Radio frequency transceiver integrated circuit, transceiver front-end chip and radio frequency heterogeneous microsystem

Abstract

The application provides a radio frequency transceiving fusion circuit, a transceiving front-end chip and a radio frequency heterogeneous microsystem. The radio frequency transceiving fusion circuit comprises: a first bidirectional drive amplifier configured as a radio frequency power amplifier and a low noise amplifier in a radio frequency transmitting process and a radio frequency receiving process; a phase shifter connected with the first bidirectional drive amplifier and configured to adjust a phase of a radio frequency signal; the radio frequency signal comprises a transmitting signal and a receiving signal; and a second bidirectional drive amplifier connected with the phase shifter and configured to mix the radio frequency signal. The application provides a compact and efficient transceiving fusion design technology, which integrates similar modules and devices in a transmitting channel and a receiving channel, reduces the size of the transceiving channel, improves the analog integration level of the chip and improves the performance of the transceiving channel.

Description

Technical Field

[0001] This application belongs to the technical field of integrated circuits, and relates to a radio frequency transceiver fusion circuit, a transceiver front-end chip, and a radio frequency heterogeneous microsystem. Background Technology

[0002] With the continuous development of integrated circuits and the increasing demands, the design requirements for radio frequency (RF) transceiver chips are also rising. Taking RF heterogeneous integrated microsystems as an example, RF heterogeneous integrated microsystems have high integration density and high functional density, and are important applications in radar detection and high-capacity wireless communication.

[0003] For millimeter-wave phased array systems, which have stringent requirements for antenna element spacing, traditional transceiver front-end chip design technology has significant bottlenecks: although its discrete transmit and receive channel design method retains the independence of transmit and receive, it relies on RF switches to achieve path switching, which not only limits the system integration, but also introduces additional insertion loss, significantly degrading key indicators such as noise figure and power efficiency.

[0004] Radio frequency heterogeneous integrated microsystems employ multidimensional heterogeneous integration technology to integrate chips designed with different material systems such as silicon-based and compound semiconductors into miniaturized radio frequency systems, significantly improving system functional density. This technology can be applied to radar detection and high-capacity communication systems. Summary of the Invention

[0005] This application provides a radio frequency transceiver fusion circuit, a transceiver front-end chip, and a radio frequency heterogeneous microsystem to address the problem of limited integration in discrete radio frequency transceiver systems.

[0006] In a first aspect, this application provides a radio frequency transceiver fusion circuit, wherein the input terminal of the transmitter and the output terminal of the receiver are the same terminal; comprising: a first bidirectional drive amplifier configured as a radio frequency power amplifier and a low noise amplifier in the radio frequency transmission and reception processes; a phase shifter connected to the first bidirectional drive amplifier and configured to adjust the phase of the radio frequency signal; the radio frequency signal includes a transmission signal and a reception signal; a second bidirectional drive amplifier connected to the phase shifter and configured to mix the radio frequency signal; the transmission signal input at the input terminal of the transmitter is transmitted to the antenna terminal sequentially via the second bidirectional drive amplifier, the phase shifter and the first bidirectional drive amplifier; the reception signal at the antenna terminal is transmitted to the output terminal of the receiver sequentially via the first bidirectional drive amplifier, the phase shifter and the second bidirectional drive amplifier.

[0007] In one implementation of the first aspect, a transformer is further included, connected to the second bidirectional drive amplifier, and configured together with the second bidirectional drive amplifier as a mixer; the transmit signal input to the input terminal of the transmitter is transmitted to the antenna terminal sequentially via the mixer, the phase shifter and the first bidirectional drive amplifier; the receive signal at the antenna terminal is transmitted to the output terminal of the receiver sequentially via the first bidirectional drive amplifier, the phase shifter and the mixer.

[0008] In one implementation of the first aspect, the first bidirectional drive amplifier includes a first-stage bidirectional drive amplifier and a second-stage bidirectional drive amplifier; the first-stage bidirectional drive amplifier is connected to the second-stage bidirectional drive amplifier; the transmit signal input to the input terminal of the transmitter is transmitted to the antenna terminal sequentially via the mixer, the phase shifter, the first-stage bidirectional drive amplifier, and the second-stage bidirectional drive amplifier; the receive signal at the antenna terminal is transmitted to the output terminal of the receiver sequentially via the first-stage bidirectional drive amplifier, the second-stage bidirectional drive amplifier, the phase shifter, and the mixer.

[0009] In one implementation of the first aspect, the first bidirectional drive amplifier, the phase shifter, the second bidirectional drive amplifier, and the transformer are used as a single transceiver channel, and the RF transceiver fusion circuit includes a plurality of such single transceiver channels.

[0010] Secondly, this application provides a multi-channel phased array transceiver front-end chip, comprising: an integrated unit consisting of the aforementioned radio frequency transceiver fusion circuit, an antenna, and an attenuator, wherein the radio frequency transceiver fusion circuit is connected to the antenna and the attenuator.

[0011] In one implementation of the second aspect, the chip includes four sets of the integrated units; the four sets of integrated units are connected to a bidirectional drive amplifier for gain and phase control via the attenuator, and are connected to a power distribution and combining network via the bidirectional drive amplifier.

[0012] Thirdly, this application provides a radio frequency heterogeneous microsystem, including: the aforementioned multi-channel phased array transceiver front-end chip and frequency conversion chip; the multi-channel phased array transceiver front-end chip is connected to the frequency conversion chip.

[0013] In one implementation of the third aspect, the frequency converter chip includes a first bidirectional drive amplifier, a phase shifter, a second bidirectional drive amplifier, a mixer, a frequency tripler, an RF buffer, and a local oscillator buffer; the local oscillator input terminal of the frequency converter chip receives a local oscillator signal of a first frequency input from outside the chip, which is multiplied by the frequency tripler and then provides a local oscillator signal of a second frequency to the mixer.

[0014] In one implementation of the third aspect, the mixer in the frequency converter chip adopts a bidirectional architecture design and has the ability to operate in both upconversion and downconversion modes. In receiving mode, it can downconvert the radio frequency signal of the first frequency band to the second frequency band; in transmitting mode, it can upconvert the intermediate frequency signal of the second frequency band to the first frequency band.

[0015] In one implementation of the third aspect, the multi-channel phased array transceiver front-end chip includes four groups, each group consisting of four multi-channel phased array transceiver front-end chips; the first group of multi-channel phased array transceiver front-end chips is connected to the first bidirectional drive amplifier of the frequency converter chip; the second group of multi-channel phased array transceiver front-end chips is connected to the second bidirectional drive amplifier of the frequency converter chip; the third group of multi-channel phased array transceiver front-end chips is connected to the third bidirectional drive amplifier of the frequency converter chip; and the fourth group of multi-channel phased array transceiver front-end chips is connected to the fourth bidirectional drive amplifier of the frequency converter chip.

[0016] As described above, the RF transceiver fusion circuit, transceiver front-end chip, and RF heterogeneous microsystem described in this application have the following beneficial effects:

[0017] The compact transceiver fusion design technology of the RF chip in this application effectively improves circuit reuse by integrating amplifiers, phase shifters, attenuators, and other modules between the transmit and receive paths, thereby reducing the redundant layout of independent functional modules. This design logic forces the system to share resources within a limited space, naturally promoting the compactness of the overall structure. Furthermore, since the various modules work collaboratively under a unified architecture, signal path redundancy and electromagnetic interference that may occur in traditional discrete designs are avoided, thus optimizing the electromagnetic performance and signal integrity of the system. In millimeter-wave high-density integrated microsystems, this fusion design can also alleviate the conflict between high integration and electromagnetic compatibility, ultimately achieving a high-efficiency, small-size, and high-reliability phased array system. Therefore, this technical approach not only promotes the feasibility of heterogeneous integration but also provides solid technical support for engineering implementation. Attached Figure Description

[0018] Figure 1 The diagram shown is a conventional RF transceiver circuit diagram using existing technology.

[0019] Figure 2 The diagram shown is a schematic diagram of the RF transceiver fusion circuit described in the embodiments of this application.

[0020] Figure 3 The diagram shown is a schematic diagram of the radio frequency transceiver fusion circuit described in the embodiment of this application.

[0021] Figure 4 The diagram shown is a schematic of a bidirectional drive amplifier for the RF transceiver fusion circuit described in an embodiment of this application.

[0022] Figure 5 The diagram shown is a structural schematic of the multi-channel phased array transceiver front-end chip described in an embodiment of this application.

[0023] Figure 6 The diagram shown is a schematic diagram of the circuit principle of the multi-channel phased array transceiver front-end chip described in the embodiments of this application.

[0024] Figure 7 The diagram shown is a schematic diagram of the chip layout of the multi-channel phased array transceiver front-end chip described in the embodiments of this application.

[0025] Figure 8 The diagram shown is a schematic diagram of the structure of the radio frequency heterogeneous microsystem described in the embodiments of this application.

[0026] Figure 9 The diagram shown is a circuit diagram of the frequency converter chip for the radio frequency heterogeneous microsystem described in this application embodiment.

[0027] Figure 10 The diagram shown is an overall circuit diagram of the radio frequency heterogeneous microsystem described in the embodiments of this application.

[0028] Figure 11 The image shown is a multi-channel transceiver test result diagram of the radio frequency heterogeneous microsystem described in the embodiments of this application.

[0029] Component designation explanation

[0030] 1 RF transceiver fusion circuit 11 First bidirectional drive amplifier 111 First-stage bidirectional drive amplifier 112 Second-stage bidirectional drive amplifier 12 Phase shifter 13 Second bidirectional drive amplifier 14 transformer Detailed Implementation

[0031] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, unless otherwise specified, the following embodiments and features in the embodiments can be combined with each other.

[0032] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. Therefore, the drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0033] In millimeter-wave phased array systems, the spacing between array antennas must strictly adhere to the half-wavelength constraint criterion to avoid system performance degradation, which places extremely high demands on the miniaturization of multi-channel transceiver front-end chips.

[0034] Please see Figure 1 This is a conventional RF transceiver circuit diagram from the existing technology. For example... Figure 1 As shown, traditional design techniques separate the transmission and reception links, facing multiple technical challenges:

[0035] (1) The independently designed power amplifier, low noise amplifier, phase shifter and switching modules occupy a large amount of physical space.

[0036] (2) Limit the ability to expand the array size.

[0037] (3) Due to impedance mismatch and the inherent characteristics of RF switches, the cascaded structure between modules inevitably leads to a decrease in signal transmission efficiency and a deterioration in noise performance. Especially in the millimeter-wave band, traditional design techniques are difficult to meet the stringent requirements of subwavelength array element spacing, which can easily cause electromagnetic coupling interference and grating lobe effects.

[0038] Therefore, traditional transceiver front-end chip design technology is limited by the separate design of transmit and receive channels, and faces the contradiction between array element spacing and chip size in millimeter-wave applications. To address the problems of traditional design methods, this application proposes a compact and efficient transceiver fusion design technology. By deeply integrating modules and devices with similar functions in the transmit and receive channels, the size of the transceiver channels is reduced, the chip analog integration density is improved, and the performance of the transceiver channels is enhanced, thereby realizing an efficient and compact RF heterogeneous integrated microsystem.

[0039] The technical solutions in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0040] Please see Figure 2 The diagram shows a schematic representation of the RF transceiver fusion circuit described in an embodiment of this application. Figure 2 As shown, this embodiment provides a radio frequency transceiver fusion circuit 1, in which the input terminal of the transmitter and the output terminal of the receiver are the same terminal; including: a first bidirectional drive amplifier 11, a phase shifter 12 and a second bidirectional drive amplifier 13.

[0041] The first bidirectional drive amplifier 11 is configured as a radio frequency power amplifier and a low noise amplifier during the radio frequency transmission and reception processes.

[0042] The phase shifter 12 is connected to the first bidirectional drive amplifier and is configured to adjust the phase of the radio frequency signal; the radio frequency signal includes a transmit signal and a receive signal.

[0043] The second bidirectional drive amplifier 13 is connected to the phase shifter 12 and is configured to mix the radio frequency signal.

[0044] The transmit signal input to the transmitter is transmitted sequentially to the antenna via the second bidirectional drive amplifier 13, the phase shifter 12, and the first bidirectional drive amplifier 11; the receive signal at the antenna is transmitted sequentially to the output of the receiver via the first bidirectional drive amplifier 11, the phase shifter 12, and the second bidirectional drive amplifier 13.

[0045] In one embodiment, the RF transceiver fusion circuit further includes a transformer connected to the second bidirectional drive amplifier and configured together with the second bidirectional drive amplifier as a mixer.

[0046] The transmit signal input to the transmitter's input terminal is transmitted to the antenna terminal sequentially via the mixer, the phase shifter, and the first bidirectional drive amplifier.

[0047] The received signal at the antenna end is transmitted sequentially to the output end of the receiver via the first bidirectional drive amplifier, the phase shifter, and the mixer.

[0048] In one embodiment, the first bidirectional drive amplifier includes a first-stage bidirectional drive amplifier and a second-stage bidirectional drive amplifier; the first-stage bidirectional drive amplifier is connected to the second-stage bidirectional drive amplifier.

[0049] The transmit signal input to the transmitter's input terminal is transmitted sequentially to the antenna terminal via the mixer, the phase shifter, the first-stage bidirectional drive amplifier, and the second-stage bidirectional drive amplifier.

[0050] The received signal at the antenna end is transmitted sequentially to the output end of the receiver via the first-stage bidirectional drive amplifier, the second-stage bidirectional drive amplifier, the phase shifter, and the mixer.

[0051] Please see Figure 3 The diagram shown is a schematic representation of the RF transceiver fusion circuit described in an embodiment of this application. Figure 3 As shown, the RF transceiver fusion circuit 1 further includes a transformer 14, which is connected to the second bidirectional driver amplifier 13 and configured together with the second bidirectional driver amplifier 13 as a mixer. The first bidirectional driver amplifier 11 includes a first-stage bidirectional driver amplifier 111 and a second-stage bidirectional driver amplifier 112; the first-stage bidirectional driver amplifier 111 is connected to the second-stage bidirectional driver amplifier 112.

[0052] like Figure 3As shown, the transmit signal input to the transmitter's input terminal is transmitted sequentially to the antenna terminal via the mixer (transformer 14, second bidirectional drive amplifier 13), the phase shifter, the first-stage bidirectional drive amplifier, and the second-stage bidirectional drive amplifier; the receive signal at the antenna terminal is transmitted sequentially to the receiver's output terminal via the first-stage bidirectional drive amplifier, the second-stage bidirectional drive amplifier, the phase shifter, and the mixer (second bidirectional drive amplifier 13, transformer 14).

[0053] like Figure 3 As shown, in one embodiment, the first bidirectional drive amplifier, the phase shifter, the second bidirectional drive amplifier, and the transformer are used as a single transceiver channel, and the RF transceiver fusion circuit includes several such single transceiver channels.

[0054] like Figure 3 As shown, this application integrates key sub-circuits such as RF power amplifiers, low-noise amplifiers, phase shifters, and mixers through collaborative design, further promoting the organic integration of transmitting and receiving active circuits. This enables the multiplexing of core functions in the transmit and receive links, significantly reducing the number of discrete modules, including RF switches, in the system. This technology not only effectively resolves the contradiction between array element spacing and circuit scale but also improves key system performance such as gain and noise by reducing circuit losses, providing a high-density, low-loss design foundation for millimeter-wave large-scale phased array systems.

[0055] In practical applications, phase shifters in radio frequency (RF) are mainly used to adjust the phase of RF signals, and to achieve functions such as beam control, signal modulation and interference suppression in scenarios such as phased array antennas, communication systems, and radar.

[0056] Please see Figure 4 The image shown is a schematic diagram of the bidirectional drive amplifier of the RF transceiver fusion circuit described in an embodiment of this application. Figure 4 As shown, the bidirectional driver amplifier integrated in this application chip also considers the requirements of the transmit and receive channels and has undergone a fusion optimization design. This solution, through the integration of a fusion RF switch, can provide a stable gain of over 20dB across the entire operating bandwidth. This highly integrated design not only simplifies the system architecture but also significantly improves the overall performance of the signal link.

[0057] Please see Figure 5 The image shown is a schematic diagram of the structure of the multi-channel phased array transceiver front-end chip described in an embodiment of this application. Figure 5 As shown, this embodiment provides a multi-channel phased array transceiver front-end chip, including: an integrated unit composed of the aforementioned radio frequency transceiver fusion circuit, an antenna, and an attenuator, wherein the radio frequency transceiver fusion circuit is connected to the antenna and the attenuator.

[0058] In one embodiment, the chip includes four sets of the overall units.

[0059] The four sets of integrated units are connected to a bidirectional drive amplifier for gain and phase control via the attenuator, and are connected to a power distribution and combining network via the bidirectional drive amplifier.

[0060] Please see Figure 6 The diagram shows the circuit principle schematic of the multi-channel phased array transceiver front-end chip described in the embodiments of this application. Figure 6 As shown, the chip comprises four integrated units consisting of the aforementioned RF transceiver fusion circuit and the attenuator, from left to right: a first branch integrated unit, a second branch integrated unit, a third branch integrated unit, and a fourth branch integrated unit. The four integrated units are connected in parallel, with one end connected to the antenna and the other end connected to an RF buffer. The RF buffer acts as a bidirectional driver amplifier for gain and phase control, specifically including SPI (Serial Peripheral Interface), gain control, and phase control, and is connected to a power distribution and combining network through the bidirectional driver amplifier. In one embodiment, the phase shifter is a digital phase shifter, and the attenuator is a digital attenuator; each integrated unit comprises a first bidirectional driver amplifier, a 7-bit digital phase shifter, a second bidirectional driver amplifier, a 4-bit digital attenuator, and an RF buffer.

[0061] In practical applications, the multi-channel transceiver front-end chip of this application adopts a compact transceiver fusion design method. Considering the phase shifting and attenuation requirements of the transceiver channels, the phase shifting and attenuation units in the channels are reused, thereby reducing the area of ​​the RF channels. The chip operates in the 92-96 GHz millimeter-wave band and integrates four bidirectional RF transceiver channels, a power distribution / combining network, an RF buffer, and digital control circuits on-chip. Each transceiver channel includes core circuit units such as a bidirectional amplifier, a 7-bit digital phase shifter, a 4-bit digital attenuator, and an RF buffer.

[0062] Therefore, addressing the issue of low integration density in traditional discrete RF front-end circuits, an innovative collaborative optimization design method using power amplifiers and low-noise amplifiers was adopted, achieving functional integration and circuit multiplexing of the transceiver link. This technological breakthrough not only significantly improved chip integration density but also enhanced the overall system performance.

[0063] Please see Figure 7 The image shows a schematic diagram of the chip layout of the multi-channel phased array transceiver front-end chip described in an embodiment of this application. Figure 7As shown in the figure, this embodiment is based on a compact transceiver fusion design technology and shows a schematic diagram of the chip layout of a millimeter-wave phased array multi-channel transceiver chip. Through the compact fusion design method, the overall chip size is only 2mm×2.5mm, which has the characteristics of small area.

[0064] Please see Figure 8 The image shown is a schematic diagram of the structure of the radio frequency heterogeneous microsystem described in an embodiment of this application. Figure 8 As shown, this embodiment provides a radio frequency heterogeneous microsystem, including: the aforementioned multi-channel phased array transceiver front-end chip and a frequency conversion chip; the multi-channel phased array transceiver front-end chip is connected to the frequency conversion chip.

[0065] In one embodiment, the multi-channel phased array transceiver front-end chip includes an integrated unit consisting of the radio frequency transceiver fusion circuit, the antenna, and the attenuator, wherein the radio frequency transceiver fusion circuit is linked to the antenna and the attenuator.

[0066] In one embodiment, the multi-channel phased array transceiver front-end chip includes four sets of integrated units; the four sets of integrated units are connected to a bidirectional drive amplifier for gain and phase control via the attenuator, and are connected to a power distribution and combining network via the bidirectional drive amplifier.

[0067] In one embodiment, the frequency converter chip includes a first bidirectional drive amplifier, a phase shifter, a second bidirectional drive amplifier, a mixer, a tripler, an RF buffer, and a local oscillator buffer.

[0068] The local oscillator input terminal of the frequency converter chip receives a local oscillator signal of the first frequency input from outside the chip. After being multiplied by the frequency tripler, it provides a local oscillator signal of the second frequency to the mixer.

[0069] Please see Figure 9 The diagram shows the frequency converter chip circuit of the radio frequency heterogeneous microsystem described in this application embodiment. Figure 9 As shown, the converter chip and multi-channel phased array transceiver front-end chip are illustrated. The converter chip integrates key functional modules such as a bidirectional drive amplifier, mixer, frequency tripler, and RF / local oscillator buffer. Compared to traditional design methods that require independent design of transmit and receive mixing links, this application deeply considers the requirements of the transceiver mixing link, achieving simultaneous transmit and receive functions through a single mixer. This not only significantly improves system integration but also effectively reduces chip area, providing technical support for high-density integration of heterogeneous RF microsystems. Furthermore, the converter chip employs a frequency tripler design, effectively reducing the frequency requirement of the external local oscillator signal. By inputting a 20GHz local oscillator signal externally, after frequency multiplication by the on-chip frequency tripler, a 60GHz local oscillator signal can be provided to the mixer.

[0070] In one embodiment, the mixer in the frequency converter chip adopts a bidirectional architecture design and has the ability to operate in both upconversion and downconversion modes. In receiving mode, it can downconvert the radio frequency signal of the first frequency band to the second frequency band; in transmitting mode, it can upconvert the intermediate frequency signal of the second frequency band to the first frequency band.

[0071] Specifically, the mixer in the chip adopts a bidirectional architecture design, which has the ability to operate in both up-conversion and down-conversion modes.

[0072] For example, the first frequency band is 92-96GHz, and the second frequency band is 32-36GHz. In practical applications, the principle is as follows: in receiving mode, the 92-96GHz radio frequency signal can be down-converted to a 32-36GHz intermediate frequency.

[0073] In transmit mode, it can upconvert 32-36GHz intermediate frequency signals to 92-96GHz radio frequency bands.

[0074] like Figure 3 As shown, the integrated bidirectional driver amplifier also incorporates optimized design to meet the requirements of the transmit and receive channels. This solution, through the integration of a fused RF switch, provides a stable gain of over 20dB across the entire operating bandwidth. This highly integrated design not only simplifies the system architecture but also significantly improves the overall performance of the signal link.

[0075] In one embodiment, the multi-channel phased array transceiver front-end chip includes four groups, each group consisting of four multi-channel phased array transceiver front-end chips.

[0076] The first group of multi-channel phased array transceiver front-end chips is connected to the first bidirectional drive amplifier of the frequency converter chip.

[0077] The second set of multi-channel phased array transceiver front-end chips is connected to the second bidirectional drive amplifier of the frequency converter chip.

[0078] The third group of multi-channel phased array transceiver front-end chips is connected to the third bidirectional drive amplifier of the frequency converter chip.

[0079] The fourth multi-channel phased array transceiver front-end chip is connected to the fourth bidirectional drive amplifier of the frequency converter chip.

[0080] Please see Figure 10 The diagram shows the overall circuit diagram of the radio frequency heterogeneous microsystem described in the embodiments of this application. Figure 10The diagram illustrates the detailed circuit principle of the radio frequency heterogeneous microsystem designed based on the compact design method of this application. The multi-channel phased array transceiver front-end chip comprises four groups, each group consisting of four multi-channel phased array transceiver front-end chips. The first group consists of chips 1, 2, 3, and 4; the second group consists of chips 5, 6, 7, and 8; the third group consists of chips 9, 10, 11, and 12; and the fourth group consists of chips 13, 14, 15, and 16. The design method of this application deeply integrates various circuits from the RF front-end to the intermediate frequency, promoting the organic integration of transmitting and receiving active circuits, reducing the transceiver channel area while improving the transceiver channel speed and efficiency.

[0081] Please see Figure 11 The image shows the multi-channel transceiver test results of the radio frequency heterogeneous microsystem described in the embodiments of this application. Figure 11 As shown, the test results of the chip in transmit and receive modes are illustrated. Figure 5 As shown, within the operating frequency range of 92~96GHz, the transmit mode gain is greater than 27dB, the return loss meets the RF system design requirements, the saturated output power is greater than 12.2dBm, and the peak PAE is greater than 17%. On the other hand, in receive mode, the gain is greater than 25dB, the return loss also meets the RF system design requirements, and the noise figure is less than 7dB.

[0082] In practical applications, for system-level verification, this embodiment plans to construct an 8×8 wafer-level phased array system. This system consists of 16 multi-channel phased array transceiver front-end chips and 4 frequency converter chips. Every 4 transceiver front-end chips are connected to one transceiver channel of the frequency converter chip, ultimately forming a 64-channel silicon-based millimeter-wave CMOS phased array system architecture. This modular design ensures both system scalability and high-density integration, providing a complete chip-level solution for millimeter-wave phased array applications.

[0083] Therefore, this application constructs a full-link bidirectional millimeter-wave phased array architecture by integrating amplifiers, phase shifters, attenuators, and other circuit modules from the RF chip between the transmit and receive paths, thereby improving the full-channel circuit multiplexing rate and reconstructing the traditional signal chain. This method effectively improves system integration and performance while resolving the contradiction between high-density integration and electromagnetic compatibility in millimeter-wave arrays. The points to be protected include: the fusion and multiplexing mechanism of the transmit and receive paths within the RF chip.

[0084] In the embodiments provided in this application, it should be understood that the disclosed circuits, chips, or systems can be implemented in other ways. For example, the system embodiments described above are merely illustrative. For instance, the division of modules / units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or units may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the couplings or direct couplings or communication connections shown or discussed may be indirect couplings or communication connections through some interfaces, devices, modules, or units, and may be electrical connections or other non-contact coupling connection forms.

[0085] The modules / units described as separate components may or may not be physically separate. The components shown as modules / units may or may not be physical modules; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules / units can be selected to achieve the objectives of the embodiments of this application, depending on actual needs. For example, the functional modules / units in the various embodiments of this application may be integrated into one processing module, or each module / unit may exist physically separately, or two or more modules / units may be integrated into one module / unit.

[0086] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.

Claims

1. A radio frequency transceiver fusion circuit, characterized in that, The transmitter's input and the receiver's output are the same; including: A first bidirectional drive amplifier is configured as a radio frequency power amplifier and a low-noise amplifier during radio frequency transmission and reception; the first bidirectional drive amplifier includes a first-stage bidirectional drive amplifier and a second-stage bidirectional drive amplifier; the first-stage bidirectional drive amplifier and the second-stage bidirectional drive amplifier are connected. A phase shifter, connected to the first bidirectional drive amplifier, is configured to adjust the phase of a radio frequency (RF) signal, which includes a transmit signal and a receive signal. A second bidirectional drive amplifier, connected to the phase shifter, is configured to mix the radio frequency signal; A transformer is connected to the second bidirectional drive amplifier and is configured together with the second bidirectional drive amplifier as a mixer; The transmit signal input to the transmitter is transmitted sequentially through the mixer, the phase shifter, the first-stage bidirectional drive amplifier, and the second-stage bidirectional drive amplifier to the antenna; the receive signal at the antenna is transmitted sequentially through the first-stage bidirectional drive amplifier, the second-stage bidirectional drive amplifier, the phase shifter, and the mixer to the output of the receiver.

2. The circuit according to claim 1, characterized in that: The first bidirectional drive amplifier, the phase shifter, the second bidirectional drive amplifier, and the transformer are combined into a single transceiver channel, and the RF transceiver fusion circuit includes several such single transceiver channels.

3. A multi-channel phased array transceiver front-end chip, characterized in that, include: The integrated unit comprising the RF transceiver fusion circuit, the antenna, and the attenuator as described in claim 1 or 2, wherein the RF transceiver fusion circuit links the antenna and the attenuator.

4. The chip according to claim 3, characterized in that: The chip comprises four sets of the aforementioned integrated units; The four sets of integrated units are connected to a bidirectional drive amplifier for gain and phase control via the attenuator, and are connected to a power distribution and combining network via the bidirectional drive amplifier.

5. A radio frequency heterogeneous microsystem, characterized in that, include: The multi-channel phased array transceiver front-end chip and the frequency converter chip as described in any one of claims 3 or 4; the multi-channel phased array transceiver front-end chip is connected to the frequency converter chip.

6. The system according to claim 5, characterized in that: The frequency converter chip includes a first bidirectional drive amplifier, a phase shifter, a second bidirectional drive amplifier, a mixer, a frequency tripler, an RF buffer, and a local oscillator buffer. The local oscillator input terminal of the frequency converter chip receives a local oscillator signal of the first frequency input from outside the chip. After being multiplied by the frequency tripler, it provides a local oscillator signal of the second frequency to the mixer.

7. The system according to claim 6, characterized in that: The mixer in the frequency converter chip adopts a bidirectional architecture design and has the ability to work in both up-conversion and down-conversion modes. In receiving mode, it can down-convert the radio frequency signal of the first frequency band to the second frequency band. In transmit mode, the intermediate frequency signal of the second frequency band can be upconverted to the first frequency band.

8. The system according to claim 5, characterized in that: The multi-channel phased array transceiver front-end chip includes 4 groups, each group consisting of 4 multi-channel phased array transceiver front-end chips; The first group of multi-channel phased array transceiver front-end chips is connected to the first bidirectional drive amplifier of the frequency converter chip. The second set of multi-channel phased array transceiver front-end chips is connected to the second bidirectional drive amplifier of the frequency converter chip. The third group of multi-channel phased array transceiver front-end chips is connected to the third bidirectional drive amplifier of the frequency converter chip; The fourth multi-channel phased array transceiver front-end chip is connected to the fourth bidirectional drive amplifier of the frequency converter chip.

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