A circuit board

Abstract

The application discloses a circuit board and relates to the technical field of circuit boards. The circuit board comprises a circuit board body, wherein a through hole structure for adapting differential signals is arranged on the circuit board body, the through hole structure comprises signal through holes and ground through holes, the signal through holes are two and are arranged in a straight line, the ground through holes are continuous rectangular structures and surround the periphery of the signal through holes, the rectangular structure comprises two long sides and two short sides, the two long sides are symmetrical about a connecting line between the two signal through holes, the two short sides are symmetrical about a perpendicular bisector of the connecting line, and the center points of the two signal through holes are located on the extension line of the connecting line. The embodiment of the application can reduce the area occupied by the signal through holes and the ground through holes as a whole, improve the utilization rate of the signal through holes, reduce the wiring difficulty, and be beneficial to the miniaturization design of the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit boards, and particularly relates to a circuit board. BACKGROUND

[0002] With the rapid development of electronic communication technology, cloud computing, artificial intelligence and other technologies, the speed of signal transmission and exchange is increasing, and circuit boards capable of meeting high-speed signal transmission have emerged as the times require.

[0003] In the related art, in order to realize the configuration of high-speed differential signals, for a group of differential signals, in addition to two signal through holes, two ground through holes matched with the signal through holes need to be configured on the circuit board to provide a low-impedance return path and suppress electromagnetic interference. Although this arrangement can meet the use requirements, half of the area in the through hole arrangement is used to arrange the ground through holes, which reduces the utilization rate of the signal through holes, increases the wiring difficulty, and is also not conducive to the miniaturization design of the circuit board. SUMMARY

[0004] The present application provides a circuit board to at least solve the problems of low utilization rate of signal through holes, difficult wiring and being not conducive to the miniaturization design of the circuit board in the related art.

[0005] The present application provides a circuit board, comprising:

[0006] A circuit board body, wherein a through hole structure for adapting differential signals is arranged on the circuit board body, the through hole structure comprises signal through holes and ground through holes, the signal through holes are two and arranged in a straight line, the ground through holes are a continuous rectangular structure and surround the outer periphery of the signal through holes, the rectangular structure comprises two long sides and two short sides, the two long sides are symmetrical about a connecting line between the two signal through holes, the two short sides are symmetrical about a perpendicular bisector of the connecting line, and the center points of the two signal through holes are located on the extension line of the connecting line.

[0007] According to the application, since the ground through hole of the rectangular structure is arranged around the outer periphery of the signal through hole, the ground through hole can be laid out using the space outside the outer periphery of the signal through hole, instead of occupying the space on the arrangement side of the two signal through holes, the occupation of the layout area by the ground through hole can be reduced, the two ground through holes originally required to strictly match the signal through holes are distributed to the entire rectangular structure by being arranged around the outer periphery of the signal through hole, the area occupied by the ground through hole can be saved on the premise of ensuring sufficient backflow ground area, thereby effectively improving the utilization rate of the area on the circuit board by the signal through hole, more wiring areas can be released to support the high-density wiring demand, thereby being beneficial to the miniaturization design of the circuit board. On the other hand, the ground through hole of the rectangular structure can form a multi-angle symmetrical structure relative to the two signal through holes, and the continuity of the rectangular structure can improve the impedance matching of the backflow path, thereby reducing signal crosstalk. Compared with the one-to-one corresponding mode of the signal through hole and the ground through hole, the ground through hole in the embodiment of the application is an overall structure arranged around the outer periphery of the signal through hole, and the corresponding relationship between the signal through hole and the ground through hole can be weakened, thereby reducing the wiring difficulty. BRIEF DESCRIPTION OF DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the application, the drawings required to be used in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0009] Figure 1 A through hole arrangement diagram on a circuit board provided by an embodiment of the application;

[0010] Figure 2 Another through hole arrangement diagram on a circuit board provided by an embodiment of the application;

[0011] Figure 3 Still another through hole arrangement diagram on a circuit board provided by an embodiment of the application;

[0012] Figure 4 Still another through hole arrangement diagram on a circuit board provided by an embodiment of the application;

[0013] Figure 5 A forming diagram of a rectangular structure under the arrangement of a signal through hole along a horizontal direction according to an embodiment of the application is shown;

[0014] Figure 6 A forming diagram of a rectangular structure under the arrangement of a signal through hole along a vertical direction according to an embodiment of the application is shown;

[0015] Figure 7A forming diagram of a rectangular structure under arrangement of signal through holes in a tilt direction is shown according to an embodiment of the present application;

[0016] Figure 8 A forming diagram of another rectangular structure under arrangement of signal through holes in a tilt direction is shown according to an embodiment of the present application.

[0017] Wherein, the above-mentioned drawings include the following reference signs:

[0018] 100-circuit board body;

[0019] 200-through hole structure; 210-signal through hole; 220-ground through hole; 221-long side; 222-short side; 221a-first long side; 221b-second long side; 222a-first short side; 222b-second short side;

[0020] 300-micro groove structure;

[0021] 10-wire; 20-elongated line; 30-mid-perpendicular line;

[0022] a-first drilling point; b-second drilling point; c-third drilling point; d-fourth drilling point. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0024] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, it can be the communication inside two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, wherein the acceptable deviation range is determined by the ordinary skilled in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For the ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0025] With the rapid development of electronic communication technology, cloud computing, artificial intelligence and other technologies, the speed of signal transmission and exchange is getting faster and faster, and the circuit board capable of meeting high-speed signal transmission has emerged as the times require.

[0026] The above-mentioned circuit board is suitable for the field of electronic communication equipment requiring high density, miniaturization and high performance. For example, in the scenes of 5G communication base station, high-performance computing server, data center switch, high-speed data acquisition system, etc., the circuit board needs to support stable transmission of high-speed signals (such as USB 3.0, PCIe 4.0, Ethernet 25G / 100G, etc.). In these scenes, the impedance continuity, signal integrity and reflow path design of high-speed differential signals directly affect the performance and reliability of the equipment.

[0027] In the related art, in order to realize the configuration of high-speed differential signals, for a group of differential signals, in addition to two signal vias (the function of the signal via is to change layers of the differential signal, for example, from the surface layer to the inner layer, so as to maintain the symmetry and impedance matching of the differential signal), two ground vias matching the signal vias also need to be configured, and the two signal vias and the two ground vias generally present a layout of signal via-ground via-signal via-ground via, so as to provide a low-impedance return path and suppress electromagnetic interference.

[0028] Although the above arrangement can meet the use requirements, half of the area in the via arrangement is used to arrange the ground vias, which reduces the utilization rate of the signal vias, and because a strict corresponding relationship is required between the signal vias and the ground vias, the wiring difficulty is also increased. The reduction of the utilization rate of the signal vias and the increase of the wiring difficulty are not conducive to the miniaturization design of the circuit board.

[0029] It can be understood that with the further improvement of the signal transmission rate, the limitations of the above via arrangement in space utilization and electrical performance will become increasingly prominent, and it is urgent to optimize the via arrangement to meet the increasingly high use requirements.

[0030] In view of the above status and problems, the circuit board in the embodiments of the present application realizes the configuration of differential signals by adopting a brand-new via arrangement, which can reduce the area occupied by the signal vias and the ground vias as a whole and improve the utilization rate of the signal vias, reduce the wiring difficulty, and is also conducive to the miniaturization design of the circuit board.

[0031] To achieve the above purpose, the circuit board in the embodiments of the present application optimizes the arrangement and structure of the ground vias. Specifically, the ground vias are arranged around the outer periphery of the two signal vias and are configured in a rectangular structure. This arrangement mode divides the two ground vias originally required to strictly match the signal vias into the entire rectangular structure by surrounding the outer periphery of the signal vias, which can save the area occupied by the ground vias while ensuring sufficient return ground area, thereby effectively improving the utilization rate of the signal vias on the circuit board and facilitating the miniaturization design of the circuit board. In addition, compared with the one-to-one corresponding mode of the signal vias and the ground vias, the ground vias in the embodiments of the present application are the overall structure surrounding the outer periphery of the signal vias, which can weaken the corresponding relationship between the signal vias and the ground vias, thereby reducing the wiring difficulty.

[0032] In the embodiments of the present application, the arrangement relationship between the signal vias and the ground vias will be described in detail mainly by taking three typical arrangement modes of the signal vias as examples. The three typical arrangement modes of the signal vias include horizontal arrangement of the two signal vias, vertical arrangement of the two signal vias, and inclined arrangement of the two signal vias.

[0033] To realize the overall layout structure of the through hole on the circuit board, the embodiment of the present application further provides a through hole arrangement method, through which the purpose of surrounding the ground through hole around the outer periphery of the two signal through holes can be realized.

[0034] The core of the through hole arrangement method is to plan the optimal position of the ground through hole according to the diameter, distance and existing manufacturing process of the two signal through holes, so as to realize the miniaturization design of the circuit board.

[0035] Figure 1 A through hole arrangement diagram on a circuit board provided by the embodiment of the present application; Figure 2 Another through hole arrangement diagram on a circuit board provided by the embodiment of the present application; Figure 3 Still another through hole arrangement diagram on a circuit board provided by the embodiment of the present application; Figure 4 Yet another through hole arrangement diagram on a circuit board provided by the embodiment of the present application.

[0036] In the embodiment of the present application, please refer to Figures 1 to 4 , the circuit board includes a circuit board body 100, which can be formed into a plate-shaped structure by using polyimide, Teflon and the like as a base material. The design and manufacture of the circuit board body 100 can refer to related technologies.

[0037] To realize the transmission of differential signals, a through hole structure 200 needs to be configured on the circuit board, which is used to adapt to the transmission of differential signals.

[0038] As can be seen from Figures 1 to 4 , the through hole structure 200 includes two signal through holes 210, which are used to change layers of differential signals, for example, from the surface layer to the inner layer, so as to maintain the symmetry and impedance matching of the differential signals.

[0039] The signal through hole 210 in the embodiment of the present application can follow the existing signal through hole 210 design. The two signal through holes 210 can be arranged along a straight line, for example, in the example shown in Figure 1 , the two signal through holes 210 are arranged along the horizontal direction, in the example shown in Figure 2 , the two signal through holes 210 are arranged along the vertical direction, and in the examples shown in Figure 3 and Figure 4 , the two signal through holes 210 are arranged along the inclined direction.

[0040] It should be noted that the two signal through holes 210 are configured for a group of differential signals, and in the example shown in Figures 1 to 4 , the circuit board can adapt to four groups of differential signals, so eight signal through holes 210 are provided on the circuit board. The embodiment of the present application mainly takes a group of differential signals as the object for description.

[0041] The ground via 220 in the embodiments of the present application is a continuous rectangular structure and surrounds the outer periphery of the signal via 210. The rectangular structure includes two long sides 221 and two short sides 222. The two long sides 221 are symmetrical about the line 10 between the two signal vias 210, and the two short sides 222 are symmetrical about the median line 30 of the line 10. The center points of the two signal vias 210 are located on the extension line 20 of the line 10 (the line 10 and the median line 30 can be referred to Figure 5 ).

[0042] In the embodiments of the present application, the ground via 220 of the rectangular structure surrounds the outer periphery of the signal via 210. The ground via 220 can be laid out using the outer periphery space of the signal via 210, rather than occupying the space on the arrangement side of the two signal vias 210. This can reduce the occupation of the layout area by the ground via 220. This arrangement mode divides the two ground vias 220 originally required to strictly match the signal vias 210 into the entire rectangular structure by surrounding the outer periphery of the signal via 210. This can save the area occupied by the ground via 220 on the premise of ensuring sufficient reflow ground area, thereby effectively improving the utilization rate of the area of the signal via 210 on the circuit board, releasing more wiring areas, supporting the high-density wiring demand, and thus being beneficial to the miniaturization design of the circuit board. On the other hand, the ground via 220 of the rectangular structure can form a multi-angle symmetrical structure relative to the two signal vias 210. The continuity of the rectangular structure can improve the impedance matching of the reflow path and play a role in reducing signal crosstalk. Compared with the single-to-single corresponding mode of the signal via 210 and the ground via 220, the ground via 220 in the embodiments of the present application is a whole structure surrounding the outer periphery of the signal via 210. This can weaken the corresponding relationship between the signal via 210 and the ground via 220, thereby reducing the wiring difficulty.

[0043] In some embodiments, the long side 221 and the short side 222 have the same width. Thus, a uniform reflow path can be formed on the outer periphery of the signal via 210, which is beneficial to reducing signal crosstalk.

[0044] It should be understood that, for the long side 221, the width refers to the dimension along the Y direction. For the short side 222, the width refers to the dimension along the X direction. Figure 5

[0045] Specifically, for the existing manufacturing process of the circuit board, the diameters of various vias on the circuit board cannot be reduced unlimitedly. Under the condition of meeting the existing process, the vias on the circuit board body 100 have a minimum diameter. The above width is greater than or equal to the minimum diameter.

[0046] ​In some embodiments, the distance between the long side 221 and the signal via 210 and the distance between the short side 222 and the signal via 210 are greater than or equal to the minimum distance between two adjacent vias on the circuit board body 100.

[0047] The distance between the long side 221 and the signal via 210 and the distance between the short side 222 and the signal via 210 are greater than or equal to the minimum distance between two adjacent vias on the circuit board body 100.

[0048] In some specific embodiments, the minimum distance between two adjacent vias on the circuit board body 100 can be determined according to the following formula: Figure 5 , where d is the minimum diameter, m is the minimum distance, D is the diameter of the signal via, and L is the distance between two signal vias. The short side 222 includes a first short side 222a and a second short side 222b, which are parallel to each other. The first short side 222a has a first drilling point a on the extension line 20, and the second short side 222b has a second drilling point b on the extension line 20. The distance between the first drilling point a and the second drilling point b and the perpendicular line 30 is .

[0049] After the first drilling point a and the second drilling point b are formed, the first short side 222a and the second short side 222b can be formed by drilling holes on the circuit board. Specifically, the first drilling point a and the second drilling point b can be used as the reference to form the first drilling hole and the second drilling hole, respectively. Then, the first short side 222a can be formed based on the first drilling hole, and the second short side 222b can be formed based on the second drilling hole.

[0050] The first drilling point a and the second drilling point b are formed based on the minimum diameter d and the minimum distance m, so that the first short side 222a and the second short side 222b form two short sides in the minimum rectangular structure.

[0051] The width of the first short side 222a and the second short side 222b is d, and the length of the first short side 222a and the second short side 222b is D+2m+2d.

[0052] In some specific embodiments, the minimum distance between two adjacent vias on the circuit board body 100 can be determined according to the following formula: Figure 5 , where d is the minimum diameter, m is the minimum distance, D is the diameter of the signal via, and L is the distance between two signal vias. The long side 221 includes a first long side 221a and a second long side 221b, which are parallel to each other. The first long side 221a has a third drilling point c on the perpendicular line 30, and the second long side 221b has a fourth drilling point e on the perpendicular line 30. The distance between the third drilling point c and the fourth drilling point e and the connecting line 10 is .

[0053] After the third drilling point c and the fourth drilling point e are formed, the first long side 221a and the second long side 221b can be formed by drilling holes on the circuit board, specifically, the third drilling hole and the fourth drilling hole can be formed respectively based on the third drilling point c and the fourth drilling point e, and then the first long side 221a is formed based on the third drilling hole and the second long side 221b is formed based on the fourth drilling hole.

[0054] Since the third drilling point d and the fourth drilling point e are formed based on the minimum diameter d and the minimum distance m, the first long side 221a and the second long side 221b form two long sides in the smallest rectangular structure.

[0055] The width of the first long side 221a and the second long side 221b is d, and the length of the first long side 221a and the second long side 221b is 2D+L+2m+2d.

[0056] It can be understood that the first short side 222a, the second short side 222b, the first long side 221a and the second long side 221b can form the smallest rectangular structure, so that the ground via hole 220 surrounds the outer periphery of the signal via hole 210 with the smallest area, thereby effectively improving the area utilization of the signal via hole 210 on the circuit board, releasing more wiring area, supporting the demand for high-density wiring, and facilitating the miniaturization design of the circuit board.

[0057] In some embodiments, the rectangular structure is filled with a composite filling structure, which includes a copper layer in the inner layer and a conductive adhesive layer in the outer layer, and the copper layer is connected to the inner wall of the rectangular structure.

[0058] By introducing the composite filling structure into the rectangular structure, the impedance characteristics of the reflow path can be optimized by using the conductive properties of different materials. Specifically, the copper layer provides a low-resistance main reflow path, and the conductive adhesive layer can be filled in the via edge to compensate for the impedance discontinuity of the main reflow path through its high conductivity and low dielectric constant. This design can reduce the total resistance and inductance of the via, thereby reducing the reflection and loss of high-speed signals. In addition, the flexibility of the conductive adhesive can absorb the internal stress of the circuit board body 100, enhancing the long-term stability of the via.

[0059] Therefore, the composite filling structure described above can optimize the impedance mismatch problem while improving the reflow efficiency, further improve the signal integrity, and prolong the service life of the circuit board.

[0060] In some embodiments, the edge of the rectangular structure is provided with a micro groove structure 300 in communication with the rectangular structure, and the micro groove structure 300 is filled with a conductive material.

[0061] The micro-groove structure 300 can expand the backflow area, reduce the current density of the rectangular structure, and thus reduce the risk of heat generation. Meanwhile, the filling of the conductive material can supplement the impedance discontinuity of the main backflow path, and thus improve the signal integrity.

[0062] In some embodiments, the micro-groove structure 300 is multiple, and the multiple micro-groove structures 300 are uniformly spaced along the circumference of the rectangular structure.

[0063] The uniform spacing of the multiple micro-groove structures 300 can further reduce the current density of the ground via hole 220 in the rectangular structure, thereby reducing the risk of heat generation, and further improving the signal integrity.

[0064] Figure 5 A forming diagram of a rectangular structure with signal vias 210 arranged in a horizontal direction is shown; Figure 6 A forming diagram of a rectangular structure with signal vias 210 arranged in a vertical direction is shown; Figure 7 A forming diagram of a rectangular structure with signal vias 210 arranged in an inclined direction is shown; Figure 8 A forming diagram of another rectangular structure with signal vias 210 arranged in an inclined direction is shown.

[0065] In the embodiments of the present application, please refer to Figure 5 The through-hole arrangement method of the circuit board comprises:

[0066] S100, arranging two signal vias 210 in a straight line according to the diameter of the signal via 210 and the straight-line distance between the two signal vias 210.

[0067] The diameter of the signal via 210 and the straight-line distance between the signal vias 210 can be set according to requirements. The straight-line distance refers to the shortest distance between the two signal vias 210.

[0068] As described above, the two signal vias 210 can be arranged in a horizontal direction, a vertical direction, or an inclined direction.

[0069] The two signal vias 210 can be formed by a conventional drilling process, and the specific drilling process for forming the signal via 210 is not described in detail.

[0070] S200, establishing a two-dimensional coordinate system with the line 10 between the two signal vias 210 as the X-axis, the median line of the line 10 as the Y-axis, and the center point on the line 10 as the coordinate origin.

[0071] The coordinate system is established to set a reference datum for subsequent formation of the rectangular structure. Specifically, the X-axis of the coordinate system can be located on the line 10 between the two signal vias 210, and the Y-axis of the coordinate system can be located on the perpendicular bisector of the line 10.

[0072] In Figure 5 In the example shown, the solid line portion on the X-axis is the line 10, and the dashed line portion is the extension 20 of the line 10.

[0073] S300, set two long sides 221 with the X-axis as the symmetry axis and set the length and width of the long sides 221, set two short sides 222 with the Y-axis as the symmetry axis and set the length and width of the short sides 222, and the two long sides 221 and the two long sides 221 are wrapped around the outer periphery of the two signal vias 210.

[0074] Since the two long sides 221 have the X-axis as the symmetry axis, the two long sides 221 can extend in a direction parallel to the X-axis. Since the two short sides 222 have the Y-axis as the symmetry axis, the two short sides 222 can extend in a direction parallel to the Y-axis.

[0075] In the above via arrangement method, a coordinate system is established based on the two signal vias 210, and a rectangular structure is formed based on the coordinate system. The via layout scheme on the circuit board can be finally formed, which can adapt to the transmission of differential signals. The via arrangement method can quickly complete the construction of the via layout scheme, and has the advantage of precise construction.

[0076] In some embodiments, the width of the long side 221 and the short side 222 is the same, and the via on the circuit board body 100 has a minimum diameter that meets the process requirements, and the width is greater than or equal to the minimum diameter.

[0077] In some embodiments, the distance between the two adjacent vias on the circuit board body 100 has a minimum spacing that meets the process requirements, and the distance between the long side 221 and the signal via 210 and the distance between the short side 222 and the signal via 210 are greater than or equal to the minimum spacing.

[0078] In some embodiments, for the convenience of understanding and simplifying the description, the above minimum diameter is d, the minimum spacing is m, the diameter of the signal via 210 is D, and the distance between the two signal vias 210 is L.

[0079] To form a rectangular structure, it can be divided into two processes, which are setting two short sides 222 with the Y-axis as the symmetry axis and setting two long sides 221 with the X-axis as the symmetry axis. The specific process is as follows:

[0080] Please refer to Figure 5 , the coordinates are ( At coordinates (0), a first drilling point a is set, and a first short side 222a is set based on the first drilling point a. The width of the first short side 222a is d, and the length of the first short side 222a is D+2m+2d. At point 0, a second drilling point b is set, and a second short side 222b is set based on the second drilling point b. The width of the second short side 222b is d, and the length of the second short side 222b is D+2m+2d.

[0081] Continue to refer to Figure 5 At coordinates (0, A third drilling point c is set at (0, -( ) , and a first long side 221a is set based on the third drilling point c. The width of the first long side 221a is d, and the length of the first long side 221a is 2D+L+2m+2d; at coordinates (0, -( Set the fourth drilling point e at point e, and set the second long side 221b based on the fourth drilling point e. The width of the second long side 221b is d, and the length of the second long side 221b is 2D+L+2m+2d.

[0082] The above process involves forming the short side 222 first and then the long side 221. Since the long side 221 is longer than the short side 222, this method of forming the short side 222 first and then the long side 221 can ensure the orderly progress of the entire process and ensure the stability of the rectangular structure during its formation.

[0083] The above embodiments provide a detailed description of the via layout of a circuit board including signal vias 210 arranged in a horizontal direction. The following, in conjunction with... Figure 6 A detailed description is provided of the via layout of a circuit board containing signal vias 210 arranged in a vertical direction, with a focus on the portion forming a rectangular structure.

[0084] Please refer to Figure 6 To facilitate understanding and simplify the explanation, we will take the minimum diameter as d, the minimum spacing as m, the diameter of the signal via 210 as D, and the distance between the two signal vias 210 as L as an example.

[0085] To form a rectangular structure, this can be divided into two processes: setting two short sides 222 with the Y-axis as the axis of symmetry and setting two long sides 221 with the X-axis as the axis of symmetry. The specific processes are as follows:

[0086] Please refer to Figure 6 At coordinates ( At coordinates (0), a first drilling point a is set, and a first short side 222a is set based on the first drilling point a. The width of the first short side 222a is d, and the length of the first short side 222a is D+2m+2d. At point 0, a second drilling point b is set, and a second short side 222b is set based on the second drilling point b. The width of the second short side 222b is d, and the length of the second short side 222b is D+2m+2d.

[0087] Continue to refer to Figure 6 At coordinates (0, A third drilling point c is set at (0, -( ) , and a first long side 221a is set based on the third drilling point c. The width of the first long side 221a is d, and the length of the first long side 221a is 2D+L+2m+2d; at coordinates (0, -( Set the fourth drilling point e at point e, and set the second long side 221b based on the fourth drilling point e. The width of the second long side 221b is d, and the length of the second long side 221b is 2D+L+2m+2d.

[0088] The following is combined with Figure 7 and Figure 8 A detailed description is provided of the via layout of a circuit board containing signal vias 210 arranged in a vertical direction, with a focus on the portion forming a rectangular structure.

[0089] Please refer to Figure 7 and Figure 8 To facilitate understanding and simplify the explanation, we will use the minimum diameter as d, the minimum spacing as m, the diameter of the signal via 210 as D, and the distance between two signal vias 210 as L as an example.

[0090] To form a rectangular structure, it can be divided into two processes: setting two short sides 222 with the Y-axis as the axis of symmetry and setting two long sides 221 with the X-axis as the axis of symmetry. The specific processes are as follows:

[0091] Please refer to Figure 7 and Figure 8 At coordinates ( At coordinates (0), a first drilling point a is set, and a first short side 222a is set based on the first drilling point a. The width of the first short side 222a is d, and the length of the first short side 222a is D+2m+2d. At point 0, a second drilling point b is set, and a second short side 222b is set based on the second drilling point b. The width of the second short side 222b is d, and the length of the second short side 222b is D+2m+2d.

[0092] Continue to refer to Figure 7 and Figure 8 At coordinates (0, ) and the third drilling point c is set, the first long side 221a is set based on the third drilling point c, the width of the first long side 221a is d, and the length of the first long side 221a is 2D+L+2m+2d; at the coordinates (0, - (D+L+2m+d) in the coordinate system, the fourth drilling point e is set, the second long side 221b is set based on the fourth drilling point e, the width of the second long side 221b is d, and the length of the second long side 221b is 2D+L+2m+2d. ) and the third drilling point c is set, the first long side 221a is set based on the third drilling point c, the width of the first long side 221a is d, and the length of the first long side 221a is 2D+L+2m+2d; at the coordinates (0, - (D+L+2m+d) in the coordinate system, the fourth drilling point e is set, the second long side 221b is set based on the fourth drilling point e, the width of the second long side 221b is d, and the length of the second long side 221b is 2D+L+2m+2d.

[0093] In order to make the person skilled in the art better understand the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0094] The circuit board and the via arrangement method thereof provided by the present application are described in detail above. The principles and embodiments of the present application are described by applying specific examples in this paper, and the above description of the embodiments is only used to help understand the method and core idea of the present application. It should be pointed out that, for the person skilled in the art, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A circuit board, characterized by, The application relates to a circuit board body provided with a via structure for adapting differential signals, the via structure comprising signal vias and ground vias, the signal vias being two and arranged in a straight line, the ground vias being a continuous rectangular structure and surrounding the outer periphery of the signal vias, the rectangular structure comprising two long sides and two short sides, the two long sides being symmetrical to the line connecting the two signal vias, the two short sides being symmetrical to the perpendicular bisector of the line, and the center points of the two signal vias being on the extension line of the line. The width of the long side and the short side is the same, the via on the circuit board body has a minimum diameter meeting the process requirement, and the width is greater than or equal to the minimum diameter.

2. The circuit board of claim 1, wherein The distance between the long side and the signal via and the distance between the short side and the signal via are greater than or equal to the minimum distance meeting the process requirement.

3. The circuit board of claim 2, wherein, The width of the first short side and the second short side is d, and the length of the first short side and the second short side is D+2m+2d.

4. The circuit board of claim 3, wherein The minimum diameter has a size of d, the minimum distance has a size of m, the diameter of the signal through hole has a size of D, the distance between two signal through holes has a size of L, the short side comprises a first short side and a second short side which are parallel to each other, the first short side has a first drilling point on the extension line, the second short side has a second drilling point on the extension line, the distance between the first drilling point and the second drilling point and the perpendicular line is .

5. The circuit board of claim 4, wherein, The width of the first long side and the second long side is d, and the length of the first long side and the second long side is 2D+L+2m+2d.

6. The circuit board of claim 4, wherein The long side includes a first long side and a second long side which are parallel to each other, the first long side has a third drilling point on the median line, the second long side has a fourth drilling point on the median line, the third drilling point and the fourth drilling point are away from the connecting line by .

7. The circuit board of claim 6, wherein, The rectangular structure is filled with a composite filling structure, the composite filling structure comprising a copper layer in an inner layer and a conductive adhesive layer in an outer layer, and the copper layer is connected to the inner wall of the rectangular structure.

8. The circuit board according to any one of claims 1 to 7, characterized by, The edge of the rectangular structure is provided with a micro groove structure in communication with the rectangular structure, and the micro groove structure is filled with conductive material.

9. The circuit board according to any one of claims 1 to 7, characterized by, The micro groove structure is multiple, and the multiple micro groove structures are uniformly and spacedly arranged along the circumference of the rectangular structure.

10. The circuit board of claim 9, wherein, ​

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