High-speed chip mounting and welding integrated equipment in electronic component production

Abstract

The invention relates to the technical field of electronic component surface mounting and welding, in particular to high-speed surface mounting and welding integrated equipment in electronic component production, and adopts the technical scheme that the high-speed surface mounting and welding integrated equipment comprises a high-speed surface mounting machine and a welding mechanical arm, and the high-speed surface mounting machine is provided with a conveying mechanism. Through cooperation of the high-speed chip mounter, the welding mechanical arm, the lifting mechanism, the push-pull mechanism, the locking rod mechanism, the springback mechanism and the like, when the equipment is used, an electronic element body is conveyed through the conveying mechanism, then the motor is started to drive the screw rod, and the supporting sliding base and the welding mechanical arm are driven to ascend and descend in the telescopic groove. When the supporting sliding base ascends, the pushing and ejecting plate pushes the rotating supporting baffle to rotate around the hinge, the pull rope is in linkage with the locking rod mechanism for unlocking, and the springback mechanism enables the L-shaped baffle to rotate out. During descending, the third spring resets to push the top plate, the rotary supporting baffle falls back, and the L-shaped baffle is fixed by the locking rod mechanism. Extra equipment is not needed, process transfer and element displacement are reduced, the production changing time is shortened, and small-batch adaptability and flexibility are improved.

Description

Technical Field

[0001] This invention relates to the field of surface mount and soldering technology for electronic components, and in particular to a high-speed integrated surface mount and soldering equipment for electronic component production. Background Technology

[0002] In existing surface mount technology (SMT) production processes, the placement and soldering of electronic components generally adopt a functionally separate design: during production, solder paste is first applied using a solder paste printer, then a high-speed pick-and-place machine precisely places micro-components such as 0402 and 0201 components, and finally the substrate carrying the components is transferred to a reflow oven for soldering and curing. Under this process architecture, the pick-and-place machine and soldering equipment are forced to be set as independent functional units, relying on a fixed assembly line conveyor mechanism to achieve process connection; at the same time, in order to ensure the continuity of mass production, the entire system must strictly match the operating speed and production cycle of each piece of equipment, forming a highly rigid specialized production mode.

[0003] This separate production model has certain efficiency advantages in large-scale mass production scenarios, but it exposes significant flexibility shortcomings in actual production, making it difficult to adapt to the current market demand for multi-variety, small-batch orders. On the one hand, when facing small-batch, multi-batch production tasks, the start-up and debugging costs of rigid production lines are high, and the changeover cycle is long. Enterprises need to configure additional auxiliary equipment such as manual soldering stations and desktop placement machines to compensate for insufficient capacity adaptability. This not only significantly increases equipment investment, factory floor space, and human resource management costs, but also causes idle waste of large-scale production equipment. On the other hand, in the process of small-batch production, the transfer of substrates between the mounting and soldering processes needs to be completed by a conveyor mechanism. Multiple transfers not only consume time, but also easily cause displacement and skew of the mounted micro-components due to conveyor vibration, thereby affecting the soldering yield and ultimately causing problems such as extended production response cycles and low overall efficiency. Summary of the Invention

[0004] The purpose of this invention is to address the problems existing in the background art by proposing a high-speed integrated surface mount and soldering equipment for electronic component manufacturing.

[0005] The technical solution of this invention: A high-speed integrated surface mount and soldering equipment for electronic component production, comprising a high-speed surface mount machine for soldering electronic component bodies and a soldering robotic arm, further comprising: a telescopic groove, formed at one end of the high-speed surface mount machine, and having a lifting mechanism inside for driving the soldering robotic arm to move up and down; a rotating support plate rotatably connected to one end of the high-speed surface mount machine, wherein the high-speed surface mount machine has a push-pull mechanism that is linked to the lifting mechanism and causes the rotating support plate to rotate up and down; a locking rod mechanism, installed on the outer wall of the high-speed surface mount machine and linked to the rotating support plate, wherein an L-shaped baffle for fixing by a locking mechanism is rotatably connected inside the telescopic groove, and a spring-loaded mechanism for disengaging the L-shaped baffle from the telescopic groove is provided inside the telescopic groove. Optionally, the lifting mechanism includes a support slide fixedly connected to the bottom of the welding robotic arm. The support slide is slidably connected to the telescopic groove. The storage cavity has a support groove that communicates with the telescopic groove. The outer wall of the support slide is also fixedly connected to a spiral sleeve plate that is inserted into the support groove. The inner bottom wall of the support groove is fixedly connected to a motor. The output shaft of the motor is fixedly connected to a spiral rod. The spiral rod is helically inserted into the spiral sleeve plate.

[0006] Optionally, a limiting sleeve plate that locks the spiral sleeve plate is fixedly sleeved at one end of the spiral rod near the motor.

[0007] Optionally, the high-speed placement machine has a storage cavity at one end near the rotating support plate. The storage cavity has a support clamping groove that communicates with the telescopic groove. The telescopic groove, the storage cavity, and the support clamping groove are used to house a push-pull mechanism. The push-pull mechanism includes a push plate disposed in the storage cavity. The top of the push plate is fixedly connected to an upper clamping plate that is inserted into the support clamping groove. The upper clamping plate is in close contact with the outer wall of the support slide. The push plate also has an inclined abutment surface that is dislodged from the storage cavity after being abutted by the support slide. The bottom of the push plate has a lower clamping plate that is inserted into the storage cavity. The lower clamping plate is fixedly connected to a third spring. The end of the third spring away from the lower clamping plate is fixedly connected to the inner wall of the storage cavity.

[0008] Optionally, the upper and lower ends of the push plate are provided with rotating slots, and rotating rollers that abut against the rotating support plate are rotatably connected inside the rotating slots.

[0009] Optionally, a pair of support clamps that hold the push plate are fixedly connected to the inner wall of the storage cavity.

[0010] Optionally, the locking mechanism includes a sleeve fixedly connected to the outer wall of the high-speed pick and place machine. A telescopic locking rod is slidably connected inside the sleeve. A spherical locking block is fixedly connected to one end of the telescopic locking rod. A second spring is movably sleeved at the end of the telescopic locking rod near the spherical locking block. One end of the second spring is fixedly connected to the sleeve, and the other end of the second spring is fixedly connected to the spherical locking block. A protrusion is fixedly connected to the outer wall of one end of the rotating support plate. A pull rope is fixedly connected to the middle of the protrusion and the spherical locking block. A reinforcing keel that is abutted by a rotating roller is also embedded in the rotating support plate.

[0011] Optionally, the outer wall of the high-speed placement machine is fixedly connected to a support plate through which the pull rope moves, and the end of the telescopic lever away from the spherical block is provided with an arc-shaped abutment that slides toward the support plate after being pressed against by an L-shaped baffle.

[0012] Optionally, the rebound mechanism includes a limiting plate fixedly connected to the bottom of the telescopic groove. The limiting plate has multiple mounting slots arranged in a linear pattern. A first spring is fixedly connected inside each mounting slot. A telescopic stop block that abuts against an L-shaped baffle is fixedly connected to the end of the first spring away from the inner wall of the mounting slot. A limiting pull rope is fixedly connected to each telescopic stop block. The end of the limiting pull rope away from the telescopic stop block is fixedly connected to the L-shaped baffle.

[0013] Optionally, the high-speed placement machine is provided with a conveying mechanism for placing electronic components. The outer wall of the high-speed placement machine is fixedly connected with a support base that supports the rotation of the bottom of the L-shaped baffle. One end of the high-speed placement machine is provided with an inclined buffer surface that supports the rotating baffle. The end of the rotating baffle connected to the high-speed placement machine is provided with multiple hinges arranged in a linear pattern.

[0014] Compared with the prior art, this application includes at least one of the following beneficial technical effects: This invention utilizes a high-speed chip mounter, a welding robotic arm, and lifting, pushing, pulling, locking, and spring-loaded mechanisms. When using the equipment, the electronic component is conveyed via a transport mechanism, and then a motor drives a screw rod, which in turn moves the support slide and welding robotic arm up and down within a telescopic groove. When the support slide rises, the push plate pushes the rotating support plate to rotate around a hinge, the pull rope-linked locking mechanism unlocks, and the spring-loaded mechanism causes the L-shaped baffle to rotate out. When descending, a third spring resets the push plate, the rotating support plate falls back, and the locking mechanism secures the L-shaped baffle. This eliminates the need for additional equipment, reduces process transfers and component relocation, shortens changeover time, and improves adaptability and flexibility for small-batch production.

[0015] Furthermore, by using the spiral engagement of the spiral sleeve plate and the spiral rod, the limiting design of the limiting sleeve plate, the securing of the top plate by the supporting clamp, and the reinforcement of the keel to enhance the strength of the rotating support plate, the stability of equipment operation and the durability of the structure are improved; the friction between the push-pull mechanism and the rotating support plate is reduced by the rotating rollers, and the inclined buffer surface assists the rotating support plate to fall smoothly, thus optimizing the smoothness of equipment operation. Attached Figure Description

[0016] Figure 1 A schematic diagram of the first state structure of a high-speed integrated surface mount and soldering equipment for electronic component manufacturing according to the present invention is provided. Figure 2 A schematic diagram of the second state structure of a high-speed integrated surface mount and soldering equipment for electronic component manufacturing according to the present invention is provided. Figure 3 for Figure 2 Enlarged view of point A in the middle; Figure 4 A schematic diagram of the third state structure of a high-speed integrated surface mount and soldering equipment for electronic component manufacturing is provided in this invention. Figure 5 for Figure 2 A schematic diagram of the cross-sectional structure; Figure 6 for Figure 5 Enlarged view of point B in the middle; Figure 7 This is a partial structural diagram of part 5.

[0017] Reference numerals: 1. High-speed placement machine; 11. Conveyor mechanism; 12. Electronic component body; 2. Welding robotic arm; 3. Telescopic groove; 31. Support slide; 32. Spiral sleeve; 33. Support base; 34. L-shaped baffle; 4. Limiting plate; 41. Mounting groove; 42. First spring; 43. Telescopic stop; 44. Limiting pull rope; 5. Sleeve; 51. Telescopic rod; 52. Arc-shaped stop; 53. Spherical stop; 54. Second spring; 5 5. Pull rope; 56. Support plate; 6. Storage cavity; 61. Hinge; 7. Rotating support plate; 71. Reinforcing keel; 72. Protrusion; 8. Support groove; 81. Motor; 82. Helical rod; 83. Limiting sleeve plate; 9. Support clamping groove; 91. Push plate; 911. Upper clamping plate; 912. Lower clamping plate; 913. Inclined abutment surface; 92. Rotating notch; 93. Rotating roller; 94. Third spring; 95. Support clamping plate; 10. Inclined buffer surface. Detailed Implementation

[0018] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0019] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0020] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0021] like Figures 1 to 7 As shown, this invention proposes a high-speed integrated placement and soldering equipment for electronic component production, comprising a high-speed placement machine 1 for placing and soldering electronic component bodies 12 and a soldering robotic arm 2. The soldering robotic arm 2 is capable of soldering because it integrates core components required for soldering, such as solder heads and heating modules, and can be precisely moved to the soldering position under the drive of a lifting mechanism. During equipment operation, after the high-speed placement machine 1 completes the placement of the electronic component body 12, the soldering robotic arm 2 adjusts its height by lifting and lowering the support slide 31, aligns itself with the solder pads on the PCB, and uses its own heating function to melt the solder paste, achieving a firm connection between the component and the PCB. Thus, the soldering process is completed in the integrated equipment without relying on external soldering equipment. The high-speed placement machine 1 is equipped with a conveying mechanism 11, which places and transports the electronic component body 12 to the soldering processing position. A support base 33 is fixedly connected to the outer wall of the high-speed placement machine 1 to support the rotation of the bottom of the L-shaped baffle 34. One end of the high-speed pick-and-place machine 1 is provided with an inclined buffer surface 10 to support the rotating support plate 7. A rubber pad is provided on the inclined buffer surface 10 and is positioned at one end of the high-speed pick-and-place machine 1 to support the rotating support plate 7, assisting its smooth return and preventing the rotating support plate 7 from impacting the inclined buffer surface 10 due to gravity. The end of the rotating support plate 7 connected to the high-speed pick-and-place machine 1 is provided with multiple hinges 61 arranged in a linear pattern. The hinges 61 connect the rotating support plate 7 and the high-speed pick-and-place machine 1, allowing the rotating support plate 7 to rotate up and down around them.

[0022] Among them, such as Figures 1 to 5 As shown, multiple electronic component bodies 12 arranged linearly are placed on the conveyor mechanism 11. These electronic component bodies 12 are the objects to be mounted and soldered, and the mounting and soldering are completed by the equipment. One end of the high-speed pick-and-place machine 1 has a telescopic groove 3, which provides space for the support slide 31 and the welding robotic arm 2 to move vertically and accommodate the relevant components. A rotating support plate 7 is rotatably connected to the end of the high-speed pick-and-place machine 1 near the telescopic groove 3. When the high-speed pick-and-place machine 1 is placed horizontally at one end, the rotating support plate 7 can be used to place the electronic component bodies 12. The rotating support plate 7 is connected to the high-speed pick-and-place machine 1 via a hinge 61 and can rotate vertically to form a horizontal working surface with the high-speed pick-and-place machine 1, assisting in conveying and supporting. The rotating support plate 7 is made of aluminum alloy, which has low density, high strength, and is lightweight while ensuring structural stability, meeting the requirements for support and rotation. Reducing the weight of the rotating support baffle 7 lowers its rotational inertia, making the push-pull mechanism, such as the push plate 91 and the rotating roller 93, easier to drive, reducing the load on the motor 81 and related transmission components, and extending the equipment's service life. The push-pull mechanism is used to rotate the rotating support baffle 7 up and down. An L-shaped baffle 34 is rotatably connected inside the telescopic groove 3. The L-shaped baffle 34 can be fixed by a locking rod mechanism or disengaged by a spring-loaded mechanism, facilitating process switching. The locking rod mechanism is used to fix the L-shaped baffle 34.

[0023] Secondly, such as Figures 5 to 7 As shown, the telescopic groove 3 is equipped with a lifting mechanism that drives the welding robotic arm 2 to move up and down. The lifting mechanism includes a support slide 31 fixedly connected to the bottom of the welding robotic arm 2. The top of the support slide 31 is connected to the welding robotic arm 2, driving it to move up and down. The outer wall is linked to a push-pull mechanism. The support slide 31 is slidably connected to the telescopic groove 3. The storage cavity 6 has a support groove 8 that communicates with the telescopic groove 3. The support groove 8 is used to accommodate the lifting mechanism components of the motor 81 and the screw rod 82. The outer wall of the support slide 31 is also fixedly connected to a screw sleeve plate 32 that is inserted into the support groove 8. The inner bottom wall of the support groove 8 is fixedly connected to the motor 81. The output shaft of the motor 81 is connected to the screw rod 82, providing power for the rotation of the screw rod 82. The output shaft of the motor 81 is fixedly connected to the screw rod 82. The screw rod 82 rotates under the drive of the motor 81, driving the screw sleeve plate 32 and the support slide 31 to move up and down. The spiral rod 82 is screwed into the spiral sleeve plate 32. A limiting sleeve plate 83 is fixedly sleeved on the end of the spiral rod 82 near the motor 81 to lock the spiral sleeve plate 32. The limiting sleeve plate 83 is fixedly sleeved on the end of the spiral rod 82 near the motor 81, locking the spiral sleeve plate 32 and restricting its descent position.

[0024] In addition, such as Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 7As shown, the high-speed pick-and-place machine 1 has a storage cavity 6 at one end near the rotating support plate 7. The storage cavity 6 is used to accommodate the push-pull mechanism components of the push plate 91, providing storage space for the rotating support plate 7. Inside the storage cavity 6, there is a support clamping groove 9 that communicates with the telescopic groove 3. The support clamping groove 9 allows the upper clamping plate 911 to be inserted, providing a moving guide for the push plate 91. The telescopic groove 3, the storage cavity 6, and the support clamping groove 9 are used to house the push-pull mechanism. The high-speed pick-and-place machine 1 has a push-pull mechanism that is linked to the lifting mechanism and causes the rotating support plate 7 to rotate up and down. The push-pull mechanism includes the push plate 91, which is located in the storage cavity 6. After being pressed against by the support slide 31, the push plate 91 moves, pushing the rotating support plate 7 to rotate. It is the main component of the push-pull mechanism. The top of the push plate 91 is fixedly connected to an upper retaining plate 911 that inserts into the support groove 9. The upper retaining plate 911 is inserted into the support groove 9 and abuts against the outer wall of the support slide 31 to ensure that the support slide 31 is positioned after installation when it moves upward. The upper retaining plate 911 abuts tightly against the outer wall of the support slide 31. The push plate 91 also has an inclined abutting surface 913 that, after being abutted by the support slide 31, disengages into the storage cavity 6. The inclined abutting surface 913, after being abutted by the support slide 31, causes the push plate 91 to disengage from the storage cavity 6. The bottom end of the push plate 91 is provided with a lower retaining plate 912 that engages into the storage cavity 6. The lower retaining plate 912 engages into the storage cavity 6 and is connected to a third spring 94 to transmit the spring force. The lower retaining plate 912 is fixedly connected to the third spring 94, which provides the push plate 91 with a restoring spring force. The end of the third spring 94 furthest from the lower clamping plate 912 is fixedly connected to the inner wall of the storage cavity 6. Rotating slots 92 are provided at both the upper and lower ends of the push plate 91, and rotating rollers 93 are installed inside the rotating slots 92. Rotating rollers 93 are rotatably connected inside each rotating slot 92, abutting against the rotating support plate 7. The rotating rollers 93 abut against the rotating support plate 7, reducing friction between the push plate 91 and the rotating support plate 7. A pair of support clamps 95 are fixedly connected to the inner wall of the storage cavity 6, clamping the push plate 91 and guiding and limiting its movement.

[0025] It is worth noting that, such as Figure 3As shown, a locking mechanism that is linked to the rotating support plate 7 is installed on the outer wall of the high-speed pick-and-place machine 1. The locking mechanism includes a sleeve 5 fixedly connected to the outer wall of the high-speed pick-and-place machine 1. The sleeve 5 provides sliding space and guidance for the telescopic locking rod 51. The telescopic locking rod 51 is slidably connected inside the sleeve 5. The telescopic locking rod 51 slides within the sleeve 5. One end is connected to the pull rope 55 and the second spring 54 through a spherical locking block 53. The other end cooperates with the L-shaped baffle 34 through an arc-shaped abutment 52 to fix or unlock the L-shaped baffle 34. One end of the telescopic locking rod 51 is fixedly connected to the spherical locking block 53. The spherical locking block 53 is connected to the pull rope 55 and the second spring 54 to transmit tension and elasticity. The end of the telescopic locking rod 51 near the spherical locking block 53 is also movably sleeved with the second spring 54. The second spring 54 provides elastic force to reset the telescopic locking rod 51. One end of the second spring 54 is fixedly connected to the sleeve 5, and the other end of the second spring 54 is fixedly connected to the spherical block 53. A protrusion 72 is fixedly connected to the outer wall of one end of the rotating support plate 7. The protrusion 72 is connected to the pull rope 55, which is pulled when the rotating support plate 7 rotates. The pull rope 55 is fixedly connected to the middle of the protrusion 72 and the spherical block 53. The pull rope 55 pulls the spherical block 53 when the rotating support plate 7 rotates, thereby moving the telescopic lever 51. The pull rope 55 is made of steel wire rope, which has extremely high tensile strength and is not easy to break, making it suitable for scenarios with higher strength requirements. A reinforcing keel 71 is also embedded on the rotating support plate 7 and is held in place by the rotating roller 93. The reinforcing keel 71 is embedded on the rotating support plate 7 to enhance its strength and is held in place by the rotating roller 93. The reinforcing keel 71 is made of metal materials such as aluminum alloy and stainless steel to ensure high strength and rigidity, effectively improving the load-bearing capacity and deformation resistance of the rotating support plate 7, and adapting to the stress scenarios in the mechanical movement of the equipment. A support plate 56 is fixedly connected to the outer wall of the high-speed placement machine 1, through which the pull rope 55 moves. The support plate 56 provides support and guidance for the pull rope 55. An arc-shaped abutment 52 is provided at the end of the telescopic lever 51 away from the spherical block 53. This abutment is pressed against the L-shaped baffle 34 and slides towards the support plate 56. The arc-shaped abutment 52, pressed against the L-shaped baffle 34, allows the telescopic lever 51 to slide, facilitating the insertion or removal of the L-shaped baffle 34.

[0026] Furthermore, such as Figure 3As shown, a spring-loaded mechanism is installed inside the telescopic groove 3 to disengage the L-shaped baffle 34 from the telescopic groove 3. The spring-loaded mechanism includes a limiting plate 4 fixedly connected to the bottom of the telescopic groove 3. The limiting plate 4 has mounting slots 41 for mounting the spring-loaded mechanism components. The limiting plate 4 has multiple linearly arranged mounting slots 41 that accommodate and fix the first spring 42 and the telescopic stop block 43. The first spring 42 is fixedly connected inside each mounting slot 41, providing elastic thrust to push the L-shaped baffle 34 out. When the first spring 42 extends to its maximum length, the telescopic stop block 43 will not disengage from the mounting slot 41, ensuring smooth retraction of the telescopic stop block 43 without jamming. Therefore, the first spring 42 has a relatively high stiffness. The end of the first spring 42 furthest from the inner wall of the mounting groove 41 is fixedly connected to a telescopic stop 43 that abuts against the L-shaped baffle 34. Under the action of the first spring 42, the telescopic stop 43 abuts against the L-shaped baffle 34, pushing it to move. Each telescopic stop 43 is fixedly connected to a limiting rope 44. The limiting rope 44 is made of nylon rope, which has good tensile strength, moderate flexibility, wear resistance, and is not prone to aging, meeting the limiting requirements of the L-shaped baffle 34 at a low cost. The limiting rope 44 connects the telescopic stop 43 and the L-shaped baffle 34, limiting the rotation range of the L-shaped baffle 34. The end of the limiting rope 44 furthest from the telescopic stop 43 is fixedly connected to the L-shaped baffle 34.

[0027] In this embodiment, when using a high-speed integrated placement and welding equipment, the electronic component body 12 is transported to the processing position of the welding robotic arm 2 via the conveying mechanism 11 of the high-speed placement machine 1. Then, the motor 81 is started, and its output shaft drives the screw rod 82 to rotate. The screw sleeve 32 engages with the screw rod 82, causing the support slide 31 to move up and down within the telescopic groove 3, thereby raising and lowering the welding robotic arm 2.

[0028] When the support slide 31 rises, its outer wall abuts against the inclined abutment surface 913 of the push plate 91, causing the push plate 91 to move out of the receiving cavity 6. The rotating roller 93 pushes the rotating support plate 7 to rotate upwards around the hinge 61, thus allowing the rotating support plate 7 to rotate upwards to the desired position. Figure 1 The state shown places the rotating support plate 7 at the same horizontal height as the high-speed placement machine 1. Simultaneously, the rotating support plate 7 moves the protrusion 72, which pulls the spherical locking block 53 via the pull rope 55, causing the telescopic locking rod 51 to extend and slide along the second spring 54. At this point, one end of the telescopic locking rod 51 cannot lock the L-shaped baffle 34, meaning the locking mechanism is unlocked. Subsequently, under the action of the springback mechanism, the rotating support plate 7 pushes the telescopic stop block 43 through the elastic thrust of the first spring 42, thereby causing the L-shaped baffle 34 to disengage from the telescopic groove 3. Combined with the limiting pull rope 44, this allows the L-shaped baffle 34 to rotate around the support base 33 until... Figure 2The state shown is as follows. Finally, the spiral sleeve 32 moves upward to abut the top wall of the support groove 8, so that the support slide 31 is at the same horizontal height as the high-speed placement machine 1, to ensure that the welding robot arm 2 is installed in place on the high-speed placement machine 1.

[0029] When the support slide 31 descends, the spiral sleeve 32 abuts against the limiting sleeve 83 at the end of the spiral rod 82. At this time, the third spring 94 pulls the push plate 91 to reset, and the rotating support plate 7 falls back under gravity, thus resetting the locking mechanism. Then, simply rotate the L-shaped baffle 34 in the direction of the telescopic groove 3 and press it firmly. The L-shaped baffle 34 abuts against the arc-shaped abutment 52 at the end of the telescopic clamp 51, causing the telescopic clamp 51 to move towards the support plate 56. Until the L-shaped baffle 34 is fully engaged in the telescopic groove 3, the telescopic clamp 51, through the elastic rebound force of the second spring 54, fixes the end of the telescopic clamp 51 with the L-shaped baffle 34. Finally, the switching and coordination of the patching and welding processes can be completed, achieving integrated operation.

[0030] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-speed integrated surface mount and soldering equipment for electronic component manufacturing, comprising a high-speed surface mount machine (1) for soldering electronic component bodies (12) and a soldering robotic arm (2), characterized in that, Also includes: The telescopic groove (3) is opened at one end of the high-speed pick and place machine (1), and is equipped with a lifting mechanism inside to drive the welding robotic arm (2) to move up and down; Rotary support plate (7) is rotatably connected to one end of the high-speed pick and place machine (1). The high-speed pick and place machine (1) is equipped with a push-pull mechanism that is linked to the lifting mechanism and causes the rotating support plate (7) to rotate up and down. The locking mechanism is installed on the outer wall of the high-speed pick and place machine (1) and linked to the rotating support plate (7). The inside of the telescopic groove (3) is rotatably connected to an L-shaped baffle (34) for fixing the locking mechanism. The telescopic groove (3) is provided with a spring mechanism that allows the L-shaped baffle (34) to disengage from the telescopic groove (3).

2. The high-speed integrated surface mount and soldering equipment for electronic component manufacturing according to claim 1, characterized in that, The lifting mechanism includes a support slide (31) fixedly connected to the bottom of the welding robotic arm (2). The support slide (31) is slidably connected to the telescopic groove (3). The storage cavity (6) has a support groove (8) connected to the telescopic groove (3). The outer wall of the support slide (31) is also fixedly connected to a spiral sleeve plate (32) that is inserted into the support groove (8). The inner bottom wall of the support groove (8) is fixedly connected to a motor (81). The output shaft of the motor (81) is fixedly connected to a spiral rod (82). The spiral rod (82) is spirally inserted into the spiral sleeve plate (32).

3. The high-speed integrated surface mount and soldering equipment for electronic component manufacturing according to claim 2, characterized in that, The end of the spiral rod (82) near the motor (81) is fixedly fitted with a limiting sleeve (83) that holds the spiral sleeve plate (32).

4. The high-speed integrated surface mount and soldering equipment for electronic component manufacturing according to claim 1, characterized in that, The high-speed placement machine (1) has a receiving cavity (6) at one end near the rotating support plate (7). Inside the receiving cavity (6) is a support clamping groove (9) communicating with the telescopic groove (3). The telescopic groove (3), the receiving cavity (6), and the support clamping groove (9) are used to house a push-pull mechanism. The push-pull mechanism includes a push plate (91) located inside the receiving cavity (6). The top of the push plate (91) is fixedly connected to an upper clamping plate (911) inserted into the support clamping groove (9). The upper plate (911) is in close contact with the outer wall of the support slide (31). The push plate (91) is also provided with an inclined abutment surface (913) that is pushed out of the storage cavity (6) after being abutted by the support slide (31). The bottom end of the push plate (91) is provided with a lower plate (912) that is inserted into the storage cavity (6). The lower plate (912) is fixedly connected with a third spring (94). The end of the third spring (94) away from the lower plate (912) is fixedly connected to the inner wall of the storage cavity (6).

5. The high-speed integrated surface mount and soldering equipment for electronic component manufacturing according to claim 4, characterized in that, The upper and lower ends of the push plate (91) are provided with rotating slots (92), and the interior of each rotating slot (92) is rotatably connected to a rotating roller (93) that abuts against the rotating support plate (7).

6. The high-speed integrated surface mount and soldering equipment for electronic component manufacturing according to claim 4, characterized in that, The inner wall of the storage cavity (6) is fixedly connected to a pair of support clamps (95) that hold the push plate (91).

7. The high-speed integrated surface mount and soldering equipment for electronic component manufacturing according to claim 1, characterized in that, The locking mechanism includes a sleeve (5) fixedly connected to the outer wall of the high-speed pick and place machine (1). A telescopic locking rod (51) is slidably connected inside the sleeve (5). A spherical locking block (53) is fixedly connected to one end of the telescopic locking rod (51). A second spring (54) is movably sleeved at one end of the telescopic locking rod (51) near the spherical locking block (53). One end of the second spring (54) is fixedly connected to the sleeve (5), and the other end of the second spring (54) is fixedly connected to the spherical locking block (53). A protrusion (72) is fixedly connected to the outer wall of one end of the rotating support plate (7). A pull rope (55) is fixedly connected to the middle of the protrusion (72) and the spherical locking block (53). A reinforcing keel (71) is also embedded on the rotating support plate (7) and held against by the rotating roller (93).

8. The high-speed integrated surface mount and soldering equipment for electronic component manufacturing according to claim 7, characterized in that, The outer wall of the high-speed chip mounter (1) is fixedly connected to a support plate (56) through which the pull rope (55) moves. The telescopic lever (51) has an arc-shaped abutment (52) at one end away from the spherical block (53), which is pressed against by the L-shaped baffle (34) and slides toward the support plate (56).

9. The high-speed integrated surface mount and soldering equipment for electronic component manufacturing according to claim 1, characterized in that, The rebound mechanism includes a limiting plate (4) fixedly connected to the bottom of the telescopic groove (3). The limiting plate (4) has multiple mounting grooves (41) arranged in a linear pattern. A first spring (42) is fixedly connected inside each mounting groove (41). The end of the first spring (42) away from the inner wall of the mounting groove (41) is fixedly connected to a telescopic stop block (43) that abuts against the L-shaped baffle (34). A limiting pull rope (44) is fixedly connected to each telescopic stop block (43). The end of the limiting pull rope (44) away from the telescopic stop block (43) is fixedly connected to the L-shaped baffle (34).

10. The high-speed integrated surface mount and soldering equipment for electronic component manufacturing according to claim 1, characterized in that, The high-speed placement machine (1) is provided with a conveying mechanism (11) for placing electronic component bodies (12). The outer wall of the high-speed placement machine (1) is fixedly connected with a support base (33) for supporting the rotation of the bottom of the L-shaped baffle (34). One end of the high-speed placement machine (1) is provided with an inclined buffer surface (10) that supports the rotating support baffle (7). The end of the rotating support baffle (7) connected to the high-speed placement machine (1) is provided with multiple hinges (61) arranged in a linear pattern.

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