Photoelectric detector

Abstract

The photoelectric detector comprises a first photoelectric module (3) and a second photoelectric module (4) which are arranged in a stacked mode, the first photoelectric module (3) is provided with an assembling face, the assembling face is provided with a first light sensing part (31), and a transmission filling layer (5) is arranged between the assembling face and the second photoelectric module (4). And the transmission filling layer (5) is used for enhancing the irradiation intensity of light to the first photoelectric module (3). According to the invention, the optical responsivity of the second photoelectric module can be improved, the difference value between the optical responsivity of the second photoelectric module and the optical responsivity of the first photoelectric module can be reduced, and the design complexity and design cost of a rear-end circuit can be reduced.

Description

Technical Field

[0001] This application relates to the field of temperature measuring device technology, specifically to a photoelectric detector. Background Technology

[0002] Dual-color temperature measurement determines temperature by the ratio of infrared radiation energy in two adjacent bands. It can be widely used in industries such as smelting, casting, steel rolling, forging, powder metallurgy, chemicals, glass processing, ceramics, medium-frequency induction heating, and welding. Dual-color thermometers can eliminate the influence of moisture, dust, changes in the size of the target object, partial obstruction, and changes in emissivity. Even when affected by external conditions, causing both bands to rise or fall simultaneously, the ratio remains constant. Therefore, dual-color temperature measurement has the advantage of high accuracy. Dual-color temperature sensors require two photoelectric modules packaged together. These modules collect light signals and transmit them to the back-end circuitry, which then processes the signals to obtain temperature information. However, current dual-color temperature sensors suffer from complex back-end circuit design and high design costs, as well as complex packaging structures, difficult packaging operations, and high costs. Summary of the Invention

[0003] This application aims to address one of the technical problems in related technologies to a certain extent. To this end, this application provides a photodetector.

[0004] To achieve the above objectives, this application adopts the following technical solution: a photodetector, comprising a first photodetector and a second photodetector arranged in layers, the first photodetector having a mounting surface, a first photosensitive part being disposed on the mounting surface, and a transmission filling layer being disposed between the mounting surface and the second photodetector, the transmission filling layer being used to enhance the irradiation intensity of light on the first photodetector.

[0005] Optionally, the material of the transmission filling layer is a light-transmitting adhesive material, and the first photoelectric module and the second photoelectric module are fixedly bonded together through the transmission filling layer.

[0006] Optionally, one side surface of the second photoelectric module has a second photosensitive part, the other side of the second photoelectric module faces the first photoelectric module, and the transmissive filling layer is disposed between the mounting surface and the other side surface of the second photoelectric module.

[0007] Optionally, one side surface of the second photoelectric module has a second photosensitive portion, the other side surface of the second photoelectric module faces the first photoelectric module, and the transmissive filling layer is disposed between the mounting surface and one side surface of the second photoelectric module.

[0008] Optionally, the assembly surface is further provided with a first wiring portion, wherein the first wiring portion and the first photosensitive portion are located at opposite ends of the assembly surface and are adjacent to each other;

[0009] A second wiring portion is also provided on one side surface of the second photoelectric module. The second wiring portion and the second photosensitive portion are located at opposite ends of the second photoelectric module and are adjacent to each other.

[0010] The first photosensitive part and the second photosensitive part have the same shape and coincide in a direction perpendicular to the first photoelectric module. The first wiring part and the second wiring part are offset from each other in a direction perpendicular to the first photoelectric module.

[0011] Optionally, the photodetector further includes a tube base and a tube cap, the tube cap being disposed on the tube base and forming a cavity between the two, the tube cap being provided with an opening for external light to enter the cavity;

[0012] Both the first optoelectronic module and the second optoelectronic module are disposed within the cavity.

[0013] Optionally, the tube seat has a mounting plane located within the cavity, and the first photoelectric module is disposed on the mounting plane.

[0014] Optionally, a support is provided on the tube base, the first photoelectric module is fixedly installed on the support, and the second photoelectric module is located on the side of the first photoelectric module away from the support.

[0015] Optionally, the photodetector further includes an auxiliary wiring section. The support includes a photoelectric module carrier and an electrical connector carrier located on one side of the photoelectric module carrier. The auxiliary wiring section is disposed on the electrical connector carrier. The first photoelectric module is disposed on the photoelectric module carrier. The second photoelectric module is electrically connected to the auxiliary wiring section. The first wiring section of the first photoelectric module is located on the side of the first photoelectric module away from the photoelectric module carrier. The first wiring section of the first photoelectric module extends beyond the coverage area of ​​the second photoelectric module.

[0016] Optionally, the mounting plane is provided with a first terminal and a second terminal, the height of the first terminal is smaller than the height of the second terminal, the first optoelectronic module is connected to the first terminal via a first wiring part, and the second optoelectronic module is connected to the second terminal via a second wiring part.

[0017] Optionally, the height of the first terminal is a selected value between 450 μm and 550 μm, and the horizontal height of the end face of the first terminal is lower than the horizontal height of the mounting surface; the height of the second terminal is a selected value between 750 μm and 850 μm, and the horizontal height of the end face of the second terminal is lower than the horizontal height of the side surface of the second optoelectronic module facing away from the mounting surface.

[0018] Optionally, the mounting surface is provided with a first mark for guiding the assembly direction of the first optoelectronic module, and the first optoelectronic module is provided with a second mark for guiding the assembly direction of the second optoelectronic module.

[0019] Optionally, the thickness of the first optoelectronic module is a selected value between 650 μm and 750 μm, the thickness of the second optoelectronic module is a selected value between 250 μm and 350 μm, and the thickness of the transmission filling layer is a selected value between 250 nm and 350 nm.

[0020] The present application provides a transmissive filling layer between the first optoelectronic module and the second optoelectronic module, which can enhance the intensity of light irradiation on the first optoelectronic module. This can improve the photoresponsivity of the second optoelectronic module, reduce the difference between the photoresponsivity of the second optoelectronic module and the photoresponsivity of the first optoelectronic module, and thus reduce the design complexity and cost of the back-end circuit.

[0021] These features and advantages of this application will be disclosed in detail in the following specific embodiments and accompanying drawings. The best embodiments or means of this application will be shown in detail in conjunction with the accompanying drawings, but are not intended to limit the technical solutions of this application. In addition, each of these features, elements and components appearing in the following text and drawings is multiple and is labeled with different symbols or numbers for convenience, but all represent parts with the same or similar structure or function. Attached Figure Description

[0022] The following description, in conjunction with the accompanying drawings, further illustrates this application:

[0023] Figure 1 This is a schematic diagram of the structure of a photodetector provided in an embodiment of this application;

[0024] Figure 2 for Figure 1 Exploded view of the photodetector in the image;

[0025] Figure 3 for Figure 2 Further exploded view of the photodetector in the image;

[0026] Figure 4This is a schematic diagram showing the first and second photoelectric modules being illuminated by light during the application of the photodetector in this application.

[0027] Figure 5 This is a schematic diagram showing the upper and lower photoelectric modules of a photodetector in the related technology being illuminated by light during application.

[0028] Figure 6 This is a schematic diagram showing the spectral response of the photodetector in this application to the photodetector in related technologies when the photodetector is illuminated by light in the lower photoelectric module during application.

[0029] Figure 7 for Figure 6 A magnified view of a portion of the image;

[0030] Figure 8 A schematic diagram showing the spectral response multiplication factor of the first photoelectric module in the photodetector of this application;

[0031] Figure 9 A simulation diagram of the light response of the first photoelectric module in the photodetector of this application;

[0032] Figure 10 A simulation diagram of the photoresponse of the lower-level photoelectric module in a photodetector used in related technologies;

[0033] Figure 11 A schematic diagram illustrating another embodiment of the photodetector provided in this application;

[0034] Figure 12 An exploded view of another embodiment of the photodetector provided in this application;

[0035] Figure 13 This is a cross-sectional schematic diagram of one embodiment of the photodetector provided in this application.

[0036] Among them, 1. tube socket, 10. mounting plane, 11. first terminal, 12. second terminal, 13. pin, 2. tube cap, 20. opening, 3. first optoelectronic module, 30. first wiring part, 31. first photosensitive part, 4. second optoelectronic module, 40. second wiring part, 41. second photosensitive part, 5. transmission filling layer, 6. lead wire, 7. upper optoelectronic module, 8. lower optoelectronic module, 9. vacuum. Figure 4 and Figure 5 The straight line with an arrowhead represents a ray of light. Detailed Implementation

[0037] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described are intended to explain this application and should not be construed as limiting it.

[0038] The terms "an embodiment," "example," or "example" used in this specification refer to a particular feature, structure, or characteristic described in connection with the embodiment itself that may be included in at least one embodiment disclosed in this application. The phrase "in an embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment.

[0039] This embodiment provides a photodetector, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the photodetector includes a base 1, a cap 2, a first photoelectric module 3, and a second photoelectric module 4. The first photoelectric module 3 has a mounting surface on which a first photosensitive portion 31 is disposed. In this embodiment of the invention, the first photoelectric module 3 and the second photoelectric module 4 are stacked, and a transmission filling layer 5 is disposed between the mounting surface of the first photoelectric module 3 and the second photoelectric module 4. This transmission filling layer 5 is used to enhance the intensity of light irradiation onto the first photoelectric module 3.

[0040] When the photodetector is working, light shines on the first photoelectric module 3 and the second photoelectric module 4. The first photoelectric module 3 and the second photoelectric module 4 convert the light signal into an electrical signal and transmit it to the back-end circuit. The back-end circuit then processes the electrical signal to obtain the temperature data.

[0041] The inventors discovered through research that the design complexity of the back-end circuit in the dual-color temperature sensor of related technologies is related to the consistency of the photoresponsivity between the two photoelectric modules. Specifically, the closer the photoresponsivity of the two photoelectric modules is, the lower the design difficulty of the back-end circuit. However, the photoresponsivity of the two photoelectric modules in the dual-color temperature sensor of related technologies differs significantly, leading to the aforementioned problems of complex and costly back-end circuit design. The solution of this application provides a transmissive filling layer 5 between the first photoelectric module 3 and the second photoelectric module 4, which enhances the intensity of light irradiation on the first photoelectric module 3. This improves the photoresponsivity of the second photoelectric module 4, reduces the difference between the photoresponsivity of the second photoelectric module 4 and the first photoelectric module 3, and thus reduces the design complexity and cost of the back-end circuit.

[0042] In this embodiment, the transmissive filling layer 5 is a light-transmitting adhesive material, specifically, an optical adhesive. Since this optical adhesive is coated on the first optoelectronic module 3, in... Figure 3 The light-transmitting adhesive material is not shown in the image, but rather in... Figure 4 The image shows a light-transmitting adhesive material. The optical adhesive used in this embodiment is described in detail below: This optical adhesive is a solvent-free two-component epoxy potting compound. It is a colorless and transparent liquid with advantages such as low viscosity, ease of handling, good leveling properties, and low curing shrinkage. This optical adhesive can be purchased directly from the market. The principle and performance of the optical adhesive are existing technologies and will not be elaborated here.

[0043] In this embodiment, the first optoelectronic module 3 and the second optoelectronic module 4 are fixedly bonded together by the transmission filling layer 5. Specifically, during encapsulation, the first optoelectronic module 3 is first installed on the mounting plane 10, and then the aforementioned optical adhesive is applied to the surface of the first optoelectronic module 3 facing away from the mounting plane 10. The second optoelectronic module 4 is then bonded to the first optoelectronic module 3 using the optical adhesive. After the optical adhesive cures, the first optoelectronic module 3 and the second optoelectronic module 4 remain firmly fixed. This solution eliminates the need for brackets and other structures used for assembling optoelectronic modules in related technologies. On the one hand, it reduces the design size of the cavity space; on the other hand, it significantly simplifies the encapsulation operation, reduces the difficulty of the encapsulation operation, and lowers the cost.

[0044] Specifically, in this embodiment, the thickness of the first photoelectric module 3 is 300 μm, the thickness of the second photoelectric module 4 is 650 μm, and the thickness of the transmission filling layer 5 is 300 nm. It is easy to understand that the thicknesses of the first photoelectric module 3, the second photoelectric module 4, and the transmission filling layer 5 can be changed as needed. Experimental studies show that when the thickness of the first photoelectric module 3 is a selected value between 250 μm and 350 μm, the thickness of the second photoelectric module 4 is a selected value between 650 μm and 750 μm, and the thickness of the transmission filling layer 5 is a selected value between 250 nm and 350 nm, the transmission filling layer 5 can enhance the intensity of light irradiation onto the first photoelectric module 3.

[0045] Combination Figure 4 and Figure 5As shown, the improvement of the photodetector provided in this embodiment compared to similar products in the prior art is explained: Similar products in the prior art also use two photoelectric modules. For ease of description, the two photoelectric modules in such photodetectors in the prior art are respectively named the lower photoelectric module 8 and the upper photoelectric module 7. The lower photoelectric module 8 can be understood as the first photoelectric module 3 in this application, and the upper photoelectric module 7 can be understood as the second photoelectric module 4 in this application. In the prior art, a bracket is generally used to separate the upper photoelectric module 7 and the lower photoelectric module 8, and then a vacuum 9 is created in the cavity by evacuation 9, or the cavity is filled with nitrogen gas. This creates a vacuum 9 or fills the cavity with nitrogen between the upper photoelectric module 7 and the lower photoelectric module 8. The above solution is a conventional solution currently used in the art. The inventors of this application discovered through research that the design of the back-end circuit using the aforementioned conventional solution is extremely complex, time-consuming, labor-intensive, and costly. Through in-depth research, the inventors found that the reason for this problem is the excessively large difference between the photoresponsivity of the upper-layer photoelectric module 7 and the lower-layer photoelectric module 8. After clarifying the root cause of the problem, the inventors further discovered that the reason the photoresponsivity of the upper-layer photoelectric module 7 is greater than that of the lower-layer photoelectric module 8 is because the intensity of light illuminating the upper-layer photoelectric module 7 is greater than the intensity of light illuminating the lower-layer photoelectric module 8.

[0046] To improve the intensity of light reaching the lower photoelectric module 8, the inventors considered the reduction in light intensity. They concluded that the light was reflected when passing through the gas between the upper and lower photoelectric modules, leading to a decrease in the intensity of light reaching the lower module 8. Therefore, the inventors proposed coating the space between the upper and lower photoelectric modules with optical adhesive. This adhesive reduces light reflection and increases the intensity of light reaching the lower photoelectric module. Figure 4 and Figure 5 As shown, the principle is explained below:

[0047] The reflection of light by the medium between the first optoelectronic module 3 and the second optoelectronic module 4 in this application can be characterized by the reflectivity of light. Where R is the reflectivity of the medium (corresponding to optical adhesive in this application, and vacuum in the prior art) for light passing through the upper photoelectric module and incident on the lower photoelectric module, n1 is the refractive index of the upper photoelectric module, and n2 is the refractive index of the medium. Assuming the total intensity of light incident on the upper photoelectric module is A, then the total intensity incident on the lower photoelectric module is AA*R. The smaller the value of R, the more light incident on the lower photoelectric module, thus reducing the difference in photoresponsivity between the lower and upper photoelectric modules.

[0048] Simplifying the above formula, we get: Therefore, The larger the value of R, the larger the ratio of the refractive index of the upper photoelectric module to the refractive index of the medium. The more light is reflected, the less light passes through the medium and reaches the lower photoelectric module. In other words, the intensity of light reaching the lower photoelectric module is lower.

[0049] Therefore, while keeping the refractive index of the upper photoelectric module constant, the refractive index of the aforementioned medium should be increased as much as possible. This will result in a smaller ratio between the refractive index of the upper photoelectric module and the refractive index of the aforementioned medium, ultimately increasing the intensity of light directed towards the lower photoelectric module. It is known that the refractive index of vacuum 9 is 1, while the refractive index of the optical adhesive provided in this application can reach 1.5 (it is easily understood that in other alternative embodiments, the refractive index of optical adhesives with slightly different performance may vary slightly, but it is sufficient that it is greater than 1). Therefore, the difference in photoresponsivity between the first photoelectric module 3 and the second photoelectric module 4 in the photodetector provided in this embodiment is small, which can reduce the design complexity of the back-end circuit and lower costs.

[0050] Furthermore, in combination Figure 6 and Figure 7 As shown in the diagram, the blue curve represents the response of a single optoelectronic module in the 350nm to 1100nm spectrum. This single optoelectronic module is then used as the first optoelectronic module 3, i.e., the optoelectronic module located in the lower layer (e.g., ...). Figure 6 and Figure 7 The experiment involved placing a second photoelectric module on top of the BottomPD (the bottom photoelectric module) for testing. The orange curve represents the response of the lower photoelectric module in the 350nm to 1100nm spectrum with a vacuum between the two modules. Figure 6 and Figure 7 The text indicates that the bottom photoelectric module (labeled "BottomPD_covered_with_TopPD") covers the top photoelectric module; the gray curve represents the response of the lower photoelectric module in the 350nm to 1100nm spectrum when optical adhesive is used between the two photoelectric modules (e.g., ...). Figure 6 and Figure 7 The annotation "BottomPD_covered_with_TopPD_with_OCA" indicates that the bottom photoelectric module covers the top photoelectric module, with optical adhesive between them. This demonstrates that applying optical adhesive between the upper and lower photoelectric modules significantly improves the photoresponsivity of the lower photoelectric module. Further, refer to... Figure 8As shown, in the 990nm to 1100nm spectrum, the photoresponsivity of the lower-layer optoelectronic module can be improved by about 50%.

[0051] Furthermore, the inventors verified the principles described in the above scheme by conducting simulation verification using a light wavelength of 1060nm as an example, referring to... Figure 9 and Figure 10 As shown, with a 3μm optical adhesive coating between the upper and lower optoelectronic modules, the transmittance of the lower optoelectronic module at a wavelength of 1060nm is 0.72; while without the optical adhesive, the transmittance of the lower optoelectronic module at a wavelength of 1060nm is 0.52. Simulation results show that coating the upper and lower optoelectronic modules with optical adhesive can significantly improve the photoresponsivity of the lower optoelectronic module, increasing it by approximately 38%.

[0052] The inventors also discovered that coating the first optoelectronic module 3 and the second optoelectronic module 4 with optical adhesive not only solves the problem of complex back-end circuit design, but also reduces the packaging difficulty and cost of the photodetector. Specifically, it reduces the number of components used for packaging (reducing the bracket structure used to mount the optoelectronic modules in the prior art), and the packaging operation is easier.

[0053] The second photoelectric module 4 has a second photosensitive part 41. In this embodiment of the invention, the orientation of the second photosensitive part 41 is not specifically limited. As an optional implementation, the orientation of the second photosensitive part 41 is the same as that of the first photosensitive part 31. Specifically, the second photosensitive part 41 is disposed on one side surface of the first photoelectric module 4, and the other side of the second photoelectric module 4 faces the first photoelectric module 3. The transmission filling layer 5 is disposed between the mounting surface and the other side surface of the second photoelectric module 4. That is, in this embodiment, the second photosensitive part 41 and the first photosensitive part 31 are separated by at least the main body of the first photoelectric module 4 and the transmission filling layer 5. In this embodiment, both the first photoelectric module 3 and the second photoelectric module 4 are "upright mounted".

[0054] Of course, the embodiments of the present invention are not limited thereto. As another optional implementation, one side surface of the second photoelectric module 4 has a second photosensitive portion 41, and this side surface faces the first photoelectric module 3. A transmission filling layer 5 is disposed between the mounting surface and one side surface of the second photoelectric module 4. In this configuration, the second photosensitive portion 41 of the second photoelectric module 4 and the first photoelectric module 3 are spaced apart by the transmission filling layer 5. In this embodiment, the first photoelectric module 3 is mounted upright, and the second photoelectric module 4 is mounted upside down.

[0055] To facilitate electrical connection between the first optoelectronic module 3 and the back-end circuit, optionally, a first wiring portion 30 can be provided on the mounting surface of the first optoelectronic module 3. The first wiring portion 30 and the first photosensitive portion 31 are located at opposite ends of the mounting surface, and the first wiring portion 30 is adjacent to the first photosensitive portion 31. The first optoelectronic module 3 can be electrically connected to the external circuit through the first wiring portion 30.

[0056] Correspondingly, a second wiring portion 40 is also provided on one side surface of the second optoelectronic module 4. The second wiring portion 40 and the second photosensitive portion 41 are located at the two ends of the second optoelectronic module, and the second wiring portion 40 and the second photosensitive portion 41 are adjacent to each other.

[0057] To improve compactness and reduce space occupation, the first photosensitive part 31 and the second photosensitive part 41 have the same shape and coincide in a direction perpendicular to the first optoelectronic module 3, while the first wiring part 30 and the second wiring part 40 are staggered in a direction perpendicular to the first optoelectronic module 3. The staggered arrangement of the first wiring part 30 and the second wiring part 40 facilitates wiring layout.

[0058] In this embodiment of the invention, the photodetector may also include other structures. For example, the photodetector may also include a base 1 and a cap 2, with the cap 2 disposed on the base 1 and forming a cavity between them. The cap 2 has an opening 20 for external light to enter the cavity. Optionally, a transparent glass may be provided at the opening 20 for sealing.

[0059] When the photodetector is working, light enters the cavity through the opening 20 and illuminates the first photodetector 3 and the second photodetector 4. The first photodetector 3 and the second photodetector 4 convert the light signal into an electrical signal and transmit it to the back-end circuit. The back-end circuit then processes the electrical signal to obtain temperature data. In this embodiment, the first photodetector 3 is disposed on the mounting plane 10, and the second photodetector 4 is disposed on the first photodetector 3. In terms of relative position, the second photodetector 4 is located between the first photodetector 3 and the opening 20. In this embodiment, a transmission filling layer 5 is also disposed between the first photodetector 3 and the second photodetector 4 to enhance the intensity of light irradiation on the first photodetector 3.

[0060] Combination Figure 1 , Figure 2 and Figure 3As shown in the diagram, in this embodiment, a first terminal 11 and a second terminal 12 are provided on the socket 1. The height of the first terminal 11 is smaller than the height of the second terminal 12. The first optoelectronic module 3 is electrically connected to the first terminal 11, and the second optoelectronic module 4 is electrically connected to the second terminal 12. Further, a first wiring portion 30 is provided on the surface of the first optoelectronic module 3 facing the opening 20, and the first wiring portion 30 is wire-bonded to the first terminal 11; a second wiring portion 40 is provided on the surface of the second optoelectronic module 4 facing the opening 20, and the second wiring portion 40 is wire-bonded to the second terminal 12. The first terminal 11 and the second terminal 12 can be integrated with the pin 13 on the socket 1, and the pin 13 can be electrically connected to the back-end circuit. By designing the first terminal 11 and the second terminal 12 to have different heights, the second optoelectronic module 4 is not affected by the first terminal 11 and the wire used for wire bonding during wire bonding, facilitating the wire bonding operation and reducing the difficulty of the packaging operation. At the same time, the length of the lead wire 6 used in the wire bonding can be reduced, which can improve the data transmission rate.

[0061] In this embodiment, the height of the first terminal 11 is 0.5 mm and the height of the second terminal 12 is 0.8 mm. It is easy to understand that in other optional embodiments, the height of the first terminal 11 can be a selected value between 0.45 mm and 0.55 mm, and the height of the second terminal 12 can be a selected value between 0.75 mm and 0.85 mm.

[0062] In this embodiment of the invention, there are no special limitations on how the first optoelectronic module 3 is placed on the tube seat 1. For example, the tube seat 1 has a mounting plane 10 located in the cavity, and the first optoelectronic module 3 is directly placed on the mounting plane 10.

[0063] Furthermore, the orthographic projection of the first wiring portion 30 on the mounting plane 10 does not overlap with the orthographic projection of the second wiring portion 40 on the mounting plane 10. In this way, the first wiring portion 30 and the second wiring portion 40 are offset from each other (away from each other in the circumferential direction), so that the second optoelectronic module 4 is less affected by the first terminal 11 and the wires used for wire bonding on the first terminal 11 during wire bonding.

[0064] In one specific implementation, the surface of the first photoelectric module 3 facing the opening 20 has a first photosensitive part 31, and the surface of the second photoelectric module 4 facing the opening 20 has a second photosensitive part 41. The orthographic projection of the first photosensitive part 31 onto the mounting plane 10 coincides with the orthographic projection of the second photosensitive part 41 onto the mounting plane 10. Further, this embodiment employs the following scheme to ensure the coaxiality of the first photosensitive part 31 and the second photosensitive part 41: specifically, in this embodiment, a first mark is provided on the mounting plane 10 to guide the assembly direction of the first photoelectric module 3, and the first photoelectric module 3 is provided with a second mark to guide the assembly direction of the second photoelectric module 4. Through the above design, the coaxiality of the first photoelectric module 3 and the second photoelectric module 4 can be ensured, reducing assembly difficulty.

[0065] In this embodiment, the first optoelectronic module 3 can be fixedly mounted on the mounting plane 10 using an adhesive method. Of course, in other optional embodiments, such as... Figures 11 to 13 As shown, a support member 100 is provided on the mounting plane 10, and then the first optoelectronic module 3 is fixedly installed on the support member 100.

[0066] To improve the stability of the first photoelectric module 3 and the second photoelectric module 4, the support member 100 includes a photoelectric module carrier 110 and an electrical connector carrier 120 located on one side of the photoelectric module carrier 110. The photoelectric detector may also include an auxiliary wiring portion 200, which is disposed on the electrical connector carrier 120, and the first photoelectric module 3 is disposed on the photoelectric module carrier 110.

[0067] The second optoelectronic module 4 is electrically connected to the auxiliary wiring section 200, and the first wiring section 30 of the first optoelectronic module 3 is located on the side of the first optoelectronic module 3 away from the optoelectronic module support section 110, and the first wiring section 30 of the first optoelectronic module 3 extends beyond the coverage area of ​​the second optoelectronic module 4.

[0068] By setting the support member 100, the wiring part of the second optoelectronic module 4 can be led out to the electrical connector carrier part 120. The first optoelectronic module 3 and the second optoelectronic module 4 are stacked on the optoelectronic module carrier part 110, which can improve the structural stability of the first optoelectronic module 3 and the second optoelectronic module 4.

[0069] As an optional implementation, the electrical connector carrier portion 120 protrudes from the optoelectronic module carrier portion 110.

[0070] Optionally, the height difference between the surface of the first photoelectric module 3 away from the photoelectric module support portion 110 and the surface of the electrical connector support portion 120 away from the tube seat 1 does not exceed a set height threshold, a portion of the second photoelectric module 4 covers the surface of the first photoelectric module 3 away from the photoelectric module support portion 110, and another portion of the second photoelectric module 4 covers a portion of the electrical connector support portion 120.

[0071] Optionally, the surface of the first optoelectronic module 3 facing away from the optoelectronic module carrier 110 is flush with the surface of the electrical connector carrier 120 facing away from the tube seat 1.

[0072] When there is a height difference between the surface of the first optoelectronic module 3 facing away from the optoelectronic module support portion 110 and the surface of the electrical connector support portion 120 facing away from the tube seat 1, the provision of the transmission filling layer 5 on the surface of the first optoelectronic module 3 and the surface of the electrical connector support portion 120 can also achieve the effect of planarization.

[0073] As an alternative implementation, the support member 100 is stepped, and the surface of the optoelectronic module carrier 110 is lower than the surface of the electrical connector carrier 120.

[0074] In this embodiment of the invention, the support frame 100 is made of insulating material.

[0075] As an alternative implementation, the support member 100 is disposed in the space defined by the first terminal 11 and the second terminal 12.

[0076] The packaging process of the photodetector provided in this embodiment is described as follows:

[0077] First, the first optoelectronic module 3 is attached and fixed to the mounting plane 10 according to the first markings using a pick-and-place machine. After the adhesive has cured at high temperature, the first wiring part 30 on the first optoelectronic module 3 is electrically connected to the first terminal 11 by wire bonding.

[0078] Next, optical adhesive is applied to the first photosensitive surface of the first photoelectric module 3 using a dispensing machine. Then, the second photoelectric module 4 is bonded to the first photoelectric module 3 with optical adhesive according to the guidance of the second mark. After high temperature curing, the second wiring part 40 on the second photoelectric module 4 is electrically connected to the second terminal 12 by wire bonding.

[0079] Finally, cap 2 and base 1 are welded together using capacitive energy storage welding to complete the encapsulation.

[0080] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Those skilled in the art should understand that this application includes, but is not limited to, the contents described in the accompanying drawings and the specific embodiments above. Any modifications that do not depart from the functional and structural principles of this application will be included within the scope of the claims.

Claims

1. A photodetector, comprising: The photovoltaic detector comprises a first photovoltaic module (3) and a second photovoltaic module (4) arranged in a stacked manner, the first photovoltaic module (3) has an assembly surface provided with a first light-sensing part (31), and a transmission filling layer (5) is arranged between the assembly surface and the second photovoltaic module (4), and the transmission filling layer (5) is used for enhancing the illumination intensity of light on the first photovoltaic module (3).

2. The photodetector of claim 1, wherein, The material of the transmission filling layer (5) is a light-transmitting adhesive material, and the first photovoltaic module (3) and the second photovoltaic module (4) are fixedly bonded through the transmission filling layer (5).

3. The photodetector of claim 1, wherein, One side surface of the second photovoltaic module (4) is provided with a second light-sensing part (41), and the other side surface of the second photovoltaic module (4) faces the first photovoltaic module (3), and the transmission filling layer (5) is arranged between the assembly surface and the other side surface of the second photovoltaic module (4).

4. The photodetector of claim 1, wherein, One side surface of the second photovoltaic module (4) is provided with a second light-sensing part (41), and the other side surface of the second photovoltaic module (4) faces the first photovoltaic module (3), and the transmission filling layer (5) is arranged between the assembly surface and the other side surface of the second photovoltaic module (4).

5. The photodetector according to claim 3 or 4, c h a r a c t e r i z e d in that The assembly surface is further provided with a first wiring part (30), and the first wiring part (30) and the first light-sensing part (31) are respectively located at two ends of the assembly surface and adjacent to each other. The other side surface of the second photovoltaic module (4) is further provided with a second wiring part (40), and the second wiring part (40) and the second light-sensing part (41) are respectively located at two ends of the second photovoltaic module (4) and adjacent to each other. The first light-sensing part (31) and the second light-sensing part (41) are of the same shape and coincide with each other in a direction perpendicular to the first photovoltaic module (3), and the first wiring part (30) and the second wiring part (40) are staggered with each other in a direction perpendicular to the first photovoltaic module (3).

6. The photodetector according to any one of claims 1 to 4, wherein, The photovoltaic detector further comprises a tube base (1) and a tube cap (2), the tube cap (2) is arranged on the tube base (1), and a cavity is formed between the tube base (1) and the tube cap (2), and the tube cap (2) is provided with an opening (20) for external light to enter the cavity. The first photovoltaic module (3) and the second photovoltaic module (4) are arranged in the cavity.

7. The photodetector of claim 6, wherein, The tube base (1) is formed with a mounting plane (10) located in the cavity, and the first photovoltaic module (3) is arranged on the mounting plane (10).

8. The photodetector of claim 6, wherein, The tube base (1) is provided with a support, the first photovoltaic module (3) is fixedly arranged on the support (100), and the second photovoltaic module (4) is located on a side of the first photovoltaic module (3) away from the support (100).

9. The photodetector of claim 8, wherein, The photoelectric detector further comprises an auxiliary wiring part (200), the support (100) comprises a photoelectric module bearing part (110) and an electrical connector bearing part (120) located on one side of the photoelectric module bearing part (110), the auxiliary wiring part (200) is arranged on the electrical connector bearing part (120), the first photoelectric module (3) is arranged on the photoelectric module bearing part (110), the second photoelectric module (4) is electrically connected with the auxiliary wiring part (200), and the first wiring part (30) of the first photoelectric module (3) is located on the side of the first photoelectric module (3) away from the photoelectric module bearing part (110), and the first wiring part (30) of the first photoelectric module (3) exceeds the coverage range of the second photoelectric module (4).

10. The photodetector of claim 7, wherein, The mounting plane (10) is provided with a first wiring column (11) and a second wiring column (12), the height size of the first wiring column (11) is smaller than the height size of the second wiring column (12), the first photoelectric module (3) is connected with the first wiring column (11) by the first wiring part (30), and the second photoelectric module (4) is connected with the second wiring column (12) by the second wiring part (40).

11. The photodetector of claim 10, wherein, The height size of the first wiring column (11) is selected to be between 450μm and 550μm, and the horizontal height of the end surface of the first wiring column (11) is lower than the horizontal height of the mounting plane; the height size of the second wiring column (12) is selected to be between 750μm and 850μm, and the horizontal height of the end surface of the second wiring column (12) is lower than the horizontal height of the side surface of the second photoelectric module (4) away from the mounting plane.

12. The photodetector of claim 7, wherein, The mounting plane (10) is provided with a first mark for guiding the assembly direction of the first photoelectric module (3), and the first photoelectric module (3) is provided with a second mark for guiding the assembly direction of the second photoelectric module (4).

13. The photodetector according to any one of claims 1 to 4, wherein, The thickness size of the first photoelectric module (3) is selected to be between 650μm and 750μm, the thickness size of the second photoelectric module (4) is selected to be between 250μm and 350μm, and the thickness size of the transmission filling layer (5) is selected to be between 250nm and 350nm.

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