Electronic device

Abstract

The invention provides electronic equipment. The electronic equipment comprises a shell, a heat source device, a heat conduction assembly and a heat dissipation assembly. An accommodating space is defined by the shell, the heat source device, the heat conduction assembly and the heat dissipation assembly are all arranged in the accommodating space, the heat conduction assembly comprises a liquid cooling membrane, the two ends of the liquid cooling membrane are connected with the heat source device and the heat dissipation assembly respectively, and the liquid cooling membrane is arranged in the accommodating space. The liquid cooling membrane is used for conducting heat of the heat source device to the heat dissipation assembly. According to the electronic equipment provided by the embodiment of the invention, the heat of the heat source device is conducted to the heat dissipation assembly by using an active heat conduction device such as the liquid cooling diaphragm, and then the heat is dissipated to the environment outside the electronic equipment through the heat dissipation assembly, so that the heat dissipation structure of the electronic equipment has the characteristics of short heat conduction path and high heat conduction efficiency; and reliable heat dissipation conditions are provided for high-power operation of the electronic equipment, so that the use experience of the electronic equipment product is improved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation structures for electronic devices, specifically to an electronic device. Background Technology

[0002] Currently, smartphones and other electronic devices commonly employ passive cooling solutions using high-performance graphite sheets and vapor chambers (VCs). However, as the power consumption of chips and other power devices increases, passive cooling is gradually becoming insufficient to meet cooling requirements, leading to a deterioration in user experience. To improve passive cooling, some smartphones have added internal micro-fans for air cooling. However, while conventional air cooling solutions improve cooling efficiency to some extent, their performance remains poor and cannot meet the cooling requirements of electronic devices operating under high power conditions. Summary of the Invention

[0003] This application provides an electronic device, which includes a housing, a heat source device, a heat conduction component, and a heat dissipation component. The housing encloses a receiving space, and the heat source device, the heat conduction component, and the heat dissipation component are all disposed within the receiving space. The heat conduction component includes a liquid cooling film, and the two ends of the liquid cooling film are respectively connected to the heat source device and the heat dissipation component. The liquid cooling film is used to conduct the heat from the heat source device to the heat dissipation component.

[0004] The electronic device provided in this application embodiment utilizes a liquid-cooled film, an active heat conduction device, to conduct heat from the heat source device to the heat dissipation component, which then dissipates the heat to the environment outside the electronic device. The heat dissipation structure of this electronic device features a short heat conduction path and high thermal conductivity, providing reliable heat dissipation conditions for the high-power operation of the electronic device, thereby improving the user experience of the electronic device product. Attached Figure Description

[0005] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0006] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the electronic device of this application; Figure 2 yes Figure 1 A schematic cross-sectional view of the electronic device along line AA in the embodiment; Figure 3 yes Figure 1 A simplified schematic diagram of the structure of heat dissipation-related components of the electronic device in the embodiment; Figure 4 This is a perspective structural schematic diagram of an embodiment of the liquid cooling film of this application; Figure 5 This is a cross-sectional structural schematic diagram of an embodiment of the liquid-cooled diaphragm of this application; Figure 6 This is a cross-sectional structural schematic diagram of another embodiment of the electronic device of this application; Figure 7 This is a cross-sectional structural schematic diagram of another embodiment of the electronic device of this application; Figure 8 This is a schematic block diagram of the structural composition of an embodiment of the electronic device of this application. Detailed Implementation

[0007] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0008] The terms "first," "second," and "third" used in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movement of components in a specific posture (as shown in the figures). If the specific posture changes, the directional indication will also change accordingly. The terms "comprising" and "having," and any variations thereof, in the embodiments of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or components inherent to these processes, methods, products, or devices.

[0009] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0010] As used herein, “electronic device” (or simply “terminal”) includes, but is not limited to, means configured to receive / transmit communication signals via a wired connection (such as via a Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), Digital Cable, Direct Cable Connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, Wireless Local Area Network (WLAN), Digital Television Network such as DVB-H, Satellite Network, AM-FM Broadcast Transmitter, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a “wireless communication terminal,” a “wireless terminal,” or a “mobile terminal.” Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephone with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, notepads, calendars, and / or Global Positioning System (GPS) receivers; and conventional laptop and / or handheld receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0011] Please refer to the following: Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the overall structure of an embodiment of the electronic device of this application. Figure 2 yes Figure 1 The embodiment shows a cross-sectional view of the electronic device along line AA. It should be noted that the electronic device in this application may include mobile phones, tablets, laptops, wearable devices, and other electronic devices with heat source devices that require active heat dissipation. This electronic device includes, but is not limited to, the following structures: housing 100, heat source device 200, heat-conducting component 300, heat dissipation component 400, and display screen 500.

[0012] Specifically, in this embodiment, the housing 100 may include a middle frame 110 and a rear cover 120. The middle frame 110 may include an integrally structured middle plate 111 and a side frame 112. The middle plate 111 includes a first surface 1111 and a second surface 1112 disposed opposite to each other. The display screen 500 is fixedly connected to the side frame 112 and is disposed on one side of the second surface 1112 of the middle plate 111. One side of the first surface 1111 of the middle plate 111 and the rear cover 120 cooperate to form an accommodating space 1000. The heat source device 200, the heat conduction component 300, and the heat dissipation component 400 are all disposed within the accommodating space 1000.

[0013] Please refer to the following: Figure 2 and Figure 3 , Figure 3 yes Figure 1The schematic diagram of the heat dissipation-related devices in this embodiment is shown below. The heat-conducting component 300 in this embodiment includes a liquid-cooled film 310. Both ends of the liquid-cooled film 310 are connected to the heat source device 200 and the heat dissipation component 400, respectively. The liquid-cooled film 310 is used to conduct heat from the heat source device 200 to the heat dissipation component 400. In this embodiment, the heat source device 200 can be a heat-generating chip (SOC) on the control circuit board 600. In some other embodiments, the heat source device 200 can also be a camera module, battery, etc., which are not specifically limited here. The heat source device 200 and the liquid-cooled film 310 can be bonded together using a first thermally conductive interface material 203.

[0014] Optionally, please refer to the following as well. Figure 4 and Figure 5 , Figure 4 This is a perspective structural schematic diagram of an embodiment of the liquid cooling film of this application. Figure 5 This is a cross-sectional structural schematic diagram of an embodiment of the liquid cooling film of this application. The liquid cooling film 310 in this embodiment may include an upper film 311, a lower film 312, and a supporting film 313. The supporting film 313 is sandwiched between the upper film 311 and the lower film 312. The upper film 311, the lower film 312, and the supporting film 313 together form a plurality of interconnected flow channels 3100. The flow channels 3100 are filled with a liquid heat dissipation medium (not shown in the figure). The liquid heat dissipation medium may be a liquid with good thermal conductivity and fluidity, such as silicone oil, vegetable oil, water, ethanol (also known as alcohol), or glycerol.

[0015] The upper membrane 311 and the lower membrane 312 can be made of PET-based water and oxygen barrier membranes, or composites of metal and plastic materials, such as copper and its alloys, aluminum and its alloys, stainless steel, etc., and composites of PI (Polyimide), PET (Polyethylene terephthalate, commonly known as polyester resin), PEEK (Polyetheretherketone), etc., which need to have both thermal conductivity and structural strength. Optionally, in this embodiment, both the upper membrane 311 and the lower membrane 312 can be made of metal materials, such as copper and its alloys, aluminum and its alloys, stainless steel, etc.

[0016] The supporting diaphragm 313 is located between the upper diaphragm 311 and the lower diaphragm 312, serving to support and form the flow channel 3100. The supporting diaphragm 313 can also be made of materials such as metal, alloy, or thermally conductive resin. To ensure heat dissipation, the height of the flow channel 3100 in the overall diaphragm thickness direction must be ≥80μm, and the permeability of the upper diaphragm 311 and lower diaphragm 312 to water vapor must be ≤1 g / m³. 2 / 24hr.

[0017] Alternatively, please continue reading Figure 4 and Figure 5 In this embodiment, the liquid-cooled diaphragm 310 also includes a piezoelectric micropump 314, which is connected to the flow channel 3100 and is used to drive the flow circulation of the liquid heat dissipation medium within the flow channel 3100. The detailed structure of the piezoelectric micropump 314 is within the understanding of those skilled in the art and will not be described in detail here.

[0018] In this embodiment, a liquid-cooled film 310 is used for heat conduction. Compared with conventional VC and heat pipe, it is not limited by the power of the heat source. Conventional VC and heat pipe fail when the power of the heat source exceeds Qmax (Qmax refers to the water at the heat source evaporates rapidly when the power is too high, and the capillary force is insufficient to drive the water in the cold zone to flow back, resulting in the heat source area drying out and the VC performance deteriorating sharply).

[0019] Alternatively, please continue reading Figure 2 and Figure 3 In this embodiment, the heat dissipation assembly 400 includes a heat sink 410 and a cooling fan 420. The heat sink 410 is thermally connected to the liquid cooling film 310, specifically through a second thermally conductive interface material 304. The cooling fan 420 is disposed adjacent to the heat sink 410. The function of the cooling fan 420 is to blow heat into the environment, reducing the temperature of the heat source and the electronic device casing. Please continue reading... Figure 2 In this embodiment, the rear cover 120 is provided with an air inlet 121, and the side frame 112 is provided with an air outlet 1120. A cooling fan 420 is provided corresponding to the air inlet 121, and a heat sink 410 is disposed between the air outlet 1120 and the cooling fan 420. The cooling fan 420 is used to blow the hot air on the heat sink 410 out of the air outlet 1120. Optionally, the cooling fan 420 in this embodiment can be a miniature centrifugal fan, a piezoelectric fan, or an axial fan, etc.

[0020] The function of the heat sink 410 is to increase the heat dissipation area. The heat sink 410 can have a finned structure, such as a substrate plus fins. The fins can be conventional sheets, needle-shaped, or other irregularly shaped fins. The key is that the fin orientation is parallel to the airflow channel to reduce system impedance (wind resistance). A substrate is not necessary; to reduce the overall thickness, the fins can be directly bonded to the liquid cooling film 310. In the embodiments of this application, the heat sink 410 can be connected to the liquid cooling film 310 using double-sided adhesive, interface material 304, brazing, or other processes. The material of the heat sink 410 can be aluminum, copper, graphite, high thermal conductivity polymers, etc. Detailed structural features of the heat sink 410 are within the understanding of those skilled in the art and will not be elaborated here.

[0021] The electronic device provided in this application embodiment utilizes a liquid-cooled film, an active heat conduction device, to conduct heat from the heat source device to the heat dissipation component, which then dissipates the heat to the environment outside the electronic device. The heat dissipation structure of this electronic device features a short heat conduction path and high thermal conductivity, providing reliable heat dissipation conditions for the high-power operation of the electronic device, thereby improving the user experience of the electronic device product.

[0022] Please see Figure 6 , Figure 6 This is a cross-sectional structural diagram of another embodiment of the electronic device of this application. The electronic device in this embodiment may also include the following structures: housing 100, heat source device 200, heat conduction component 300, heat dissipation component 400, and display screen 500.

[0023] The housing 100 may include a middle frame 110 and a rear cover 120. The middle frame 110 includes an integral middle plate 111 and a side frame 112. The middle plate 111 includes a first surface 1111 and a second surface 1112 disposed opposite to each other. The display screen 500 is fixedly connected to the side frame 112 and is disposed on one side of the second surface 1112 of the middle plate 111. One side of the first surface 1111 of the middle plate 111 and the rear cover 120 cooperate to form an accommodating space 1000. The heat source device 200, the heat conduction component 300, and the heat dissipation component 400 are all disposed within the accommodating space 1000.

[0024] The heat-conducting component 300 in this embodiment includes a liquid-cooled film 310. Both ends of the liquid-cooled film 310 are connected to the heat source device 200 and the heat dissipation component 400, respectively. The liquid-cooled film 310 is used to conduct heat from the heat source device 200 to the heat dissipation component 400. In this embodiment, the heat source device 200 can be a heat-generating chip (SOC) on the control circuit board 600. In some other embodiments, the heat source device 200 can also be a camera module, a battery, etc., which are not specifically limited here. The liquid-cooled film 310 is attached to the first surface 1111 of the middle plate 111.

[0025] The structure of the liquid cooling film 310 in this embodiment can be referred to in the previous embodiment. Figure 4 and Figure 5This system can also include an upper diaphragm 311, a lower diaphragm 312, a supporting diaphragm 313, and a piezoelectric micropump 314. The supporting diaphragm 313 is sandwiched between the upper diaphragm 311 and the lower diaphragm 312. The upper diaphragm 311, the lower diaphragm 312, and the supporting diaphragm 313 together form a flow channel 3100, which is filled with a liquid heat dissipation medium. This liquid heat dissipation medium can be a liquid with good thermal conductivity and fluidity, such as silicone oil, vegetable oil, water, ethanol (also known as alcohol), or glycerol. The supporting diaphragm 313, located between the upper diaphragm 311 and the lower diaphragm 312, serves to support and form the flow channel 3100. The supporting diaphragm 313 can also be made of materials such as metal, alloy, or thermally conductive resin. The piezoelectric micropump 314 is connected to the flow channel 3100 and is used to drive the flow and circulation of the liquid heat dissipation medium within the flow channel 3100.

[0026] The heat dissipation assembly 400 in this embodiment includes a heat sink 410 and a cooling fan 420. The heat sink 410 is thermally connected to the liquid cooling film 310, specifically through an interface material 304. The cooling fan 420 is arranged adjacent to the heat sink 410. The function of the cooling fan 420 is to blow heat into the environment, reducing the temperature of the heat source and the electronic device casing. Please continue reading for further details. Figure 6 In this embodiment, the rear cover 120 is provided with an air inlet 121, and the side frame 112 is provided with an air outlet 1120. A corresponding air inlet 121 is provided for the cooling fan 420. The heat sink 410 is located between the air outlet 1120 and the cooling fan 420. The cooling fan 420 is used to blow hot air from the heat sink 410 out through the air outlet 1120. Optionally, the cooling fan 420 in this embodiment can be a miniature centrifugal fan, a piezoelectric fan, or an axial fan, etc. The function of the heat sink 410 is to increase the heat dissipation area. The structure of the heat sink 410 can be a finned structure, for example, a substrate + fins. The fins can be conventional sheets, needle-shaped fins, or other irregularly shaped fins. The key is that the orientation of the fins is parallel to the airflow channel to reduce system impedance (wind resistance). The substrate is not necessary; to reduce the overall thickness, the fins can also be directly bonded to the liquid cooling film 310.

[0027] In the embodiments of this application, the heat conduction component 300 further includes an active heat conduction device 320, which is disposed between the heat sink 410 and the liquid cooling film 310. The active heat conduction device 320 may include any one of a semiconductor cooler and a phase change material heat sink.

[0028] Thermoelectric Cooler (TEC) is made using the Peltier effect of semiconductor materials. The Peltier effect refers to the phenomenon where, when a direct current passes through a thermocouple composed of two semiconductor materials, one end absorbs heat and the other releases heat. Heavily doped N-type and P-type bismuth telluride are mainly used as semiconductor materials in TECs. Bismuth telluride elements are connected in series and generate heat in parallel. A TEC consists of several P-type and N-type pairs (groups) connected by electrodes and sandwiched between two ceramic electrodes. When current flows through the TEC, the heat generated by the current is transferred from one side of the TEC to the other, creating a "hot" side and a "cold" side. This is the heating and cooling principle of the TEC.

[0029] Phase change material heat sinks are a technology that utilizes the absorption or release of latent heat during the phase change process of materials to achieve efficient heat dissipation. The detailed features of this part are within the understanding of those skilled in the art and will not be described in detail here.

[0030] The electronic device in this embodiment incorporates an active heat transfer device (TEC) in the thermally conductive components. From a heat dissipation perspective, the heat transfer capacity of the liquid cooling film is Q = C * m * ΔT, where C is the specific heat capacity of the working fluid in the liquid cooling plate, m is the mass flow rate, and ΔT is the temperature difference of the working fluid flowing through the heat source area. It is easy to see that the larger ΔT is, the greater the heat transfer capacity of the liquid cooling film. Therefore, the TEC can drastically reduce the temperature of the working fluid flowing out of the heat source through the thermoelectric effect, increasing ΔT. Thus, the introduction of the TEC can significantly improve the heat transfer capacity of the liquid cooling film, thereby reducing the chip temperature and the temperature of the outer casing (screen, back cover) of the chip projection area. This TEC requires a maximum heat dissipation power Qcmax ≥ 2 W and a maximum temperature difference ΔTmax ≥ 30 ℃.

[0031] In this embodiment, the electronic device utilizes a liquid-cooled film to rapidly conduct heat from the heat source device (such as a System-on-a-Chip) to the heat sink via a thermal interface material (TEC), and then a fan convects the heat from the heat sink into the environment. The main heat transfer path is: heat source device → first thermally conductive interface material → liquid-cooled film → TEC → heat sink → fan → airflow. The large amount of heat generated by the heat source device (taking the System-on-a-Chip as an example) during operation is conducted to the liquid-cooled film through the first thermally conductive interface material. The liquid-cooled film rapidly conducts the heat from the System-on-a-Chip to the TEC, then to the heat sink, and finally the fan blows the heat into the environment.

[0032] In this embodiment, the electronic device has a TEC (thermoelectric cooling device) between the heat sink and the liquid cooling film. Through the thermoelectric effect, the temperature of the working fluid flowing out of the heat source is drastically reduced, increasing ΔT. Therefore, the introduction of the TEC can significantly improve the heat transfer capacity of the liquid cooling film, thereby reducing the chip temperature and the temperature of the outer casing (screen, back cover) of the chip projection area.

[0033] Please see Figure 7 , Figure 7 This is a cross-sectional structural diagram of another embodiment of the electronic device of this application. In this embodiment, a heat insulation material layer 700 is provided between the liquid cooling film 310 and the middle frame 110. The function of the heat insulation material layer 700 is to reduce the heat transfer between the liquid cooling film 310 and the middle frame 110, increase the heat exchange capacity of the TEC and the heat sink, and further improve the heat dissipation efficiency. The heat insulation material layer 700 can be a low thermal conductivity material such as double-sided adhesive, hot melt adhesive, or pressure-sensitive adhesive to bond the liquid cooling film 310 to the surface of the middle frame 110. The heat insulation material layer 700 can also be an aerogel heat insulation film structure with adhesive layers on both sides. Other materials and structural forms of the heat insulation material layer 700 are within the understanding of those skilled in the art and will not be listed or described in detail here. For better heat insulation, the thermal conductivity of the heat insulation material layer 700 is required to be less than or equal to 0.4 W / mK.

[0034] In this embodiment, by providing a heat insulation material layer between the liquid cooling film and the middle frame, the heat transfer between the liquid cooling film and the middle frame can be reduced, and the heat exchange of the TEC and the heat sink can be increased, thereby further improving the heat dissipation efficiency of the electronic device.

[0035] Please see Figure 8 , Figure 8 This is a schematic block diagram illustrating the structural composition of an embodiment of the electronic device of this application. The electronic device can be a mobile phone, tablet computer, laptop computer, or wearable device, etc. This embodiment uses a mobile phone as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940, a sensor 950, an audio circuit 960, a Wi-Fi module 970, a processor 980 (which can be a heat source device as described in the previous embodiment), and a power supply 990. The RF circuit 910, memory 920, input unit 930, display unit 940, sensor 950, audio circuit 960, and Wi-Fi module 970 are all connected to the processor 980; the power supply 990 provides power to the entire electronic device.

[0036] Specifically, the RF circuit 910 is used to transmit and receive signals; the memory 920 is used to store data and instruction information; the input unit 930 is used to input information, and may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes infrared sensors, laser sensors, etc., used to detect user proximity signals, distance signals, etc.; the speaker 961 and the microphone 962 are connected to the processor 980 through the audio circuit 960 for transmitting and receiving sound signals; the Wi-Fi module 970 is used to receive and transmit Wi-Fi signals; and the processor 980 is used to process the data information of the electronic device. The specific structural features of the electronic device will not be described in detail here, as is understood by those skilled in the art.

[0037] The electronic device provided in this application embodiment utilizes a liquid-cooled film, an active heat conduction device, to conduct heat from the heat source device to the heat dissipation component, which then dissipates the heat to the environment outside the electronic device. The heat dissipation structure of this electronic device features a short heat conduction path and high thermal conductivity, providing reliable heat dissipation conditions for the high-power operation of the electronic device, thereby improving the user experience of the electronic device product.

[0038] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or direct or indirect application in other related technical fields, are similarly included in the patent protection scope of this application.

Claims

1. An electronic device, comprising: The electronic device comprises a housing, a heat source device, a heat conduction assembly, and a heat dissipation assembly; the housing is provided with an accommodating space, the heat source device, the heat conduction assembly, and the heat dissipation assembly are arranged in the accommodating space, the heat conduction assembly comprises a liquid cooling diaphragm, two ends of the liquid cooling diaphragm are connected with the heat source device and the heat dissipation assembly respectively, and the liquid cooling diaphragm is used for conducting heat of the heat source device to the heat dissipation assembly.

2. The electronic device of claim 1, wherein, An internal part of the liquid cooling diaphragm is provided with a flow channel, and the flow channel is filled with a liquid heat dissipation medium.

3. The heat-dissipating protective case according to claim 2, wherein, The liquid cooling diaphragm further comprises a piezoelectric micro-pump, the piezoelectric micro-pump is communicated with the flow channel, and is used for driving the liquid heat dissipation medium in the flow channel to flow and circulate.

4. The electronic device of claim 1, wherein, The heat conduction assembly further comprises an active heat conduction device, and the active heat conduction device is arranged between the heat dissipation assembly and the liquid cooling diaphragm.

5. The electronic device of claim 4, wherein, The active heat conduction device comprises any one of a semiconductor refrigerator and a phase change material heat sink.

6. The electronic device of claim 4, wherein, The heat dissipation assembly comprises a heat sink and a heat dissipation fan, the active heat conduction device is arranged between the heat sink and the liquid cooling diaphragm, and the heat dissipation fan is arranged adjacent to the heat sink.

7. The electronic device of claim 1, wherein, The housing comprises a middle frame, and the liquid cooling diaphragm is arranged in close contact with the middle frame.

8. The electronic device of claim 7, wherein, A heat insulation material layer is arranged between the liquid cooling diaphragm and the middle frame.

9. The electronic device of claim 8, wherein, The thermal conductivity of the heat insulation material layer is less than or equal to 0.4 W / mK.

10. The electronic device of claim 1, wherein, The heat source device and the liquid cooling diaphragm are connected through a heat conduction interface material.

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