Solder supply device for LED production

Abstract

The invention relates to a solder supply device for LED production, and the solder supply device comprises a bottom plate, a placing disc, a supporting assembly, a sliding frame, a lifting assembly, a conveying part, a cleaning assembly, a butt joint sleeve and a sealing cover. In the prior art, dust and impurity particles may fall on the inner surface of a placing disc (at a designated position) when the placing disc is not used, when welding flux is directly input into the placing disc, the welding flux, the dust and the impurities form a mixed state, after the welding flux connects a welded component and a welding disc together, the dust and the impurities follow the welding flux together, and after subsequent hot melting welding, the welding flux can be separated from the welding disc. Particles such as dust and impurities can be permanently mixed at the solidified connection points, the connection stability degree of the connection points is reduced due to mixing of the dust and the impurities, and the situation that the welding points fall off possibly subsequently occurs.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solder supply for LED production, and particularly relates to a solder supply device for LED production. BACKGROUND

[0002] With the wide application of display screens in various fields, as important parts of display screens, LEDs (Light Emitting Diode) are required to be higher and higher in the production process. An LED includes a glass substrate, referred to as a substrate, and a plurality of micro-sized particles, referred to as particles, arranged on the substrate. Since the number of particles is large, failure may occur during use. Therefore, subsequent repair operations are required. In the repair process, solder paste (solder) is used for repair. The solder paste has certain viscosity at room temperature and can initially adhere the LED to a predetermined position. At the soldering temperature, the solder paste is volatilized with the solvent and part of the additive, so that the soldered component and the solder pad are welded together, thereby achieving the purpose of repair.

[0003] In the existing solder supply process, a Chinese patent with publication number CN106029279B discloses a solder supply device and a solder supply method. The solder supply device includes a solder cup, a positive and negative pressure supply device, a supply nozzle, and a solder cutting device. The solder cup stores fluid solder inside. The positive and negative pressure supply device changes the pressure in the solder cup in a controllable manner. The supply nozzle is used to discharge the solder in the solder cup. The solder cutting device cuts the solder supplied from the supply nozzle by spraying compressed air. The solder cup is pressurized by the positive and negative pressure supply device, so that the solder is supplied from the supply nozzle. When the supply of solder from the supply nozzle is stopped, the solder cup is depressurized by the positive and negative pressure supply device. At the moment of depressurization in the solder cup, the solder is cut by the solder cutting device. In this way, the cutting of the solder in the supply nozzle and the pulling back of the solder into the supply nozzle are simultaneously performed, so that the solder can be reliably prevented.

[0004] In the above-mentioned prior art, the main purpose is to prevent the occurrence of droplets when the supply of solder is stopped. However, the presence of impurities after the solder is supplied to a specified position is not considered. When the solder is directly input into the placement tray (specified position), the solder may form a mixed state with dust and impurities. When the solder connects the soldered component and the solder pad together, the dust and impurities also follow. After the subsequent hot melting welding, the dust and impurities are permanently mixed in the solidified connection point (solder paste after the volatilization of the solvent and part of the additive). The mixing of dust and impurities reduces the connection stability of the connection point, and the solder joint (connection point) may fall off in the future.

[0005] Based on this, there is still room for improvement in the existing solder supply technology. SUMMARY

[0006] In order to be able to carry out internal multiple cleaning of the placement tray before solder paste supply, the cleanliness of subsequent solder paste input is ensured, and the quantitatively output solder paste can be completely delivered into the placement tray during subsequent supply process, the application provides a solder supply device for LED production.

[0007] The application provides a solder supply device for LED production, which adopts the following technical scheme: A solder supply device for LED production, comprising a bottom plate; a placement tray rotatably arranged on the bottom plate, the placement tray being controlled to rotate by a driving part, a supporting assembly being installed on the right side of the bottom plate; a sliding frame sliding along the length direction of the bottom plate, a sliding piece being slidingly arranged at the left end of the sliding frame, a lifting assembly being installed at the right end lower side of the sliding piece; a conveying part being installed at the upper end rear side of the lifting assembly through a connecting rod, the conveying part being used for conveying solder paste, a driving assembly being installed at the middle part of the conveying part, the lower end of the driving assembly being connected with the inner side of a cleaning assembly through a linkage rod, the cleaning assembly in the initial position plugging the outlet position arranged on the conveying part; a butt joint sleeve being slidingly arranged on the lower end of the conveying part, when the upper end of the butt joint sleeve is in contact with the lower end of the conveying part, the driving assembly is electrified to control the cleaning assembly to rotate around the center position of the conveying part, so that the cleaning assembly carries out cleaning work on the inner surface of the placement tray; a sealing cover being installed at the upper end front side of the lifting assembly, the sealing cover being used for sealing the opening position at the upper end of the placement tray.

[0008] As a preferred technical scheme of the application, the conveying part comprises a conveying frame, the conveying frame being installed at the upper end rear side of the lifting assembly through a connecting rod, a connecting piece being installed at the middle upper end of the conveying frame, the outlet position being arranged at the left end lower side of the conveying frame, the rear end of a plugging plate used for plugging the outlet being connected with the lower end face of the conveying frame through a pin shaft, an input port being arranged on the left side wall of the conveying frame, a heat preservation layer being laid on the inner wall of the conveying frame; a piston piece being connected with the connecting piece through a push air cylinder, a storage cavity being formed between the lower side of the piston piece and the conveying frame, a push-out piece corresponding to the outlet position being installed at the left side of the lower end of the piston piece; a conveying unit being installed on the lifting assembly, the solder paste being conveyed to the input port arranged on the conveying frame and then entering the storage cavity through the conveying unit; a blocking piece being installed on the left end upper side of the piston piece, the blocking piece being lowered to the lowest position to plug the input port.

[0009] As a preferred technical scheme of the application, the conveying unit comprises a storage box and a conveying pump, the storage box being installed at the rear end of the conveying frame, the storage box and the outlet position of the conveying frame being connected through the conveying pump, the conveying pump being installed at the upper end of the lifting assembly. As a preferred embodiment of the present invention, the blocking component includes a blocking plate, an inner shell, and a blocking ball. The lower end of the blocking plate is installed on the upper left side of the piston component, and the upper end of the blocking plate is equipped with the inner shell. The interior of the inner shell is connected to the blocking ball through an elastic element.

[0010] As a preferred embodiment of the present invention, the driving assembly includes a motor, a power supply, a first conductive component, a second conductive component, and an L-shaped component. An insulating cavity is provided in the middle of the conveying frame. The motor is installed in the lower half of the insulating cavity, and the power supply, the first conductive component, and the second conductive component are provided in the upper half of the insulating cavity. The power supply, the first conductive component, and the second conductive component are electrically connected to the motor. The second conductive component is slidably disposed in the insulating cavity, and the side wall of the second conductive component is connected to the left end of the L-shaped component made of insulating material.

[0011] As a preferred embodiment of the present invention, the linkage rod includes a crossbeam rod, an adapter, and a telescopic cylinder. The telescopic cylinder is mounted on the output shaft of the motor, and the adapter is slidably disposed inside the telescopic cylinder. The crossbeam rod is mounted on the side wall of the adapter.

[0012] As a preferred embodiment of the present invention, the cleaning assembly includes a connector, the sidewall of which is connected to the outer end face of the crossbeam; a cleaning part, which is installed on the front side of the lower end of the connector, and is used to remove impurity particles from the inner surface of the placement tray; a coating part, which is installed in the middle of the lower end of the connector, and a top support assembly that is used in compression cooperation with the coating part is slidably disposed in the movable groove opened in the middle of the connector, and the top support assembly in the initial position is used to block the blockage plate at the blockage outlet position; and a wiping body, which is installed on the rear side of the lower end of the connector, and a sponge strip is laid around the edge of the wiping body.

[0013] As a preferred embodiment of the present invention, the cleaning part includes a hard layer and a scraper. The hard layer is installed on the lower front side of the connector, and the scraper is provided at the front edge of the hard layer. The scraper has an L-shaped cross-section.

[0014] As a preferred embodiment of the present invention, the coating part includes an intermediate layer, a coating component, and an extrusion head. The intermediate layer is installed in the middle of the lower end of the connector. A movable cavity is provided inside the intermediate layer. The coating components are symmetrically slidably arranged at the left and right ends of the movable cavity. An extrusion head is installed on the side wall of the coating component near the top support assembly.

[0015] As a preferred embodiment of the present invention, the coating component includes a rigid component, a rubber frame, a connecting plate, and a coating layer. The rigid component is horizontally slidably disposed in the movable cavity. The outer side of the rigid component is sequentially fitted with the rubber frame, the connecting plate, and the coating layer from the inside out. The cavity formed by the rubber frame and the connecting plate is filled with a cleaning agent. The rubber frame and the connecting plate are connected by an outward expansion spring. The connecting plate has a spray hole.

[0016] As a preferred embodiment of the present invention, the top support assembly includes a top support head and a pressing rod. The top support head is slidably disposed inside the movable groove. A return spring is connected between the top support head and the bottom of the movable groove. The pressing rod is installed at the lower end of the top support head. A rollable ball is provided at the end of the pressing rod. The pressing rod and the pressing surface of the pressing head are used in a pressing fit. The upper middle part of the pressing surface of the pressing head has a structure that gradually slopes inward from top to bottom, and the lower part of the pressing surface of the pressing head is a vertical surface.

[0017] As a preferred embodiment of the present invention, the upper end of the docking sleeve is provided with a movable sleeve, which is movably disposed in a hidden groove opened at the lower end of the conveying frame, and a connecting spring is connected between the upper end of the movable sleeve and the hidden groove. The lower right side of the L-shaped part is mounted on the movable sleeve.

[0018] In summary, this application includes the following beneficial technical effects: In the above technical solution, the present invention provides a solder supply device for LED production. For the supply of solder paste, the inside of the placement tray is first thoroughly cleaned. After the docking sleeve is successfully docked with the placement tray, the cleaning component is driven by the drive component to rotate circumferentially, thereby scraping off impurities and particles, wet wiping with cleaning agent, and subsequent dry wiping, thus performing multiple cleanings on the inside of the placement tray to ensure its cleanliness. Then, the solder paste is conveyed by a piston to ensure that no impurities are mixed in when the solder paste is supplied. Attached Figure Description

[0019] Figure 1 This is a first structural schematic diagram of the present invention; Figure 2 This is a schematic diagram of the second structure of the present invention; Figure 3 This is a top view of the present invention; Figure 4 This is the present invention. Figure 3 AA section view; Figure 5 This is a cross-sectional view of the conveying unit, cleaning component, and docking sleeve of the present invention; Figure 6 This is a cross-sectional view of the cleaning component of the present invention; Figure 7 This is a first structural schematic diagram of the linkage rod and the cleaning component of the present invention; Figure 8 This is a schematic diagram of the second structure between the linkage rod and the cleaning component of the present invention; Figure 9 This is the present invention. Figure 6 A magnified view of the area at point X.

[0020] Explanation of reference numerals in the attached drawings: 1. Base plate; 2. Placement tray; 3. Support assembly; 4. Sliding frame; 5. Lifting assembly; 6. Conveying section; 7. Cleaning assembly; 8. Connecting sleeve; 9. Sealing cover; 51. Linkage rod; 61. Conveying frame; 62. Blocking plate; 63. Piston component; 64. Push cylinder; 65. Blocking component; 66. Storage box; 67. Conveying pump; 68. Motor; 69. Conductive component two; 70. L-shaped component; 71. 72. Connector; 73. Cleaning section; 74. Coating section; 75. Top support assembly; 76. Wiping section; 67. Push-out part; 68. Sealing plate; 69. Blocking ball; 72. Hard layer; 72. Scraping part; 73. Intermediate layer; 73. Coating part; 74. Extrusion head; 75. Rigid part; 76. Rubber frame; 77. Connecting plate; 78. Coating layer; 79. Top support head; 70. Extrusion rod. Detailed Implementation

[0021] The following is in conjunction with the appendix Figures 1-9 This application will be described in further detail.

[0022] This application discloses a solder supply device for LED production. By performing multiple internal cleanings on the placement tray 2 before supplying solder paste, the cleanliness of the subsequent solder paste input is ensured. At the same time, during the subsequent supply process, the quantitatively output solder paste can be completely delivered to the placement tray 2.

[0023] Reference Figures 1-5As shown, this embodiment discloses a solder supply device for LED production, including a base plate 1, a placement tray 2, a support assembly 3, a sliding frame 4, a lifting assembly 5, a conveying section 6, a cleaning assembly 7, a docking sleeve 8, and a sealing cover 9. The placement tray 2 is rotatably mounted on the base plate 1, and its rotation is controlled by a drive unit. The support assembly 3 is installed on the right side of the base plate 1, and can be used to lift the placement tray 2 as a whole. The sliding frame 4 slides along the length of the base plate 1. During use, pulling the sliding frame 4 to the left moves the conveying section 6, the cleaning assembly 7, the docking sleeve 8, and the sealing cover 9 to the left side of the placement tray 2, providing sufficient usage area for the placement tray 2. A sliding element is slidably provided at the left end of the sliding frame 4, which can drive the support assembly 3, the sliding frame 4, the lifting assembly 5, the conveying section 6, the cleaning assembly 7, the docking sleeve 8, and the sealing cover 9 to move back and forth as a whole, so that the conveying section 6, the cleaning assembly 7, the docking sleeve 8, and the sealing cover 9 move to a suitable position to clean the placement tray 2. The solder paste is conveyed and then sealed. A lifting assembly 5 is installed on the lower right side of the sliding component. The lifting assembly 5 plays a lifting role. The conveying part 6 is installed on the upper rear side of the lifting assembly 5 through a connecting rod. The conveying part 6 is used to convey solder paste. A drive assembly is installed in the middle of the conveying part 6. The lower end of the drive assembly is connected to the inner side of the cleaning assembly 7 through a linkage rod 51. The cleaning assembly 7 initially blocks the outlet position of the conveying part 6. When the cleaning assembly 7 rotates until it completely leaves the outlet position area, the outlet position opens and the solder paste is input into the placement tray 2. The docking sleeve 8 is slidably disposed at the lower end of the conveying part 6. When the upper end of the docking sleeve 8 contacts the lower end of the conveying part 6, the drive assembly is energized to control the cleaning assembly 7 to rotate around the center position of the conveying part 6, so that the cleaning assembly 7 can perform cleaning operations on the inner surface of the placement tray 2. The sealing cover 9 is installed on the upper front side of the lifting assembly 5. The sealing cover 9 is used to seal the opening position at the upper end of the placement tray 2.

[0024] In actual operation, the sliding component moves the conveyor 6 to directly above the placement tray 2. The lifting component 5 lowers the conveyor 6 until the mating sleeve 8 is in contact with the lower end of the conveyor 6 (during the descent of the conveyor 6, the mating sleeve 8 is first placed on the upper end of the placement tray 2 and then stops descending; the conveyor 6 continues to descend until the two are in contact). At this time, the drive component is energized, thereby driving the cleaning component 7 to rotate, thereby scraping, wet wiping, and dry wiping the inside of the placement tray 2 to clean the placement tray 2 before solder paste is fed in. After the cleaning component 7 rotates at a small angle, it no longer squeezes the outlet of the conveyor 6, and the outlet opens. A certain amount of solder paste is fed into the clean placement tray 2 through the internal piston structure. After the cleaning component 7 rotates one revolution, it closes the outlet again, and the solder paste feeding is completed. Then, the lifting component 5 drives the conveyor 6 to rise and reset, and then pushes the sliding frame 4 to the left, so that the area around the placement tray 2 is completely cleared. At this time, the solder paste in the placement tray 2 is used for... After repairing LED components, if there is still some solder paste in the placement tray 2 after use, the sealing cover 9 can be lowered and sealed on the upper end of the placement tray 2 by the cooperation of the sliding component and the lifting component 5, thus sealing and storing it for the next use. When there is no solder paste in the placement tray 2, the placement tray 2 can be disassembled and its interior can be cleaned (the cleaning component 7 set in this application is mainly used for fine cleaning before supply, avoiding the mixing of impurities and particles in the placement tray 2 with the input solder paste, which would affect the subsequent solder paste soldering repair operation. The existing cleaning method is still used for cleaning the placement tray 2 after use). In this application, the interior of the storage structure (placement tray 2) is first finely cleaned for the supply of solder paste. The interior of the placement tray 2 is cleaned multiple times by removing particulate impurities, applying cleaning agent, and then wiping it dry, ensuring its cleanliness. The solder paste is conveyed during the cleaning process, which improves the supply efficiency. Moreover, the conveying process adopts a piston extrusion method to completely input the solder paste into the placement tray 2, avoiding incomplete delivery.

[0025] Reference Figure 5As shown, solder paste is a viscous paste-like mixture at room temperature. To ensure it remains viscous when placed in the placement tray 2, this application includes a conveying section 6 to interfere with its temperature before supplying it. After interference, the paste can be fully output, avoiding a situation where the supply volume is less than the predetermined amount. Specifically, the conveying section 6 includes a conveying frame 61, a blocking plate 62, a piston 63, a pushing cylinder 64, and a blocking member 65. The conveying frame 61 is installed on the upper rear side of the lifting assembly 5 via a connecting rod. A connecting member is installed on the upper middle part of the conveying frame 61, and the outlet is located on the lower left side of the conveying frame 61, used to block the outlet. The rear end of plate 62 is connected to the lower end face of conveying frame 61 via a pin. An input port is provided on the left side wall of conveying frame 61. An insulation layer is laid on the inner wall of conveying frame 61. Piston 63 is connected to connecting part via pushing cylinder 64. A storage cavity is formed between the lower part of piston 63 and conveying frame 61. An ejector 631 corresponding to the outlet position is installed on the lower left side of piston 63. Conveying unit is installed on lifting assembly 5. Solder paste is conveyed to the input port of conveying frame 61 and then enters the storage cavity through conveying unit. Blocking part 65 is installed on the upper left side of piston 63. When the blocking part 65 descends to the lowest position, it blocks the input port.

[0026] Reference Figure 2 As shown, the conveying unit includes a storage tank 66 and a conveying pump 67. The storage tank 66 is installed at the rear end of the conveying frame 61. The storage tank 66 is connected to the outlet position of the conveying frame 61 through the conveying pump 67. The conveying pump 67 is installed at the upper end of the lifting assembly 5.

[0027] Reference Figure 5 As shown, the blocking component 65 includes a blocking plate 651, an inner shell, and a blocking ball 652. The lower end of the blocking plate 651 is installed on the upper left side of the piston component 63, and the upper end of the blocking plate 651 is equipped with an inner shell. The interior of the inner shell is connected to the blocking ball 652 through an elastic element. The elastic element always maintains an outward pushing tendency on the blocking ball 652. During the descent of the blocking component 65, the blocking plate 651 and the blocking ball 652 successively isolate and seal the inlet position.

[0028] During the above-mentioned conveying process, the solder paste in the storage tank 66 is quantitatively conveyed into the storage cavity by the conveying pump 67. The temperature of the input solder paste is disturbed by the heat insulation layer, and it is allowed to return to the optimal temperature during the waiting process. When the cleaning component 7 stops squeezing the blocking plate 62, the blocking plate 62 is adjusted downward by gravity, and the outlet position is opened. At this time, the piston 63 and the blocking component 65 are driven down by the cylinder 64, thereby pushing the solder paste in the storage cavity into the placement tray 2 (during the descent, the blocking component 65 blocks the inlet to prevent the solder paste from flowing back when pushing down).

[0029] ReferenceFigure 5 As shown, in order to ensure that the cleaning component 7 only rotates circumferentially when it is in the working area, this application provides a drive component with a linkage structure and a docking sleeve 8. Specifically, the drive component includes a motor 68, a power supply, a first conductive component, a second conductive component 69, and an L-shaped component 70. An insulating cavity is provided in the middle of the conveying frame 61. The motor 68 is installed in the lower half of the insulating cavity, and the power supply, the first conductive component, and the second conductive component 69 are provided in the upper half of the insulating cavity. The power supply, the first conductive component, and the second conductive component 69 are electrically connected to the motor 68. The second conductive component 69 is initially in the lowest position and is in contact with the first conductive component. The second conductive component 69 is slidably disposed in the insulating cavity. The side wall of the second conductive component 69 is connected to the left end of the L-shaped component 70 made of insulating material.

[0030] Reference Figure 5 , Figure 7 , Figure 8 As shown, the linkage 51 includes a crossbeam, an adapter, and a telescopic cylinder. The telescopic cylinder is installed on the output shaft of the motor 68. The adapter is slidably installed inside the telescopic cylinder. The crossbeam is installed on the side wall of the adapter. The adapter and the telescopic cylinder form a telescopic structure that can extend and retract vertically, thereby cooperating with the lifting and lowering of the cleaning component 7.

[0031] Reference Figure 5 As shown, the upper end of the docking sleeve 8 is provided with a movable sleeve, which is movably disposed in the hidden groove opened at the lower end of the conveying frame 61. A connecting spring is connected between the upper end of the movable sleeve and the hidden groove. The connecting spring always maintains a downward pushing tendency on the movable sleeve. The lower right side of the L-shaped part 70 is installed on the movable sleeve.

[0032] In actual operation, the sliding component moves the conveying part 6 to the top of the placement tray 2. The lifting component 5 drives the conveying part 6 to descend. During the descent, the docking sleeve 8 is first fitted onto the upper end of the placement tray 2 and then stops descending. The conveying part 6 continues to descend until the two are in contact. At this time, the cleaning component 7 is completely inside the placement tray 2 (in the working area), and the movable sleeve pushes the L-shaped part 70 to the highest position. The first conductive part and the second conductive part 69 are in contact (the power supply, the first conductive part, the second conductive part 69 and the motor 68 form a complete passage). The energized motor 68 drives the linkage rod 51 and the cleaning component 7 to rotate around the center position of the conveying frame 61.

[0033] Reference Figures 6-8As shown, in order to ensure triple cleaning (particle scraping, cleaning agent application, and dry wiping) of the interior of the placement tray 2, this application provides a cleaning component 7. Specifically, the cleaning component 7 includes a connector 71, a cleaning part 72, a coating part 73, a top support component 74, and a wiping part 75. The side wall of the connector 71 is connected to the outer end face of the crossbeam. The cleaning part 72 is installed on the front side of the lower end of the connector 71 and is used to remove impurities and particles from the inner surface of the placement tray 2. The coating part 73 is installed in the middle of the lower end of the connector 71. The top support component 74, which is used in conjunction with the coating part 73, is slidably disposed in the movable groove opened in the middle of the connector 71. The top support component 74 in the initial position is used to block the blocking plate 62 at the blocking outlet position. The wiping part 75 is installed on the rear side of the lower end of the connector 71. A sponge strip is laid around the edge of the wiping part 75. The sponge strip is used to dry the inner surface of the placement tray 2 after wet wiping.

[0034] During the actual cleaning process described above, as the conveying unit 6 descends, the distance between the docking sleeve 8 and the conveying frame 61 gradually approaches. The top support assembly 74 is squeezed by the blocking plate 62 and descends relative to the position of the connector 71, thereby spreading the coating part 73 to both sides. After the cleaning assembly 7 arrives at the working area, the coating part 73 adheres to the inner wall of the placement tray 2. Then, the energized motor 68 drives the linkage rod 51 and the cleaning assembly 7 to rotate around the center position of the conveying frame 61. During the rotation, the cleaning part 72, the coating part 73, and the wiping part 75 sequentially perform triple cleaning on the inside of the placement tray 2.

[0035] Reference Figure 7 As shown, the cleaning part 72 includes a hard layer 721 and a scraper 722. The hard layer 721 is installed on the lower front side of the connector 71. The scraper 722 is provided at the front edge of the hard layer 721. The cross-section of the scraper 722 is L-shaped, and the L-shaped structure plays the role of scraping off the material.

[0036] During the scraping process described above, the scraper 722 scrapes away impurities from the inside of the placement tray 2, thereby removing particulate impurities.

[0037] Reference Figure 6 As shown, in order to further improve cleanliness after the particles are scraped off, this application applies cleaning agent to the scraped area through the application part 73 and wipes it clean. Specifically, the application part 73 includes an intermediate layer 731, an application element 732 and an extrusion head 733. The intermediate layer 731 is installed in the middle of the lower end of the connector 71. The intermediate layer 731 has a movable cavity inside. The application element 732 is symmetrically slidably arranged at the left and right ends of the movable cavity. The extrusion head 733 is installed on the side wall of the application element 732 near the top support assembly 74.

[0038] Reference Figure 6 ,Figure 9 As shown, the coating component 732 includes a rigid component 734, a rubber frame 735, a connecting plate 736, and a coating layer 737. The rigid component 734 is horizontally slidably disposed in the movable cavity. The rubber frame 735, the connecting plate 736, and the coating layer 737 are sequentially installed on the outer side of the rigid component 734 from the inside to the outside. The cavity formed by the rubber frame 735 and the connecting plate 736 is filled with cleaning agent. An expansion spring is connected to the rubber frame 735 and the connecting plate 736. The connecting plate 736 has a spray hole. When the rubber frame 735 and the connecting plate 736 are not compressed, the expansion spring maintains the shape of the rubber frame 735 and the connecting plate 736 (cavity).

[0039] Reference Figure 6 As shown, the top support assembly 74 includes a top support head 741 and a pressing rod 742. The top support head 741 is slidably disposed inside the movable groove. A return spring is connected between the top support head 741 and the bottom of the movable groove. The return spring always maintains an upward pushing tendency on the top support head 741. The pressing rod 742 is installed at the lower end of the top support head 741. A rollable ball is provided at the end of the pressing rod 742. The pressing rod 742 and the pressing surface of the pressing head 733 are used for pressing cooperation. The upper part of the extrusion surface is a structure that gradually slopes inward from top to bottom. The lower part of the extrusion surface of the extrusion head 733 is a vertical surface. The height of the vertical surface is equal to the height of the blocking plate 62. Since the cleaning component 7 rotates circumferentially, when the cleaning component 7 moves away from the area of ​​the blocking plate 62, the upper end of the top support head 741 is not squeezed by the blocking plate 62 and rises slightly. The setting of the vertical surface ensures that the slight rise of the top support head 741 does not affect the current position of the coating part 732 (the position that is in contact with the inner surface of the placement tray 2).

[0040] In actual operation, as the conveying unit 6 descends, the distance between the docking sleeve 8 and the conveying frame 61 gradually approaches. The top support head 741 is squeezed by the blocking plate 62 and moves downward relative to the position of the connector head 71, thereby pushing the applicator 732 to both sides. After the cleaning component 7 arrives at the working area, the applicator 732 adheres to the inner wall of the placement tray 2 (at this time, the rubber frame 735 is under slight pressure, and part of the cleaning agent in the cavity is squeezed into the inner wall of the placement tray 2). Then, as the motor 68 drives the applicator 73 to rotate, the cleaning agent squeezed out and the applicator layer 737 come into contact with the inner surface of the placement tray 2, so that the cleaning agent is wiped onto the inner surface area of ​​the placement tray 2, thereby achieving the effect of wet wiping.

[0041] The implementation principle of this embodiment is as follows: S1. The conveying part 6 is moved to the top of the placement tray 2 by the sliding part, and the conveying part 6 is lowered by the lifting component 5 until the docking sleeve 8 is attached to the lower end face of the conveying part 6. At this time, the driving component is powered on to drive the cleaning component 7 to rotate, thereby scraping, wet wiping and dry wiping the inside of the placement tray 2. S2. After the cleaning component 7 rotates to a certain angle, it separates from the blocking plate 62. At this time, the outlet position of the conveying frame 61 opens. The piston 63 is driven down by the cylinder 64, thereby conveying the solder paste in the cavity to the placement tray 2. After the cleaning component 7 is about to rotate one revolution, the solder paste is conveyed. At this time, the continuing to rotate cleaning component 7 will re-contact the blocking plate 62 and squeeze it to block the outlet position of the conveying frame 61 until the cleaning component 7 stops after rotating one revolution. S3. The lifting assembly 5 drives the conveying part 6 to rise and reset, and then pushes the sliding frame 4 to the left so that the area around the placement tray 2 is completely cleared. At this time, the solder paste in the placement tray 2 is used to repair the LED parts. S4. After use, clean or seal the placement tray 2.

[0042] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A solder supply device for LED production, characterized by, Include: The bottom plate (1); The placement tray (2) is rotatably arranged on the bottom plate (1), and the placement tray (2) is controlled to rotate by a driving part. The right side of the bottom plate (1) is provided with a supporting assembly (3); The sliding frame (4) slides along the length direction of the bottom plate (1), and the left end of the sliding frame (4) is slidably provided with a sliding piece. The right end of the sliding piece is provided with a lifting assembly (5) on the lower side; The conveying part (6) is installed on the upper end rear side of the lifting assembly (5) through a connecting rod. The conveying part (6) is used for conveying solder paste. The middle part of the conveying part (6) is provided with a driving assembly. The lower end of the driving assembly is connected to the inner side of the cleaning assembly (7) through a linkage rod (51). The cleaning assembly (7) in the initial position blocks the outlet position of the conveying part (6); The butt joint sleeve (8) is slidably arranged on the lower end of the conveying part (6). When the upper end of the butt joint sleeve (8) is in contact with the lower end of the conveying part (6), the driving assembly is energized to control the cleaning assembly (7) to rotate around the center position of the conveying part (6), so that the cleaning assembly (7) cleans the inner surface of the placement tray (2); The sealing cover (9) is installed on the upper end front side of the lifting assembly (5). The sealing cover (9) is used for sealing the opening position at the upper end of the placement tray (2).

2. The solder supply apparatus for LED production according to claim 1, characterized in that: The conveying part (6) comprises: The conveying frame (61) is installed on the upper end rear side of the lifting assembly (5) through a connecting rod. The middle upper end of the conveying frame (61) is provided with a connecting piece. The outlet position is arranged on the left lower side of the conveying frame (61). The rear end of the blocking plate (62) for blocking the outlet is connected to the lower end face of the conveying frame (61) through a pin shaft. The left side wall of the conveying frame (61) is provided with an input port. The inner wall of the conveying frame (61) is paved with a heat preservation layer; The piston piece (63) is connected to the connecting piece through a push air cylinder (64). The lower part of the piston piece (63) and the conveying frame (61) form a storage cavity. The lower left end of the piston piece (63) is provided with a push-out piece (631) corresponding to the outlet position; The conveying unit is installed on the lifting assembly (5). The solder paste is conveyed to the input port of the conveying frame (61) through the conveying unit and then enters the storage cavity; The blocking piece (65) is installed on the left upper side of the piston piece (63). The blocking piece (65) blocks the input port when it is lowered to the lowest position.

3. The solder supply apparatus for LED production according to claim 2, wherein: The conveying unit comprises a storage box (66) and a conveying pump (67). The storage box (66) is installed on the rear end of the conveying frame (61). The storage box (66) and the outlet position of the conveying frame (61) are connected through the conveying pump (67). The conveying pump (67) is installed on the upper end of the lifting assembly (5); The blocking piece (65) comprises a blocking plate (651), an inner shell and a blocking ball (652). The lower end of the blocking plate (651) is installed on the left upper side of the piston piece (63). The upper end of the blocking plate (651) is provided with an inner shell. The inner part of the inner shell is connected to the blocking ball (652) through an elastic piece.

4. The solder supply apparatus for LED production according to claim 2, wherein: The driving assembly comprises a motor (68), a power supply, a conductive part one, a conductive part two (69) and an L-shaped part (70), a middle part of the conveying frame (61) is provided with an insulating cavity, a lower half of the insulating cavity is provided with the motor (68), an upper half of the insulating cavity is provided with the power supply, the conductive part one and the conductive part two (69), the power supply, the conductive part one and the conductive part two (69) are electrically connected with the motor (68), the conductive part two (69) is slidably arranged in the insulating cavity, and a side wall of the conductive part two (69) is connected with a left end of the L-shaped part (70) made of insulating material.

5. The solder supply apparatus for LED production according to claim 4, wherein: The linkage rod (51) comprises a cross beam, an adapter and a telescopic cylinder, the output shaft of the motor (68) is provided with the telescopic cylinder, the adapter is slidably arranged in the telescopic cylinder, and a side wall of the adapter is provided with the cross beam.

6. The solder supply apparatus for LED production according to claim 5, wherein: The cleaning assembly (7) comprises: a connecting head (71), a side wall of which is connected with an outer end surface of the cross beam; a cleaning part (72) which is arranged on the front side of the lower end of the connecting head (71) and is used for cleaning impurity particles on the inner surface of the placement disc (2); an application part (73) which is arranged on the middle part of the lower end of the connecting head (71), a top support assembly (74) which is used in extrusion with the application part (73) is slidably arranged in a movable slot arranged in the middle part of the connecting head (71), and the top support assembly (74) in the initial position is used for plugging the blocking plate (62) in the blocking outlet position; a wiping part (75) which is arranged on the rear side of the lower end of the connecting head (71), and a sponge strip is arranged around the edge of the wiping part (75).

7. The solder supply apparatus for LED production according to claim 6, wherein: The cleaning part (72) comprises a hard layer (721) and a scraping part (722), the hard layer (721) is arranged on the lower end of the connecting head (71), a front end edge of the hard layer (721) is provided with the scraping part (722), and the scraping part (722) has an L-shaped structure in cross section.

8. The solder supply apparatus for LED production according to claim 6, wherein: The application part (73) comprises an intermediate layer (731), an application part (732) and an extrusion head (733), the intermediate layer (731) is arranged on the lower end of the connecting head (71), a movable cavity is arranged in the intermediate layer (731), the application part (732) is symmetrically and slidably arranged at the left and right ends of the movable cavity, and the extrusion head (733) is arranged on the side wall of the application part (732) close to the top support assembly (74). The application part (732) comprises a rigid part (734), a rubber frame (735), a connecting plate (736) and an application layer (737), the rigid part (734) is horizontally and slidably arranged in the movable cavity, the rubber frame (735), the connecting plate (736) and the application layer (737) are sequentially arranged on the outer side of the rigid part (734) from inside to outside, a cavity formed by the rubber frame (735) and the connecting plate (736) is filled with a cleaning agent, an outwardly expanding spring is connected between the rubber frame (735) and the connecting plate (736), and a spraying hole is arranged on the connecting plate (736).

9. The solder supply apparatus for LED production according to claim 8, wherein: The top supporting assembly (74) comprises a top supporting head (741), an extruding rod (742), the top supporting head (741) is arranged in the inside of the movable groove and slides up and down, a reset spring is connected between the top supporting head (741) and the bottom of the movable groove, the lower end of the top supporting head (741) is provided with the extruding rod (742), the end of the extruding rod (742) is provided with rollable balls, the extruding rod (742) and the extruding surface of the extruding head (733) are extruded and used in cooperation, the middle and upper part of the extruding surface of the extruding head (733) is gradually inclined to the inside from top to bottom, and the lower part of the extruding surface of the extruding head (733) is a vertical surface.

10. The solder supply apparatus for LED production according to claim 4, wherein: The upper end of the butt joint sleeve (8) is provided with a movable sleeve, the movable sleeve is movably arranged in the hidden groove arranged at the lower end of the conveying frame (61), and a connecting spring is connected between the upper end of the movable sleeve and the hidden groove, and the lower side of the right end of the L-shaped piece (70) is installed on the movable sleeve.

Images