Installation method of copper pin of water-cooling disc assembly for semiconductor

Abstract

The invention belongs to the technical field of precision mechanical assembly, and particularly discloses a method for installing copper pins of a water-cooling disc assembly for semiconductors, and the method comprises the following steps: carrying out pretreatment on matrix holes in the water-cooling disc assembly for semiconductors; interference detection is conducted on the copper pin to be installed and the pretreated base body hole; the copper pin and the base body hole which are qualified through interference detection are installed in a guiding mode; the copper pin and the base body hole which are installed in a guiding mode are pressed and fixed; and carrying out in-place detection on the copper pin and the base body hole which are pressed and fixed. According to the invention, the heat conduction, electric conduction and long-term service stability of the semiconductor water-cooling disc assembly can be improved.

Description

Technical Field

[0001] This application belongs to the field of precision mechanical assembly technology, specifically relating to a method for installing copper pins in a semiconductor water-cooled plate assembly. Background Technology

[0002] Copper pins are widely used as positioning and connecting components in mechanical assembly due to their excellent electrical and thermal conductivity and ductility. However, their excellent ductility makes them prone to two types of problems during traditional press-fit installation if the interference fit is not properly controlled: firstly, excessive interference fit leads to installation difficulties or pin deformation; secondly, insufficient interference fit leads to loose connections. Both of these problems severely affect the final installation quality and the thermal and electrical conductivity of the semiconductor water-cooled plate assembly.

[0003] Therefore, there is an urgent need for a copper pin installation method that can achieve precise control and efficient operation, thereby ensuring installation quality. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this application is to provide a method for installing copper pins of semiconductor water cooling plate assembly. This application aims to improve the various performance characteristics of semiconductor water cooling plate assembly by improving the installation quality of copper pins.

[0005] To achieve the above objectives, this application provides the following technical solution: A method for installing copper pins in a semiconductor water cooling pan assembly, the method comprising: pre-treating a base hole on the semiconductor water cooling pan assembly; performing an interference test on the copper pin to be installed and the pre-treated base hole; guiding the copper pin and base hole that have passed the interference test for installation; pressing and fixing the guided copper pin and base hole; and performing a positioning test on the pressed and fixed copper pin and base hole.

[0006] Optionally, the pretreatment of the substrate holes on the semiconductor water cooling plate assembly includes: cleaning the substrate holes; activating the cleaned substrate holes; depositing a solid lubricating film on the inner wall of the activated substrate holes; and performing a finishing process on the substrate holes with the deposited solid lubricating film.

[0007] Optionally, the finishing process of the substrate pores deposited with a solid lubricating film includes: introducing a diamond micro-abrasive head into the substrate pore and moving it back and forth at a constant speed along the pore axis within the substrate pore; controlling the abrasive head to pause briefly in the pore opening region of the substrate pore to form a uniform and minute rounded transition at the pore opening edge; and purging the substrate pores.

[0008] Optionally, the interference detection on the copper pin to be installed and the pretreated base body hole comprises: zero calibration on the gas-electric micrometer; measuring the diameter of the pretreated base body hole based on the zero-calibrated gas-electric micrometer; measuring the diameter of the copper pin to be installed; pre-checking the contact resistance of the copper pin and the base body hole; determining whether the interference detection of the copper pin to be installed and the pretreated base body hole is qualified based on the diameter of the base body hole, the diameter of the copper pin and the contact resistance.

[0009] Optionally, the determination of whether the interference detection of the copper pin to be installed and the pretreated base body hole is qualified based on the diameter of the base body hole, the diameter of the copper pin and the contact resistance comprises: calculating the actual interference amount of the copper pin to be installed and the pretreated base body hole; if the actual interference amount meets the preset range and the contact resistance is lower than the maximum allowable threshold, the interference detection of the copper pin to be installed and the pretreated base body hole is qualified.

[0010] Optionally, the guided installation of the copper pin and the base body hole that pass the interference detection comprises: pre-alignment of the copper pin and the base body hole; and guiding the pre-aligned copper pin and base body hole.

[0011] Optionally, the pre-alignment of the copper pin and the base body hole comprises: arranging a magnetic fluid guide ring at the base body hole opening, and pre-aligning the copper pin and the base body hole based on the magnetic fluid guide ring.

[0012] Optionally, the guiding of the pre-aligned copper pin and base body hole comprises: guiding the pre-aligned copper pin and base body hole by constant pressure.

[0013] Optionally, the pressure assembly and fixation of the guided copper pin and base body hole comprises: constant-speed pressure insertion and pressure curing of the copper pin that has completed the guided installation; and cleaning of the base body hole after the installation is completed.

[0014] Optionally, the in-place detection of the pressure assembly and fixed copper pin and base body hole comprises: laser scanning of the pressure assembly and fixed copper pin; and quality evaluation of the interface contact between the copper pin and the base body hole.

[0015] Compared with the prior art, the application has the following beneficial effects: This application systematically solves the core challenges of cleanliness, matching accuracy, stress control, and reliability verification faced by copper pins in the precision assembly of semiconductor water-cooled pans by integrating pretreatment processes such as supercritical cleaning, plasma activation, and solid lubricant film deposition, combined with dynamic interference detection based on gas electro-electric micrometry and laser scanning, adaptive alignment of magnetohydrodynamic guiding rings, precise press-fitting under constant pressure and speed, and non-destructive positioning detection of multiple physical quantities. Ultimately, it achieves high-precision, high-consistency, and high-reliability connection between copper pins and substrate holes under high cleanliness and low assembly stress conditions, which can improve the thermal conductivity, electrical conductivity, and long-term service stability of semiconductor water-cooled pan components. Attached Figure Description

[0016] Figure 1 This is a schematic flowchart illustrating a method for installing copper pins in a semiconductor water-cooling plate assembly, according to one embodiment of this application. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0018] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0019] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0020] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0021] Figure 1 This is a schematic flowchart illustrating a method for installing copper pins in a semiconductor water-cooled pan assembly, as provided in one embodiment of this application. Figure 1 As shown, the method includes the following steps: S100: Pre-processing the substrate holes on the semiconductor water cooling pan assembly; S200: Perform interference testing on the copper pins to be installed and the pre-treated base holes; S300: Guide and install copper pins and base holes that have passed the interference fit test; S400: Press-fit the guide-installed copper pins and base holes to fix them in place; S500: Perform position check on the copper pins and base holes after press-fitting.

[0022] The above embodiments constitute the basic technical solution of this application. This embodiment first pre-processes the base hole to provide a clean and low-friction mounting interface for the assembly of the copper pin. Subsequently, interference testing ensures precise dimensional and electrical matching between the copper pin and the base hole. Guided installation achieves precise alignment and stress-free insertion of the copper pin and the base hole. The press-fitting process forms a reliable and tight mechanical connection through a controllable press-fitting procedure. Finally, a multi-physical quantity arrival detection process completes a comprehensive verification of the installation results. This application can guarantee high-precision, high-consistency, and high-reliability installation of the copper pin and the base hole as a whole. In another exemplary embodiment, step S100, the pretreatment of the substrate hole on the semiconductor water cooling pan assembly for mounting copper pins includes the following steps: S101: Clean the pores in the substrate; In this step, the semiconductor water-cooled pan assembly is placed in the high-pressure chamber of the supercritical CO2 cleaning equipment. By precisely controlling the temperature and pressure, CO2 is brought to a supercritical state, possessing both high gas permeability and strong liquid dissolving power. Subsequently, a trace amount of co-solvent (such as ethanol) is injected into the chamber. Utilizing the synergistic effect of supercritical CO2 and the co-solvent, efficient and deep cleaning of organic contaminants on the inner wall of the substrate pores is achieved.

[0023] Compared to traditional water-based or solvent-based ultrasonic cleaning, the cleaning method employed in this embodiment fully utilizes the unique properties of supercritical CO2 fluid, enabling it to completely penetrate into the pores of the substrate. Through the high permeability and strong dissolving power of supercritical CO2, combined with the synergistic effect of the co-solvent, deep cleaning at the molecular level can be achieved. After the cleaning process, contaminants are completely carried away by the vaporization of CO2, resulting in extremely high dryness of the substrate pores without any secondary pollution or chemical residue. This overcomes the inherent defects of traditional cleaning methods, which easily lead to liquid residue, water stains, or secondary pollution, thus providing a high-cleanliness installation environment for subsequent precision assembly.

[0024] S102: Activate the pores of the cleaned substrate; In this step, this embodiment employs multiphoton ionization activation technology based on femtosecond lasers, focusing an ultrashort pulse laser (pulse width < 100 femtoseconds) onto the inner wall of the substrate pore using an adaptive optics system, achieving an extremely high peak power density (> 10^14 W / cm²). 2 Under the influence of plasma, the molecular bonds of contaminants are directly broken through a nonlinear multiphoton absorption process without significant thermal effects. Simultaneously, it induces self-organized nano-wave structures and oxygen vacancy defects on the surface of the substrate pores, forming a highly active metastable surface. This process can simultaneously excite hydroxyl radicals generated by the dissociation of water molecules in the air, further oxidizing residual hydrocarbons into volatile small molecules. This achieves in-situ cleaning and activation at room temperature and pressure, not only completely removing monolayer contaminants but also increasing the surface energy of the substrate pores to over 80 mN / m. Furthermore, it avoids surface damage and thermal stress problems that may be caused by plasma treatment, providing an ideal interface for subsequent solid lubricant film deposition. S103: Deposit a solid lubricating film on the inner wall of the pores of the activated substrate; In this step, immediately after the activation treatment is completed, a solid lubricating film (such as molybdenum disulfide or diamond-like carbon film) of controllable thickness (usually 50 nm to 200 nm) is deposited on the inner wall of the substrate hole by physical vapor deposition. This film helps to reduce the insertion force of the copper pin during the subsequent press-fitting process, thereby effectively preventing the copper pin from seizing or shearing due to excessive friction, while not affecting the connection strength between the copper pin and the substrate hole and the overall thermal conductivity.

[0025] S104: Finishing process for the pores of the substrate to which a solid lubricating film has been deposited.

[0026] This step involves finishing the substrate pores to which a solid lubricating film has been deposited, including the following steps: First, a diamond micro-grinding head, whose dimensions are matched to the tolerances of the substrate hole, is mounted on a precision spindle. Guided by a sensor, it is aligned with the substrate hole with high coaxiality and smoothly introduced into the hole. Second, the spindle is started to rotate at a set speed while simultaneously reciprocating at a uniform speed along the hole axis. The diamond abrasive grains cut and grind the hole wall to remove microscopic protrusions, burrs, and uneven film layers that may remain after drilling and film deposition. Next, by controlling the brief pause and specific trajectory movement of the grinding head in the hole opening area, a uniform and minute rounded transition is formed at the hole edge to eliminate stress concentration points and homogenize the microscopic residual stress layer generated during drilling. Finally, the grinding head is withdrawn, and a high-pressure clean airflow is used to blow away the substrate hole to remove processing debris. Subsequently, a rapid inspection is performed using an endoscope or pneumatic measurement to ensure that the surface roughness of the hole wall is significantly reduced and the geometric accuracy is improved without removing the effective film layer, thereby obtaining an assembly interface with surface integrity.

[0027] In another exemplary embodiment, step S200, which involves performing an interference test on the copper pin to be installed and the pre-treated base hole, includes the following steps: S201: Zero and calibrate the gas-electric micrometer; In this step, the pneumatic micrometer is first zeroed and calibrated using standard parts with known precise dimensions (such as standard ring gauges and standard pins) to ensure its reference accuracy. Then, the theoretical interference range between the copper pin and the substrate hole is preset in the pneumatic micrometer, and the acceptable pneumatic measurement signal range is calculated based on this, serving as the basis for subsequent determination of the substrate hole diameter. Simultaneously, a certain safety margin is reserved based on the theoretical resistance value of good copper-copper contact, and a "maximum permissible contact resistance threshold" is set to provide a passing standard for subsequent electrical performance testing. This establishes an accurate criterion foundation for the entire testing process from both dimensional and electrical performance perspectives. S202: Measurement of the pore diameter of the pre-treated matrix based on a gas-electric micrometer after zeroing and calibration; In this step, the integrated testing fixture is moved above the pre-treated substrate hole, ensuring the measuring nozzle is tightly fitted to the hole opening. Then, the zeroed and calibrated pneumatic micrometer is activated, injecting a stable airflow into the pre-treated substrate hole. By measuring changes in back pressure or flow rate, the actual effective aperture D_actual of the substrate hole is quickly calculated and recorded. Compared to caliper measurements at a single location, the pneumatic measuring instrument can reflect the comprehensive dimensions and shape errors of the substrate hole (such as roundness and cylindricity), thus providing a more comprehensive and accurate representation of the actual geometric state of the fit between the substrate hole and the pin, thereby improving the reliability of the interference fit calculation.

[0028] S203: Measure the diameter of the copper pin to be installed; In this step, a laser scanner is integrated into the vibratory feeder or feeding mechanism to perform non-contact diameter measurement of the copper pins to be installed and accurately record their actual diameter d_actual. Through diameter measurement, blind selection of pins is no longer necessary; instead, the precise dimensions of the pins can be obtained and utilized in real time. Based on the measured diameter D_actual of the base hole, the system actively searches for and specifies copper pins that meet the target interference fit (d_actual - D_actual) among many copper pins. This enables a dynamic and adaptive flexible matching strategy, fundamentally ensuring the compatibility between the two components.

[0029] S204: Pre-inspection of contact resistance of copper pins and base holes; In this step, the designated paired copper pins are first brought into contact with two insulated conductive probes. Then, a constant, minute current is applied between the copper pins and the substrate hole (accessed via another probe) using a low-resistance measuring instrument, and the contact resistance between them is precisely measured. This contact resistance pre-check detects the presence of high-resistance oxide films or non-conductive contaminants on the surfaces of the copper pins and the substrate hole walls. If the contact resistance exceeds a set threshold, the combination is deemed unqualified. This effectively prevents a decrease in electrical and thermal conductivity due to surface contamination, ensuring the functional reliability of the water cooling pan. S205: Sorting is performed based on the data from steps S202 to S204.

[0030] In this step, all data from steps S202, S203, and S204 (substrate hole diameter D_actual, copper pin diameter d_actual, contact resistance value) are received, and the following logical judgment is performed: First, calculate the actual interference fit: Actual interference fit = d_actual - D_actual, and determine if the actual interference fit is within the preset acceptable range. Simultaneously, determine if the contact resistance is below the maximum allowable threshold. Second, if the actual interference fit is acceptable and the contact resistance meets the standard, the copper pin and the base hole can be considered a qualified pair, allowing it to proceed to the next installation step.

[0031] In another exemplary embodiment, step S300, guiding and installing the copper pins and base holes that have passed the interference fit test, includes the following steps: S301: Pre-align the copper pin and the base hole; In this step, the copper pin that has passed the interference fit test is moved directly above the base hole. At the opening of the base hole, a magnetofluid guide ring with an embedded annular permanent magnet is pre-installed. This ring is filled with magnetofluid, which forms a fluid liquid film under the influence of a magnetic field and is firmly adsorbed within the ring. When the copper pin approaches and contacts this magnetofluid liquid film under the guidance of a robotic arm, the liquid film instantly wraps around the pin tip. Due to the inherent self-adaptability and surface tension of the magnetofluid, it can automatically compensate for the slight coaxiality deviation (typically <10µm) between the pin and the guide ring, thereby forming a liquid bearing interface, which enables automatic alignment and lubrication between the copper pin and the base hole.

[0032] It should be noted that, compared to traditional rigid guidance or mechanical floating alignment methods, this embodiment uses a magnetohydrodynamic (MHD) guide ring to pre-align the copper pin and the base hole. This MHD fluid film forms a "soft contact" guide interface with liquid self-adaptive properties. This fluid film instantly wraps around the tip of the copper pin and, utilizing its surface tension and fluidity, automatically compensates for coaxiality deviations between the pin and the base hole, thus achieving precise automatic alignment. Simultaneously, this liquid bearing effect continuously provides lubrication during the guidance process, effectively preventing scratches on the pin surface or abrasion at the base hole opening caused by rigid contact. This eliminates the seizing, jamming, or installation stress problems caused by excessive friction in traditional alignment methods, thereby improving the success rate and installation integrity of the copper pin and base hole connection.

[0033] S302: Apply constant pressure to the pre-aligned copper pins and base holes.

[0034] In this step, after pre-alignment, a robotic arm is used to slowly push the copper pin into the base hole with a constant small pressure (e.g., 5N to 10N). During the pushing process, the magnetohydrodynamic film at the opening of the base hole undergoes slight deformation under pressure. However, due to the magnetic field constraint of the annular permanent magnet, the magnetohydrodynamic film will always maintain a sealed and lubricated state, thereby continuously guiding the copper pin into the base hole along the correct axial direction.

[0035] It should be noted that the reason for using constant pressure introduction, rather than constant displacement or constant speed, is that this method can fundamentally avoid sudden changes in assembly stress caused by microscopic geometric deviations of parts or fluctuations in the friction coefficient of mating surfaces through real-time feedback and adaptive adjustment. Specifically, under the guidance of the liquid bearing interface constructed by the magnetofluid guiding ring, a constant small pressure (such as 5N to 10N) ensures that the copper pin advances axially in a compliant state during the initial stage of cutting into the base hole. Even if there is microscopic non-roundness at the hole or a slight deflection at the pin tip, the system can "digest" these deviations by maintaining constant pressure, allowing the copper pin to automatically locate and center under the wrapping of the magnetofluid liquid film. If constant displacement or constant speed drive is used, overshoot or compressive stress is easily generated when encountering small resistance due to the rigidity of the mechanism and the inertia of motion, which can lead to plastic bending of the copper pin, scratching of the base hole, or even failure of the magnetofluid seal. Constant pressure introduction eliminates such risks from the mechanism, ensuring stress-free, high-precision, and high-reliability guiding process.

[0036] In another exemplary embodiment, step S400, which involves pressing and fixing the guided copper pin and the base hole, includes the following steps: S401: Press the copper pins that have been guided and installed at a constant speed and hold them under pressure for curing. In this step, the semiconductor water-cooled plate assembly, which has already been guided and partially inserted into the substrate hole, is first smoothly transferred by a robotic arm to a dedicated precision pressing station. This station is equipped with a servo-driven electric press, which advances the copper pin at a constant low speed (e.g., 0.5 mm / s to 1 mm / s) until the pressure value inside the substrate hole rises significantly, indicating that the interference fit section between the copper pin and the substrate hole has begun to fully contact. Next, when the monitored pressure value reaches a preset contact threshold, the press stops moving and switches to force control mode, maintaining a constant pressure (e.g., 2 kN to 5 kN based on the interference fit) at the current position for a period of time (e.g., 3 to 5 seconds). This pressure holding allows the metal material of the copper pin and the substrate hole wall to undergo microscopic elastoplastic deformation under pressure, thereby fully filling the fit gap between them and ensuring the stability and tightness of the connection.

[0037] S402: Clean the base hole after installation.

[0038] In this step, after press-fitting, negative pressure is applied through a pre-set microchannel at the bottom of the substrate hole to promptly remove any trace amounts of solid lubricant (such as molybdenum disulfide) particles or debris squeezed out from the mating interface during press-fitting. This prevents their accumulation at the end of the mating surface or in the water-cooling plate channel, thus avoiding potential risks of poor thermal conductivity or channel blockage. Finally, a low-pressure clean gas (such as dry nitrogen) is used to purge the area around the substrate hole opening to complete the final cleaning.

[0039] In another exemplary embodiment, step S500, the positioning detection of the press-fitted copper pin and the base hole, includes the following steps: S501: Perform laser scanning on the press-fitted copper pins; In this step, a high-precision 3D laser profile scanner can be used to quickly and non-contactly scan the top and surrounding area of ​​the press-fitted copper pin to generate three-dimensional point cloud data. By analyzing the generated three-dimensional point cloud data, the following two judgments can be made simultaneously: First, the installation height of the copper pin can be determined, that is, the amount of protrusion or indentation of the top of the copper pin relative to the plane of the water-cooling plate can be accurately measured to ensure that it meets the design depth tolerance requirements (e.g., ±10µm); Second, the deformation and damage of the copper pin can be preliminarily screened by analyzing the three-dimensional morphology of the top of the copper pin to detect whether macroscopic deformation or damage such as bulging, warping, or scratches occurred during the press-fitting process.

[0040] S502: Quality assessment of the interface contact between the copper pin and the base hole.

[0041] In this step, a pair of precision microneedle probes are used to contact the top of the copper pin and the nearby water-cooled plate substrate, respectively, while the probes are connected to an impedance analyzer. Subsequently, a small AC test signal is applied within a set frequency range (e.g., 1 kHz to 1 MHz), and its impedance spectrum is scanned and recorded. By analyzing the morphological characteristics of this impedance spectrum, especially its difference from the reference spectrum of a qualified sample, defects such as high-resistivity oxide films, micro-gaps, or insufficient contact area at the interface can be detected non-destructively, thereby achieving an indirect and accurate assessment of the quality of the electrical connection and the tightness of the physical contact at the interface.

[0042] In addition, a miniature acoustic excitation sensor can be used to lightly touch the top of the copper pin, applying a short, broadband acoustic pulse, while simultaneously receiving the reflected resonance signal through the same sensor. By analyzing the frequency, attenuation characteristics, and spectral composition of this resonance signal and comparing it with a database of "acoustic fingerprints" of known qualified samples, the binding state and press-fit tightness of the copper pin within the substrate hole can be indirectly determined. The principle behind this operation is that the mechanical contact state at the interface directly determines the vibration characteristics of the system. When there is microscopic loosening or cracks at the contact interface, it is equivalent to introducing tiny "gaps" or "flexible layers" into the originally rigidly connected system, which significantly reduces the equivalent contact stiffness of the system. This loss of stiffness will cause characteristic changes in the resonance signal, specifically: due to the decrease in system stiffness, its natural vibration frequency will shift towards lower frequencies. For example, the main resonance peak of a qualified component may be stable at 85 kHz, while the main resonance peak of the same component with microscopic loosening may shift to 80 kHz or lower. The frequency shift is positively correlated with the degree of loss of contact stiffness (i.e., the severity of loosening). Below, this application compares and tests a semiconductor water-cooled pan assembly based on the solution described in this application with one based on traditional press-fit assembly. The specific testing process includes: First, for thermal cycling testing, a semiconductor water-cooled pan assembly based on the scheme described in this application and manually assembled was placed in a high and low temperature test chamber. A constant-temperature liquid was circulated inside, and an online micro-ohmmeter was connected. The program controlled the chamber to cycle between -40℃ and 125℃, automatically recording the contact resistance of the copper pins at the end of each cycle, and plotting the resistance change curve with the number of thermal cycles to evaluate stability. Before, during, and after the cycling test, samples were randomly selected, and a steady-state thermal resistance tester was used. Precise heating power and cooling conditions were applied to both sides of the assembly, and the resistance across the copper pins was measured. The precise temperature difference at the substrate interface allows for the direct calculation of interfacial contact thermal resistance. For mass-produced components, a four-wire micro-ohmmeter is used to perform online continuity testing on each pin connection point, recording its initial contact resistance and statistically analyzing its distribution to calculate the first-pass yield. Finally, for typical samples or abnormal locations, an impedance analyzer is used to apply a swept-frequency signal to obtain the impedance spectrum, and an acoustic resonance analyzer is used to collect its resonance frequency and attenuation characteristics. These non-destructive testing "fingerprint" signals are compared with a database of reference samples that have passed metallographic section verification, thereby achieving a quantitative and non-destructive assessment of the interfacial micro-contact quality.

[0043] The detection comparison results obtained based on the above detection process are shown in Table 1: Table 1

[0044] As shown in Table 1, this application, through a systematic and precise assembly process, achieves a qualitative leap in the performance of semiconductor water-cooled pan assemblies compared to traditional methods. Specifically, the interface contact thermal resistance is reduced by approximately 60% to 70%, and the contact resistance is reduced by approximately 70% to 80%. Furthermore, it can withstand over 3000 harsh thermal cycles while maintaining excellent stability (contact resistance change rate <5%), and simultaneously increases the first-pass yield to over 99.8%. These significant improvements, verified by quantitative data such as steady-state thermal resistance testing, four-wire micro-ohmmeter measurement, and non-destructive acoustic impedance spectroscopy, collectively ensure that the semiconductor water-cooled pan assembly achieves superior thermal / electrical conductivity, exceptional long-term service reliability, and highly consistent product quality.

[0045] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A method for installing copper pins in a semiconductor water-cooled pan assembly, characterized in that, The method includes: Pre-treatment of the substrate holes on the semiconductor water cooling plate assembly; Perform interference testing on the copper pins to be installed and the pre-treated base holes; Guide and install the copper pins and base holes that have passed the interference fit test; Press-fit the guide pins and base holes to fix them in place. After press-fitting and fixing, the copper pins and base holes are checked for proper positioning.

2. The installation method according to claim 1, characterized in that, The pretreatment of the substrate holes on the semiconductor water-cooled pan assembly includes: Clean the pores in the substrate; The cleaned substrate pores are then activated. A solid lubricating film is deposited on the inner wall of the pores of the activated substrate; The substrate pores with deposited solid lubricating films are smoothed.

3. The installation method according to claim 2, characterized in that, The finishing process for the substrate pores on which a solid lubricating film has been deposited includes: The diamond micro-grinding head is inserted into the substrate hole and moves back and forth at a constant speed along the hole axis inside the substrate hole; The grinding head is controlled to pause briefly in the area of ​​the hole opening in the substrate to form a uniform, minute rounded transition at the edge of the hole opening; The pores in the matrix are purged.

4. The installation method according to claim 1, characterized in that, The interference test performed on the copper pins to be installed and the pre-treated base hole includes: Zero and calibrate the gas-electric micrometer; The pore diameter of the pretreated matrix was measured using a gas-electric micrometer after zeroing and calibration. Measure the diameter of the copper pin to be installed; Pre-inspection of contact resistance between copper pins and substrate holes; The interference fit test is determined based on the diameter of the substrate hole, the diameter of the copper pin, and the contact resistance.

5. The installation method according to claim 4, characterized in that, The determination of whether the copper pin to be installed and the pre-treated substrate hole pass the interference test based on the substrate hole diameter, copper pin diameter, and contact resistance includes: Calculate the actual interference fit between the copper pins to be installed and the pre-treated base hole; If the actual interference fit meets the preset range and the contact resistance is lower than the maximum allowable threshold, then the interference fit test of the copper pin to be installed and the pre-treated base hole is qualified.

6. The installation method according to claim 1, characterized in that, The process of guiding and installing the copper pins and base holes that have passed the interference fit test includes: Pre-align the copper pins and the base hole; The pre-aligned copper pins and base holes are then introduced.

7. The installation method according to claim 6, characterized in that, The pre-alignment of the copper pin and the base hole includes: A magnetohydrodynamic (MHD) guide ring is installed at the orifice of the substrate hole, and the copper pin and the substrate hole are pre-aligned based on the MHD guide ring.

8. The installation method according to claim 7, characterized in that, The process of guiding the pre-aligned copper pins and base holes includes: The pre-aligned copper pins and base holes are introduced by constant pressure.

9. The installation method according to claim 1, characterized in that, The step of pressing and fixing the guide-installed copper pins and base holes includes: The copper pins that have been guided and installed are pressed in at a constant speed and then cured under pressure. Clean the holes in the substrate after installation.

10. The installation method according to claim 1, characterized in that, The process of checking the positioning of the copper pins and base holes after press-fitting includes: Laser scanning is performed on the copper pins after they have been press-fitted and fixed. The quality of the interface contact between the copper pin and the base hole is assessed.

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