Power consumption detection system and method for semiconductor chilling plate
By integrating probes and clamping probes, the structure of the TEC power consumption detection equipment is simplified, solving the problems of complexity, high cost and low efficiency of existing equipment, and achieving high efficiency, low cost and accurate detection results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-19
- Publication Date
- 2026-04-03
AI Technical Summary
Existing TEC power consumption testing equipment is complex in structure, expensive, occupies a large space, and has low testing efficiency, which cannot meet the TEC's needs for accurate, efficient and low-cost testing.
The upper detection component, which integrates positive and negative power probes and is combined with a clamping probe structure, simplifies the design of the detection device, reduces the number of probe platforms, and achieves precise docking and thermal contact of the probes through a moving module, eliminating the need for a separate pressure device.
This technology simplifies the structure, reduces costs and shrinks the space required for TEC power consumption detection, improves detection efficiency and accuracy, and meets the high-efficiency, low-cost detection needs of TEC.
Smart Images
Figure CN121784495A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor cooling chip testing technology, and in particular to a power consumption testing system and method for semiconductor cooling chips. Background Technology
[0002] Thermoelectric coolers (TECs) have become core components in fields such as temperature control for electronic equipment, refrigeration for medical instruments, and thermal management for precision instruments due to their advantages such as small size, fast response speed, high temperature control accuracy, and absence of mechanical transmission parts. Power consumption, as a key performance indicator of TECs, directly determines their energy efficiency rating, heat dissipation capacity, and lifespan. Accurately measuring the power consumption parameters of TECs is a crucial step in ensuring product quality and application reliability.
[0003] Currently, existing dedicated equipment for TEC power consumption detection has the following two main drawbacks: First, existing TEC power consumption testing devices generally adopt a "dual-probe platform" design: because the TEC needs to distinguish between positive and negative power supplies, two independent probe platforms are required, each corresponding to one of the TEC's positive and negative pins. This design not only increases the structural complexity of the equipment and the difficulty of debugging the probe platforms, but also significantly increases the production cost of the equipment. In addition, the dual-probe platform occupies a large space, which is not conducive to the development of compact devices.
[0004] Secondly, to ensure good thermal contact between the TEC and the test platform, existing testing devices generally use a copper block as a weight: a special copper block needs to be placed on top of the TEC, and the weight of the copper block ensures that the TEC and the heat-conducting surface of the test platform are tightly bonded. This method generally requires a separate weight device, which further increases the overall size and structural complexity of the equipment, while also prolonging the testing process and reducing testing efficiency.
[0005] In summary, existing TEC power consumption testing equipment can no longer meet the requirements for accurate, efficient, and low-cost TEC testing. With the rapid growth of the TEC market demand, developing a power consumption testing device with a simplified structure and no need for additional weight devices has become an urgent need to solve industry pain points and promote the industrialization of TEC. Summary of the Invention
[0006] The purpose of this invention is to provide a power consumption detection system and method for semiconductor refrigeration chips (TECs), which is beneficial to meet the requirements of accurate, efficient and low-cost detection of TECs. Moreover, the system has a simple and reasonable structure, is convenient and quick to use, and can effectively overcome the shortcomings of the prior art.
[0007] To achieve this objective, the present invention adopts the following technical solution: A power consumption detection system for a semiconductor cooling chip includes a vacuum drying oven and a detection device, wherein the detection device is installed inside the vacuum drying oven; The detection device includes a support column, an upper detection component, a heat load module, a heat-conducting block, and a lower detection component; the upper detection component and the lower detection component are installed on the same side of the support column from top to bottom, and both the upper detection component and the lower detection component can move relative to the support column along the z-axis; the heat-conducting block is connected to the detection end of the temperature detector; The lower detection component includes a mounting base, a heat-conducting base, and a constant temperature platform. The heat-conducting base and the constant temperature platform are both mounted on the mounting base, and the heat-conducting base is located on top of the constant temperature platform. The heat-conducting base is used to place the semiconductor cooling chip to be tested, and the heat-conducting base is connected to the detection end of another temperature detector. The upper detection component includes a mounting bracket, a positive power probe, a negative power probe, and a clamping probe. The positive power probe, the negative power probe, and the clamping probe are all mounted on the mounting bracket. The positive power probe and the negative power probe are used together to supply power to the thermoelectric cooler to be tested. The clamping probe is used to press the heat-conducting block against the top of the thermoelectric cooler to be tested, or to press the heat load module and the heat-conducting block against the top of the thermoelectric cooler to be tested in sequence.
[0008] Preferably, the upper detection component further includes a y-axis moving module and an x-axis moving module; the y-axis moving module and the x-axis moving module are installed between the support column and the mounting bracket, and the support column, the y-axis moving module, the x-axis moving module and the mounting bracket are connected in sequence; The mounting bracket moves relative to the supporting column along the y-axis direction via the y-axis moving module. The mounting bracket moves relative to the supporting column along the x-axis direction via the x-axis moving module.
[0009] Preferably, the clamping probe includes a probe body, a limiting ring, and an elastic element; The probe body passes through and is installed inside the mounting bracket, and the probe body moves relative to the mounting bracket along the z-axis. The limiting ring is fitted onto the upper part of the probe body and disposed on the top of the mounting bracket. The limiting ring is used to limit the lower limit of the travel of the probe body. The elastic element is fitted onto the lower part of the probe body and abuts against the end of the mounting bracket and the probe body. The upward movement of the probe body causes the elastic element to compress.
[0010] Preferably, the end of the probe body is a tip.
[0011] Preferably, the mounting bracket has multiple mounting holes for mounting the positive power probe and the negative power probe, and the positive power probe and the negative power probe are detachably mounted in any two of the mounting holes.
[0012] Preferably, the upper surface of the heat-conducting base is provided with a recessed placement groove, and the placement groove is used for the semiconductor cooling chip to be tested.
[0013] Preferably, both the heat-conducting block and the heat-conducting base are made of copper.
[0014] Preferably, both the heat-conducting block and the heat-conducting base have receiving holes on their sidewalls, and the receiving holes are used to accommodate the detection end of the temperature detector.
[0015] Preferably, the constant temperature platform has an internal cavity for storing liquid media.
[0016] A method for detecting the power consumption of a semiconductor refrigeration chip, using the aforementioned power consumption detection system for the semiconductor refrigeration chip, includes an idle detection stage and a load detection stage; The no-load detection phase includes the following steps: (1) Place the semiconductor refrigeration chip to be tested on top of the heat-conducting base, and then place the heat-conducting block on top of the semiconductor refrigeration chip; (2) Adjust the position of the upper detection component and the lower detection component relative to the support column so that the positive power probe and the negative power probe are aligned with and contact the positive and negative electrodes of the semiconductor cooling chip respectively, and use the pressing probe to press the heat-conducting block against the semiconductor cooling chip. (3) Place the detection device inside the vacuum drying oven, and adjust the operating parameters of the vacuum drying oven and the temperature of the constant temperature platform according to the working conditions; (4) Adjust the end face temperature of the semiconductor refrigeration chip to be tested to a preset temperature by using the positive power supply probe and the negative power supply probe, and calculate the no-load power consumption of the semiconductor refrigeration chip under this working condition. The load detection phase includes the following steps: (1) Place the semiconductor refrigeration chip to be tested on the top of the heat-conducting base 52, then place the heat-conducting block on the top of the semiconductor refrigeration chip, and then place the heat load module on the top of the heat-conducting block; (2) Adjust the position of the upper detection component and the lower detection component relative to the support column so that the positive power probe and the negative power probe are aligned with and contact the positive and negative electrodes of the semiconductor cooling chip respectively, and use the pressing probe to press the heat load module and the heat conduction block onto the semiconductor cooling chip in sequence. (3) Place the detection device inside the vacuum drying oven, and adjust the operating parameters of the vacuum drying oven, the temperature of the constant temperature platform and the power supply parameters of the heat load module according to the working conditions; (4) Adjust the end face temperature of the semiconductor cooling chip to be tested to a preset temperature by using the positive power probe 22 and the negative power probe 23, and calculate the load power consumption of the semiconductor cooling chip under this working condition.
[0017] The technical solution provided by this invention may include the following beneficial effects: 1. This solution integrates the positive and negative power supply probes used to power the semiconductor cooling chip into the upper detection component, replacing the existing "dual probe platform" design, which greatly simplifies the structure of the power consumption detection system and reduces the space occupied by the power consumption detection system.
[0018] 2. To ensure good thermal contact between the thermoelectric cooler and the heat-conducting block and heat-conducting base, this solution also integrates a clamping probe in the upper detection component. By moving the upper detection component downward relative to the support column, and by having the end of the clamping probe act on the upper surface of the heat load module or the upper surface of the heat-conducting block, good thermal contact between the heat-conducting block, the thermoelectric cooler, and the heat-conducting base can be achieved. Compared with the independent pressure device in the prior art, the clamping probe structure of this solution is simpler, lower in cost, and occupies very little space. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the working state of the detection device in the load detection stage of the present invention.
[0020] Figure 2 yes Figure 1 Enlarged view of point A in the middle.
[0021] Figure 3 This is a schematic diagram of the working state of the detection device in the load detection stage of the present invention.
[0022] Figure 4 This is a partial structural schematic diagram of the detection device in this invention.
[0023] Figure 5 This is a partial structural schematic diagram of the detection device in this invention.
[0024] The components include: support column 1, upper detection component 2, mounting bracket 21, mounting hole 211, positive power probe 22, negative power probe 23, clamping probe 24, probe body 241, limiting ring 242, elastic element 243, y-axis moving module 25, x-axis moving module 26, heat load module 3, heat conduction block 4, lower detection component 5, mounting base 51, heat conduction base 52, placement groove 521, constant temperature platform 53, and semiconductor cooling chip 6. Detailed Implementation
[0025] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0026] This technical solution provides a power consumption detection system for a semiconductor cooling chip, including a vacuum drying oven and a detection device, wherein the detection device is installed inside the vacuum drying oven; The detection device includes a support column 1, an upper detection component 2, a heat load module 3, a heat-conducting block 4, and a lower detection component 5; the upper detection component 2 and the lower detection component 5 are installed on the same side of the support column 1 from top to bottom, and both the upper detection component 2 and the lower detection component 5 are movable relative to the support column 1 along the z-axis; the heat-conducting block 4 is connected to the detection end of the temperature detector; The lower detection component 5 includes a mounting base 51, a heat-conducting base 52, and a constant temperature platform 53. The heat-conducting base 52 and the constant temperature platform 53 are both mounted on the mounting base 51, and the heat-conducting base 52 is located on top of the constant temperature platform 53. The heat-conducting base 52 is used to place the semiconductor cooling chip 6 to be tested, and the heat-conducting base 52 is connected to the detection end of another temperature detector. The upper detection component 2 includes a mounting bracket 21, a positive power probe 22, a negative power probe 23, and a clamping probe 24. The positive power probe 22, the negative power probe 23, and the clamping probe 24 are all mounted on the mounting bracket 21. The positive power probe 22 and the negative power probe 23 are used together to supply power to the thermoelectric cooler 6 to be tested. The clamping probe 24 is used to press the heat-conducting block 4 against the top of the thermoelectric cooler 6 to be tested, or to press the heat load module 3 and the heat-conducting block 4 against the top of the thermoelectric cooler 6 to be tested in sequence.
[0027] To meet the requirements of accurate, efficient, and low-cost TEC testing, this technical solution proposes a power consumption testing system for semiconductor refrigeration chips, including a vacuum drying oven (not shown in the figure) and a testing device. The vacuum drying oven can simulate the working state of the TEC under different temperature conditions in a vacuum environment, thereby improving the testing accuracy of the TEC. In addition, the constant temperature platform 53 in the testing device can also adjust the testing environment temperature of the semiconductor refrigeration chip 6 to further improve the testing accuracy of the TEC.
[0028] Furthermore, this solution optimizes the structure of the detection device in the power consumption detection system, making it more conducive to efficient and low-cost TEC detection, such as... Figure 1-5As shown in the diagram. Specifically, this solution integrates the positive power supply probe 22 and the negative power supply probe 23, used to power the TEC (i.e., the thermoelectric cooler 6), into the upper detection component 2, replacing the existing "dual probe platform" design. This greatly simplifies the structure of the power consumption detection system and reduces its footprint. It should be noted that the tips of the positive power supply probe 22 and the negative power supply probe 23 are connected to the positive and negative terminals of the existing power supply (not shown in the diagram), respectively. This allows for rapid power supply to the thermoelectric cooler 6 when the positive power supply probe 22 and the negative power supply probe 23 contact the positive and negative terminals of the thermoelectric cooler 6 to be tested, respectively.
[0029] Furthermore, to ensure good thermal contact between the TEC and the heat-conducting block 4 and the heat-conducting base 52, this solution also integrates a clamping probe 24 in the upper detection component 2. By moving the upper detection component 2 downward relative to the support column 1, and by having the end of the clamping probe 24 act on the upper surface of the heat load module 3 or the upper surface of the heat-conducting block 4, good thermal contact between the heat-conducting block 4, the semiconductor cooling chip 6 and the heat-conducting base 52 can be achieved. Compared with the independent pressure device in the prior art, the clamping probe 24 in this solution has a simpler structure, lower cost and occupies very little space.
[0030] It should be noted that the thermal load module 3 is used to perform power consumption testing on the semiconductor cooling chip 6 under load conditions. Different thermal load power can be set by adjusting the power supply parameters (such as voltage and current) of this module. In a specific embodiment, the thermal load module 3 of this solution is a ceramic heating element.
[0031] Furthermore, the upper detection component 2 also includes a y-axis moving module 25 and an x-axis moving module 26; the y-axis moving module 25 and the x-axis moving module 26 are installed between the support column 1 and the mounting bracket 21, and the support column 1, the y-axis moving module 25, the x-axis moving module 26 and the mounting bracket 21 are connected in sequence; The mounting bracket 21 moves relative to the support column 1 along the y-axis direction via the y-axis moving module 25. The mounting bracket 21 moves relative to the support column 1 along the x-axis direction via the x-axis moving module 26.
[0032] In a preferred embodiment of this technical solution, the solution further adds a y-axis moving module 25 and an x-axis moving module 26 to the upper detection component 2, so that the mounting bracket 21 can move in the x, y and z directions relative to the supporting column 6, which is more conducive to the alignment of the positive power probe 22, the negative power probe 23 and the clamping probe 24 with the TEC to be tested.
[0033] It should be noted that the y-axis moving module 25 and the x-axis moving module 26 in this solution are conventional moving modules in the prior art, and their structures will not be described in detail here.
[0034] To further explain, the clamping probe 24 includes a probe body 241, a limiting ring 242, and an elastic element 243; The probe body 241 passes through and is installed inside the mounting bracket 21, and the probe body 241 moves relative to the mounting bracket 21 along the z-axis. The limiting ring 242 is fitted onto the upper part of the probe body 241 and disposed on the top of the mounting bracket 21. The limiting ring 242 is used to limit the lower limit of the travel of the probe body 241. The elastic element 243 is fitted onto the lower part of the probe body 241 and abuts against the end of the mounting bracket 21 and the probe body 241. The upward movement of the probe body 241 causes the elastic element 243 to compress.
[0035] In another preferred embodiment of this technical solution, such as Figure 4-5 As shown, the clamping probe 24 includes a probe body 241, a limiting ring 242, and an elastic element 243. When the upper detection component 2 moves downward and the end of the clamping probe 24 acts on the upper surface of the heat load module 3 or the upper surface of the heat conduction block 4, the movable design of the clamping probe 24 can prevent rigid contact between the clamping probe 24 and the heat load module 3 or the heat conduction block 4, thereby preventing damage to the heat load module 3 or the heat conduction block 4. At the same time, the design of the elastic element 243 can also ensure the clamping effect of the clamping probe 24 on the heat conduction block 4, the semiconductor cooling chip 6, and the heat conduction seat 52. When the upper detection component 2 moves upward and the clamping effect of the clamping probe 24 is removed, the probe body 241 can be reset under the action of the elastic element 243. At the same time, under the restriction of the limiting ring 242, it can prevent the force of the elastic element 243 from being too large, causing the probe body 241 to detach from the mounting bracket 21, so as to achieve stable installation of the probe body 241.
[0036] Furthermore, the end of the probe body 241 is a pointed tip. This effectively prevents the probe body 241 from conducting away heat, further ensuring the accuracy of power consumption detection.
[0037] Furthermore, the mounting bracket 21 has multiple mounting holes 211 for mounting the positive power probe 22 and the negative power probe 23, and the positive power probe 22 and the negative power probe 23 can be detachably mounted in any two of the mounting holes 211. Figure 2As shown, the design of multiple mounting holes 211 allows the spacing between the positive power probe 22 and the negative power probe 23 to match more TECs of different specifications, thereby improving the versatility of the power consumption detection system.
[0038] Furthermore, the upper surface of the heat-conducting base 52 is provided with a recessed placement groove 521, which is used for the semiconductor cooling chip 6 to be tested. This facilitates the quick positioning and installation of the semiconductor cooling chip 6 on the top of the heat-conducting base 52, thereby improving testing efficiency.
[0039] To further clarify, both the heat-conducting block 4 and the heat-conducting base 52 are made of copper.
[0040] Furthermore, both the heat-conducting block 4 and the heat-conducting base 52 have receiving holes on their sidewalls, and these receiving holes are used to accommodate the detection end of the temperature detector. This effectively ensures the accuracy of temperature detection during power consumption detection.
[0041] To further explain, the constant temperature platform 53 has an internal cavity, and the cavity is used to store liquid media.
[0042] In one specific embodiment, the constant temperature platform 53 has an internal cavity for storing liquid media, such as coolant or hot water, so that the constant temperature platform 53 maintains a certain temperature and can regulate the detection environment temperature of the semiconductor cooling chip 6.
[0043] Furthermore, the cavity can be connected to an external circulation device through a pipe to ensure that the temperature of the liquid medium inside the cavity remains constant, thus achieving the purpose of constant temperature.
[0044] A method for detecting the power consumption of a semiconductor refrigeration chip, using the aforementioned power consumption detection system for the semiconductor refrigeration chip, includes an idle detection stage and a load detection stage; The no-load detection phase includes the following steps: (1) Place the semiconductor cooling chip 6 to be tested on the top of the heat-conducting base 52, and then place the heat-conducting block 4 on the top of the semiconductor cooling chip 6; (2) Adjust the position of the upper detection component 2 and the lower detection component 5 relative to the support column 1 so that the positive power probe 22 and the negative power probe 23 are aligned with and contact the positive and negative electrodes of the semiconductor cooling chip 6 respectively, and use the pressing probe 24 to press the heat-conducting block 4 against the semiconductor cooling chip 6. (3) Place the detection device inside the vacuum drying oven, and adjust the operating parameters of the vacuum drying oven and the temperature of the constant temperature platform 53 according to the working conditions; (4) Adjust the end face temperature of the semiconductor cooling chip 6 to be tested to a preset temperature by using the positive power supply probe 22 and the negative power supply probe 23, and calculate the no-load power consumption of the semiconductor cooling chip 6 under this working condition. The load detection phase includes the following steps: (1) Place the semiconductor cooling chip 6 to be tested on the top of the heat-conducting base 52, then place the heat-conducting block 4 on the top of the semiconductor cooling chip 6, and then place the heat load module 3 on the top of the heat-conducting block 4. (2) Adjust the position of the upper detection component 2 and the lower detection component 5 relative to the support column 1 so that the positive power probe 22 and the negative power probe 23 are aligned with and contact the positive and negative electrodes of the semiconductor cooling chip 6 respectively, and use the pressing probe 24 to press the heat load module 3 and the heat conduction block 4 onto the semiconductor cooling chip 6 in sequence. (3) Place the detection device inside the vacuum drying oven, and adjust the operating parameters of the vacuum drying oven, the temperature of the constant temperature platform 53 and the power supply parameters of the heat load module 3 according to the working conditions; (4) Adjust the end face temperature of the semiconductor cooling chip 6 to be tested to a preset temperature by using the positive power supply probe 22 and the negative power supply probe 23, and calculate the load power consumption of the semiconductor cooling chip 6 under this working condition.
[0045] This technical solution also proposes a power consumption detection method for a semiconductor refrigeration chip using the aforementioned power consumption detection system. Furthermore, by utilizing this power consumption detection system, the detection method of this solution can efficiently detect the power consumption of the semiconductor refrigeration chip 6 under two typical operating conditions: no-load and load, fully meeting the speed and accuracy requirements of TEC detection.
[0046] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0047] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.
[0048] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.
[0049] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.
[0050] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.
[0051] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.
[0052] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the invention and should not be construed as limiting the scope of protection of the invention in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of the invention without inventive effort, and these embodiments will all fall within the scope of protection of the present invention.
Claims
1. A power consumption detection system for a semiconductor cooling chip, characterized in that: It includes a vacuum drying oven and a testing device, wherein the testing device is installed inside the vacuum drying oven; The detection device includes a support column, an upper detection component, a heat load module, a heat-conducting block, and a lower detection component; the upper detection component and the lower detection component are installed on the same side of the support column from top to bottom, and both the upper detection component and the lower detection component can move relative to the support column along the z-axis; the heat-conducting block is connected to the detection end of the temperature detector; The lower detection component includes a mounting base, a heat-conducting base, and a constant temperature platform. The heat-conducting base and the constant temperature platform are both mounted on the mounting base, and the heat-conducting base is located on top of the constant temperature platform. The heat-conducting base is used to place the semiconductor cooling chip to be tested, and the heat-conducting base is connected to the detection end of another temperature detector. The upper detection component includes a mounting bracket, a positive power probe, a negative power probe, and a clamping probe. The positive power probe, the negative power probe, and the clamping probe are all mounted on the mounting bracket. The positive power probe and the negative power probe are used together to supply power to the thermoelectric cooler to be tested. The clamping probe is used to press the heat-conducting block against the top of the thermoelectric cooler to be tested, or to press the heat load module and the heat-conducting block against the top of the thermoelectric cooler to be tested in sequence.
2. The power consumption detection system for a semiconductor cooling chip according to claim 1, characterized in that: The upper detection component further includes a y-axis moving module and an x-axis moving module; the y-axis moving module and the x-axis moving module are installed between the support column and the mounting bracket, and the support column, the y-axis moving module, the x-axis moving module and the mounting bracket are connected in sequence; The mounting bracket moves relative to the supporting column along the y-axis direction via the y-axis moving module. The mounting bracket moves relative to the supporting column along the x-axis direction via the x-axis moving module.
3. The power consumption detection system for a semiconductor cooling chip according to claim 1, characterized in that: The clamping probe includes a probe body, a limiting ring, and an elastic element; The probe body passes through and is installed inside the mounting bracket, and the probe body moves relative to the mounting bracket along the z-axis. The limiting ring is fitted onto the upper part of the probe body and disposed on the top of the mounting bracket. The limiting ring is used to limit the lower limit of the travel of the probe body. The elastic element is fitted onto the lower part of the probe body and abuts against the end of the mounting bracket and the probe body. The upward movement of the probe body causes the elastic element to compress.
4. The power consumption detection system for a semiconductor cooling chip according to claim 1, characterized in that: The probe body has a pointed tip at its end.
5. The power consumption detection system for a semiconductor cooling chip according to claim 1, characterized in that: The mounting bracket has multiple mounting holes for mounting the positive power probe and the negative power probe, and the positive power probe and the negative power probe can be detachably mounted in any two of the mounting holes.
6. The power consumption detection system for a semiconductor cooling chip according to claim 1, characterized in that: The upper surface of the heat-conducting base is provided with a recessed placement groove, and the placement groove is used for the semiconductor cooling chip to be tested.
7. The power consumption detection system for a semiconductor cooling chip according to claim 1, characterized in that: Both the heat-conducting block and the heat-conducting base are made of copper.
8. The power consumption detection system for a semiconductor cooling chip according to claim 1, characterized in that: Both the heat-conducting block and the heat-conducting base have receiving holes on their sidewalls, and the receiving holes are used to accommodate the detection end of the temperature detector.
9. The power consumption detection system for a semiconductor cooling chip according to claim 1, characterized in that: The constant temperature platform has an internal cavity for storing liquid media.
10. A method for detecting the power consumption of a semiconductor cooling chip, characterized in that, The power consumption detection system using the semiconductor cooling chip according to any one of claims 1 to 9 includes an idle detection stage and a load detection stage. The no-load detection phase includes the following steps: (1) Place the semiconductor refrigeration chip to be tested on top of the heat-conducting base, and then place the heat-conducting block on top of the semiconductor refrigeration chip; (2) Adjust the position of the upper detection component and the lower detection component relative to the support column so that the positive power probe and the negative power probe are aligned with and contact the positive and negative electrodes of the semiconductor cooling chip respectively, and use the pressing probe to press the heat-conducting block against the semiconductor cooling chip. (3) Place the detection device inside the vacuum drying oven, and adjust the operating parameters of the vacuum drying oven and the temperature of the constant temperature platform according to the working conditions; (4) Adjust the end face temperature of the semiconductor refrigeration chip to be tested to a preset temperature by using the positive power supply probe and the negative power supply probe, and calculate the no-load power consumption of the semiconductor refrigeration chip under this working condition. The load detection phase includes the following steps: (1) Place the semiconductor refrigeration chip to be tested on the top of the heat-conducting base 52, then place the heat-conducting block on the top of the semiconductor refrigeration chip, and then place the heat load module on the top of the heat-conducting block; (2) Adjust the position of the upper detection component and the lower detection component relative to the support column so that the positive power probe and the negative power probe are aligned with and contact the positive and negative electrodes of the semiconductor cooling chip respectively, and use the pressing probe to press the heat load module and the heat conduction block onto the semiconductor cooling chip in sequence. (3) Place the detection device inside the vacuum drying oven, and adjust the operating parameters of the vacuum drying oven, the temperature of the constant temperature platform and the power supply parameters of the heat load module according to the working conditions; (4) Adjust the end face temperature of the semiconductor cooling chip to be tested to a preset temperature by using the positive power probe 22 and the negative power probe 23, and calculate the load power consumption of the semiconductor cooling chip under this working condition.