Distributed thermal management method and system based on flexible heat conduction belt and thermal routing

Abstract

The invention provides a distributed thermal management method and system based on a flexible heat conduction belt and thermal routing, and relates to the technical field of vehicle-mounted thermal management, the method comprises the steps that temperature information and vehicle operation conditions in a to-be-tested vehicle are collected, a vehicle-mounted thermal state atlas is constructed according to the temperature information, the to-be-tested vehicle comprises a plurality of thermal nodes, and the vehicle-mounted thermal state atlas is constructed according to the thermal nodes; any two adjacent hot nodes are connected through a flexible heat conduction belt, and the hot nodes comprise a heat source node and a heat dissipation node; obtaining a thermal load state of each thermal node in the to-be-tested vehicle according to the vehicle operation condition and the temperature information; generating a thermal routing configuration strategy based on the thermal load state and the vehicle-mounted thermal state map; and adjusting a heat conduction path between the heat source node and the heat dissipation node in the to-be-tested vehicle according to the thermal routing configuration strategy. The method and the device are beneficial to improving the accuracy of thermal management decisions.

Description

Technical Field

[0001] This invention relates to the field of vehicle thermal management technology, and in particular to a distributed thermal management method and system based on flexible conductive tape and thermal routing. Background Technology

[0002] In vehicle systems, power batteries, electric drive systems, power electronic devices, and on-board computing units are typically spatially dispersed and operate under significantly different conditions. Their heat generation exhibits the following characteristics: multiple heat sources coexist and are discretely distributed; thermal load dynamically changes with driving conditions and ambient temperature; limited vehicle space and complex structures lead to vibration and deformation; traditional centralized cooling (such as a single cooling loop or large-size heat dissipation structures) suffers from limited layout and slow response. Existing vehicle thermal management solutions largely rely on liquid cooling pipelines or fixed heat conduction structures, which are prone to problems such as localized overheating, high energy consumption, and increased system complexity.

[0003] Chinese patent CN120481605A discloses a vehicle thermal management method, device, equipment, medium, and product. The method includes first determining the current driving scenario based on the vehicle's current driving data. Then, based on the current driving data, an initial thermal management sub-strategy is determined from a first thermal management strategy corresponding to the current driving scenario. Next, based on the current driving data and the initial thermal management sub-strategy, a target thermal management sub-strategy is determined. Finally, the target thermal management sub-strategy is executed to perform thermal management on the vehicle. However, the above solution focuses on prioritizing the identification and control dimensions of the driving scenario at the vehicle level in thermal management decision-making, failing to accurately identify and prioritize key heat source nodes with high heat loads, resulting in insufficient accuracy in thermal management decisions. Therefore, it is essential to provide a distributed thermal management method and system based on flexible conductive tape and thermal routing to improve the accuracy of thermal management decisions. Summary of the Invention

[0004] In view of this, the present invention proposes a distributed thermal management method and system based on flexible conductive tape and thermal routing.

[0005] This invention provides a distributed thermal management method based on flexible conductive tape and thermal routing, the method comprising: Temperature information and vehicle operating conditions in the vehicle under test are collected, and an on-board thermal state map is constructed based on the temperature information. The vehicle under test includes multiple thermal nodes, and any two adjacent thermal nodes are connected by a flexible heat conduction cable. The thermal nodes include heat source nodes and heat dissipation nodes. Based on the vehicle operating conditions and the temperature information, the thermal load status of each thermal node in the vehicle under test is obtained; Based on the heat load state and the vehicle thermal state map, a heat routing configuration strategy is generated, wherein the heat routing configuration strategy is used to determine the heat conduction path, conduction direction and conduction intensity in the flexible heat-conducting tape; The heat conduction path between the heat source node and the heat dissipation node in the vehicle under test is adjusted according to the heat routing configuration strategy.

[0006] Based on the above technical solutions, preferably, the step of constructing the vehicle thermal state map based on the temperature information specifically includes: Multiple heat source nodes and multiple heat dissipation nodes in the vehicle under test are modeled, and the on-board thermal state topology relationship corresponding to the heat source nodes and heat dissipation nodes is constructed. The temperature information is mapped to the corresponding heat source node and heat dissipation node to obtain the node temperature of the heat source node and the heat dissipation node, wherein the temperature information includes the first node temperature corresponding to the heat source node and the second node temperature corresponding to the heat dissipation node; By associating the node temperature with the vehicle thermal state topology, an vehicle thermal state map is constructed to characterize the overall vehicle thermal distribution.

[0007] Based on the above technical solutions, preferably, the step of associating the node temperature with the vehicle thermal state topology to construct an vehicle thermal state map characterizing the overall vehicle thermal distribution state specifically includes: Establish node attribute structures for the heat source node and the heat dissipation node respectively, and bind the node temperature as a node attribute to the corresponding heat node; Based on the vehicle thermal state topology, the node temperature difference value corresponding to adjacent thermal nodes with thermal coupling relationship is calculated, wherein the node temperature difference value is used as an edge attribute and associated with the thermal coupling relationship in the vehicle thermal state topology. The node temperature attributes and the thermal coupling relationship between nodes are integrated to form an on-board thermal state map that includes node attributes and edge attributes.

[0008] More preferably, the step of obtaining the thermal load status of each heat source node in the vehicle under test based on the vehicle operating conditions and the temperature information specifically includes: The current temperature of each hot node and the rate of temperature change within a preset time window are obtained, and the vehicle operating condition parameters corresponding to the vehicle under test are collected. The vehicle operating condition parameters include vehicle driving status parameters and power parameters corresponding to each hot node. If the current temperature of the first hot node is greater than a preset temperature threshold or the temperature change rate of the first hot node is greater than a preset change rate threshold, and the vehicle operating condition parameters indicate a high power condition, then the first hot node is marked as a high heat load state. If the current temperature of the first hot node is greater than a preset temperature threshold or the temperature change rate of the first hot node is greater than a preset change rate threshold, and the vehicle operating condition parameters are characterized as medium power conditions, then the first hot node is marked as a medium heat load state. If the first hot node is not marked as either the high heat load state or the medium heat load state, then the first hot node is marked as the low heat load state.

[0009] More preferably, the step of generating a thermal routing configuration strategy based on the thermal load state and the vehicle thermal state map specifically includes: Based on the heat load status of each hot node and the node temperature difference between each adjacent hot node in the vehicle thermal state map, target heat source nodes that are in a high heat load state and / or have an excessively rapid temperature rise trend are marked. Based on the vehicle thermal state map and the topology of the flexible heat conduction tape and the heat dissipation node, candidate heat dissipation nodes that are thermally coupled to the target heat source node are marked, and candidate heat conduction paths are connected between the target heat source node and each candidate heat dissipation node. Based on the path thermal resistance of each candidate heat conduction path, the temperature of intermediate heat nodes, and the path influence factor of the candidate heat conduction path on other heat source nodes, the path evaluation index of each candidate heat conduction path is calculated, and the target heat conduction path set is constructed. Assign path priorities to each heat conduction path in the target heat conduction path set to generate a heat routing configuration strategy.

[0010] More preferably, based on the vehicle-mounted thermal state map and the topology of the flexible conductive tape and the heat dissipation node, candidate heat dissipation nodes thermally coupled to the target heat source node are marked, specifically including: Based on the vehicle thermal state map, a set of hot nodes that have a direct thermal connection with the target heat source node is retrieved, and all hot nodes of the type of heat dissipation node are filtered in the set of hot nodes to construct a first candidate heat dissipation node set. If the target heat source node does not have a directly connected heat dissipation node, or if the first candidate heat dissipation node set does not meet the heat dissipation requirements, then based on the thermal coupling relationship of the vehicle thermal state map extending outward from the target heat source node by a preset number of layers, a heat dissipation node that forms thermal coupling with the target heat source node through at least one intermediate heat node is determined, and a second candidate heat dissipation node set is constructed. Based on the topology of the flexible heat-conducting tape and the heat dissipation node, the reachability of the first candidate heat dissipation node set and the second candidate heat dissipation node set is determined, and heat dissipation nodes that have a configurable connection relationship with the target heat source node through the flexible heat-conducting tape are retained, and candidate heat dissipation nodes are constructed.

[0011] More preferably, the step of assigning path priorities to each heat conduction path in the target heat conduction path set to generate a heat routing configuration strategy specifically includes: Normalize the path thermal resistance, intermediate thermal node temperature and path influence factor corresponding to each target heat conduction path to obtain standardized path index values ​​corresponding to each target heat conduction path. Based on the standardized path index values ​​of each target heat conduction path, a comprehensive path score is constructed, and each target heat conduction path is sorted according to the comprehensive path score to obtain a path priority sequence. A heat routing configuration strategy is then selected based on the path priority sequence.

[0012] A second aspect of this application provides a distributed thermal management system based on flexible conductive tape and heat routing. The distributed thermal management system includes a data acquisition module, a data processing module, and a path adjustment module. The data acquisition module is used to collect temperature information and vehicle operating conditions in the vehicle under test, and to construct an on-board thermal state map based on the temperature information. The vehicle under test includes multiple thermal nodes, and any two adjacent thermal nodes are connected by a flexible heat conduction cable. The thermal nodes include heat source nodes and heat dissipation nodes. The data processing module is used to obtain the thermal load status of each thermal node in the vehicle under test according to the vehicle operating conditions and the temperature information, and generate a thermal routing configuration strategy based on the thermal load status and the vehicle thermal status map. The thermal routing configuration strategy is used to determine the heat conduction path, conduction direction and conduction intensity in the flexible heat conduction tape. The path adjustment module is used to adjust the heat conduction path between the heat source node and the heat dissipation node in the vehicle under test according to the heat routing configuration strategy.

[0013] A third aspect of this application provides an electronic device including a processor, a memory, a user interface, and a network interface, wherein the memory is used to store instructions, the user interface and the network interface are used to communicate with other devices, and the processor is used to execute the instructions stored in the memory.

[0014] A fourth aspect of this application provides a non-transitory computer-readable storage medium having a computer program stored thereon, the computer program being executed by a processor to implement the steps of a distributed thermal management method based on flexible heat conduction tape and thermal routing.

[0015] The distributed thermal management method and system based on flexible conductive tape and thermal routing provided by this invention have the following advantages over existing technologies: (1) By abstracting the vehicle under test into an on-board thermal state map composed of multiple hot nodes, and using flexible conductive tape to connect adjacent hot nodes, distributed management of different heat source nodes and heat dissipation nodes is realized, avoiding the problems of coarse control and slow response in traditional centralized thermal management. By comprehensively collecting vehicle operating conditions and multi-node temperature information, the on-board thermal state map is dynamically constructed, and the thermal load status of each hot node is obtained. This can comprehensively and in real time reflect the thermal distribution characteristics of the vehicle under different operating conditions, thereby improving the accuracy of thermal management decisions. Furthermore, a thermal routing configuration strategy is generated based on the thermal load status and the on-board thermal state map, which can be applied to the flexible conductive tape. The heat conduction path, direction, and intensity in the tropics are dynamically adjusted to ensure efficient heat transfer from high-heat-load heat source nodes to suitable heat dissipation nodes, avoiding local overheating or heat accumulation. Furthermore, by combining flexible heat-conducting tape with the heat routing system, the heat conduction path can be adaptively adjusted according to changes in vehicle operating conditions. This makes it suitable for various complex operating conditions and different vehicle structural layouts, enhancing the environmental adaptability of the thermal management system. By precisely controlling the heat flow direction and conduction intensity, ineffective or redundant heat conduction processes are reduced, improving heat dissipation efficiency and thus reducing reliance on traditional active cooling devices, ultimately lowering overall vehicle energy consumption.

[0016] (2) By prioritizing the search for heat dissipation nodes that have a direct thermal connection with the target heat source node in the vehicle thermal state map, and when the heat dissipation capacity is insufficient or there is no direct heat dissipation node, the heat dissipation nodes are introduced by extending outward along the thermal coupling relationship by a preset number of layers. This ensures sufficient heat dissipation resources while avoiding blindly expanding the search range. At the same time, the reachability is judged by combining the actual topology of the flexible heat conduction tape and the heat dissipation node. Only heat dissipation nodes that have a configurable connection with the target heat source node through the flexible heat conduction tape are retained. This effectively eliminates heat dissipation paths that are physically impossible or inefficient, so that the final candidate heat dissipation nodes meet the heat dissipation requirements and are practically feasible. This improves the accuracy, reliability and overall thermal management efficiency of thermal routing configuration and reduces the overheating risk of the target heat source node. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A flowchart illustrating the distributed thermal management method based on flexible conductive tape and thermal routing provided by this invention; Figure 2 This is a schematic diagram of the structure of the distributed thermal management system provided by the present invention; Figure 3 This is a schematic diagram of the structure of the electronic device provided by the present invention.

[0019] Explanation of reference numerals in the attached diagram: 1. Distributed thermal management system; 11. Data acquisition module; 12. Data processing module; 13. Path adjustment module; 2. Electronic equipment; 21. Processor; 22. Communication bus; 23. User interface; 24. Network interface; 25. Memory. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] This invention discloses a distributed thermal management method based on flexible conductive tape and heat routing, with reference to... Figure 1 The steps of this method include S1 to S4.

[0022] Step S1: Collect temperature information and vehicle operating conditions in the vehicle under test, and construct an on-board thermal state map based on the temperature information. The vehicle under test includes multiple thermal nodes, and any two adjacent thermal nodes are connected by a flexible heat conduction cable. The thermal nodes include heat source nodes and heat dissipation nodes.

[0023] In this step, hot nodes include battery modules or cells in the power battery system; electric drive systems, including motors, controllers, reducer housings, etc.; engines and their accessories; power electronic devices, such as OBCs, DC / DC converters, PDUs, etc.; heat dissipation components such as radiators, water tanks, condensers, cooling plates, etc.; connection structures on the vehicle body or frame used for laying flexible heat conduction cables; and key temperature measurement locations in the passenger compartment, such as air vents and representative measurement points inside the compartment. Each hot node is marked as a heat source node or a heat dissipation node according to its function and thermal characteristics.

[0024] To obtain temperature information for each of the aforementioned thermal nodes, temperature sensors are placed at the corresponding node locations or their adjacent areas. These temperature sensors include contact temperature sensors such as thermocouples, platinum resistance thermometers, and NTC / PTC thermistors; thin-film or strip temperature sensors attached to the housing surface or the connection points of the flexible conductive tape; non-contact temperature sensors such as infrared temperature sensors; and temperature detection units integrated into the battery management system (BMS), motor controller (MCU), or other control units. Each temperature sensor is electrically connected to the vehicle controller via a wiring harness or bus to transmit the acquired temperature signals to the vehicle controller.

[0025] In this embodiment, the vehicle controller collects temperature information from each hotspot according to a preset sampling period and preprocesses the collected raw temperature signals. The vehicle controller reads the output signals of each temperature sensor sequentially or in parallel according to a preset sampling period (e.g., 100 ms to 1 s). For hotspots with high temperature change rates (such as power electronic devices, exhaust systems, etc.), a higher sampling frequency can be used for monitoring.

[0026] When the temperature sensor outputs an analog signal, the analog voltage or current signal is converted into a digital quantity through a multiplex analog-to-digital converter module. When the temperature data is sent by electronic control units such as BMS and MCU through CAN bus, LIN bus or Ethernet, the vehicle controller receives the digitized temperature data through the corresponding communication interface.

[0027] The collected temperature data is preprocessed as follows: zero drift and sensitivity error are compensated according to the calibration parameters of the temperature sensor; moving average filtering, median filtering or low-pass filtering algorithms are used to reduce random noise and instantaneous spikes; when the temperature value of a certain measuring point exceeds the reasonable range or does not change within several sampling periods, it is marked as abnormal data and interpolated using data from nearby time points or nearby nodes, or it is directly removed.

[0028] Furthermore, for gasoline or hybrid vehicles, parameters such as engine speed, torque, fuel injection quantity, and throttle opening are obtained through the engine control unit (ECU); for pure electric or hybrid vehicles, parameters such as motor speed, motor torque, phase current, voltage, and inverter switching frequency are obtained through the motor controller (MCU); and parameters such as battery pack voltage, battery pack current, individual cell voltage, and SOC are obtained through the battery management system (BMS).

[0029] Vehicle speed, acceleration, gear, and drive mode information are obtained through the vehicle control unit (VCU) or body control module, while slope, orientation, and external road environment information are obtained through onboard sensors (such as IMU and GPS).

[0030] The system acquires information such as cooling water pump speed, cooling fan speed, electronic water valve or multi-way valve opening, and heat exchanger bypass valve status through the air conditioning controller or thermal management controller. It also acquires information such as compressor speed, refrigerant pressure and temperature (PT sensor data), and expansion valve opening in the refrigeration system; and air conditioning set temperature, fan speed, and defrost / defogging mode status. Ambient temperature and humidity data are collected through ambient temperature and humidity sensors.

[0031] The aforementioned vehicle operating condition parameters are transmitted to the vehicle controller via the vehicle network (e.g., CAN bus, LIN bus, Ethernet, etc.). The vehicle controller timestamps each operating condition parameter to ensure a one-to-one correspondence with temperature information at the same time point, forming the operating condition vector for the current moment.

[0032] This step also includes S11~S13.

[0033] Step S11: Model multiple heat source nodes and multiple heat dissipation nodes in the vehicle under test, and construct the on-board thermal state topology relationship corresponding to the heat source nodes and heat dissipation nodes.

[0034] In this step, during the vehicle design phase, the set of thermal nodes is pre-determined based on the vehicle structural layout and the connection scheme of the flexible heat-conducting cable. N k}, and determine the connection relationship between any two adjacent hot nodes { E i,j}; For each hot node N k It stores information about the type, spatial location within the vehicle, and the flexible heat exchanger connected to it; for each connecting edge E k,k+1 The system stores the equivalent thermal parameters of the corresponding flexible heating tape or thermal connection structure, including thermal conductivity, equivalent thermal resistance, and equivalent heat capacity. This node and edge information can be stored in the vehicle controller using an adjacency matrix, adjacency list, or graph database.

[0035] Step S12: Map the temperature information to the corresponding heat source node and heat dissipation node, and obtain the node temperature of the heat source node and heat dissipation node. The temperature information includes the first node temperature corresponding to the heat source node and the second node temperature corresponding to the heat dissipation node.

[0036] In this step, when a thermal node corresponds to a single temperature sensor, the vehicle controller directly assigns the sensor's effective temperature value to the node's current temperature attribute. T i = T sensorWhen a thermal node is characterized by multiple temperature sensors, the vehicle controller can perform a weighted average of the temperature values ​​of each sensor according to a preset weighting coefficient, or determine the representative temperature of the node by using the maximum / minimum value or other methods. For thermal nodes without temperature sensors, the vehicle controller can use the temperatures of adjacent nodes connected to it and the corresponding thermal resistance parameters to obtain the estimated temperature of the node by interpolation estimation or simplified thermal network calculation.

[0037] Step S13: Correlate the node temperature with the topological relationship of the vehicle thermal state to construct an on-board thermal state map that characterizes the overall vehicle thermal distribution state.

[0038] Furthermore, node attribute structures are established for heat source nodes and heat dissipation nodes respectively, and node temperature is bound to the corresponding heat node as a node attribute. Based on the vehicle thermal state topology, the node temperature difference corresponding to adjacent thermal nodes with thermal coupling relationship is calculated. The node temperature difference is used as an edge attribute and associated with the thermal coupling relationship in the vehicle thermal state topology. The node temperature attributes and the thermal coupling relationship between nodes are integrated to form an on-board thermal state map that includes node attributes and edge attributes.

[0039] In this embodiment, node attribute structures are established for heat source nodes and heat dissipation nodes respectively, and node temperatures are bound to corresponding hot nodes, enabling the vehicle thermal state map to accurately characterize the real-time thermal state of each hot node. Simultaneously, based on the vehicle thermal state topology, the node temperature difference between adjacent hot nodes with thermal coupling relationships is calculated, and this temperature difference is used as an edge attribute associated with the thermal coupling relationship. This allows the map to not only reflect the connection relationships between hot nodes but also quantify the driving force and directionality of heat transfer. Furthermore, the node temperature attributes and the thermal coupling relationships between nodes are integrated to form a vehicle thermal state map that simultaneously includes node attributes and edge attributes. This achieves a structured and computable expression of the overall vehicle thermal distribution and heat conduction relationships, improving the accuracy and reliability of thermal management strategies.

[0040] In one example, identify whether a valid heat conduction path exists between any two nodes based on at least one of the following criteria: The two are directly connected by a flexible heat-conducting tape; The two are in stable solid contact through metal structural components, fasteners, thermal pads, etc. The two are indirectly coupled through fluid media such as coolant circuit and refrigerant circuit, and the key nodes are discretized into equivalent lumped nodes during modeling.

[0041] If any two hot nodes N k andN k+1 If one or more of the above conditions are met, then in the thermal state topology, a relationship is established from the hot node. N k To hot node N k+1 thermal connection edge E k,k+1 .

[0042] For heat source nodes and heat dissipation nodes connected by flexible conductive tape, in this embodiment, the flexible conductive tape is regarded as an equivalent heat conduction path and is the corresponding topological edge. E k,k+1 The flexible heat transfer cable is assigned corresponding thermal parameters, including equivalent thermal conductivity or equivalent thermal resistance; geometric and material parameters such as the length, cross-sectional area, and thermal conductivity of the material; and maximum allowable heat transfer power or safety limits. These parameters can be determined based on the materials and structure during the design phase and stored in the on-board controller as static properties of the thermal topology.

[0043] For each thermal connection edge E k,k+1 Record at least one or more of the following attributes: connection type, such as via flexible heat transfer cable, via metal structure, via coolant circuit, etc.; equivalent thermal resistance, equivalent heat capacity, and thermal inertia parameters; default heat transfer direction (e.g., from a typical high-temperature node to a typical low-temperature node), and whether bidirectional heat transfer is supported; control variables related to heat route adjustment, such as adjustable thermal conductivity, on / off state, and bypass ratio. Through the above modeling, a set of nodes { N k} and edge set { E k,k+1 The vehicle-mounted thermal network topology consists of}.

[0044] Step S2: Based on the vehicle's operating conditions and temperature information, obtain the thermal load status of each thermal node in the vehicle under test.

[0045] This step also includes S21~S24.

[0046] Step S21: Obtain the current temperature of each hot node and the rate of temperature change within a preset time window, and collect the vehicle operating condition parameters corresponding to the vehicle under test. The vehicle operating condition parameters include vehicle driving status parameters and power parameters corresponding to each hot node.

[0047] Step S22: If the current temperature of the first hot node is greater than the preset temperature threshold or the temperature change rate of the first hot node is greater than the preset change rate threshold, and the vehicle operating condition parameters are characterized as high power condition, then the first hot node is marked as high heat load state.

[0048] Step S23: If the current temperature of the first hot node is greater than the preset temperature threshold or the temperature change rate of the first hot node is greater than the preset change rate threshold, and the vehicle operating condition parameters are characterized as medium power condition, then the first hot node is marked as medium heat load state.

[0049] Step S24: If the first hot node is not marked as a high heat load state or a medium heat load state, then mark the first hot node as a low heat load state.

[0050] In this embodiment, by simultaneously acquiring the current temperature and temperature change rate of each hot node within a preset time window, and combining this with vehicle driving status parameters and corresponding power parameters, the transient thermal state and development trend of the hot nodes are comprehensively evaluated. This allows the determination of thermal load to no longer rely solely on a single temperature threshold, but to take into account both the rate of heat accumulation and the intensity of the operating conditions, thereby improving the accuracy and foresight of thermal load identification. Based on this, hot nodes are classified into high thermal load, medium thermal load, and low thermal load states according to different power conditions, achieving a hierarchical quantification of thermal risk levels. This facilitates the early identification of potential overheating nodes and the priority allocation of heat dissipation resources under high power conditions, while avoiding excessive heat dissipation control under medium and low power conditions. Ultimately, this improves the refinement, adaptability, and safety and energy efficiency of the vehicle's thermal management strategy.

[0051] Step S3: Based on the thermal load status and vehicle thermal status map, generate a thermal routing configuration strategy, wherein the thermal routing configuration strategy is used to determine the heat conduction path, conduction direction and conduction intensity in the flexible heat conduction tape.

[0052] This step also includes S31~S34.

[0053] Step S31: Based on the heat load status of each heat node and the node temperature difference between each adjacent heat node in the vehicle thermal state map, mark the target heat source node that is in a high heat load state and / or has an excessively rapid temperature rise trend.

[0054] In this step, for each hot node N k The on-board controller reads the thermal load status flag determined in step S2 and reads the node temperature of each thermal node at the current moment from the on-board thermal status map. T k Based on the vehicle's thermal topology, obtain the thermal nodes for each node. N k The set of adjacent hot nodes, i.e., with N i Thermal nodes are directly connected via flexible conductive tape or other thermal connection edges.

[0055] Among all hot nodes, nodes of type heat source node are selected as candidate objects. If the heat load state of a heat source node has been marked as high heat load state, then the heat source node is directly marked as a candidate node of the target heat source node; such heat source nodes are added to the initial set of the "target heat source node set".

[0056] For each heat source node and any of its adjacent nodes, the node temperature difference at the current moment is calculated, and corresponding temperature difference thresholds are preset for different types of heat source nodes. For each heat source node, the vehicle controller determines whether there is at least one adjacent node such that the temperature difference threshold is greater than or equal to the node temperature difference value. If so, the heat source node is considered to have a significant overheating trend relative to its environment (or adjacent heat dissipation nodes, intermediate nodes).

[0057] Step S32: Based on the vehicle thermal state map and the topology of the flexible heat conduction tape and heat dissipation nodes, mark the candidate heat dissipation nodes that are thermally coupled to the target heat source node, and connect the candidate heat conduction paths between the target heat source node and each candidate heat dissipation node.

[0058] Furthermore, based on the vehicle thermal state map, a set of hot nodes that have a direct thermal connection with the target heat source node is retrieved, and all hot nodes of the type of heat dissipation node are selected from the set of hot nodes to construct a first candidate heat dissipation node set; If the target heat source node does not have a directly connected heat dissipation node, or if the first candidate heat dissipation node set does not meet the heat dissipation requirements, then based on the thermal coupling relationship of the vehicle thermal state map extending outward from the target heat source node by a preset number of layers, the heat dissipation node that forms thermal coupling with the target heat source node through at least one intermediate heat node is determined, and a second candidate heat dissipation node set is constructed. Based on the topology of the flexible heat conduction tape and heat dissipation nodes, the accessibility of the first candidate heat dissipation node set and the second candidate heat dissipation node set is judged. Heat dissipation nodes that have a configurable connection relationship with the target heat source node through the flexible heat conduction tape are retained, and candidate heat dissipation nodes are constructed.

[0059] In this embodiment, by prioritizing the retrieval of heat dissipation nodes with direct thermal connections to the target heat source node in the vehicle thermal state map, and when the heat dissipation capacity is insufficient or there are no direct heat dissipation nodes, the search is expanded outward by a preset number of layers along the thermal coupling relationship to introduce heat dissipation nodes coupled through intermediate heat dissipation nodes. This ensures sufficient heat dissipation resources while avoiding blindly expanding the search range. At the same time, accessibility is determined by combining the actual topology of the flexible heat conduction tape and the heat dissipation node. Only heat dissipation nodes with configurable flexible heat conduction tape connections to the target heat source node are retained. This effectively eliminates physically impossible or inefficient heat dissipation paths, ensuring that the finally determined candidate heat dissipation nodes meet heat dissipation requirements and are practically feasible. This improves the accuracy, reliability, and overall thermal management efficiency of thermal routing configuration and reduces the overheating risk of the target heat source node.

[0060] Step S33: Calculate the path evaluation index of each candidate heat conduction path based on the path thermal resistance of each candidate heat conduction path, the temperature of intermediate heat nodes, and the path influence factor of the candidate heat conduction path on other heat source nodes, and construct the target heat conduction path set.

[0061] In this step, candidate heat conduction pathways p It can be represented as p= { N k | k =0,1,2,..., m , m +1}, where N 0 indicates the starting heat source node. N m Indicates the first m One intermediate hot node N m+1 Indicates the target heat dissipation node The thermal resistance network function corresponding to the path thermal resistance in each candidate heat conduction path can be expressed as:

[0062]

[0063]

[0064]

[0065]

[0066] in, Indicate candidate heat conduction pathways p The thermal resistance network evaluation function, Indicate candidate heat conduction pathways p Total thermal resistance, This represents the influence coefficient of thermal resistance variance. Indicate candidate heat conduction pathways p The standard deviation of the thermal resistance value Indicate candidate heat conduction pathways p The average value of the thermal resistance of each section. Indicate candidate heat conduction pathways p The Middle k thermal resistance of the segment Indicates the first k The internal thermal resistance of the intermediate thermal node Indicates the first k The intermediate hot node and the first k The basic thermal resistance of the thermal connection edge between +1 intermediate thermal nodes Indicates the first k Contact thermal resistance of the intermediate thermal nodes Indicates the hot connection edge The thermal resistance modulation function, This represents the sinusoidal component coefficients of the edge weight modulation. This represents the cosine component coefficients of the edge weight modulation. Indicates the hot connection edge The corresponding weight value, This represents the maximum weight of the hot-connected edge. Indicates the hot connection edge The physical length, Indicate candidate heat conduction pathways p Total length, Indicates the hot connection edge cross-sectional area, Indicates the hot connection edge thermal conductivity, This represents the influence coefficient of the orientation angle. Indicates the hot connection edge The direction angle.

[0067] The temperature gradient transfer function corresponding to the path thermal resistance in each candidate heat conduction path can be expressed as:

[0068]

[0069]

[0070] in, Indicate candidate heat conduction pathways p Temperature gradient transfer evaluation function Candidate heat conduction pathways p Effective temperature difference, Indicate candidate heat conduction pathwaysp Total length, Indicates the first k The heat transfer efficiency factor of each intermediate heat node. Indicate candidate heat conduction pathways p Thermal coupling enhancement factor, This indicates the temperature of the initial heat source node. Indicates the temperature of the target heat dissipation node. Indicates the first k Temperature loss at intermediate thermal nodes Indicates the first k Thermal coupling weight coefficients of intermediate hot nodes Indicates the first k The heat capacity of each intermediate hot node Indicates the reference heat capacity value. Indicates the first k The thermal conductivity of each intermediate thermal node, This represents the reference thermal conductivity value.

[0071] The path stability function corresponding to the path thermal resistance of each candidate heat conduction path can be expressed as:

[0072]

[0073] in, Indicate candidate heat conduction pathways p Path stability function, The adjustment coefficient representing path stability. Indicate candidate heat conduction pathways p The coefficient of thermal variation, Indicates the hot connection edge The corresponding actual thermal stress, Indicates the hot connection edge The corresponding maximum permissible thermal stress, Indicates the hot connection edge The corresponding stress influence index, Indicates the first k The temperature of the intermediate thermal node Indicate candidate heat conduction pathways p The average temperature of all nodes in the middle. Indicates the connection via thermal link. heat flux density, Indicate candidate heat conduction pathways p The average heat flux density of all thermally connected edges.

[0074] The dynamic response function corresponding to the path thermal resistance of each candidate heat conduction path can be expressed as:

[0075]

[0076] in, Indicate candidate heat conduction pathways p The dynamic response function, Indicate candidate heat conduction pathways p The response time function, Indicate candidate heat conduction pathways p Thermal stability time, Indicates the reference response time. Indicates the first k The dynamic response weighting coefficients of the intermediate hot nodes, Indicates the first k The rate of temperature change of each intermediate thermal node Indicates the hot connection edge heat capacity, Indicates the hot connection edge The thermal conductivity.

[0077] Furthermore, the path evaluation index can be expressed as:

[0078] in, Indicate candidate heat conduction pathways p Path evaluation metrics Indicates the first i The weight coefficients corresponding to each evaluation function Indicate candidate heat conduction pathways p The i Each sub-evaluation function, This represents the weighting coefficients corresponding to the multi-path coupling effect function. This represents the multi-path coupling effect function. This represents the set of other paths.

[0079] In one example, the multipath coupling effect function can be expressed as:

[0080]

[0081]

[0082] in, Representing a path Importance weight, Representing a path p and The coupling strength index between them Representing a path p and The heat transfer interference function between them Indicate candidate heat conduction pathways p The set of nodes in Representing a path The set of nodes in Representing a path p and The number of common nodes between them Indicate candidate heat conduction pathways p The set of edges in, Representing a path The set of edges in, Representing a path p and The number of common edges between them This represents the coupling strength coefficient corresponding to the edge weight. Representing a path p and The distance between the centers of mass, Indicates the reference distance. Indicates the first k The actual heat load demand of each intermediate thermal node. Indicates the first k The heat load capacity of each intermediate thermal node Indicates the connection via thermal link. The actual heat flow Indicates the connection via thermal link. Maximum heat flow.

[0083] Step S34: Assign path priorities to each heat conduction path in the target heat conduction path set to generate a heat routing configuration strategy.

[0084] Furthermore, the path thermal resistance, intermediate thermal node temperature, and path influence factor corresponding to each target heat conduction path are normalized to obtain standardized path index values ​​corresponding to each target heat conduction path. Based on the standardized path index values ​​of each target heat conduction path, a comprehensive path score is constructed, and each target heat conduction path is sorted according to the comprehensive path score to obtain a path priority sequence. Then, a heat routing configuration strategy is selected based on the path priority sequence.

[0085] In one example, the optimal selection of the target path set can be achieved using a multi-objective optimization function, which can be expressed as:

[0086] The constraints can be expressed as:

[0087] in, Represents the set of target heat conduction paths. This represents the sum of comprehensive evaluation indicators for the selected path. The penalty coefficient representing the inter-path coupling interference. The penalty coefficient representing the number of paths, Indicate candidate heat conduction pathways p Heat transfer capacity Indicates the minimum required heat transfer capacity. This represents the union of all hot nodes in the selected path. Indicates the first k The actual operating temperature of each intermediate thermal node. Indicates the first k The maximum allowable temperature of each intermediate thermal node. This represents the union of all edges in the selected path. Indicates the maximum number of allowed paths.

[0088] Step S4: Adjust the heat conduction path between the heat source node and the heat dissipation node in the vehicle under test according to the heat routing configuration strategy.

[0089] In this step, based on the thermal routing configuration strategy, the target heat conduction relationships between each heat node are determined, including the heat dissipation node corresponding to each heat source node, the preferred heat conduction path, the heat conduction direction, and the target thermal conductivity intensity or thermal conductivity level of each flexible heat-conducting tape. The thermal routing configuration strategy is expressed in the form of a thermal routing table, heat flow vector, or heat weight matrix.

[0090] For flexible heat-conducting tapes connecting adjacent thermal nodes, their thermal conductivity is adjusted based on the analysis results. This adjustment process includes: controlling the flexible heat-conducting tape to be in a conductive or insulating state to open or close the corresponding heat conduction path; or setting the unidirectional or bidirectional heat conduction mode for flexible heat-conducting tapes with thermal diode or thermal rectification characteristics.

[0091] After the flexible heat-conducting tape is adjusted to maintain its thermal conductivity, at least one or more heat conduction paths are formed between the heat source nodes and the heat dissipation nodes, allowing heat to be transferred along the path specified by the heat routing configuration strategy. This prioritizes the transfer of heat from high-heat-load heat source nodes to heat dissipation nodes with high heat dissipation capacity, preventing heat from being transferred to nodes with higher temperatures or insufficient heat dissipation capacity, and achieving heat diversion or convergence conduction from multiple heat source nodes.

[0092] After the heat conduction path is adjusted, temperature change information of each heat node is continuously collected, and the real-time temperature information is fed back to the heat routing configuration strategy module. When a deviation between the actual heat conduction effect and the target thermal state is detected, steps S3 and S4 are re-executed to dynamically correct the heat conduction path, thereby forming a closed-loop thermal management control.

[0093] In this embodiment, the vehicle under test is abstracted as an on-board thermal state map composed of multiple hot nodes, and adjacent hot nodes are connected by flexible conductive tape. This enables distributed management of different heat source nodes and heat dissipation nodes, avoiding the problems of coarse control and lag response in traditional centralized thermal management. By comprehensively collecting vehicle operating conditions and multi-node temperature information, the on-board thermal state map is dynamically constructed, and the thermal load status of each hot node is obtained. This can comprehensively and in real time reflect the thermal distribution characteristics of the vehicle under different operating conditions, thereby improving the accuracy of thermal management decisions. Furthermore, a thermal routing configuration strategy is generated based on the thermal load status and the on-board thermal state map. This strategy can dynamically adjust the heat conduction path, direction, and intensity in the flexible conductive tape, enabling heat to be efficiently conducted from high-heat-load hot source nodes to suitable heat dissipation nodes, avoiding local overheating or heat accumulation. At the same time, by combining the flexible conductive tape with the thermal routing, the heat conduction path can be adaptively adjusted according to changes in vehicle operating conditions. This is applicable to various complex operating conditions and different vehicle structural layouts, improving the environmental adaptability of the thermal management system. By precisely controlling the direction of heat flow and the intensity of heat conduction, ineffective or redundant heat conduction processes are reduced, heat dissipation efficiency is improved, thereby reducing reliance on traditional active cooling devices and achieving the effect of reducing overall vehicle energy consumption.

[0094] Based on the above method, this application discloses a distributed thermal management system based on flexible conductive tape and heat routing, referencing... Figure 2 The distributed thermal management system 1 includes a data acquisition module 11, a data processing module 12, and a path adjustment module 13, wherein... The data acquisition module 11 is used to collect temperature information and vehicle operating conditions in the vehicle under test, and to construct an on-board thermal state map based on the temperature information. The vehicle under test includes multiple thermal nodes, and any two adjacent thermal nodes are connected by a flexible heat conduction cable. The thermal nodes include heat source nodes and heat dissipation nodes. The data processing module 12 is used to obtain the thermal load status of each thermal node in the vehicle under test according to the vehicle's operating conditions and temperature information, and generate a thermal routing configuration strategy based on the thermal load status and the vehicle thermal status map. The thermal routing configuration strategy is used to determine the heat conduction path, conduction direction and conduction intensity in the flexible heat conduction tape. The path adjustment module 13 is used to adjust the heat conduction path between the heat source node and the heat dissipation node in the vehicle under test according to the heat routing configuration strategy.

[0095] In one example, the data acquisition module 11 is used to model multiple heat source nodes and multiple heat dissipation nodes in the vehicle under test, construct the on-board thermal state topology relationship corresponding to the heat source nodes and heat dissipation nodes; map temperature information to the corresponding heat source nodes and heat dissipation nodes, and obtain the node temperature of the heat source nodes and heat dissipation nodes, wherein the temperature information includes the first node temperature corresponding to the heat source node and the second node temperature corresponding to the heat dissipation node; associate the node temperature with the on-board thermal state topology relationship to construct an on-board thermal state map for characterizing the thermal distribution state of the whole vehicle.

[0096] In one example, the data acquisition module 11 is used to establish node attribute structures for heat source nodes and heat dissipation nodes respectively, and bind node temperature as a node attribute to the corresponding hot node; based on the vehicle thermal state topology, it calculates the node temperature difference corresponding to adjacent hot nodes with thermal coupling relationship, wherein the node temperature difference is used as an edge attribute to associate with the thermal coupling relationship in the vehicle thermal state topology; and integrates the node temperature attribute with the thermal coupling relationship between nodes to form a vehicle thermal state map including node attributes and edge attributes.

[0097] In one example, the data processing module 12 is used to obtain the current temperature of each hot node and the rate of temperature change within a preset time window, and to collect the vehicle operating condition parameters corresponding to the vehicle under test. The vehicle operating condition parameters include vehicle driving state parameters and power parameters corresponding to each hot node. If the current temperature of the first hot node is greater than a preset temperature threshold or the rate of temperature change of the first hot node is greater than a preset rate of change threshold, and the vehicle operating condition parameters indicate a high power condition, then the first hot node is marked as a high heat load state. If the current temperature of the first hot node is greater than a preset temperature threshold or the rate of temperature change of the first hot node is greater than a preset rate of change threshold, and the vehicle operating condition parameters indicate a medium power condition, then the first hot node is marked as a medium heat load state. If the first hot node is not marked as a high heat load state or a medium heat load state, then the first hot node is marked as a low heat load state.

[0098] In one example, the data processing module 12 is used to mark target heat source nodes that are under high heat load and / or have a tendency to heat up too quickly, based on the heat load status of each heat node and the node temperature difference between each adjacent heat node in the vehicle thermal state map; based on the vehicle thermal state map and the topology of the flexible heat conduction tape and heat dissipation node, it marks candidate heat dissipation nodes that are thermally coupled to the target heat source node, and connects the target heat source node with each candidate heat dissipation node to form candidate heat conduction paths; based on the path thermal resistance of each candidate heat conduction path, the temperature of the intermediate heat node, and the path influence factor of the candidate heat conduction path on other heat source nodes, it calculates the path evaluation index of each candidate heat conduction path and constructs a set of target heat conduction paths; and assigns path priority to each heat conduction path in the set of target heat conduction paths to generate a thermal routing configuration strategy.

[0099] In one example, the data processing module 12 is used to retrieve a set of hot nodes that have a direct thermal connection with the target heat source node based on the vehicle thermal state map, and to filter all hot nodes of the type of heat dissipation node in the hot node set, and to construct a first candidate heat dissipation node set; if there is no heat dissipation node directly connected to the target heat source node, or if the first candidate heat dissipation node set does not meet the heat dissipation requirements, then based on the thermal coupling relationship of the vehicle thermal state map extending outward from the target heat source node by a preset number of layers, it determines the heat dissipation node that forms a thermal coupling with the target heat source node through at least one intermediate hot node, and constructs a second candidate heat dissipation node set; based on the topology of the flexible heat conduction tape and the heat dissipation node, it performs an accessibility judgment on the first candidate heat dissipation node set and the second candidate heat dissipation node set, retains the heat dissipation node that has a configurable connection relationship with the target heat source node through the flexible heat conduction tape, and constructs candidate heat dissipation nodes.

[0100] In one example, the data processing module 12 is used to normalize the path thermal resistance, temperature of intermediate thermal nodes and path influence factors corresponding to each target heat conduction path to obtain the standardized path index value corresponding to each target heat conduction path. Based on the standardized path index values ​​of each target heat conduction path, a comprehensive path score is constructed, and each target heat conduction path is sorted according to the comprehensive path score to obtain a path priority sequence. Then, a heat routing configuration strategy is selected based on the path priority sequence.

[0101] Please see Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 3 As shown, the electronic device 2 may include: at least one processor 21, at least one network interface 24, user interface 23, memory 25, and at least one communication bus 22.

[0102] The communication bus 22 is used to enable communication between these components.

[0103] The user interface 23 may include a display screen and a camera. Optionally, the user interface 23 may also include a standard wired interface and a wireless interface.

[0104] The network interface 24 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface).

[0105] The processor 21 may include one or more processing cores. The processor 21 connects to various parts of the server using various interfaces and lines, and performs various server functions and processes data by running or executing instructions, programs, code sets, or instruction sets stored in the memory 25, and by calling data stored in the memory 25. Optionally, the processor 21 may be implemented using at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). The processor 21 may integrate one or a combination of several of the following: Central Processing Unit (CPU), Graphics Processing Unit (GPU), and modem. The CPU primarily handles the operating system, user interface, and applications; the GPU is responsible for rendering and drawing the content required for display; and the modem handles wireless communication. It is understood that the modem may also be implemented as a separate chip without being integrated into the processor 21.

[0106] The memory 25 may include random access memory (RAM) or read-only memory. Optionally, the memory 25 may include non-transitory computer-readable storage medium. The memory 25 can be used to store instructions, programs, code, code sets, or instruction sets. The memory 25 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as touch function, sound playback function, image playback function, etc.), instructions for implementing the above-described method embodiments, etc.; the data storage area may store data involved in the above-described method embodiments, etc. Optionally, the memory 25 may also be at least one storage device located remotely from the aforementioned processor 21. Figure 3As shown, the memory 25, which serves as a computer storage medium, may include an operating system, a network communication module, a user interface module, and an application program based on a distributed thermal management method using flexible conductive tape and thermal routing.

[0107] exist Figure 3 In the electronic device 2 shown, the user interface 23 is mainly used to provide an input interface for the user and obtain the user input data; while the processor 21 can be used to call an application stored in the memory 25 for a distributed thermal management method based on flexible heat conduction tape and thermal routing. When executed by one or more processors, the electronic device executes one or more methods as described in the above embodiments.

[0108] A non-transitory computer-readable storage medium stores instructions that, when executed by one or more processors, cause a computer to perform one or more methods as described in the above embodiments.

[0109] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0110] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0111] In the several embodiments provided in this application, it should be understood that the disclosed apparatus can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the shown or discussed mutual couplings or direct couplings or communication connections may be through some service interfaces; indirect couplings or communication connections between apparatuses or units may be electrical or other forms.

[0112] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0113] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0114] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage device (CMD). Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a memory and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned memory includes various media capable of storing program code, such as USB flash drives, portable hard drives, magnetic disks, or optical disks.

[0115] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A distributed thermal management method based on flexible conductive tape and thermal routing, characterized in that, The method includes: Temperature information and vehicle operating conditions in the vehicle under test are collected, and an on-board thermal state map is constructed based on the temperature information. The vehicle under test includes multiple thermal nodes, and any two adjacent thermal nodes are connected by a flexible heat conduction cable. The thermal nodes include heat source nodes and heat dissipation nodes. Based on the vehicle operating conditions and the temperature information, the thermal load status of each thermal node in the vehicle under test is obtained; Based on the heat load state and the vehicle thermal state map, a heat routing configuration strategy is generated, wherein the heat routing configuration strategy is used to determine the heat conduction path, conduction direction and conduction intensity in the flexible heat-conducting tape; The heat conduction path between the heat source node and the heat dissipation node in the vehicle under test is adjusted according to the heat routing configuration strategy.

2. The distributed thermal management method based on flexible conductive tape and heat routing as described in claim 1, characterized in that, The step of constructing an on-board thermal state map based on the temperature information specifically includes: Multiple heat source nodes and multiple heat dissipation nodes in the vehicle under test are modeled, and the on-board thermal state topology relationship corresponding to the heat source nodes and heat dissipation nodes is constructed. The temperature information is mapped to the corresponding heat source node and heat dissipation node to obtain the node temperature of the heat source node and the heat dissipation node, wherein the temperature information includes the first node temperature corresponding to the heat source node and the second node temperature corresponding to the heat dissipation node; By associating the node temperature with the vehicle thermal state topology, an vehicle thermal state map is constructed to characterize the overall vehicle thermal distribution.

3. The distributed thermal management method based on flexible conductive tape and thermal routing as described in claim 2, characterized in that, The step of associating the node temperature with the vehicle thermal state topology to construct an vehicle thermal state map characterizing the overall vehicle thermal distribution includes: Establish node attribute structures for the heat source node and the heat dissipation node respectively, and bind the node temperature as a node attribute to the corresponding heat node; Based on the vehicle thermal state topology, the node temperature difference value corresponding to adjacent thermal nodes with thermal coupling relationship is calculated, wherein the node temperature difference value is used as an edge attribute and associated with the thermal coupling relationship in the vehicle thermal state topology. The node temperature attributes and the thermal coupling relationship between nodes are integrated to form an on-board thermal state map that includes node attributes and edge attributes.

4. The distributed thermal management method based on flexible conductive tape and thermal routing as described in claim 1, characterized in that, The step of obtaining the heat load status of each heat source node in the vehicle under test based on the vehicle operating conditions and the temperature information specifically includes: The current temperature of each hot node and the rate of temperature change within a preset time window are obtained, and the vehicle operating condition parameters corresponding to the vehicle under test are collected. The vehicle operating condition parameters include vehicle driving status parameters and power parameters corresponding to each hot node. If the current temperature of the first hot node is greater than a preset temperature threshold or the temperature change rate of the first hot node is greater than a preset change rate threshold, and the vehicle operating condition parameters indicate a high power condition, then the first hot node is marked as a high heat load state. If the current temperature of the first hot node is greater than a preset temperature threshold or the temperature change rate of the first hot node is greater than a preset change rate threshold, and the vehicle operating condition parameters are characterized as medium power conditions, then the first hot node is marked as a medium heat load state. If the first hot node is not marked as either the high heat load state or the medium heat load state, then the first hot node is marked as the low heat load state.

5. The distributed thermal management method based on flexible conductive tape and heat routing as described in claim 1, characterized in that, The generation of a thermal routing configuration strategy based on the thermal load state and the vehicle thermal state map specifically includes: Based on the heat load status of each hot node and the node temperature difference between each adjacent hot node in the vehicle thermal state map, target heat source nodes that are in a high heat load state and / or have an excessively rapid temperature rise trend are marked. Based on the vehicle thermal state map and the topology of the flexible heat conduction tape and the heat dissipation node, candidate heat dissipation nodes that are thermally coupled to the target heat source node are marked, and candidate heat conduction paths are connected between the target heat source node and each candidate heat dissipation node. Based on the path thermal resistance of each candidate heat conduction path, the temperature of intermediate heat nodes, and the path influence factor of the candidate heat conduction path on other heat source nodes, the path evaluation index of each candidate heat conduction path is calculated, and the target heat conduction path set is constructed. Assign path priorities to each heat conduction path in the target heat conduction path set to generate a heat routing configuration strategy.

6. The distributed thermal management method based on flexible conductive tape and thermal routing as described in claim 5, characterized in that, Based on the vehicle-mounted thermal state map and the topology of the flexible conductive tape and the heat dissipation node, candidate heat dissipation nodes thermally coupled to the target heat source node are marked, specifically including: Based on the vehicle thermal state map, a set of hot nodes that have a direct thermal connection with the target heat source node is retrieved, and all hot nodes of the type of heat dissipation node are filtered in the set of hot nodes to construct a first candidate heat dissipation node set. If the target heat source node does not have a directly connected heat dissipation node, or if the first candidate heat dissipation node set does not meet the heat dissipation requirements, then based on the thermal coupling relationship of the vehicle thermal state map extending outward from the target heat source node by a preset number of layers, a heat dissipation node that forms thermal coupling with the target heat source node through at least one intermediate heat node is determined, and a second candidate heat dissipation node set is constructed. Based on the topology of the flexible heat-conducting tape and the heat dissipation node, the reachability of the first candidate heat dissipation node set and the second candidate heat dissipation node set is determined, and heat dissipation nodes that have a configurable connection relationship with the target heat source node through the flexible heat-conducting tape are retained, and candidate heat dissipation nodes are constructed.

7. The distributed thermal management method based on flexible conductive tape and thermal routing as described in claim 5, characterized in that, The step of assigning path priorities to each heat conduction path in the target heat conduction path set to generate a heat routing configuration strategy specifically includes: Normalize the path thermal resistance, intermediate thermal node temperature and path influence factor corresponding to each target heat conduction path to obtain standardized path index values ​​corresponding to each target heat conduction path. Based on the standardized path index values ​​of each target heat conduction path, a comprehensive path score is constructed, and each target heat conduction path is sorted according to the comprehensive path score to obtain a path priority sequence. A heat routing configuration strategy is then selected based on the path priority sequence.

8. A distributed thermal management system based on flexible conductive tape and heat routing, characterized in that, The distributed thermal management system (1) includes a data acquisition module (11), a data processing module (12), and a path adjustment module (13), wherein, The data acquisition module (11) is used to collect temperature information and vehicle operating conditions in the vehicle under test, and to construct an on-board thermal state map based on the temperature information. The vehicle under test includes multiple thermal nodes, and any two adjacent thermal nodes are connected by a flexible heat conduction cable. The thermal nodes include heat source nodes and heat dissipation nodes. The data processing module (12) is used to obtain the thermal load status of each thermal node in the vehicle under test according to the vehicle operating conditions and the temperature information, and generate a thermal routing configuration strategy based on the thermal load status and the vehicle thermal status map. The thermal routing configuration strategy is used to determine the heat conduction path, conduction direction and conduction intensity of the heat in the flexible heat conduction tape. The path adjustment module (13) is used to adjust the heat conduction path between the heat source node and the heat dissipation node in the vehicle under test according to the heat routing configuration strategy.

9. An electronic device, characterized in that, The device includes a processor (21), a memory (25), a user interface (23), and a network interface (24), wherein the memory (25) is used to store instructions, the user interface (23) and the network interface (24) are used to communicate with other devices, and the processor (21) is used to execute the instructions stored in the memory (25) to cause the electronic device (2) to perform the method as described in any one of claims 1-7.

10. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1-7.

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