Permanent stainless steel negative plate surface treatment device and method

Abstract

The invention discloses a permanent stainless steel cathode plate surface treatment device and method, the device comprises a polishing device, a conveying device, a plasma treatment device and a controller, and the conveying device penetrates through the polishing device; the plasma treatment device is fixed on the polishing device and stretches across the conveying device; the controller is electrically connected with the grinding device, the conveying device and the plasma processing device. According to the device, conveying, grinding and plasma treatment are integrated, and the efficient and accurate surface preparation treatment process is achieved.

Description

Technical Field

[0001] This invention relates to the field of cathode plate surface treatment technology, specifically to a permanent stainless steel cathode plate surface treatment apparatus and method. Background Technology

[0002] Currently, during the long-term use of permanent stainless steel cathode plates, a series of surface treatments are typically required to improve the adhesion and surface quality of the cathode plate. These surface treatment processes usually include mechanical grinding and cleaning.

[0003] However, existing surface treatment devices and methods have some problems, such as unstable treatment results, complex operation, and low work efficiency.

[0004] Therefore, providing an efficient and high-quality permanent stainless steel cathode plate surface treatment device and method is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of this, the present invention provides a permanent stainless steel cathode plate surface treatment apparatus and method, which integrates multiple processing steps to improve processing efficiency and consistency.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A permanent stainless steel cathode plate surface treatment apparatus includes a grinding device, a conveying device, a plasma treatment device, and a controller. The conveying device is disposed within the grinding device; the plasma treatment device is fixed on the grinding device and spans across the conveying device; the controller is electrically connected to the grinding device, the conveying device, and the plasma treatment device respectively.

[0007] By adopting the above technical solutions, the present invention has the following beneficial effects: By integrating conveying, polishing and plasma treatment into one process, a highly efficient and precise surface preparation process is achieved.

[0008] Furthermore, the polishing device includes a base and a polishing mechanism, the polishing mechanism includes a robotic arm and a nylon drawing wheel, the conveyor belt of the conveying device passes through the base; the robotic arm is mounted on the base; the nylon drawing wheel is detachably connected to the end of the robotic arm; the controller is electrically connected to the robotic arm and the nylon drawing wheel respectively.

[0009] Furthermore, the plasma treatment device includes a support frame, a slide table, a plasma cleaning nozzle, and a gas supply device. The support frame is fixed on the base and spans the conveyor belt. The slide table is slidably connected to the top of the support frame. The plasma cleaning nozzle is installed at the bottom of the slide table and aligned with the surface of the conveyor belt. The gas supply device is connected to the plasma cleaning nozzle. The controller is electrically connected to both the slide table and the gas supply device.

[0010] Furthermore, the permanent stainless steel cathode plate surface treatment device also includes a positioning sensor and a clamping mechanism. The positioning sensor is mounted on the support frame; the clamping mechanism is mounted on the base to clamp both sides of the cathode plate located on the conveyor belt; the positioning sensor is electrically connected to the controller, and the controller is electrically connected to the clamping mechanism.

[0011] Furthermore, a rubber layer is fixedly laid on the outer surface of the clamping block of the clamping mechanism.

[0012] Furthermore, there are multiple polishing mechanisms, which are arranged sequentially along the conveying direction of the conveyor belt.

[0013] Furthermore, it also includes a cooling device, which is installed at the conveying end of the conveying device.

[0014] The cathode plate surface treatment method using the above-mentioned permanent stainless steel cathode plate surface treatment apparatus includes the following steps: 1) The conveying device horizontally conveys the cathode plate to the grinding device; 2) When the positioning sensor detects the cathode plate, the clamping mechanism is activated to clamp and fix the cathode plate; 3) The robotic arm moves and rotates the nylon drawing wheel to polish the surface of the cathode plate along a predetermined path to remove the passivation layer; 4) After polishing, gas is introduced into the gas supply device, and the plasma cleaning nozzle discharges at a distance of 5-20mm from the cathode plate surface to form plasma to treat the cathode plate surface. 5) After processing, the cathode plate is conveyed by the conveying device and enters the cooling device for cooling.

[0015] Furthermore, after step 4), the surface roughness and visual inspection of the processed cathode plate are also performed; if the roughness does not reach Ra=0.5-2μm or there are scratches, the polishing parameters or plasma treatment parameters are adjusted. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0017] Figure 1 The attached figure is a structural schematic diagram of a permanent stainless steel cathode plate surface treatment device provided by the present invention. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] like Figure 1 As shown in the figure, this invention discloses a surface treatment device for permanent stainless steel cathode plates, including a grinding device 1, a conveying device 2, a plasma treatment device 3, and a controller. The conveying device 2 is inserted through the grinding device 1 and is driven by a servo motor. The servo motor of the conveying device 2 is controlled in a closed loop by the controller. The conveying speed (0.1-2 m / min) and position are precisely adjusted through encoder feedback to ensure that the cathode plate accurately enters the predetermined positions of the grinding device 1 and the plasma treatment device 3. The plasma treatment device 3 is fixed on the grinding device 1 and spans the conveying device 2. The controller is electrically connected to the grinding device 1, the conveying device 2, and the plasma treatment device 3 respectively, and is used to precisely control the conveying speed, grinding parameters (drawing wheel speed, pressure), and plasma treatment parameters (gas flow rate, discharge duration, nozzle spacing). This invention integrates conveying, grinding, and plasma treatment into one unit, realizing a highly efficient and precise surface preparation process, effectively eliminating the passivation phenomenon on the cathode plate surface without reducing its surface roughness, thereby improving the product quality of subsequent electrolytic copper.

[0020] Specifically, the grinding device 1 includes a base 11 and a grinding mechanism. The grinding mechanism includes a robotic arm 12 and a nylon wire drawing wheel 13. The conveyor belt 21 of the conveying device 2 passes through the base 11. The conveyor belt 21 is selected as a wear-resistant rubber belt with a width of 1.2m. The robotic arm 12 is mounted on the base 11 and has XYZ three-axis motion freedom. The nylon wire drawing wheel 13 is detachably connected to the end of the robotic arm 12. The nylon wire drawing wheel 13 is driven by a motor to rotate at high speed. It has a diameter of 200mm and is used to mechanically grind the surface of the fixed cathode plate 4. The controller is electrically connected to the robotic arm 12 and the nylon wire drawing wheel 13 respectively. The rotation speed (500-3000rpm) and the contact pressure (0.1-1MPa) of the nylon wire drawing wheel 13 on the cathode plate 4 are set by the controller to adapt to the grinding requirements of cathode plates 4 with different materials (such as 304 / 316 stainless steel) and thicknesses (2-5mm).

[0021] Specifically, the plasma treatment device 3 includes a support frame 31, a slide table 32, a plasma cleaning nozzle 33, and a gas supply device 34. The support frame 31 is fixed on the base 11 and spans the conveyor belt 21. The slide table 32 is slidably connected to the top of the support frame 31, and the two can be connected by pulleys or slide rails. The plasma cleaning nozzle 33 is installed at the bottom of the slide table 32 and aligned with the surface of the conveyor belt 21. In this embodiment, there are 3 plasma cleaning nozzles 33 with a spacing of 300 mm. The gas supply device 34 is connected to the plasma cleaning nozzle 33 and supplies inert gas (such as argon) or active gas (such as oxygen) to the plasma cleaning nozzle 33. The controller is electrically connected to the slide table 32 and the gas supply device 34 respectively. The plasma treatment process, through the cooperation of the gas supply device 34 and the plasma cleaning nozzle 33, achieves precise adjustment of gas flow rate (5-20L / min), discharge duration (10-60s), and nozzle spacing (5-20mm), and constructs a moderately rough surface (Ra=0.5-2μm) on the cathode plate 4, which significantly improves the adsorption force of copper particles (adsorption amount increased by more than 30%).

[0022] Specifically, gas is ionized to form plasma. Under the influence of high-temperature electrons and ions, plasma can chemically react with the stainless steel surface. The main function of plasma treatment to improve the adhesion of stainless steel is to enhance the adhesion between the coating and the substrate, which includes the following: 1. Improving the bonding force between the coating and the substrate, thereby enhancing the coating's adhesion; 2. Increasing surface roughness, allowing the coating to deposit better on the surface, enabling more copper particles to deposit in more of the surface's fine unevenness, thus increasing the number of adhesion points, enhancing the coating's adhesion, and improving the uniformity and purity of copper deposition; 3. Increasing surface energy, increasing the contact area between the coating and the substrate, thereby enhancing the adhesion between the coating and the substrate, leading to an increased contact area between the coating and the substrate, making the surface more prone to reacting with copper ions, and improving the adhesion of copper particles during the deposition process; 4. Forming a dense oxide film or nitride film, which can prevent the coating from peeling or detaching during use.

[0023] Of course, in order to prevent dust from scattering during the polishing process, baffles can be set around the support frame 31 to form a closed polishing chamber with an opening for the cathode plate 4 to enter and space for the slide table 32 to move horizontally. On this basis, a negative pressure dust suction port is opened on the polishing chamber to collect the metal dust generated by the nylon drawing wheel 13. A smoke extraction pipe is set near the plasma treatment device 3 to discharge the dust generated during the treatment process and maintain a clean working environment.

[0024] Of course, the plasma treatment device 3 also includes a power supply and a discharge assembly. The power supply provides sufficient electrical energy to ionize atoms or molecules in the gas into plasma through an electromagnetic field. Plasma cleaning generally uses a high-frequency power supply to excite the gas. The power supply provides a high voltage through the discharge assembly (such as electrodes), which excites plasma in the gas. This process can be accomplished using technologies such as radio frequency (RF), microwave, direct current, or pulsed direct current. In actual operation, the plasma cleaning nozzle 33 first introduces a suitable gas, and then the power supply generates a high voltage to ionize these gases and form plasma. Since the plasma contains a large number of energy-rich particles, when it comes into contact with the surface of an object, a series of physical and chemical reactions occur, including the removal of organic contaminants, changes in surface energy, and the formation of functional coatings on the surface of the object.

[0025] Specifically, a permanent stainless steel cathode plate surface treatment device also includes a positioning sensor 5 and a clamping mechanism 6. The positioning sensor 5 is mounted on a support frame 31; the clamping mechanism 6 is mounted on a base 11 to clamp both sides of the cathode plate 4 located on the conveyor belt 21. The clamping mechanism 6 can be a pneumatic, air suction, hydraulic, magnetic or mechanical clamping mechanism; the positioning sensor 5 is electrically connected to a controller, and the controller is electrically connected to the clamping mechanism 6.

[0026] Understandably, to ensure the accuracy of the cathode plate 4 clamping position, a small position sensor can be installed on the clamping block to detect and provide feedback on whether the cathode plate is accurately positioned and whether the clamping is reliable.

[0027] To further optimize the technical solution of the present invention, a rubber layer is laid and fixed on the outer surface of the clamping block of the clamping mechanism 6.

[0028] To further optimize the technical solution of the present invention, there are multiple grinding mechanisms arranged sequentially along the conveying direction of the conveyor belt 21. The rotation speed (500-3000rpm) of each nylon drawing wheel 13 can be adjusted independently to achieve step-by-step processing of coarse grinding and fine grinding, and to balance the passivation layer removal rate and the surface finish of the grinding surface.

[0029] Specifically, it also includes a cooling device, which is installed at the end of the conveying device 2. The cooling device reduces the temperature of the processed cathode plate 4 from 100-200℃ to room temperature by spraying or air cooling to prevent thermal deformation from affecting subsequent electrolysis.

[0030] This invention also discloses a method for surface treatment of a cathode plate using the aforementioned permanent stainless steel cathode plate surface treatment apparatus, comprising the following steps: 1) The conveying device 2 horizontally conveys the cathode plate 4 (size: 1.2m×0.8m×3mm) to the grinding device 2 at a speed of 1m / min; 2) When the position sensor 5 detects that the cathode plate 4 has reached the center position of the grinding station, the conveying device 2 stops and the clamping mechanism 6 starts (clamping force: 500N) to clamp and fix the cathode plate 4. 3) The robotic arm 12 drives the nylon drawing wheel 13 to move and rotate at a speed of 0.5 m / s (rotation speed 1000-2500 rpm). In this embodiment, the rotation speed of the nylon drawing wheel 13 is set to 2000 rpm, and a contact pressure of 0.5 MPa is applied at the same time. The surface of the cathode plate 4 is polished along a predetermined path (lateral reciprocating). The polishing time is about 2 minutes, and a passivation layer of 0.01-0.05 mm thickness is removed. In this embodiment, the passivation layer thickness is about 0.03 mm. 4) After polishing, gas supply device 34 introduces gas (such as argon, flow rate 5-20L / min). In this embodiment, the flow rate is set to 12L / min. Plasma cleaning nozzle 33 discharges at a distance of 5-20mm from the surface of cathode plate 4 (voltage 10-30kV, duration 10-60s). In this embodiment, plasma cleaning nozzle 33 is 10mm from the surface of cathode plate 4, voltage is selected as 20kV, and duration is selected as 30s, forming plasma to etch the surface of cathode plate 4. After treatment, the micro-roughness of the surface of cathode plate 4 is improved from Ra=0.6μm after polishing to Ra=1.2μm. Understandably, the distance between the plasma cleaning nozzle 33 and the surface of the cathode plate 4 is adjustable, and the discharge duration and power (1-5kW) are adjusted in real time by the controller to ensure that a micro-roughness of Ra=0.5-2μm is formed on the surface of the cathode plate 4 without damaging the substrate. 5) After processing, the cathode plate 4 is conveyed by the conveying device 2 and enters the cooling device for cooling. In this embodiment, air cooling is used with a wind speed of 5m / s to cool it down to room temperature (about 25°C) and then it is sent out by the conveying device 2 to the unloading platform.

[0031] Specifically, after step 4), the surface of the processed cathode plate 4 is subjected to roughness detection and visual inspection; if the roughness does not reach Ra=0.5-2μm or there are scratches, the grinding parameters or plasma treatment parameters are adjusted to achieve closed-loop optimization of detection-feedback-adjustment, ensuring that the processing quality of each cathode plate 4 is consistent.

[0032] Tests have shown that the cathode plate 4 treated with this invention performs as follows in electrolytic copper production: Copper deposition uniformity: surface copper layer thickness deviation ≤0.1mm (≤0.3mm for traditional methods); Copper particle adsorption force: The copper layer peeling rate was ≤1% (≤5% using the traditional method) when tested using the "tape peeling test". Processing efficiency: 15 cathode plates per hour (10 per hour using traditional methods); Surface quality: Visual inspection shows no obvious scratches (the scratch rate is about 10% using traditional methods).

[0033] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0034] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A permanent stainless steel cathode plate surface treatment device, characterized in that, The device includes a polishing device, a conveying device, a plasma treatment device, and a controller. The conveying device passes through the polishing device. The plasma treatment device is fixed on the polishing device and spans across the conveying device. The controller is electrically connected to the polishing device, the conveying device, and the plasma treatment device.

2. The permanent stainless steel cathode plate surface treatment device according to claim 1, characterized in that, The polishing device includes a base and a polishing mechanism. The polishing mechanism includes a robotic arm and a nylon drawing wheel. The conveyor belt of the conveying device passes through the base. The robotic arm is mounted on the base. The nylon drawing wheel is detachably connected to the end of the robotic arm. The controller is electrically connected to the robotic arm and the nylon drawing wheel respectively.

3. The permanent stainless steel cathode plate surface treatment device according to claim 2, characterized in that, The plasma treatment device includes a support frame, a slide table, a plasma cleaning nozzle, and a gas supply device. The support frame is fixed on the base and spans the conveyor belt. The slide table is slidably connected to the top of the support frame. The plasma cleaning nozzle is installed at the bottom of the slide table and aligned with the surface of the conveyor belt. The gas supply device is connected to the plasma cleaning nozzle. The controller is electrically connected to both the slide table and the gas supply device.

4. The permanent stainless steel cathode plate surface treatment device according to claim 3, characterized in that, The permanent stainless steel cathode plate surface treatment device further includes a positioning sensor and a clamping mechanism. The positioning sensor is mounted on the support frame; the clamping mechanism is mounted on the base to clamp both sides of the cathode plate located on the conveyor belt; the positioning sensor is electrically connected to the controller, and the controller is electrically connected to the clamping mechanism.

5. The permanent stainless steel cathode plate surface treatment device according to claim 4, characterized in that, The outer surface of the clamping block of the clamping mechanism is covered with a rubber layer.

6. The permanent stainless steel cathode plate surface treatment device according to claim 2, characterized in that, The number of the grinding mechanisms is multiple, and the multiple grinding mechanisms are arranged sequentially along the conveying direction of the conveyor belt.

7. The permanent stainless steel cathode plate surface treatment device according to claim 1, characterized in that, It also includes a cooling device, which is located at the conveying end of the conveying device.

8. A method for surface treatment of a cathode plate using the permanent stainless steel cathode plate surface treatment apparatus according to any one of claims 1-7, characterized in that, Includes the following steps: 1) The conveying device horizontally conveys the cathode plate to the grinding device; 2) When the positioning sensor detects the cathode plate, the clamping mechanism is activated to clamp and fix the cathode plate; 3) The robotic arm moves and rotates the nylon drawing wheel to polish the surface of the cathode plate along a predetermined path to remove the passivation layer; 4) After polishing, gas is introduced into the gas supply device, and the plasma cleaning nozzle discharges at a distance of 5-20mm from the cathode plate surface to form plasma to treat the cathode plate surface. 5) After processing, the cathode plate is conveyed by the conveying device and enters the cooling device for cooling.

9. A method for surface treatment of a cathode plate, characterized in that, Step 4) includes roughness detection and visual inspection of the processed cathode plate surface; if the roughness does not reach Ra=0.5-2μm or there are scratches, the polishing parameters or plasma treatment parameters are adjusted.

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