Embedded multi-fixed thin plate high-temperature continuous temperature measurement method

Abstract

The invention discloses an embedded multi-fixed thin plate high-temperature continuous temperature measurement method, which belongs to the technical field of material forming, and comprises the following steps: firstly, processing a precise micropore at a preset point of a thin plate, and inserting a thermocouple measuring end to form mechanical embedding; then a welding machine is used for conducting spot welding on the periphery of the micropore to achieve welding connection; and finally, high-temperature glue is smeared to fill gaps and cured, and sealing and reinforcing are achieved. And the fixed thermocouple is connected to a multi-channel data acquisition card and temperature measurement software, so that the continuous, synchronous and accurate monitoring of the internal temperature field of the thin plate in the whole high-temperature processing process is realized. According to the invention, through ultra-strong fixation of the temperature measurement element, the reliability under a severe working condition is significantly improved, environmental interference is avoided, a complete and accurate data chain is provided for process optimization and quality control, and the system is simple in structure and has a good industrial popularization prospect.

Description

Technical Field

[0001] This invention relates to the field of material forming technology, and in particular to a method for continuous high-temperature temperature measurement of thin plates with embedded multiple fixation. Background Technology

[0002] With the increasing demand for lightweight and high-strength manufacturing, thin sheet materials, due to their excellent mechanical properties and lightweight characteristics, have been widely used in the manufacturing of automotive body structural parts, aerospace components, and electronic device housings. The processing of thin sheets often involves high-temperature processes such as hot stamping, hot rolling, annealing, and quenching. Temperature is a key parameter affecting the forming accuracy, mechanical property stability, and connection reliability of thin sheets, and its stable and accurate monitoring throughout the process is a core element in ensuring consistent product quality.

[0003] Currently, temperature measurement methods for high-temperature processing of thin plates are mainly divided into two categories: non-contact temperature measurement and contact temperature measurement, but both have significant technical drawbacks: Non-contact temperature measurement, represented by infrared thermometry, measures temperature by detecting infrared radiation on the surface of a thin plate. However, during high-temperature processing, the surface of the thin plate is prone to forming an oxide layer, absorbing moisture or dust. These factors can severely interfere with the transmission and reception of infrared signals, resulting in large measurement errors, typically exceeding ±5℃, which is insufficient to meet the requirements of high-precision processing. At the same time, infrared thermometry is limited by measurement distance and angle, making it impossible to directly monitor the internal temperature of the thin plate. Furthermore, temperature measurement will be interrupted in scenarios such as thin plate transfer or mold closure, preventing the formation of a complete temperature data chain.

[0004] Contact temperature measurement is currently the most widely used temperature measurement method. Among them, thermocouple temperature measurement is widely used due to its fast response speed and wide temperature measurement range. However, the traditional contact temperature measurement fixing methods have obvious shortcomings: some use clamping fixing, which is prone to loosening, displacement or even falling off during the transfer, positioning and forming of thin plates due to vibration and external impact, resulting in temperature measurement interruption or data distortion; some use single-point welding fixing, which is prone to thermal fatigue failure at high temperatures, and the stress concentration in the welding area may affect the local forming quality of the thin plate; some studies have tried to embed thermocouples in grooves on the surface of thin plates, but the groove structure will destroy the overall structural integrity of the thin plate, causing stress concentration around the groove during high-temperature processing, leading to problems such as deformation and cracking of the thin plate. At the same time, the gap between the groove and the thermocouple is easily affected by high-temperature airflow, reducing the temperature measurement accuracy.

[0005] In addition, most existing temperature measurement methods can only achieve single-point temperature measurement or asynchronous multi-point temperature measurement, which cannot accurately reflect the temperature field distribution and dynamic change law in different areas of the thin plate, and it is difficult to provide comprehensive data support for process parameter optimization.

[0006] Therefore, developing a technology that is fixed and reliable, provides accurate temperature measurement, has minimal impact on the performance of thin plates, and enables simultaneous and continuous temperature measurement at multiple points has become the key to solving the problem of quality control in high-temperature processing of thin plates. Summary of the Invention

[0007] To address the problems associated with non-contact and contact temperature measurement methods for high-temperature processing of thin plates, this invention provides an embedded, multi-fixed, continuous high-temperature temperature measurement method for thin plates. It abandons the single-fixation approach and designs a hierarchical, multi-mechanism collaborative "triple fixation" strategy, achieving continuous and accurate temperature measurement throughout the entire high-temperature process.

[0008] The technical solution adopted in this invention, a method for continuous high-temperature measurement of thin plates with embedded multiple fixation, is as follows: A method for continuous high-temperature measurement of thin plates with embedded multiple fixed elements, comprising the following steps: S1. Select the plate material to be tested, and set n temperature measurement points according to the processing characteristics and temperature measurement requirements of the plate material to be tested. S2. Microholes matching the thermocouple are machined at the preset temperature measurement points on the plate material to be measured; S3. Take a plate with microholes processed at the preset temperature measurement point, insert the thermocouple measuring end into the hole along the axis of the microhole, and ensure that the measuring end is tightly fitted to the bottom of the microhole to achieve the first mechanical engagement. S4. Use a welding machine to weld the thermocouple inserted into the microhole to a non-critical area around the microhole to achieve a second welding connection. S5. Apply high-temperature adhesive to the micro-hole inlet, the gap between the thermocouple and the inlet hole wall, and the welding area to ensure a tight filling. After the high-temperature adhesive has cured, a third adhesive bond is achieved. S6. Connect the fixed thermocouple terminals at each measuring point to the data acquisition card. Connect the acquisition card terminal to the temperature measuring device with temperature measurement software to realize real-time monitoring of the target temperature field.

[0009] A further improvement of the technical solution of the present invention is that the plate material to be tested includes various thin plate materials with a thickness of 0.5-6mm, such as steel, aluminum alloy, titanium alloy, and magnesium alloy, which are suitable for high-temperature processing.

[0010] A further improvement of the technical solution of the present invention is that: in step S1, n temperature measuring points are preset on the plate to be measured, the distance between adjacent temperature measuring points is ≥5mm, and two micro-holes should be processed at each temperature measuring point. The two micro-holes are used to install the two fixed ends of a single thermocouple to form two-point positioning; the distance between the two micro-holes at the same temperature measuring point is 1-8mm to avoid inaccurate temperature measurement due to the thermocouple wires being too close or too far apart. The distance between adjacent temperature measuring points should be greater than the distance between the two micro-holes, and the temperature measuring points near the edge should be ≥15mm away from the edge.

[0011] A further improvement of the technical solution of the present invention is that: in step S2, the diameter of the micropore is 0.3-4mm, the diameter tolerance should be controlled within ±0.05mm of the target value, the parallelism error between the axes of two micropores at the same temperature measurement point is ≤0.2°, and the perpendicularity deviation of the axis of the micropore relative to the surface of the plate is ≤0.5°.

[0012] A further improvement of the technical solution of the present invention is that: in step S3, the temperature measuring thermocouple has a temperature measuring range of 0-1370℃, and the thermocouple wire is wrapped with a high-temperature resistant insulating sleeve such as quartz fiber.

[0013] A further improvement of the technical solution of the present invention is that the welding machine in step S4 supports output power adjustment, the instantaneous pulse welding current is 50-600A, and the duration of a single welding pulse is 10-3000ms.

[0014] A further improvement of the technical solution of the present invention is that: the high-temperature adhesive in step S5 has a temperature resistance range of -4 to 1200℃, releases no volatiles at high temperatures, does not chemically react with the board material, and has a bonding strength ≥3Mpa.

[0015] A further improvement of the technical solution of the present invention is that: the data acquisition card in step S6 is a multi-channel analog input acquisition card, which supports multi-point synchronous acquisition and the acquisition frequency can be adjusted in the range of 1-100Hz.

[0016] A further improvement of the technical solution of the present invention is that the temperature measurement software in step S6 has the functions of real-time display of temperature curve and data recording, and its temperature data display refresh rate is ≥1Hz and data storage frequency is ≥1 point / second.

[0017] The technological advancements achieved by this invention due to the adoption of the above technical solutions are as follows: This invention employs a triple fixation method: mechanical fitting, welding, and adhesive sealing. Mechanical fitting achieves initial positioning of the temperature sensing element and the thin plate through an adaptable structure. Welding strengthens the structural connection, and adhesive sealing fills the gaps and isolates environmental interference. The three work together to ensure that the temperature sensing element remains stable under harsh conditions such as high temperature, vibration, and frequent transfer, avoiding the problems of loosening and falling off that are common with traditional fixing methods.

[0018] The temperature sensing element of this invention is embedded inside a thin plate through an installation structure, making direct and close contact with the plate body. This allows for accurate capture of temperature changes inside the plate, avoiding interference from environmental factors such as surface oxidation, moisture, and obstruction that affect non-contact temperature measurement. It also avoids temperature measurement errors caused by poor contact in surface-fixed methods.

[0019] This invention uses micropores as the mounting structure. Compared with surface grooving, the micropore structure causes minimal damage to the structural integrity of the thin plate and does not cause significant stress concentration. Mechanical performance tests show that the key mechanical properties of the thin plate using the temperature measurement method of this invention have a change rate of ≤2% compared with the thin plate without temperature measurement, which fully meets the requirements of subsequent processing. At the same time, the material, thickness, number of temperature measurement points and processing technology of the thin plate can be flexibly adjusted, which is suitable for various materials such as steel, aluminum alloy, and titanium alloy, as well as various high-temperature processing scenarios such as hot stamping and annealing.

[0020] This invention enables simultaneous acquisition of multiple temperature measurement points through a multi-channel data acquisition component. The acquisition frequency can be adjusted within the range of 1-100Hz as needed, which can comprehensively capture the temperature field distribution and dynamic changes in different areas of the thin plate, forming a complete data chain covering the entire high-temperature processing process. This provides a comprehensive data foundation for analyzing the correlation between temperature and the forming quality and mechanical properties of the thin plate. Attached Figure Description

[0021] Figure 1 These are the front and left views of the hot-stamped U-shaped part of the present invention; Figure 2 This is an enlarged schematic diagram of the triple-fixed thermocouple of the present invention; Figure 3 This is a schematic diagram of the preset temperature measurement points in Embodiment 1 of the present invention; Figure 4 This is a schematic diagram of the preset temperature measurement points in Embodiment 2 of the present invention; Figure 5 This is a temperature-time curve.

[0022] In the attached figures: 1. Temperature measuring thermocouple; 2. High-temperature adhesive; 3. Micropore; 4. Sheet material; 5. Welding point; 6-10. Temperature measuring points in Example 1; 11-13. Temperature measuring points in Example 2. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings. In the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily obscuring the concept of this invention.

[0024] This invention provides a high-temperature continuous temperature measurement method for thin plates using a triple-fixed embedded thermocouple. Temperature measurement is performed using a dedicated temperature measuring device, which includes a thermocouple, high-temperature adhesive, a data acquisition card, a welding machine, and a temperature measuring device with temperature measurement software. The thin plate material used in this invention includes, but is not limited to, steel, aluminum alloy, titanium alloy, magnesium alloy, and other thin plate materials with a thickness of 0.5-6mm suitable for high-temperature processing. The aforementioned continuous temperature measurement method specifically includes the following steps: S1. Select the plate material to be tested, and set n temperature measurement points in appropriate locations according to its processing characteristics and temperature measurement requirements.

[0025] The sheet metal has n preset temperature measurement points, with a spacing of ≥5mm between adjacent temperature measurement points. Each temperature measurement point should be machined with two micro-holes. The double micro-holes are used to install the two fixed ends of a single thermocouple to form a two-point positioning, further improving the fixation stability under high temperature, vibration and other environments. The spacing between the two micro-holes at the same temperature measurement point should be 1-8mm to avoid inaccurate temperature measurement due to the thermocouple wires being too close or too far apart. The spacing between adjacent temperature measurement points should be greater than the spacing between the two micro-holes. Temperature measurement points near the edge should be ≥15mm away from the edge.

[0026] S2. Microholes matching the thermocouple are machined at the preset temperature measurement points on the sheet material.

[0027] The micro-hole diameter is 0.3-4mm, and the micro-hole depth is determined according to the sheet size and temperature measurement requirements. The hole diameter tolerance should be controlled within ±0.05mm of the target value. The parallelism error between the axes of two holes should be ≤0.2°, and the perpendicularity deviation of the hole axis relative to the sheet surface should be ≤0.5°. S3. Take the plate material with micro-holes processed at the preset temperature measurement point, insert the thermocouple measuring end into the hole along the axis of the micro-hole, and ensure that the measuring end is tightly fitted to the bottom of the micro-hole to achieve the first mechanical engagement.

[0028] The temperature measuring range of the thermocouple is 0-1370℃, and the thermocouple wire is wrapped with a high-temperature resistant insulating sleeve such as quartz fiber.

[0029] S4. Use a welding machine to weld the thermocouple inside the insertion hole to a non-critical area around the microhole to achieve a second welding connection.

[0030] The welding machine supports output power adjustment, with an instantaneous pulse welding current of 50-600A and a single welding pulse duration of 10-3000ms.

[0031] S5. Apply high-temperature adhesive to the micro-hole inlet, the gap between the thermocouple and the inlet hole wall, and the welding area to ensure a tight filling. After the high-temperature adhesive has cured, a third adhesive bond is achieved.

[0032] The high-temperature adhesive has a temperature resistance range of -4 to 1200℃. It should not release volatile substances at high temperatures and should not chemically react with the board material. The bonding strength should be ≥3 MPa.

[0033] S6. Connect the fixed thermocouple terminals at each measuring point to the data acquisition card. Connect the acquisition card terminal to the temperature measuring device with temperature measurement software to realize real-time monitoring of the target temperature field.

[0034] The data acquisition card is a multi-channel analog input acquisition card that supports multi-point synchronous acquisition, and the acquisition frequency can be adjusted within the range of 1-100Hz; the temperature measurement software has real-time display of temperature curves and data recording functions, and its temperature data display refresh rate is ≥1Hz, and its data storage frequency is ≥1 point / second. Example

[0035] Taking the hot stamping of galvanized 22MnB5 steel sheet into U-shaped parts as an example, such as... Figure 1 As shown, the sheet metal is 500mm×250mm×1.4mm in size. The process involves heating the sheet metal to 880℃ in a furnace, holding it at that temperature for 5 minutes, removing it immediately after holding for 5 seconds for pre-cooling, and then placing it into a U-shaped mold for quenching and stamping into a U-shaped part.

[0036] The preparation process in this embodiment is as follows: Step 1: Determine the location of the temperature measurement point: like Figure 3 As shown, based on the process and temperature measurement requirements, the following five key temperature measurement points are preset on the galvanized 22MnB5 steel plate: 6 at the rounded corner, 7 at the upper rounded corner, 8 at the straight arm, 9 at the lower rounded corner, and 10 at the bottom. The edge points are 20mm away from the edge.

[0037] Step 2: Processing micropores: Microhole 3 was fabricated using YSH-1000 equipment and micro-hole electrical discharge machining technology. The electrode type was copper electrode with a diameter of 0.6 mm. A vise and a self-made tooling were used to fix it to ensure perpendicularity and parallelism. The microholes were fabricated with a diameter of 0.6 mm, a depth of 20 mm, and a spacing of 6 mm, for a total of 10 microholes.

[0038] Step 3: First layer of thermocouple fixation: A K-type solder joint thermocouple 1, with an outer layer of quartz fiber and metal mesh, a conductor diameter (wire diameter) of 0.5 mm, and a length of 4 m, is inserted along the axis of the micro-hole 3 to ensure that its measuring end is completely and tightly fitted to the bottom of the micro-hole 3 without any gaps, thus ensuring the accuracy of temperature measurement.

[0039] Step 4: Second fixation of the thermocouple: Using a portable handheld welding machine at 35% power, single-point welding pulse, pulse welding current of 80A, and pulse welding duration of 50ms-100ms, weld the temperature measuring thermocouple 1 to the welding point 5 at the inlet of the micro-hole 3, ensuring a firm weld without any incomplete welds and preventing it from falling off.

[0040] Step 5: Third fixation of the thermocouple: Z-7011 high-temperature adhesive 2 was applied to the inlet of micropore 3, the gap between thermocouple 1 and the inlet hole wall, and the welding point 5. The thermocouple was then fixed by curing at room temperature for 3 hours. Figure 2 As shown.

[0041] Step 6: Connect the temperature measuring equipment: Connect all thermocouple 1 terminals to the NI 9212 data acquisition card. Connect the acquisition card terminals to a laptop computer with LabVIEW real-time monitoring software via USB interface. Set the LabVIEW temperature measurement software to continuous acquisition mode, set the acquisition frequency to 50Hz, and use TDMS format for binary storage to achieve real-time transmission and monitoring of temperature measurement data.

[0042] Step 7: Perform the entire hot stamping process: The galvanized 22MnB5 hot-formed steel sheet 4, with thermocouples already fixed, is placed on the material preparation table. A robotic arm picks up sheet 4 and places it into a heating furnace preheated to 880℃ for 5 minutes. LabVIEW software records the temperature at each measuring point in real time, with temperature fluctuations ≤ ±3℃. After the holding time is reached, the robotic arm removes the sheet and immediately moves it to a water spray precooling station for 5 seconds of precooling. The sheet is then placed in a stamping press for stamping, with LabVIEW software recording the temperature during stamping. Once the temperature drops to room temperature, the mold is raised, and the robotic arm removes the sheet and places it back on the material preparation table. Finally, the data is exported to LabVIEW software to plot a temperature-time curve, as shown below. Figure 5 As shown, the temperature measurement has ended. Example

[0043] Taking the annealing heat treatment of TC4 titanium alloy as an example, the plate size is 425mm×425mm×3mm. The process is to anneal in an annealing furnace at a temperature of 900℃ for 2 hours. After the holding time is over, the plate is immediately removed and air-cooled to room temperature.

[0044] The preparation process in this embodiment is as follows: Step 1: Determine the location of the temperature measurement point: like Figure 4 As shown, based on the process and temperature measurement requirements, the following three key temperature measurement points are preset on the TC4 titanium alloy plate: the middle of the plate (12), the edge (11), and the edge (13). Points 11 and 13 are 100mm away from both sides of the edge.

[0045] Step 2: Processing micropores: Microhole 3 was fabricated using YSH-1000 equipment and micro-hole electrical discharge machining technology. The electrode type was copper electrode with a diameter of 1.3mm. A vise and a self-made tooling were used to fix it to ensure perpendicularity and parallelism. The microholes were fabricated with a diameter of 1.3mm, a depth of 25mm, and a spacing of 7mm, for a total of 6 microholes.

[0046] Step 3: First layer of thermocouple fixation: A K-type solder joint thermocouple 1, with an outer layer of quartz fiber and metal mesh, a conductor diameter (wire diameter) of 1.2 mm, and a length of 4 m, is inserted along the axis of the micro-hole 3 to ensure that its measuring end is completely and tightly fitted to the bottom of the micro-hole 3 without any gaps, thus ensuring the accuracy of temperature measurement.

[0047] Step 4: Second fixation of the thermocouple: Using a portable handheld welding machine at 25% power, single-point welding pulse, pulse welding current of 60A, and pulse welding duration of 50ms-100ms, weld the temperature measuring thermocouple 1 to the welding point 5 at the inlet of the micro-hole 3, ensuring that the weld is firm and free of incomplete welds, and preventing it from falling off.

[0048] Step 5: Third fixation of the thermocouple: Z-7011 high-temperature adhesive 2 was applied to the inlet of micropore 3, the gap between thermocouple 1 and the inlet hole wall, and the welding point 5. The thermocouple was then fixed by curing at room temperature for 3 hours. Figure 2 As shown.

[0049] Step 6: Connect the temperature measuring equipment: Connect all thermocouple 1 terminals to the NI 9212 data acquisition card. Connect the acquisition card terminals to a laptop computer with LabVIEW real-time monitoring software via USB interface. Set the LabVIEW temperature measurement software to continuous acquisition mode, set the acquisition frequency to 50Hz, and use TDMS format for binary storage to achieve real-time transmission and monitoring of temperature measurement data.

[0050] Step 7: Perform the entire annealing process: The TC4 titanium alloy sheet 4, with thermocouples already fixed, is placed on the material preparation table. A robotic arm picks up sheet 4 and places it into an annealing furnace preheated to 900℃, where it is held for 2 hours. LabVIEW software records the temperature at each measurement point in real time, with temperature fluctuations ≤ ±3℃. After the holding time is reached, the robotic arm removes the sheet and immediately moves it to the material preparation table for air cooling to room temperature, ending the temperature measurement. Finally, the data is exported to LabVIEW software to plot a temperature-time curve, concluding the temperature measurement process.

[0051] In the above examples, the sheet metal movement distance was ≥10m throughout the entire process, and the robot arm's movement speed was 2m / s. Thermocouples did not detach during the entire process. Figure 5 The temperature curve is smooth and continuous, clearly reflecting the temperature changes at each stage.

[0052] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the concept and scope of the present invention. Various modifications and improvements made to the technical solutions of the present invention by those skilled in the art without departing from the inventive concept should fall within the protection scope of the present invention. All technical contents for which protection is sought in this invention are fully described in the claims.

Claims

1. A method for high-temperature continuous temperature measurement of a thin plate with embedded multiple fastenings, characterized by, The method comprises the following steps: S1, selecting a to-be-tested temperature plate material, and setting n to-be-tested temperature points according to the processing process characteristics and temperature measurement requirements of the to-be-tested temperature plate material; S2, processing micro-holes matched with thermocouples at the preset to-be-tested temperature points of the to-be-tested temperature plate material; S3, taking the plate material with the processed micro-holes at the preset temperature measurement points, inserting the measurement end of the thermocouple into the hole along the micro-hole axis, ensuring that the measurement end is tightly combined with the bottom of the micro-hole, and realizing the first mechanical embedding; S4, welding the thermocouple inserted into the micro-hole at the non-critical area around the micro-hole by using a welding machine, and realizing the second welding connection; S5, smearing high-temperature glue at the entrance of the micro-hole, the gap between the thermocouple and the entrance hole wall, and the welding area, ensuring that the filling is dense, and after the high-temperature glue is solidified, realizing the third glue connection; S6, connecting the terminal of each fixed thermocouple to a data acquisition card, connecting the terminal of the data acquisition card to a temperature measurement equipment with temperature measurement software, and realizing real-time monitoring of the target temperature field.

2. The method of claim 1, wherein the method is a high-temperature continuous temperature measurement method for a thin plate with embedded multiple fastenings. The to-be-tested temperature plate material includes steel, aluminum alloy, titanium alloy, magnesium alloy, and other types of thin plate materials with a thickness of 0.5-6 mm suitable for high-temperature processing.

3. The method of claim 1, wherein the method is a high-temperature continuous temperature measurement method of a thin plate with embedded multiple fastenings. In the step S1, the to-be-tested temperature plate material is preset with n temperature measurement points, the distance between adjacent temperature measurement points is greater than or equal to 5 mm, two micro-holes are processed at each temperature measurement point, and the two micro-holes are used to install two fixed ends of a single thermocouple to form two-point positioning; the distance between the two micro-holes of the same temperature measurement point is 1-8 mm to avoid inaccurate temperature measurement caused by the thermocouple wire being too close or too far apart; the distance between adjacent temperature measurement points should be greater than the distance between the two micro-holes; the distance between the edge temperature measurement point and the edge is greater than or equal to 15 mm.

4. The method of claim 1, wherein the method is a high-temperature continuous temperature measurement method for a thin plate with embedded multiple fastenings. In the step S2, the micro-hole diameter is 0.3-4 mm, the hole diameter tolerance should be controlled within ±0.05 mm of the target value, the parallelism error between the two micro-hole axes of the same temperature measurement point is less than or equal to 0.2°, and the perpendicularity deviation of the micro-hole axis relative to the plate surface is less than or equal to 0.5°.

5. The method of claim 1, wherein the method is a high-temperature continuous temperature measurement method of a thin plate with embedded multiple fastenings. In the step S3, the temperature measurement thermocouple has a temperature measurement range of 0-1370℃, and the thermocouple wire is wrapped with a high-temperature-resistant insulating sleeve such as quartz fiber.

6. The method of claim 1, wherein the method is a high-temperature continuous temperature measurement method of a thin plate with embedded multiple fastenings. In the step S4, the welding machine supports output power adjustment, the instantaneous pulse welding current is 50-600A, and the duration of a single welding pulse is 10-3000ms.

7. The method of claim 1, wherein the method is a high-temperature continuous temperature measurement method of a thin plate with embedded multiple fastenings. In the step S5, the high-temperature glue has a temperature resistance range of -4-1200℃, does not release volatile substances at high temperatures, and does not have a chemical reaction with the plate material, and the bonding strength is greater than or equal to 3Mpa.

8. The method of claim 1, wherein the method is a high-temperature continuous temperature measurement method of a thin plate with embedded multiple fastenings. In the step S6, the data acquisition card is a multi-channel analog input acquisition card, supports multi-point synchronous acquisition, and the acquisition frequency can be adjusted within the range of 1-100Hz.

9. The method of claim 1, wherein the method is a high-temperature continuous temperature measurement method of a thin plate with embedded multiple fastenings. In the step S6, the temperature measurement software has the functions of real-time display of temperature curve and data recording, the display refresh rate of temperature data is greater than or equal to 1Hz, and the data storage frequency is greater than or equal to 1 point per second.

Images