A high-barrier aluminum-plated composite film for integrated circuit packaging and its preparation method

Abstract

This application discloses a high-barrier aluminized composite film for integrated circuit packaging and its preparation method, belonging to the field of metal coating. The high-barrier aluminized composite film for integrated circuit packaging includes a first aluminized PET layer, a first adhesive layer, a second aluminized PET layer, a second adhesive layer, a BOPA layer, a third adhesive layer, and a PE layer arranged sequentially. The aluminized surfaces of the first and second aluminized PET layers are bonded together by the first adhesive layer, which is formed by curing a polyurethane-acrylate base agent and a curing agent. This application has the advantage of obtaining an aluminized composite film with good oxygen and moisture barrier properties and mechanical properties.

Description

Technical Field

[0001] This application relates to the field of metal coating, and in particular to a high-barrier aluminum-coated composite film for integrated circuit packaging and its preparation method. Background Technology

[0002] Due to the high precision and high integration of integrated circuits, integrated circuits need to be packaged and protected during the transfer or transportation of integrated circuit products and components. Therefore, the packaging materials for integrated circuits need to combine electrostatic protection, moisture protection, printability, and cushioning functions.

[0003] Based on the aforementioned functional requirements, traditional integrated circuit packaging materials generally employ a PET / aluminum foil / PE composite structure. PET material possesses excellent mechanical properties, such as high impact strength and bending resistance, and is also printable. Aluminum foil has high density, excellent oxygen and moisture barrier properties, and provides good antistatic properties. PE provides heat-sealing capability, enabling the packaging to be heat-sealed into bags.

[0004] While the packaging materials described above can meet the packaging requirements of integrated circuits, the high cost of aluminum foil limits its application to high-value, highly sensitive integrated circuit devices. Some manufacturers have attempted to replace aluminum foil with relatively inexpensive aluminized films, but their oxygen and moisture barrier properties are not ideal and require further improvement. Summary of the Invention

[0005] In order to obtain an aluminized composite film with good oxygen and moisture barrier properties and mechanical properties, this application provides a high-barrier aluminized composite film for integrated circuit packaging and its preparation method.

[0006] Firstly, the high-barrier aluminized composite film for integrated circuit packaging provided in this application adopts the following technical solution:

[0007] A high-barrier aluminized composite film for integrated circuit packaging includes, from top to bottom, a first aluminized PET layer, a first adhesive layer, a second aluminized PET layer, a second adhesive layer, a BOPA layer, a third adhesive layer, and a PE layer. The aluminized surfaces of the first and second aluminized PET layers are bonded together by the first adhesive layer. The first adhesive layer is formed by curing a polyurethane-acrylate base agent and a curing agent. The polyurethane-acrylate base agent is prepared from the following raw materials in parts by weight:

[0008] 20-30 parts of polyether polyol;

[0009] 5-8 parts of modified diol;

[0010] 15-25 parts of diisocyanate;

[0011] Chain extender 1-3 parts;

[0012] 1-2 parts of hydroxyacrylate monomer;

[0013] 70-90 parts of diluent;

[0014] The modified diol is prepared by dipropylene glycol ether, second diisocyanate and diethanolamine.

[0015] Metallized PET layers offer excellent mechanical strength, rigidity, electrostatic shielding, and a printable surface, protecting the internal structure. To enhance the moisture and oxygen barrier properties of the metallized PET layer, two metallized PET layers are laminated together, with the metallized surfaces adhered to each other, providing a double barrier effect. However, the interfacial properties of traditional polyurethane adhesives are incompatible, especially when the two aluminum layers are directly bonded by the adhesive, leading to aluminum layer migration and subsequent localized detachment, affecting oxygen and moisture barrier properties as well as mechanical properties.

[0016] Based on this, by adopting the above technical solution, this application uses polyurethane-acrylate as the adhesive layer to achieve aluminum layer composite of two aluminum-plated PET layers. The modified diol can introduce side chains into the polyurethane chain segments, and the urethane chain segments with dipropylene glycol ether structure have appropriate flexibility. While ensuring the degree of crosslinking of the adhesive layer, it disperses stress, improves the interfacial compatibility between the adhesive layer and the aluminum layer, inhibits aluminum layer migration, maintains the integrity of the double aluminum layer structure, and improves the oxygen and moisture barrier performance of the composite film. In addition, the introduction of hydroxyl acrylate plays a moderate crosslinking role, which can enhance the cohesive strength, inhibit the degree of shrinkage after curing, ensure the structural stability of the composite film, and improve the mechanical properties of the composite film.

[0017] The BOPA layer improves the overall puncture resistance, impact resistance, and oxygen barrier properties of the composite film; the PE layer can melt and seal when heated, ensuring airtightness when packaging integrated circuits.

[0018] Optionally, in the modified diol, the molar ratio of dipropylene glycol ether, second diisocyanate and diethanolamine is 1:1:(1~1.1).

[0019] Optionally, the dipropylene glycol ether includes one or more of dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, and dipropylene glycol monobutyl ether.

[0020] By adopting the above technical solution, the ether segment structure of dipropylene glycol ether can reduce the curing shrinkage of the adhesive layer, thereby improving the interfacial compatibility between the adhesive layer and the aluminum layer, effectively avoiding aluminum layer migration or local detachment caused by stress concentration, and improving the water vapor and oxygen barrier performance.

[0021] Optionally, the first diisocyanate and the second diisocyanate each independently comprise one or more of diphenylmethane diisocyanate, toluene diisocyanate, dicyclohexylmethane diisocyanate, hexamethylene diisocyanate, and isophorone diisocyanate.

[0022] By adopting the above technical solution, diisocyanate, as the hard segment of the polyurethane adhesive layer, plays a reinforcing role in the adhesive layer.

[0023] Optionally, the second diisocyanate is prepared by compounding toluene diisocyanate and hexamethylene diisocyanate in a mass ratio of 1:(6.5~8).

[0024] By adopting the above technical solution, the flexibility of the side chains is adjusted by combining the aromatic diisocyanate and the aliphatic diisocyanate, thereby further improving the overall mechanical strength of the aluminized composite film.

[0025] Optionally, the aluminum layer thickness of the first aluminized PET layer and the second aluminized PET layer are each independently 400-700 angstroms.

[0026] By adopting the above technical solution, the thickness of the aluminum layer can be controlled, thus reducing the cost of aluminum consumption while ensuring oxygen and moisture barrier performance.

[0027] Optionally, the polyether polyol includes one or both of polyethylene glycol and polypropylene glycol.

[0028] Optionally, the mass ratio of the polyurethane-acrylate main agent to the curing agent is 1:(0.05~0.1).

[0029] Optionally, the hydroxyacrylate monomer includes one or more of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, and hydroxypropyl methacrylate.

[0030] Optionally, the curing agent is an isocyanate curing agent.

[0031] Optionally, the diluent includes one or more of ethyl acetate, acetone, and isopropanol.

[0032] Optionally, the chain extender includes one or both of 1,4-butanediol and trimethylolpropane.

[0033] Optionally, the raw materials for preparing the polyurethane-acrylate main agent further include:

[0034] Initiator 0.01~0.1 parts;

[0035] Catalyst 0.005~0.02 parts.

[0036] Optionally, the initiator includes benzoyl peroxide.

[0037] Optionally, the catalyst includes an organotin catalyst.

[0038] Secondly, the method for preparing a high-barrier aluminum-plated composite film for integrated circuit packaging provided in this application adopts the following technical solution:

[0039] A method for preparing a high-barrier aluminum-plated composite film for integrated circuit packaging includes the following steps:

[0040] The polyether polyol is mixed with the modified diol, and a first diisocyanate is added to react. Then a chain extender is added to react, followed by the addition of a diluent, catalyst and hydroxy acrylate monomer to react, and then an initiator is added to react, thus obtaining the polyurethane-acrylate main agent.

[0041] Plasma treatment is performed on one side of the PET film, and the side after plasma treatment is called the plasma surface. Then, aluminum is deposited on the plasma surface to obtain an aluminum-coated PET film.

[0042] The polyurethane-acrylate main agent and curing agent are mixed and coated onto the aluminum-coated surface of the PET aluminum-coated film. Two PET aluminum-coated films are then bonded together with their aluminum-coated surfaces facing each other to form a first aluminum-coated PET layer, a first adhesive layer, and a second aluminum-coated PET layer.

[0043] By applying an adhesive, the second aluminized PET layer is bonded to the BOPA film to form the second adhesive layer and the BOPA layer.

[0044] By applying an adhesive, the BOPA layer and the PE film are bonded together to form a third adhesive layer and a PE layer, thus obtaining a high-barrier aluminum-coated composite film.

[0045] By adopting the above technical solution, plasma surface treatment can increase the active groups on the PET surface, thereby improving the adhesion between the aluminum layer and the PET film and enhancing the structural stability of the aluminum-coated PET layer.

[0046] Preferably, the steps for preparing the polyurethane-acrylate main agent are as follows: mixing polyether polyol with modified diol, heating to 75~85℃, adding diisocyanate and reacting for 1~1.5h, then cooling to 60~70℃, adding chain extender and reacting for 0.5~1h, then adding diluent, catalyst and hydroxy acrylate monomer and reacting for 0.5~1h, and then adding initiator and reacting for 1~1.5h to obtain the polyurethane-acrylate main agent.

[0047] Optionally, the method for preparing the modified diol includes the following steps:

[0048] The second diisocyanate was dispersed in a solvent, and dipropylene glycol ether was added to react. Then diethanolamine was added to react. After the reaction was completed, the solvent was removed to obtain the modified diol.

[0049] By adopting the above technical solution, the hydroxyl group of dipropylene glycol ether reacts with one of the isocyanate groups of the second diisocyanate, and the remaining isocyanate group of the second diisocyanate reacts with the amino group of diethanolamine to obtain a modified diol with side chain modification effect.

[0050] Preferably, the method for preparing the modified diol includes the following steps: dispersing the second diisocyanate in a solvent, heating to 50-60°C, adding dipropylene glycol ether and reacting for 1-1.5 h, then cooling to room temperature, adding diethanolamine and reacting for 1-1.5 h, and removing the solvent after the reaction is completed to obtain the modified diol.

[0051] Optionally, the working gas in the plasma treatment method is a combination of oxygen and argon, and the power of the plasma treatment is 5~8kW.

[0052] Optionally, the aluminum plating method is vacuum evaporation, with an aluminum plating speed of 300~600m / min and an aluminum wire feeding speed of 600~1200mm / min.

[0053] In summary, this application has the following beneficial effects:

[0054] 1. This application uses polyurethane-acrylate as an adhesive layer to achieve aluminum layer composite of two aluminized PET layers. The modified diol can introduce side chains into the polyurethane chain segments. The urethane chain segments with dipropylene glycol ether structure have appropriate flexibility, which can disperse stress while ensuring the degree of crosslinking of the adhesive layer, improve the interfacial compatibility between the adhesive layer and the aluminum layer, inhibit aluminum layer migration, maintain the integrity of the double aluminum layer structure, and improve the oxygen and moisture barrier performance of the composite film. In addition, the introduction of hydroxy acrylate plays a role in moderate crosslinking, which can enhance the cohesive strength, inhibit the degree of shrinkage after curing, ensure the structural stability of the composite film, and improve the mechanical properties of the composite film.

[0055] 2. The aluminized PET layer provides excellent mechanical strength, rigidity, electrostatic shielding, and a printable surface, protecting the internal structure; the BOPA layer improves the overall puncture resistance, impact resistance, and oxygen barrier properties of the composite film; the PE layer can melt and seal when heated, ensuring airtightness when packaging integrated circuits. Attached Figure Description

[0056] Figure 1 This is a schematic diagram of the layer structure of the high-barrier aluminum-coated composite film of this application.

[0057] Explanation of reference numerals in the attached figures:

[0058] 1. First aluminized PET layer; 2. First adhesive layer; 3. Second aluminized PET layer; 4. Second adhesive layer; 5. BOPA layer; 6. Third adhesive layer; 7. PE layer. Detailed Implementation

[0059] The following is in conjunction with the appendix Figure 1 This application will be described in further detail.

[0060] Preparation Example 1

[0061] The method for preparing modified diols includes the following steps:

[0062] Dipropylene glycol ether, second diisocyanate and diethanolamine are weighed in a molar ratio of 1:1:1, wherein the second diisocyanate is specifically hexamethylene diisocyanate and the dipropylene glycol ether is specifically dipropylene glycol monobutyl ether.

[0063] The second diisocyanate was dispersed in 8 times its volume of acetone, heated to 50°C, and dipropylene glycol ether was added and reacted for 1 hour. Then, the mixture was cooled to room temperature, and diethanolamine was added and reacted for 1.5 hours. After the reaction was completed, the acetone was removed by rotary evaporation to obtain the modified diol.

[0064] Preparation Example 2

[0065] The method for preparing modified diols includes the following steps:

[0066] Weigh out dipropylene glycol ether, second diisocyanate and diethanolamine in a molar ratio of 1:1:1.1, wherein the second diisocyanate is specifically hexamethylene diisocyanate and the dipropylene glycol ether is specifically dipropylene glycol monobutyl ether.

[0067] The second diisocyanate was dispersed in 8 times its volume of acetone, heated to 60°C, and dipropylene glycol ether was added and reacted for 1.5 h. Then, the mixture was cooled to room temperature, and diethanolamine was added and reacted for 1 h. After the reaction was completed, the acetone was removed by rotary evaporation to obtain the modified diol.

[0068] Preparation Example 3

[0069] The difference between this preparation example and Preparation Example 1 is that in the preparation method of the modified diol, the second diisocyanate is specifically toluene-2,4-diisocyanate.

[0070] Preparation Example 4

[0071] The difference between this preparation example and Preparation Example 1 is that in the preparation method of the modified diol, the second diisocyanate is specifically a compound of toluene-2,4-diisocyanate and hexamethylene diisocyanate in a mass ratio of 1:6.5.

[0072] Preparation Example 5

[0073] The difference between this preparation example and Preparation Example 1 is that in the preparation method of the modified diol, the second diisocyanate is specifically a compound of toluene-2,4-diisocyanate and hexamethylene diisocyanate in a mass ratio of 1:8.

[0074] Comparative Preparation Example 1

[0075] The method for preparing modified diols includes the following steps:

[0076] 2-hydroxyisobutyrate methyl ester, diisocyanate 2, and diethanolamine are weighed in a molar ratio of 1:1:1, wherein the diisocyanate 2 is specifically hexamethylene diisocyanate.

[0077] The second diisocyanate was dispersed in 8 times its volume of acetone, heated to 50°C, and methyl 2-hydroxyisobutyrate was added and reacted for 1 hour. Then, the mixture was cooled to room temperature, and diethanolamine was added and reacted for 1.5 hours. After the reaction was completed, the acetone was removed by rotary evaporation to obtain the modified diol.

[0078] Comparative Preparation Example 2

[0079] The method for preparing modified diols includes the following steps:

[0080] Weigh propylene glycol ether, second diisocyanate and diethanolamine in a molar ratio of 1:1:1, wherein the second diisocyanate is specifically hexamethylene diisocyanate and the propylene glycol ether is specifically propylene glycol monobutyl ether.

[0081] The second diisocyanate was dispersed in 8 times its volume of acetone, heated to 50°C, and propylene glycol ether was added and reacted for 1 hour. Then, the mixture was cooled to room temperature, and diethanolamine was added and reacted for 1.5 hours. After the reaction was completed, the acetone was removed by rotary evaporation to obtain the modified diol.

[0082] Example 1

[0083] like Figure 1 As shown, a high-barrier aluminized composite film for integrated circuit packaging includes a first aluminized PET layer 1, a first adhesive layer 2, a second aluminized PET layer 3, a second adhesive layer 4, BOPA 5, a third adhesive layer 6, and a PE layer 7 arranged sequentially. The aluminized surfaces of the first aluminized PET layer 1 and the second aluminized PET layer 3 are bonded together by the first adhesive layer 2.

[0084] A method for preparing a high-barrier aluminum-plated composite film for integrated circuit packaging includes the following steps:

[0085] S1. Weigh out 20 parts by weight of polyether polyol; 5 parts by weight of modified diol; 15 parts by weight of diisocyanate 1; 1 part by weight of chain extender; 1 part by weight of hydroxy acrylate monomer; 0.01 parts by weight of initiator; 0.005 parts by weight of catalyst; and 70 parts by weight of diluent.

[0086] Specifically, the polyether polyol is polyethylene glycol with a molecular weight of 400; the modified diol is prepared from Preparation Example 1; the first diisocyanate is 4,4'-diphenylmethane diisocyanate; the chain extender is 1,4-butanediol; the hydroxy acrylate monomer is hydroxyethyl methacrylate; the initiator is benzoyl peroxide; the catalyst is dibutyltin dilaurate; and the diluent is ethyl acetate.

[0087] Polyether polyol and modified diol were mixed, and the reaction system was protected by nitrogen gas. The mixture was heated to 75°C, and the first diisocyanate was added and reacted for 1.5 h. Then the temperature was lowered to 60°C, and the chain extender was added and reacted for 1 h. Then the diluent, catalyst and hydroxy acrylate monomer were added and reacted for 1 h. Finally, the initiator was added and reacted for 1.5 h to obtain the polyurethane-acrylate main agent.

[0088] S2. Take a 12μm thick PET film, perform plasma treatment on one side of the PET film, and then plate aluminum on the plasma side to obtain an aluminum-coated PET film; the working gas in the plasma treatment method is a combination of oxygen and argon at a flow ratio of 1:4, and the power of the plasma treatment is 5kW; the aluminum plating method is vacuum evaporation, the aluminum plating speed is 300m / min, the aluminum wire feeding speed is 600mm / min, and the thickness of the obtained aluminum layer is 700 angstroms.

[0089] S3. The polyurethane-acrylate base agent and the curing agent are mixed at a mass ratio of 1:0.05 to obtain the adhesive. The curing agent is Covestro L75 TDI trimer. The adhesive is then coated onto the aluminized surface of the PET aluminized film at a coating amount of 0.7 g / m². 2 The aluminized surfaces of two aluminized PET films are bonded together, dried and cured to form a first aluminized PET layer, a first adhesive layer and a second aluminized PET layer.

[0090] S4. Take a 10μm thick BOPA film, apply an adhesive to bond the second aluminized PET layer to the BOPA film, and dry and cure to form a second adhesive layer and a BOPA layer; the adhesive can be a commercially available traditional adhesive or the adhesive obtained in step S3. In this embodiment, the adhesive obtained in step S3 is used, and the coating amount is 0.8g / m. 2 .

[0091] S5. Take a PE film with a thickness of 30 μm, apply an adhesive to bond the BOPA layer to the PE film, dry and cure to form a third adhesive layer and a PE layer, and obtain a high-barrier aluminized composite film; wherein the adhesive can be a commercially available traditional adhesive or the adhesive obtained in step S3. In this embodiment, the adhesive obtained in step S3 is specifically used, and the coating amount is 0.8 g / m 2 .

[0092] Example 2

[0093] The difference between this embodiment and Embodiment 1 lies in the preparation method of the high-barrier aluminum-coated composite film, which includes the following steps:

[0094] S1. Weigh out the following components by weight: 30 parts polyether polyol; 8 parts modified diol; 25 parts diisocyanate; 3 parts chain extender; 2 parts hydroxy acrylate monomer; 0.1 parts initiator; 0.02 parts catalyst; and 90 parts diluent.

[0095] Specifically, the polyether polyol is polyethylene glycol with a molecular weight of 400; the modified diol is prepared from Preparation Example 2; the first diisocyanate is 4,4'-diphenylmethane diisocyanate; the chain extender is 1,4-butanediol; the hydroxy acrylate monomer is hydroxyethyl methacrylate; the initiator is benzoyl peroxide; the catalyst is dibutyltin dilaurate; and the diluent is ethyl acetate.

[0096] Polyether polyol and modified diol were mixed, and the reaction system was protected by nitrogen gas. The mixture was heated to 85°C, and a first diisocyanate was added and reacted for 1 hour. Then the temperature was lowered to 70°C, and a chain extender was added and reacted for 0.5 hours. Then a diluent, catalyst and hydroxy acrylate monomer were added and reacted for 0.5 hours. Finally, an initiator was added and reacted for 1 hour to obtain the polyurethane-acrylate main agent.

[0097] S2. Take a PET film with a thickness of 12μm, perform plasma treatment on one side of the PET film, and then perform aluminum plating on the plasma side to obtain an aluminum-plated PET film; the working gas in the plasma treatment method is a combination of oxygen and argon at a flow ratio of 1:4, and the power of the plasma treatment is 8kW; the aluminum plating method is vacuum evaporation, the aluminum plating speed is 600m / min, the aluminum wire feeding speed is 1200mm / min, and the thickness of the obtained aluminum layer is 400 angstroms.

[0098] S3. The polyurethane-acrylate base agent and the curing agent are mixed at a mass ratio of 1:0.1 to obtain an adhesive. The curing agent is specifically L75 TDI trimer. The adhesive is then coated onto the aluminized surface of the PET aluminized film at a coating amount of 0.7 g / m². 2 The aluminized surfaces of two aluminized PET films are bonded together, dried and cured to form a first aluminized PET layer, a first adhesive layer and a second aluminized PET layer.

[0099] S4. Take a 10μm thick BOPA film, apply an adhesive to bond the second aluminized PET layer to the BOPA film, and dry and cure to form a second adhesive layer and a BOPA layer; the adhesive can be a commercially available traditional adhesive or the adhesive obtained in step S3. In this embodiment, the adhesive obtained in step S3 is used, and the coating amount is 0.8g / m. 2 .

[0100] S5. Take a PE film with a thickness of 30 μm, apply an adhesive to bond the BOPA layer to the PE film, dry and cure to form a third adhesive layer and a PE layer, and obtain a high-barrier aluminized composite film; wherein the adhesive can be a commercially available traditional adhesive or the adhesive obtained in step S3. In this embodiment, the adhesive obtained in step S3 is specifically used, and the coating amount is 0.8 g / m 2 .

[0101] Example 3

[0102] The difference between this embodiment and Embodiment 1 lies in the preparation method of the high-barrier aluminum-coated composite film, specifically step S1, which includes the following steps:

[0103] S1. Weigh out 25 parts by weight of polyether polyol, 7 parts by weight of modified diol, 20 parts by weight of diisocyanate, 2 parts by weight of chain extender, 1.5 parts by weight of hydroxy acrylate monomer, 0.05 parts by weight of initiator, 0.01 parts by weight of catalyst, and 80 parts by weight of diluent to prepare polyurethane-acrylate main agent.

[0104] Example 4

[0105] The difference between this embodiment and Example 1 is that S1 is different in the preparation method of the high-barrier aluminum-coated composite film, and the modified diol is obtained from Preparation Example 3.

[0106] Example 5

[0107] The difference between this embodiment and Example 1 is that S1 is different in the preparation method of the high-barrier aluminum-coated composite film, and the modified diol is obtained from Preparation Example 4.

[0108] Example 6

[0109] The difference between this embodiment and Example 1 is that S1 is different in the preparation method of the high-barrier aluminum-coated composite film, and the modified diol is obtained from Preparation Example 5.

[0110] Comparative Example 1

[0111] The difference between this comparative example and Example 1 is that S3 in the preparation method of the high-barrier aluminum-coated composite film is different. The adhesive is not obtained by compounding polyurethane-acrylate main agent and curing agent, but by commercially available adhesive, specifically Conlibang UPSA-933.

[0112] Comparative Example 2

[0113] The difference between this comparative example and Example 1 lies in the different S1 step in the preparation method of the high-barrier aluminum-coated composite film.

[0114] S1. Weigh out 25 parts by weight of polyether polyol; 15 parts by weight of diisocyanate; 1 part by weight of chain extender; 1 part by weight of hydroxy acrylate monomer; 0.01 parts by weight of initiator; 0.005 parts by weight of catalyst; and 70 parts by weight of diluent.

[0115] Specifically, the polyether polyol is polyethylene glycol with a molecular weight of 400; the first diisocyanate is 4,4'-diphenylmethane diisocyanate; the chain extender is 1,4-butanediol; the hydroxy acrylate monomer is hydroxyethyl methacrylate; the initiator is benzoyl peroxide; the catalyst is dibutyltin dilaurate; and the diluent is ethyl acetate.

[0116] The polyether polyol was heated to 75°C, and the reaction system was protected by nitrogen gas. The first diisocyanate was added and reacted for 1.5 h. Then the temperature was lowered to 60°C, and the chain extender was added and reacted for 1 h. Then the diluent, catalyst and hydroxy acrylate monomer were added and reacted for 1 h. Finally, the initiator was added and reacted for 1.5 h to obtain the polyurethane-acrylate main agent.

[0117] Comparative Example 3

[0118] The difference between this comparative example and Example 1 is that S1 is different in the preparation method of the high-barrier aluminum-coated composite film, and the modified diol is prepared by Comparative Preparation Example 1.

[0119] Comparative Example 4

[0120] The difference between this comparative example and Example 1 is that S1 is different in the preparation method of the high-barrier aluminum-coated composite film, and the modified diol is prepared by comparative preparation example 2.

[0121] Performance testing

[0122] Oxygen and moisture barrier properties: After the high-barrier composite membrane is prepared and placed for at least 7 days, the oxygen permeability and water vapor permeability of the high-barrier composite membrane are tested according to the test methods ASTM D-3985-2017 and ASTM F-1249-2011.

[0123] Composite strength: After the first aluminized PET layer, the first adhesive layer and the second aluminized PET layer are formed, the mixture is left to stand for at least 7 days, and then the interlayer peel force is tested in accordance with the test method GB / T 8808-1988 "Peel Test Method for Flexible Composite Plastic Materials".

[0124] Aging composite strength: After the first aluminized PET layer, the first adhesive layer and the second aluminized PET layer are formed, the mixture is left to stand for at least 7 days, and then placed in a constant temperature and humidity aging chamber. The constant temperature and humidity aging chamber is set to a temperature of 85℃ and a humidity of 95%RH for 168 hours. After removal, the interlayer peel force is tested according to the test method GB / T 8808-1988 "Peel Test Method for Flexible Composite Plastic Materials".

[0125] The test results are shown in Table 1.

[0126] Table 1

[0127]

[0128] Based on the above test results, it can be found that, taking Example 1 and Comparative Example 1 as examples, compared with using traditional adhesives to laminate two layers of aluminized PET, the adhesive used in Example 1 can effectively improve the stability of the aluminum layer, thereby reducing the oxygen permeability and water vapor permeability of the aluminized composite film, that is, improving the oxygen and moisture barrier capacity, and improving the interlayer peel force, that is, improving the mechanical properties, thus improving the sealing performance of the aluminized composite film, making it suitable for packaging materials for integrated circuits.

[0129] Taking Example 1 and Comparative Examples 2-4 as examples, the adhesive with modified diols to modify the side chains of polyurethane in Example 1 can improve the oxygen and moisture barrier capacity and mechanical properties of the aluminized composite film. Furthermore, the introduction of dipropylene glycol ether structure into the modified diol can effectively adjust the flexibility of the polyurethane chain segments, ensuring the degree of crosslinking of the adhesive layer while dispersing stress, thereby achieving the comprehensive effect of improving oxygen and moisture barrier capacity and mechanical properties.

[0130] Taking Examples 1 and 4-6 as examples, Examples 5-6 use a compound of toluene diisocyanate and hexamethylene diisocyanate as the second diisocyanate as the composition of the modified diol, which can further improve the structural stability of the aluminum layer and the aluminum-plated composite film, and further improve the oxygen and moisture barrier capabilities and mechanical properties.

[0131] This specific embodiment is merely an explanation of this application and is not intended to limit it. After reading this specification, those skilled in the art can make modifications to this specific embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this application.

Claims

1. A high-barrier aluminized composite film for integrated circuit packaging, characterized in that: The material comprises, from top to bottom, a first aluminized PET layer, a first adhesive layer, a second aluminized PET layer, a second adhesive layer, a BOPA layer, a third adhesive layer, and a PE layer. The aluminized surfaces of the first and second aluminized PET layers are bonded together by the first adhesive layer. The first adhesive layer is formed by curing a polyurethane-acrylate base agent and a curing agent. The polyurethane-acrylate base agent is prepared from the following raw materials in parts by weight: 20-30 parts of polyether polyol; 5-8 parts of modified diol; 15-25 parts of diisocyanate; Chain extender 1-3 parts; 1-2 parts of hydroxyacrylate monomer; 70-90 parts of diluent; The modified diol was prepared by dipropylene glycol ether, second diisocyanate and diethanolamine; The method for preparing the modified diol includes the following steps: The second diisocyanate was dispersed in a solvent, and dipropylene glycol ether was added to react. Then diethanolamine was added to react. After the reaction was completed, the solvent was removed to obtain the modified diol.

2. The high-barrier aluminized composite film for integrated circuit packaging according to claim 1, characterized in that: In the modified diol, the molar ratio of dipropylene glycol ether, second diisocyanate and diethanolamine is 1:1:(1~1.1).

3. The high-barrier aluminized composite film for integrated circuit packaging according to claim 1, characterized in that: The dipropylene glycol ether includes one or more of dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, and dipropylene glycol monobutyl ether.

4. The high-barrier aluminized composite film for integrated circuit packaging according to claim 1, characterized in that: The first and second diisocyanates each independently comprise one or more of diphenylmethane diisocyanate, toluene diisocyanate, dicyclohexylmethane diisocyanate, hexamethylene diisocyanate, and isophorone diisocyanate.

5. The high-barrier aluminized composite film for integrated circuit packaging according to claim 1, characterized in that: The second diisocyanate is compounded from toluene diisocyanate and hexamethylene diisocyanate in a mass ratio of 1:(6.5~8).

6. The high-barrier aluminized composite film for integrated circuit packaging according to claim 1, characterized in that: The aluminum layer thickness of the first aluminized PET layer and the second aluminized PET layer are each 400-700 angstroms independently.

7. A method for preparing a high-barrier aluminized composite film for integrated circuit packaging based on any one of claims 1-6, characterized in that: Includes the following steps: The polyether polyol is mixed with the modified diol, and a first diisocyanate is added to react. Then a chain extender is added to react, followed by the addition of a diluent, catalyst and hydroxy acrylate monomer to react, and then an initiator is added to react, thus obtaining the polyurethane-acrylate main agent. Plasma treatment is performed on one side of the PET film, and the side after plasma treatment is called the plasma surface. Then, aluminum is deposited on the plasma surface to obtain an aluminum-coated PET film. The polyurethane-acrylate main agent and curing agent are mixed and coated onto the aluminum-coated surface of the PET metallized film. Two PET metallized films are then bonded together to form a first aluminum-coated PET layer, a first adhesive layer, and a second aluminum-coated PET layer. By applying an adhesive, the second aluminized PET layer is bonded to the BOPA film to form the second adhesive layer and the BOPA layer. By applying an adhesive, the BOPA layer and the PE film are bonded together to form a third adhesive layer and a PE layer, thus obtaining a high-barrier aluminum-coated composite film.

8. The method for preparing a high-barrier aluminized composite film for integrated circuit packaging according to claim 7, characterized in that: The working gas in the plasma treatment method is a combination of oxygen and argon, and the power of the plasma treatment is 5~8kW.

9. The method for preparing a high-barrier aluminized composite film for integrated circuit packaging according to claim 7, characterized in that: The aluminum plating method uses vacuum evaporation, with a plating speed of 300~600m / min and a wire feeding speed of 600~1200mm / min.

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