Testing method containing laser seal

By introducing laser engraving technology into the testing section, the problem of copper shavings residue in the packaging section was solved, resulting in improved product quality and testing accuracy, and reduced rework and damage risks.

CN121798166APending Publication Date: 2026-04-07SUZHOU ASEN SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-31
Publication Date
2026-04-07

AI Technical Summary

Technical Problem

In the existing laser marking process for the packaging section, copper residue can cause short circuits and reduce detection accuracy. The testing section cannot correct defective products in time, increasing costs and damage risks.

Method used

The laser marking process is introduced in the testing section. Through steps such as vibratory feeder feeding, turntable PIN1 detection, laser marking by a marking machine, turntable shuttle feeding, and robotic arm picking, continuous laser operation and electrical testing of products are achieved. Combined with bottom two-dimensional visual inspection and in-tape visual inspection, good products and defective products are separated.

Benefits of technology

It effectively removes copper shavings residue, improves product quality, avoids short circuits, reduces rework costs, and enhances testing accuracy and product yield.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a test method containing a laser seal, and belongs to the field of semiconductor device testing and marking, and the method comprises the following steps: 1, vibration disc feeding: a product is conveyed to a rotating disc through a vibration disc; and 2, a turntable PIN1 is used for detection, wherein the turntable is used for adjusting the product to the pin1 direction and feeding the product into a marking machine to complete laser operation. And 3, a laser marking process of a marking machine is conducted, specifically, the marking machine conducts laser marking operation on the marking faces of the products, and continuous laser operation of different products is achieved by adjusting the positions of the products. According to the invention, laser marking and function and performance detection are carried out on the cut and stripped product, and the original mode of cutting after packaging section laser marking is changed into the mode of testing the laser marking of the product after the packaging section is cut, so that the problem that residual copper cuttings exist in the packaging section laser marking operation is solved; and therefore, the product quality can be improved.
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Description

Technical Field

[0001] This invention belongs to the field of semiconductor device testing and marking technology, specifically referring to a testing method including laser stamping. Background Technology

[0002] In the semiconductor device manufacturing process, laser marking is a crucial step in assigning a unique identifier to a product. The marking content (such as model number, batch number, QR code, etc.) is directly related to product traceability management, quality control, and downstream application compatibility. Currently, the industry generally places the laser marking process in the packaging stage, that is, after the device is packaged and formed, laser marking equipment is used to mark the product on the pre-designed mark surface.

[0003] However, existing laser marking processes for the packaging stage have unavoidable technical drawbacks: because the area around the mark surface of the packaged device often has residual metal plating or copper substrate, when the laser is applied to this area, copper shavings are easily generated. If these copper shavings are not removed in time, they will adhere to the product surface or hide in the gaps between the devices, which will not only affect the detection accuracy of subsequent testing processes, but may also fall off during subsequent assembly or use, leading to reliability issues such as short circuits and poor contact, seriously reducing product yield and market competitiveness.

[0004] Meanwhile, in the semiconductor device testing section, existing test sorters only have the function of visually inspecting existing product markings, such as determining whether the markings are clear, whether the position is off-center, and whether the content is correct. They cannot perform secondary laser marking on the products during the testing phase. This limitation makes it difficult to directly correct marking defects found in the testing phase (such as blurry markings, incorrect content, and copper filings covering the markings) in the testing process. They can only be returned to the packaging section for rework, which not only increases process flow costs and time costs but may also cause secondary damage to the products during the return process. For some defective products that cannot be reworked, they can only be scrapped, further increasing manufacturing costs. Summary of the Invention

[0005] To address the above issues and overcome the shortcomings of existing technologies, this invention provides a testing method incorporating laser marking. This method effectively solves the problem of residual copper shavings in the laser marking process during the packaging stage, which can lead to short circuits and failures after the substrate is mounted. This results in improved quality and a product free of customer complaints.

[0006] The technical solution adopted by the present invention is as follows: The present invention proposes a testing method including laser stamping, including step one: vibratory feeder feeding: the product is transferred to the turntable by a vibratory feeder; Step 2: Turntable PIN1 Inspection: The turntable adjusts the product to the pin1 direction and feeds it into the marking machine to complete the laser operation; Step 3: Laser marking process of the marking machine: The marking machine performs laser marking on the marking surface of the product, and by adjusting the product position, it can achieve continuous laser marking of different products; Step 4: Rotary shuttle feeding: The laser-finished product is transported to the rotary shuttle via a suction nozzle; Step 5: Robotic arm material handling: The product is transported via a track to the material shuttle in the testing area, located on one side of the material handling robotic arm; Step Six: Product Placement in the Feed Shuttle: The product is placed into the feed shuttle by the robotic arm and conveyed to the testing station, awaiting the test command; Step 7: Testing: Conduct electrical tests on the product; Step 8: Good Products Loading and Placement: Based on the test results, good products are transported via the material shuttle, while defective products are placed into the corresponding test bins for classification. Step 9: Bin-based sorting and classification of defective products: Defective products are processed centrally. Step 10: Robotic arm unloading: The tested products are transported to the jig shuttle by the unloading robotic arm; Step 11: Fixture shuttle carrying the product: transport the product to the area above the bottom two-dimensional vision inspection for scanning and inspection; Step 12: Bottom 2D visual inspection: Defective products after bottom 2D visual inspection are placed into the visual inspection failure box, while qualified products are put into the tape and reel for further visual inspection. Step 13: Products that pass the jig shuttle load-bearing test: Products that pass the jig shuttle load-bearing 5S test are awaiting visual inspection within the tape tray; Step Fourteen: Visual Inspection within the Tape and Reel: Visual inspection within the tape and reel marks products that have passed 5S inspection and entered the carrier tape groove. Defective products are transferred to the visual inspection failure box by the suction nozzle of the unloading robot. Step 15: Visual Inspection Failure Box: The visual inspection failure box is used to receive defective products that have failed 5S inspection and laser marking inspection. Step Sixteen: Tape Reeling and Packaging: Deliver the good products to the tape reeling station to complete the final carrier tape packaging.

[0007] Preferably, in step three, the laser marking process of the marking machine includes the following steps: S1: Stamp making: Using design software, create a stamp template based on the product marking character information requirements, and perform mirror processing on the pattern of the stamp template; S2: Upload stamp for trial printing: Upload the stamp information template to the system and perform a trial printing to check whether the pattern marking effect meets the standards; S3: Printing Positioning: Adjust the position of the marking head so that the marking area is aligned with the predetermined position on the stamp blank; S4: Adjust printing parameters: Ensure the accuracy of the layout and position of the marking pattern by adjusting the position of the marking head; S5: On-machine production: After confirming the test printing effect, start the marking machine to carry out the marking operation.

[0008] Preferably, the marking machine includes a mechanical structure component, an auxiliary component, a power drive component, and a control system. The mechanical structure component includes a base, and the marking machine is mounted on the sorting machine via the base.

[0009] Preferably, a support plate is installed on the base, the support plate fixes the laser, the laser generates a laser beam, and the galvanometer system of the scanning focusing part deflects the reflector at high speed to form a focused spot on the product surface to complete the laser.

[0010] Preferably, a turntable is rotatably connected to the worktable of the marking machine. The turntable is equipped with a moving plate and a power drive assembly. The power drive assembly includes a motor, which drives the turntable to rotate, so that the chips are sequentially brought into the marking position.

[0011] Preferably, the auxiliary component includes a dust collector, which is connected to the marking machine via a vacuum cleaner pipe and is used to adsorb smoke and dust generated during the marking process.

[0012] Preferably, the control system includes marking content input and editing, marking data processing and system uploading, external device docking and data import.

[0013] Preferably, the seal template production process is as follows: S1: Adjust the overall height of the characters; S2: Adjusts the overall width of the characters; S3: Adjust the spacing between characters.

[0014] Preferably, the sorting machine includes a feeding area, a testing area, a discharging area, and a packaging area, and the marking machine is located in the feeding area.

[0015] The beneficial effects of the present invention using the above structure are as follows: This solution proposes a test method including laser marking, which solves the problem that residual copper shavings in the laser marking process of the packaging section may cause short circuit failure after the circuit is mounted on the substrate, thereby effectively improving product quality and avoiding customer complaints. Attached Figure Description

[0016] Figure 1 This is a detailed flowchart illustrating a testing method involving laser stamping proposed in this invention. Figure 2This is a schematic diagram of a marking machine that includes a laser stamping testing method proposed in this invention; Figure 3 This is a schematic diagram of a sorting machine that includes a laser stamping test method proposed in this invention; Figure 4 This is a schematic diagram of the laser marking process flow for a testing method including laser stamping proposed in this invention. Figure 5 This is a schematic diagram of a marking stamp for a testing method including laser stamping proposed in this invention; Figure 6 This is a schematic diagram of the size template for a test method including laser stamping proposed in this invention.

[0017] The components include: 1. Marking machine; 2. Dust collector duct; 3. Moving plate; 4. Turntable; 5. Laser; 6. Support plate; 7. Material handling robot; 8. Turntable shuttle; 9. Dust collector; 10. Track; 11. Vibratory feeder; 12. Tape and reel position; 13. Visual inspection within the tape and reel; 14. Visual inspection failure bin; 15. Bottom 2D visual inspection; 16. Test and sorting bin; 17. Discharge robot; 18. Fixture shuttle; 19. Test position; 20. Shuttle; 21. Sorter; 22. Feeding area; 23. Test area; 24. Discharge area; 25. Packaging area; 26. Base; 27. Pin 1; 28. Text; 29. ​​Pattern.

[0018] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0020] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0021] like Figures 1-6As shown, this invention proposes a testing method including laser stamping, such as... Figure 1 As shown, the process includes step one: Vibratory feeder loading: Products (such as lead frames, IC chips, semiconductor wafers, etc.) are poured into the vibratory feeder 11, and the products are moved into the KIT track by the vibration of the vibratory feeder 11 and transferred to the turntable 4.

[0022] Step 2: Turntable PIN1 detection: The working unit consists of a rotating platform and a drive motor. The rotating platform is driven by the drive motor. The direction of pin1 27 is defined according to the position of the missing corner in the middle of the pad surface of the product. The product is rotated and adjusted. The product with the correct pin1 27 direction enters the marking machine 1 area under the suction force of the nozzle to prepare for laser operation.

[0023] Step 3: Laser marking process of marking machine: Marking machine 1 performs laser marking operation on the marking surface of the product; the worktable of marking machine 1 is equipped with a rotatable turntable 4, and a moving plate 3 is set on the turntable 4. The turntable 4 is driven to rotate by a motor, which drives the product on the moving plate 3 to adjust its position, so as to realize continuous laser operation of different products.

[0024] like Figure 4 As shown, it should be noted that the laser marking process is as follows: S1: Stamp making: Using professional design software (such as CorelDRAW, Adobe Illustrator), design the text 28, pattern 29, etc. of the stamp according to the product marking character information requirements; the pattern needs to be mirrored to ensure that the stamping effect is correct.

[0025] S2: Upload stamp for trial printing: Upload the stamp information template to the system. Before the official marking, perform a trial print on an inconspicuous location on scrap material or stamp blank to check whether the marking effect, such as the clarity, depth, and line thickness of the pattern, meets the requirements.

[0026] S3: Printing Positioning: Adjust the position of the marking head through the control software or manual operation function of the device to align the marking area with the predetermined position on the stamp blank; the layout and position of the marking pattern can be checked through the software preview function to see if they are correct.

[0027] S4: Adjust printing parameters: Open the control software of the CF320Mhandler marking machine and set parameters such as laser power, marking speed, and marking frequency according to the stamp material and design requirements.

[0028] S5: Production on the machine: After confirming that the test marking effect is satisfactory, start the marking machine 1 on the CF320Mhandler to begin marking the stamp blank; during the operation, keep the equipment running stably and avoid collisions or interference.

[0029] like Figure 5 and Figure 6 As shown, it should be noted that in the process of creating a seal template, the following parameters need to be adjusted: S1: Font height: Adjust the overall height of the character.

[0030] S2: Width factor: Adjusts the overall width of the character.

[0031] S3: Character Spacing Ratio: Adjusts the ratio of the spacing between characters.

[0032] Meanwhile, both the width factor and the character spacing ratio affect the overall character width; it is recommended to adjust using the width factor. The Common Attributes tab allows you to edit text and switch between different layers. The duty cycle in the Common Attributes affects the printing darkness of the characters; the larger the duty cycle, the darker the characters.

[0033] like Figure 3 As shown, it should be noted that the marking machine 1 includes mechanical structure components, auxiliary components, power drive components, and a control system. The mechanical structure components include a base 26, through which the marking machine 1 is mounted on the sorting machine 21. The sorting machine 21 includes a feeding area 22, a testing area 23, a discharging area 24, and a packaging area 25. The marking machine 1 is located in the feeding area 22. A support plate 6 is mounted on the base 26, which is used to support and fix the laser 5.

[0034] like Figure 2 As shown, the laser 5 is the core component, used to generate a laser beam. The laser beam propagation path is changed by rapidly and accurately rotating the reflector through the galvanometer scanning system, and the beam is focused into a spot on the surface of the product to complete the laser marking operation.

[0035] A turntable 4 is rotatably connected to the worktable of the marking machine 1. A movable plate 3 and a power drive assembly are provided on the turntable 4. The power drive assembly includes a motor, which drives the turntable 4 to rotate so that the chips can enter the marking position in sequence. The movable plate 3 is used to place the product, and the marking position of the product can be adjusted by adjusting its relative position.

[0036] The auxiliary components include a dust collector 9, which is connected to the marking machine 1 through a vacuum cleaner pipe 2. The dust collector 9 is used to absorb the smoke and dust generated during the marking process, so as to prevent dust from falling onto the chip and affecting the marking effect and chip quality.

[0037] The control system is one of the core components of the marking machine 1. Its functions include inputting and editing marking content, processing marking data and uploading to the system, connecting to external devices and importing data.

[0038] Step 4: Rotary shuttle feeding: The products laser-marked by the marking machine 1 are transported to the rotary shuttle 8 through the suction nozzle, waiting for the material handling robot 7 to grab and transport them to the test area 23.

[0039] Step 5: Robotic arm picking up material: The picking robot 7 is located above the corresponding track and moves along the track to transport the product on the turntable shuttle 8 to the shuttle 20 in the test area 23.

[0040] Step 6: Product placement in the feed shuttle: The feed shuttle is located on one side of the picking robot 7. The picking robot 7 places the laser-etched product into the feed shuttle 20 and waits for the test command. The feed shuttle 20 is connected to the test station 19 via a conveyor belt, and the product is transported to the test station 19 via the conveyor belt.

[0041] Step 7: Testing: Electrical testing of the product is performed using a test socket and a test loadboard. The socket is the component that directly contacts the chip. The loadboard is used to mount the socket, which is connected to the test machine through the loadboard, thus completing the electrical connection between the product and the test machine.

[0042] Step 8: Feeding Good Products: The feeding robot 17 is located above the corresponding track and moves along the track. Based on the test results, good products are transported through the feeding shuttle 20, and defective products are placed into the corresponding test bin classification box 16.

[0043] Step 9: Bin Sorting and Classification: Defective products that fail the test are placed into the test bin 16 by the unloading robot 17 for centralized processing.

[0044] Step 10: Robotic arm unloading: The unloading robotic arm 17 transports the tested products in the material shuttle 20 to the fixture material shuttle 18.

[0045] Step 11: Fixture shuttle carrying products: Good products that have passed the test are placed on the fixture shuttle 18 by the feeding robot 17, and then transported to the position above the bottom two-dimensional vision inspection 15 through the suction nozzle on the robot for appearance (5S) inspection.

[0046] Step 12: Bottom 2D Visual Inspection: Bottom 2D visual inspection 15 includes an image acquisition unit, an industrial camera and lens, a light source system, an image processing and analysis unit, and a control and communication unit. The industrial camera captures images of the bottom of the product, the lens is responsible for focusing and imaging, the light source system provides illumination, the image processing software processes and analyzes the images, the control unit coordinates the system's operation and communicates with the equipment's main control system, and after inspection, defective products are classified into the visual inspection failure box 14, while qualified products enter the tape and reel visual inspection 13.

[0047] Step Thirteen: Products that pass the jig shuttle load-bearing test: Products that pass the jig shuttle 18 load-bearing 5S test are awaiting visual inspection 13 within the tape tray.

[0048] Step Fourteen: Visual Inspection Inside the Tape: The visual inspection inside the tape consists of a camera module, a light source module, an image processing module, and a control module. It performs marking inspection on products that have passed the 5S inspection and entered the carrier tape groove. Products that fail the inspection are transferred to the visual inspection failure box 14 by the suction nozzle on the robotic arm.

[0049] Step 15: Visual Inspection Failure Box: Visual inspection failure box 14 is used to receive defective products that have failed 5S inspection and laser marking inspection.

[0050] Step 16: Tape receiving and packaging: Good products that pass the visual inspection 13 inside the tape are sent to the tape feeding station 12 to complete the final carrier tape packaging.

[0051] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0052] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

[0053] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the protection scope of the present invention.

Claims

1. A testing method including laser stamping, characterized in that: The laser stamping test method includes the following steps: Step 1: Vibratory feeder feeding: The product is transferred to the turntable (4) via the vibratory feeder (11). Step 2: Turntable PIN1 detection: The turntable (4) adjusts the product to the pin1 direction and sends it into the marking machine (1) to complete the laser operation; Step 3: Laser marking process of the marking machine: The marking machine (1) performs laser marking on the marking surface of the product, and achieves continuous laser marking of different products by adjusting the product position; Step 4: Rotary shuttle feeding: The laser-finished product is transported to the rotary shuttle (8) through a suction nozzle. Step 5: Robotic arm material handling: The product is transported via track (10) to the material shuttle (20) in the test area (23) located on one side of the material handling robot (7); Step 6: Product placement in the feed shuttle: The product is placed into the feed shuttle (20) by the picking robot (7) and transferred to the test position (19), waiting for the test instruction; Step Seven: Testing: Perform electrical tests on the product; Step 8: Good products are transported via shuttle (20) according to the test results, and defective products are placed into the corresponding test bin classification box (16). Step 9: Bin-based sorting and classification of defective products: Defective products are processed centrally. Step 10: Robotic arm unloading: The tested products are transported to the fixture shuttle (18) by the unloading robot (17); Step 11: Fixture shuttle carrying product: Transport the product to the top of the bottom two-dimensional vision inspection (15) for scanning inspection; Step 12: Bottom two-dimensional visual inspection (15): Defective products after bottom two-dimensional visual inspection (15) are classified into the visual inspection failure box, while qualified products are put into the tape and reel visual inspection (13) for further inspection. Step 13: Products that pass the jig shuttle load test: Products that pass the 5S load test of the jig shuttle (18) are ready for visual inspection (13) in the tape tray. Step Fourteen: Visual Inspection within the Tape: Visual inspection within the tape (13) Marking inspection is carried out on products that have passed the 5S inspection and entered the carrier tape groove. Defective products are transferred to the visual inspection failure box (14) by the suction nozzle of the feeding robot (17). Step 15: Visual Inspection Failure Box: The visual inspection failure box (14) is used to receive defective products that have failed 5S inspection and laser marking inspection; Step 16: Tape receiving and packaging: Send the good products to the tape feeding station (12) to complete the final carrier tape packaging.

2. The testing method including laser stamping according to claim 1, characterized in that: In step three, the laser marking process of the marking machine includes the following steps: S1: Stamp making: Using design software, create a stamp template based on the product marking character information requirements, and perform mirror processing on the pattern of the stamp template; S2: Upload stamp for trial printing: Upload the stamp information template to the system and perform a trial printing to check whether the pattern marking effect meets the standards; S3: Printing Positioning: Adjust the position of the marking head so that the marking area is aligned with the predetermined position on the stamp blank; S4: Adjust printing parameters: Ensure the accuracy of the layout and position of the marking pattern by adjusting the position of the marking head; S5: On-machine production: After confirming the test effect, start the marking machine (1) to carry out the marking operation.

3. The testing method including laser stamping according to claim 2, characterized in that: The marking machine (1) includes a mechanical structure component, an auxiliary component, a power drive component and a control system. The mechanical structure component includes a base (26), and the marking machine (1) is mounted on the sorting machine (21) via the base (26).

4. The testing method including laser stamping according to claim 3, characterized in that: A support plate (6) is installed on the base (26). The support plate (6) fixes the laser (5). The laser (5) generates a laser beam, and the galvanometer system of the scanning focusing part deflects the reflector at high speed to form a focused spot on the product surface to complete the laser.

5. The test method including laser stamping according to claim 3, characterized in that: The marking machine (1) has a turntable (4) rotatably connected to its worktable. The turntable (4) is equipped with a moving plate (3) and a power drive assembly. The power drive assembly includes a motor. The motor drives the turntable (4) to rotate, so that the chips are brought into the marking position in sequence.

6. The testing method including laser stamping according to claim 3, characterized in that: The auxiliary components include a dust collector (9), which is connected to the marking machine (1) through a vacuum cleaner pipe (2) and is used to adsorb the smoke and dust generated during the marking process.

7. The test method including laser stamping according to claim 3, characterized in that: The control system includes marking content input and editing, marking data processing and system uploading, external device docking and data import.

8. A testing method including laser stamping according to claim 2, characterized in that: The process for creating the seal template is as follows: S1: Adjust the overall height of the characters; S2: Adjusts the overall width of the characters; S3: Adjust the spacing between characters.

9. A testing method including laser stamping according to claim 3, characterized in that: The sorting machine (21) includes a feeding area (22), a testing area (23), a discharging area (24) and a packaging area (25), and the marking machine (1) is located in the feeding area (22).