Microfluidic chip clamping type temperature control device and control method thereof

Abstract

The present application relates to the technical field of microfluidic detection, and particularly relates to a microfluidic chip clamping type temperature control device and a control method thereof. The device comprises a first temperature control module and a second temperature control module oppositely arranged along a first direction, the second temperature control module is connected with the first temperature control module through a linear bearing and a guide shaft and can move along the first direction; the device is provided with a first elastic member for applying an elastic force to the second temperature control module towards the first temperature control module to realize microfluidic chip clamping; and a balancing mechanism is further provided for providing an anti-inclination force to balance the gravity of the second temperature control module and maintain the parallel relationship between the two modules. The present application combines elastic clamping and independent balancing, simplifies the structure, reduces the cost, realizes self-adaptive adjustment of clamping force and overload protection, effectively prevents microfluidic chip pressure loss, actively maintains the parallel relationship to ensure uniform heat contact, and significantly improves the temperature control efficiency and device reliability.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of microfluidic detection, and in particular to a microfluidic chip clamping type temperature control device and a control method thereof. BACKGROUND

[0002] In an automated microfluidic detection system, a temperature control module needs to be closely attached to the surface of a microfluidic chip to achieve efficient heat conduction. Existing clamping schemes mostly use double guide rails or a motor directly driving clamping. Although the double guide rail structure has good parallelism, it has a complex structure, high cost, and occupies a large space. Moreover, the friction and matching precision difference of the two guide rails may cause jamming. More importantly, it is a rigid structure and cannot adapt to the slight unevenness of the microfluidic chip or the mounting surface, which may cause poor contact and low heat conduction efficiency.

[0003] The scheme of using a motor to directly drive clamping has the risk of complex control and difficulty in accurately controlling the clamping force. Once the control is improper, excessive clamping force can easily crush the fragile microfluidic chip, causing sample loss and experimental failure. Therefore, there is an urgent need for a temperature control device that has high-precision guidance, self-adaptive attachment capability, and safe and reliable clamping force. SUMMARY

[0004] The purpose of the present application is to provide a microfluidic chip clamping type temperature control device and a control method thereof, which solves the problems of complex clamping mechanism, lack of self-adaptive capability, and unsafe clamping force control in the prior art.

[0005] To achieve the above-mentioned purpose, in a first aspect, the present application provides a microfluidic chip clamping type temperature control device, comprising a first temperature control module and a second temperature control module oppositely arranged along a first direction, characterized in that:

[0006] The second temperature control module is connected with the first temperature control module through at least one linear bearing and a guide shaft penetrating therein, so that the second temperature control module can move relative to the first temperature control module in the first direction;

[0007] The device further comprises a first elastic member, which applies an elastic force to the second temperature control module to move it towards the first temperature control module; and

[0008] The device further comprises a balancing mechanism for providing an anti-tilting force to balance the gravitational tilt caused by the single-sided suspension state of the first temperature control module and maintain the parallel relationship between the second temperature control module and the first temperature control module.

[0009] Optionally, the balancing mechanism comprises a fixed block fixedly arranged, a balancing guide rod connected with the second temperature control module, and a second elastic member acting between the fixed block and the second temperature control module.

[0010] The balance guide rod passes through the fixed block and is arranged in parallel with the guide shaft, and when the second temperature control module moves along the guide shaft, the second temperature control module moves along the balance guide rod or the second temperature control module and the balance guide rod jointly move relative to the fixed block.

[0011] Optionally, the resultant force of the elastic force of the first elastic member acting on the second temperature control module is greater than the resultant force of the pressure of the second elastic member acting on the second temperature control module.

[0012] Optionally, the first elastic member is a compression spring sleeved on the guide shaft.

[0013] Optionally, the number of the linear bearings and the guide shafts is multiple, and each of the guide shafts is arranged in parallel.

[0014] Optionally, the first temperature control module comprises a first air duct, a first heat conduction block, a first Peltier and a first cooling fan, the first cooling fan is arranged at one end of the first air duct, a first air vent is arranged at the other end of the first air duct, the first heat conduction block is arranged on one side of the first air duct, and the first Peltier is arranged between the first heat conduction block and the first air duct.

[0015] The second temperature control module comprises a second air duct, a second heat conduction block, a second Peltier and a second cooling fan, the second cooling fan is arranged at one end of the second air duct, a second air vent is arranged at the other end of the second air duct, the second heat conduction block is arranged on one side of the second air duct, and the second Peltier is arranged between the second heat conduction block and the second air duct.

[0016] After the second temperature control module is connected with the first temperature control module, the first cooling fan and the second cooling fan are arranged in opposite directions.

[0017] Optionally, the first temperature control module further comprises a first radiator, the first radiator serves as or is arranged on the side wall of the first air duct facing the second temperature control module, and the first Peltier is arranged on the first radiator.

[0018] The second temperature control module further comprises a second radiator, the second radiator serves as or is arranged on the side wall of the second air duct facing the first temperature control module, and the second Peltier is arranged on the second radiator.

[0019] Optionally, a plurality of first bosses for contacting one side of a plurality of reaction chambers of the microfluidic chip are arranged on the first heat conduction block.

[0020] The second heat-conducting block is provided with a plurality of second bosses for contacting the other side of the plurality of reaction chambers of the microfluidic chip.

[0021] Optionally, the first temperature control module and the second temperature control module are arranged staggeredly in a second direction perpendicular to the first direction, so that a part of the first temperature control module protrudes from the second temperature control module in the second direction, forming a first gap space, while a part of the second temperature control module protrudes from the first temperature control module in the second direction, forming a second gap space.

[0022] Optionally, the device further comprises a pulling-apart module, which comprises a driving unit and an actuating part, and the actuating part is configured to selectively abut against or be separated from the second temperature control module.

[0023] When abutting, the second temperature control module is pulled away from the first temperature control module against the elastic force of the first elastic member.

[0024] When separated, the second temperature control module clamps the microfluidic chip under the elastic force of the first elastic member.

[0025] Optionally, the pulling-apart module further comprises a zero position detection unit for detecting whether the actuating part reaches an initial position for pulling the second temperature control module.

[0026] Optionally, the zero position detection unit comprises a zero position limiting piece arranged on the actuating part and a photoelectric switch arranged at a fixed position.

[0027] In a second aspect, the present application further provides a control method of a microfluidic chip clamping type temperature control device, which is used for controlling any one of the clamping type temperature control devices with a pulling-apart module in the first aspect, and comprises the following steps:

[0028] Controlling the driving unit to drive the actuating part to abut against the second temperature control module and continue to move to pull the second temperature control module away from the first temperature control module against the elastic force of the first elastic member, forming a release state.

[0029] Putting in or taking out the microfluidic chip;

[0030] Controlling the driving unit to drive reversely, so that the actuating part moves towards the first temperature control module, the second temperature control module is automatically reset under the elastic force of the first elastic member, and after the second temperature control module contacts the microfluidic chip, the actuating part continues to move until the actuating part is separated from the second temperature control module, so that the second temperature control module clamps the microfluidic chip under the action of the first elastic member.

[0031] The above technical solutions of the present application have the following advantages:

[0032] The microfluidic chip clamping type temperature control device provided by the application realizes the movement of the second temperature control module through a moving pair composed of a guide shaft and a linear bearing, provides constant and flexible clamping force by using the first elastic member, and introduces an independent balancing mechanism to offset the tilting moment caused by gravity. Not only the structure is simplified and the cost is reduced, but also the self-adaptive fitting and overload protection are realized by the elastic clamping, the microfluidic chip is effectively prevented from being crushed, meanwhile, the parallel relationship between the modules is actively maintained by the balancing mechanism, the uniform heat contact and efficient heat conduction performance are ensured, and the reliability and temperature control effect of the device are comprehensively improved.

[0033] The control method of the microfluidic chip clamping type temperature control device provided by the application realizes the automation of the operation of the device by controlling the actuating part to perform the specific process of "engaging-pulling" to release the microfluidic chip and "separating-elastic resetting" to clamp the microfluidic chip. The core advantage of the method is to realize the decoupling of driving and clamping: in the final clamping state, the actuating part is separated from the temperature control module, so that the clamping force is completely provided by the first elastic member instead of the driving unit, which fundamentally eliminates the risk of over-clamping and ensures the safety of the microfluidic chip. At the same time, the process operation improves the efficiency and repeatability, and is especially suitable for automatic detection systems. BRIEF DESCRIPTION OF DRAWINGS

[0034] The proportions and quantities of the components in the drawings provided for illustrative purposes only may not be consistent with the actual product.

[0035] Figure 1 is a structural schematic diagram of a microfluidic chip clamping type temperature control device in embodiment one of the application;

[0036] Figure 2 is Figure 1 another angle structural schematic diagram of the temperature control device in embodiment one of the application;

[0037] Figure 3 is Figure 1 still another angle structural schematic diagram of the temperature control device in embodiment one of the application;

[0038] Figure 4 is Figure 3 A-A sectional view of the temperature control device in embodiment one of the application;

[0039] Figure 5 is Figure 4 the C part in embodiment one of the application;

[0040] Figure 6 is Figure 3 B-B sectional view of the temperature control device in embodiment one of the application;

[0041] Figure 7 is Figure 6 the D part in embodiment one of the application;

[0042] Figure 8 is Figure 6 an enlarged schematic view of part E in Fig. 1;

[0043] Figure 9 is a structural schematic view of a first temperature control module in Embodiment One of the present application;

[0044] Figure 10 is a structural schematic view of a support plate in Embodiment One of the present application;

[0045] Figure 11 is a structural schematic view of a microfluidic chip clamping type temperature control device in Embodiment Two of the present application;

[0046] Figure 12 is Figure 11 another angle structural schematic view of the temperature control device in Fig. 2;

[0047] Figure 13 is Figure 12 a F-F cross-sectional schematic view of the temperature control device in Fig. 2.

[0048] In the drawings:

[0049] 1: first temperature control module; 11: first air duct; 12: first heat conduction block; 121: first boss; 13: first Peltier; 14: first heat dissipation fan; 15: first heat sink;

[0050] 2: second temperature control module; 21: second air duct; 22: second heat conduction block; 221: second boss; 23: second Peltier; 24: second heat dissipation fan; 25: second heat sink;

[0051] 3: linear bearing;

[0052] 4: guide shaft;

[0053] 5: first elastic member;

[0054] 6: balancing mechanism; 61: fixed block; 62: balancing guide rod; 63: second elastic member;

[0055] 7: pull-apart module; 71: driving unit; 72: base; 73: actuating part; 74: zero position detection unit; 741: zero position limiting sheet; 742: photoelectric switch;

[0056] 8: support plate; 81: support part; 82: mounting part; 83: limiting part;

[0057] 9: fixed plate;

[0058] 100: first gap space; 200: second gap space. DETAILED DESCRIPTION

[0059] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0060] The present application aims to provide a microfluidic chip temperature control device with adaptive clamping force, high parallelism guarantee and operation automation. The core thereof provides safe clamping under the action of elastic pre-tensioning force through a relatively movable temperature control module cooperating with an elastic member, and overcomes the inclination caused by gravity through an independent balancing mechanism, thereby comprehensively solving the problems of clamping force control difficulty, poor thermal contact and complex structure in the prior art.

[0061] The concept of the present application is further illustrated by the specific embodiments below.

[0062] Embodiment One

[0063] As shown in Figures 1 to 4 , the microfluidic chip clamping type temperature control device provided by the embodiments of the present application includes a first temperature control module 1 and a second temperature control module 2 arranged oppositely. The second temperature control module 2 is connected with the first temperature control module 1 (or with a frame fixed to the first temperature control module 1, such as a fixed plate 9) through a guide assembly. In this embodiment, specifically, the guide assembly specifically includes at least one linear bearing 3 and a guide shaft 4 penetrating through the linear bearing 3, the linear bearing 3 is fixedly installed on the second temperature control module 2, the guide shaft 4 is fixedly connected with the first temperature control module 1 after penetrating through the linear bearing 3, and the second temperature control module 2 can move along the guide shaft 4. Thus, the second temperature control module 2 can stably move along the axial direction of the guide shaft 4 (i.e. the first direction, which is also the clamping direction), so as to approach or move away from the first temperature control module 1, thereby realizing the clamping and releasing of the microfluidic chip. The guide assembly has compact structure and is integrated between the two temperature control modules, without the need for extra external system space, which is conducive to the optimization of overall layout.

[0064] Referring to Figure 6 and Figure 7 , the device further includes a first elastic member 5. The first elastic member 5 is configured to continuously apply an elastic force to the second temperature control module 2 to move it towards the first temperature control module 1. This elastic force directly constitutes the pre-tensioning force for clamping the microfluidic chip. Since this force is generated by an elastic element rather than a rigid drive, it can adapt to slight changes in the thickness of the microfluidic chip, and naturally has an overload protection function, effectively preventing the crushing of fragile microfluidic chips. In one specific example, as shown in Figure 6 and Figure 7As shown, the first elastic member 5 is a compression spring sleeved on the guide shaft 4. It can be understood that the first elastic member 5 can also be a disc spring, an elastic rubber column or other elastic elements capable of providing pressure.

[0065] In the present embodiment, the linear bearing is mounted on the second temperature control module 2, and the guide shaft 4 is fixedly connected with the first temperature control module 1 after passing through the linear bearing 3, so that the second temperature control module 2 can move along the guide shaft 4. The second temperature control module 2 is connected with the first temperature control module 1 (or a frame fixed with the first temperature control module 1, such as the fixed plate 9) only through the guide shaft 4 passing through the linear bearing 3, forming a single-sided suspension layout. In this state, the second temperature control module 2 has a natural inclination tendency under the action of gravity, and the inclination amplitude is affected by the cooperation gap between the linear bearing 3 and the guide shaft 4. Although the inclination does not affect the normal movement of the second temperature control module 2 along the guide shaft direction, in the application of double-sided heating of the microfluidic chip, if the parallelism between the two temperature control modules cannot be maintained, the uniformity of the microfluidic chip heating may be affected. To achieve uniform heat conduction, the key lies in ensuring the parallelism of the two temperature control modules during clamping. Therefore, the device of the present embodiment also provides an independent balancing mechanism 6. The balancing mechanism 6 is used to provide an anti-inclination force, which is mainly used to balance the gravity of the second temperature control module 2, so as to maintain the parallel relationship between the second temperature control module 2 and the first temperature control module 1 during the movement and clamping of the second temperature control module 2, and avoid the inclination of the module due to the gravity moment.

[0066] Figures 3 to 5 A preferred embodiment of the balancing mechanism is shown. The balancing mechanism includes a fixed block 61 (fixed on the fixed plate 9 or fixed on the fixed plate 9 through the base), a balancing guide rod 62 connected with the second temperature control module 2, and a second elastic member 63. The balancing guide rod 62 passes through the fixed block 61 and is arranged in parallel with the guide shaft 4. The second elastic member 63 (for example, a compression spring) acts between the fixed block 61 and the second temperature control module 2. The second elastic member 63 has a certain pre-tightening force during assembly, so as to resist the inclination tendency of the second temperature control module 2 due to gravity. When the second temperature control module 2 moves along the guide shaft 4, in an example, the second temperature control module 2 can slide relative to the balancing guide rod 62, that is, the second temperature control module 2 moves along the balancing guide rod 62 at the same time, and in the movement process, the second elastic member 63 deforms and always provides the required anti-inclination force. Preferably, the balancing guide rod 62 is connected with the second temperature control module 2 through a linear bearing, and one end of the balancing guide rod 62 is threadedly connected with the fixed block.

[0067] In another example, the balancing guide rod 62 is slidably connected with the fixed block 61, the balancing guide rod 62 is fixedly connected with the second temperature control module 2, and the balancing guide rod 62 and the second temperature control module 2 move synchronously relative to the fixed block 61. Preferably, the balancing guide rod 62 is connected with the fixed block 61 through a linear bearing.

[0068] As shown in Figure 4 and Figure 5 , preferably, the second elastic member 63 is a compression spring sleeved on the balance guide rod 62. It can be understood that the second elastic member 63 can also be a disc spring, an elastic rubber column or other elastic elements capable of providing pressure.

[0069] In order to further ensure reliable clamping while balancing the gravity tilt caused by the single-side suspension state of the second temperature control module and maintaining the parallel relationship between the second temperature control module and the first temperature control module, in an example, the resultant force of the elastic force of the first elastic member 5 acting on the second temperature control module 2 is greater than the resultant force of the pressure of the second elastic member 63 acting on the second temperature control module 2. In this way, it is ensured that after balancing the gravity, there is still sufficient net clamping force to ensure the contact of the microfluidic chip, while avoiding the failure of module closure or uneven clamping force caused by excessive force of the second elastic member 63.

[0070] It is worth noting that the balancing mechanism 6 is not limited to the "guide rod + spring" form. In the present embodiment, the magnetic force balancing mechanism (such as repulsion of like poles to provide repulsive force). All these mechanisms that can provide "anti-tilt force" fall within the concept of the present application.

[0071] In order to further enhance the movement stability, in an example, referring to Figure 6 , the number of the linear bearings 3 and guide shafts 4 can be multiple (for example, two), and each of the guide shafts 4 is arranged parallel to each other.

[0072] In order to realize automatic operation, in an example, the temperature control device further comprises a module pulling open mechanism 7, referring to Figure 1 , Figure 2 , Figure 4 and Figure 6 , the module pulling open mechanism 7 comprises a driving unit 71 (such as a lead screw motor), a base 72, and an actuating part 73 (such as a pulling block mounted on the lead screw) driven by the driving unit 71 and movable relative to the base 72. The actuating part 73 is configured to selectively abut or disengage with the second temperature control module 2.

[0073] The working process of the pulling-apart module 7 will be further described below by taking the telescopic screw stepper motor of the driving unit 71 as an example. When the microfluidic chip needs to be put in or taken out, the telescopic screw stepper motor works, the actuating part 73 moves linearly with the screw rod, abuts against the second temperature control module 2, and overcomes the elastic force of the first elastic member 5 to pull the second temperature control module 2 away from the first temperature control module 1. In this process, the second temperature control module 2 compresses the first elastic member 5, so that the first elastic member 5 has a greater pre-tightening force. At this time, the device enters the release state, which is convenient for the microfluidic chip to be put in or taken out. When clamping is needed, the screw rod of the telescopic screw stepper motor moves reversely, so that the actuating part 73 moves towards the first temperature control module 1. In this process, the first elastic member 5 gradually releases the elastic force, and the second temperature control module 2 is automatically reset under the elastic force of the first elastic member 5. The device enters the clamping state, and continues to move until the actuating part 73 is separated from the second temperature control module 2, so that the second temperature control module 2 clamps the microfluidic chip under the action of the first elastic member 5. The example does not use the rigid clamping mode, but realizes clamping through the elastic force of the first elastic member, so as to avoid damaging the microfluidic chip.

[0074] In the embodiment, the actuating part 73 is not limited to a mechanical push / pull block, but can be an electromagnet attraction / separation structure or any form capable of coupling with the corresponding structure (such as a groove or a magnet) on the second temperature control module 2.

[0075] In order to ensure the control accuracy, the pulling-apart module 7 can further include a zero position detection unit 74 for detecting whether the actuating part 73 reaches the initial position for pulling the second temperature control module 2. In a specific embodiment, the zero position detection unit 74 includes a zero position limiting piece 741 arranged on the actuating part 73 and a photoelectric switch 742 fixedly arranged on the base 72 or other fixed structure (for example, the fixed plate 9). When the zero position limiting piece 741 enters or interrupts the light path of the photoelectric switch 742, it is determined that the actuating part 73 has reached the initial position (zero position).

[0076] In an example, a preferred structure of a temperature control module is provided, as shown in Figure 1 、 Figure 2 、 Figure 4 、 Figure 8 and Figure 9 . The first temperature control module 1 includes a first air duct 11, a first heat conduction block 12, a first Peltier 13, and a first cooling fan 14. The first cooling fan 14 is arranged at one end of the first air duct 11, and the other end is provided with a ventilation opening. The first heat conduction block 12 is used to contact the microfluidic chip, and the first Peltier 13 is arranged between the first heat conduction block 12 and the first air duct 11 and is used for refrigeration or heating.

[0077] Similarly, the second temperature control module 2 includes a second air duct 21, a second heat conduction block 22, a second Peltier 23, and a second cooling fan 24.

[0078] To optimize the heat dissipation airflow and avoid mutual interference, the first heat dissipation fan 14 and the second heat dissipation fan 24 are arranged in opposite directions (for example, one blows and one sucks; or the wind direction forms a 180-degree angle) after the first temperature control module 1 and the second temperature control module 2 are docked. This not only means strictly opposite, but also includes any different air outlet direction that can form an effective flow channel and avoid hot air backflow.

[0079] To further improve the heat dissipation efficiency, the first temperature control module 1 can also include a first heat sink 15 (in the figure, generally a fin structure of the air duct wall, for example, Figure 1 The fin-shaped structure in the first air duct is a fin, and the base plate connected by the fin is an air duct wall). The first heat sink 15 can be a side wall of the first air duct 11 facing the second temperature control module 2, or attached to the side wall. The first Peltier 13 is arranged on the first heat sink 15.

[0080] The second temperature control module 2 can also include a second heat sink 25 (in the figure, generally a fin structure of the air duct wall, for example, Figure 2 The fin-shaped structure in the second air duct is a fin, and the base plate connected by the fin is an air duct wall). The second heat sink 25 can be a side wall of the second air duct 21 facing the first temperature control module 1, or attached to the side wall. The second Peltier 23 is arranged on the second heat sink 25.

[0081] To achieve precise and rapid temperature control of multiple reaction chambers on the microfluidic chip, see Figure 8 and Figure 9 A plurality of first bosses 121 are arranged on the first heat conduction block 12, and a plurality of second bosses 221 are arranged on the second heat conduction block 22. These bosses are designed to be in contact with the positions of each reaction chamber of the microfluidic chip, thereby reducing the heat capacity, improving the heat flux density, achieving rapid temperature rise and fall and partition temperature control. In addition, the fit with the reaction chamber is further improved.

[0082] In an example, the first temperature control module 1 is fixed to the fixed plate 9 or other structures (such as the shell of the microfluidic detection system) through two support plates 8. The two support plates 8 are arranged at intervals, which not only play a supporting role, but also try to reduce the space occupation, facilitating the arrangement of other modules of the microfluidic detection system.

[0083] In an example, see Figure 1 and Figure 10The support plate 8 includes a support portion 81, a mounting portion 82, and a limiting portion 83. The mounting portion 82 is used to connect and fix with the fixing plate 9. The support portion 81 is vertically mounted to the 82 and extends outward, with a certain distance between it and the fixing plate 9, forming a space under the support portion 81 to facilitate the installation and arrangement of other modules. The first temperature control module 1 is mounted on the support portion 81. The limiting portion 83 is located between the first temperature control module 1 and the second temperature control module 2, which limits the travel of the second temperature control module 2 to prevent it from colliding with the first temperature control module 1 or other modules in the microfluidic detection system when moving towards the first temperature control module 1 without the microfluidic chip inserted.

[0084] Example 2

[0085] See Figures 11 to 13 As shown, this second embodiment is basically the same as the first embodiment, and the similarities will not be repeated. The difference is that: the first temperature control module 1 and the second temperature control module 2 are along the first direction (clamping direction). Figure 13 The first temperature control module 1 and the second temperature control module 2 are positioned relative to each other in a second direction perpendicular to the first direction (in the left-right direction). Figure 13 The components are staggered in the vertical direction, such that a portion of the first temperature control module 1 protrudes beyond the second temperature control module 2 in the second direction, forming a first notch space 100. Simultaneously, a portion of the second temperature control module 2 protrudes beyond the first temperature control module 1 in the second direction, forming a second notch space 200. Both the first notch space 100 and the second notch space 200 can be used to arrange other modules or components of the microfluidic chip detection system. In this embodiment, the first notch space 100 and the second notch space 200 provide space for arranging other functional modules, providing a foundation for implementing more functions, optimizing the spatial layout, and achieving multi-functional integration. This is a key design feature for system miniaturization.

[0086] In this embodiment, the first notch space 100 and the second notch space 200 are configured as functional accommodating spaces. In constructing a complete microfluidic detection system, in one example, the first notch space 100 can be used to accommodate a sample driving module (e.g., a high-precision syringe pump or pipetting mechanism), allowing its drive shaft or needle to approach the held microfluidic chip from the side, enabling automated control of the liquid within the microfluidic chip. The second notch space 200 can be used to accommodate a scanning detection module (e.g., a fluorescence excitation light source, an optical lens, or a detection sensor), allowing its optical path to be aligned with the reaction detection area of ​​the microfluidic chip from below. This layout allows the three core functions of temperature control, sample loading, and detection to be spatially interleaved, greatly optimizing the system layout and space utilization.

[0087] The staggered layout mode of the first temperature control module 1 and the second temperature control module 2 in the second embodiment can be applied to the microfluidic chip clamping type temperature control device of any one of the first embodiment.

[0088] The temperature control device in the embodiment not only solves the problems of microfluidic chip pressure loss and uneven contact through elastic clamping, but also provides physical integration space for other key function modules (such as sample adding or sample operation, optical detection) of the microfluidic detection system through the unique staggered layout, realizes the miniaturization and functional integration of the system level without increasing the size of the device.

[0089] Embodiment three

[0090] The embodiment also provides a control method of a microfluidic chip clamping type temperature control device, which is used for controlling the microfluidic chip clamping type temperature control device with the pulling module 7 as described above, and the steps are as follows:

[0091] The driving unit 71 is controlled to drive the actuating part 73 to abut against the second temperature control module 2 and continue to move to overcome the elastic force of the first elastic member 5, pull the second temperature control module 2 away from the first temperature control module 1, and form a release state;

[0092] The microfluidic chip is put in or taken out;

[0093] The driving unit 71 is reversely driven to move the actuating part 73 towards the first temperature control module 1, the first elastic member 5 gradually releases the elastic force, the second temperature control module 2 is automatically reset under the action of the elastic force of the first elastic member 5, and after the second temperature control module 2 contacts the microfluidic chip, the second temperature control module 2 continues to move until the actuating part 73 is separated from the second temperature control module 2, so that the second temperature control module 2 clamps the microfluidic chip under the action of the first elastic member 5.

[0094] As described above, the microfluidic chip clamping type temperature control device of the application replaces rigid driving with elastic pre-tightening force, prevents the microfluidic chip from being broken, is self-adaptive in thickness, and realizes full self-adaptive clamping.

[0095] Through the independent balance mechanism, the gravity inclination is actively resisted, the parallelism of the two modules is ensured, the thermal contact is uniform and efficient, and high-precision heat conduction is realized.

[0096] Through the multi-axis parallel guide structure, stable movement is realized without jamming, stable and reliable guidance is realized, the space occupation is reduced, and the space layout is optimized.

[0097] Through the reverse arrangement of the fan, the heat dissipation is optimized; the boss design realizes rapid and localized temperature control, and high-efficiency heat dissipation and precise temperature control are realized.

[0098] Through the setting of the pulling module, the automation and high repeatability of the opening and closing of the device are realized.

[0099] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the same; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that not every example contains only one independent technical solution, and in the absence of solution conflicts, various technical features mentioned in each example can be combined in any manner to form other embodiments that can be understood by those skilled in the art.

[0100] In addition, modifications can be made to the technical solutions described in the foregoing examples, or equivalent replacements can be made to part of the technical features, without departing from the scope of the present application, so that the essence of the corresponding technical solution does not deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A microfluidic chip clamping type temperature control device, comprising a first temperature control module and a second temperature control module oppositely arranged along a first direction, characterized in that: the second temperature control module is connected with the first temperature control module through at least one linear bearing and a guide shaft passing through the linear bearing, so that the second temperature control module can move relative to the first temperature control module in the first direction to make the two close to or away from each other, thereby clamping or releasing the microfluidic chip; the device further comprises a first elastic member, which applies an elastic force to the second temperature control module to move it towards the first temperature control module; and a balancing mechanism is further included for providing an anti-tilting force to balance the gravitational tilting caused by the single-side suspension state of the second temperature control module connected to the first temperature control module and maintain the parallel relationship between the second temperature control module and the first temperature control module; the balancing mechanism comprises a fixed block fixedly arranged, a balancing guide rod connected with the second temperature control module, and a second elastic member acting between the fixed block and the second temperature control module; the balancing guide rod passes through the fixed block and is arranged in parallel with the guide shaft, when the second temperature control module moves along the guide shaft, the second temperature control module moves along the balancing guide rod or the second temperature control module and the balancing guide rod move relative to the fixed block together; the resultant force of the elastic force of the first elastic member acting on the second temperature control module is greater than the resultant force of the pressure of the second elastic member acting on the second temperature control module.

2. The microfluidic chip clamp-on temperature control device of claim 1, wherein: the first elastic member is a compression spring sleeved on the guide shaft.

3. The microfluidic chip clamp-on thermal control device of claim 1, wherein: the number of linear bearings and guide shafts is multiple, and each guide shaft is arranged in parallel. 4.The microfluidic chip clamping type temperature control device according to claim 1, characterized in that: the first temperature control module comprises a first air duct, a first heat conduction block, a first Peltier and a first cooling fan, the first cooling fan is arranged at one end of the first air duct, a first air vent is arranged at the other end of the first air duct, the first heat conduction block is arranged at one side of the first air duct, and the first Peltier is arranged between the first heat conduction block and the first air duct; the second temperature control module comprises a second air duct, a second heat conduction block, a second Peltier and a second cooling fan, the second cooling fan is arranged at one end of the second air duct, a second air vent is arranged at the other end of the second air duct, the second heat conduction block is arranged at one side of the second air duct, and the second Peltier is arranged between the second heat conduction block and the second air duct; after the second temperature control module is connected with the first temperature control module, the first cooling fan and the second cooling fan are arranged in opposite directions. 5.The microfluidic chip clamping type temperature control device according to claim 4, characterized in that: the first temperature control module further comprises a first heat sink, the first heat sink serves as a side wall of the first air duct towards the second temperature control module or is arranged on the side wall of the first air duct towards the second temperature control module, and the first Peltier is arranged on the first heat sink. The second temperature control module further comprises a second heat sink, which is arranged on or towards the side wall of the second air duct towards the first temperature control module, and the second Peltier device is arranged on the second heat sink.

6. The microfluidic chip clamping type temperature control device according to claim 4, characterized in that: The first heat conduction block is provided with a plurality of first bosses for contacting one side of the plurality of reaction chambers of the microfluidic chip; The second heat conduction block is provided with a plurality of second bosses for contacting the other side of the plurality of reaction chambers of the microfluidic chip.

7. The microfluidic chip clamp-on thermal control device of claim 1, wherein: The first temperature control module and the second temperature control module are arranged staggered in a second direction perpendicular to the first direction, so that a part of the first temperature control module protrudes from the second temperature control module in the second direction, forming a first gap space, and at the same time, a part of the second temperature control module protrudes from the first temperature control module in the second direction, forming a second gap space.

8. The microfluidic chip clamping type temperature control device according to any one of claims 1 to 7, characterized in that: Further comprising a pulling-apart module, the pulling-apart module comprising a driving unit and an actuating part, the actuating part being configured to selectively abut against or be separated from the second temperature control module; When abutting, the second temperature control module is pulled away from the first temperature control module against the elastic force of the first elastic member; When separated, the second temperature control module clamps the microfluidic chip under the elastic force of the first elastic member.

9. The microfluidic chip clamp-on temperature control device of claim 8, wherein: The pulling-apart module further comprises a zero position detection unit for detecting whether the actuating part reaches an initial position for pulling the second temperature control module.

10. The microfluidic chip clamp-on temperature control device of claim 9, wherein: The zero position detection unit comprises a zero position limiting piece arranged on the actuating part and a photoelectric switch arranged at a fixed position.

11. A method of controlling a microfluidic chip clamp-type temperature control device for controlling a clamp-type temperature control device according to any one of claims 8 to 10, characterized in that, The method comprises the following steps: controlling the driving unit to drive the actuating part to abut against the second temperature control module and continue to move to pull the second temperature control module away from the first temperature control module against the elastic force of the first elastic member, forming a released state; putting in or taking out the microfluidic chip; controlling the driving unit to drive reversely, so that the actuating part moves towards the first temperature control module, the second temperature control module is automatically reset under the elastic force of the first elastic member, and after the second temperature control module contacts the microfluidic chip, the actuating part continues to move until the actuating part is separated from the second temperature control module, so that the second temperature control module clamps the microfluidic chip under the elastic force of the first elastic member.

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