Wafer thinning apparatus

Abstract

The present application relates to wafer processing technical field, especially to a kind of wafer thinning equipment, comprising: machine core component, set on bearing surface, for the wafer is thinned processing;Damping component, set in the bottom of machine core component;Support frame component, combined on machine core component;Transfer cleaning component, set on support frame component, for the wafer to be processed is transported to machine core component;Transfer cleaning component is also used to clean the wafer after being thinned by machine core component;Wherein, machine core component is configured as the rigid support of wafer thinning equipment and the contact of bearing surface.Machine core component is directly set on bearing surface, damping component is set between machine core component and bearing surface, damping is carried out to machine core component by damping component, no longer need to be transmitted by other components, so as to realize that machine core component can quickly buffer and absorb vibration when vibrating, to make machine core component stable work.

Description

Technical Field

[0001] This invention relates to the field of wafer processing technology, and more particularly to a wafer thinning device. Background Technology

[0002] In the field of wafer processing, existing wafer processing equipment is structured with a frame as support, on which precision processing components and auxiliary components are laid out, and a shock-absorbing structure is set at the bottom of the frame.

[0003] When existing wafer processing equipment vibrates during operation, the precision processing components and auxiliary components are all mounted on the frame, and they vibrate along with the frame. The damping structure located at the bottom of the frame first dampens the frame and then indirectly dampens the precision processing components, but the effect is weak and it is very easy to affect the processing accuracy of the core components on it. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] Therefore, the present invention provides a wafer thinning device in which the core assembly is configured as a rigid support component that contacts the wafer thinning device and the bearing surface, thereby improving the stability and accuracy of the processing of the core assembly.

[0006] A wafer thinning apparatus according to a first aspect of the present invention includes:

[0007] The mechanism assembly, located on the support surface, is used for thinning the wafer;

[0008] The shock-absorbing components are located at the bottom of the movement assembly;

[0009] The support frame assembly is attached to the movement assembly;

[0010] The transfer and cleaning assembly, mounted on the support frame assembly, is used to transport the wafers to be processed to the core assembly; the transfer and cleaning assembly is also used to clean the wafers after they have been thinned by the core assembly, and to transfer the cleaned wafers to the collection box;

[0011] The core assembly is configured as a rigid support component that contacts the wafer thinning equipment and the bearing surface.

[0012] Optionally, the movement components include:

[0013] The frame is mounted on the load-bearing surface;

[0014] The base module is mounted on the frame;

[0015] The turntable module is rotatably mounted on the base module;

[0016] The wiring harness is located inside the base module, with one end connected to the external control system and the other end connected to the turntable module.

[0017] Optionally, the supporting framework components include:

[0018] Support the bottom frame and fix it to the bottom position near the rack;

[0019] An auxiliary frame is fitted onto the mechanism assembly and fixedly installed on the support base frame. A load-bearing space is formed between the auxiliary frame and the support base frame, and the transfer and cleaning assembly is set within the load-bearing space.

[0020] Optionally, the movement assembly also includes:

[0021] The spindle is located above the turntable module;

[0022] The drive module is mounted on the rack and connected to the auxiliary frame. The drive module is located on one side of the turntable module and connected to the spindle. The drive module is used to drive the spindle to descend so that the spindle can thin the wafer in the turntable module.

[0023] Optionally, the transfer and cleaning components include:

[0024] The transfer module, mounted on the auxiliary frame and positioned close to the core assembly, is used to transport the wafers to be processed to the core assembly.

[0025] The cleaning module is set on the support base frame and connected to the auxiliary frame. The cleaning module is located below the transfer module. The transfer module is also used to transfer the wafer after the core assembly is thinned to the cleaning module for cleaning.

[0026] The cleaning module and the transfer module are both located on the side of the turntable module that is far away from the drive module.

[0027] Optionally, the turntable module includes:

[0028] The turntable is rotatably mounted on the base module;

[0029] A wafer carrier disk, wherein multiple wafer carrier disks are disposed on a turntable, and the axes of the multiple wafer carrier disks are distributed around the axis of the turntable;

[0030] The rotating shaft is coaxially fixed to the bottom of the turntable;

[0031] The base module includes:

[0032] The base housing has a portion of the rotating shaft extending into it, and a space for the movement of the wire harness is formed between the base housing and the rotating shaft extending into it.

[0033] The first hinge is hinged to the inner wall of the base shell;

[0034] The second hinge is hinged to the rotation axis;

[0035] Both the first hinge and the second hinge are rotatably connected to the wire harness.

[0036] Optionally, when the second hinge rotates with the rotation axis, the rotation range of the second hinge is -240° to 0° or 0° to 240°, starting from the position where the second hinge is close to the first hinge.

[0037] Optionally, the base housing is provided with an access port communicating with the operating space.

[0038] Optionally, the base module also includes:

[0039] A pipeline baffle is installed in the working space and on the side near the access port; the pipeline baffle is used to prevent part of the wire harness from extending out of the access port when the wire harness rotates with the rotating shaft.

[0040] Optionally, the pipeline baffle includes:

[0041] The first baffle unit is arranged in an arc shape on the moving path of the wire harness, and the center of the first baffle unit is located on the axis of the rotation shaft.

[0042] Two second baffle units are disposed at the two ends where the first baffle unit contacts the wire harness, and the second baffle units are bent in a direction away from the rotation axis.

[0043] One of the above technical solutions has at least the following advantages or beneficial effects:

[0044] An embodiment of the wafer thinning equipment of the present invention includes a core assembly, a vibration damping assembly, a support frame assembly, and a transfer and cleaning assembly. The core assembly is directly disposed on the bearing surface. The vibration damping assembly is disposed between the core assembly and the bearing surface to dampen vibrations in the core assembly. The support frame assembly is fixedly mounted on the core assembly. The transfer and cleaning assembly is disposed on the core assembly. When the transfer and cleaning assembly generates vibrations during operation, the vibrations are transmitted to the core assembly through the support frame assembly. During the transmission process, the support frame assembly absorbs and weakens some of the vibrations. When the vibrations are transmitted to the core assembly, the vibration damping assembly mounted on the core assembly comes into play. The vibration damping assembly is disposed between the bearing surface and the core assembly, and directly dampens vibrations in the core assembly without the need for transmission through other components. This allows the vibration damping assembly to quickly buffer and absorb vibrations when the core assembly vibrates, thus ensuring stable operation of the core assembly. Attached Figure Description

[0045] Figure 1 A three-dimensional structural schematic diagram of a wafer thinning apparatus according to an embodiment of the present invention is shown;

[0046] Figure 2 This diagram shows a front view of a wafer thinning apparatus according to an embodiment of the present invention.

[0047] Figure 3 This invention provides a three-dimensional structural schematic diagram of a module with a rotating shaft base according to an embodiment of the present invention;

[0048] Figure 4 A top view of a base module according to an embodiment of the present invention is shown.

[0049] Explanation of reference numerals in the attached figures

[0050] 100-Movement assembly, 200-Shock absorption assembly, 300-Support frame assembly, 400-Transfer and cleaning assembly, 500-Bearing surface, 600-Auxiliary support base;

[0051] 110 - Frame, 120 - Base module, 130 - Turntable module, 140 - Wiring harness, 150 - Spindle, 160 - Drive module;

[0052] 131-Turntable, 132-Wafer carrier disk, 133-Rotation shaft;

[0053] 310 - Supporting bottom frame, 320 - Auxiliary frame;

[0054] 410 - Transfer module, 420 - Cleaning module;

[0055] 121-Base shell, 122-First hinge, 123-Second hinge, 124-Pipeline baffle;

[0056] 124a - First baffle unit, 124b - Second baffle unit;

[0057] 101 - Activity space, 102 - Inspection port, 301 - Load-bearing space. Detailed Implementation

[0058] To better explain and facilitate understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0059] Wafer thinning equipment is an ultra-precision processing equipment used for the precision grinding of semiconductor wafers. Its core function is to reduce the thickness of wafers through precision machining of the wafer core to meet the needs of advanced packaging and integrated circuits.

[0060] In existing technologies, such equipment typically adopts a frame structure design, with the frame serving as the overall support foundation, and functional components such as the movement, transfer module, and cleaning module arranged on it. However, the traditional architecture has significant drawbacks: the shock-absorbing support structure is mostly placed below the frame to provide shock absorption for the movement indirectly, but the effect is limited and cannot effectively suppress the transmission of vibration during equipment operation. Vibration interference will directly lead to increased surface roughness and increased dimensional deviation, which seriously restricts product quality and yield.

[0061] To address at least one of the technical problems existing in the prior art or related technologies, the present invention provides a wafer thinning device, which includes a core assembly, a shock-absorbing assembly, a support frame assembly, and a transfer and cleaning assembly. The core assembly is directly mounted on a support surface, and the shock-absorbing assembly is disposed between the core assembly and the support surface to directly dampen the vibration of the core assembly. The support frame assembly is fixedly mounted on the core assembly, and the transfer and cleaning assembly is disposed on the core assembly. When the transfer and cleaning assembly generates vibration, it is transmitted to the core assembly through the frame assembly, and the shock-absorbing assembly at the bottom of the core assembly directly dampens the vibration. The shock-absorbing assembly can quickly buffer and absorb the vibration to ensure the stable operation of the core assembly.

[0062] A wafer thinning apparatus according to the present invention is described below with reference to the accompanying drawings.

[0063] See Figures 1 to 4 The present invention provides a wafer thinning device, comprising: a core assembly 100 disposed on a bearing surface 500 for thinning wafers; a shock-absorbing assembly 200 disposed at the bottom of the core assembly 100; a support frame assembly 300 attached to the core assembly 100; and a transfer and cleaning assembly 400 disposed on the support frame assembly 300 for conveying the wafers to be processed to the core assembly 100. The transfer and cleaning assembly 400 is also used to clean the wafers thinned by the core assembly 100 and to transfer the cleaned wafers to a collection box. The core assembly 100 is configured as a rigid support member in contact with the bearing surface 500 of the wafer thinning device.

[0064] The wafer thinning equipment provided in this embodiment includes a core assembly 100, a shock-absorbing assembly 200, a support frame assembly 300, and a transfer and cleaning assembly 400. The core assembly 100 is directly mounted on the bearing surface 500. The shock-absorbing assembly 200 is disposed between the core assembly 100 and the bearing surface 500 to dampen the vibration of the core assembly 100. The support frame assembly 300 is fixedly mounted on the core assembly 100. The transfer and cleaning assembly 400 is disposed on the core assembly 100. The core assembly 100 is used to perform wafer thinning processing. The transfer and cleaning assembly 400 is used to transport the wafer to be processed to the core assembly 100. At the same time, the transfer and cleaning assembly 400 is also used to clean the wafer after it has been thinned by the core assembly 100 and transfer the cleaned wafer to a collection box.

[0065] When the wafer thinning operation is performed by the core assembly 100, the core assembly 100 needs to maintain a stable working state to ensure the accuracy of the wafer thinning operation. In this technical solution, the core assembly 100 is directly mounted on the bearing surface 500 and directly contacts the bearing surface 500. Thus, the core assembly 100 is configured as a rigid support for the wafer thinning equipment in contact with the bearing surface 500. Unlike the traditional method of using a frame structure as the main support, the contact and support between the entire wafer thinning equipment and the bearing surface 500 is set by the core assembly 100. This allows the core assembly 100 to stand more stably on the bearing surface 500, greatly enhancing the stability of the core assembly 100 and fundamentally ensuring the stability and accuracy of the core assembly 100 processing.

[0066] The vibration damping component 200 is located at the bottom of the movement assembly 100 and is in contact with the bearing surface 500. The vibration damping component 200 can directly dampen the movement assembly 100. During the processing, when the movement assembly 100 is affected by vibration, the vibration damping component 200 can quickly buffer and absorb the vibration, thus greatly reducing the vibration transmitted to the movement assembly 100. Unlike the traditional method of placing the vibration damping support structure under the support frame to indirectly dampen the movement assembly 100, this vibration damping setting that is directly connected to the movement assembly 100 is more effective and can greatly improve the vibration damping effect of the movement assembly 100, reducing the adverse effects of vibration on the machining accuracy of the movement assembly 100.

[0067] For example, the shock-absorbing component 200 may be, but is not limited to, a shock-absorbing pad. The shock-absorbing pad is disposed at the bottom of the core component 100 and contacts the bearing surface 500. By disposing of the shock-absorbing pad, a gap can be formed between the core component 100 and the bearing surface 500. This gap allows forklifts or cranes to directly contact the bottom surface of the core component during equipment transfer, thus facilitating the transfer.

[0068] The support frame assembly 300 is mounted on the core assembly 100, and the transfer and cleaning assembly 400 is mounted on the support frame assembly 300. The support frame assembly 300 serves to integrate the transfer and cleaning assembly 400 with the core assembly 100. The transfer and cleaning assembly 400 is connected to the core assembly 100 through the support frame assembly 300. The transfer and cleaning assembly 400 performs important functions: it is responsible for conveying the wafers to be processed to the core assembly 100 to ensure the continuity of material supply in the processing flow; at the same time, it can clean the wafers after they have been thinned by the core assembly 100 and collect the cleaned wafers to prepare for subsequent wafer operations.

[0069] For example, in the prior art, the overall device of the wafer thinning equipment uses a frame structure as the main support component. Other components such as the core assembly 100 and the transfer and cleaning assembly 400 are all set on the frame structure. When the transfer and cleaning assembly 400 or other components on the frame structure shake, the vibration is transmitted to the core assembly 100 through the frame structure. As can be seen from the above, since the core assembly 100 and other components such as the transfer and cleaning assembly 400 are all set on the frame structure, when the frame structure vibrates, it will cause all the structures on the frame structure to vibrate together. When the shock absorption assembly 200 is set on the frame structure, the shock absorption assembly 200 first absorbs the vibration of the frame structure. When the vibration of the frame structure decreases, the vibration of the core assembly 100 and the transfer and cleaning assembly 400 on the frame structure can also decrease. Therefore, in the prior art, when the transfer and cleaning assembly 400 vibrates during operation, it will affect the working accuracy of the core assembly 100, which is also on the frame structure, and thus affect the product quality of the thinned wafer.

[0070] In this technical solution, the movement assembly 100 is directly mounted on the bearing surface 500, the support frame assembly 300 is mounted on the movement assembly 100, and the transfer and cleaning assembly 400 is mounted on the support frame assembly 300. When the transfer and cleaning assembly 400 vibrates during operation, the vibration is transmitted to the movement assembly 100 through the support frame assembly 300. During the transmission process, the support frame assembly 300 absorbs and weakens some of the vibration. When the vibration is transmitted to the movement assembly 100, the shock-absorbing assembly 200 mounted on the movement assembly 100 comes into play. The shock-absorbing assembly 200 is located between the bearing surface 500 and the movement assembly 100. The shock-absorbing assembly 200 directly dampens the movement of the movement assembly 100, eliminating the need for transmission through other components. Thus, when the movement assembly 100 vibrates, the shock-absorbing assembly 200 can quickly buffer and absorb the vibration, ensuring the stable operation of the movement assembly 100.

[0071] See Figures 1 to 4In some instances, the mechanism assembly 100 includes: a frame 110 disposed on a bearing surface 500; a base module 120 disposed on the frame 110; a turntable module 130 rotatably mounted on the base module 120; and a wiring harness 140 disposed within the base module 120, with one end of the wiring harness 140 connected to an external control system and the other end of the wiring harness 140 connected to the turntable module 130.

[0072] In this technical solution, the frame 110 is mounted on the bearing surface 500, serving as the basic support component for the core assembly 100 and providing a stable mounting platform for the entire core assembly 100. The base module 120 is mounted on the frame 110, and the turntable module 130 is mounted on the base module 120. For example, the drive source for the turntable module 130 is located on the frame 110, providing the necessary rotational power to the turntable module 130, enabling it to rotate according to predetermined parameters such as rotation speed and rotation direction. The main function of the turntable module 130 is to support the wafers that need to be thinned. When the turntable module 130 starts to rotate, the wafers move along with the rotation of the turntable.

[0073] The wiring harness 140 is housed within the base module 120. The wiring harness 140 plays a role in the transmission of electrical, pneumatic, and hydraulic control signals within the equipment. One end of it connects to the external control system, and the other end connects to the turntable module 130. It transmits electrical, pneumatic, and hydraulic control commands from the control system to the turntable module 130, enabling the transmission of electrical energy, gas, and liquid to the turntable module 130. By placing the wiring harness 140 within the base module 120, the external space occupied by the wiring harness 140 is reduced. Simultaneously, the base module 120 provides a relatively stable and safe space for the wiring harness 140, protecting it from external interference, collisions, and other factors during equipment operation, thus ensuring the stability of electrical, gas, and liquid transmission.

[0074] For example, the size of the base module 120 is reduced to the minimum size without affecting the operation of other devices, so as to save the space occupied by the base module 120 in the overall equipment.

[0075] For example, the wiring harness 140 includes, but is not limited to, water pipes, gas pipes, and cables. The wiring harness 140 can be used to transmit electrical energy, gas, liquids, and signals. The wiring harness 140 can be constrained in two ways, including but not limited to, by means of a cable chain and by means of pipe and cable routing.

[0076] See Figure 1 and Figure 2In some instances, the support frame assembly 300 includes: a support base frame 310, which is fixedly connected to the bottom position near the frame 110; an auxiliary frame 320, which is sleeved on the core assembly 100 and fixedly installed on the support base frame 310, and a load-bearing space 301 is formed between the auxiliary frame 320 and the support base frame 310, and the transfer and cleaning assembly 400 is disposed in the load-bearing space 301.

[0077] In this technical solution, the support frame assembly 300 includes a support base frame 310 and an auxiliary frame 320. The support base frame 310 is fixedly connected to the bottom of the frame 110, providing a solid foundation support point for the entire support frame assembly 300. By connecting to the bottom of the frame 110, it tightly integrates the support frame assembly 300 and the frame 110 of the core assembly 100, forming a stable overall structure. The auxiliary frame 320 is fitted onto the core assembly 100 and fixedly installed on the support base frame 310. The auxiliary frame 320, fitted onto the core assembly 100, provides a certain degree of protection, preventing accidental collisions with external objects that could affect the normal operation of the core assembly 100. Moreover, the fixed connection with the support base frame 310 enhances the structural strength of the entire support frame assembly 300. The auxiliary frame 320 and the supporting base frame 310 together form the overall structure of the frame, which improves the overall rigidity of the equipment and further reduces the risk of structural deformation caused by external vibration, impact and other factors. For example, the core component 100 can be connected to the auxiliary frame 320.

[0078] A bearing space 301 is formed between the auxiliary frame 320 and the supporting base frame 310. The transfer and cleaning assembly 400 is set in this bearing space 301, making the structural layout of the wafer thinning equipment more compact and reasonable. The bearing space 301 provides a stable installation position for the transfer and cleaning assembly 400, preventing the transfer and cleaning assembly 400 from shaking or shifting during equipment operation, thereby ensuring that it can accurately and stably transport the wafers to be processed to the core assembly 100 and clean the wafers after processing.

[0079] For example, an auxiliary support seat 600 may also be provided at the bottom of the support frame 310 for auxiliary support. When the support frame assembly 300 shakes, the auxiliary support seat 600 will contact the bearing surface 500 to provide auxiliary support for the support frame assembly 300.

[0080] See Figures 1 to 4 In some instances, the mechanism assembly 100 further includes: a spindle 150 located above the turntable module 130; and a drive module 160 disposed on the frame 110 and connected to the auxiliary frame 320, the drive module 160 being located on one side of the turntable module 130 and connected to the spindle 150; the drive module 160 is used to drive the spindle 150 to descend so that the spindle 150 thins the wafer in the turntable module 130.

[0081] In this technical solution, the mechanism assembly 100 also includes a spindle 150 and a drive module 160. The drive module 160 is mounted on the frame 110 and connected to the auxiliary frame 320, giving it a stable mounting position in the wafer thinning equipment. On the one hand, the connection with the frame 110 provides the drive module 160 with a stable support foundation; on the other hand, the connection with the auxiliary frame 320 further enhances its structural stability, jointly supporting and ensuring the stable operation of the equipment. The drive module 160 is located on one side of the turntable module 130, allowing the drive module 160 to operate without interfering with the normal rotation of the turntable module 130. The spindle 150, located above the turntable module 130, is connected to the spindle 150. The lateral layout ensures both the relative independence and operability of each component, as well as their effective collaborative work. The spindle 150 is located above the turntable module 130. During the wafer thinning process, the spindle 150 is the component that directly acts on the wafer. When the wafer is placed on the turntable module 130 and rotated to be directly below the spindle 150, the drive module 160 controls the spindle 150 to descend and move towards the wafer on the turntable module 130. The spindle 150 performs wafer thinning through the processing head or tool mounted on it.

[0082] For example, during equipment operation, when a command is received from an external control system, the drive module 160 starts working and controls the spindle 150 to descend. During the descent of the spindle 150, the processing head at its lower end contacts the wafer on the turntable module 130 to complete the wafer thinning operation.

[0083] See Figure 1 and Figure 2 In some instances, the transfer and cleaning assembly 400 includes: a transfer module 410, disposed on the auxiliary frame 320 and close to the core assembly 100, for conveying the wafer to be processed to the core assembly 100; and a cleaning module 420, disposed on the support base frame 310 and connected to the auxiliary frame 320, the cleaning module 420 being located below the transfer module 410, the transfer module 410 also being used to transfer the thinned wafer from the core assembly 100 to the cleaning module 420 for cleaning; wherein, both the cleaning module 420 and the transfer module 410 are located on the side of the turntable module 130 away from the drive module 160.

[0084] In this technical solution, the transfer module 410 is mounted on the auxiliary frame 320 and close to the core assembly 100. This layout allows it to easily dock with the core assembly 100 in space. The auxiliary frame 320 provides a stable mounting base for the transfer module 410. Its proximity to the core assembly 100 shortens the transport path, improving the transport efficiency of the wafers to be processed and reducing unnecessary transport time losses. One of the main functions of the transfer module 410 is to transport the wafers to be processed to the core assembly 100. It has precise positioning and transport capabilities, accurately placing the received wafers onto the turntable module 130 in the core assembly 100, ensuring the wafers are in the appropriate processing position and guaranteeing the accuracy of the thinning process. The transfer module 410 also primarily undertakes the task of removing the thinned wafers from the turntable module 130 of the core assembly 100 and transferring them to the cleaning module 420, ensuring that the thinned wafers can smoothly enter the cleaning stage and guaranteeing the smoothness of the entire production process.

[0085] The cleaning module 420 is mounted on the supporting base frame 310 and connected to the auxiliary frame 320. The supporting base frame 310 provides a stable bearing foundation for the cleaning module 420, while the connection with the auxiliary frame 320 further enhances the stability and connectivity of the cleaning module 420 in the overall equipment structure. The cleaning module 420 is located below the transfer module 410, reducing the distance between the cleaning module 420 and the transfer module 410. This allows the transfer module 410 to quickly transfer the wafer to the cleaning module 420 for cleaning, thus improving work efficiency.

[0086] The overall layout of the transfer and cleaning component 400 is on the side of the turntable module 130 away from the drive module 160, which optimizes the spatial structure of the entire equipment. First, the cleaning module 420 and the transfer module are concentrated on the side away from the drive module 160, which avoids the interference of the cleaning module 420 and the transfer module to the area near the drive module 160 and reduces the risk of mutual collision or interference that may occur between different modules during operation.

[0087] See Figures 1 to 4In some examples, the turntable module 130 includes: a turntable 131 rotatably mounted on the base module 120; a wafer carrier disk 132, with multiple wafer carrier disks 132 disposed on the turntable 131 and the axes of the multiple wafer carrier disks 132 distributed around the axis of the turntable 131; and a rotating shaft 133 coaxially fixedly mounted on the bottom of the turntable 131. The base module 120 includes: a base shell 121, with a portion of the rotating shaft 133 extending into the base shell 121, and a movable space 101 for the movement of the wire harness 140 formed between the base shell 121 and the rotating shaft 133 extending into the base shell 121; a first hinge 122 hinged to the inner wall of the base shell 121; and a second hinge 123 hinged to the rotating shaft 133. Both the first hinge 122 and the second hinge 123 are rotatably connected to the wire harness 140.

[0088] In this technical solution, the turntable module 130 includes a turntable 131, multiple wafer carrier disks 132, and a rotating shaft 133. The multiple wafer carrier disks 132 are disposed on the turntable 131, and the axes of the multiple wafer carrier disks 132 are distributed around the axis of the turntable 131. Exemplarily, there are at least three wafer carrier disks 132. The rotating shaft 133 is coaxially fixedly mounted on the bottom of the turntable 131, and the drive source of the turntable module 130 is disposed on the frame 110. The drive source is connected to the rotating shaft 133 and provides power output to the rotating shaft 133 so that the turntable 131 rotates relative to the base module 120.

[0089] The base module 120 includes a base shell 121, a rotating shaft 133, a first hinge 122, and a second hinge 123. The base shell 121 is mounted on the frame 110, providing a support base for other components of the base module 120. A portion of the rotating shaft 133 extends into the base shell 121 and is coaxially arranged with the base shell 121. The portion of the rotating shaft 133 extending into the base shell 121 and the base shell 121 form an active space 101 for the movement of the wire harness 140. This provides a dedicated active area for the wire harness 140, allowing it to move accordingly within the active space 101 as the rotating shaft 133 rotates. This avoids excessive stretching or twisting of the wire harness 140 due to rotation, providing a safe and orderly active environment for the wire harness 140.

[0090] The first hinge 122 is hinged to the inner wall of the base shell 121 and can rotate relative to the base shell 121 to a certain extent. The second hinge 123 is hinged to the rotating shaft 133 and also has a swing function. Both the first hinge 122 and the second hinge 123 are rotatably connected to the wire harness 140. This structure can effectively guide the movement of the wire harness 140 during operation. When the rotating shaft 133 rotates, the second hinge 123 rotates accordingly, causing one end of the wire harness 140 connected to it to make a circular motion around the rotating shaft 133. The first hinge 122, through its own swing, cooperates with the movement of the wire harness 140. While the wire harness 140 rotates with the rotating shaft 133, the stress on the wire harness 140 is reduced, ensuring the stability of the signal transmission of the wire harness 140 and extending the service life of the wire harness 140.

[0091] In the existing technology, the wiring harness 140 is located outside the base housing 121. This layout has obvious drawbacks: First, the wiring harness 140 outside the base housing 121 will occupy additional space outside the base housing 121, making the overall structure of the equipment appear cluttered and crowded, which is not conducive to the compact design of the equipment and the rational use of space; Second, the wiring harness 140 exposed outside the base housing 121 is easily affected by collisions and friction from external objects, as well as environmental factors such as dust and moisture, which greatly increases the risk of damage to the wiring harness 140. Once the wiring harness 140 is damaged, it may cause failures in the transmission of electrical energy, pneumatic energy, liquid energy and signals, affecting the normal operation of the equipment and increasing maintenance costs and downtime.

[0092] In this technical solution, the wire harness 140 is placed in the movable space 101 formed between the base shell 121 and the rotating shaft 133, and its rotation is guided by the first hinge 122 and the second hinge 123. This effectively overcomes the problems of the prior art, optimizes the internal space structure of the equipment, improves the safety and reliability of the wire harness 140, and ensures the stable operation of the equipment.

[0093] See Figure 2 and Figure 4 In some instances, when the second hinge 123 rotates with the rotation shaft 133, the rotation range of the second hinge 123 is -240° to 240°, starting from the position where the second hinge 123 is close to the first hinge 122.

[0094] For example, as can be seen from the above, the turntable module 130 includes a turntable 131 and at least three wafer carrier disks 132. The turntable 131 is rotatably mounted on the base module 120. When the turntable 131 rotates under the drive of its drive source, the wafer carrier disks 132 are arranged in a ring at equal intervals on the turntable 131 with the rotation axis 133 of the turntable 131 as the center. The wafer carrier disks 132 are used to carry wafers. When the turntable module 130 is working, its rotation angle range is -240° to 0° or 0° to 240°.

[0095] In this technical solution, the starting point for measuring the rotation angle is first set at the position of the second hinge 123 close to the first hinge 122. During the operation of the equipment, this position is a fixed reference position. When the second hinge 123 starts to rotate from this starting position, it begins to measure at a preset angle.

[0096] The rotation range of the second hinge 123 is -240° to 0° or 0° to 240°, which defines the rotation angle range of the second hinge 123 around the rotation axis 133. The negative angle -240° represents the maximum angle of rotation from the starting position in the counterclockwise direction; the positive angle 240° represents the maximum angle of rotation from the starting position in the opposite direction (i.e., clockwise direction).

[0097] For example, the setting of this rotation range is closely related to the operation of the entire base module 120. Since the wire harness 140 is rotatably connected to the second hinge 123, the rotation of the second hinge 123 will drive the corresponding movement of the wire harness 140. By limiting the rotation range of the second hinge 123, problems such as excessive stretching, twisting or tangling of the wire harness 140 due to excessive rotation can be prevented, thereby ensuring the stable function and service life of the wire harness 140.

[0098] See Figures 1 to 4 In some instances, the base housing 121 is provided with an access port 102 that communicates with the activity space 101.

[0099] In this technical solution, the access port 102 is connected to the movable space 101 formed between the base shell 121 and the rotating shaft 133. The wiring harness 140 rotates within the movable space 101 along with the rotating shaft 133. The access port 102 provides maintenance personnel with a convenient channel for repairing and replacing the movable space 101. Maintenance personnel can access the components and wiring harness 140 within the movable space 101 without disassembling too many complex parts, which significantly reduces the difficulty of maintenance.

[0100] For example, since the wiring harness 140 moves continuously in the activity space 101, it may experience wear, aging, or loose connections after long-term operation. Through the inspection port 102, maintenance personnel can periodically observe and inspect the condition of the wiring harness 140 in the activity space 101. They can check whether the appearance of the wiring harness 140 is damaged or cracked, and whether the connection points between the wiring harness 140 and the first hinge 122 and the second hinge 123 are secure, thus promptly identifying potential safety hazards and fault points. Once a problem is found with the wiring harness 140 or related components during the inspection, the inspection port 102 serves as a convenient passage. Maintenance personnel can directly extend repair tools into the activity space 101 through the inspection port 102 to repair or replace the wiring harness 140. Compared to large-scale disassembly and reassembly of the entire base module 120, using the inspection port 102 for repairs significantly saves maintenance time and labor costs, reduces equipment downtime, and improves equipment utilization efficiency.

[0101] For example, a transparent acrylic plate can be installed outside the access port 102 to block the access port 102, preventing foreign objects from entering the activity space 101, thereby ensuring the normal operation of the wiring harness 140 and other components in the activity space 101.

[0102] See Figure 2 and Figure 4 In some instances, the base module 120 further includes a pipeline baffle 124 disposed within the movable space 101 and on the side near the access port 102; the pipeline baffle 124 is used to prevent a portion of the wire harness 140 from extending out of the access port 102 when the wire harness 140 rotates with the rotating shaft 133.

[0103] In this technical solution, during module operation, the rotating shaft 133 drives the connected components to rotate, including the second hinge 123 connected to the rotating shaft 133. Consequently, the wiring harness 140 moves accordingly with the rotation of the rotating shaft 133. During this process, due to the range of motion and complexity of the movement of the wiring harness 140, some of the wiring harness 140 may move towards the inspection port 102 due to swinging, displacement, or other reasons. Without any protection, these wiring harnesses 140 may extend beyond the inspection port 102, causing the wiring harness to become contaminated. The disorderly exposure of wire harness 140 to the outside poses a potential risk, for example, interfering with other components and causing damage to wire harness 140; the installation of the pipeline baffle 124 serves to block the wire harness 140. When rotating with the rotating shaft 133, the pipeline baffle 124 blocks part of the wire harness 140 from extending out of the inspection port 102, reducing various risks caused by abnormal extension of the wire harness 140; the blocking function of the pipeline baffle 124 can continue to play a role in long-term, high-frequency equipment operation, ensuring the stability of equipment operation.

[0104] See Figure 2 and Figure 4 In some instances, the pipeline baffle 124 includes: a first baffle unit 124a, which is arc-shaped and disposed on the moving path of the wiring harness 140, with the center of the first baffle unit 124a located on the axis of the rotation shaft 133; and two second baffle units 124b, which are disposed at the two ends where the first baffle unit 124a contacts the wiring harness 140, with the second baffle units 124b bent toward a direction away from the rotation shaft 133.

[0105] In this technical solution, the pipeline baffle 124 includes a first baffle unit 124a and a second baffle unit 124b. The first baffle unit 124a is arc-shaped and arranged on the moving path of the wire harness 140. The center of the first baffle unit 124a is located on the axis of the rotating shaft 133. Since the wire harness 140 rotates with the rotating shaft 133, its moving path forms part of a circular trajectory with the rotating shaft 133 as the center. The arc-shaped first baffle unit 124a can block along this path, maximize its blocking effect, and effectively prevent the wire harness 140 from extending out of the inspection port 102 when rotating along the circumferential direction of the rotating shaft 133.

[0106] For example, the first baffle unit 124a is arc-shaped, and the center of the first baffle unit 124a is located on the axis of the rotation shaft 133. Thus, it can be concluded that the first baffle unit 124a fits against the inner wall of the base shell 121 to ensure that the first baffle unit 124a does not occupy too much of the active space 101, while constraining the rotation path of the wire harness 140, so that the wire harness 140 rotates smoothly.

[0107] Two second baffle units 124b are disposed at the two ends of the first baffle unit 124a that contact the wire harness 140. The second baffle units 124b are bent in a direction away from the rotation axis 133. When the wire harness 140 rotates with the rotation axis 133, the positions that contact the first baffle unit 124a are the two ends of the first baffle unit 124a. By installing the second baffle units 124b at the two ends of the first baffle unit 124a that contact the wire harness 140, since the second baffle units 124b are bent in a direction away from the rotation axis 133, the wire harness 140 can be made to change from a straight end that is in line with the first baffle unit 124a to a bent end that contacts the second baffle unit 124b during rotation. This can avoid damage to the wire harness 140 and also play a role in assisting in planning the movement path of the wire harness 140, thereby ensuring the smooth movement of the wire harness 140 in the activity space 101.

[0108] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0109] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0110] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "over," or "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," or "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0111] In the description of this specification, the terms "one embodiment," "some embodiments," "embodiment," "exemplary embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0112] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications, alterations, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A wafer thinning device, characterized in that, include: The mechanism assembly, located on the support surface, is used for thinning the wafer; A shock-absorbing component is disposed at the bottom of the movement assembly; A support frame assembly is attached to the movement assembly; A transfer and cleaning assembly, disposed on the support frame assembly, is used to transport the wafer to be processed to the core assembly; the transfer and cleaning assembly is also used to clean the wafer after it has been thinned by the core assembly, and to transfer the cleaned wafer to a collection box. The mechanism assembly is configured as a rigid support component that contacts the wafer thinning equipment and the bearing surface; The movement assembly includes: The frame is mounted on the load-bearing surface; A base module is mounted on the frame; The turntable module is rotatably mounted on the base module. A wiring harness is disposed within the base module, with one end of the wiring harness connected to an external control system and the other end of the wiring harness connected to the turntable module. The supporting framework components include: A supporting base frame is fixedly connected to the bottom of the frame. An auxiliary frame is fitted onto the mechanism assembly and fixedly installed on the supporting base frame. A load-bearing space is formed between the auxiliary frame and the supporting base frame, and the transfer and cleaning assembly is disposed within the load-bearing space. The movement assembly also includes: The main spindle is located above the turntable module; A drive module is mounted on the rack and connected to the auxiliary frame. The drive module is located on one side of the turntable module and connected to the spindle. The drive module is used to drive the spindle to descend so that the spindle can thin the wafer in the turntable module.

2. The wafer thinning equipment according to claim 1, characterized in that, The transfer and cleaning assembly includes: A transfer module is disposed on the auxiliary frame and close to the core assembly, for conveying the wafer to be processed to the core assembly; A cleaning module is disposed on the supporting base frame and connected to the auxiliary frame. The cleaning module is located below the transfer module. The transfer module is also used to transfer the wafer after the core assembly is thinned to the cleaning module for cleaning. The cleaning module and the transfer module are both located on the side of the turntable module away from the drive module.

3. The wafer thinning equipment according to claim 1, characterized in that, The turntable module includes: The turntable is rotatably mounted on the base module; A wafer carrier disk, wherein multiple wafer carrier disks are disposed on the turntable, and the axes of the multiple wafer carrier disks are distributed around the axis of the turntable; A rotating shaft is coaxially and fixedly installed at the bottom of the turntable; The base module includes: A base shell, a portion of the rotating shaft extends into the base shell, and an active space for the movement of the wire harness is formed between the base shell and the rotating shaft extending into the base shell; The first hinge is hinged to the inner wall of the base shell; The second hinge member is hinged to the rotation axis; Both the first hinge and the second hinge are rotatably connected to the wire harness.

4. The wafer thinning equipment according to claim 3, characterized in that: When the second hinge rotates with the rotation axis, taking the position of the second hinge close to the first hinge as the starting point, the rotation range of the second hinge is -240° to 0° or 0° to 240°.

5. The wafer thinning equipment according to claim 3, characterized in that, The base shell is provided with an inspection port that communicates with the active space.

6. The wafer thinning equipment according to claim 5, characterized in that, The base module also includes: A pipeline baffle is disposed within the active space and on the side near the access port; the pipeline baffle is used to prevent a portion of the wiring harness from extending out of the access port when the wiring harness rotates with the rotating shaft.

7. The wafer thinning equipment according to claim 6, characterized in that, The pipeline baffle includes: The first baffle unit is arranged in an arc shape on the moving path of the wire harness, and the center of the first baffle unit is located on the axis of the rotating shaft. Two second baffle units are disposed at the two ends where the first baffle unit contacts the wire harness, and the second baffle units are bent in a direction away from the rotation axis.

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