Low heat conduction rotating gas guide seat for mocvd equipment and mocvd equipment

By introducing a heat-insulating connection structure and expanding the heat dissipation surface in the rotating air guide seat of the MOCVD equipment, the problem of heat conduction along the axial direction at high temperatures is solved, resulting in higher equipment stability and service life.

CN121519018BActive Publication Date: 2026-06-23ETA-SEMITECH (ANHUI) CO LTD
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Patent Information

Application Number
CN202610052036.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2026-01-15
Publication Date
2026-06-23
Estimated Expiration
2046-01-15

AI Technical Summary

Technical Problem

The rotating air guide seat of existing MOCVD equipment conducts heat efficiently along the axial direction at high temperatures, causing the magnetohydrodynamic seal to fail due to overheating, which affects the stability and lifespan of the equipment.

Method used

The design adopts a low thermal conductivity rotating air guide seat. By setting a heat-insulating connection structure and an extended heat dissipation surface structure between the base contact seat and the air guide tube fixing seat, a heat-insulating gap is formed and the heat dissipation area is increased, thereby reducing heat transfer.

Benefits of technology

It effectively reduces heat conduction from the high-temperature base to the precision components at the bottom, protects the magnetohydrodynamic seals, and improves the stability and lifespan of the equipment.

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Abstract

The application discloses a low-heat-conduction rotating gas guide seat for an MOCVD device and the MOCVD device, and relates to the technical field of MOCVD devices. The base contact seat is internally provided with a gas guide channel for conveying gas to the base; the gas guide pipe fixing seat is arranged below the base contact seat; the upper end of the gas guide pipe is communicated with the gas guide channel, and the top end of the gas guide pipe abuts against the base contact seat; the bottom end of the gas guide pipe abuts against the gas guide pipe fixing seat; the heat insulation connecting structure is arranged between the base contact seat and the gas guide pipe fixing seat, so that a separated heat insulation gap is formed between the adjacent surfaces of the two; and the expanded heat dissipation surface structure is arranged on the gas guide pipe fixing seat and used for increasing the heat dissipation surface area of the gas guide pipe fixing seat. The application has the advantages of effectively reducing the heat conduction path of the high-temperature base to the bottom precision components, reducing heat transfer, protecting sensitive components such as the magnetic fluid seal, improving the operation stability and service life of the device, and the like.
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