Display substrate, display screen and electronic equipment

Abstract

The embodiment of the invention provides a display substrate, a display screen and electronic equipment. The display substrate comprises a substrate, a first metal layer, a second metal layer, a first insulating layer and a second insulating layer, the first metal layer is located on one side of the substrate; the second insulating layer is positioned on one side, far away from the substrate, of the first metal layer; the first insulating layer is positioned on one side, far away from the first metal layer, of the second insulating layer; the second metal layer is positioned on one side, far away from the second insulating layer, of the first insulating layer; the first insulating layer comprises a first etching structure, and the first etching structure is located between the maintenance signal line and the first signal line. The first insulating layer between the first metal layer and the second metal layer is thinned by the first etching structure, so that the first insulating layer is easier to punch through during maintenance, the success rate of melting of the first metal layer and the second metal layer is improved, and the success rate of maintenance and welding is improved.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display substrate, a display screen, and an electronic device. Background Technology

[0002] In the production of medium and large-sized OLED (Organic Light Emitting Diode) products, due to the larger product size, there are more and longer metal traces, which easily leads to more BP (BackPlane) particles. BP particles usually cause poor traces in the display substrate or prevent some areas from lighting up. To ensure normal display, defective products are repaired to save costs.

[0003] In related technologies, repair welding is usually performed from the back of the product, such as... Figure 1 As shown, laser welding breaks down the inorganic layer from the back of the product, fusing the Gate layer (with repair lines) and the SD layer (source / drain layer) together. The repair lines in the Gate layer then supply power to the SD layer, thus repairing the product. However, when welding from the back, the laser needs to weld the Gate layer and SD layer together, but the Gate layer absorbs the laser energy, making it difficult to penetrate the inorganic layer, leading to welding failure. Therefore, improving the success rate of repair welding is a pressing issue. Summary of the Invention

[0004] The purpose of this application is to provide a display substrate, a display screen, and an electronic device to improve the success rate of repair soldering of the display substrate, display screen, or electronic device. The specific technical solution is as follows:

[0005] This application provides a display substrate, including:

[0006] Substrate, first metal layer, second metal layer, first insulating layer, second insulating layer;

[0007] The first metal layer is located on one side of the substrate;

[0008] The second insulating layer is located on the side of the first metal layer away from the substrate;

[0009] The first insulating layer is located on the side of the second insulating layer away from the first metal layer;

[0010] The second metal layer is located on the side of the first insulating layer away from the second insulating layer;

[0011] The first metal layer includes a plurality of repair signal lines, and the second metal layer includes a plurality of first signal lines.

[0012] The first insulating layer includes a first etching structure, and the first etching structure is located between the repair signal line and the first signal line.

[0013] In a possible implementation, the first etching structure penetrates through the first insulating layer.

[0014] In a possible implementation, the display substrate further includes a third metal layer.

[0015] The third metal layer is located between the first insulating layer and the second insulating layer, the third metal layer includes an etching blocking structure, and a first projection of the first etching structure on the substrate is located in a second projection of the etching blocking structure on the substrate.

[0016] In a possible implementation, an area of the second projection is greater than an area of the first projection.

[0017] In a possible implementation, the repair signal line includes a second etching structure, and a third projection of the second etching structure on the substrate is located in the second projection.

[0018] In a possible implementation, the third projection is located in the first projection.

[0019] In a possible implementation, the second etching structure penetrates through the repair signal line.

[0020] In a possible implementation, the display substrate further includes:

[0021] a third insulating layer, a fourth insulating layer, and a passivation layer.

[0022] The third insulating layer is located on a side of the first metal layer close to the substrate.

[0023] The fourth insulating layer is located on a side of the third insulating layer close to the substrate.

[0024] The passivation layer is located on a side of the second metal layer away from the substrate.

[0025] Embodiments of the present application provide a display screen including any of the display substrates described in embodiments of the present application.

[0026] Embodiments of the present application provide an electronic device including the display screen described in embodiments of the present application.

[0027] Embodiments of the present application have the following beneficial effects:

[0028] The display substrate provided by the embodiment of the present application comprises a substrate, a first metal layer, a second metal layer, a first insulating layer and a second insulating layer. The first metal layer is located on one side of the substrate. The second insulating layer is located on the side of the first metal layer away from the substrate. The first insulating layer is located on the side of the second insulating layer away from the first metal layer. The second metal layer is located on the side of the first insulating layer away from the second insulating layer. The first metal layer comprises a plurality of repair signal lines, and the third metal layer comprises a plurality of first signal lines. The first insulating layer comprises a first etching structure located between the repair signal lines and the first signal lines. The first etching structure is located between the repair signal lines and the first signal lines, and thins the first insulating layer between the first metal layer and the second metal layer, so that the first insulating layer is more easily penetrated during repair, thereby improving the success rate of melting of the first metal layer and the second metal layer, and improving the success rate of repair welding.

[0029] Of course, implementing any product or method of the present application does not necessarily require achieving all the advantages described above at the same time. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other embodiments can also be obtained by those skilled in the art based on these drawings.

[0031] Figure 1 For Figure 2 A cross-sectional view of a position A of a display substrate in the related art;

[0032] Figure 2 A schematic view of a display substrate in the related art;

[0033] Figure 3 A schematic view of a display substrate in the embodiment of the present application;

[0034] FIG. 4(a) is a cross-sectional view of a position B of a display substrate in the embodiment of the present application;

[0035] FIG. 4(b) is a schematic view of the display substrate shown in FIG. 4(a) during laser welding;

[0036] FIG. 5(a) is another cross-sectional view of the position B of the display substrate in the embodiment of the present application;

[0037] FIG. 5(b) is a schematic view of the display substrate shown in FIG. 5(a) during laser welding;

[0038] FIG. 6(a) is another cross-sectional view of the display substrate at position B according to an embodiment of the present application;

[0039] FIG. 6(b) is a schematic view of the display substrate shown in FIG. 6(a) during laser welding according to an embodiment of the present application;

[0040] FIG. 6(c) is a comparison of the projected areas of the first etching structure and the etching blocking structure on the substrate according to an embodiment of the present application;

[0041] FIG. 7(a) is another cross-sectional view of the display substrate at position B according to an embodiment of the present application;

[0042] FIG. 7(b) is a schematic view of the display substrate shown in FIG. 7(a) during laser welding according to an embodiment of the present application;

[0043] FIG. 8(a) is another cross-sectional view of the display substrate at position B according to an embodiment of the present application;

[0044] FIG. 8(b) is a schematic view of the display substrate shown in FIG. 8(a) during laser welding according to an embodiment of the present application;

[0045] Figure 9 FIG. 9 is another schematic view of the display substrate according to an embodiment of the present application. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art based on the present application are within the scope of protection of the present application.

[0047] In the production of large-size OLED (Organic Light Emitting Diode) products, because the product size is large, the metal traces in the product also become more and longer, and more BP (BackPlane) particles are prone to occur. The BP particles usually cause the traces in the display substrate to be poor or some areas to be unable to light up. In order to ensure the normal display of the display substrate, the poor products are repaired to save costs.

[0048] In the related art, the repair welding is usually performed from the back of the product, as shown in Figure 1 Figure 1 is a cross-sectional view of position A, Figure 2 Figure 1 ​​(Bottom-end) The insulating and inorganic layers between the gate and source / drain layers are broken up, and the Gate layer (with repair lines) and SD layer (with source / drain layers) are melted together. Then, the repair lines of the Gate layer are used to power the SD layer, thus achieving product repair. When soldering from the back, the laser needs to penetrate the Gate layer to reach the insulating and inorganic layers, melting the Gate layer metal while simultaneously penetrating the insulating and inorganic layers, soldering the Gate layer and SD layer together. However, in related technologies, the insulating and inorganic layers in the display substrate are relatively thick; for example, the combined thickness of the insulating and inorganic layers is 0.64 μm. Furthermore, when the laser passes through the Gate layer, the Gate layer absorbs the laser energy, making it difficult to penetrate the inorganic layer, leading to repair soldering failure. Meanwhile, as... Figure 2 As shown, the display substrate is divided into a display area and a non-display area. When repairing and soldering, it is necessary to find the area where the Data (data signal) line and the Repair Line (repair line) overlap in the non-display area for soldering. When repairing the back, it is difficult to accurately locate the soldering point, which causes the soldering position to deviate and further increases the failure rate of repair soldering.

[0049] To improve the success rate of repair soldering, this application provides a display substrate, a display screen, and an electronic device, which are described in detail below:

[0050] This application provides a display substrate, as shown in Figures 4(a) and 4(b), comprising:

[0051] Substrate 100, first metal layer 101, second metal layer 102, first insulating layer 103, second insulating layer 104;

[0052] The first metal layer 101 is located on one side of the substrate 100;

[0053] The second insulating layer 104 is located on the side of the first metal layer 101 away from the substrate 100;

[0054] The first insulating layer 103 is located on the side of the second insulating layer 104 away from the first metal layer 101;

[0055] The second metal layer 102 is located on the side of the first insulating layer 103 away from the second insulating layer 104;

[0056] The first metal layer 101 includes multiple maintenance signal lines, and the second metal layer 102 includes multiple first signal lines;

[0057] The first insulating layer 103 includes a first etched structure 1031, which is located between the maintenance signal line and the first signal line.

[0058] The substrate 100 is used to fix the positions of the various components of the display substrate, as shown in Figure 4(a). The first metal layer 101 is a gate metal layer, which includes multiple maintenance signal lines. The second metal layer 102 is an SD metal layer, which includes multiple first signal lines. The first insulating layer 103, also known as the inorganic layer, is made of an inorganic oxide material, such as SiN. X The first insulating layer 103 is typically prepared using processes such as PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), or high-temperature sintering. These methods enable precise thin-film control, meeting the display's requirements for thickness and uniformity. The second insulating layer 104 is prepared using insulating materials, such as polyimide. The second insulating layer 104 provides electrical isolation, protecting the circuitry of the first metal layer 101 and reducing short circuits. Simultaneously, it isolates the first metal layer 101 from the second metal layer 102, minimizing the possibility of contact between the two layers during display substrate fabrication.

[0059] In the fabrication of the display substrate, the first insulating layer 103 is etched using a CNT (Contact) / CNTO (Contact Oxide) mask to form a first etched structure 1031. The first etched structure 1031 is filled by the second metal layer 102, specifically by the first signal line within the second metal layer 102. Mask etching reduces the thickness of the first insulating layer 103 without requiring additional masking, simplifying the display substrate fabrication process. The first etched structure 1031 is located between the repair signal line and the first signal line, thinning the first insulating layer 103 (inorganic layer) between the first metal layer 101 and the second metal layer 102. This makes the first insulating layer 103 easier to penetrate during repair, increasing the success rate of melting the first metal layer 101 and the second metal layer 102, thereby improving the success rate of repair soldering.

[0060] During repair soldering, as shown in Figure 4(b), a laser is inserted into the display substrate from the back (bottom of Figure 4(b)). This laser melts the gate metal of the first metal layer 101, penetrates the second insulating layer 104 and the first insulating layer 103, and fuses the first metal layer 101 and the second metal layer 102 together, completing the repair soldering. After soldering, the repair signal line of the first metal layer 101 is used to power the first signal line of the second metal layer 102, thereby enabling product repair.

[0061] In the embodiments of this application, the display substrate can be LTPS (Low Temperature Poly Silicon) or LTPO / LTPO+ (Low Temperature Poly Oxide, a technology combining LTPS and IGZO (Indium Gallium Zinc Oxide)). The display substrate can be a dual gate layer or a triple gate layer.

[0062] In one example, the display substrate is a three-gate-layer LTPS, and the first etched structure 1031 is a CNT hole. The display substrate includes a first gate layer (Gate1), a second gate layer (Gate2), and a third gate layer (Gate3), and the first metal layer 101 is the second gate layer (Gate2). During repair soldering, the laser melts the second gate layer (Gate2), penetrates the second insulating layer 104 and the first insulating layer 103, and melts the traces in the second gate layer (Gate2) and the traces in the second metal layer 102 together, completing the repair soldering.

[0063] In one example, the display substrate is a triple-gate LTPO / LTPO+, and the first etched structure 1031 is a CNTO via. The display substrate includes a first gate layer (Gate1), a second gate layer (Gate2), and a third gate layer (Gate3), with the first metal layer 101 being the second gate layer (Gate2). During repair soldering, the laser melts the second gate layer (Gate2), penetrates the second insulating layer 104 and the first insulating layer 103, and fuses the traces in the second gate layer (Gate2) with the traces in the second metal layer 102 together, completing the repair soldering.

[0064] In one example, the display substrate is a dual-gate layer LTPS, and the first etched structure 1031 is a CNT hole. The display substrate includes a first gate layer Gate1 and a second gate layer Gate2, and a first metal layer 101 is the first gate layer Gate1. During repair soldering, the laser melts the first gate layer Gate1, penetrates the second insulating layer 104 and the first insulating layer 103, and melts the traces in the first gate layer Gate1 together with the traces in the second metal layer 102, thus completing the repair soldering.

[0065] The display substrate provided in this application embodiment reduces the thickness of the first insulating layer by etching the first insulating layer 103 to form a first etched structure 1031 during the manufacturing process. In one example, the etching thickness of the first etched structure 1031 can be 0.5 μm. That is, compared with related technologies, the first insulating layer at the repair location in this application embodiment is thinned by 0.5 μm, which reduces the difficulty of subsequent repair soldering when defects occur, improves the success rate of repair soldering, and saves the manufacturing cost of the display substrate.

[0066] In one possible implementation, referring to Figures 5(a) and 5(b), the first etched structure 1031 penetrates the first insulating layer 103.

[0067] Referring to Figure 5(a), the first etched structure 1031 penetrates the first insulating layer 103 and is filled by the second metal layer 102, specifically by the first signal line in the second metal layer 102. At the first etched structure 1031, the second metal layer 102 and the second insulating layer 104 are connected. During repair soldering, referring to Figure 5(b), a laser is injected into the display substrate from the back (bottom of Figure 5(b)). After melting the gate metal of the first metal layer 101, the laser penetrates the second insulating layer 104, fusing the first metal layer 101 and the second metal layer 102 together, completing the repair soldering. After soldering, the repair signal line of the first metal layer 101 is used to power the first signal line of the second metal layer 102, thereby enabling product repair.

[0068] The first etched structure 1031 penetrates the first insulating layer 103. During maintenance, the laser can penetrate the second insulating layer 104 to achieve the maintenance. The second insulating layer 104 is thin and easy to penetrate, thereby improving the success rate of maintenance welding.

[0069] During the fabrication of the display substrate, a first etched structure 1031 is formed by etching the first insulating layer 103. Because the second insulating layer 104 is relatively thin, there is a risk that the first etched structure 1031 may simultaneously penetrate the second insulating layer 104 during the fabrication of the first etched structure 1031. This means the first etched structure 1031 may penetrate both the first and second insulating layers 104 simultaneously, causing electrical connection between the first metal layer 101 and the second metal layer 102 during the display substrate fabrication, resulting in a short circuit. To mitigate this problem, see [link to relevant documentation]. Figure 3 Figures 6(a)-8(b), where Figures 6(a)-8(b) are... Figure 3 A cross-sectional view at position B in the middle. Figure 3 The display substrate is divided into a display area and a non-display area. The second metal layer 102, the etching blocking structure 1051, and the maintenance signal line 202 are located in the non-display area. The first signal line 201 is located in both the display area and the non-display area. The first signal line 201 is arranged in the second metal layer 102, and the maintenance signal line 202 is arranged in the first metal layer 101. The etching blocking structure 1051 is set in the maintenance soldering area where the first signal line 201 and the maintenance signal line 202 overlap, so as to reduce the electrical connection between the first metal layer 101 and the second metal layer 102 during the manufacturing process of the display substrate.

[0070] In one possible implementation, referring to Figures 6(a) and 6(b), the display substrate further includes a third metal layer;

[0071] The third metal layer is located between the first insulating layer 103 and the second insulating layer 104. The third metal layer includes an etching blocking structure 1051. The first orthographic projection of the first etching structure 1031 on the substrate 100 is located within the second orthographic projection of the etching blocking structure 1051 on the substrate 100.

[0072] Referring to Figure 6(a), the third metal layer is a gate metal layer, and the first metal layer 101 includes multiple gate signal lines. The first etched structure 1031 penetrates the first insulating layer 103 and is filled by the second metal layer 102, specifically by the first signal lines in the second metal layer 102. The second metal layer 102 and the third metal layer are electrically connected at the first etched structure 1031.

[0073] During repair soldering, referring to Figure 6(b), the laser penetrates the display substrate from the back (bottom of Figure 6(b)), melting the Gate metal of the first metal layer 101, then penetrating the second insulating layer 104, melting the first metal layer 101 and the third metal layer together to complete the repair soldering. The repair signal line of the first metal layer 101 is electrically connected to the first signal line of the second metal layer 102 through the third metal layer. After soldering, the repair signal line of the first metal layer 101 is used to supply power to the first signal line of the second metal layer 102, thereby realizing the repair of the product.

[0074] In the embodiments of this application, the display substrate can be LTPS or LTPO / LTPO+, and the display substrate can be a dual gate layer or a triple gate layer.

[0075] In one example, the display substrate is a three-gate-layer LTPS, and the first etched structure 1031 is a CNT via. The display substrate includes a first gate layer (Gate1), a second gate layer (Gate2), and a third gate layer (Gate3). A first metal layer 101 is the second gate layer (Gate2), and a third metal layer is the third gate layer (Gate3). The first etched structure 1031 penetrates the first insulating layer 103 and is filled by the second metal layer 102, specifically by the first signal line in the second metal layer 102. The second metal layer 102 and the third gate layer (Gate3) are electrically connected at the first etched structure 1031. During repair soldering, the laser melts the traces in the second gate layer (Gate2), penetrates the second insulating layer 104, and melts the traces in the second gate layer (Gate2) and the traces in the third gate layer (Gate3) together, completing the repair soldering. The repair signal line of the second gate layer (Gate2) is electrically connected to the first signal line of the second metal layer 102 through the trace in the third gate layer (Gate3).

[0076] In one example, the display substrate is a triple-gate LTPO / LTPO+, and the first etched structure 1031 is a CNTO via. The display substrate includes a first gate layer (Gate1), a second gate layer (Gate2), and a third gate layer (Gate3). A first metal layer 101 is the second gate layer (Gate2), and a third metal layer is the third gate layer (Gate3). The first etched structure 1031 penetrates the first insulating layer 103 and is filled by the second metal layer 102, specifically by the first signal line in the second metal layer 102. The second metal layer 102 and the third gate layer (Gate3) are electrically connected at the first etched structure 1031. During repair soldering, the laser melts the traces in the second gate layer (Gate2), penetrates the second insulating layer 104, and melts the traces in the second gate layer (Gate2) and the traces in the third gate layer (Gate3) together, completing the repair soldering. The repair signal line of the second gate layer (Gate2) is electrically connected to the first signal line of the second metal layer 102 through the trace in the third gate layer (Gate3).

[0077] In one example, the display substrate is a dual-gate layer LTPS, and the first etched structure 1031 is a CNT hole. The display substrate includes a first gate layer Gate1, a second gate layer Gate2, a first metal layer 101 which is the first gate layer Gate1, and a third metal layer which is the second gate layer Gate2. During repair soldering, the laser melts the traces in the first gate layer Gate1, penetrates the second insulating layer 104, and melts the traces in the first gate layer Gate1 and the traces in the second gate layer Gate2 together, completing the repair soldering. The repair signal line of the first gate layer Gate1 is electrically connected to the first signal line of the second metal layer 102 through the traces in the second gate layer Gate2.

[0078] The etching blocking structure 1051 blocks the first etching structure 1031, preventing the second insulating layer 104 from being etched away, thereby reducing the possibility of short circuits between the first metal layer 101 and the second metal layer 102 during the fabrication of the display substrate. Furthermore, in addition to preventing the second insulating layer 104 from being etched, the etching blocking structure 1051 also provides positioning for solder joints during repair. When repairing from the back, the solder joints can be located at the position of the etching blocking structure 1051, facilitating positioning.

[0079] Referring to Figure 6(c), the orthographic projection of the first etched structure 1031 on the substrate 100 is referred to as the first orthographic projection, and the orthographic projection of the etching blocking structure 1051 on the substrate 100 is referred to as the second orthographic projection. The first orthographic projection is located within the second orthographic projection. In one possible implementation, the area of ​​the second orthographic projection is larger than the area of ​​the first orthographic projection. The etching blocking structure 1051 blocks the first etched structure 1031. During the etching process to form the first etched structure 1031, the second insulating layer 104 will not be etched due to the obstruction of the etching blocking structure 1051, reducing the possibility of short circuits between the first metal layer 101 and the second metal layer 102 during the fabrication of the display substrate.

[0080] In one possible implementation, referring to Figures 7(a) and 7(b), the maintenance signal line includes a second etched structure 1011, and the third orthographic projection of the second etched structure 1011 on the substrate 100 is located within the second orthographic projection.

[0081] The orthographic projection of the second etched structure 1011 onto the substrate 100 is referred to as the third orthographic projection, which lies within the second orthographic projection. In one possible implementation, the third orthographic projection lies within the first orthographic projection. Referring to Figure 7(a), during the fabrication of the display substrate, the maintenance signal lines in the first metal layer 101 are etched using a CNT / CNTO Mask to form the second etched structure 1011, which is filled by the first source insulating layer 104. The second etched structure 1011 reduces the thickness of the first metal layer 101, making it easier for the laser to penetrate the second insulating layer 104 during maintenance. This increases the success rate of melting the maintenance signal lines in the first metal layer 101 with the traces in the third metal layer, thereby improving the success rate of maintenance soldering.

[0082] During repair soldering, referring to Figure 7(b), the laser penetrates the display substrate from the back (bottom of Figure 7(b)), melting the traces in the first metal layer 101, then penetrating the second insulating layer 104, melting the traces in the first metal layer 101 together with the traces in the third metal layer, thus completing the repair soldering. The repair signal line of the first metal layer 101 is electrically connected to the first signal line of the second metal layer 102 through the traces in the third metal layer. After soldering, the repair signal line of the first metal layer 101 is used to supply power to the first signal line of the second metal layer 102, thereby realizing the repair of the product.

[0083] When performing repairs from the back, the laser may hit the edge of the second etched structure 1011. If the third orthographic projection of the second etched structure 1011 on the substrate 100 is outside the second orthographic projection of the etch blocking structure 1051 on the substrate 100, when the laser hits the edge of the second etched structure 1011, it may not hit the etch blocking structure 1051 in the third metal layer. The traces in the first metal layer 101 and the traces in the third metal layer cannot be fused together, so the traces in the first metal layer 101 cannot be electrically connected to the traces in the second metal layer. It is also necessary to penetrate the first insulating layer 103 to melt the traces in the first metal layer 101 and the traces in the second metal layer 102. In this embodiment, the third orthographic projection of the second etched structure 1011 on the second insulating layer 104 is located within the second orthographic projection of the etch blocking structure 1051 on the substrate 100, as shown in FIG7(b). After the laser melts the first metal layer 101, it penetrates and fills the second insulating layer 104 within the second etched structure 1011, causing the first metal layer 101 and the third metal layer to melt together, thus completing the repair welding and improving the success rate of repair welding.

[0084] In one possible implementation, referring to Figures 8(a) and 8(b), the second etched structure 1011 extends through the maintenance signal line.

[0085] Referring to Figure 8(a), the second etched structure 1011 penetrates the maintenance signal line in the first metal layer 101. The first etched structure 1031 is filled by the second insulating layer 104. At the second etched structure 1011, the second insulating layer 104 and the third insulating layer 106 are connected. During repair soldering, referring to Figure 8(b), the laser enters the interior from the back of the display substrate (the bottom of Figure 8(b)). At the second etched structure 1011, the laser can directly penetrate the third insulating layer 106 and the second insulating layer 104, melting the maintenance signal line in the first metal layer 101 and the trace in the third metal layer together. The second etched structure 1011 further reduces the thickness that the laser needs to penetrate, improving the success rate of repair soldering. In addition, since the second etched structure 1011 penetrates the maintenance signal line, there is a significant difference between the second etched structure 1011 and the rest of the first metal layer 101 during back repair. This allows for more precise identification of the soldering point during laser soldering, further improving the success rate of repair soldering.

[0086] In one possible implementation, referring to Figures 4(a)-8(b), the display substrate further includes:

[0087] Third insulating layer 106, fourth insulating layer 107, passivation layer 108;

[0088] The third insulating layer 106 is located on the side of the first metal layer 101 closest to the substrate 100;

[0089] The fourth insulating layer 107 is located on the side of the third insulating layer 106 that is close to the substrate 100;

[0090] The passivation layer 108 is located on the side of the second metal layer 102 away from the substrate 100.

[0091] The third insulating layer 106 and the fourth insulating layer 107 are made of insulating materials, such as polyimide. The third insulating layer 106 is used to provide electrical isolation, protect the circuit of the first metal layer 101, and reduce short circuits. The fourth insulating layer 107 is used to protect the circuit, reduce short circuits, and at the same time isolate the signal line from external environmental pollution and damage.

[0092] In this embodiment of the invention, the passivation layer 108 is typically made of inorganic materials, such as amorphous or microcrystalline silicon dioxide, to protect the internal circuitry, block the entry of water and oxygen, prevent the signal lines from oxidizing, and protect the surface of the display substrate from physical damage such as impact and friction.

[0093] This application provides a display screen, including any of the display substrates described in this application.

[0094] See Figure 9 The display screen includes a display area and a non-display area. The non-display area includes a repair soldering point 301, a repair signal line 202, and a multiplexer MUX. The display area is connected to the pixel circuit and is used to display the image. The repair soldering point 301 is located on the display substrate. During repair soldering, a laser strikes the repair soldering point 301, causing the repair signal line 202 at the repair soldering point 301 to melt with the first signal line. Power is then supplied to the first signal line through the repair signal line 202, thereby achieving product repair.

[0095] A multiplexer (MUX) can receive multiple input signals and synthesize them into a single output signal in a recoverable manner from each input signal. A multiplexer is a complex system that typically contains a certain number of data inputs and a single output. A multiplexer (MUX) can select a signal from multiple analog or digital input signals and forward it, outputting different selected signals to the same output line.

[0096] Multiplexers (MUX) employ multiplexing techniques, which can include: TDM (Time Division Multiplexing, which interleaves different signals across different time periods and transmits them along the same channel; at the receiving end, the signals from each time period are extracted and restored to the original signal); FDM (Frequency Division Multiplexing, also known as frequency division multiplexing, which modulates multiple baseband signals onto different frequency carriers and then superimposes them to form a composite signal); CDM (Code Division Multiplexing, a communication multiplexing technique based on code orthogonality to achieve multiple signals sharing a channel; this technique distinguishes channels by assigning quasi-orthogonal address codes, allowing signals to overlap in frequency, time, and space; the system receiver uses the same address code for correlation detection to separate signals); or WDM (Optical Wavelength Division Multiplexing). Multiplexing, or wavelength division multiplexing, is a communication technology that transmits optical signals of different wavelengths in parallel through a single optical fiber. The transmitting end uses a multiplexer to combine the signals, and the receiving end uses a demultiplexer to separate them. The purpose of using multiplexers is to fully utilize the capacity of the communication channel and reduce the manufacturing cost of the display screen. Multiplexers allow multiple data streams to share a single channel. This sharing method is effective when the data streams on the multiplexed line are continuous. This is also more economical than using a separate communication line for each terminal. Multiplexers are usually used in pairs, one at each terminal and the other near the host. See [example example]. Figure 9 The display screen includes four multiplexers (MUX).

[0097] The screen provided in this application embodiment forms a first etched structure by etching the first insulating layer during the manufacturing process, which reduces the thickness of the first insulating layer, reduces the difficulty of subsequent repair and soldering when defects occur, improves the success rate of repair and soldering, and saves the manufacturing cost of the display substrate.

[0098] This application provides an electronic device, including the display screen described in this application embodiment.

[0099] The electronic devices provided in this application embodiment can be any product or component with display function, such as mobile phones, tablets, flexible display devices, televisions, and monitors, and are not specifically limited thereto.

[0100] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0101] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. The above descriptions are merely preferred embodiments of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A display substrate, characterized by, The display substrate comprises: a substrate, a first metal layer, a second metal layer, a first insulating layer, a second insulating layer; the first metal layer is located on one side of the substrate; the second insulating layer is located on a side of the first metal layer away from the substrate; the first insulating layer is located on a side of the second insulating layer away from the first metal layer; the second metal layer is located on a side of the first insulating layer away from the second insulating layer; the first metal layer comprises a plurality of repair signal lines, and the second metal layer comprises a plurality of first signal lines; the first insulating layer comprises a first etching structure, and the first etching structure is located between the repair signal lines and the first signal lines.

2. The display substrate of claim 1, wherein, The first etching structure penetrates the first insulating layer. 3.The display substrate of claim 2, wherein, The display substrate further comprises a third metal layer. The third metal layer is located between the first insulating layer and the second insulating layer, and the third metal layer comprises an etching blocking structure, and a first projection of the first etching structure on the substrate is located within a second projection of the etching blocking structure on the substrate.

4. The display substrate of claim 3, wherein, The area of the second projection is greater than the area of the first projection. 5.The display substrate of claim 3, wherein, The repair signal lines comprise a second etching structure, and a third projection of the second etching structure on the substrate is located within the second projection. 6.The display substrate of claim 5, wherein, The third projection is located within the first projection. 7.The display substrate of claim 5, wherein, The second etching structure penetrates the repair signal lines. 8.The display substrate of claim 1, wherein, The display substrate further comprises: a third insulating layer, a fourth insulating layer, and a passivation layer; the third insulating layer is located on a side of the first metal layer close to the substrate; the fourth insulating layer is located on a side of the third insulating layer close to the substrate; the passivation layer is located on a side of the second metal layer away from the substrate.

9. A display screen, characterized by The display substrate comprises any one of claims 1-8.

10. An electronic device, comprising: The display screen comprises claim 9.

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