Wafer carrying friction pad and surface treatment method

Abstract

The invention relates to the technical field of high polymer materials, and discloses a wafer carrying friction pad and a surface treatment method. Comprising the following components in parts by weight: 65-75 parts of methyl vinyl silicone rubber, 2-4 parts of phenyl vinyl silicone oil, 3-5 parts of organic silicon modified polyurethane, 2-3.6 parts of talcum powder, 1-2 parts of a fluorine-containing auxiliary agent, 1-2 parts of an antioxidant 1010 and 1-2 parts of stearic acid. The wafer carrying friction pad has good flame retardant, stretching and self-cleaning effects.

Description

Technical Field

[0001] This invention relates to the field of polymer materials technology, specifically to a wafer handling friction pad and a surface treatment method. Background Technology

[0002] Methyl vinyl silicone rubber, as a general-purpose polymer material, is widely used in packaging, automotive, and home appliance industries due to its low cost, good processability, and excellent chemical stability. However, pure methyl vinyl silicone rubber has some performance defects that limit its application in more demanding scenarios. For example, its tensile strength and toughness need improvement, making it difficult to meet the requirements of structural components with high mechanical properties; its flame retardant properties are poor, making it easily flammable and prone to rapid fire spread when exposed to open flames, posing a safety hazard; and its high surface energy makes it prone to adsorbing dust, oil, and other stains, resulting in poor self-cleaning properties and increased maintenance costs. Therefore, avoiding these issues is key to solving the problem. Summary of the Invention

[0003] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a wafer handling friction pad and a surface treatment method, which has good tensile, flame retardant, and self-cleaning effects.

[0004] (II) Technical Solution To achieve the above objectives, the present invention provides the following technical solution: a wafer handling friction pad, comprising the following weight components: 65-75 parts by weight of methyl vinyl silicone rubber, 2-4 parts by weight of phenyl vinyl silicone oil, 3-5 parts by weight of silicone-modified polyurethane, 2-3.6 parts by weight of talc, 1-2 parts by weight of fluorine-containing additives, 1-2 parts by weight of antioxidant 1010, and 1-2 parts by weight of stearic acid.

[0005] Furthermore, the preparation method of the organosilicon-modified polyurethane is as follows: S1. Under a nitrogen atmosphere, 4.72-4.78 g of 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide was added to 42-46 mL of N,N-dimethylformamide solvent and stirred at 70-75 °C for 22-25 min. Then, 1.3-1.4 g of NaOH was added and the mixture was stirred for 45-50 min. Next, 1.5-1.7 g of 1,4-dichlorobenzyl was added and the mixture was stirred for 5-6 h. Then, 1.43-1.45 g of 4-vinylbenzyl chloride was added and the mixture was reacted at 60-65 °C for 5-6 h. After the reaction was completed, the mixture was filtered, washed, and filtered again to obtain alkenyl-modified DOPO. S2. Add alkenyl-modified DOPO to N,N-dimethylformamide solvent, stir and disperse, then add mercaptoethylamine and benzoin dimethyl ether photoinitiator, irradiate with 365nm ultraviolet light at 20-25℃, centrifuge after the irradiation, wash and dry to obtain chain extender; S3. Place 3.4-3.6 mmol of hydroxyl-terminated polyether silicone oil in a vacuum oven and dry it at 90-100℃ for 1-1.2 h. Then, add the dried hydroxyl-terminated polyether silicone oil and 7-7.2 mmol of isophorone diisocyanate to the reactor, and then add 70-90 mL of acetone solvent. React at 50-56℃ for 1-2 h. Then, continue to add 3.1-3.2 mmol of polycaprolactone diol and 2-2.8 mmol of chain extender, and heat the reaction for 4-6 h. After the reaction is completed, dry the product to obtain silicone-modified polyurethane.

[0006] Furthermore, the ratio of N,N-dimethylformamide solvent, alkenyl-modified DOPO, mercaptoethylamine, and benzoin dimethyl ether photoinitiator in S2 is 50-55 mL: 2-2.5 mmol: 4.2-6.9 mmol: 0.1-0.2 mmol.

[0007] Furthermore, the ultraviolet irradiation time in S2 is 2-3 hours.

[0008] Furthermore, the heating reaction temperature in S3 is 52-56℃.

[0009] Furthermore, the preparation method of the fluorine-containing additive is as follows: Step 1: Add 7-7.3g of maleic acid and 140-150mL of deionized water to the reactor, heat to 75-80℃, then add 1.6-1.7g of aluminum hydroxide, reflux at 70-80℃ for 4-5h, evaporate the solvent by rotary evaporation after the reaction, and dry the product at 75-80℃ for 10-12h to obtain intermediate 1; add 9.5-9.9g of intermediate 1, 9.6-10.8g of DOPO, and 90-100mL of propionic acid to the reactor, stir magnetically, reflux and condense, introduce nitrogen gas, reflux at 150-160℃ for 12-14h, cool to room temperature after the reaction to obtain intermediate 2; Step 2: Add intermediate 2 and perfluorohexylethyl alcohol to N,N-dimethylformamide solvent, stir and mix, and continue to add p-toluenesulfonic acid catalyst. React at 90-95℃ for 4-6 hours. After the reaction is completed, distill under reduced pressure, wash, filter, and obtain fluorine-containing additive.

[0010] Furthermore, the ratio of N,N-dimethylformamide solvent, intermediate 2, perfluorohexylethyl alcohol, and p-toluenesulfonic acid catalyst in S2 is 50-60 mL: 3-5 mmol: 10-18 mmol: 0.1-0.3 mmol.

[0011] Furthermore, the preparation method of the wafer transport friction pad is as follows: methyl vinyl silicone rubber and phenyl vinyl silicone oil are added to a torque rheometer for mixing, and then organosilicon modified polyurethane, talc powder, fluorine-containing additives, antioxidant 1010 and stearic acid are added for mixing. The mixing temperature is 175-185℃ and the time is 50-60min. After cooling to room temperature, it is pressed into shape to obtain the wafer transport friction pad.

[0012] Furthermore, the processing in the semiconductor wafer manufacturing process.

[0013] (iii) Beneficial technical effects Phosphorus, sulfur, and silicon elements in silicone-modified polyurethane, as well as phosphorus elements in fluorine-containing additives, all exhibit good flame-retardant effects, collectively forming a flame-retardant system. Phosphorus can form a flame-retardant barrier during combustion, inhibiting the spread of flames. At the same time, silicon elements in silicone-modified polyurethane also help improve the flame-retardant properties of the material. The synergistic effect of both gives the composite material a good flame-retardant effect, reducing the risk of fire.

[0014] Fluorine atoms in fluorinated additives have low surface energy. When introduced into composite materials, they form a thin film with hydrophobic and oleophobic properties on the material surface, making it difficult for dust, oil, and other stains to adhere. Even if they do adhere, they are easily washed away by rain or other liquids, thus giving the material good self-cleaning properties and reducing later maintenance costs. Silicone-modified polyurethane contains silicon-oxygen bonds (-Si-O-), which have low surface energy, making it difficult for water, oil, and other stains to adhere to its surface or easily washed away, thus exhibiting a certain degree of self-cleaning effect. During the mixing process, methyl vinyl silicone rubber, silicone-modified polyurethane, and fluorinated additives crosslink, forming a crosslinked network with tighter connections, resulting in better tensile properties. Attached Figure Description

[0015] Figure 1 It is a reaction formula for fluorine-containing additives. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific embodiments.

[0018] 10-(2,5-Dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide: CAS 99208-50-1.

[0019] DOPO, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide.

[0020] Polycaprolactone diol: molecular weight 1000.

[0021] Hydroxyl-terminated polyether silicone oil: molecular weight 2800 g / mol, Chengdu Silike Technology Co., Ltd.

[0022] Methyl vinyl silicone rubber: Grade 110-2, density 1.1 g / cm³ 3 Relative molecular mass 6.2 × 10 5 Nanjing Dongjue Silicone Co., Ltd.

[0023] Example 1 S1. Under a nitrogen atmosphere, 4.72 g of 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide was added to 42 mL of N,N-dimethylformamide solvent and stirred at 70 °C for 22 min. Then, 1.3 g of NaOH was added and stirred for another 45 min. Next, 1.5 g of 1,4-dichlorobenzyl was added and stirred for another 5 h. Then, 1.43 g of 4-vinylbenzyl chloride was added and reacted at 60 °C for 5 h. After the reaction was completed, the mixture was filtered, washed, and filtered again to obtain alkenyl-modified DOPO. S2. Add 2 mmol of alkenyl-modified DOPO to 50 mL of N,N-dimethylformamide solvent, stir and disperse, then add 4.2 mmol of mercaptoethylamine and 0.1 mmol of benzoin dimethyl ether photoinitiator, irradiate with 365 nm ultraviolet light at 20 °C for 2 h, centrifuge after the irradiation, wash and dry to obtain chain extender; S3. Place 3.4 mmol of hydroxyl-terminated polyether silicone oil in a vacuum oven and dry it at 90°C for 1 h. Then, add the dried hydroxyl-terminated polyether silicone oil and 7 mmol of isophorone diisocyanate to the reactor, add 70 mL of acetone solvent, and react at 50°C for 1 h. Then, add 3.1 mmol of polycaprolactone diol and 2 mmol of chain extender, and heat to 52°C to react for 4 h. After the reaction is completed, dry to obtain silicone-modified polyurethane. S4. Add 7g maleic acid and 140mL deionized water to the reactor, heat to 75℃, then add 1.6g aluminum hydroxide, reflux at 70℃ for 4h, evaporate the solvent by rotary evaporation after the reaction, and dry the product at 75℃ for 10h to obtain intermediate 1; add 9.5g intermediate 1, 9.6g DOPO and 90mL propionic acid to the reactor, stir magnetically, reflux and condense, introduce nitrogen gas, reflux at 150℃ for 12h, and cool to room temperature after the reaction to obtain intermediate 2; S5. Add 3 mmol of intermediate 2 and 10 mmol of perfluorohexylethyl alcohol to 50 mL of N,N-dimethylformamide solvent, stir and mix, then add 0.1 mmol of p-toluenesulfonic acid catalyst, react at 90 °C for 4 h, after which distill under reduced pressure, wash, filter, and obtain fluorine-containing additive. S6. Add 65 parts by weight of methyl vinyl silicone rubber and 2 parts by weight of phenyl vinyl silicone oil to a torque rheometer and mix. Then add 3 parts by weight of organosilicon-modified polyurethane, 2 parts by weight of talc, 1 part by weight of fluorine-containing additive, 1 part by weight of antioxidant 1010 and 1 part by weight of stearic acid and mix. The mixing temperature is 175℃ and the time is 50min. After cooling to room temperature, press to form a wafer transport friction pad.

[0024] Example 2 S1. Under a nitrogen atmosphere, 4.78 g of 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide was added to 46 mL of N,N-dimethylformamide solvent and stirred at 75 °C for 25 min. Then, 1.4 g of NaOH was added and stirred for another 50 min. Next, 1.7 g of 1,4-dichlorobenzyl was added and stirred for another 6 h. Then, 1.45 g of 4-vinylbenzyl chloride was added and reacted at 65 °C for 6 h. After the reaction was completed, the mixture was filtered, washed, and filtered again to obtain alkenyl-modified DOPO. S2. Add 2.5 mmol of alkenyl-modified DOPO to 55 mL of N,N-dimethylformamide solvent, stir and disperse, then add 6.9 mmol of mercaptoethylamine and 0.2 mmol of benzoin dimethyl ether photoinitiator, irradiate with 365 nm ultraviolet light at 25 °C for 3 h, centrifuge after the irradiation, wash and dry to obtain chain extender; S3. Place 3.6 mmol of hydroxyl-terminated polyether silicone oil in a vacuum oven and dry at 100 °C for 1.2 h. Then, add the dried hydroxyl-terminated polyether silicone oil and 7.2 mmol of isophorone diisocyanate to the reactor, add 90 mL of acetone solvent, and react at 56 °C for 2 h. Then, add 3.2 mmol of polycaprolactone diol and 2.8 mmol of chain extender, raise the temperature to 56 °C and react for 6 h. After the reaction is completed, dry to obtain silicone-modified polyurethane. S4. Add 7.3g maleic acid and 150mL deionized water to the reactor, heat to 80℃, then add 1.7g aluminum hydroxide, reflux at 80℃ for 5h, evaporate the solvent by rotary evaporation after the reaction, and dry the product at 80℃ for 12h to obtain intermediate 1; add 9.9g intermediate 1, 10.8g DOPO and 100mL propionic acid to the reactor, stir magnetically, reflux and condense, introduce nitrogen gas, reflux at 160℃ for 14h, cool to room temperature after the reaction to obtain intermediate 2; S5. Add 5 mmol of intermediate 2 and 18 mmol of perfluorohexylethyl alcohol to 60 mL of N,N-dimethylformamide solvent, stir and mix, then add 0.3 mmol of p-toluenesulfonic acid catalyst, react at 95 °C for 6 h, after which distill under reduced pressure, wash, filter, and obtain fluorine-containing additive. S6. 75 parts by weight of methyl vinyl silicone rubber and 4 parts by weight of phenyl vinyl silicone oil are added to a torque rheometer and mixed. Then, 5 parts by weight of organosilicon-modified polyurethane, 3.6 parts by weight of talc, 2 parts by weight of fluorine-containing additives, 2 parts by weight of antioxidant 1010 and 2 parts by weight of stearic acid are added and mixed. The mixing temperature is 185℃ and the time is 60min. After cooling to room temperature, the mixture is pressed into shape to obtain a wafer transport friction pad.

[0025] Example 3 S1. Under a nitrogen atmosphere, 4.75 g of 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide was added to 44 mL of N,N-dimethylformamide solvent and stirred at 73 °C for 24 min. Then, 1.35 g of NaOH was added and the mixture was stirred for another 47 min. Next, 1.6 g of 1,4-dichlorobenzyl was added and the mixture was stirred for another 5.5 h. Then, 1.44 g of 4-vinylbenzyl chloride was added and the mixture was reacted at 62 °C for 5.5 h. After the reaction was completed, the mixture was filtered, washed, and filtered again to obtain alkenyl-modified DOPO. S2. Add 2.4 mmol of alkenyl-modified DOPO to 53 mL of N,N-dimethylformamide solvent, stir and disperse, then add 5.4 mmol of mercaptoethylamine and 0.15 mmol of benzoin dimethyl ether photoinitiator, irradiate with 365 nm ultraviolet light at 22 °C for 2.5 h, centrifuge after the irradiation, wash and dry to obtain the chain extender; S3. Place 3.5 mmol of hydroxyl-terminated polyether silicone oil in a vacuum oven and dry at 96 °C for 1.1 h. Then, add the dried hydroxyl-terminated polyether silicone oil and 7.1 mmol of isophorone diisocyanate to the reactor, add 80 mL of acetone solvent, and react at 52 °C for 1.5 h. Then, add 3.1 mmol of polycaprolactone diol and 2.3 mmol of chain extender, raise the temperature to 54 °C and react for 5 h. After the reaction is completed, dry to obtain silicone-modified polyurethane. S4. Add 7.2g maleic acid and 145mL deionized water to the reactor, heat to 78℃, then add 1.65g aluminum hydroxide, reflux at 76℃ for 4h, evaporate the solvent by rotary evaporation after the reaction, and dry the product at 77℃ for 11h to obtain intermediate 1; add 9.7g intermediate 1, 10.2g DOPO and 95mL propionic acid to the reactor, stir magnetically, reflux and condense, introduce nitrogen gas, reflux at 156℃ for 12-14h, cool to room temperature after the reaction to obtain intermediate 2; S5. Add 4 mmol of intermediate 2 and 13 mmol of perfluorohexylethyl alcohol to 54 mL of N,N-dimethylformamide solvent, stir and mix, then add 0.2 mmol of p-toluenesulfonic acid catalyst, react at 93 °C for 5 h, after which distill under reduced pressure, wash, filter, and obtain fluorine-containing additive. S6. 70 parts by weight of methyl vinyl silicone rubber and 3 parts by weight of phenyl vinyl silicone oil are added to a torque rheometer and mixed. Then, 4 parts by weight of organosilicon-modified polyurethane, 2.8 parts by weight of talc, 1.5 parts by weight of fluorine-containing additives, 1.8 parts by weight of antioxidant 1010 and 1.2 parts by weight of stearic acid are added and mixed. The mixing temperature is 180℃ and the time is 55min. After cooling to room temperature, the mixture is pressed into shape to obtain a wafer transport friction pad.

[0026] Example 4 S1. Under a nitrogen atmosphere, 4.72 g of 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide was added to 42 mL of N,N-dimethylformamide solvent and stirred at 70 °C for 22 min. Then, 1.3 g of NaOH was added and stirred for another 45 min. Next, 1.5 g of 1,4-dichlorobenzyl was added and stirred for another 5 h. Then, 1.43 g of 4-vinylbenzyl chloride was added and reacted at 60 °C for 5 h. After the reaction was completed, the mixture was filtered, washed, and filtered again to obtain alkenyl-modified DOPO. S2. Add 2 mmol of alkenyl-modified DOPO to 50 mL of N,N-dimethylformamide solvent, stir and disperse, then add 4.2 mmol of mercaptoethylamine and 0.1 mmol of benzoin dimethyl ether photoinitiator, irradiate with 365 nm ultraviolet light at 20 °C for 2 h, centrifuge after the irradiation, wash and dry to obtain chain extender; S3. Place 3.6 mmol of hydroxyl-terminated polyether silicone oil in a vacuum oven and dry at 100 °C for 1.2 h. Then, add the dried hydroxyl-terminated polyether silicone oil and 7.2 mmol of isophorone diisocyanate to the reactor, add 90 mL of acetone solvent, and react at 56 °C for 2 h. Then, add 3.2 mmol of polycaprolactone diol and 2.8 mmol of chain extender, raise the temperature to 56 °C and react for 6 h. After the reaction is completed, dry to obtain silicone-modified polyurethane. S4. Add 7.3g maleic acid and 150mL deionized water to the reactor, heat to 80℃, then add 1.7g aluminum hydroxide, reflux at 80℃ for 5h, evaporate the solvent by rotary evaporation after the reaction, and dry the product at 80℃ for 12h to obtain intermediate 1; add 9.9g intermediate 1, 10.8g DOPO and 100mL propionic acid to the reactor, stir magnetically, reflux and condense, introduce nitrogen gas, reflux at 160℃ for 14h, cool to room temperature after the reaction to obtain intermediate 2; S5. Add 4 mmol of intermediate 2 and 13 mmol of perfluorohexylethyl alcohol to 54 mL of N,N-dimethylformamide solvent, stir and mix, then add 0.2 mmol of p-toluenesulfonic acid catalyst, react at 93 °C for 5 h, after which distill under reduced pressure, wash, filter, and obtain fluorine-containing additive. S6. 70 parts by weight of methyl vinyl silicone rubber and 2 parts by weight of phenyl vinyl silicone oil are added to a torque rheometer and mixed. Then, 4 parts by weight of organosilicon-modified polyurethane, 2.8 parts by weight of talc, 1.5 parts by weight of fluorine-containing additives, 1.8 parts by weight of antioxidant 1010 and 1.2 parts by weight of stearic acid are added and mixed. The mixing temperature is 180℃ and the time is 55min. After cooling to room temperature, the mixture is pressed into shape to obtain a wafer transport friction pad.

[0027] Comparative Example 1 The difference between this comparative example and Example 4 is that alkenyl-modified DOPO is used instead of organosilicon-modified polyurethane.

[0028] Comparative Example 2 The difference between this comparative example and Example 4 is that no fluorine-containing additives were added.

[0029] Performance testing The limiting oxygen index of the wafer handling friction pad was tested using an oxygen index meter, and the flammability rating was tested using a horizontal and vertical combustion meter. Tensile strength testing: The tensile strength of the composite material was tested according to standard GB / T 1040-2006. The test results are shown in Table 1.

[0030] Table 1: Flame retardancy and tensile strength tests.

[0031]

[0032] As shown in Table 1, Examples 1-4 of the present invention have better flame retardant and tensile effects compared with Comparative Examples 1-2.

[0033] Self-cleaning performance: The dynamic water droplet angle test was conducted using the non-axisymmetric Young-Laplace method and the ADSA-RealDroP fitting technique; the test was performed using the SDC-500 fully automatic water droplet angle and contact angle instrument manufactured by Dongguan Shengding Precision Instruments Co., Ltd.

[0034] Table 2: Self-cleaning performance test.

[0035]

[0036] As shown in Table 2, Examples 1-4 of the present invention have a larger contact angle than Comparative Examples 1-2, indicating that the self-cleaning effect is better.

[0037] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0038] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

[0039] Those skilled in the art should understand that the above descriptions are merely several specific embodiments of the present invention, and not all embodiments.

Claims

1. A wafer handling friction pad, characterized by, It comprises the following weight components: 65-75 parts by weight of methyl vinyl silicone rubber, 2-4 parts by weight of phenyl vinyl silicone oil, 3-5 parts by weight of silicone modified polyurethane, 2-3.6 parts by weight of talcum powder, 1-2 parts by weight of fluorine-containing auxiliary agent, 1-2 parts by weight of antioxidant 1010, and 1-2 parts by weight of stearic acid.

2. The wafer handling friction pad of claim 1, wherein The preparation method of the silicone modified polyurethane is: S1. Under a nitrogen atmosphere, 4.72-4.78 g of 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide is added to 42-46 mL of N,N-dimethylformamide solvent, stirred at 70-75°C for 22-25 min, then 1.3-1.4 g of NaOH is added, and stirring is continued for 45-50 min, then 1.5-1.7 g of 1,4-p-dichlorobenzyl is added, and stirring is continued for 5-6 h, then 1.43-1.45 g of 4-vinylbenzyl chloride is added, and reaction is carried out at 60-65°C for 5-6 h, after which filtration is performed, washing is performed, and filtration is performed to obtain an alkenyl modified DOPO; S2. The alkenyl modified DOPO is added to the N,N-dimethylformamide solvent, stirred and dispersed, then mercaptoethylamine and benzoin dimethyl ether photoinitiator are added, and irradiation is performed under 365 nm ultraviolet light at 20-25°C, after which centrifugal separation is performed, washing and drying are performed, and a chain extender is obtained; S3. 3.4-3.6 mmol of hydroxyl-terminated polyether silicone oil is placed in a vacuum oven and dried at 90-100°C for 1-1.2 h, then the dried hydroxyl-terminated polyether silicone oil and 7-7.2 mmol of isophorone diisocyanate are added to a reactor, 70-90 mL of acetone solvent is added, reaction is carried out at 50-56°C for 1-2 h, then 3.1-3.2 mmol of polycaprolactone diol and 2-2.8 mmol of chain extender are added, and temperature is raised to carry out reaction for 4-6 h, after which drying is performed to obtain a silicone modified polyurethane.

3. The wafer handling friction pad of claim 2, wherein, The amount ratio of the N,N-dimethylformamide solvent, the alkenyl modified DOPO, the mercaptoethylamine, and the benzoin dimethyl ether photoinitiator in S2 is 50-55 mL: 2-2.5 mmol: 4.2-6.9 mmol: 0.1-0.2 mmol.

4. The wafer handling friction pad of claim 2, wherein The ultraviolet light irradiation time in S2 is 2-3 h.

5. The wafer handling friction pad of claim 2, wherein, The temperature of the temperature-raising reaction in S3 is 52-56°C.

6. The wafer handling friction pad of claim 1, wherein The preparation method of the fluorine-containing auxiliary agent is: Step one: 7-7.3 g of maleic acid and 140-150 mL of deionized water are added to a reactor, the temperature is raised to 75-80°C, then 1.6-1.7 g of aluminum hydroxide is added, reaction is carried out under reflux at 70-80°C for 4-5 h, after which the solvent is evaporated by rotary evaporation, and the product is dried at 75-80°C for 10-12 h to obtain intermediate 1; 9.5-9.9 g of intermediate 1, 9.6-10.8 g of DOPO, and 90-100 mL of propionic acid are added to a reactor, magnetic stirring is performed, reaction is carried out under reflux condensation, nitrogen is introduced, and reaction is carried out under reflux at 150-160°C for 12-14 h, after which the temperature is cooled to room temperature to obtain intermediate 2; Step two: add intermediate 2, perfluorohexyl ethyl alcohol to N,N-dimethylformamide solvent, stir the mixture, continue to add p-toluenesulfonic acid catalyst, react at 90-95 DEG C for 4-6h, after the end of the reduced pressure distillation, washing, filtration, to obtain a fluorine-containing auxiliary.

7. The wafer handling friction pad of claim 1, wherein The amount of N,N-dimethylformamide solvent, intermediate 2, perfluorohexyl ethyl alcohol, p-toluenesulfonic acid catalyst in S2 is 50-60 mL: 3-5 mmol: 10-18 mmol: 0.1-0.3 mmol.

8. A method of manufacturing a wafer handling friction pad as claimed in any one of claims 1 to 7, characterized in that, The preparation method of the wafer carrying friction pad is as follows: methyl vinyl silicone rubber and phenyl vinyl silicone oil are added into a torque rheometer for mixing, then silicone modified polyurethane, talcum powder, fluorine-containing auxiliary, antioxidant 1010 and stearic acid are added for mixing, the mixing temperature is 175-185 DEG C, the mixing time is 50-60 min, after cooling to room temperature, the wafer carrying friction pad is pressed into shape.

9. A wafer handling friction pad, characterized by, The processing in the semiconductor wafer manufacturing process.

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