CPU control module
By designing a modular CPU control module, the high cost and long development time caused by complex circuit design in existing technologies are solved, and the design error rate is reduced and the heat dissipation capacity is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2026-03-27
AI Technical Summary
In engineering products, existing technologies require the design of complex circuits to achieve data acquisition, voltage conversion, and data exchange, resulting in high design costs, frequent errors, complex manufacturing processes, and extended project timelines.
The modular CPU control module includes a module bracket board, a module CPU board, and a module power supply. The modules are fixedly connected by bracket connecting columns and thermally conductive connecting platforms. Heat dissipation capacity is improved by using thermally conductive sheets and heat sink fins, and electromagnetic interference is reduced by using a linear power supply.
It reduces design complexity and error rate, reduces design costs, improves installation strength and heat dissipation capacity, and enhances module reliability.
Smart Images
Figure CN121751548A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a CPU control module. BACKGROUND
[0002] Many engineering products need to communicate with external devices through a bus, and need to design complex circuits to achieve data acquisition, voltage conversion, data exchange and analysis. In the design of serialized products, each product needs to be designed with the above-mentioned circuit, which will inevitably cause the problems of increasing design cost, high error rate, complex manufacturing process, and prolonged construction period. The use of a general CPU control module design scheme can solve the above-mentioned problems. SUMMARY
[0003] The purpose of the present application is to provide a new CPU control module.
[0004] In order to achieve the above-mentioned purpose, the technical scheme provided by the present application is: a CPU control module, comprising: a module support plate, a module CPU plate and a module power supply; the module support plate has a support connecting column and a support heat-conducting connecting table; the module CPU plate is in front of the module support plate, the back of the module CPU plate and the front of the module support plate have a heat dissipation interval, the back of the module CPU plate is abutted to the front of the support connecting column of the module support plate, the module CPU plate is fixedly connected with the support connecting column, the module CPU plate has a notch part, and the notch part is located backward to the support heat-conducting connecting table; the module CPU plate has a microprocessor CPU, a socket piece and a heat source piece, the microprocessor CPU is in the front of the module CPU plate, and the socket piece and the heat source piece are in the back of the module CPU plate; the module power supply is located at the notch part of the module CPU plate, the back of the module power supply is abutted to the front of the support heat-conducting connecting table of the module support plate, the module power supply is fixedly connected with the support heat-conducting connecting table, and the module power supply is electrically connected with the module CPU plate.
[0005] As a preferred scheme of the CPU control module, the module CPU plate is formed with a first connecting hole, the support connecting column is formed with a first connected hole corresponding to the first connecting hole, and a first connecting piece is arranged between the first connecting hole and the first connected hole to realize the fixed connection of the module CPU plate and the module support plate.
[0006] As a preferred scheme of the CPU control module, the insertion end face of the socket piece is formed with a positioning pin and a positioning hole, the positioning pin is arranged on one side of the insertion end face of the socket piece, and the positioning hole is arranged on the opposite side of the insertion end face of the socket piece; correspondingly, the insertion end face of the plug piece is formed with a matching hole corresponding to the positioning pin and a matching pin corresponding to the positioning hole.
[0007] As the preferred scheme of the CPU control module, the module power supply unit is formed with a second connecting hole, the support heat-conducting connecting table is formed with a second connected hole corresponding to the second connecting hole, and a second connecting piece is arranged between the second connecting hole and the second connected hole to realize the fixed connection of the module power supply and the support heat-conducting connecting table.
[0008] As the preferred scheme of the CPU control module, the module power supply has a 5V power supply and a 10V power supply, and the 5V power supply is separated from the 10V power supply by a heat dissipation fin.
[0009] As the preferred scheme of the CPU control module, the module support plate is erected on the module mounting surface, and a heat-conducting sheet is arranged between the bottom surface of the module support plate and the module mounting surface.
[0010] As the preferred scheme of the CPU control module, the rear surface of the module support plate is formed with a heat-conducting connecting table heat dissipation fin at the position of the support heat-conducting connecting table.
[0011] As the preferred scheme of the CPU control module, the front surface of the module support plate is formed with a support plate heat-conducting table at the position of the heat source of the module CPU plate, the front surface of the support plate heat-conducting table abuts against the rear surface of the heat source, further, a heat-conducting sheet is arranged between the heat source and the support plate heat-conducting table, and the rear surface of the module support plate is formed with a heat-conducting table heat dissipation fin at the position of the support plate heat-conducting table.
[0012] As the preferred scheme of the CPU control module, the top surface of the module support plate is formed with a support plate mounting table, the plug is fixed to the module support plate through the support plate mounting table, and reliable connection between the plug and the socket of the module CPU plate is ensured.
[0013] As the preferred scheme of the CPU control module, the side surface of the module support plate is formed with a support plate mounting ear, the module support plate is fixed to an external mechanical interface through the support plate mounting ear, and mechanical installation of the CPU control module is realized.
[0014] Compared with the prior art, the module overall structure can be popularized and applied, the design strength and design errors are greatly reduced, and the cost is reduced. The module support plate can improve the installation strength and increase the module heat dissipation capacity. The module power supply is a linear power supply, which can effectively reduce electromagnetic interference. The heat-conducting sheet can effectively conduct the heat of the module to improve the reliability. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 is a structural schematic diagram of the embodiment of the CPU control module of the application (in an exploded state).
[0016] Figure 2 is a structural schematic diagram of the embodiment of the CPU control module of the present application (combination state).
[0017] Figure 3 is a structural schematic diagram of the module CPU board in the embodiment of the CPU control module of the present application Figure 1 .
[0018] Figure 4 is a structural schematic diagram of the module CPU board in the embodiment of the CPU control module of the present application Figure 2 .
[0019] Figure 5 is a structural schematic diagram of the module support board in the embodiment of the CPU control module of the present application Figure 1 .
[0020] Figure 6 is a structural schematic diagram of the module support board in the embodiment of the CPU control module of the present application Figure 2 . DETAILED DESCRIPTION
[0021] The present application will be further described below in conjunction with the drawings by specific embodiments. It should be noted that the description of the embodiments is used to help understand the present application, but does not constitute a limitation on the present application. In addition, the technical features involved in each of the embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
[0022] Referring to Figures 1 to 6 , a CPU control module is shown in the figure. The CPU control module is applied to a control board containing bus communication. The CPU control module comprises a module support board 1, a module CPU board 2, a module power supply 3 and the like.
[0023] The module support board 1 has a support connecting column 11 and a support heat-conducting connecting table 12. Among them, the support connecting column 11 extends forward from the front of the module support board 1. Among them, the support heat-conducting connecting table 12 extends forward from the front of the module support board 1.
[0024] In specific implementation, the module support board 1 is a rectangular structure. The support heat-conducting connecting table 12 is located at one of the corner positions of the module support board 1.
[0025] The module CPU board 2 is in front of the module support board 1. The back of the module CPU board 2 is spaced apart from the front of the module support board 1 for heat dissipation. The back of the module CPU board 2 abuts the front of the support connecting column 11 of the module support board 1. The module CPU board 2 is fixedly connected with the support connecting column 11. The module CPU board 2 has a notch portion 20. The notch portion 20 is located at the back of the support heat-conducting connecting table 12.
[0026] In particular implementation, the module CPU board 2 is formed with a first connecting hole. The support connecting column 11 is formed with a first connected hole corresponding to the first connecting hole. The first connecting hole and the first connected hole are connected by a first connecting member to achieve the fixed connection of the module CPU board 2 and the module support board 1. Further, the first connecting hole is located at each corner of the module CPU board 2.
[0027] The module CPU board 2 has a microprocessor CPU 21, a socket member 22, and a heat source member 23. The microprocessor CPU 21 is located at the front of the module CPU board 2. The socket member 22 and the heat source member 23 are located at the back of the module CPU board 2. The microprocessor CPU 21 is the central processing unit of the module CPU board 2. The microprocessor CPU 21 is used for various data receiving, calculation, data conversion, control, and other core functions. The socket member 22 is the electrical interface of the module CPU board 2. The socket member 22 is used to achieve the electrical connection of the module CPU board 2 and the external functional board (with a plug member corresponding to the socket member 22). The heat source member 23 is the heat generating part of the module CPU board 2.
[0028] In particular implementation, the plug end face of the socket member 22 is formed with a positioning pin 221 and a positioning hole 222. The positioning pin 221 is located at one side of the plug end face of the socket member 22, and the positioning hole 222 is located at the opposite side of the plug end face of the socket member 22. Correspondingly, the plug end face of the plug member is formed with a matching hole corresponding to the positioning pin 221 and a matching pin corresponding to the positioning hole 222. By the shaft hole cooperation of the positioning pin 221 and the matching hole, and the shaft hole cooperation of the matching pin and the positioning hole 222, the mechanical positioning and reinforced connection of the socket member 22 to the plug member are achieved, and the plug member is prevented from being inserted reversely in the socket member 22.
[0029] The module power supply 3 is located at the notch portion 20 of the module CPU board 2. The back of the module power supply 3 abuts the front of the support heat-conducting connecting table 12 of the module support board 1. The module power supply 3 is fixedly connected with the support heat-conducting connecting table 12. The module power supply 3 is electrically connected with the module CPU board 2.
[0030] In particular implementation, the module power supply 3 is formed with a second connecting hole. The bracket heat-conducting connecting table 12 is formed with a second connected hole corresponding to the second connecting hole. A second connecting piece is arranged between the second connecting hole and the second connected hole to realize the fixed connection of the module power supply 3 and the bracket heat-conducting connecting table 12.
[0031] In particular implementation, the module power supply 3 is provided with a 5V power supply and a 15V power supply. The module power supply 3 is used to provide the module CPU board 2 with two working voltages of 5V and 15V. Further, the 5V power supply is separated from the 15V power supply by the heat dissipation fin 121.
[0032] In particular implementation, the pin of the module power supply 3 is welded to the pad of the module CPU board 2 to realize the electrical connection of the module power supply 3 and the module CPU.
[0033] Preferably, the module bracket board 1 is erected on a module mounting surface (not shown in the figure). The bottom surface of the module bracket board 1 is provided with a heat-conducting sheet 4 between the bottom surface and the module mounting surface. The heat-conducting sheet 4 is used to better conduct the heat of the module bracket board 1 to the module mounting surface.
[0034] In particular implementation, the heat-conducting sheet 4 is pasted to the bottom surface of the module bracket board 1.
[0035] Preferably, the back surface of the module bracket board 1 is formed with a bracket board heat-conducting table heat dissipation fin 14 at the position of the bracket heat-conducting connecting table 12. The bracket board heat-conducting table heat dissipation fin 14 is used to accelerate the heat conduction and convection heat dissipation at the position of the bracket heat-conducting connecting table 12.
[0036] Preferably, the front surface of the module bracket board 1 is formed with a bracket board heat-conducting table 13 at the position of the heat source 23 of the module CPU board 2. The front surface of the bracket board heat-conducting table 13 abuts against the back surface of the heat source 23. The working heat of the heat source 23 is conducted to the module bracket board 1 via the bracket board heat-conducting table 13. Further, the heat-conducting sheet 5 is arranged between the heat source 23 and the bracket board heat-conducting table 13. The heat-conducting sheet 5 is used to better conduct the working heat of the heat source 23 to the bracket board heat-conducting table 13. Further, the back surface of the module bracket board 1 is formed with a heat-conducting table heat dissipation fin 15 at the position of the bracket board heat-conducting table 13. The heat-conducting table heat dissipation fin 15 is used to accelerate the heat conduction and convection heat dissipation at the position of the bracket board heat-conducting table 13.
[0037] Preferably, the top surface of the module bracket board 1 is formed with a bracket board mounting table 16. The bracket board mounting table 16 is used to fix the plug to the module bracket board 1, so as to ensure the reliable connection of the plug and the socket 22 of the module CPU board 2.
[0038] Preferably, the module support plate 1 has support plate mounting ears 17 on its sides. Through the support plate mounting ears 17, the module support plate 1 can be fixed to external mechanical interfaces, realizing mechanical installation of the CPU control module.
[0039] The above only expresses the embodiments of the present application, the description is more specific and detailed, but cannot be understood as the limitation of the patent scope of the application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.
Claims
1. A CPU control module, applied to a control board with bus communication, characterized in that, include: The system comprises a module support plate, a module CPU board, and a module power supply. The module support plate has a support connecting column and a support heat-conducting connecting platform. The module CPU board is located in front of the module support plate, with a heat dissipation gap between its rear and front sides. The rear side of the module CPU board abuts against the front of the support connecting column of the module support plate. The module CPU board is fixedly connected to the support connecting column. The module CPU board has a notch that faces rearward towards the support heat-conducting connecting platform. The module CPU board includes a microprocessor CPU, a socket component, and a heat source component. The microprocessor CPU is located in front of the module CPU board, while the socket component and the heat source component are located behind it. The module power supply is located at the notch on the module CPU board. The rear side of the module power supply abuts against the front of the support heat-conducting connecting platform of the module support plate. The module power supply is fixedly connected to the support heat-conducting connecting platform and electrically connected to the module CPU board.
2. The CPU control module according to claim 1, characterized in that, The module CPU board has a first connection hole, and the bracket connecting column has a first connected hole corresponding to the first connection hole. A first connector is provided between the first connection hole and the first connected hole to achieve a fixed connection between the module CPU board and the module bracket board.
3. The CPU control module according to claim 1, characterized in that, The socket member has a locating pin and a locating hole on its plug end face. The locating pin is located on one side of the plug end face of the socket member, and the locating hole is located on the opposite side of the plug end face of the socket member. Correspondingly, the plug end face of the plug member has a mating hole for the locating pin and a mating pin for the locating hole.
4. The CPU control module according to claim 1, characterized in that, The module power supply unit has a second connection hole, and the bracket heat-conducting connection platform has a second connection hole corresponding to the second connection hole. A second connector is provided between the second connection hole and the second connection hole to achieve a fixed connection between the module power supply and the bracket heat-conducting connection platform.
5. The CPU control module according to claim 1, characterized in that, The module power supply has a 5V power supply and a 10V power supply, and the 5V power supply and the 10V power supply are separated by heat dissipation fins.
6. The CPU control module according to claim 1, characterized in that, The module support plate stands upright on the module mounting surface, and there is a heat-conducting sheet between the bottom surface of the module support plate and the module mounting surface.
7. The CPU control module according to claim 1, characterized in that, The module support plate has heat dissipation fins formed on the back of the support heat dissipation connection platform.
8. The CPU control module according to claim 1, characterized in that, A heat-conducting platform is formed on the front of the module support plate at the location of the heat source component on the module CPU board, and the front of the heat-conducting platform abuts against the rear of the heat source component; further, a heat-conducting sheet is provided between the heat source component and the heat-conducting platform; heat-conducting platform heat dissipation fins are formed on the rear of the module support plate at the location of the heat-conducting platform.
9. The CPU control module according to claim 1, characterized in that, The top surface of the module bracket plate has a bracket plate mounting platform. The plug can be fixed on the module bracket plate through the bracket plate mounting platform to ensure that the plug is reliably connected to the socket of the module CPU board.
10. The CPU control module according to claim 1, characterized in that, The module support plate has mounting ears on its side. The module support plate can be fixed to an external mechanical interface through the mounting ears to achieve mechanical installation of the CPU control module.