Three-dimensional mounting device and three-dimensional mounting method

Abstract

The invention provides a three-dimensional mounting apparatus and a three-dimensional mounting method. The three-dimensional mounting apparatus includes: a stage that supports a three-dimensional substrate; a mounting head for mounting the component in the mounting area; the heating head is used for heating the paste solder; and a controller. The controller is provided with: an allowable angle acquisition unit that acquires an allowable angle indicating the maximum value of the inclination angle of the component whose positional shift amount after installation is suppressed to be less than or equal to a predetermined amount; a mounting order determination unit that determines the mounting order of the components with respect to the plurality of mounting region components; a table control unit that controls the table; a head control unit that controls the mounting head so as to sequentially mount the components in the mounting region in the horizontal state in the mounting order; and a heating control unit that controls the heating head so as to heat the paste solder in the first mounting region during mounting of the first component when a mounting order in which the first component is made to be at or below an allowable angle after the first component is moved relative to the first mounting region and when the second component is mounted is impossible to be achieved.

Description

TECHNICAL FIELD

[0001] The technology disclosed in this specification relates to a three-dimensional mounting apparatus and a three-dimensional mounting method. BACKGROUND

[0002] In the technical field related to the three-dimensional mounting apparatus, there is known a three-dimensional mounting apparatus that mounts a component on a three-dimensional substrate, as disclosed in Patent Literature 1. PRIOR ART DOCUMENTS PATENT LITERATURE

[0003] Patent Literature 1: International Publication No. 2018 / 207313 SUMMARY PROBLEMS TO BE SOLVED BY THE INVENTION

[0004] In a case where a component is mounted on a mounting region provided on a surface of a three-dimensional substrate, the inclination angle of the three-dimensional substrate is adjusted so that the mounting region becomes a horizontal state. When a second component is mounted on a second mounting region after a first component is mounted on a first mounting region, the first mounting region can be inclined with respect to the horizontal plane. In a case where the first mounting region is inclined with respect to the horizontal plane, the first component can be displaced in position due to the action of gravity.

[0005] The technology disclosed in this specification aims to suppress displacement in position of a component. MEANS FOR SOLVING THE PROBLEMS

[0006] The present specification discloses a three-dimensional mounting apparatus including a table that supports a three-dimensional substrate having a surface on which a mounting region to which paste solder is applied is provided, a mounting head that mounts a component on the mounting region, a heating head that heats the paste solder, and a controller. The controller includes an allowable angle acquisition section that acquires an allowable angle that indicates a maximum value of an inclination angle of the component whose displacement in position after mounting is suppressed to be equal to or smaller than a prescribed amount, a mounting order determination section that determines a mounting order of the component with respect to a plurality of mounting regions so that the component after mounting becomes equal to or smaller than the allowable angle, a table control section that controls the table so that the plurality of mounting regions sequentially become a horizontal state in accordance with the mounting order, a head control section that controls the mounting head so that the component is sequentially mounted on the mounting region in the horizontal state in accordance with the mounting order, and a heating control section that controls the heating head so that, in a case where a mounting order in which the first component becomes equal to or smaller than the allowable angle after the first component is mounted on the first mounting region and when a second component is mounted is not possible, the paste solder of the first mounting region is heated in the mounting of the first component. EFFECT OF THE INVENTION

[0007] According to the technology disclosed in this specification, displacement in position of a component can be suppressed. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 This is a perspective view showing the substrate and components of the embodiment. Figure 2 This is a perspective view showing the support plate of the substrate in the embodiment. Figure 3 This is an exploded perspective view showing the substrate and tray of the embodiment. Figure 4 This is a side view schematically illustrating the three-dimensional mounting device of the embodiment. Figure 5 This is a top view schematically illustrating the implementation of a three-dimensional mounting device. Figure 6 This is a perspective view showing the tray and workbench of the implementation method. Figure 7 This is an exploded perspective view showing the tray and workbench of the implementation method. Figure 8 This is a schematic diagram illustrating the mounting head of an embodiment. Figure 9 This is a hardware configuration diagram of the controller in the implementation method. Figure 10 This is a functional block diagram representing the three-dimensional mounting device of the implementation method. Figure 11 This is a top view schematically illustrating the implementation of the substrate. Figure 12 This diagram illustrates the operation of the workbench and mounting head in the implementation method. Figure 13 This diagram illustrates the operation of the workbench and mounting head in the implementation method. Figure 14 This diagram illustrates the operation of the laser head in the embodiment. Figure 15 This diagram illustrates the operation of the heating head in the embodiment. Figure 16 This is a diagram illustrating the positional offset of the components in the implementation method. Figure 17 This diagram illustrates the installation sequence of the components in the implementation method. Figure 18 This diagram illustrates the installation sequence of the components in the implementation method. Figure 19 This diagram illustrates the component whose positional offset was not eliminated in the implementation method. Figure 20 This diagram illustrates the component whose positional offset was not eliminated in the implementation method. Figure 21This diagram illustrates the operation of a three-dimensional mounting device when there are components whose positional offset has not been eliminated in the implementation method. Figure 22 This diagram illustrates the operation of a three-dimensional mounting device when there are components whose positional offset has not been eliminated in the implementation method. Figure 23 This is a flowchart illustrating the method for determining the installation order of components in an implementation method. Figure 24 This is a flowchart illustrating the method for installing the components in an embodiment. Figure 25 This is a schematic diagram illustrating the permissible angle storage unit of an embodiment. Figure 26 This is a diagram schematically illustrating the controller of an implementation method. Figure 27 This diagram illustrates the relationship between the solder paste and the heating head in the embodiment. Detailed Implementation

[0009] The embodiments will now be described with reference to the accompanying drawings. In the embodiments, an XYZ orthogonal coordinate system is defined, and the positional relationships of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X-axis of the defined surface is defined as the X-axis direction. The direction parallel to the Y-axis of the defined surface orthogonal to the X-axis is defined as the Y-axis direction. The direction parallel to the Z-axis orthogonal to the defined surface is defined as the Z-axis direction. The rotational or tilting direction centered on the X-axis direction is defined as the θX direction. The rotational or tilting direction centered on the Y-axis direction is defined as the θY direction. The rotational or tilting direction centered on the Z-axis direction is defined as the θZ direction. In the embodiments, the defined surface is parallel to the horizontal plane. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. Furthermore, in the embodiments, the defined surface including the X-axis and Y-axis is appropriately referred to as the XY plane.

[0010] [Substrate] Figure 1 This is a perspective view showing the substrate 1 and component 2 according to an embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. Protrusions may be provided on the surface of the substrate 1.

[0011] A circuit is disposed on the surface of substrate 1. In this embodiment, substrate 1 is formed by in-mold molding technology. Substrate 1 includes: a substrate 1A having a curved surface; and a thin film 1B bonded to the surface of substrate 1A. Thin film 1B is flexible. Thin film 1B is a flexible thin film. Thin film 1B includes the circuit. The surface of substrate 1 includes the surface of thin film 1B.

[0012] Component 2 includes electronic components. Component 2 can be a leaded electronic component with leads protruding from the body. Component 2 can also be a chip-type electronic component without leads. Electronic devices are manufactured by mounting component 2 on the surface of substrate 1.

[0013] [Pattern] Figure 2 This is a perspective view showing the support plate 3 of the substrate 1 in the embodiment. Figure 3 This is an exploded perspective view showing the substrate 1 and the tray 3 according to the embodiment. The tray 3 holds the substrate 1. In the embodiment, the substrate 1 is processed while being held on the tray 3. The tray 3 has: a support member 4 for supporting the substrate 1; and a clamping mechanism 5 for fixing the substrate 1.

[0014] The support member 4 includes: a base portion 4A that supports the substrate 1 from the -Z side; a protective portion 4B that is respectively provided on the +Y side and the -Y side of the base portion 4A; and a plurality of pin portions 4C that support the substrate 1 from the +Y side and the -Y side.

[0015] The base portion 4A is a plate-shaped structure with multiple openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the upper and lower surfaces of the base portion 4A.

[0016] The protective part 4B is longer in the X-axis direction. A pair of protective parts 4B are provided. The pair of protective parts 4B are separated from each other in the Y-axis direction. One protective part 4B protrudes from the +Y side end of the upper surface of the base part 4A toward the +Z side. The other protective part 4B protrudes from the -Y side end of the upper surface of the base part 4A toward the +Z side.

[0017] Multiple pins 4C protrude from the upper surface of the base portion 4A toward the +Z side. A portion of the pins 4C are positioned closer to the +Y side than the center of the base portion 4A. A portion of the pins 4C are positioned closer to the -Y side than the center of the base portion 4A. The pins 4C positioned closer to the +Y side than the center of the base portion 4A support the +Y side end of the base plate 1. The pins 4C positioned closer to the -Y side than the center of the base portion 4A support the -Y side end of the base plate 1.

[0018] A clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes: a pair of support portions 5A supporting the -X side end of the substrate 1; and a movable portion 5B supporting the +X side end of the substrate 1. The movable portion 5B is movable in the X-axis direction on the upper surface of the base portion 4A. When the substrate 1 is positioned between the support portions 5A and the movable portion 5B, the substrate 1 is clamped by the support portions 5A and the movable portion 5B as it moves in the -X direction via the movable portion 5B. The substrate 1 is fixed to the support plate 3 by being clamped by the support portions 5A and the movable portion 5B.

[0019] [Three-dimensional mounting device] Figure 4 This is a side view schematically showing the three-dimensional mounting device 10 of the embodiment. Figure 5 This is a top view schematically illustrating the three-dimensional mounting device 10 of the embodiment. The three-dimensional mounting device 10 mounts the component 2 onto the substrate 1.

[0020] The three-dimensional mounting device 10 includes a base component 18, a conveying device 19, a worktable 20, a worktable moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a camera 25, a head moving device 27, a distributor 11, a laser head 12, a heating head 13, a nozzle storage device 14, a chamber 29, and a controller 16.

[0021] The base component 18 supports the conveying device 19, the worktable 20, the worktable moving device 21, the component supply device 22, the mounting head 24, the head moving device 27, the distributor 11, the laser head 12, the heating head 13, and the nozzle storage device 14.

[0022] The conveying device 19 conveys the tray 3 holding the substrate 1 in the X-axis direction. The conveying device 19 conveys the tray 3 to the processing position of the three-dimensional mounting device 10. The processing position is defined on the conveying path of the conveying device 19.

[0023] The conveying device 19 includes: a conveyor belt 19A for conveying the pallet 3 in the X-axis direction; and a guide member 19B for guiding the pallet 3.

[0024] The guide member 19B is longer in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are separated from each other in the Y-axis direction. One guide member 19B is positioned on the +Y side relative to the tray 3. The other guide member 19B is positioned on the -Y side relative to the tray 3.

[0025] The conveyor belt 19A is looped. A pair of conveyor belts 19A are provided. The conveyor belts 19A are supported on guide members 19B via drive pulleys and driven pulleys. The conveyor belts 19A are mounted on the drive pulleys and driven pulleys. One conveyor belt 19A is supported on one guide member 19B. The other conveyor belt 19A is supported on the other guide member 19B.

[0026] The +Y side end of the lower surface of the support plate 3 of the conveyor belt 19A on the +Y side. The -Y side end of the lower surface of the support plate 3 of the conveyor belt 19A on the -Y side. The support plate 3 is conveyed in the X-axis direction by rotating the drive pulley via a drive motor (not shown).

[0027] By means of an actuator (not shown), one guide member 19B can move relative to the other guide member 19B in the Y-axis direction. By separating one guide member 19B from the other guide member 19B in the Y-axis direction, the support of the conveyor belt 19A on the pallet 3 is released.

[0028] Figure 6 This is a perspective view showing the tray 3 and the worktable 20 of the embodiment. Figure 7 This is an exploded perspective view showing the tray 3 and the worktable 20 of the embodiment.

[0029] The worktable 20 supports the base plate 1 via the pallet 3. The worktable 20 supports the pallet 3, which is being transported to the processing position, from the -Z side. Two positioning members 20A are provided on the upper surface of the worktable 20. The positioning members 20A are inserted into holes 4D in the pallet 3. The worktable 20 and the pallet 3 are positioned by the positioning members 20A being inserted into the holes 4D from the -Z side of the pallet 3. A hook is provided at the upper end of the positioning member 20A. The hook is attached to the pallet 3. The hook includes a ball that moves under air pressure. After the positioning members 20A are inserted into the holes 4D from the -Z side of the pallet 3, the worktable 20 and the pallet 3 are fixed by the hooks being attached to the pallet 3.

[0030] The worktable moving device 21 moves the worktable 20. In this embodiment, the worktable moving device 21 is capable of moving the worktable 20 along the Y-axis, Z-axis, θX-axis, and θY-axis, respectively. The worktable moving device 21 includes: a Y-axis motor that generates power to move the worktable 20 along the Y-axis; a Z-axis motor that generates power to move the worktable 20 along the Z-axis; an θX motor that generates power to rotate the worktable 20 along the θX-axis; and an θY motor that generates power to rotate the worktable 20 along the θY-axis.

[0031] After the pallet 3 is conveyed to the processing position by the conveyor 19, the guide member 19B on the +Y side moves in the +Y direction to separate from the other guide member 19B, and the worktable 20 is moved in the +Z direction by the worktable moving device 21. The guide member 19B on the +Y side moves in the Y-axis direction to separate from the other guide member 19B, thereby releasing the support of the conveyor belt 19A on the pallet 3. With the support of the conveyor belt 19A on the pallet 3 released, the worktable 20 moves in the +Z direction, thereby transferring the pallet 3 from the conveyor 19 to the worktable 20. The worktable moving device 21 can move the worktable 20 in the Z-axis direction, the θX direction, and the θY direction respectively while the pallet 3 is supported on the worktable 20.

[0032] When pallet 3 is transferred from worktable 20 to conveyor 19, worktable 20 moves in the -Y direction to position the -Y side end of pallet 3 above the -Y side conveyor belt 19A, and guide member 19B on the +Y side moves in the -Y direction to position the +Y side end of pallet 3 above the +Y side conveyor belt 19A. After releasing the hook fixing provided at the upper end of positioning member 20A, worktable 20 is moved in the -Z direction by worktable moving device 21. This releases the support of worktable 20 on pallet 3, and pallet 3 is supported on conveyor belt 19A.

[0033] The component supply device 22 supplies component 2. The component supply device 22 includes a plurality of belt feeders. The belt feeders hold a plurality of components 2. The component supply device 22 supplies at least one of the plurality of components 2 to a supply position. The component supply device 22 is disposed on the -Y side of the conveyor device 19. Alternatively, the component supply device 22 may be disposed on both the +Y side and the -Y side of the conveyor device 19.

[0034] The mounting head 24 mounts the component 2 onto the substrate 1. The mounting head 24 supports a plurality of nozzles 23. The mounting head 24 holds the component 2 supplied from the component supply device 22 through the nozzles 23 and mounts the component 2 onto the substrate 1. The mounting head 24 is movable between a supply position where the component 2 is supplied from the component supply device 22 and a processing position where the substrate 1 is disposed. The mounting head 24 holds the component 2 supplied to the supply position through the nozzles 23, and after moving to the processing position, mounts the component 2 onto the surface of the substrate 1 disposed at the processing position.

[0035] The head moving device 27 moves the mounting head 24. In this embodiment, the head moving device 27 moves the mounting head 24 along both the X-axis and Y-axis directions. The head moving device 27 includes an X-axis moving device 27X for moving the mounting head 24 along the X-axis direction and a Y-axis moving device 27Y for moving the mounting head 24 along the Y-axis direction. Both the X-axis moving device 27X and the Y-axis moving device 27Y include actuators. The X-axis moving device 27X is connected to the mounting head 24. The mounting head 24 moves along the X-axis direction due to the operation of the X-axis moving device 27X. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. The X-axis moving device 27X moves along the Y-axis direction due to the operation of the Y-axis moving device 27Y, thereby moving the mounting head 24 along the Y-axis direction.

[0036] Figure 8 This is a schematic diagram illustrating the mounting head 24 of the embodiment. (As shown) Figure 8 As shown, the mounting head 24 has multiple nozzles 23. The nozzles 23 are capable of holding the member 2 in a suction-holding manner. The nozzles 23 are suction nozzles for the suction-holding member 2. An opening is provided at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. When the lower end of the nozzle 23 is in contact with the member 2, the member 2 is suction-held at the lower end of the nozzle 23 by performing a suction action from the opening provided at the lower end of the nozzle 23. By releasing the suction action from the opening, the member 2 is released from the nozzle 23. Alternatively, the nozzle 23 can also be a clamping nozzle for a clamping and holding member 2.

[0037] Mounting head 24 includes a nozzle moving device 28 for moving nozzle 23. The nozzle moving device 28 moves nozzle 23 along the Z-axis and θZ-axis, respectively. The nozzle moving device 28 is supported on mounting head 24. Nozzle 23 is connected to the lower end of shaft 23A. Multiple shafts 23A are provided. Multiple nozzles 23 are connected to multiple shafts 23A. Multiple nozzle moving devices 28 are provided. Multiple nozzle moving devices 28 are connected to multiple shafts 23A. Nozzle 23 is supported on mounting head 24 via shafts 23A and nozzle moving devices 28. The nozzle moving device 28 moves nozzle 23 by moving shafts 23A along the Z-axis and θZ-axis.

[0038] The nozzle 23 can be moved along the X-axis, Y-axis, Z-axis and θZ-axis respectively by the head moving device 27 and the nozzle moving device 28. As the nozzle 23 moves, the component 2 held in the nozzle 23 can also move along the X-axis, Y-axis, Z-axis and θZ-axis respectively.

[0039] Camera 25 photographs substrate 1. In this embodiment, camera 25 photographs the surface of substrate 1 from the +Z side. Camera 25 is mounted on mounting head 24. Camera 25 moves together with mounting head 24 along the X-axis and Y-axis directions. Camera 25 is capable of photographing alignment marks provided on the surface of substrate 1. Camera 25 is also capable of photographing component 2 mounted behind substrate 1.

[0040] Dispenser 11 applies solder paste to substrate 1. Dispenser 11 moves along the X-axis, Y-axis, and Z-axis directions at a position closer to the +Z side than conveyor 19. Dispenser 11 and mounting head 24 can move independently. After the solder paste is applied to the surface of substrate 1 by dispenser 11, component 2 is mounted to substrate 1 by mounting head 24. Mounting head 24 mounts component 2 to substrate 1 coated with solder paste.

[0041] The laser head 12 irradiates the solder paste with a laser to melt it. After the component 2 is mounted on the substrate 1 using the solder paste, the laser head 12 irradiates the solder paste with a laser. The laser head 12 irradiates the solder paste with a laser to melt it. The laser head 12 moves along the X-axis, Y-axis, and Z-axis directions at a position closer to the +Z side than the conveying device 19.

[0042] Heating head 13 heats the paste solder. Heating head 13 supplies hot air to the paste solder, heating it. Heating head 13 supplies hot air to the paste solder to melt it. Hot air refers to heated air. The temperature of the hot air is high enough to melt the paste solder. In this embodiment, the temperature of the hot air is 100°C or higher and 500°C or lower. When mounting component 2 onto substrate 1 using the paste solder, heating head 13 blows hot air onto the paste solder. Heating head 13 melts the paste solder by blowing hot air onto it. Heating head 13 moves along the X-axis, Y-axis, and Z-axis directions at positions closer to the +Z side than the conveying device 19.

[0043] The heating head 13 includes: a heating section 13A for heating air to generate hot air; and a hot air nozzle 13B for injecting the hot air generated in the heating section 13A. The heating section 13A includes a heating device such as a heating wire capable of heating air. The hot air nozzle 13B has a nozzle for injecting hot air. The nozzle is located at the lower end of the hot air nozzle 13B. Hot air generated in the heating section 13A is injected from the nozzle of the hot air nozzle 13B. Hot air injected from the nozzle of the hot air nozzle 13B is supplied to the solder paste. The heating section 13A can adjust the temperature and flow rate of the hot air injected from the hot air nozzle 13B.

[0044] The heating head 13, laser head 12, distributor 11, and mounting head 24 can move independently.

[0045] The nozzle storage 14 houses multiple hot air nozzles 13B. The nozzle storage 14 is supported by the base component 18. In this embodiment, the nozzle storage 14 is positioned on the +Y side relative to the conveying device 19. The hot air nozzles 13B are detachable from and replaceable relative to the heating unit 13A. After the heating head 13 moves above the nozzle storage 14, the hot air nozzle 13B removed from the heating unit 13A is stored in the nozzle storage 14. After removing the hot air nozzle 13B from the heating unit 13A, another hot air nozzle 13B stored in the nozzle storage 14 is installed onto the heating unit 13A, thereby replacing the hot air nozzle 13B.

[0046] The nozzle storage 14 contains multiple hot air nozzles 13B with different constructions. The nozzle storage 14 also contains multiple hot air nozzles 13B with at least different nozzle sizes. Replacing a hot air nozzle 13B involves changing the nozzle size of the hot air nozzle 13B.

[0047] The chamber 29 has an internal space for each of the following components: base component 18, conveying device 19, worktable 20, worktable moving device 21, component supply device 22, mounting head 24, head moving device 27, nozzle moving device 28, distributor 11, laser head 12, heating head 13, and nozzle storage 14.

[0048] [Controller] Figure 9 This is a hardware configuration diagram of the controller 16 according to the implementation method. The controller 16 includes a computer system. The controller 16 has a processor 16A such as a CPU (Central Processing Unit), main memory 16B including non-volatile memory such as ROM (Read Only Memory) and volatile memory such as RAM (Random Access Memory), memory 16C, and an interface 16D including input / output circuitry. The functions of the controller 16 are stored as a computer program in memory 16C. The processor 16A reads the computer program from memory 16C and expands it into main memory 16B, and executes the prescribed processing according to the computer program. In addition, the computer program can also be distributed to the controller 16 via a network.

[0049] Figure 10 This is a functional block diagram illustrating the three-dimensional mounting device 10 of the implementation method. For example... Figure 10 As shown, the controller 16 includes a distributor control unit 31, a worktable control unit 32, a head control unit 33, a laser control unit 34, a heating control unit 35, a position offset calculation unit 36, an allowable angle acquisition unit 37, an installation sequence determination unit 38, an allowable angle storage unit 41, and an installation sequence storage unit 42.

[0050] Distributor control unit 31 controls distributor 11. Distributor control unit 31 controls distributor 11 to apply paste solder 60 to the surface of substrate 1.

[0051] Figure 11 This is a schematic top view of the substrate 1 according to an embodiment. Figure 11 As shown, a plurality of mounting areas 50 are provided on the surface of the substrate 1. The mounting areas 50 are areas for mounting components 2. Components 2 are mounted in the plurality of mounting areas 50 respectively. The distributor control unit 31 controls the distributor 11 to apply solder paste 60 to each of the plurality of mounting areas 50.

[0052] The worktable control unit 32 controls the worktable 20. The worktable 20 supports a substrate 1, which has a surface with a plurality of mounting areas 50 coated with solder paste 60. The head control unit 33 controls the mounting head 24 to mount the component 2 onto the mounting areas 50 of the substrate 1 supported on the worktable 20.

[0053] Figure 12 as well as Figure 13 These figures illustrate the operation of the worktable 20 and mounting head 24 in the embodiment. Multiple mounting areas 50 are provided on the surface of the substrate 1. Figure 12 as well as Figure 13 In the example shown, the mounting regions 50 defined on the surface of the substrate 1 include mounting regions 50A, 50B, and 50C. Solder paste 60 is applied to each of the mounting regions 50. The component 2 includes: component 2A, mounted in mounting region 50A; component 2B, mounted in mounting region 50B; and component 2C, mounted in mounting region 50C.

[0054] When component 2 is mounted on the mounting area 50 set on the surface of substrate 1, the tilt angle of substrate 1 is adjusted so that mounting area 50 is horizontal. The worktable control unit 32 controls the worktable 20 to sequentially horizontalize the plurality of mounting areas 50. Substrate 1 is rotated to sequentially horizontalize the plurality of mounting areas 50. The head control unit 33 controls the mounting head 24 to sequentially mount component 2 onto the horizontally horizontal mounting areas 50.

[0055] like Figure 12 As shown, when component 2A is mounted in mounting area 50A, the worktable control unit 32 controls the worktable 20 to make mounting area 50A horizontal. The head control unit 33 controls the mounting head 24 to mount component 2A in the horizontal mounting area 50A. Component 2A is mounted in mounting area 50A by means of solder paste 60 applied to mounting area 50A.

[0056] likeFigure 13 As shown, after component 2A is installed in mounting area 50A, component 2B is installed in mounting area 50B. With component 2B installed in mounting area 50B, the worktable control unit 32 controls the worktable 20 to make mounting area 50B horizontal. The head control unit 33 controls the mounting head 24 to install component 2B in the horizontally positioned mounting area 50B. Component 2B is installed in mounting area 50B using solder paste 60 applied to mounting area 50B.

[0057] After component 2B is installed in mounting area 50B, component 2C is installed in mounting area 50C. With component 2C installed in mounting area 50C, the worktable control unit 32 controls the worktable 20 to make mounting area 50C horizontal. The head control unit 33 controls the mounting head 24 to install component 2C in the horizontally positioned mounting area 50C. Component 2C is installed in mounting area 50C using solder paste 60 applied to mounting area 50C.

[0058] The laser control unit 34 controls the laser head 12. After the component 2 is mounted in the mounting area 50 using solder paste 60, the laser control unit 34 controls the laser head 12 to irradiate the solder paste 60 with a laser. By irradiating the solder paste 60 with a laser, the solder paste 60 melts. By cooling the molten solder paste 60, the component 2 is brazed onto the substrate 1.

[0059] Figure 14 This diagram illustrates the operation of the laser head 12 according to the embodiment. (As shown...) Figure 14 As shown, the laser head 12 irradiates the solder paste 60 with laser light after the component 2 is mounted in the mounting area 50. When irradiating the solder paste 60 in the mounting area 50 where the component 2 is mounted with laser light, the tilt angle of the substrate 1 is adjusted so that the mounting area 50 is horizontal. The worktable control unit 32 controls the worktable 20 to sequentially make the plurality of mounting areas 50 horizontal. The laser control unit 34 controls the laser head 12 to sequentially irradiate the solder paste 60 in the horizontally positioned mounting areas 50 with laser light.

[0060] like Figure 14 As shown, when a laser is irradiated onto the solder paste 60 in the mounting area 50A where component 2A is mounted, the worktable control unit 32 controls the worktable 20 to make the mounting area 50A horizontal. The laser control unit 34 controls the laser head 12 to irradiate the solder paste 60 in the horizontally positioned mounting area 50A. The solder paste 60 in the mounting area 50A melts under laser irradiation. By cooling the molten solder paste 60 in the mounting area 50A, component 2A is brazed to the mounting area 50A.

[0061] When a laser is applied to the solder paste 60 in the mounting area 50B where component 2B is mounted, the worktable control unit 32 controls the worktable 20 to level the mounting area 50B. The laser control unit 34 controls the laser head 12 to apply the laser to the horizontally positioned solder paste 60 in the mounting area 50B. The solder paste 60 in the mounting area 50B melts under laser irradiation. By cooling the molten solder paste 60 in the mounting area 50B, component 2B is brazed to the mounting area 50B.

[0062] When a laser is applied to the solder paste 60 in the mounting area 50C where component 2C is mounted, the worktable control unit 32 controls the worktable 20 to level the mounting area 50C. The laser control unit 34 controls the laser head 12 to apply the laser to the horizontally positioned solder paste 60 in the mounting area 50C. The solder paste 60 in the mounting area 50C melts under laser irradiation. By cooling the molten solder paste 60 in the mounting area 50C, component 2C is brazed to the mounting area 50C.

[0063] The heating control unit 35 controls the heating head 13. When the component 2 is mounted in the mounting area 50 using the solder paste 60, the heating control unit 35 controls the heating head 13 to supply hot air to the solder paste 60. By supplying hot air to the solder paste 60, the solder paste 60 melts. By cooling the molten solder paste 60, the component 2 is fixed to the substrate 1.

[0064] Figure 15 This diagram illustrates the operation of the heating head 13 in the embodiment. Figure 15 As shown, the heating head 13 supplies hot air to the solder paste 60 during the mounting of the component 2 relative to the mounting area 50. While supplying hot air to the solder paste 60 in the mounting area 50 of the component 2, the tilt angle of the substrate 1 is adjusted to make the mounting area 50 horizontal. The worktable control unit 32 controls the worktable 20 to make the mounting area 50 horizontal. The heating control unit 35 controls the heating head 13 to heat the solder paste 60 in the mounting area 50 during the mounting of the component 2. Figure 15 As shown, in this embodiment, the heating control unit 35 controls the heating head 13 to heat the solder paste 60 in the mounting region 50 while the component 2 is pressed against the mounting region 50 (substrate 1) through the nozzle 23 of the mounting head 24. The heating control unit 35 also controls the heating head 13 to supply hot air to the solder paste 60 while the component 2 is pressed against the horizontally positioned solder paste 60 in the mounting region 50 through the mounting head 24.

[0065] like Figure 15As shown, when hot air is supplied to the solder paste 60 in the mounting area 50A where component 2A is mounted, the worktable control unit 32 controls the worktable 20 to make the mounting area 50A horizontal. The heating control unit 35 controls the heating head 13 to supply hot air to the horizontally positioned solder paste 60 in the mounting area 50A. The solder paste 60 in the mounting area 50A melts due to the supply of hot air. By cooling the molten solder paste 60 in the mounting area 50A, component 2A is fixed to the mounting area 50A.

[0066] When component 2B is mounted in mounting area 50B and the solder paste 60 in mounting area 50B is heated by heating head 13, substrate 1 is rotated to bring mounting area 50B to a horizontal position. Heating head 13 is controlled to supply hot air to solder paste 60 while component 2B is pressed against the horizontally positioned solder paste 60 in mounting area 50B by mounting head 24. The same procedure applies when component 2C is mounted in mounting area 50C and the solder paste 60 in mounting area 50C is heated by heating head 13.

[0067] [Permitted Angle] The position offset calculation unit 36 ​​calculates the position offset ΔD of the mounted component 2 relative to the mounting area 50. The component 2 mounted on the substrate 1 is captured by the camera 25. Based on the image data of the mounted component 2 captured by the camera 25, the position offset calculation unit 36 ​​calculates the position offset ΔD of the mounted component 2.

[0068] Figure 16 This diagram illustrates the positional offset of component 2 in the embodiment. After component 2 is mounted in mounting area 50 using solder paste 60, it is not fixed in mounting area 50 before laser irradiation or hot air supply to the solder paste 60. Therefore, as... Figure 16 As shown, when the mounting area 50 is tilted relative to the horizontal plane, the component 2 may shift in position relative to the mounting area 50 due to gravity.

[0069] For example, such as Figure 13 As shown, after component 2A is installed in mounting area 50A, when component 2B is installed in mounting area 50B, mounting area 50A is tilted relative to the horizontal plane. With mounting area 50A tilted relative to the horizontal plane, component 2A may shift position due to gravity.

[0070] When calculating the position offset ΔD of component 2, after component 2 is mounted in the mounting area 50 using solder paste 60, and before irradiating the solder paste 60 with a laser or supplying hot air, component 2 is photographed by camera 25. The position offset calculation unit 36 ​​can calculate the position offset ΔD of component 2 based on the image data of component 2 captured by camera 25.

[0071] The allowable angle acquisition unit 37 acquires an allowable angle θ, which represents the maximum value of the tilt angle of component 2 at which the positional offset ΔD of the installed component 2 is suppressed to below a predetermined amount. The tilt angle of component 2 is equal to the tilt angle of the mounting area 50 on which component 2 is mounted. Both the tilt angle of component 2 and the tilt angle of the mounting area 50 are tilt angles relative to the horizontal plane. The predetermined amount is a value close to zero. In this embodiment, the allowable angle θ is the maximum value of the tilt angle at which component 2 does not substantially experience positional offset.

[0072] like Figure 16 As shown, when the position offset calculation unit 36 ​​calculates the position offset ΔD, the worktable control unit 32 tilts the mounting area 50 to an arbitrary tilt angle. The worktable control unit 32 gradually increases the tilt angle of the mounting area 50 relative to the horizontal plane from 0 degrees. The camera 25 captures images of the component 2 mounted on the mounting area 50 with the gradually increasing tilt angle. Based on the image data of the component 2 mounted on the mounting area 50 with the gradually increasing tilt angle, the position offset calculation unit 36 ​​can calculate the maximum tilt angle of the component 2 where the position offset ΔD is below a predetermined value. In this embodiment, the position offset calculation unit 36 ​​can calculate the maximum tilt angle of the component 2 where the component 2 does not substantially undergo position offset, based on the image data of the component 2.

[0073] The allowable angle acquisition unit 37 acquires the maximum value of the tilt angle of the component 2 when the position offset ΔD calculated by the position offset calculation unit 36 ​​is below a predetermined amount, and takes this value as the allowable angle θ. The position offset calculation unit 36 ​​calculates the allowable angle θ for each of the plurality of components 2 mounted on the substrate 1. The allowable angle acquisition unit 37 acquires the allowable angle θ for each of the plurality of components 2 mounted on the substrate 1. The allowable angle θ acquired by the allowable angle acquisition unit 37 is stored in the allowable angle storage unit 41.

[0074] [Installation Order] The mounting sequence determination unit 38 determines the mounting sequence of component 2 relative to the plurality of mounting areas 50 set on the surface of the substrate 1, so that component 2 mounted after mounting on the substrate 1 is at an allowable angle θ or less. The worktable control unit 32 controls the worktable 20 to sequentially make the plurality of mounting areas 50 horizontal in accordance with the mounting sequence determined by the mounting sequence determination unit 38. The substrate 1 is rotated to make the plurality of mounting areas 50 horizontal in accordance with the mounting sequence. The head control unit 33 controls the mounting head 24 to sequentially mount component 2 to the horizontal mounting areas 50 in accordance with the mounting sequence determined by the mounting sequence determination unit 38. Component 2 is sequentially mounted to the horizontal mounting areas 50 in accordance with the mounting sequence.

[0075] Figure 17 as well as Figure 18 These are diagrams illustrating the installation sequence of component 2 in the embodiment. Figure 17 as well as Figure 18 In the example shown, the allowable angle θa of component 2A is less than the allowable angle θb of component 2B. Figure 17 This example illustrates how component 2B is installed in mounting area 50B after component 2A is installed in mounting area 50A. Figure 18 This indicates an example where component 2B is installed in mounting area 50B, and then component 2A is installed in mounting area 50A.

[0076] like Figure 17 As shown in (A), when component 2A is installed in mounting area 50A, the worktable control unit 32 controls the worktable 20 to make mounting area 50A horizontal. Figure 17 As shown in (B), when component 2B is installed in mounting area 50B after component 2A is installed in mounting area 50A, the worktable control unit 32 controls the worktable 20 to make mounting area 50B horizontal. Since the allowable angle θa of component 2A is small, when mounting area 50A is tilted relative to the horizontal plane, the possibility of component 2A shifting position due to gravity is relatively high.

[0077] like Figure 18 As shown in (A), when component 2B is installed in mounting area 50B, the worktable control unit 32 controls the worktable 20 to make mounting area 50B horizontal. Figure 18 As shown in (B), when component 2A is installed in mounting area 50A after component 2B is installed in mounting area 50B, the table control unit 32 controls the table 20 to make mounting area 50A horizontal. Because the allowable angle θb of component 2B is large, the possibility of component 2B shifting position is low even if mounting area 50B is tilted relative to the horizontal plane.

[0078] like Figure 18 As shown, by installing component 2B with a larger allowable angle θb after installing component 2B with a smaller allowable angle θa, the positional offset of components 2A and 2B can be suppressed. The installation sequence determination unit 38 determines the installation sequence of components 2 relative to each of the plurality of installation areas 50, so that components 2 with a smaller allowable angle θa are installed after components 2 with a larger allowable angle θa are installed. The installation sequence determination unit 38 determines the installation sequence so that the installed component 2 will not exceed the allowable angle θa during the subsequent installation of components 2.

[0079] The installation order of component 2, determined by the installation order determination unit 38, is stored in the installation order storage unit 42. By installing component 2 according to the installation order, positional deviation of component 2 can be suppressed.

[0080] [Handling components whose positional offset has not been eliminated] Due to factors such as the weight and size of component 2, and the shape of the substrate 1, there may be component 2 that, even with adjustments to the installation sequence, does not fall below the permissible angle θ during installation. In other words, there may be component 2 whose positional offset is not eliminated even with adjustments to the installation sequence.

[0081] In the following description, the component 2 whose positional offset is eliminated by adjusting the installation sequence is appropriately referred to as "permitted component", and the component 2 whose positional offset is not eliminated even if the installation sequence is adjusted is appropriately referred to as "non-permitted component".

[0082] Figure 19 as well as Figure 20 These are figures illustrating component 2, where the positional offset in the embodiment has not been eliminated. Figure 19 as well as Figure 20 In the example shown, the mounting regions 50 defined on the surface of substrate 1 include mounting regions 50D, 50E, and 50F. Solder paste 60 is applied to each of the mounting regions 50. Component 2 includes: component 2D mounted in mounting region 50D; component 2E mounted in mounting region 50E; and component 2F mounted in mounting region 50F. Component 2F has a large allowable angle θf. Component 2D has a small allowable angle θd, and component 2E has a small allowable angle θe. Component 2F is a permitted component. Components 2D and 2E are non-permitted components. Figure 19 This example shows how component 2E is installed in mounting area 50E after component 2D is installed in mounting area 50D. Figure 20 This is an example of installing component 2E in mounting area 50E and then installing component 2D in mounting area 50D. Component 2F has already been installed in mounting area 50F.

[0083] like Figure 19As shown in (A), when component 2D is mounted in mounting area 50D, the table control unit 32 controls the table 20 to make mounting area 50D horizontal. Figure 19 As shown in (B), when component 2D is installed in mounting area 50D and then component 2E is installed in mounting area 50E, the table control unit 32 controls the table 20 to make mounting area 50E horizontal. Since the allowable angle θd of component 2D is small, when mounting area 50D is tilted relative to the horizontal plane, the position of component 2D is likely to shift due to gravity.

[0084] like Figure 20 As shown in (A), when component 2E is installed in mounting area 50E, the worktable control unit 32 controls the worktable 20 to make mounting area 50E horizontal. Figure 20 As shown in (B), when mounting area 50D is mounted on component 2D after component 2E is mounted on mounting area 50E, the worktable control unit 32 controls the worktable 20 to make mounting area 50D horizontal. Since the allowable angle θe of component 2E is small, when mounting area 50E is tilted relative to the horizontal plane, the possibility of component 2E shifting position due to gravity is high.

[0085] That is, when component 2D is installed in mounting area 50D and then component 2E is installed in mounting area 50E, component 2D may not be below the allowable angle θd during installation of component 2E, resulting in a positional shift of component 2D. Similarly, when component 2E is installed in mounting area 50E and then component 2D is installed in mounting area 50D, component 2E may not be below the allowable angle θe during installation of component 2D, resulting in a positional shift of component 2E. In other words, the installation sequence in which component 2D (the first component) is installed in mounting area 50D (the first mounting area) and then component 2E (the second component) is installed in a way that makes component 2D (the first component) below the allowable angle θd is sometimes impossible. Reversing the installation sequence, the installation sequence in which component 2E (the first component) is installed in mounting area 50E (the first mounting area) and then component 2D (the second component) is installed in a way that makes component 2E (the first component) below the allowable angle θe is sometimes impossible.

[0086] Existence occurs Figure 19 as well as Figure 20In the case described, where component 2D is installed in mounting region 50D but does not reach an angle θd or less when component 2E is installed, even if the installation order is reversed, component 2E does not reach an angle θe or less when component 2D is installed after component 2E is installed in mounting region 50E. In this case, the heating control unit 35 controls the heating head 13 to heat the solder paste 60 in mounting region 50D during component 2D installation. After heating the solder paste 60 in mounting region 50D and then cooling it, component 2D is fixed to the substrate 1 by means of the solder paste 60. Component 2D is fixed to the substrate 1 before tilting the substrate 1 for component 2E installation. In the case of reversed installation order, the heating control unit 35 controls the heating head 13 to heat the solder paste 60 in mounting region 50E during component 2E installation. The component 2E is fixed to the substrate 1 by means of the solder paste 60 after cooling the heated mounting area 50E. The component 2E is fixed to the substrate 1 before the substrate 1 is tilted for mounting component 2D.

[0087] Figure 21 as well as Figure 22 These figures illustrate the operation of the three-dimensional mounting device 10 when there is a component 2 whose positional offset in the implementation method has not been eliminated.

[0088] like Figure 21 As shown, when component 2D is mounted in mounting area 50D, the worktable control unit 32 controls the worktable 20 to make mounting area 50D horizontal. When component 2D is mounted in mounting area 50D while maintaining the horizontal state of mounting area 50D, hot air is supplied to the solder paste 60 in mounting area 50D.

[0089] like Figure 21 As shown in (A), during the mounting of component 2D relative to mounting region 50D, mounting head 24 brings nozzle 23 holding component 2D close to mounting region 50D. Mounting head 24 lowers nozzle 23 holding component 2D so that component 2D approaches mounting region 50D. In this embodiment, heating control unit 35 synchronously brings heating head 13 close to mounting region 50D with nozzle 23 (component 2D) approaching mounting region 50D. Heating control unit 35 synchronously lowers heating head 13 with nozzle 23 holding component 2D so that the nozzle of hot air nozzle 13B approaches the solder paste 60 in mounting region 50D.

[0090] like Figure 21As shown in (B), with component 2D pressed against the solder paste 60 in mounting region 50D by mounting head 24, hot air is supplied from heating head 13 to the solder paste 60 in mounting region 50D. By cooling the solder paste 60 molten by hot air, component 2D is fixed in mounting region 50D. After component 2D is fixed in mounting region 50D, nozzle 23 of mounting head 24 moves away from mounting region 50D. After component 2D is fixed in mounting region 50D, nozzle 23 of mounting head 24 rises and leaves component 2D. Heating control unit 35 moves heating head 13 away from mounting region 50D in sync with the departure of nozzle 23. The rising of heating head 13 and nozzle 23 is synchronized in a manner that causes them to leave substrate 1.

[0091] like Figure 22 As shown, after fixing component 2D to mounting area 50D, component 2E is installed in mounting area 50E. With component 2E installed in mounting area 50E, the worktable control unit 32 controls the worktable 20 to make mounting area 50E horizontal. Since mounting area 50E is horizontal, mounting area 50D is tilted relative to the horizontal plane. Because component 2D is fixed to mounting area 50D by means of solder paste 60, even if the tilt angle of mounting area 50D exceeds the allowable angle θd, positional displacement of component 2D can be suppressed. When component 2E is installed in mounting area 50E while maintaining the horizontal state of mounting area 50E, hot air is supplied to the solder paste 60 in mounting area 50E.

[0092] like Figure 22 As shown in (A), during the installation of component 2E relative to mounting region 50E, mounting head 24 brings nozzle 23, which holds component 2E, closer to mounting region 50E. Heating control unit 35 synchronously brings heating head 13 closer to mounting region 50E in conjunction with the approach of nozzle 23 (component 2E) to mounting region 50E. Figure 22 As shown in (B), hot air is supplied from the heating head 13 to the solder paste 60 in the mounting area 50E while the component 2E is pressed against the solder paste 60 in the mounting area 50E by the mounting head 24. By cooling the solder paste 60 molten by the hot air, the component 2E is fixed in the mounting area 50E. After the component 2E is fixed in the mounting area 50E, the nozzle 23 of the mounting head 24 moves away from the mounting area 50E. The heating control unit 35 moves the heating head 13 away from the mounting area 50E in sync with the movement of the nozzle 23 away from the mounting area 50E.

[0093] By heating the paste solder 60 using the heating head 13, component 2 can be brazed onto substrate 1, or temporarily fixed. Temporary fixing refers to a state where component 2 is fixed onto substrate 1 by flux solidification even though the solder has not melted. When component 2 is temporarily fixed onto substrate 1 using hot air from heating head 13, laser light is irradiated onto paste solder 60 from laser head 12 to braze component 2 onto substrate 1. By irradiating paste solder 60 with laser light, the solder melts and solidifies, brazing component 2 onto substrate 1. That is, when an unauthorized component is temporarily fixed onto substrate 1 using paste solder 60 with heating head 13, laser control unit 34 controls laser head 12 to irradiate the paste solder 60 heated by heating head 13 with laser light to braze the unauthorized component.

[0094] [Methods for determining the installation order] Figure 23 This is a flowchart illustrating the method for determining the installation order of component 2 in the embodiment. When determining the installation order, a test substrate 1 and test component 2 are used.

[0095] The worktable control unit 32 controls the worktable 20 to make the plurality of mounting areas 50 sequentially horizontal. The distributor control unit 31 controls the distributor 11 to apply solder paste 60 to each of the plurality of mounting areas 50 on the substrate 1 (step SA1).

[0096] The head control unit 33 controls the mounting head 24 to mount the component 2 in the horizontal mounting area 50 (step SA2).

[0097] The position offset calculation unit 36 ​​causes the camera 25 to capture the component 2 in the mounting area 50 (step SA3).

[0098] The position offset calculation unit 36 ​​calculates the position offset ΔD of each component 2 based on the image data of component 2 captured in step SA3 (step SA4). It then determines whether the position offset ΔD calculated by the position offset calculation unit 36 ​​is below a predetermined amount (step SA5).

[0099] In step SA5, if it is determined that the position offset ΔD is below a specified amount ("Yes" in step SA5), the worktable control unit 32 increases the tilt angle of the mounting area 50 and repeatedly performs the image capture by the position offset calculation unit 36 ​​and the calculation of the position offset ΔD (step SA6).

[0100] In step SA5, if it is determined that the position offset ΔD exceeds the specified amount (in step SA5, it is "No"), the position offset calculation unit 36 ​​stores the tilt angle before the position offset ΔD exceeds the specified amount as the allowable angle θ of the tilt angle of the component 2 in the allowable angle storage unit 41 (step SA7).

[0101] The process from step SA3 to step SA7 is performed on each component 2 mounted on the substrate 1. If it is the same component 2, the allowable angle θ stored in the allowable angle storage unit 41 can also be applied to other substrates 1.

[0102] The installation sequence determination unit 38 determines the installation sequence of the components 2 relative to the multiple installation areas 50 based on the allowable angle θ of each component 2.

[0103] The installation sequence determination unit 38, for example, makes a temporary determination of the installation sequence based on the optimal installation sequence of the conventional planar substrate (step SA8).

[0104] The installation sequence determination unit 38 checks whether each component 2 becomes an allowed component or a non-allowed component when installed in the installation sequence (step SA9).

[0105] The installation sequence determination unit 38 moves the installation sequence of non-permitted components backward and checks whether each component 2 becomes a permitted component or a non-permitted component (step SA10).

[0106] The installation sequence determination unit 38 repeatedly changes and checks the installation sequence until the identification of permitted and non-permitted parts remains unchanged (step SA11).

[0107] The installation sequence determination unit 38 stores the installation sequence and the identification of permitted and non-permitted components under that sequence in the installation sequence storage unit 42 (step SA12).

[0108] By doing so, the installation sequence of component 2, which has a small allowable angle θ and is prone to positional displacement, is placed later, making it less susceptible to the influence of the tilt of the substrate 1 during the installation of other components 2. Therefore, by increasing the number of allowable components and reducing the number of non-allowable components, continuous installation can be performed, and the installation cycle time can be shortened.

[0109] [Installation Method] Figure 24 This is a flowchart illustrating the installation method of component 2 in the embodiment.

[0110] The distributor control unit 31 controls the distributor 11 to apply solder paste 60 to each of the plurality of mounting areas 50 on the substrate 1 (step SB1).

[0111] The workbench control unit 32 controls the workbench 20 to sequentially align the multiple mounting areas 50 into a horizontal state according to the mounting sequence stored in the mounting sequence storage unit 42. The head control unit 33 controls the mounting head 24 to sequentially mount the component 2 into the horizontal mounting areas 50 according to the mounting sequence stored in the mounting sequence storage unit 42, thereby mounting the permitted component (step SB2).

[0112] The head control unit 33 determines whether there is an unauthorized component (step SB3).

[0113] If it is determined in step SB3 that an unauthorized component exists (in step SB3, it is "yes"), the head control unit 33 installs the unauthorized component in the mounting area 50 (step SB4).

[0114] For reference Figure 21 as well as Figure 22 As explained, after the non-permitted component is installed in the mounting area 50, the heating control unit 35 controls the heating head 13 to supply hot air to the paste solder 60 of the non-permitted component while maintaining the horizontal state of the mounting area 50 (step SB5).

[0115] The head control unit 33 determines whether the installation of all non-permitted components is complete (step SB6).

[0116] If it is determined in step SB6 that the installation of the non-permitted component has not been completed (step SB6 is "No"), return to step SB4 for processing.

[0117] When it is determined in step SB6 that the installation of the non-permitted component is complete (step SB6 is "Yes"), the laser control unit 34 controls the laser head 12 to irradiate the non-permitted component and the respective solder paste 60 of the permitted component with laser (step SB7).

[0118] The laser control unit 34 controls the laser head 12 to sequentially irradiate the solder paste 60 of each of the plurality of components 2 with laser. Similarly, when it is determined in step SB3 that there are no unauthorized components (step SB3 is "No"), the laser control unit 34 controls the laser head 12 to irradiate the solder paste 60 of each of the plurality of components 2 (authorized components) with laser (step SB7).

[0119] By making the laser brazing sequence the reverse of the component installation sequence, it is possible to prevent the components from tilting above the installation angle before brazing.

[0120] [Effect] As explained above, according to the embodiment, the installation order of component 2 is determined based on the allowable angle θ of component 2. The installation order of component 2 is determined in such a way that the installed component 2 is below the allowable angle θ, thus suppressing positional deviation of component 2.

[0121] The three-dimensional mounting device 10 is designed to achieve optimal cycle time during continuous adsorption and mounting of components 2, thereby improving production efficiency. According to the present invention, by identifying permitted and non-permitted components, permitted components can be mounted by continuous adsorption and mounting as in the past, and even in three-dimensional mounting where the substrate 1 is tilted while mounting, the reduction in cycle time can be minimized.

[0122] When the first component 2 has been installed in the first mounting area 50 and it is impossible to install the second component 2 in a sequence where the first component 2 is positioned at an angle below the allowable angle θ, the heating head 13 is controlled to heat the solder paste 60 in the first mounting area 50 during the installation of the first component 2. Since the first component 2 is fixed to the substrate 1 by means of the solder paste 60 using the heating head 13, positional displacement of the first component 2 can be suppressed even if the substrate 1 is tilted for the installation of the second component 2.

[0123] With the component 2 pressed into the mounting area 50 by the mounting head 24, the solder paste 60 in the mounting area 50 is heated by the heating head 13. Since the component 2 is pressed into the mounting area 50 by the mounting head 24, the solder paste 60 is fixed by the heating head 13 while suppressing the positional displacement of the component 2.

[0124] [Other Implementation Methods] Figure 25 This diagram schematically illustrates the allowable angle storage unit 41 of the embodiment. In the above embodiment, the allowable angle θ is calculated based on image data of the component 2 captured by the camera 25. The allowable angle θ of the component 2 can also be measured using a measuring device different from the three-dimensional mounting device 10. Figure 25 As shown, the data (allowable angle table) related to component 2 and the allowable angle θ, measured by another measuring device, can be stored in the allowable angle storage unit 41. The allowable angle acquisition unit 37 can acquire the allowable angle θ of component 2 from the allowable angle storage unit 41.

[0125] Figure 26 This is a schematic diagram illustrating the controller 16 of an implementation method. (As shown) Figure 26As shown, the controller 16 may also have an allowable angle calculation unit 39, which calculates the allowable angle θ of component 2 based on the weight of component 2. The allowable angle acquisition unit 37 can acquire the allowable angle θ from the allowable angle calculation unit 39. The weight of component 2 is related to the allowable angle θ. The greater the weight of component 2, the smaller the allowable angle θ. Furthermore, the allowable angle calculation unit 39 can calculate the allowable angle θ by considering not only the weight of component 2 but also the volume of component 2 and the properties of the solder paste 60. By considering not only the weight of component 2 but also the volume of component 2 and the properties of the solder paste 60, the calculation accuracy of the allowable angle θ can be improved.

[0126] Figure 27 This diagram illustrates the relationship between the solder paste 60 and the heating head 13 according to the embodiment. As described above, the heating head 13 includes a heating section 13A and a hot air nozzle 13B with a spray port 13C. The heating control unit 35 can also change the size of the spray port 13C based on the volume of the solder paste 60. As described above, the hot air nozzle 13B installed on the heating section 13A is replaceable. Multiple hot air nozzles 13B with different spray port 13C sizes are stored in the nozzle storage unit 14. The heating control unit 35 can change the size of the spray port 13C by replacing the hot air nozzle 13B installed on the heating section 13A based on the volume of the solder paste 60. For example, the heating control unit 35 can increase the opening area (nozzle diameter) of the spray port 13C as the volume of a solder paste 60 increases.

[0127] The heating control unit 35 can also adjust the flow rate of hot air ejected from the nozzle 13C of the hot air nozzle 13B based on the volume of the solder paste 60. For example, the heating control unit 35 can increase the flow rate of hot air ejected from the nozzle 13C as the volume of the solder paste 60 increases.

[0128] The heating control unit 35 can also adjust the temperature of the hot air ejected from the nozzle 13C of the hot air nozzle 13B based on the melting temperature of the solder paste 60. The heating control unit 35 can adjust the relative position of the nozzle 13C and the solder paste 60 so that the hot air ejected from the nozzle 13C does not directly contact the component 2 or the substrate 1.

[0129] In the above embodiment, the heating head 13 uses hot air to heat the paste solder 60. The heating head 13 can also heat the paste solder 60 by irradiating it with halogen light or infrared light, for example. The heating head 13 only needs to heat the paste solder 60 in a manner that does not contact it. Explanation of reference numerals in the attached figures:

[0130] 1: Substrate; 1A: Substrate; 1B: Thin film; 2: Component; 2A: Component; 2B: Component; 2C: Component; 2D: Component; 2E: Component; 2F: Component; 3: Pallet; 4: Support component; 4A: Base part; 4B: Guide part; 4C: Pin part; 4D: Hole; 5: Clamping mechanism; 5A: Support part; 5B: Movable part; 10: Three-dimensional mounting device; 11: Distributor; 12: Laser head; 13: Heating head; 13A: Heating part; 13B: Hot air nozzle; 13C: Jet nozzle; 14: Nozzle storage; 16: Controller; 16A: Processor; 16B: Main memory; 16C: Memory; 16D: Interface; 18: Base component; 19: Conveying device; 19A: Conveyor belt; 19B: Guide component; 20: Worktable; 20A: Positioning component; 21: Tool 22: Table moving device; 23: Component supply device; 23: Nozzle; 23A: Axis; 24: Mounting head; 25: Camera; 27: Head moving device; 27X: X-axis moving device; 27Y: Y-axis moving device; 28: Nozzle moving device; 29: Chamber; 31: Distributor control unit; 32: Table control unit; 33: Head control unit; 34: Laser control unit; 35: Heating control unit; 36: Position offset calculation unit; 37: Allowable angle acquisition unit; 38: Installation sequence determination unit; 39: Allowable angle calculation unit; 41: Allowable angle storage unit; 42: Installation sequence storage unit; 50: Installation area; 50A: Installation area; 50B: Installation area; 50C: Installation area; 50D: Installation area; 50E: Installation area; 50F: Installation area; 60: Solder paste.

Claims

1. A three-dimensional mounting apparatus characterized by comprising: a stage that supports a three-dimensional substrate having a surface on which a mounting region to which a paste solder is applied is set; a mounting head that mounts a component on the mounting region; a heating head that heats the paste solder; and a controller, the controller having: an allowable angle acquisition section that acquires an allowable angle that indicates a maximum value of a tilt angle of a component whose positional displacement after mounting is suppressed to be equal to or smaller than a prescribed amount; a mounting order decision section that decides a mounting order of a component with respect to a plurality of the mounting regions so that the component after mounting becomes equal to or smaller than the allowable angle; a stage control section that controls the stage so that the plurality of the mounting regions become horizontal in order according to the mounting order; a head control section that controls the mounting head so that the component is mounted on the mounting region that is horizontal in order according to the mounting order; and a heating control section that controls the heating head so that, in a case where a mounting order in which the component after mounting becomes equal to or smaller than the allowable angle is not possible after a first component is mounted on a first mounting region and when a second component is mounted, the paste solder of the first mounting region is heated in the mounting of the first component.

2. The three-dimensional mounting apparatus according to claim 1, characterized in that the heating control section controls the heating head so that the paste solder of the first mounting region is heated in a state where the first component is pressed on the first mounting region by the mounting head.

3. The three-dimensional mounting apparatus according to claim 1, characterized in that the mounting head has a nozzle that holds the first component, the nozzle that holds the first component is brought close to the first mounting region in the mounting of the first component, the heating control section brings the heating head close to the first mounting region in synchronization with the approach of the nozzle to the first mounting region.

4. The three-dimensional mounting apparatus according to claim 3, characterized in that the nozzle moves away from the first mounting region after the first component is fixed on the first mounting region, the heating control section moves the heating head away from the first mounting region in synchronization with the departure of the nozzle from the first mounting region.

5. The three-dimensional mounting apparatus according to claim 1, characterized in that the heating head supplies a hot air to the paste solder to heat the paste solder.

6. The three-dimensional mounting apparatus according to claim 5, characterized in that the heating control section changes a flow rate of the hot air based on a volume of the paste solder.

7. The three-dimensional mounting apparatus according to claim 5, characterized in that the heating head has a hot air nozzle that has a spouting port that spouts the hot air, the heating control section changes a size of the spouting port based on the volume of the paste solder.

8. The three-dimensional mounting apparatus according to claim 7, characterized in that the heating head has a heating section that heats air to generate the hot air, the hot air nozzle is detachable with respect to the heating section, ​ ​ ​ The three-dimensional mounting device has a nozzle reservoir that accommodates a plurality of hot-air nozzles having different sizes of the ejection port, The heating control section changes the size of the ejection port by replacing the hot-air nozzle attached to the heating section.

9. The three-dimensional mounting device according to claim 1, wherein The controller has a position offset amount calculation section that calculates a position offset amount of the mounted component based on image data of the mounted component, The allowable angle acquisition section acquires, as the allowable angle, a maximum value of the tilt angle of the component for which the position offset amount calculated by the position offset amount calculation section is equal to or less than the prescribed amount.

10. The three-dimensional mounting device according to claim 1, wherein The controller has an allowable angle storage section that stores data relating to the component and the allowable angle, The allowable angle acquisition section acquires the allowable angle from the allowable angle storage section.

11. The three-dimensional mounting device according to claim 1, wherein The controller has an allowable angle calculation section that calculates the allowable angle based on the weight of the component, The allowable angle acquisition section acquires the allowable angle from the allowable angle calculation section.

12. The three-dimensional mounting device according to claim 1, wherein The mounting order determination section determines the mounting order so that the mounted component does not exceed the allowable angle at the time of mounting of a later component.

13. The three-dimensional mounting device according to claim 1, wherein The three-dimensional mounting device has a laser head that irradiates the paste-like solder with laser light after mounting of a component to the mounting region, The controller has a laser control section, The laser control section controls the laser head to irradiate the paste-like solder heated by the heating head with laser light to perform soldering of the first component.

14. A three-dimensional mounting method, comprising: acquiring an allowable angle that indicates a maximum value of a tilt angle of a component for which a position offset amount after mounting to a mounting region provided on a surface of a three-dimensional substrate and coated with a paste-like solder is suppressed to be equal to or less than a prescribed amount; determining a mounting order of a component with respect to a plurality of the mounting regions so that the mounted component becomes equal to or less than the allowable angle; rotating the three-dimensional substrate so that the plurality of the mounting regions become horizontal in the mounting order; mounting components to the mounting regions in the horizontal state in the mounting order; and when it is not possible to achieve a mounting order in which the first component becomes equal to or less than the allowable angle after mounting of the first component to a first mounting region and at the time of mounting of a second component, heating the paste-like solder of the first mounting region in the mounting of the first component. ​

Images