A server risk control heat dissipation method and device, a terminal and a medium

Abstract

The application belongs to the technical field of server heat dissipation, and particularly relates to a server risk control heat dissipation method and device, a terminal and a medium. The method comprises the following steps: executing a first speed regulation strategy: acquiring a temperature parameter of a central processing unit, performing a differential calculation based on the temperature parameter, a preset target temperature and a preset fan duty cycle at a moment to obtain a first fan duty cycle; executing a second speed regulation strategy: acquiring an ambient temperature at a server air inlet, comparing the ambient temperature with a first speed regulation curve to obtain a second fan duty cycle; determining a high numerical value duty cycle between the first fan duty cycle and the second fan duty cycle, and determining the high numerical value duty cycle as a target fan duty cycle; and controlling the fan of the server to operate based on the target fan duty cycle. In this way, the PID closed-loop speed regulation strategy and the openloop open-loop speed regulation strategy are synchronously executed, the fan duty cycle with a higher numerical value is selected to control the fan to operate, and the purpose of flexibly controlling the rotating speed of the server fan is achieved.

Description

Technical Field

[0001] This invention relates to the field of server heat dissipation technology, and in particular to a server airflow control and heat dissipation method, device, terminal, and medium. Background Technology

[0002] With the rapid development of information technology, especially the widespread application of cloud computing, big data, and artificial intelligence, the computing demands on servers and data centers are increasing, leading to continuous improvements in hardware performance. However, along with performance enhancements, server heat dissipation has become increasingly prominent. Traditional air-cooling solutions are no longer sufficient to meet the heat dissipation requirements of high-performance computing devices under high load conditions, especially in high-density deployment environments within data centers. Heat dissipation issues can trigger hardware failures, reduce equipment efficiency, and even affect system reliability and security.

[0003] Current server cooling methods mainly include fixed fan speed strategy (i.e., controlling the fan to run at a fixed speed regardless of the temperature), simple temperature threshold control (i.e. controlling the fan to run or stop according to a certain temperature threshold), and linear fan speed control (linearly controlling the fan speed according to temperature changes). However, all of the above server cooling methods have the drawbacks of not being flexible enough in controlling the fan and having high energy consumption.

[0004] Therefore, how to flexibly control the fan speed to meet the overall heat dissipation needs of the server while reducing heat dissipation energy consumption is a problem that urgently needs to be solved in the field of server heat dissipation technology. Summary of the Invention

[0005] The main objective of this invention is to provide a server airflow control and heat dissipation method, device, terminal, and medium. The aim is to achieve flexible control of the server fan speed by simultaneously executing a PID closed-loop speed control strategy and an open-loop speed control strategy, calculating the duty cycle of the two types of fans respectively, and selecting the fan duty cycle with the higher value to control the fan operation.

[0006] According to one aspect of the embodiments of this application, a server heat dissipation and ventilation method is disclosed, including:

[0007] Step S1: Execute the first speed regulation strategy: Obtain the temperature parameters of the central processing unit, and perform differential calculation based on the temperature parameters, the preset target temperature and the fan duty cycle at the preset time to obtain the first fan duty cycle;

[0008] Step S2: Execute the second speed regulation strategy: Obtain the ambient temperature at the server air intake, compare the ambient temperature with the first speed regulation curve, and obtain the second fan duty cycle corresponding to the ambient temperature;

[0009] Step S3: Determine the higher duty cycle between the first fan duty cycle and the second fan duty cycle, and set the higher duty cycle as the target fan duty cycle;

[0010] Step S4: Control the operation of the server's fan based on the target fan duty cycle.

[0011] In some embodiments of this application, based on the above technical solutions, the fan duty cycle at the preset time includes the fan duty cycle at the previous sampling time. Step S1, which involves performing differential calculations based on the temperature parameter, the preset target temperature, and the fan duty cycle at the preset time to obtain the first fan duty cycle, includes:

[0012] Step S1.1: Calculate the first temperature difference between the temperature parameter and the preset target temperature;

[0013] Step S1.2: Compare the temperature difference with the first preset temperature difference. If the temperature difference is greater than the first preset temperature difference, perform differential calculation based on the temperature parameter, the preset target temperature, and the fan duty cycle at the last sampling time to obtain the first fan duty cycle. If the temperature difference is less than or equal to the first preset temperature difference, determine the fan duty cycle at the last sampling time as the first fan duty cycle.

[0014] In some embodiments of this application, based on the above technical solutions, the preset target temperature includes a first target temperature and a second target temperature, wherein the first target temperature is higher than the second target temperature. Before obtaining the temperature parameters of the central processing unit in step S1, the method further includes:

[0015] Step S1.3: Obtain the current fan mode of the server, including normal mode and silent mode;

[0016] Step S1.4: If the fan mode is normal mode, then the second target temperature is applied to the so-called differential calculation to obtain the first fan duty cycle; if the fan mode is silent mode, then the first target temperature is applied to the so-called differential calculation to obtain the first fan duty cycle.

[0017] In some embodiments of this application, based on the above technical solutions, step S1 includes:

[0018] Step S1.5: Execute the first speed regulation strategy: obtain the temperature parameters of each preset component of the central processing unit;

[0019] Step S1.6: Determine the preset target temperature corresponding to each preset device based on the temperature parameters of each preset device;

[0020] Step S1.7: Perform differential calculation based on the temperature parameter, the preset target temperature, and the fan duty cycle at the preset time to obtain the device fan duty cycle corresponding to each preset device;

[0021] Step S1.8: Based on the highest value of the duty cycle of the device fan corresponding to each preset device, determine it as the first fan duty cycle.

[0022] In some embodiments of this application, based on the above technical solutions, after obtaining the ambient temperature at the server air inlet in step S2, the method further includes:

[0023] Step S2.1: If it fails to obtain the ambient temperature at the server air intake, then obtain the air intake temperature of the backup temperature sensor motherboard.

[0024] Step S2.2: Compare the inlet air temperature with the second speed regulation curve to obtain the second fan duty cycle corresponding to the inlet air temperature.

[0025] In some embodiments of this application, based on the above technical solutions, step S2, comparing the ambient temperature with the first speed regulation curve to obtain the second fan duty cycle corresponding to the ambient temperature, includes:

[0026] Step S2.3: Calculate the second temperature difference between the ambient temperature and the ambient temperature at the time of the previous sampling.

[0027] Step S2.4: Compare the second temperature difference with the second preset temperature difference. If the second temperature difference is greater than the second preset temperature difference, compare the ambient temperature with the first speed regulation curve to obtain the second fan duty cycle corresponding to the ambient temperature. If the second temperature difference is less than or equal to the second preset temperature difference, determine the current fan duty cycle as the second fan duty cycle.

[0028] In some embodiments of this application, based on the above technical solutions, before step S1, the method further includes:

[0029] Step S5: Execute the third speed control strategy: Based on the preset device heat dissipation status, fan operation status and baseboard management controller operation status of the server, determine whether the server is in an abnormal heat dissipation state; if the server is in an abnormal heat dissipation state, control the fan to run at full speed.

[0030] According to another aspect of the embodiments of this application, a server airflow control and heat dissipation device is provided, the server airflow control and heat dissipation device comprising:

[0031] The first speed control module is configured to execute a first speed control strategy: obtain the temperature parameters of the central processing unit, and perform differential calculations based on the temperature parameters, a preset target temperature, and the fan duty cycle at a preset time to obtain the first fan duty cycle;

[0032] The second speed control module is configured to execute a second speed control strategy: obtain the ambient temperature at the server air inlet, compare the ambient temperature with the first speed control curve, and obtain the second fan duty cycle corresponding to the ambient temperature.

[0033] The fan duty cycle determination module is configured to determine a higher duty cycle between the first fan duty cycle and the second fan duty cycle, and to determine the higher duty cycle as the target fan duty cycle;

[0034] The fan control module is configured to control the operation of the server's fans based on the target fan duty cycle.

[0035] According to another aspect of the embodiments of this application, an electronic device is provided, the electronic device comprising: a memory, a processor, and a server heat dissipation program stored in the memory and executable on the processor, wherein when the server heat dissipation program is executed by the processor, it implements the server heat dissipation method as described above.

[0036] According to another aspect of the embodiments of this application, a storage medium is provided, wherein a computer program is stored on the storage medium, and when the computer program is executed by a processor, it implements the server heat dissipation method as described above.

[0037] The server airflow control and heat dissipation method provided in this application can simultaneously execute a PID closed-loop speed control strategy and an open-loop speed control strategy, respectively calculating two fan duty cycles. The PID closed-loop speed control strategy calculates a first fan duty cycle based on the CPU temperature parameters, a preset target temperature, and the fan duty cycle at a preset time, achieving fine control of the fan duty cycle. The open-loop speed control strategy acquires the ambient temperature at the server's air intake, compares this ambient temperature with the first speed control curve, and obtains a second fan duty cycle corresponding to the ambient temperature. This allows for timely adjustment of the fan duty cycle based on the external ambient temperature, meeting the overall heat dissipation requirements of the server. Finally, the higher fan duty cycle between the first and second fan duty cycles is selected to control fan operation, thereby achieving flexible control of the server fan speed.

[0038] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0039] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0040] Figure 1 A flowchart illustrating the steps of a server heat dissipation method in one embodiment of this application is shown.

[0041] Figure 2 A schematic diagram illustrating the application of a first speed regulation strategy in one embodiment of this application is shown.

[0042] Figure 3 A schematic diagram illustrating the application of the second speed regulation strategy in one embodiment of this application is shown.

[0043] Figure 4 A schematic diagram illustrating the application of the first speed regulation curve and the second speed regulation curve in one embodiment of this application is shown.

[0044] Figure 5 A schematic diagram illustrating the application of the third speed regulation strategy in one embodiment of this application is shown.

[0045] Figure 6 A schematic diagram of the server heat dissipation device in one embodiment of this application is shown. Detailed Implementation

[0046] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0047] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0048] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0049] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be broken down, while others can be combined or partially combined; therefore, the actual execution order may change depending on the specific circumstances.

[0050] The following detailed description of the server heat dissipation method, device, terminal, and medium provided in this application, in conjunction with specific implementation methods, provides a detailed explanation of these technical solutions.

[0051] Figure 1 A flowchart illustrating the steps of a server heat dissipation method according to one embodiment of this application is shown, as follows: Figure 1 As shown, the server's heat dissipation method mainly includes the following steps S1 to S4.

[0052] Step S1: Execute the first speed regulation strategy: Obtain the temperature parameters of the central processing unit, and perform differential calculation based on the temperature parameters, the preset target temperature and the fan duty cycle at the preset time to obtain the first fan duty cycle;

[0053] Step S2: Execute the second speed regulation strategy: Obtain the ambient temperature at the server air intake, compare the ambient temperature with the first speed regulation curve, and obtain the second fan duty cycle corresponding to the ambient temperature;

[0054] Step S3: Determine the higher duty cycle between the first fan duty cycle and the second fan duty cycle, and set the higher duty cycle as the target fan duty cycle;

[0055] Step S4: Control the operation of the server's fan based on the target fan duty cycle.

[0056] The server airflow control and heat dissipation method provided in this application can simultaneously execute a PID closed-loop speed control strategy and an open-loop speed control strategy, respectively calculating two fan duty cycles. The PID closed-loop speed control strategy calculates a first fan duty cycle based on the CPU temperature parameters, a preset target temperature, and the fan duty cycle at a preset time, achieving fine control of the fan duty cycle. The open-loop speed control strategy acquires the ambient temperature at the server's air intake, compares this ambient temperature with the first speed control curve, and obtains a second fan duty cycle corresponding to the ambient temperature. This allows for timely adjustment of the fan duty cycle based on the external ambient temperature, meeting the overall heat dissipation requirements of the server. Finally, the higher fan duty cycle between the first and second fan duty cycles is selected to control fan operation, thereby achieving flexible control of the server fan speed.

[0057] The following sections provide a detailed explanation of each step in the server heat dissipation and ventilation method.

[0058] Step S1, execute the first speed regulation strategy: obtain the temperature parameters of the central processing unit, and perform differential calculation based on the temperature parameters, the preset target temperature and the fan duty cycle at the preset time to obtain the first fan duty cycle.

[0059] Specifically, the first speed regulation strategy is a closed-loop feedback control strategy, preferably employing an incremental PID algorithm. The system collects the temperature parameter T(n) of the central processing unit in real time through a temperature sensor. The preset target temperature (Set Point, SP) is the desired temperature value set according to the server's heat dissipation target. The fan duty cycle at the preset time refers, for example, to the fan duty cycle pwm(n-1) calculated in the previous control cycle. Based on these parameters, differential calculations are performed using an incremental PID algorithm, with the specific differential calculation formula being:

[0060] pwm(n) = pwm(n-1) + Δpwm(n)

[0061] =pwm(n-1) +Kp*[e(n)-e(n-1)]+Ki*[T(n)-SP]+Kd*[e(n)+e(n-2)-2*e(n-1)]

[0062] =pwm(n-1) +Kp*[T(n)-T(n-1)]+Ki*[T(n)-SP]+Kd*[T(n)+T(n-2)-2*T(n-1)]

[0063] Formula explanation:

[0064] ① “pwm(n)” represents the fan PWM value at time n;

[0065] ② “n” represents time, “n-1” represents the time of the last sampling, and “n-2” represents the time of the two previous samplings;

[0066] ③ "△pwm(n)" represents the sum of the PID calculations in the previous round;

[0067] ④ “Kp” represents the proportionality coefficient;

[0068] ⑤ “Ki” integral coefficient;

[0069] ⑥ "kd" is the differential coefficient;

[0070] ⑦ “e(n)” represents the temperature difference between the sensor reading and the set value at time n;

[0071] ⑧ “T(n)” represents the sensor reading at time n;

[0072] ⑨ “SP” stands for Set point, CPU control target.

[0073] Step S2, execute the second speed regulation strategy: obtain the ambient temperature at the server air inlet, compare the ambient temperature with the first speed regulation curve, and obtain the second fan duty cycle corresponding to the ambient temperature.

[0074] Specifically, the second speed control strategy is an open-loop feedforward control strategy based on the ambient temperature (InletTemp) at the server's air intake. The system has a preset first speed control curve that defines the recommended base fan duty cycle for different ambient temperature ranges. For example, a lower duty cycle corresponds to a lower ambient temperature, and a higher duty cycle corresponds to a higher ambient temperature. By reading the current ambient temperature sensor value (InletTemp) and comparing it with the first speed control curve, a second fan duty cycle can be directly mapped. This strategy can pre-adjust the fan speed according to external cooling conditions, providing basic heat dissipation assurance for the server.

[0075] Step S3: Determine a higher duty cycle between the first fan duty cycle and the second fan duty cycle, and set the higher duty cycle as the target fan duty cycle.

[0076] Specifically, to ensure sufficient heat dissipation under all circumstances, the system employs a "higher value principle" to synthesize the final control command. That is, the first fan duty cycle calculated in step S1 (based on CPU temperature) is compared with the second fan duty cycle obtained in step S2 (based on ambient temperature), and the higher value is selected as the final target fan duty cycle. This ensures that the fan can respond quickly and accelerate when the CPU load surges, and also ensures that the fan speed can be increased in advance when the ambient temperature is too high, achieving optimized heat dissipation with dual protection.

[0077] Step S4: Control the operation of the server's fan based on the target fan duty cycle.

[0078] Specifically, after determining the target fan duty cycle, the system's control unit (such as BMC or CPLD) generates a PWM signal with the corresponding duty cycle and outputs it to the server fan through the corresponding drive circuit, thereby controlling the fan to run at the target speed and achieving precise air cooling for the server system.

[0079] Furthermore, based on the above embodiments, the fan duty cycle at the preset time includes the fan duty cycle at the previous sampling time. Step S1, which performs differential calculation based on the temperature parameter, the preset target temperature, and the fan duty cycle at the preset time to obtain the first fan duty cycle, includes the following steps S1.1 and S1.2.

[0080] Step S1.1: Calculate the first temperature difference between the temperature parameter and the preset target temperature;

[0081] Step S1.2: Compare the temperature difference with the first preset temperature difference. If the temperature difference is greater than the first preset temperature difference, perform differential calculation based on the temperature parameter, the preset target temperature, and the fan duty cycle at the last sampling time to obtain the first fan duty cycle. If the temperature difference is less than or equal to the first preset temperature difference, determine the fan duty cycle at the last sampling time as the first fan duty cycle.

[0082] Specifically, to improve the stability of fan control and avoid frequent speed adjustments (i.e., "fan surge") caused by small temperature fluctuations near the target temperature, this embodiment introduces a "dead-zone control" mechanism. The first preset temperature difference can be set to 1℃. The system first calculates the absolute value of the difference e(n) between the current CPU temperature T(n) and the preset target temperature SP. If |e(n)| > 1℃, it indicates that the temperature deviates significantly from the target value, and the PID algorithm needs to be activated for adjustment. At this time, a complete incremental PID calculation is performed to obtain a new first fan duty cycle. If |e(n)| ≤ 1℃, it indicates that the temperature is within an acceptable stable range. To ensure system stability and extend fan life, the fan speed remains unchanged, that is, the first fan duty cycle uses the value pwm(n-1) from the previous control cycle. This dead-zone control effectively smooths the fan control action.

[0083] Furthermore, based on the above embodiments, the preset target temperature includes a first target temperature and a second target temperature, wherein the first target temperature is higher than the second target temperature. Before obtaining the temperature parameters of the central processing unit in step S1, the method further includes the following steps S1.3 and S1.4.

[0084] Step S1.3: Obtain the current fan mode of the server, including normal mode and silent mode;

[0085] Step S1.4: If the fan mode is normal mode, then the second target temperature is applied to the so-called differential calculation to obtain the first fan duty cycle; if the fan mode is silent mode, then the first target temperature is applied to the so-called differential calculation to obtain the first fan duty cycle.

[0086] Figure 2 A schematic diagram illustrating the application of the first speed regulation strategy is shown. Specifically, to meet the differentiated requirements for noise and heat dissipation in different scenarios, this embodiment provides a dual-target temperature switching mechanism. The system presets two target temperatures: a higher first target temperature (e.g., applicable to silent mode) and a lower second target temperature (e.g., applicable to normal mode). Before executing the first speed regulation strategy, the system first determines the currently active fan operating mode. If it is "silent mode," the preset target temperature SP in the PID calculation adopts the higher first target temperature, which allows the CPU to operate at a relatively higher temperature, thereby reducing the requirement for fan speed and achieving noise reduction. If it is "normal mode" or other non-silent mode, SP adopts the lower second target temperature to ensure that heat dissipation efficiency is prioritized, keeping the CPU temperature at a lower level. By dynamically switching the target temperature, a flexible trade-off between performance and quietness is achieved.

[0087] In other implementations, the fan modes also include a full-speed mode and a manual mode. The full-speed mode controls the fan to run at full speed, while the manual mode determines the fan speed based on manually input commands.

[0088] Furthermore, based on the above embodiments, step S1 includes the following steps S1.5 to S1.8.

[0089] Step S1.5: Execute the first speed regulation strategy: obtain the temperature parameters of each preset component of the central processing unit;

[0090] Step S1.6: Determine the preset target temperature corresponding to each preset device based on the temperature parameters of each preset device;

[0091] Step S1.7: Perform differential calculation based on the temperature parameter, the preset target temperature, and the fan duty cycle at the preset time to obtain the device fan duty cycle corresponding to each preset device;

[0092] Step S1.8: Based on the highest value of the duty cycle of the device fan corresponding to each preset device, determine it as the first fan duty cycle.

[0093] Specifically, such as Figure 2As shown, the server's heat dissipation requirements come not only from the CPU but also from multiple key components such as memory, hard drive, and motherboard chipset. This embodiment extends the first speed regulation strategy to multi-point temperature monitoring and collaborative control at the system-wide level. The system simultaneously acquires the temperature parameters of multiple preset key components such as the CPU, memory, and hard drive. For each component, an independent preset target temperature (SP_CPU, SP_Memory, etc.) can be set. Then, for each component's current temperature T_i(n) and its corresponding target temperature SP_i, the aforementioned incremental PID calculation (including dead-zone control) is executed independently to calculate a "suggested" component fan duty cycle pwm_i(n) for cooling that component. Finally, the system selects the largest value among all calculated component fan duty cycles as the final first fan duty cycle. This principle of "taking the demand of the hottest component" ensures that all key components of the entire system receive sufficient heat dissipation.

[0094] Furthermore, based on the above embodiments, after obtaining the ambient temperature at the server air inlet in step S2, the method further includes the following steps S2.1 and S2.2.

[0095] Step S2.1: If it fails to obtain the ambient temperature at the server air intake, then obtain the air intake temperature of the backup temperature sensor motherboard.

[0096] Step S2.2: Compare the inlet air temperature with the second speed regulation curve to obtain the second fan duty cycle corresponding to the inlet air temperature.

[0097] Figure 3 A schematic diagram illustrating the application of the second speed control strategy is shown. Specifically, to improve the robustness and fault tolerance of the system, this embodiment provides a backup mechanism for ambient temperature monitoring. Under normal circumstances, the second speed control strategy uses a dedicated inlet temperature sensor, InletTemp. When the system detects that the main sensor has failed, has abnormal readings, or cannot be read (e.g., sensor failure or communication interruption), the backup plan is automatically activated: the reading of another available temperature sensor from the server motherboard is obtained as the inlet temperature reference. Simultaneously, the system switches the query strategy from the "first speed control curve" to a preset, more conservative "second speed control curve" (i.e., the abnormal speed control curve). This abnormal speed control curve is typically set to be more aggressive than the normal curve (i.e., a higher duty cycle at the same temperature) to ensure that the fan can still provide sufficient conservative heat dissipation capacity in the event of sensor malfunction, preventing the system from overheating due to the failure of ambient temperature sensing.

[0098] Figure 4 The diagram shows the application of the "first speed regulation curve" (normal ambient temperature speed regulation curve) and the "second speed regulation curve" (abnormal ambient temperature speed regulation curve).

[0099] Furthermore, based on the above embodiments, step S2, which compares the ambient temperature with the first speed regulation curve to obtain the second fan duty cycle corresponding to the ambient temperature, includes the following steps S2.3 and S2.4.

[0100] Step S2.3: Calculate the second temperature difference between the ambient temperature and the ambient temperature at the time of the previous sampling.

[0101] Step S2.4: Compare the second temperature difference with the second preset temperature difference. If the second temperature difference is greater than the second preset temperature difference, compare the ambient temperature with the first speed regulation curve to obtain the second fan duty cycle corresponding to the ambient temperature. If the second temperature difference is less than or equal to the second preset temperature difference, determine the current fan duty cycle as the second fan duty cycle.

[0102] Specifically, to avoid frequent adjustments in fan speed due to small, instantaneous fluctuations in ambient temperature (such as airflow disturbances), this embodiment introduces a "hysteresis control" mechanism for the second speed control strategy. The second preset temperature difference can be set to 2℃. Before the system queries the first speed control curve based on the current ambient temperature InletTemp(n) to obtain a new candidate value for the second fan duty cycle, it first calculates the absolute value of the difference between the current ambient temperature and the ambient temperature InletTemp(n-1) at the previous sampling time. If this difference is ≥ 2℃, it indicates that the ambient temperature has changed significantly, and it is necessary to adjust the fan speed to adapt to the new heat dissipation conditions. Only then is the second fan duty cycle updated to the new value queried from the curve. If the difference is < 2℃, it is considered that the ambient temperature change is within the normal fluctuation range. To maintain the stability of fan control, the second fan duty cycle will remain unchanged, using the current value. This hysteresis control significantly improves the stability of open-loop control.

[0103] Furthermore, based on the above embodiments, before step S1, the method further includes the following step S5.

[0104] Step S5: Execute the third speed control strategy: Based on the preset device heat dissipation status, fan operation status and baseboard management controller operation status of the server, determine whether the server is in an abnormal heat dissipation state; if the server is in an abnormal heat dissipation state, control the fan to run at full speed.

[0105] Specifically, the third speed control strategy is the highest priority safety protection mechanism in this solution, designed to handle various sudden abnormal situations and ensure hardware safety. The abnormal heat dissipation states include, but are not limited to:

[0106] If the temperature of any critical component (CPU, memory, etc.) reaches or exceeds the preset emergency threshold (critical value);

[0107] A single rotor failure was detected in the fan, and for dual-rotor fans, the number of failed rotors exceeded the safety limit;

[0108] More than the specified number of fans were detected to be missing.

[0109] The baseboard management controller itself malfunctions, such as during an upgrade, restart, or complete shutdown.

[0110] The system continuously monitors the above states. Once any abnormal condition is detected, the normal PID and OpenLoop speed control process is immediately interrupted, and a 100% duty cycle PWM signal is forcibly sent to all controllable fans, causing them to run at full speed to provide maximum emergency cooling capacity and prevent equipment damage due to overheating. Specifically, in the event of a BMC failure, the CPLD, equipped with an independent watchdog circuit, detects the BMC's lack of response and automatically takes over fan control, executing the full-speed fan command, achieving seamless and safe takeover of control.

[0111] Figure 5 A schematic diagram illustrating the application of the third speed control strategy is shown. For example... Figure 5 As shown, if a critical component (CPU, memory, etc.) reaches the severe heat dissipation level 5 times, or the number of patent failures for a single-blade fan is greater than or equal to 2, or the number of fans not in place is greater than or equal to 1, or the BMC (Baseboard Management Controller) fails, the fan will be controlled to run at full speed to ensure that the overall heat dissipation requirements of the server are met.

[0112] According to another aspect of the embodiments of this application, a server airflow control and heat dissipation device is provided, the server airflow control and heat dissipation device comprising:

[0113] The first speed control module 100 is configured to execute a first speed control strategy: obtain the temperature parameters of the central processing unit, and perform differential calculations based on the temperature parameters, a preset target temperature, and the fan duty cycle at a preset time to obtain the first fan duty cycle;

[0114] The second speed control module 200 is configured to execute a second speed control strategy: obtain the ambient temperature at the server air inlet, compare the ambient temperature with the first speed control curve, and obtain the second fan duty cycle corresponding to the ambient temperature.

[0115] The fan duty cycle determination module 300 is configured to determine a high value duty cycle between the first fan duty cycle and the second fan duty cycle, and to determine the high value duty cycle as the target fan duty cycle;

[0116] The fan control module 400 is configured to control the operation of the server's fan based on the target fan duty cycle.

[0117] According to another aspect of the embodiments of this application, an electronic device is provided, the electronic device comprising: a memory, a processor, and a server heat dissipation program stored in the memory and executable on the processor, wherein when the server heat dissipation program is executed by the processor, it implements the server heat dissipation method as described above.

[0118] According to another aspect of the embodiments of this application, a storage medium is provided, wherein a computer program is stored on the storage medium, and when the computer program is executed by a processor, it implements the server heat dissipation method as described above.

[0119] Specifically, according to embodiments of this application, the processes described in the various method flowcharts can be implemented as computer software programs. For example, embodiments of this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network, and / or installed from a removable medium. When the computer program is executed by a central processing unit, it performs various functions defined in the system of this application.

[0120] It should be noted that the computer-readable medium shown in the embodiments of this application can be a computer-readable signal medium or a computer-readable storage medium, or any combination of the two. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), flash memory, optical fiber, portable compact disc read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this application, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. In this application, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such transmitted data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. The computer-readable signal medium can also be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to wireless, wired, etc., or any suitable combination thereof.

[0121] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram or flowchart, and combinations of blocks in a block diagram or flowchart, may be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0122] It should be noted that although several modules or units for the device used to perform actions have been mentioned in the detailed description above, this division is not mandatory. In fact, according to the embodiments of this application, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0123] Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of this application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, USB flash drive, external hard drive, etc.) or on a network, including several instructions to cause a computing device (such as a personal computer, server, touch terminal, or network device, etc.) to execute the methods according to the embodiments of this application.

[0124] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein.

[0125] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A server risk control heat dissipation method, characterized in that, The method comprises: Step S1: performing a first speed regulation strategy: obtaining a temperature parameter of a central processor, performing differential calculation based on the temperature parameter, a preset target temperature and a fan duty ratio at a preset time to obtain a first fan duty ratio; Step S2: performing a second speed regulation strategy: obtaining an ambient temperature at an air inlet of the server, comparing the ambient temperature with a first speed regulation curve to obtain a second fan duty ratio corresponding to the ambient temperature; Step S3: determining a high value duty ratio between the first fan duty ratio and the second fan duty ratio, and determining the high value duty ratio as a target fan duty ratio; Step S4: controlling the fan of the server to operate based on the target fan duty ratio; Wherein, the fan duty ratio at the preset time comprises a fan duty ratio at a last sampling time, and the step S1 of performing differential calculation based on the temperature parameter, the preset target temperature and the fan duty ratio at the preset time to obtain the first fan duty ratio comprises: Step S1.1: calculating a first temperature difference between the temperature parameter and the preset target temperature; Step S1.2: comparing the temperature difference with a first preset temperature difference, if the temperature difference is greater than the first preset temperature difference, performing differential calculation based on the temperature parameter, the preset target temperature and the fan duty ratio at the last sampling time to obtain the first fan duty ratio; if the temperature difference is less than or equal to the first preset temperature difference, determining the fan duty ratio at the last sampling time as the first fan duty ratio; Wherein, the step S1 further comprises: Step S1.5: performing a first speed regulation strategy: obtaining a temperature parameter of each preset device of the central processor; Step S1.6: determining a preset target temperature corresponding to each preset device based on the temperature parameter of each preset device; Step S1.7: performing differential calculation based on the temperature parameter, the preset target temperature and the fan duty ratio at the preset time to obtain a device fan duty ratio corresponding to each preset device; Step S1.8: determining the first fan duty ratio by taking the highest value of the device fan duty ratios corresponding to each preset device.

2. The method of claim 1, wherein, The preset target temperature comprises a first target temperature and a second target temperature, the first target temperature is higher than the second target temperature, and before the step S1 of obtaining the temperature parameter of the central processor, the method further comprises: Step S1.3: obtaining a current fan mode of the server, the fan mode comprising a regular mode and a silent mode; Step S1.4: if the fan mode is the regular mode, applying the second target temperature to the differential calculation to obtain the first fan duty ratio; if the fan mode is the silent mode, applying the first target temperature to the differential calculation to obtain the first fan duty ratio.

3. The method of claim 1, wherein, After the step S2 of obtaining the ambient temperature at the air inlet of the server, the method further comprises: Step S2.1: if the ambient temperature at the air inlet of the server fails to be obtained, obtaining an air inlet temperature of a backup temperature sensor mainboard; Step S2.2: comparing the air inlet temperature with the second speed regulation curve to obtain a second fan duty cycle corresponding to the air inlet temperature.

4. The method of claim 1, wherein, The step S2 of comparing the ambient temperature with the first speed regulation curve to obtain a second fan duty cycle corresponding to the ambient temperature comprises: Step S2.3: calculating a second temperature difference between the ambient temperature and the ambient temperature at the last sampling time; Step S2.4: comparing the second temperature difference with a second preset temperature difference, if the second temperature difference is greater than the second preset temperature difference, comparing the ambient temperature with the first speed regulation curve to obtain a second fan duty cycle corresponding to the ambient temperature; if the second temperature difference is less than or equal to the second preset temperature difference, determining the current fan duty cycle as the second fan duty cycle.

5. The method of claim 1, wherein, Before step S1, the method further comprises: Step S5: executing a third speed regulation strategy: judging whether the server is in an abnormal heat dissipation state based on a preset device heat dissipation state of the server, a fan running state and an operation state of a baseboard management controller; if the server is in the abnormal heat dissipation state, controlling the fan to run at full speed.

6. A server risk control heat dissipation device, characterized in that, The server heat control and dissipation device is configured to implement the server heat control and dissipation method according to any one of claims 1 to 5, and comprises: A first speed regulation module configured to execute a first speed regulation strategy: obtaining a temperature parameter of a central processing unit, performing a differential calculation based on the temperature parameter, a preset target temperature and a fan duty cycle at a preset time to obtain a first fan duty cycle; A second speed regulation module configured to execute a second speed regulation strategy: obtaining an ambient temperature at an air inlet of the server, comparing the ambient temperature with a first speed regulation curve to obtain a second fan duty cycle corresponding to the ambient temperature; A fan duty cycle determination module configured to determine a high value duty cycle between the first fan duty cycle and the second fan duty cycle, and determine the high value duty cycle as a target fan duty cycle; A fan control module configured to control the fan of the server to run based on the target fan duty cycle.

7. An electronic device, comprising: The electronic device comprises a memory, a processor and a server heat control and dissipation program stored on the memory and executable on the processor, and the server heat control and dissipation program is executed by the processor to implement the server heat control and dissipation method according to any one of claims 1 to 5.

8. A storage medium, characterized by The storage medium has a computer program stored thereon, and the computer program is executed by the processor to implement the server heat control and dissipation method according to any one of claims 1 to 5.

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