Circuit board, circuit board assembly and manufacturing method of circuit board assembly
By designing staggered conductive pillars and non-coplanar pad structures on the insulating substrate of the circuit board, the problem of inconsistent copper pillar lengths during electroplating is solved, improving the electrical connection reliability and alignment accuracy of electronic components and reducing the risk of poor contact and short circuit.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2026-04-03
Smart Images
Figure CN121793239A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a circuit board, a circuit board assembly, and a method for manufacturing the circuit board assembly. Background Technology
[0002] Existing electronic components are typically mounted on circuit boards using multiple copper pillars, which are usually formed by electroplating. Due to the potential for uneven current density during electroplating, the lengths of these copper pillars may vary significantly. As a result, after the electronic component is mounted on the circuit board, some copper pillars may not be electrically connected to the board's pads, causing the electronic component to malfunction. Summary of the Invention
[0003] At least one embodiment of the present invention provides a circuit board and a circuit board assembly. Compared with conventional circuit boards and circuit board assemblies, the aforementioned circuit board and circuit board assembly improves alignment accuracy and reduces the occurrence of poor contact.
[0004] At least one embodiment of the present invention provides a method for manufacturing the above-described circuit board assembly.
[0005] According to at least one embodiment of the present invention, a circuit board is provided, comprising a circuit board substrate, an insulating substrate, a first conductive post, a second conductive post, and pads. The insulating substrate is disposed on the circuit board substrate and has a first surface, a second surface, and a groove located on the first surface, wherein the first surface is opposite to the second surface, and the circuit board substrate is disposed on the second surface. The first conductive post is disposed in the insulating substrate and is not located within any groove. The second conductive post is disposed in the insulating substrate and is respectively located within a groove, wherein the length of the first conductive post is greater than the length of the second conductive post. Pads are respectively disposed on the first conductive post and the second conductive post, wherein the plurality of top surfaces of the pads are not coplanar.
[0006] In at least one embodiment of the present invention, each of the grooves has a groove wall, and the roughness of the groove wall is between 0.1 micrometers and 0.4 micrometers.
[0007] In at least one embodiment of the present invention, the aforementioned pad is divided into a first pad and a second pad. The first pad has a first top surface and is disposed on a first conductive post. The second pad has a second top surface and is disposed on a second conductive post, wherein the height difference between the first top surface and the second top surface is between 30 micrometers and 50 micrometers.
[0008] In at least one embodiment of the present invention, the first conductive post and the second conductive post are arranged alternately along one direction.
[0009] In at least one embodiment of the present invention, the width of the groove decreases from the first surface to the second surface.
[0010] According to at least one embodiment of the present invention, a circuit board assembly is provided, including a circuit board and electronic components. The circuit board includes a circuit substrate, an insulating substrate, a first conductive post, a second conductive post, and pads. The electronic components are disposed on the circuit board and include a body and conductive blocks. The insulating substrate is disposed on the circuit substrate and has a first surface, a second surface, and grooves, wherein the first surface is opposite to the second surface, and the circuit substrate is disposed on the second surface. The first conductive post is disposed in the insulating substrate and is not located within any groove. The second conductive post is disposed in the insulating substrate and is located within each groove, wherein the length of the first conductive post is greater than the length of the second conductive post. Pads are respectively disposed on the first conductive post and the second conductive post, wherein the top surfaces of these pads are not coplanar. The body has a bottom surface. Conductive blocks are disposed on the bottom surface of the body and electrically connected to the body, wherein the conductive blocks are respectively disposed within grooves and electrically connected to the pads within the grooves.
[0011] At least one embodiment of the present invention provides a method for manufacturing a circuit board assembly, comprising providing an initial insulating substrate having a first surface, a second surface opposite to the first surface, and a groove located on the first surface. A first through-hole is formed on the first surface of the initial insulating substrate. A second through-hole is formed within the groove of the initial insulating substrate, wherein the insulating substrate is formed after forming the first and second through-holes. A first conductive post is formed within the first through-hole. A second conductive post is formed within the second through-hole, wherein the second conductive post does not fill the groove. Pads are formed on the first and second conductive posts, respectively. After forming the pads, the insulating substrate is disposed on a circuit board, wherein the circuit board is disposed on the second surface. Subsequently, electronic components are mounted on the insulating substrate, wherein the insulating substrate is located between the electronic components and the circuit board.
[0012] At least one embodiment of the present invention provides a method for manufacturing a circuit board assembly, which further includes polishing the groove wall of each groove.
[0013] At least one embodiment of the present invention provides a method for manufacturing a circuit board assembly, wherein the steps of forming the electronic component include providing a body having a bottom surface, and disposing a conductive block on the bottom surface of the body, wherein the conductive block is electrically connected to the body.
[0014] According to at least one embodiment of the present invention, a method for manufacturing a circuit board assembly is provided, wherein the width of the groove decreases from the first surface to the second surface.
[0015] Based on the above, in the circuit boards and circuit board assemblies disclosed in the above embodiments of the present invention, by utilizing the characteristic that the length of the first conductive post of the insulating substrate is greater than the length of the second conductive post and the groove, the top surfaces of these pads are not coplanar. Therefore, when electronic components are mounted on the circuit board, it can be ensured that the electronic components can be electrically connected to the pads of the circuit board, reducing the occurrence of poor contact and malfunction of electronic components. Attached Figure Description
[0016] To make the above and other features, advantages and embodiments of the present invention more apparent and understandable, the accompanying drawings are described in detail below:
[0017] Figure 1 This is a cross-sectional schematic diagram of a circuit board assembly according to at least one embodiment of the present invention.
[0018] Figures 2A to 2K for Figure 1 A cross-sectional schematic diagram of the manufacturing method of the circuit board assembly. Detailed Implementation
[0019] In the following text, to clearly present the technical features of the present invention, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions) in the accompanying drawings will be enlarged proportionally, and the number of some elements may be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings or the size and shape of the elements, but should cover deviations in size, shape, and both caused by actual manufacturing processes and / or tolerances. For example, a flat surface shown in the drawings may have rough and / or non-linear characteristics, and an acute angle shown in the drawings may be rounded. Therefore, the elements presented in the accompanying drawings of the present invention are primarily for illustration and are not intended to precisely depict the actual shape of the elements, nor are they intended to limit the claims of the present invention.
[0020] Secondly, the terms "approximately," "approximately," or "substantially" used in this invention not only cover explicitly stated numerical values and ranges, but also the permissible deviation range understood by those skilled in the art. This deviation range can be determined by errors generated during measurement, which may be caused by limitations of the measurement system or process conditions. Furthermore, "approximately" can indicate a deviation within one or more standard deviations of the aforementioned numerical values, such as ±30%, ±20%, ±10%, or ±5%. The acceptable deviation range or standard deviation used in this invention can be selected based on optical properties, etching properties, mechanical properties, or other properties, and is not applied to all optical properties, etching properties, mechanical properties, and other properties using only one standard deviation.
[0021] Figure 1 This is a schematic cross-sectional view of a circuit board assembly 100 according to at least one embodiment of the present invention. Please refer to... Figure 1 The circuit board assembly 100 includes a circuit board 110 and electronic components 140, wherein the electronic components 140 are disposed on the circuit board 110. Figure 1In the illustrated embodiment, the circuit board assembly 100 further includes a plurality of solders 145, and the electronic components 140 are mounted on the circuit board 110 using these solders 145, wherein the solders 145 are, for example, solder balls.
[0022] The circuit board 110 includes a circuit board 120, an insulating substrate 130, a plurality of first conductive posts 134, a plurality of second conductive posts 135, and a plurality of pads, with the insulating substrate 130 located between the electronic component 140 and the circuit board 120. These pads can be further divided into a plurality of first pads 136 and a plurality of second pads 137, wherein the first pads 136 are disposed on top of the first conductive posts 134, and the second pads 137 are disposed on top of the second conductive posts 135. In other words, these pads (including the first pads 136 and the second pads 137) are respectively disposed on the first conductive posts 134 and the second conductive posts 135, and are electrically connected to the first conductive posts 134 and the second conductive posts 135.
[0023] exist Figure 1 In the illustrated embodiment, the first conductive posts 134 and the second conductive posts 135 may be arranged in an alternating pattern along a first direction 150, wherein Figure 1 The first direction 150 shown can be a horizontal direction. The circuit board 120 has a circuit structure 122 and a third surface 124, wherein the circuit structure 122 includes at least one circuit layer (not shown) and at least one conductive blind via (not shown). Figure 1 Three circuit layers and eight conductive blind vias are depicted. In addition, the circuit structure 122 of the circuit board 120 electrically connects the first conductive pillars 134 and the second conductive pillars 135, so the first pad 136 and the second pad 137 can be electrically connected to the circuit board 120 via the first conductive pillars 134 and the second conductive pillars 135.
[0024] An insulating substrate 130 is disposed on a circuit board 120 and has a first surface 131, a second surface 132, and a groove 133 located on the first surface 131, wherein the first surface 131 is opposite to the second surface 132, and the circuit board 120 is disposed on the second surface 132. Furthermore, the insulating substrate 130 may be a glass plate. First conductive posts 134 and second conductive posts 135 are all disposed in the insulating substrate 130, wherein the first conductive posts 134 are not located within any groove 133, while the second conductive posts 135 are respectively located within the grooves 133. The length of the first conductive post 134 is equivalent to the thickness of the insulating substrate 130, which is also equivalent to the distance from the first surface 131 to the second surface 132. Therefore, the first conductive post 134 extends from the first surface 131 to the second surface 132.
[0025] from Figure 1It can be seen that the length of the first conductive post 134 is greater than the length of the second conductive post 135, and both the first conductive post 134 and the second conductive post 135 extend from the second surface 132. Therefore, the second conductive post 135 does not protrude from the first surface 131, and the top surfaces of these pads (including the first pad 136 and the second pad 137) are not coplanar. These first pads 136 each have multiple first top surfaces 138, and these second pads 137 each have multiple second top surfaces 139, wherein the first top surfaces 138 and the second top surfaces 139 are not coplanar.
[0026] exist Figure 1 In the illustrated embodiment, the height difference between the first top surface 138 and the second top surface 139 can be between 30 micrometers and 50 micrometers, where this height difference refers to the distance between the first top surface 138 and the second top surface 139 along the second direction 152, and the second direction 152 is perpendicular to the first direction 150. Additionally, in Figure 1 In the middle, the second direction 152 can be the vertical direction.
[0027] Electronic component 140 includes a body 141 and conductive blocks 144, wherein the body 141 may be a wafer or a die and has a plurality of connection pads 143 and a bottom surface 142. The connection pads 143 are located on the bottom surface 142 and exposed thereon, while the conductive blocks 144 are on the bottom surface 142 of the body 141 and are electrically connected to the body 141. Furthermore, some of the connection pads 143 are connected to the conductive blocks 144, while other connection pads 143 are not connected to any conductive blocks 144.
[0028] These conductive blocks 144 can be aligned with the grooves 133 of the circuit board 110, so that the conductive blocks 144 are respectively disposed in the grooves 133 and electrically connected to the pads (i.e., the second pads 137) in the grooves 133. Solder 145 is disposed between some of the pads 143 and the first pads 136, and between some of the conductive blocks 144 and the second pads 137, so that electronic components 140 can be mounted on the insulating substrate 130 via the solder 145 and electrically connected to the first conductive posts 134 and the second conductive posts 135. Thus, electronic components 140 can be electrically connected to the circuit structure 122 of the circuit board 120 via the solder 145, the first pads 136, the second pads 137, the first conductive posts 134, and the second conductive posts 135.
[0029] Figures 2A to 2K for Figure 1 A cross-sectional schematic diagram of the manufacturing method of the circuit board assembly 100. Please refer to... Figure 2AAn initial insulating substrate 160 is provided, having a first surface 131, a second surface 132 opposite to the first surface 131, and grooves 133 located on the first surface 131, each groove 133 having a groove wall 162. The groove wall 162 of each groove 133 can then be polished so that the roughness of the groove wall 162 is between 0.1 micrometers and 0.4 micrometers. Thus, the groove wall 162 can have a fairly smooth surface. The width of the groove 133 decreases from the first surface 131 towards the second surface 132, therefore the groove 133 has a larger width adjacent to the first surface 131, such as... Figure 2A As shown. Furthermore, the initial insulating substrate 160 can be a glass plate.
[0030] Please see Figures 2A to 2B Subsequently, a plurality of first through holes 174 are formed on the first surface 131 of the initial insulating substrate 160, and a plurality of second through holes 175 are formed in these grooves 133 respectively. The first through holes 174 and the second through holes 175 can be formed by mechanical drilling. After the first through holes 174 and the second through holes 175 are formed, the aforementioned insulating substrate 130 is formed.
[0031] Please see Figure 2C Subsequently, the insulating substrate 130 is electroplated to form a metal material 178, which covers the first surface 131 and the second surface 132 and fills the first through-holes 174, the second through-holes 175, and the grooves 133. (See also...) Figure 2D Then, two mask patterns 180 are formed on the metal material 178, wherein the insulating substrate 130 is located between the two mask patterns 180, and the mask pattern 180 can be the photoresist after development.
[0032] Please see Figure 2D and Figure 2E Then, using these masking patterns 180 as masks, the metal material 178 is etched to form a first conductive post 134 in the first through hole 174 and a second conductive post 135 in the second through hole 175. The second conductive post 135 does not fill the groove 133 and does not protrude from the first surface 131. At the same time, pads, namely the first pad 136 and the second pad 137, are formed on the first conductive post 134 and the second conductive post 135, respectively.
[0033] Please see Figure 2FAfter the pads are formed, specifically after the first pad 136 and the second pad 137 are formed, an insulating substrate 130 is disposed on the circuit substrate 120, wherein the circuit substrate 120 is disposed on the second surface 132. Subsequently, a solder resist layer 190 is formed on the first surface 131 and the third surface 124, wherein the solder resist layer 190 exposes the first pad 136, the second pad 137, and a plurality of pads 126 of the circuit structure 122.
[0034] Figures 2G to 2I for Figure 1 A cross-sectional schematic diagram of the manufacturing method of electronic components 140 in the circuit board assembly 100. Please refer to... Figure 2G and Figure 2H First, a body 141 is provided. Then, a mask pattern 181 is formed on the body 141, wherein the mask pattern 181 may be a photoresist after development. See [link to documentation]. Figure 2I Electroplating is performed using mask pattern 181 as a mask to form these conductive blocks 144. Afterwards, mask pattern 181 is removed. See [link to documentation]. Figure 2J Then, solder 145 is applied to the connecting pad 143, the conductive block 144, the first pad 136, and the second pad 137.
[0035] Please see Figure 2K Electronic component 140 is mounted on insulating substrate 130, which is located between electronic component 140 and circuit board 120. Since the width of the groove 133 decreases from the first surface 131 to the second surface 132, and the roughness of the groove wall 162 is between 0.1 micrometers and 0.4 micrometers, excess solder 145 can slide into the groove 133 to avoid short circuits. At this point, circuit board assembly 100 is essentially complete.
[0036] In summary, in the circuit board assembly 100 of at least one embodiment of the present invention, by utilizing the characteristic that the length of the first conductive post 134 of the insulating substrate 130 is greater than the length of the second conductive post 135, and the groove 133, the top surfaces (including the first top surface 138 and the second top surface 139) of the pads (including the first pad 136 and the second pad 137) are not coplanar. Therefore, when the electronic component 140 is mounted on the insulating substrate 130, the non-coplanar first pad 136, second pad 137, and groove 133 can achieve alignment, which helps to improve alignment accuracy and reduce the occurrence of poor contact. At the same time, since the length of the first conductive post 134 is greater than the length of the second conductive post 135, and the second conductive post 135 does not protrude from the first surface 131, when there is too much solder 145, it will flow back into the groove 133, which helps to avoid electrical short circuits.
[0037] While the present invention has been disclosed above with reference to various embodiments, it is not intended to limit the invention. The components of several embodiments are outlined above to facilitate a better understanding of the inventive concepts by those skilled in the art. Those skilled in the art should understand that they can design or modify other processes and structures based on the embodiments of the present invention to achieve the same purpose and / or advantages as the embodiments described herein. Those skilled in the art should also understand that such equivalent processes and structures do not depart from the spirit and scope of the present invention, and that various changes, substitutions, and replacements can be made without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.
[0038] [Symbol Explanation]
[0039] 100: Circuit board assembly
[0040] 110: Circuit board
[0041] 120: Circuit board
[0042] 122: Line Structure
[0043] 124: Third Surface
[0044] 126: Connecting pad
[0045] 130: Insulating substrate
[0046] 131: First Surface
[0047] 132: Second Surface
[0048] 133: Groove
[0049] 134: First conductive pillar
[0050] 135: Second conductive post
[0051] 136: First receiving pad
[0052] 137: Second pad
[0053] 138: First Top Surface
[0054] 139: Second Top Surface
[0055] 140: Electronic components
[0056] 141: Ontology
[0057] 142: Bottom surface
[0058] 143: Connecting pad
[0059] 144: Conductive block
[0060] 145: Solder
[0061] 150: First Direction
[0062] 152: Second Direction
[0063] 160: Initial insulating substrate
[0064] 162: Tank wall
[0065] 174: First through hole
[0066] 175: Second through hole
[0067] 178: Metallic Materials
[0068] 180, 181: Masking patterns
[0069] 190: Solder resist layer.
Claims
1. A circuit board, characterized in that, include: Circuit board; An insulating substrate is disposed on the circuit substrate and has a first surface, a second surface, and a plurality of grooves located on the first surface, wherein the first surface is opposite to the second surface, and the circuit substrate is disposed on the second surface; Multiple first conductive pillars are disposed in the insulating substrate and are not located within any of the grooves; A plurality of second conductive pillars are disposed in the insulating substrate and are respectively located in the groove, wherein the length of the first conductive pillar is greater than the length of the second conductive pillar; as well as Multiple pads are respectively disposed on the multiple first conductive posts and the multiple second conductive posts, wherein the multiple top surfaces of the multiple pads are not coplanar.
2. The circuit board according to claim 1, characterized in that, Each of the plurality of grooves has a groove wall, and the roughness of the groove wall is between 0.1 micrometers and 0.4 micrometers.
3. The circuit board according to claim 1, characterized in that, The plurality of pads are divided into a plurality of first pads and a plurality of second pads, and the plurality of first pads each have a plurality of first top surfaces and are disposed on the plurality of first conductive posts; The plurality of second pads each have a plurality of second top surfaces and are disposed on the plurality of second conductive posts, wherein the height difference between the first top surface and the second top surface is between 30 micrometers and 50 micrometers.
4. The circuit board according to claim 1, characterized in that, The plurality of first conductive pillars and the plurality of second conductive pillars are arranged alternately along one direction.
5. The circuit board according to claim 1, characterized in that, The width of the groove decreases from the first surface toward the second surface.
6. A circuit board assembly, characterized in that, include: Circuit board, including: Circuit board; An insulating substrate is disposed on the circuit substrate and has a first surface, a second surface, and a plurality of grooves located on the first surface, wherein the first surface is opposite to the second surface, and the circuit substrate is disposed on the second surface; Multiple first conductive pillars are disposed in the insulating substrate and are not located within any of the grooves; A plurality of second conductive pillars are disposed in the insulating substrate and are respectively located in the groove, wherein the length of the first conductive pillar is greater than the length of the second conductive pillar; Multiple pads are respectively disposed on the multiple first conductive posts and the multiple second conductive posts, wherein the multiple top surfaces of the multiple pads are not coplanar; Electronic components, disposed on the circuit board, include: The body has a bottom surface; Multiple conductive blocks are disposed on the bottom surface of the main body and are electrically connected to the main body. The multiple conductive blocks are respectively disposed in the multiple grooves and are electrically connected to the multiple pads in the multiple grooves.
7. A method for manufacturing a circuit board assembly, characterized in that, include: An initial insulating substrate is provided, having a first surface, a second surface opposite to the first surface, and a plurality of grooves located on the first surface; A plurality of first through holes are formed on the first surface of the initial insulating substrate; A plurality of second through holes are formed in the groove of the initial insulating substrate, wherein the insulating substrate is formed after the first through hole and the plurality of second through holes are formed; A plurality of first conductive pillars are formed within the plurality of first through holes; A plurality of second conductive posts are formed within the plurality of second through holes, wherein the second conductive posts do not fill the plurality of grooves; Multiple pads are formed on the plurality of first conductive posts and the plurality of second conductive posts, respectively; After forming multiple pads, the insulating substrate is disposed on the circuit board, wherein the circuit board is disposed on the second surface; as well as Electronic components are mounted on the insulating substrate, wherein the insulating substrate is located between the electronic components and the circuit board.
8. The method for manufacturing a circuit board assembly according to claim 7, characterized in that, Also includes: The groove walls of each of the plurality of grooves are polished.
9. The method for manufacturing a circuit board assembly according to claim 7, characterized in that, The steps for forming the electronic component include: Provides a body having a bottom surface; and Multiple conductive blocks are disposed on the bottom surface of the body, wherein the multiple conductive blocks are electrically connected to the body.
10. The method for manufacturing a circuit board assembly according to claim 7, characterized in that, The width of the groove decreases from the first surface toward the second surface.