Method for forming molded product and sealing resin

Abstract

The present invention addresses the problem of providing a method for forming a molded article, capable of realizing a compression molding device and a compression molding method capable of preventing the occurrence of molding defects caused by winding unevenness, residual gas, and dust generation during molding, and capable of forming a molded article having a thin resin portion. Moreover, the processing before resin sealing can be facilitated, and the occurrence of damage during the processing can be prevented. As a solution, this method for forming a molded article comprises: a carrier mounting step in which a carrier (C) is mounted so as to be in contact with the bottom surface of a cavity (108) of a mold; a resin placement step in which a resin (Rm) is placed in the cavity (108); a temporary molded article forming step for forming a temporary molded article by sealing the carrier (C) with a resin (Rm); and a molded article forming step in which a molded article (Wp) is formed by heating or pressurizing in a state where a workpiece (W) including the electronic component is brought into contact with the temporary molded article.

Description

Technical Field

[0001] This invention relates to a method for forming a molded article and a sealing resin. Background Technology

[0002] As an example of a resin sealing device and resin sealing method that uses sealing resin to seal workpieces containing electronic components and process them into molded articles, one is known to use a compression molding method.

[0003] Compression molding is performed by supplying a predetermined amount of sealing resin to a sealing area (mold cavity) of a sealing mold comprising an upper mold and a lower mold, placing a workpiece in the sealing area, and sealing the resin by clamping it with the upper and lower molds. As an example, it is known that when using a sealing mold with a mold cavity in the upper mold, sealing resin is supplied to the center of the workpiece for molding. On the other hand, it is known that when using a sealing mold with a mold cavity in the lower mold, a release film (hereinafter sometimes simply referred to as "film") covering the mold surface containing the mold cavity and sealing resin are supplied for molding (see Patent Document 1: Japanese Patent Application Publication No. 2019-145550).

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2019-145550 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] Previously, it was also believed that the compression molding method with a movable lower mold cavity was widely adopted because it had advantages in preventing deformation of the workpiece caused by the flow of sealing resin or contact based on the flow of wires. This method held the workpiece in the upper mold, provided a mold cavity in the lower mold, and supplied sealing resin (for example, particulate resin) into the mold cavity.

[0009] However, in structures where the upper mold holds the workpiece and the lower mold has a cavity, there is a problem that the workpiece is difficult to hold in the upper mold and is prone to falling, especially if it is thin or large. Furthermore, when using particulate resin as the sealing resin, there are problems not only with the generation of dust during molding due to friction between resin particles, which is difficult to manage, but also with the difficulty of evenly supplying (distributing) the sealing resin to the entire area within the lower mold cavity, leading to uneven distribution. Additionally, there is a problem that air trapped between the particles and gases generated during degassing of the sealing resin during melting cannot escape during distribution and remain as voids in the molded product, easily resulting in poor molding.

[0010] On the other hand, regardless of the mold cavity configuration, when using a solid resin with a definite shape, which is not a particulate resin or a liquid resin, as the sealing resin, the following issues become clear. Specifically, if a molded article is to be formed with a resin thickness of less than 0.4 mm after resin sealing (specifically, the thickness of the resin portion above or below the resin-sealed workpiece), the thickness of the sealing resin (solid resin) before resin sealing must be reduced. However, since the sealing resin (solid resin) before resin sealing is, of course, in its uncured state, it has low rigidity (brittleness) and weak strength, making it extremely prone to breakage during handling (especially during transport).

[0011] Technical means to solve the problem

[0012] The present invention was made in view of the above circumstances, and its object is to provide a method for forming a molded article and a sealing resin, which can realize a compression molding apparatus and compression molding method that can prevent the occurrence of molding defects caused by uneven spreading, residual gas, and dust generation during molding, and can form a molded article with a thin resin portion, as well as facilitate the pre-sealing treatment of the resin and prevent breakage during processing.

[0013] The present invention addresses the aforementioned problem through the means described below as one embodiment.

[0014] One embodiment of the molding article forming method is necessary to include: a carrier placement step, in which a carrier, which is a plate-shaped member, is placed in contact with the bottom surface of the mold cavity of a mold; a resin placement step, in which resin is placed in the mold cavity after the carrier placement step; a temporary molded article forming step, in which the carrier placed after the carrier placement step is sealed with the resin placed after the resin placement step to form a temporary molded article; and a molded article forming step, in which a molded article is formed by heating or pressurizing while a workpiece including electronic components is in contact with the temporary molded article.

[0015] Alternatively, the process preferably includes: a carrier peeling step, in which the carrier is peeled off from the molded article; and a step of sealing the carrier peeled off by the carrier peeling step with the resin, thereby forming the temporary molded article.

[0016] In another embodiment, a sealing resin includes a carrier as a plate-shaped member and a resin, wherein a necessary condition for the sealing resin is that a portion of the sealing resin has an exposed portion in which the carrier is exposed.

[0017] Alternatively, preferably, the sealing resin has a resin sealing portion on the surface where the exposed portion is formed, where the carrier is not exposed to the outside of the exposed portion.

[0018] In another embodiment, a method for forming a sealing resin is used in the compression molding of a workpiece. An essential condition for the method for forming the sealing resin is that it includes a forming step in which a carrier is fixed to one side of a base resin in an exposed state to form a solid resin, namely the sealing resin.

[0019] Compression molding is performed using the sealing resin formed through the described embodiment, thereby preventing molding defects caused by uneven distribution, residual gas, and dust generation during molding. Furthermore, the handling of the sealing resin is simplified, and breakage during handling is prevented, especially for molded articles where the thickness of the resin-formed portion is less than 0.4 mm. Additionally, by applying a structure that provides a mold cavity in the upper mold and holds the workpiece in the lower mold, defects such as workpiece falling can be resolved.

[0020] Alternatively, it is preferable to use a powdered resin as the base resin, and the forming process includes the step of pressing the powdered resin into a sheet to form a solid resin, i.e., the sealing resin, with the carrier fixed in a predetermined shape.

[0021] In addition, the preferred shape is one in which, when viewed from above, the carrier is disposed in the center and the base resin is disposed at the periphery to cover the outer periphery of the carrier.

[0022] In addition, it is preferable that the forming process includes a step in which the carrier, which is peeled off from the molded article after compression molding, is returned to the apparatus for forming the sealing resin and reused during the formation of the sealing resin.

[0023] In another embodiment, a sealing resin forming apparatus forms a sealing resin used in the compression molding of a workpiece. An essential feature of the sealing resin forming apparatus is that it includes a pressing mold, which forms a solid resin, i.e., the sealing resin, by holding and pressing a base resin and a carrier together.

[0024] In another embodiment, the sealing resin is used in the compression molding of the workpiece. The essential requirement of the sealing resin is that it is a solid resin formed by fixing the base resin in an exposed state as a carrier.

[0025] The effects of the invention

[0026] Through this invention, a sealing resin can be formed that achieves the following effects: Specifically, by using the sealing resin of this invention, a compression molding apparatus and method can be realized that prevents molding defects caused by uneven distribution, residual gas, and dust generation during molding, and enables the formation of molded articles with thin resin portions. Furthermore, the pre-sealing treatment of the resin is simplified. Additionally, breakage during processing is prevented. Attached Figure Description

[0027] [ Figure 1 ] Figure 1 This is a plan view illustrating an example of a sealing resin forming apparatus according to an embodiment of the present invention.

[0028] [ Figure 2 ] Figure 2 It means Figure 1 A side view of an example of the first pressing device of the forming apparatus shown.

[0029] [ Figure 3 ] Figure 3 It means Figure 1 A front cross-sectional view of an example of the first mold of the forming apparatus shown.

[0030] [ Figure 4 ] Figure 4 It means Figure 1 A front cross-sectional view of another example of the first mold of the forming apparatus shown.

[0031] [ Figure 5 ] Figure 5 This is an explanatory diagram illustrating an example of a method for forming a sealing resin according to an embodiment of the present invention.

[0032] [ Figure 6 ] Figure 6 It is a continuation Figure 5 Explanatory diagram.

[0033] [ Figure 7 ] Figure 7A is a plan view showing an example of a sealing resin according to an embodiment of the present invention. Figure 7 B is Figure 7 A cross-sectional view of line AA in section A. Figure 7 C is a cross-sectional view representing another example of sealing resin.

[0034] [ Figure 8 ] Figure 8 It is a continuation Figure 6 Explanatory diagram.

[0035] [ Figure 9 ] Figure 9 This is a plan view showing an example of a compression molding apparatus using a sealing resin according to an embodiment of the present invention.

[0036] [ Figure 10 ] Figure 10 It means Figure 9 A side view of an example of the second pressing device of the compression forming apparatus shown.

[0037] [ Figure 11 ] Figure 11 It means Figure 9 A front cross-sectional view of an example of the second mold of the compression molding apparatus shown.

[0038] [ Figure 12 ] Figure 12 This is an explanatory diagram illustrating an example of a compression molding method for a sealing resin using an embodiment of the present invention.

[0039] [ Figure 13 ] Figure 13 It is a continuation Figure 12 Explanatory diagram.

[0040] [ Figure 14 ] Figure 14 It is a continuation Figure 13 Explanatory diagram.

[0041] [ Figure 15 ] Figure 15 A~ Figure 15 C is a front cross-sectional view showing an example of a molded article formed in the compression molding apparatus and compression molding method using the sealing resin according to an embodiment of the present invention. Figure 15 A represents the state before the carrier stripping process is performed. Figure 15 B represents the state after the carrier stripping process has been performed. Figure 15 C represents the state after the cutting process has been performed.

[0042] [ Figure 16 ] Figure 16 It means Figure 9 A side view of an example of the third pressing device in the compression forming apparatus shown.

[0043] [ Figure 17 ] Figure 17 It means Figure 9 A front cross-sectional view of an example of the third mold of the compression molding apparatus shown.

[0044] [ Figure 18 ] Figure 18 This is an explanatory diagram illustrating another example of a compression molding method for a sealing resin using an embodiment of the present invention.

[0045] [ Figure 19 ] Figure 19 It is a continuation Figure 18 Explanatory diagram.

[0046] [ Figure 20 ] Figure 20 It is a continuation Figure 19 Explanatory diagram.

[0047] [ Figure 21 ] Figure 21 This is an explanatory diagram illustrating another example of a compression molding method for a sealing resin using an embodiment of the present invention.

[0048] [ Figure 22 ] Figure 22 This is an explanatory diagram illustrating another example of a compression molding method for a sealing resin using an embodiment of the present invention. Detailed Implementation

[0049] (Apparatus for forming sealing resin)

[0050] The sealing resin R in the embodiments of the present invention is a resin used in the compression molding of a workpiece (the molded article) W. First, the forming apparatus 1 (hereinafter sometimes simply referred to as the "forming apparatus") for the sealing resin R will be described. The forming apparatus 1 can be installed either inside or outside the compression molding apparatus 2. Here, Figure 1 This is a plan view (schematic diagram) showing an example of forming device 1. Furthermore, for ease of explanation, arrows are used in the figure to indicate the left-right direction (X direction), front-back direction (Y direction), and up-down direction (Z direction) of the device. Additionally, in all the drawings used to explain the various embodiments, components with the same function are given the same reference numerals, and sometimes repeated descriptions are omitted.

[0051] The workpiece W, which is the object to be formed, is composed of electronic components. Examples of electronic components include: coil sheets, semiconductor chips, microelectromechanical system (MEMS) chips, passive components, heat sinks, conductive components, and pads. The workpiece W may be configured to include only electronic components, or it may be configured to be mounted on a substrate (wire bonding package, flip chip package, etc.). Furthermore, examples of substrates include rectangular or circular plate-shaped components such as resin substrates, ceramic substrates, metal substrates, transport plates, lead frames, and wafers. In addition, there is no particular limitation on the number of electronic components constituting the workpiece W, and it is set to one or more.

[0052] In this embodiment, the sealing resin R is a base resin Rm with the carrier C fixed in place (details of the forming apparatus and forming method will be described later). As an example, the carrier C is a plate-shaped member with a thickness of about 0.1 mm to 0.5 mm, formed from a metallic material (e.g., copper, copper alloy, etc.), but it is not limited to this.

[0053] In this embodiment, a thermosetting resin (such as an epoxy resin containing fillers, but not limited thereto) is used as both the base resin Rm and the sealing resin R. Furthermore, a powdered resin (powdered resin) that is a thermosetting resin (property) is preferably used as the base resin Rm (details will be described later). However, it is not limited thereto, and the structure may also use granular resin, fragmented resin, solid resin, liquid resin, or a combination of several of these resins.

[0054] Furthermore, as examples of membrane F, membrane materials with excellent heat resistance, ease of peeling, flexibility, and stretchability are preferred, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene (ETFE) (a polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorinated glass cloth, polypropylene, and polyvinylidene chloride. Additionally, membrane F can also be used when forming sealing resin R in the resin forming section 50 described later.

[0055] like Figure 1 As shown, the forming apparatus 1 includes the following as its main structure: a base resin supply unit 10D for supplying base resin Rm and carrier C, etc., and a resin forming unit 10E for forming sealing resin R using base resin Rm and carrier C, etc. As an example, along... Figure 1 In the X direction, a base resin supply unit 10D and a resin forming unit 10E are arranged sequentially. However, the structure is not limited to the above, and the equipment structure, number of units, and arrangement order of units within the unit can be changed. Alternatively, it can be configured to include units other than those described above (not shown).

[0056] Furthermore, in the forming apparatus 1, the guide rails 20 are arranged in a straight line across the units, and the conveying device (first loader) 21 for conveying the base resin Rm and the carrier C is configured to move along the guide rails 20 between the units. However, it is not limited to the above structure, and the conveying device may be configured to include a robot or the like to replace the loader.

[0057] In addition, in the forming apparatus 1, the control unit 80 that performs the operation control of each mechanism in each unit is arranged in the base resin supply unit 10D (which may be configured to be arranged in other units).

[0058] Next, the base resin supply unit 10D included in the forming apparatus 1 will be described in detail. The base resin supply unit 10D includes a carrier supply section 30 for supplying carriers C and a base resin supply section 40 for supplying base resin Rm. As an example, the carrier supply section 30 is configured to include a storage section (e.g., a storage container) for accommodating multiple carriers C (a pick-up device or a platform may also be appropriately provided). In addition, the base resin supply section 40 is configured to include a distributor for supplying base resin Rm, a conveying device, etc. Furthermore, when conveying carriers C and base resin Rm from the base resin supply unit 10D to the resin forming unit 10E, the conveying device may be a first loader 21, or other conveying devices (not shown) (regarding base resin Rm, direct dispensing from the distributor, etc., may also be used).

[0059] Next, the resin forming unit 10E included in the forming apparatus 1 will be described in detail. The resin forming unit 10E includes a resin forming section 50 and serves as an apparatus for forming a sealing resin R using a base resin Rm and a carrier C. In this embodiment, two (or more than three, or one) resin forming units 10E are included, and each resin forming unit 10E includes one (or more than two) resin forming section 50 (see reference 1). Figure 1 However, it is not limited to the structure described above.

[0060] The resin forming section 50 includes a tableting mold (first mold) 102, which has a pair of molds for opening and closing (e.g., a mold assembled from multiple mold blocks, mold plates, mold pillars, or other components made of alloy tool steel). It also includes a pressing device (first pressing device) 150 that drives the opening and closing of the first mold 102. As an example, the structure may include two first pressing devices 150, or it may include one, or it may include multiple (three or more) devices (not shown). A side view (schematic view) of the first pressing device 150 is shown below. Figure 2 A schematic cross-sectional view (front view) of the first mold 102 is shown below. Figure 3 .

[0061] Here, as Figure 2 As shown, the first pressing device 150 comprises a pair of pressing plates 154 and 156, a plurality of pull rods 152 supporting the pair of pressing plates 154 and 156, and a drive device for making the pressing plate 156 movable (lifting and lowering). Specifically, the drive device comprises a drive source (e.g., an electric motor) 160 and a drive transmission mechanism (e.g., a ball screw or toggle mechanism) 162, etc. (however, it is not limited to this). In this embodiment, the pressing plate 154 on the upper side in the vertical direction is set as a fixed pressing plate (the pressing plate fixed to the pull rod 152), and the pressing plate 156 on the lower side is set as a movable pressing plate (the pressing plate that can be slidably held in place by the pull rod 152 and lifted and lowered). However, it is not limited to this, and the two sides can be reversed, that is, the upper side can be set as a movable pressing plate and the lower side as a fixed pressing plate, or both the upper and lower sides can be set as movable pressing plates (neither shown).

[0062] On the other hand, such as Figure 3 As shown, the first mold 102 includes a first upper mold 104 on the upper side and a first lower mold 106 on the lower side in the vertical direction, serving as a pair of molds disposed between the pair of pressure plates 154 and 156 in the first pressing device 150. The first upper mold 104 is assembled to the upper pressure plate (a fixed pressure plate 154 in this embodiment), and the first lower mold 106 is assembled to the lower pressure plate (a movable pressure plate 156 in this embodiment). Mold closing / opening is achieved by the first upper mold 104 and the first lower mold 106 approaching / moving away from each other (the vertical direction (up and down direction) becomes the mold opening and closing direction). In the first mold 102 of this embodiment, the first upper mold 104 is configured as a so-called "pestle type", and the first lower mold 106 is configured as a so-called "mortar type".

[0063] Next, the first lower mold 106 of the first mold 102 will be described in detail. For example... Figure 3As shown, the first lower mold 106 includes a lower mold groove (first lower mold groove) 110, a mold cavity component (first mold cavity component) 126 held therein, a clamping device (first clamping device), etc. The first lower mold groove 110 is fixed to the upper surface of the support plate (first support plate) 114 via a support post (first support post) 112. A mold cavity (first mold cavity) 108 is provided on the upper surface of the first lower mold 106 (the surface on the side of the first upper mold 104). A carrier C and a predetermined amount of base resin Rm are contained in the first mold cavity 108.

[0064] The first clamp 128 is configured in a ring shape to surround the first mold cavity module 126, and is assembled in a manner that allows it to move up and down separately (floatingly) relative to the upper surface of the first support plate 114 via a push pin (first push pin) 122 and a clamping spring (first clamping spring) 124 (e.g., a force-applying member exemplified by a coil spring) (however, this assembly structure is not limited to this). The first mold cavity module 126 forms the interior (bottom) of the first mold cavity 108, and the first clamp 128 forms the side of the first mold cavity 108. As an example, the upper surface of the first mold cavity module 126 (the surface on the side of the first upper mold 104) is formed as a plane. Furthermore, the shape or number of first mold cavities 108 provided in a first lower mold 106 is appropriately set (one or more).

[0065] Here, the first pressing device 150 is provided with a lower mold film supply unit (first lower mold film supply unit) 111, which supplies a film F to cover the mold surface 106a (a defined area) in the first lower mold 106, which includes the inner surface of the first mold cavity 108. In addition, as an example, the film F is roller-shaped, but it can also be strip-shaped.

[0066] Furthermore, the first lower mold 106 is provided with a suction path (hole or groove, etc.) (not shown) that communicates with the suction device at the first clamping device 128 or at the boundary with the first mold cavity 126. As a result, the film F supplied from the first lower mold film supply unit 111 can be adsorbed and held on the mold surface 106a containing the inner surface of the first mold cavity 108.

[0067] In addition, in this embodiment, a first lower mold heating mechanism (not shown) is provided to heat the first lower mold 106 to a predetermined temperature. The first lower mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 80. As an example, the heater is built into the first lower mold groove 110 and applies heat to the entire first lower mold 106, the carrier C housed in the first mold cavity 108, and the base resin Rm. At this time, the first lower mold 106 is heated to a predetermined temperature (e.g., 50°C to 80°C) to a degree that makes it difficult for the base resin Rm to undergo thermosetting (formal curing).

[0068] Next, the first upper mold 104 of the first mold 102 will be described in detail. For example... Figure 3 As shown, the first upper mold 104 includes a pressing plate (first plate) 142 held (fixed) in the upper mold groove (first upper mold groove) 140. The pressing plate (first plate) 142 functions to form (press) a carrier C and a predetermined amount of base resin Rm housed in the first mold cavity 108 of the first lower mold 106, thereby forming a sealing resin R with a predetermined shape in which the carrier C is fixed (details of the forming method will be described later). As an example, the lower surface of the first plate 142 (the surface on the side of the first lower mold 106) is formed as a planar shape.

[0069] Here, the first pressing device 150 is provided with an upper mold film supply unit (first upper mold film supply unit) 113, which supplies film F for covering the mold surface 104a (defined area) of the first upper mold 104. In addition, as an example, film F is roller-shaped, but it can also be strip-shaped.

[0070] Furthermore, the first upper mold 104 is provided with a suction path (hole or groove, etc.) (not shown) that communicates with the suction device on the first plate 142, etc. As a result, the film F supplied from the first upper mold film supply section 113 can be adsorbed and held on the mold surface 104a.

[0071] In addition, in this embodiment, a first upper mold heating mechanism (not shown) is provided to heat the first upper mold 104 to a predetermined temperature. The first upper mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 80. As an example, the heater is built into the first upper mold groove 140 and applies heat to the entire first upper mold 104. At this time, the first upper mold 104 is heated to a predetermined temperature (e.g., 50°C to 80°C) to a degree that makes it difficult to thermocure (formal curing) the base resin Rm contained in the first lower mold 106.

[0072] Furthermore, as one example, the first mold 102 has a structure with a movable gripper (first gripper 128), and as another example, such as Figure 4 As shown, it can also be a structure without a movable clamp.

[0073] (Method for forming sealing resin)

[0074] Next, a method for forming the sealing resin R according to this embodiment (hereinafter sometimes simply referred to as the "forming method") will be described. As an example, the forming method can be implemented using the forming apparatus 1. Here, Figures 5-8 This is an explanatory diagram of the main processes.

[0075] First, a first preparation step is performed. This first preparation step includes the following steps: A heating step (first lower mold heating step) is performed whereby the first lower mold 106 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and sealing resin R will not fully harden, for example, 50°C to 80°C) and heated using a first lower mold heating mechanism. A heating step (first upper mold heating step) is performed whereby the first upper mold 104 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and sealing resin R will not fully harden, for example, 50°C to 80°C) and heated using a first upper mold heating mechanism. A lower mold film supply step (first lower mold film supply step) is performed whereby the first lower mold film supply unit 111 is operated to supply a new film F, which is then adsorbed onto a predetermined area of ​​the mold surface 106a, including the inner surface of the first mold cavity 108, in the first lower mold 106. A higher mold film supply step (first upper mold film supply step) is performed whereby the first upper mold film supply unit 113 is operated to supply a new film F, which is then adsorbed onto a predetermined area of ​​the mold surface 104a, in the first upper mold 104.

[0076] The forming process is performed before, after, or in parallel with the first preparation process, wherein the forming process forms a base resin Rm with the carrier C fixed in a fixed state as a sealing resin R.

[0077] As an example of the forming process, carrier C is supplied to carrier supply section 30. Additionally, a predetermined amount of base resin Rm is supplied to base resin supply section 40 via a dispenser (not shown). Next, a pressing process is performed: in resin forming section 50, carrier C and base resin Rm are pressed into a sheet (an example of "temporary molding") to form a solid state of sealing resin R ("temporary molded product") with carrier C fixed in a predetermined shape. Furthermore, the term "solid" includes substances that have melted to the so-called B stage or are about to melt, since the pressing is performed while heating to a temperature that will not formally harden. As an example, carrier C is placed in lower mold 106 before supplying base resin Rm, or carrier C may be attached to the underside of film F in upper mold 104.

[0078] Specifically, in the tableting process, the carrier C supplied from the carrier supply unit 30 is conveyed by a conveying device (e.g., the first loader 21) and housed at a predetermined position (e.g., the central position) within the first mold cavity 108 of the first lower mold 106. Next, a predetermined amount of base resin Rm supplied from the base resin supply unit 40 is conveyed by a conveying device (e.g., the first loader 21), or directly distributed from a dispenser, and housed within the first mold cavity 108 of the first lower mold 106. As an example, within the first mold cavity 108, the base resin Rm is placed on the previously housed carrier C (see reference). Figure 5Next, the first pressing device 150 is operated to close the first mold 102, which has been heated to the specified temperature (see reference). Figure 6 At this time, the first mold cavity module 126 rises relative to the first mold cavity 108, and the carrier C and the base resin Rm are pressed (clamped and pressurized) by the first mold cavity module 126 and the first plate 142. Thus, a sealing resin R is formed in a solid state with the carrier C fixed in a predetermined shape and not yet thermally cured (fully cured).

[0079] As an example, such as Figure 7 A (a plan view with the exposed surface of carrier C as the top surface) and Figure 7 B ( Figure 7 As shown in the cross-sectional view along line AA in section A), the "prescribed shape" is as follows: In top view, a carrier C is positioned in the center, and a base resin Rm (in its solid state after compression) is positioned around the periphery of the carrier C, covering its outer circumference Ca. (Furthermore, since the workpiece W is clamped from above and below, a positioning step (not shown) for the workpiece W can also be provided on the resin surface). This improves the fixation between the carrier C and the base resin Rm, thus preventing unexpected peeling. Furthermore, regarding the ends, it is not necessary for the ends of the base resin Rm to reach the outer side, as... Figure 7 C (and) Figure 7 As shown in the same cross-sectional view (B), the carrier C and the base resin Rm can be substantially the same. Alternatively, a base resin Rm with recesses can be prepared, and the carrier C can be attached to the recesses. Alternatively, a flat carrier C can be attached to a simple flat base resin Rm without recesses. The fixing includes attachment.

[0080] The tableting process is importantly carried out at a temperature where it is difficult to heat-cure (formally cure) the base resin Rm (by heating the first lower mold 106 and the first upper mold 104 to a temperature where it is difficult to heat-cure (formally cure)), so that the formed sealing resin R can be heat-cure (formally cure) in the subsequent resin sealing process. As mentioned above, the "temperature where it is difficult to heat-cure" also depends on the material of the base resin Rm, but as a specific example, it is about 50°C to 80°C (about 70°C in this embodiment).

[0081] Furthermore, powdered resin is preferably used as the base resin Rm. This allows for extremely precise adjustment and supply of the resin quantity compared to using granular or broken resin. However, it is not limited to powdered resin.

[0082] After the tableting process, the first mold 102 is opened, and the sealing resin R (with the carrier C fixed on the lower surface) is separated from the used film F and the sealing resin R is removed (first mold opening process) (see reference). Figure 8 In this embodiment, by including the lower mold film supply process and the upper mold film supply process, the film F is disposed on both the mold surface 106a of the first lower mold 106 and the mold surface 104a of the first upper mold 104. Therefore, the demolding of the sealing resin R formed by pressing becomes easy, thereby preventing defects caused by resin adhering to the mold.

[0083] In addition, after the first mold opening process, or in parallel, the following film supply process (first lower mold film supply process, first upper mold film supply process) is performed: the first lower mold film supply unit 111 and the first upper mold film supply unit 113 are operated to send the used film F out of the first mold 102, and a new film F is sent in and installed in the first mold 102.

[0084] The above are the main steps of the method for forming the sealing resin R according to this embodiment. However, the order of the steps described is just one example, and the order can be changed or implemented in parallel as long as there are no obstacles.

[0085] As mentioned above, if the desired resin thickness is to be achieved after resin sealing (compression molding) (specifically, such as...) Figure 15 As shown in Figure C, if the thickness of the resin portion (Da) at the upper position or the thickness of the resin portion (Db) at the lower position of the resin-sealed workpiece W is as thin as 0.4 mm or less, then the thickness of the sealing resin (solid resin) before resin sealing must also be thinned. However, since the sealing resin (solid resin) before resin sealing is in its uncured state, it has low rigidity (brittleness) and weak strength, thus posing a problem of easy breakage during handling (especially during transport). In particular, it has been confirmed that the problem is more pronounced with sealing resin (solid resin) formed by compression molding. In contrast, by using the sealing resin R of this embodiment for resin sealing (compression molding), the aforementioned problem can be solved, that is, the sealing resin R can be prevented from breaking during handling (especially during transport), and a molded article Wp with a thin resin portion can be formed. Furthermore, through the inventors' experiments, it has been verified that a shape with Da=Db=0.1 mm can also be achieved.

[0086] Furthermore, by using the sealing resin R of the aforementioned structure for resin sealing (compression molding), problems such as uneven distribution, residual gas, dust generation during molding, or difficulties in handling caused by particulate resin, as in the past, can be solved or reduced.

[0087] (Compression forming apparatus and compression forming method)

[0088] Next, a general description of the compression molding apparatus 2 and the compression molding method for resin sealing (compression molding) of workpiece W using the sealing resin R of this embodiment will be given. Here, Figure 9This is a plan view (simplified view) showing an example of the compression forming device 2.

[0089] like Figure 9 As shown, the compression molding apparatus 2 includes the following main components: a supply unit 10A for supplying workpiece W, a pressing unit 10B for sealing workpiece W with resin and processing it into a molded product Wp, and a storage unit 10C for storing the molded product Wp. As an example, along... Figure 9 In the X direction, a supply unit 10A, a pressing unit 10B, and a storage unit 10C are arranged sequentially. However, the structure is not limited to this; the equipment structure, number of units, and arrangement order of the units can be changed. For example, the supply unit 10A and the storage unit 10C can be arranged opposite to each other in the X direction, or they can be arranged concentrated at the location of either one (not shown). Alternatively, it can be configured to include units other than those described above (not shown).

[0090] Furthermore, in the compression molding apparatus 2, the guide rails 22 are arranged in a straight line across each unit. The conveying device (second loader) 23 for transporting the workpiece W and the sealing resin R (or for transporting other than the workpiece W and sealing resin R), and the conveying device (third loader) 24 for transporting the molded product Wp (or for transporting other than the molded product Wp) are configured to move along the guide rails 22 between designated units. However, this configuration is not limited to the above structure; it may also be configured to include a single, shared conveying device (loader) (not shown) for transporting the workpiece W, sealing resin R, and molded product Wp. Alternatively, the conveying device may be configured to include a robotic arm or the like instead of a loader.

[0091] In addition, in the compression molding apparatus 2, the control unit 90, which controls the operation of each mechanism in each unit, is arranged in the supply unit 10A (or may be configured to be arranged in other units).

[0092] The pressing unit 10B includes a resin sealing part 70, which seals the workpiece W with resin and processes it into a molded product Wp. In this embodiment, two (or more than three, or one) pressing units 10B each include the resin sealing part 70. Each pressing unit 10B includes one (or more than two) resin sealing part 70 (see reference). Figure 9 However, it is not limited to the structure described above. The resin sealing part 70 includes a pair of sealing molds (e.g., a mold assembled from multiple mold blocks, mold plates, mold pillars, or other components made of alloy tool steel) that are opened and closed by a pressing device.

[0093] Here, as an example, refer to Figures 12-14 For use including the second pressing device 250 (see reference) Figure 10) and the second mold 202 (refer to Figure 11 The process of the compression forming method implemented by the compression forming apparatus 2 will be described.

[0094] First, a second preparation step is performed. Specifically, a heating step (second upper mold heating step) is performed, in which the second upper mold 204 is adjusted to a specified temperature (e.g., 100℃~300℃) and heated using a second upper mold heating mechanism. Additionally, a heating step (second lower mold heating step) is performed, in which the second lower mold 206 is adjusted to a specified temperature (e.g., 100℃~300℃) and heated using a second lower mold heating mechanism. Furthermore, a lower mold film supply step (second lower mold film supply step) is performed, in which the second lower mold film supply unit 211 is operated to supply a new film F, which is adsorbed in a manner that covers a specified area of ​​the mold surface 206a of the second lower mold 206. In addition, an upper mold film supply process (second upper mold film supply process) is performed, in which the second upper mold film supply unit 213 is operated to supply a new film F, and the film is adsorbed in such a way that it covers a predetermined area of ​​the mold surface 204a, which includes the inner surface of the second mold cavity 208, in the second upper mold 204.

[0095] The resin preparation process, which prepares the base resin Rm with the carrier C fixed in a fixed state as the sealing resin R, is performed before, after, or in parallel with the second preparation process. Specifically, the sealing resin R formed by the forming apparatus 1 is prepared.

[0096] Following the second preparation step, an installation step is performed whereby the sealing resin R and the workpiece W are installed within the sealing mold (second mold 202). Figure 12 As shown, the workpiece W is held (including placed) on the holding part 205 with the workpiece W sandwiched between two sealing resins R arranged with each carrier C on the outside.

[0097] As an example of the installation process, a sealing resin R (referred to as "first sealing resin R" for ease of explanation) prepared in the resin preparation process is conveyed by a conveying device (e.g., a second loader 23, etc.) and placed on the holding part 205 with the exposed surface of the carrier C facing downwards. Next, a workpiece W supplied from the supply box 12 is conveyed by a conveying device (e.g., a second loader 23, etc.) and placed on the first sealing resin R. Next, another sealing resin R (referred to as "second sealing resin R" for ease of explanation) prepared in the resin preparation process is conveyed by a conveying device (e.g., a second loader 23, etc.) and placed on the workpiece W with the exposed surface of the carrier C facing upwards.

[0098] Alternatively, as another example of the installation process, the first sealing resin R and the second sealing resin R prepared in the resin preparation process, and the workpiece W supplied from the supply box 12 are stacked in such a way that the workpiece W is sandwiched between the two (first and second) sealing resins R arranged with each carrier C on the outside (i.e., the first sealing resin R is prepared with the exposed surface of the carrier C as the lower side, the workpiece W is placed on the first sealing resin R, and the second sealing resin R is placed on the workpiece W with the exposed surface of the carrier C as the upper side). Then, the stacked first sealing resin R, workpiece W, and second sealing resin R are transported by a conveying device (e.g., a second loader 23, etc.) and placed on the holding part 205. In this case, there is an advantage that the workpiece W and the two sealing resins R are not transported to the second mold 202 separately, but are done at once. In addition, there is an advantage that since the first sealing resin R and the second sealing resin R can be supplied to the heated sealing mold (second mold 202) at the same time, the thermal process remains unchanged.

[0099] After all the aforementioned processes are completed, a resin sealing process is performed to seal the workpiece W with sealing resin R (in this embodiment, the workpiece W is clamped between two sealing resins R) to process it into a molded product Wp. Specifically, this involves performing a mold closing process of closing the second mold 202 and heating and pressurizing the workpiece W with sealing resin R (second mold closing process) (see [reference]). Figure 13 At this time, the second clamping device 228 abuts against the lower plate 242 (mold surface 206a) via the membrane F, and the second mold cavity component 226 descends relative to the second mold cavity 208. Through the mold closing process, the sealing resin R undergoes thermosetting and the resin sealing (compression molding) is completed, forming a mold cavity with... Figure 15 The molded article Wp has the shape shown in A. Furthermore, in this embodiment, as... Figure 12 As shown, the workpiece W is clamped in from above and below by a sealing resin R with a carrier C, thereby undergoing compression molding from both above and below. However, as another example, such as Figure 21 As shown, the sealing resin R with carrier C can be only one of the upper and lower components, while the other is a sealing resin R without carrier C.

[0100] After the second mold closing process, the second mold 202 is opened, and the molded product Wp is separated from the used film F and the molded product Wp is removed (second mold opening process) (see reference). Figure 14 Next, a molding product removal process is performed in which the molded product Wp (for example, held in the holding part 205 of the lower plate 242) is removed from the second mold 202 and transferred to the storage unit 10C by a conveying device (e.g., a third loader 24).

[0101] After the molded product removal process, or in parallel, a film supply process (second lower mold film supply process, second upper mold film supply process) is performed, in which the second lower mold film supply unit 211 and the second upper mold film supply unit 213 are operated to send the used film F out of the second mold 202 and send a new film F into the second mold 202 and install it.

[0102] Furthermore, after the molded article removal process, a carrier peeling process is performed to peel the carrier C from the molded article Wp using the carrier peeling device 16. This results in the formation of a product with... Figure 15 The molded article Wp is shown in shape B. In addition, the molded article Wp can be reversed midway through the process, and the carrier C on the upper and lower surfaces can be peeled off sequentially by a peeling mechanism. Alternatively, the molded article Wp can be reversed, and the carrier C on the upper and lower surfaces can be peeled off separately by two peeling mechanisms.

[0103] After the carrier peeling process, a process is performed in which the carrier C, after being peeled from the molded article Wp, is transferred from the storage unit 10C to the resin forming unit 10E (or the base resin supply unit 10D) by a conveying device (e.g., a third loader 24, etc.) (as long as the carrier C is eventually returned to the resin forming section 50). Furthermore, if the carrier C is used in the final product as a heat sink, peeling the carrier C may not be necessary.

[0104] With this structure, the carrier C can be peeled off from the molded article Wp and reused in the forming process of forming the sealing resin R (i.e., the base resin Rm with the carrier C fixed) in the forming apparatus 1. Therefore, manufacturing costs can be reduced by reducing the number of parts (the total number of necessary carriers C). In addition, since it is not necessary to prepare multiple carriers C in advance, the apparatus can be miniaturized, especially by focusing on the size of the carrier C storage part (e.g., a storage container) or the installation space.

[0105] In addition, after the carrier peeling process, the molded article Wp is cut at a specified position ( Figure 15 The cutting process (located at the dotted line position shown in B) involves cutting the outer edge of the molded article Wp along the thickness direction using the cutting device 18. This results in the formation of an article with... Figure 15 The shape shown in C is the molded part Wp (final target shape) with a thin resin thickness (the resin thickness of the upper or lower part of the workpiece W).

[0106] After the cutting process, a storage process is performed to store the molded article Wp (in this embodiment, the carrier C is peeled off and cut at a specified position) in the storage box 14. In addition, the carrier peeling device 16 and the cutting device 18 may be provided separately from this compression molding apparatus 2, in which case it can be configured to store the molded article Wp in a state where it has not been peeled off or cut.

[0107] The above describes the main steps of the compression forming method using the compression forming apparatus 2 (including the second mold 202). However, the sequence of these steps is just one example, and the order can be changed or implemented in parallel as long as there are no obstacles.

[0108] Next, as another example, refer to Figures 18-20 For the use of a third pressing device 350 (see reference) Figure 16 ) and the third mold 302 (refer to Figure 17 The process of the compression forming method implemented by the compression forming apparatus 2 will be described.

[0109] First, a third preparation step is performed. Specifically, a heating step (third upper mold heating step) is performed, in which the third upper mold 304 is adjusted to a specified temperature (e.g., 100°C to 300°C) and heated by the third upper mold heating mechanism. Additionally, a heating step (third lower mold heating step) is performed, in which the third lower mold 306 is adjusted to a specified temperature (e.g., 100°C to 300°C) and heated by the third lower mold heating mechanism. Furthermore, a lower mold film supply step (third lower mold film supply step) is performed, in which the third lower mold film supply unit 311 is operated to supply a new film F, which is adsorbed in a manner that covers a specified area of ​​the mold surface 306a, including the inner surface of the third mold cavity 308, in the third lower mold 306. In addition, an upper mold film supply process (third upper mold film supply process) is performed, in which the third upper mold film supply unit 313 is operated to supply a new film F, and the film is adsorbed in a manner that covers a predetermined area of ​​the mold surface 304a of the third upper mold 304.

[0110] The resin preparation process, which prepares the base resin Rm with the carrier C fixed in a fixed state as the sealing resin R, is performed before, after, or in parallel with the third preparation process. Specifically, the sealing resin R formed by the forming apparatus 1 is prepared.

[0111] After the third preparation step, an installation step is performed to install the sealing resin R and the workpiece W into the sealing mold (third mold 302). Figure 18 As shown, the workpiece W is held (including placed) in the third mold cavity 308 (on the third mold cavity module 326) with the workpiece W sandwiched between two sealing resins R arranged with each carrier C on the outside.

[0112] As an example of the installation process, a sealing resin R (referred to as "first sealing resin R" for ease of explanation) prepared in the resin preparation process is transported by a conveying device (e.g., a second loader 23, etc.) and placed in the third mold cavity 308 (on the third mold cavity module 326) with the exposed surface of the carrier C facing downwards. Next, a workpiece W supplied from the supply box 12 is transported by a conveying device (e.g., a second loader 23, etc.) and placed on the first sealing resin R. Then, another sealing resin R (referred to as "second sealing resin R" for ease of explanation) prepared in the resin preparation process is transported by a conveying device (e.g., a second loader 23, etc.) and placed on the workpiece W with the exposed surface of the carrier C facing upwards.

[0113] Alternatively, as another example of the installation process, the first sealing resin R and the second sealing resin R prepared in the resin preparation process, and the workpiece W supplied from the supply box 12 are stacked in such a way that the workpiece W is sandwiched between the two (first and second) sealing resins R with each carrier C on the outside (i.e., the first sealing resin R is prepared with the exposed surface of the carrier C as the lower side, the workpiece W is placed on the first sealing resin R, and the second sealing resin R is placed on the workpiece W with the exposed surface of the carrier C as the upper side). Then, the stacked first sealing resin R, workpiece W, and second sealing resin R are transported by a conveying device (e.g., a second loader 23, etc.) and placed in the third mold cavity 308 (on the third mold cavity module 326). In this case, there is an advantage that the workpiece W and the two sealing resins R are not transported to the third mold 302 separately, but are done at once. In addition, there are the following advantages: since the first sealing resin R and the second sealing resin R can be supplied to the heated sealing mold (third mold 302) at the same time, the thermal process remains unchanged.

[0114] After all the aforementioned processes are completed, a resin sealing process is performed to seal the workpiece W with sealing resin R (in this embodiment, it is a state in which two sealing resins R are clamped together) to process it into a molded product Wp. Specifically, a mold closing process is performed on the third mold 302, which involves heating and pressurizing the workpiece W with sealing resin R to close the mold (the third mold closing process) (see [reference]). Figure 19 At this point, the third clamping device 328 abuts against the upper plate 342 (mold surface 304a) via the membrane F, and the third mold cavity component 326 rises relative to the upper plate 342 within the third mold cavity 308. Through the mold closing process, the sealing resin R undergoes thermosetting to complete the resin sealing (compression molding), forming a mold cavity with… Figure 15 A molded article Wp with the shape shown in Figure A (i.e., the same shape as when using the second mold 202). Furthermore, in this embodiment, as... Figure 18As shown, the workpiece W is clamped in from above and below by a sealing resin R with a carrier C, thereby undergoing compression molding from both above and below. However, as another example, such as Figure 22 As shown, the sealing resin R with carrier C can be only one of the upper and lower components, while the other is a sealing resin R without carrier C.

[0115] After the third mold closing process, the mold opening process (third mold opening process) is carried out, in which the molded product Wp is separated from the used film F and the molded product Wp is removed (see reference). Figure 20 Next, a molding product removal process is performed in which the molded product Wp (for example, held in the holding part 305 of the upper plate 342) is removed from the third mold 302 and transferred to the storage unit 10C by a conveying device (e.g., the third loader 24).

[0116] After the molded product removal process, or in parallel, a film supply process (third lower mold film supply process, third upper mold film supply process) is performed, in which the third lower mold film supply unit 311 and the third upper mold film supply unit 313 are operated to send the used film F out of the third mold 302 and send a new film F into the third mold 302 and install it.

[0117] Furthermore, after the molded article removal process, a carrier peeling process is performed to peel the carrier C from the molded article Wp using the carrier peeling device 16. This results in the formation of a product with... Figure 15 The molded article Wp is shown in shape B. In addition, the molded article Wp can be reversed midway through the process, and the carrier C on the upper and lower surfaces can be peeled off sequentially by a peeling mechanism. Alternatively, the molded article Wp can be reversed, and the carrier C on the upper and lower surfaces can be peeled off separately by two peeling mechanisms.

[0118] After the carrier peeling process, a process is performed in which the carrier C peeled from the molded article Wp is transferred from the storage unit 10C to the resin forming unit 10E (or the base resin supply unit 10D) by a conveying device (such as a third loader 24, etc.) (as long as the carrier C is eventually returned to the resin forming section 50). In addition, if the carrier C is used in the final product as a heat sink, it may not be necessary to peel off the carrier C.

[0119] With this structure, the carrier C can be peeled off from the molded article Wp and reused in the forming process of forming the sealing resin R (i.e., the base resin Rm with the carrier C fixed) in the forming apparatus 1. Therefore, manufacturing costs can be reduced by reducing the number of parts (the total number of necessary carriers C). In addition, since it is not necessary to prepare multiple carriers C in advance, the apparatus can be miniaturized, especially by focusing on the size of the carrier C storage part (e.g., a storage container) or the installation space.

[0120] In addition, after the carrier peeling process, the molded article Wp is cut at a specified position ( Figure 15 The cutting process (located at the dotted line position shown in B) involves cutting the outer edge of the molded article Wp along the thickness direction using the cutting device 18. This results in the formation of an article with... Figure 15 The shape shown in C is the molded part Wp (final target shape) with a thin resin thickness (the resin thickness of the upper or lower part of the workpiece W).

[0121] After the cutting process, a storage process is performed to store the molded article Wp (in this embodiment, the carrier C has been peeled off and cut at a predetermined position) in the storage box 14. Alternatively, the process can be configured to store the molded article Wp without performing the carrier peeling or cutting process (i.e., storing the molded article Wp in a state where it has not been peeled off or cut). Furthermore, the carrier peeling device 16 and the cutting device 18 may be provided separately from this compression molding apparatus 2, in which case it can be configured to store the molded article Wp in a state where it has not been peeled off or cut.

[0122] The above describes the main steps of the compression forming method using the compression forming apparatus 2 (including the third mold 302). However, the sequence of these steps is just one example, and the order can be changed or implemented in parallel as long as there are no obstacles.

[0123] As explained above, the present invention provides a sealing resin that achieves the following effects: Specifically, by using the sealing resin of the present invention, a compression molding apparatus and method can be developed that prevents molding defects caused by uneven distribution, residual gas, or dust generation during molding, and enables the formation of molded articles with thin resin portions. Furthermore, the pre-sealing treatment of the resin is simplified. Additionally, breakage during processing is prevented.

[0124] Furthermore, through the forming method of the present invention, since the carrier can be peeled off from the molded article and reused in the forming process of forming the sealing resin, it is possible to reduce manufacturing costs based on the reduction of the number of parts and to miniaturize the device, which is mainly composed of a carrier storage section.

[0125] Furthermore, the present invention is not limited to the described embodiments, and various modifications can be made without departing from the scope of the present invention.

Claims

1. A method for forming a molded article, characterized in that... include: The carrier placement process involves placing the carrier, which is a plate-shaped component, in contact with the bottom surface of the mold cavity. The resin loading process involves loading resin into the mold cavity after the carrier loading process. A temporary molded article forming process uses the resin that has been placed in the resin placement process to seal the carrier that has been placed in the carrier placement process to form a temporary molded article. as well as The molding process involves forming a molded article by heating or pressurizing while a workpiece, including electronic components, is in contact with the temporary molded article.

2. The method for forming a molded article according to claim 1, characterized in that... include: The carrier stripping process involves stripping the carrier from the molded article; as well as The process of sealing the carrier after it has been peeled off by the carrier peeling process using the resin, thereby forming the temporary molded article.

3. A sealing resin comprising a carrier as a plate-like member and a resin, characterized in that, A portion of the sealing resin has an exposed portion where the carrier is exposed.

4. The sealing resin according to claim 3, characterized in that, The sealing resin has a resin sealing portion on the surface where the exposed portion is formed, where the carrier is not exposed to the outside of the exposed portion.

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