Hybrid cooling system for electronic devices

Abstract

An apparatus includes a heat source, a vapor chamber, a bridge, and a heat pipe. The vapor chamber is in thermal communication with the heat source and includes a working fluid. The heat pipe is in thermal communication with the heat sink and is in fluid communication with the vapor chamber via the bridge.

Description

Cross-reference to related applications

[0001] This application claims priority to jointly owned U.S. non-provisional patent application No. 18 / 363,924, filed August 2, 2023, the entire contents of which are expressly incorporated herein by reference. Technical Field

[0002] Various features are involved in thermal management in equipment. Background Technology

[0003] State-of-the-art mobile applications demand small form factors, low costs, tightly controlled power consumption, and superior electrical performance. Mobile packaging designs have continuously evolved to meet these conflicting goals, enabling mobile applications that support enhanced multimedia. However, these mobile devices are susceptible to uneven heating and overheating when multiple heat sources are placed within a small form factor. Summary of the Invention

[0004] Various features are involved in thermal management in equipment.

[0005] One example provides a device including a heat source, a heat spreader, a bridging element, and heat pipes. The heat spreader is in thermal communication with the heat source and includes a working fluid. The heat pipes are in thermal communication with a radiator and are in fluid communication with the heat spreader via the bridging element.

[0006] Another example provides a device including a heat pipe, a bridging element, and a vapor chamber. The heat pipe is in thermal communication with a heat source. The vapor chamber includes a working fluid and is in fluid communication with the heat pipe via the bridging element.

[0007] Another example provides a method comprising: forming a vapor chamber and forming a heat pipe. The method further comprises: forming a bridging element between the vapor chamber and the heat pipe to achieve fluid communication between them. The method further comprises: adding working fluid to a volume defined by the vapor chamber, the heat pipe, and the bridging element.

[0008] Another example provides a method comprising: transferring heat from a heat source to a working fluid within a first heat exchange device. The method further comprises: transferring the working fluid to a second heat exchange device via a bridging member. The method further comprises: transferring heat from the working fluid within the second heat exchange device to a radiator. One of the first and second heat exchange devices is a heat spreader, and the other of the first and second heat exchange devices is a heat pipe. Attached Figure Description

[0009] The various features, essence, and advantages will become apparent when the detailed description set forth below is understood in conjunction with the accompanying drawings, in which similar reference characters are used for corresponding identification throughout.

[0010] Figure 1A A specific implementation of a cooling system for a mixing device is illustrated.

[0011] Figure 1B Examples include Figure 1A The specific implementation of the equipment structure of the mixing equipment cooling system.

[0012] Figure 1C Examples include Figure 1B The specific implementation of the equipment structure.

[0013] Figure 2A Examples include Figure 1B A perspective view of a specific implementation of the equipment structure.

[0014] Figure 2B Examples include Figure 1B A perspective view of a specific implementation of the equipment structure.

[0015] Figure 3 An exemplary flowchart illustrating a method for manufacturing a cooling system for a mixing device is shown.

[0016] Figure 4 An exemplary flowchart illustrating a method using a hybrid cooling system is provided. Detailed Implementation

[0017] In the following description, specific details are set forth to provide a thorough understanding of the various aspects of this disclosure. However, those skilled in the art will understand that these aspects can be practiced without these specific details. For example, circuits may be shown as block diagrams to avoid complicating these aspects with unnecessary detail. In other instances, well-known circuits, structures, and techniques may not be shown in detail to avoid complicating these aspects of this disclosure.

[0018] Specific aspects of this disclosure are described below with reference to the accompanying drawings. In this description, common features are designated by common reference numerals. As used herein, various terms are used only for the purpose of describing particular embodiments and are not intended to limit the scope of the embodiments. For example, the singular forms “a,” “an,” and “the” are intended to also include the plural forms, unless the context clearly indicates otherwise. Furthermore, some features described herein are singular in some embodiments and plural in others. For ease of reference herein, such features are generally introduced as “one or more” features and are subsequently referred to in the singular or optional plural form (as indicated by “(multiple)”), unless the aspect relating to multiples of features is being described.

[0019] As used herein, the term “comprise” may be used interchangeably with “include”. As used herein, “exemplary” indicates an example, specific implementation, and / or aspect, and should not be construed as restrictive or indicating a preference or preferred implementation. As used herein, ordinal terms used to modify elements (such as structures, components, operations, etc.) (e.g., “first,” “second,” “third,” etc.) do not themselves indicate any priority or order of that element relative to another element, but merely distinguish that element from another element with the same name (but using ordinal terms). As used herein, the term “set” refers to one or more specific elements within a set of specific elements, while the term “multiple” refers to multiple (e.g., two or more) specific elements.

[0020] State-of-the-art mobile applications demand small form factors, low cost, tightly controlled power consumption, and superior electrical performance. Mobile packaging designs are constantly evolving to meet these conflicting goals, enabling mobile applications that support multimedia enhancements. For example, mobile application devices may include multiple antenna modules and system-on-a-chip (SoC) comprising one or more processors. However, these mobile applications are susceptible to overheating issues when multiple heat sources (e.g., antenna modules and SoC) are housed within a small form factor.

[0021] Various aspects of this disclosure provide a hybrid device cooling system including a heat spreader and heat pipes in fluid communication with the heat spreader via bridging elements. The heat spreader and heat pipes can be coupled to one or more heat sources to improve heat distribution.

[0022] Exemplary specific implementations including hybrid cooling systems Figure 1A A specific implementation of a cooling system 100 (e.g., a hybrid cooling system) is illustrated, which includes a heat spreader 102 coupled to a heat pipe 106 via a bridging member 104. Figure 1A The image shows a top view of the cooling system 100.

[0023] In a particular aspect, the vapor chamber 102 corresponds to a rectangular container. For example, the vapor chamber 102 has a face 174, a back surface 170, and four edges 172 (e.g., edges 172A, 172B, 172C, and 172D) defining a space between them. The face 174 is opposite to the back surface 170, edge 172A is opposite to edge 172C, and edge 172B is opposite to edge 172D. In a particular aspect, the surface area of ​​the face 174 is larger than the surface area of ​​each of the edges 172, and is the same as the surface area of ​​the back surface 170. In a particular aspect, the heat pipe 106 corresponds to a hollow pipe.

[0024] In certain aspects, the vapor chamber 102, the bridging element 104, and the heat pipe 106 are made of a conductive material (e.g., copper, aluminum, or both). The bridging element 104 is formed between the vapor chamber 102 and the heat pipe 106 to achieve fluid communication between them. According to some embodiments, a wicking structure extends between the vapor chamber 102 and the heat pipe 106. In one example, the vapor chamber 102 includes a first portion of the wicking structure, the bridging element 104 includes a second portion of the wicking structure, and the heat pipe 106 includes a third portion of the wicking structure. According to some embodiments, the grain size of the wicking structure is greater than or equal to 8 micrometers and less than or equal to 12 micrometers. In a particular example, the characteristic grain size of the wicking structure is approximately equal to 10 micrometers.

[0025] A working fluid is added to the volume defined by the vapor chamber 102, the bridging element 104, and the heat pipe 106. In some embodiments, the working fluid includes water, distilled water, acetone, one or more additives, or combinations thereof. The working fluid has a thermal conductivity greater than a threshold (e.g., greater than or equal to 0.6 W / m Kelvin at room temperature (25°C)) and a boiling point below a threshold (e.g., less than or equal to 100°C). In some embodiments, the operating pressure of the cooling system 100 may be set to achieve a lower boiling point (e.g., less than or equal to room temperature). The working fluid enables the heat pipe 106 to be in fluid communication with the vapor chamber 102 via the bridging element 104.

[0026] In one example, the vapor chamber 102 is in thermal communication with a heat source coupled to (e.g., adjacent to) the vapor chamber 102. In certain aspects, the heat source includes: one or more processors, a system-on-a-chip (SoC) including one or more processors, a central processing unit (CPU), a graphics processing unit (GPU), an audio processor, a video processor, a display, or a combination thereof. When the heat source generates heat, the air inside the vapor chamber 102 is heated, and the working fluid undergoes a phase change from liquid to vapor at a relatively low temperature. According to some specific embodiments, the vapor chamber 102 includes one or more evaporator sections, wherein heat from the heat source is applied to the working fluid and the working fluid undergoes a phase change from liquid to vapor.

[0027] As the working fluid (e.g., as vapor) diffuses away from the heat source, it is transferred from the heat spreader 102 to the heat pipe 106 via the bridging member 104. When the working fluid encounters a cooler region of the heat pipe 106, it condenses into a liquid phase. According to some embodiments, the heat pipe 106 is in thermal communication with one or more radiators. These radiators may include the surrounding environment, a heat diffuser, or both. Regions of the heat pipe 106 cooled by the radiators cause the working fluid in those regions to condense. The working fluid (e.g., as a liquid) flows back to the heat spreader 102 via the bridging member 104. In certain aspects, the working fluid flows back from the heat pipe 106 to the heat spreader 102 via a wicking structure (e.g., via capillary action).

[0028] In certain aspects, the vapor chamber 102 includes one or more condenser sections in which the working fluid (e.g., as vapor) condenses back into a liquid state. For example, the one or more condenser sections are coupled to one or more radiators. The working fluid can move away from one or more evaporator sections of the vapor chamber 102 to one or more condenser sections and via bridging member 104 to heat pipe 106.

[0029] According to some specific implementations, heat pipe 106 is thermally connected to one or more additional heat sources (e.g., antenna module 122). In one example, antenna module 122 includes a fifth-generation (5G) millimeter-wave (mmWave) beamformer. It should be understood that antenna module 122 is used as an exemplary example of a heat source, and in other examples, heat pipe 106 may be thermally connected to one or more other types of heat sources.

[0030] In certain aspects, heat pipe 106 includes one or more evaporator sections and one or more condenser sections. In one example, the evaporator section is in thermal communication with a heat source and the condenser section is in thermal communication with a heat sink. For example, the evaporator section is coupled to antenna module 122, and the condenser section is exposed to the surrounding environment, coupled to a heat diffuser, or both. When the heat source generates heat, the working fluid in the evaporator section absorbs heat and undergoes a phase change from liquid to vapor. The working fluid moves away from the heat source toward the condenser section and condenses back into the liquid phase.

[0031] Figure 1B An example of a device structure 150 is shown, including a cooling system 100 coupled to a printed circuit board (PCB) 108. Figure 1B The image shows a bottom view of the cooling system 100. According to some specific embodiments, a heat spreader 102 and a bridging element 104 are embedded in a PCB 108.

[0032] In a particular aspect, device structure 150 includes one or more brackets 120 coupled to heat pipe 106. A heat source (e.g., antenna module 122) may be attached to bracket 120 to enable thermal communication between heat pipe 106 and heat source. For example, a portion of heat pipe 106 is located on bracket 120, and bracket 120 is in thermal communication with heat source. In a particular embodiment, at least a portion of heat pipe 106 is located on the periphery of PCB 108 to enable heat pipe 106 to be in thermal communication with the surrounding environment.

[0033] Figure 1C An example is shown of device 190, which includes device structure 150. In Figure 1C The image shows a top view of the cooling system 100. In certain aspects, device 190 includes at least one of a mobile device, a mobile test platform (MTP), a laptop computer, a communication device, or an Internet of Things (IoT) device. In one example, a vapor chamber 102, a bridging element 104, a heat pipe 106, one or more heat sources, or combinations thereof, are integrated into at least one of the mobile device, MTP, laptop computer, communication device, or IoT device.

[0034] In a particular aspect, device 190 is rectangular. For example, device 190 includes a face 164, a back face 160, and four edges 162 (e.g., edges 162A, 162B, 162C, and 162D). Face 164 is opposite to back face 160, edge 162A is opposite to edge 162C, and edge 162B is opposite to edge 162D. In a particular aspect, the surface area of ​​face 164 is greater than the surface area of ​​each of the edges 162, and is the same as the surface area of ​​back face 160.

[0035] In a particular aspect, face 174 of the vapor chamber 102 is aligned with face 164 of the device 190. In a particular aspect, back face 170 of the vapor chamber 102 is aligned with back face 160 of the device 190. In a particular aspect, a heat source (not shown) of the device 190 is coupled to (e.g., adjacent to or adjacent to) the back face 170 of the vapor chamber 102. For example, a SoC including one or more processors is coupled to the back face 170 of the vapor chamber 102. As another example, one or more processors are coupled to the back face 170 of the vapor chamber 102. In a particular aspect, the vapor chamber 102 is located between the heat source and face 164 of the device 190. According to some specific embodiments, a display of the device 190 is located between face 174 of the vapor chamber 102 and face 164 of the device 190.

[0036] In a particular aspect, a first portion of the bridging member 104 is positioned along face 164 of the device 190, and a second portion of the bridging member 104 is positioned along edge 162A. In a particular aspect, at least a portion of the heat pipe 106 is located on the periphery of the device 190. For example, a first portion of the heat pipe 106 is positioned along at least a portion of edge 162A, a second portion of the heat pipe 106 is positioned along edge 162D, and a third portion of the heat pipe 106 is positioned along at least a portion of edge 162C. In a particular embodiment, the device 190 includes a mobile device, and at least a portion of the heat pipe 106 is located on the edge of the mobile device.

[0037] Positioning at least a portion of heat pipe 106 along the periphery of device 190 allows that portion of heat pipe 106 to be exposed to the surrounding environment while keeping heat pipe 106 away from one or more heat sources (such as SoC, processor, etc.). In some examples, a particular active heat source (e.g., antenna module 122) generates more heat than another inactive heat source (e.g., another antenna module 122), and the technical advantages of cooling system 100 include achieving heat distribution to reduce the temperature difference between active and inactive areas, thereby preventing overheating of the active area.

[0038] It should be understood that the specific implementations of the vapor chamber 102, the bridging element 104, and the heat pipe 106 are provided as exemplary examples, and in other examples, the vapor chamber 102, the bridging element 104, the heat pipe 106, or combinations thereof may have other locations, other shapes, other sizes, or combinations thereof.

[0039] In certain respects, one or more portions of the heat pipe 106 are angled based on the intended location of a heat source (e.g., antenna module 122). Although Figure 1A , Figure 1B and Figure 1C The cooling system 100 is illustrated as including a single heat spreader 102 and a single heat pipe 106, but in some other examples, the cooling system 100 may include one or more heat spreaders 102 coupled to one or more heat pipes 106. For illustration, in a particular example, multiple heat spreaders 102 are in fluid communication with heat pipes 106 via bridging members 104. In another example, a first heat spreader 102 is in fluid communication with heat pipes 106 via a first bridging member 104, and a second heat spreader 102 is in fluid communication with heat pipes 106 via a second bridging member 104. In yet another example, a first heat spreader 102 is in fluid communication with a first heat pipe 106 via a first bridging member 104, and a second heat spreader 102 is in fluid communication with a second heat pipe 106 via a second bridging member 104.

[0040] Figure 2A Examples include Figure 1B A perspective view 200 of a specific embodiment of the device structure 150 and the device 290. Figure 2B Another perspective view 250 of device 290 is shown.

[0041] Device 290 includes the above reference. Figures 1A to 1C Many of the same components and features described. These components and features are identical in entity and operation to those referenced above. Figures 1A to 1C The described components and features are the same, and in Figure 2A and Figure 2B The same reference numerals are used for identification. In some specific embodiments, device 290 includes, for example, Figure 1A Cooling system 100 Figure 1B Equipment structure 150, Figure 1C All features and components of the same features and components of the device 190 or combinations thereof; however, Figures 1A to 1C Some of the components and features illustrated have been removed from Figure 2A and Figure 2B Omissions (or omission of reference numerals in the figures) are used for simplification and to emphasize the differences between device 290 and one or more of the cooling system 100, device structure 150, or device 190. Such omissions of features and reference numerals should not be construed as meaning that... Figure 2A and Figure 2B The features and components are limited to those specifically indicated below. For example, although Figure 2A And not shown Figure 1B The bracket 120 is marked, but the device 290 may include the bracket 120.

[0042] Device 290 includes a heat diffuser 220 located between PCB 108 and surface 164. In a particular aspect, device 290 includes a display (e.g., a touchscreen) located between PCB 108 and surface 164. In a particular aspect, heat diffuser 220 is located between PCB 108 (e.g., including a heat spreader 102) and the display. In a particular aspect, cooling system 100 is coupled to heat diffuser 220. For example, a portion of heat pipe 106 is coupled to heat diffuser 220. The technical advantages of heat diffuser 220 coupled to heat pipe 106 may include providing additional heat distribution.

[0043] Exemplary flowchart of a method for manufacturing a cooling system for a mixing device In some specific implementations, manufacturing a cooling system for a mixing device involves several processes. Figure 3 An exemplary flowchart illustrating a method 300 for providing or manufacturing a cooling system for a mixing device is shown. In some specific embodiments, Figure 3 Method 300 can be used to provide or manufacture Figure 1A The cooling system 100.

[0044] It should be pointed out that, Figure 3Method 300 may combine one or more processes to simplify and / or clarify the method for providing or manufacturing a cooling system for a mixing device. In some specific implementations, the order of the processes may be changed or modified.

[0045] At frame 302, method 300 includes forming a heat spreader. For example, a highly conductive material (e.g., copper, aluminum, stainless steel, or a combination thereof) is stamped or milled to produce a substrate corresponding to the back surface 170 of the heat spreader 102 and a cover plate corresponding to the front surface 174 of the heat spreader 102. The substrate and the cover plate are assembled to form the heat spreader 102.

[0046] At frame 304, method 300 includes forming a heat pipe. For example, a highly conductive pipe (e.g., copper, aluminum, stainless steel, or a combination thereof) is evacuated to create a vacuum. The evacuation pipe corresponds to heat pipe 106.

[0047] At frame 306, method 300 includes forming a bridging element between the heat spreader and the heat pipe to achieve fluid communication between them. For example, a highly conductive tube (e.g., copper, aluminum, stainless steel, or a combination thereof) is evacuated to create a vacuum. The evacuation tube corresponds to bridging element 104. For example, a first evacuation tube corresponding to bridging element 104 is connected to the substrate, cover plate, or both of the heat spreader 102 and to a second evacuation tube corresponding to heat pipe 106 to achieve fluid communication between them. In a particular embodiment, an opening is formed on one side of the second evacuation tube, and the opening of the first evacuation tube is attached to that opening.

[0048] At block 308, method 300 includes adding working fluid to a volume defined by the vapor chamber, the heat pipe, and the bridging element. For example, working fluid is added to a volume defined by vapor chamber 102, bridging element 104, and heat pipe 106. In a particular embodiment, bridging element 104 is attached to vapor chamber 102 and heat pipe 106 before the working fluid is added, and the cooling system 100 (e.g., vapor chamber 102, bridging element 104, and heat pipe 106) is sealed after the working fluid is added.

[0049] In a particular embodiment, method 300 includes forming a wicking structure extending between a heat spreader and a heat pipe. For example, the wicking structure is formed of a material such as sintered metal, a screen, a grooved surface, or a combination thereof. In a particular aspect, the wicking structure is inserted into the heat spreader 102 via heat pipe 106 and bridging member 104. In a particular aspect, the wicking structure is inserted after bridging member 104 has been attached to the heat spreader 102, heat pipe 106, or both.

[0050] According to some specific embodiments, the wicking structure is manufactured in the cooling system 100 (e.g., heat spreader 102, bridging member 104, and heat pipe 106). For example, the cooling system 100 includes molten metal, and gas is injected into the molten metal to form a foam-like structure as the wicking structure.

[0051] In one aspect, working fluid is added before (e.g., insertion or fabrication) the wicking structure. In another aspect, working fluid is added after (e.g., insertion or fabrication) the wicking structure. The cooling system 100 is sealed after (e.g., insertion or fabrication) the wicking structure and the addition of working fluid.

[0052] In a particular embodiment, the heat pipe 106 is shaped (e.g., bent or angled) to achieve a predetermined configuration. In a particular embodiment, the heat pipe 106 is shaped before the wicking structure is formed in the cooling system 100. In an alternative embodiment, the heat pipe 106 is shaped after the wicking structure is formed in the cooling system 100.

[0053] Exemplary flowchart of a method using a hybrid cooling system In some specific implementations, the use of a hybrid equipment cooling system involves several processes. Figure 4 An exemplary flowchart illustrating a method 400 using a hybrid cooling system is shown. In some specific implementations, Figure 4 Method 400 is to use Figure 1A The cooling system 100.

[0054] It should be pointed out that, Figure 4 Method 400 may combine one or more processes to simplify and / or clarify the method of using a hybrid equipment cooling system. In some specific implementations, the order of the processes may be changed or modified.

[0055] At block 402, method 400 includes transferring heat from a heat source to a working fluid within a first heat exchange device. In a first example, heat from a heat source (e.g., the SoC of device 190 or device 290) is transferred to a working fluid within a vapor chamber 102. In a second example, heat from a heat source (e.g., the SoC of device 190 or device 290) is transferred to a working fluid within a heat pipe 106.

[0056] At block 404, method 400 includes delivering the working fluid to a second heat exchange device via a bridging member. In a first example, the working fluid is delivered from a heat spreader 102 to a heat pipe 106 via a bridging member 104. In a second example, the working fluid is delivered from a heat pipe 106 to a heat spreader 102 via a bridging member 104.

[0057] At block 406, method 400 includes transferring heat from the working fluid within the second heat exchange device to a radiator, wherein one of the first and second heat exchange devices is a vapor chamber, and the other is a heat pipe. In a first example, heat from the working fluid within heat pipe 106 is transferred to the radiator (e.g., ambient environment, thermal diffuser 220, or both). In a second example, heat from the working fluid within vapor chamber 102 is transferred to the radiator (e.g., the condenser portion of vapor chamber 102).

[0058] Figures 1A to 4 One or more of the illustrated components, processes, features, and / or functions may be rearranged and / or combined into a single component, process, feature, or function, or embodied in several components, processes, or functions. Additional elements, components, processes, and / or functions may also be added without departing from this disclosure. In some specific embodiments, Figures 1A to 4 The descriptions thereon can be used to manufacture, establish, provide and / or produce hybrid cooling systems and / or equipment that includes hybrid cooling systems.

[0059] It should be noted that the accompanying drawings in this disclosure may represent actual and / or conceptual representations of various parts, components, objects, devices, packages, integrated devices, integrated circuits, and / or transistors. In some instances, the drawings may not be to scale. In some instances, not all components and / or parts are shown for clarity. In some instances, the positioning, location, size, and / or shape of the various parts and / or components in the drawings may be exemplary. In some specific embodiments, the various components and / or parts in the drawings may be optional.

[0060] The term “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any specific implementation or aspect described herein as “exemplary” is not necessarily to be construed as superior to or better than other aspects of this disclosure. Similarly, the term “aspect” does not require that all aspects of this disclosure include the features, advantages, or modes of operation discussed. The term “coupling” is used herein to refer to direct or indirect coupling (e.g., mechanical coupling) between two objects. For example, if object A physically contacts object B, and object B contacts object C, objects A and C can still be considered coupled to each other, even if they are not in direct physical contact. Object A coupled to object B may be coupled to at least a portion of object B. The term “electrical coupling” may mean that two objects are directly or indirectly coupled together such that current (e.g., signal, power, ground) can flow between the two objects. Electrically coupled objects may or may not have current traveling between them. The use of the terms “first,” “second,” “third,” and “fourth” (and / or anything above the fourth) is arbitrary. Any component described can be a first component, a second component, a third component, or a fourth component. For example, a component referred to as a second component can be a first component, a second component, a third component, or a fourth component. The terms “enclosing,” “enclosing,” and / or any derivative meaning can refer to an object that partially or completely encloses another object. The terms “top” and “bottom” are arbitrary. A component located at the top can be above a component located at the bottom. A top component can be considered a bottom component, and vice versa. As described in this disclosure, a first component located “above” a second component can mean that the first component is located above or below the second component, depending on how bottom or top is arbitrarily defined. In another example, a first component can be located above (e.g., above) a first surface of a second component, and a third component can be located above (e.g., below) a second surface of a second component, where the second surface is opposite to the first surface. It should also be noted that the term “above” as used in this application in the context of one component being above another component can be used to mean that a component is on and / or in another component (e.g., on the surface of a component or embedded in a component). Therefore, for example, "the first component is on top of the second component" can mean: (1) the first component is on top of the second component but does not directly contact the second component; (2) the first component is on the second component (e.g., on the surface of the second component); and / or (3) the first component is in the second component (e.g., embedded in the second component). A first component located "in" the second component can be partially or completely located in the second component. Values ​​from about X to XX can refer to values ​​between X and XX, including both X and XX. Values ​​between X and XX can be discrete or continuous. As used in this disclosure, the terms "about 'value X'" or "approximately value X" mean within 10% of "value X".For example, a value of about 1 or approximately 1 would mean a value in the range of 0.9 to 1.1. "Multiple" components can include all possible components or only some of all possible components. For example, if a device comprises ten components, the term "multiple components" can refer to all ten components or only some of those ten components.

[0061] It should also be noted that the various disclosures contained herein can be described as processes depicted as work diagrams, flowcharts, structural diagrams, or block diagrams. Although flowcharts may describe operations as sequential processes, many operations within an operation can be performed in parallel or concurrently. Furthermore, the order of operations can be rearranged. The process terminates when its operations are completed.

[0062] Further examples are described below to facilitate understanding of this disclosure.

[0063] According to Embodiment 1, a device includes: a heat source; a heat spreader, the heat spreader being thermally connected to the heat source and including a working fluid; a bridging element; and a heat pipe, the heat pipe being thermally connected to a radiator and fluidly connected to the heat spreader via the bridging element.

[0064] Example 2 includes the device described in Example 1, wherein the heat sink includes the surrounding environment, a heat diffuser, or both.

[0065] Example 3 includes the device described in Example 1 or Example 2, wherein the heat pipe is in thermal communication with one or more additional heat sources.

[0066] Example 4 includes the device described in any one of Examples 1 to 3, wherein at least a portion of the heat pipe is located at the periphery of the device.

[0067] Example 5 includes the device described in any one of Examples 1 to 4, wherein the surface of the heat spreader is aligned with the surface of the device.

[0068] Example 6 includes the device of any one of Examples 1 to 5, wherein a first portion of the bridging member is positioned along a face of the device and a second portion of the bridging member is positioned along an edge of the device.

[0069] Example 7 includes the device described in any one of Examples 1 to 6 and further includes a wicking structure extending between the heat spreader and the heat pipe.

[0070] Example 8 includes the device described in Example 7, wherein the grain size of the wicking structure is approximately 10 micrometers.

[0071] Example 9 includes the device described in Example 7 or Example 8, wherein the grain size of the wicking structure is greater than or equal to 8 micrometers and less than or equal to 12 micrometers.

[0072] Example 10 includes the device of any one of Examples 1 to 9 and further includes a bracket in thermal communication with an additional heat source, wherein a portion of the heat pipe is located on the bracket.

[0073] Example 11 includes the device described in Example 10, wherein the additional heat source includes an antenna module.

[0074] Example 12 includes the device of any one of Examples 1 to 11, wherein the heat spreader is coupled to a system-on-a-chip (SoC) including one or more processors.

[0075] Example 13 includes the device described in Example 12, wherein the heat source includes the one or more processors.

[0076] Example 14 includes the device of any one of Examples 1 to 13 and further includes one or more additional heat spreaders in fluid communication with the heat pipe via the bridging member.

[0077] Example 15 includes the device described in any one of Examples 1 to 14, the device further including: a display; and a heat diffuser located between the heat spreader and the display.

[0078] Example 16 includes the device described in any one of Examples 1 to 15, wherein the heat source, the heat spreader, the bridging element, and the heat pipe are integrated into the mobile device.

[0079] Example 17 includes the device described in Example 16, wherein at least a portion of the heat pipe is located on the frame of the mobile device.

[0080] Example 18 includes the device described in any one of Examples 1 to 17, wherein the heat source, the heat spreader, the bridging element, and the heat pipe are integrated into at least one of a mobile test platform (MTP), a laptop computer, a communication device, or an Internet of Things (IoT) device.

[0081] According to embodiment 19, a device includes: a heat pipe thermally connected to a heat source; a bridging element; and a heat spreader including a working fluid and in fluid communication with the heat pipe via the bridging element.

[0082] Example 20 includes the device described in Example 19, the device further including a bracket in thermal communication with the heat source, wherein a portion of the heat pipe is located on the bracket.

[0083] Example 21 includes the device described in Example 19 or Example 20, wherein the heat source includes an antenna module.

[0084] Example 22 includes the device described in Example 21, wherein the antenna module includes a fifth-generation (5G) millimeter-wave (mmWave) beamformer.

[0085] Example 23 includes the device of any one of Examples 19 to 22, wherein the heat spreader is coupled to a system-on-a-chip (SoC) including one or more processors.

[0086] Example 24 includes the device described in any one of Examples 19 to 23 and further includes one or more additional heat spreaders in fluid communication with the heat pipe via the bridging member.

[0087] Example 25 includes the device described in any one of Examples 19 to 24, the device further including: a display; and a heat diffuser located between the heat spreader and the display.

[0088] Example 26 includes the device described in any one of Examples 19 to 25, wherein the heat pipe, the bridging element, and the heat spreader are integrated into the mobile device.

[0089] Example 27 includes the device described in Example 26, wherein at least a portion of the heat pipe is located on the frame of the mobile device.

[0090] According to embodiment 28, a method includes: forming a heat spreader; forming a heat pipe; forming a bridging element between the heat spreader and the heat pipe to achieve fluid communication between the two; and adding working fluid to a volume defined by the heat spreader, the heat pipe and the bridging element.

[0091] Example 29 includes the method described in Example 28, forming a wicking structure extending between the heat spreader and the heat pipe.

[0092] According to embodiment 30, a method includes: transferring heat from a heat source to a working fluid within a first heat exchange device; transferring the working fluid to a second heat exchange device via a bridging member; and transferring heat from the working fluid within the second heat exchange device to a radiator, wherein one of the first heat exchange device and the second heat exchange device is a heat spreader, and the other of the first heat exchange device and the second heat exchange device is a heat pipe.

[0093] The various features of this disclosure described herein can be implemented in different systems without departing from this disclosure. It should be noted that the foregoing aspects of this disclosure are merely illustrative and should not be construed as limiting the scope of this disclosure. The description of aspects of this disclosure is intended to be illustrative and not to limit the scope of the appended claims. Therefore, the teachings herein are readily applicable to other types of devices, and many substitutions, modifications, and variations will be apparent to those skilled in the art.

Claims

1. An apparatus, the apparatus comprising: Heat source; A heat spreader, wherein the heat spreader is in thermal communication with the heat source and includes a working fluid; Bridging components; and A heat pipe that is thermally connected to a radiator and fluidly connected to a heat spreader via the bridging member.

2. The device according to claim 1, wherein the heat sink comprises the surrounding environment, a heat diffuser, or both.

3. The device of claim 1, wherein the heat pipe is in thermal communication with one or more additional heat sources.

4. The device of claim 1, wherein at least a portion of the heat pipe is located at the periphery of the device.

5. The device according to claim 1, wherein the surface of the heat spreader is aligned with the surface of the device.

6. The device of claim 1, wherein a first portion of the bridging member is positioned along a face of the device and a second portion of the bridging member is positioned along an edge of the device.

7. The device according to claim 1, further comprising a wicking structure extending between the heat spreader and the heat pipe.

8. The device of claim 7, wherein the grain size of the wicking structure is approximately 10 micrometers.

9. The device according to claim 7, wherein the grain size of the wicking structure is greater than or equal to 8 micrometers and less than or equal to 12 micrometers.

10. The device of claim 1, further comprising a bracket in thermal communication with an additional heat source, wherein a portion of the heat pipe is located on the bracket.

11. The device of claim 10, wherein the additional heat source comprises an antenna module.

12. The device of claim 1, wherein the heat spreader is coupled to a system-on-a-chip (SoC), the SoC including one or more processors.

13. The device of claim 12, wherein the heat source comprises the one or more processors.

14. The device of claim 1, further comprising one or more additional heat spreaders in fluid communication with the heat pipe via the bridging member.

15. The device according to claim 1, further comprising: monitor; and A heat diffuser is located between the heat spreader and the display.

16. The device of claim 1, wherein the heat source, the heat spreader, the bridging element and the heat pipe are integrated into the mobile device.

17. The device of claim 16, wherein at least a portion of the heat pipe is located on the frame of the mobile device.

18. The device of claim 1, wherein the heat source, the heat spreader, the bridging element and the heat pipe are integrated into at least one of a mobile test platform (MTP), a laptop computer, a communication device or an Internet of Things (IoT) device.

19. An apparatus, the apparatus comprising: A heat pipe, wherein the heat pipe is in thermal communication with a heat source; Bridging components; and A heat spreader, the heat spreader including a working fluid and in fluid communication with the heat pipe via the bridging member.

20. The device of claim 19, further comprising a bracket in thermal communication with the heat source, wherein a portion of the heat pipe is located on the bracket.

21. The device of claim 19, wherein the heat source includes an antenna module.

22. The device of claim 21, wherein the antenna module comprises a fifth-generation (5G) millimeter-wave (mmWave) beamformer.

23. The device of claim 19, wherein the heat spreader is coupled to a system-on-a-chip (SoC), the SoC including one or more processors.

24. The device of claim 19, further comprising one or more additional heat spreaders in fluid communication with the heat pipe via the bridging member.

25. The apparatus of claim 19, further comprising: monitor; and A heat diffuser is located between the heat spreader and the display.

26. The device of claim 19, wherein the heat pipe, the bridging element, and the heat spreader are integrated into the mobile device.

27. The device of claim 26, wherein at least a portion of the heat pipe is located on the frame of the mobile device.

28. A method, the method comprising: Form a heat spreader; Forming a heat pipe; A bridging element is formed between the heat spreader and the heat pipe to achieve fluid communication between the two; as well as The working fluid is added to the volume defined by the heat spreader, the heat pipe and the bridging element.

29. The method of claim 28, wherein a wicking structure is formed extending between the heat spreader and the heat pipe.

30. A method comprising: Heat from the heat source is transferred to the working fluid within the first heat exchange device; The working fluid is delivered to a second heat exchange device via a bridging component; as well as Heat from the working fluid in the second heat exchange device is transferred to a radiator, wherein one of the first heat exchange device and the second heat exchange device is a heat spreader, and the other of the first heat exchange device and the second heat exchange device is a heat pipe.

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