Oven controlled crystal oscillator based on copper plate thermal coupling

Abstract

The invention discloses an oven controlled crystal oscillator based on copper plate thermal coupling, and the key points of the technical scheme are that the oven controlled crystal oscillator comprises a base, and a PCB is arranged in the base; the crystal is arranged in the base, bonding glue is adhered to the four corners of the bottom surface of the crystal, and a copper plate is arranged on the top surface of the PCB; when the PCB works, the heating surface of the PCB can transmit the temperature to the copper plate, so that the temperature on the copper plate can heat the crystal, and meanwhile, the temperature on the copper plate can be guided to the copper pipe through the temperature guide block, so that the first temperature sensor in the copper pipe can detect the temperature on the copper pipe in real time; and when the external environment temperature changes, the two heaters are controlled to work through the temperature control circuit, so that the copper plate is rapidly heated, the crystal can generate a working environment with a constant internal temperature along with the change of the external environment, and the working efficiency of the crystal is improved.

Description

Technical Field

[0001] This invention relates to the field of oscillator technology, and more specifically to a thermostatic crystal oscillator based on copper plate thermal coupling. Background Technology

[0002] A cryogenic crystal oscillator is a high-stability frequency source that reduces the impact of ambient temperature changes on the oscillation frequency by controlling the temperature of the crystal oscillation unit and its related circuits. It is widely used in communication systems, navigation and positioning, test and measurement equipment, and high-precision timing devices. Its basic working principle involves placing a heating device in the crystal's working area, along with a temperature sensor and temperature control circuit, to maintain the crystal and key circuits within a preset constant temperature range, thereby improving the frequency stability and reliability of the crystal oscillator. As electronic devices increasingly demand higher frequency stability and environmental adaptability, the temperature control performance of cryogenic crystal oscillators under complex environmental conditions, especially the temperature control response speed and temperature distribution uniformity, is gradually becoming a crucial factor affecting their overall performance.

[0003] Existing isothermal crystal oscillators typically mount the crystal, heating element, and temperature sensor on the same cavity or circuit board, and adjust the heating power through a temperature control circuit to achieve constant temperature control.

[0004] Due to frequent changes in external ambient temperature, unreasonable internal structural layout, or long heat conduction paths, the crystal and key circuit areas are still easily affected by temperature fluctuations, resulting in problems such as slow temperature control response and uneven temperature distribution. To solve these problems, we propose a thermostatic crystal oscillator based on copper plate thermal coupling. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a thermostatic crystal oscillator based on copper plate thermal coupling, thus solving the problem.

[0006] The above-mentioned technical objective of the present invention is achieved through the following technical solution:

[0007] A temperature-controlled crystal oscillator based on copper plate thermal coupling includes:

[0008] The base, the interior of which is equipped with a PCB board,

[0009] The crystal is disposed inside the base, and adhesive is attached to the four corners of the bottom surface of the crystal. A copper plate is disposed on the top surface of the PCB board.

[0010] A cover plate disposed on the top surface of the base;

[0011] A heating element located inside the base is used to heat the copper plate;

[0012] An adjustment component located inside the base is used to adjust the position of the copper plate.

[0013] Preferably, the heating component includes two heaters fixed to the bottom of the copper plate, the heaters being electrically connected to the PCB board, a placement groove being formed on the top surface of the copper plate, a temperature-conducting block being fixedly connected inside the placement groove, a copper tube being fixedly connected to one side of the temperature-conducting block, and a first temperature sensor being disposed inside the copper tube, the first temperature sensor being electrically connected to the PCB board.

[0014] Preferably, the copper tube has a temperature-conducting pad inside, and one side of the temperature-conducting pad is attached to the first temperature sensor.

[0015] Preferably, the adjusting component includes two adjusting plates disposed inside the base. The bottom surface of the PCB board is fixedly connected to the top surface of the adjusting plate. Adjusting blocks are fixedly connected to both the front and rear sides of the adjusting plate. Two adjusting slots are opened on both the front and rear sides inside the base. The adjusting blocks are slidably installed with the adjusting slots. An adjusting rod is rotatably installed inside the adjusting slot. An adjusting hole is opened on the top surface of the adjusting block. The adjusting rod is threadedly connected to the adjusting hole.

[0016] Preferably, the top surface of the adjusting rod is provided with a control groove, the inside of the control groove is provided with a control rod, the top surface of the control rod is fixedly connected with a control plate, the bottom surface inside the base is provided with a plurality of limiting grooves, the bottom surface of the control plate is fixedly connected with a limiting frame, the limiting frame is movably fitted together with the limiting groove, the outer wall surface of the control rod is fixedly connected with two connecting blocks, the inner wall surface of the control groove is provided with two connecting grooves, and the connecting blocks are movably fitted together with the connecting grooves.

[0017] Preferably, a detection groove is provided on one side of the base, and a second temperature sensor is fixedly connected inside the detection groove. The second temperature sensor is electrically connected to the PCB board.

[0018] Preferably, two limiting plates are fixedly connected to the bottom surface inside the base, and an installation groove is provided on one side of the limiting plate, with a protective pad being movably installed inside the installation groove.

[0019] Preferably, a positioning frame is fixedly connected to the bottom surface of the cover plate, a positioning groove is provided on the top surface of the base, the positioning frame and the positioning groove are movably fitted together, a sealing gasket is fixedly connected to the bottom surface of the cover plate, and a low thermal conductivity insulation layer is provided on the top surface inside the cover plate.

[0020] In summary, the present invention has the following main beneficial effects:

[0021] By setting up a PCB board, when the PCB board is working, the heating surface of the PCB board can transfer heat to the copper plate, so that the temperature on the copper plate can heat the crystal. At the same time, the temperature on the copper plate can be guided to the copper tube through the temperature conducting block, so that the first temperature sensor inside the copper tube can detect the temperature on the copper tube in real time, thereby determining whether the copper plate is within the appropriate temperature conduction range. If the temperature is too low, the first temperature sensor can transmit an electrical signal to the PCB board, and the PCB board controls two heaters to work, thereby heating the copper plate to reach the appropriate temperature conduction range. When the external ambient temperature changes, the temperature control circuit controls the two heaters to work, thereby quickly heating the copper plate, so that the crystal can maintain a constant internal temperature working environment as the external environment changes, thereby improving the working efficiency of the crystal. At the same time, the temperature on the copper tube can be transferred to the first temperature sensor through the temperature conducting pad, thereby improving the temperature transfer efficiency.

[0022] By setting up adjustment plates, when the operator fixes the PCB board on the top surface of the two adjustment plates, the adjustment plates can move up and down inside the base, thereby moving the PCB board and adjusting the position of the copper plate. This allows the operator to fit the top surface of copper plates of different thicknesses with the bottom surface of the crystal, so that the temperature of the copper plate can be transferred to the crystal. By adjusting the position of the control plate, the limit frame can be moved out of the limit groove. At the same time, when the control plate drives the control rod to rotate, the control rod can drive the adjustment rod to rotate through the connecting block, so that the adjustment rod can rotate inside the adjustment groove.

[0023] By setting a sealing gasket, the gasket can seal the space between the cover plate and the base, preventing gas inside the base from leaking out through the gap between the base and the cover plate after the cover plate is sealed. The low thermal conductivity insulation layer can reduce the absorption of heat radiation inside the base by the cover plate. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0025] Figure 2 This is a schematic diagram of the limiting plate structure of the present invention;

[0026] Figure 3 This is a schematic diagram of the base structure of the present invention;

[0027] Figure 4 This is a schematic diagram of the temperature-conducting block structure of the present invention;

[0028] Figure 5 yes Figure 3 A magnified schematic diagram of the structure of part A in the diagram;

[0029] Figure 6This is a schematic diagram of the adjusting rod structure of the present invention;

[0030] Figure 7 This is a schematic diagram of the protective pad structure of the present invention;

[0031] Figure 8 This is a schematic diagram of the cover plate structure of the present invention.

[0032] Reference numerals: 100, base; 101, PCB board; 102, crystal; 103, adhesive; 104, copper plate; 105, cover plate;

[0033] 200. Heater; 201. Placement slot; 202. Temperature-conducting block; 203. Copper tube; 204. First temperature sensor; 205. Temperature-conducting pad;

[0034] 300. Adjusting plate; 301. Adjusting block; 302. Adjusting groove; 303. Adjusting rod; 304. Adjusting hole;

[0035] 400. Control slot; 401. Control rod; 402. Control board; 403. Limit slot; 404. Limit frame; 405. Connecting block; 406. Connecting slot;

[0036] 500, Detection tank; 501, Second temperature sensor;

[0037] 600, Limiting plate; 601, Mounting slot; 602, Protective pad;

[0038] 700, Positioning frame; 701, Positioning groove; 702, Sealing gasket; 703, Low thermal conductivity insulation layer. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] refer to Figure 1 - Figure 8 A thermostatic crystal oscillator based on copper plate thermal coupling includes a base 100, a PCB board 101, a heating component, and an adjustment component;

[0041] The base 100 is an existing structure and will not be described in detail here. The base 100 has a PCB board 101 inside, and the PCB board 101 is respectively equipped with a crystal oscillation circuit, a power supply circuit and a temperature control circuit.

[0042] The crystal 102 is disposed inside the base 100. Adhesive 103 is attached to the four corners of the bottom surface of the crystal 102 to bond the crystal 102 to the inside of the base 100, so that the crystal 102 is above the PCB board 101.

[0043] A copper plate 104 is disposed above the PCB board 101;

[0044] The cover plate 105 located on the top surface of the base 100 can seal the top of the base 100;

[0045] The heating element located inside the base 100 is used to heat the copper plate 104. When the copper plate 104 is bonded to the crystal 102, the temperature on the copper plate 104 can be transferred to the crystal 102, thereby quickly improving the temperature stability of the crystal 102 and the key circuit.

[0046] An adjustment component located inside the base 100 is used to adjust the position of the copper plate 104 so that the top surface of the copper plate 104 can be attached to the bottom surface of the crystal 102.

[0047] The heating component includes two heaters 200 fixed to the bottom of the copper plate 104. The heaters 200 are electrically connected to the temperature control circuit of the PCB board 101. A placement groove 201 is provided on the top surface of the copper plate 104. A temperature conducting block 202 is fixedly connected inside the placement groove 201. A copper tube 203 is fixedly connected to one side of the temperature conducting block 202. A first temperature sensor 204 is provided inside the copper tube 203. The first temperature sensor 204 can detect the temperature of the copper plate 104 in real time. The first temperature sensor 204 is electrically connected to the PCB board 101.

[0048] By configuring the PCB board 101, when the PCB board 101 is working, its heating surface can transfer heat to the copper plate 104, allowing the temperature on the copper plate 104 to heat the crystal 102. Simultaneously, the temperature on the copper plate 104 can be guided to the copper tube 203 via the temperature-conducting block 202, enabling the first temperature sensor 204 inside the copper tube 203 to detect the temperature in real time and determine if the copper plate 104 is within a suitable temperature conduction range. If the temperature is too low, the first temperature sensor 204 can transmit an electrical signal to the PCB board 101, which then controls two heaters 200 to operate, thereby heating the copper plate 104 to achieve a suitable temperature conduction range. Furthermore, when the external ambient temperature changes, the temperature control circuit controls the two heaters 200 to operate, rapidly heating the copper plate 104. This allows the crystal 102 to maintain a constant internal temperature working environment regardless of changes in the external environment, thereby improving the working efficiency of the crystal 102.

[0049] As a further embodiment of the present invention, a temperature-conducting pad 205 is provided inside the copper tube 203, and one side of the temperature-conducting pad 205 is attached to the first temperature sensor 204.

[0050] By setting up the copper tube 203, the temperature on the copper tube 203 can be transferred to the first temperature sensor 204 through the thermal pad 205, thereby improving the temperature transfer efficiency.

[0051] As a further embodiment of the present invention, the adjustment component includes two adjustment plates 300 disposed inside the base 100. The bottom surface of the PCB board 101 is fixedly connected to the top surface of the adjustment plate 300. When the operator fixes the PCB board 101 to the top surface of the two adjustment plates 300, the adjustment plates 300 move up and down inside the base 100, which can drive the PCB board 101 to move, thereby adjusting the position of the copper plate 104. This allows the operator to fit the top surface of the copper plate 104 of different thicknesses with the bottom surface of the crystal 102, so that the temperature of the copper plate 104 can be transferred to the crystal 102. Adjustment blocks 301 are fixedly connected to both the front and rear sides of the adjustment plate 300. Two adjustment slots 302 are opened on both the front and rear sides inside the base 100. The adjustment blocks 301 and the adjustment slots 302 are slidably installed together. An adjustment rod 303 is rotatably installed inside the adjustment slots 302. An adjustment hole 304 is opened on the top surface of the adjustment block 301. The adjustment rod 303 is threadedly connected to the adjustment hole 304.

[0052] By setting the adjusting rod 303, when the adjusting rod 303 rotates inside the adjusting groove 302, the adjusting block 301 can move up and down inside the adjusting groove 302. When the adjusting block 301 moves, it can drive the adjusting plate 300 to move, thereby adjusting the position of the PCB board 101 inside the base 100.

[0053] As a further embodiment of the present invention, the top surface of the adjusting rod 303 is provided with a control groove 400, the inside of the control groove 400 is provided with a control rod 401, the top surface of the control rod 401 is fixedly connected with a control plate 402, the bottom surface inside the base 100 is provided with a plurality of limiting grooves 403, the bottom surface of the control plate 402 is fixedly connected with a limiting frame 404, the limiting frame 404 and the limiting groove 403 are movably fitted together, the outer wall surface of the control rod 401 is fixedly connected with two connecting blocks 405, the inner wall surface of the control groove 400 is provided with two connecting grooves 406, the connecting blocks 405 and the connecting grooves 406 are movably fitted together;

[0054] By setting up the control plate 402 and adjusting its position, the limiting frame 404 can be moved out of the limiting groove 403. At the same time, when the control plate 402 drives the control rod 401 to rotate, the control rod 401 can drive the adjusting rod 303 to rotate through the connecting block 405, so that the adjusting rod 303 can rotate inside the adjusting groove 302.

[0055] As a further embodiment of the present invention, a detection groove 500 is provided on one side of the base 100, and a second temperature sensor 501 is fixedly connected inside the detection groove 500. The second temperature sensor 501 is electrically connected to the PCB board 101.

[0056] By setting a second temperature sensor 501, the second temperature sensor 501 can detect the internal and external temperatures of the base 100, so that the crystal 102 can generate a working environment with a constant internal temperature as the external environment changes.

[0057] As a further embodiment of the present invention, two limiting plates 600 are fixedly connected to the bottom surface inside the base 100. An installation groove 601 is provided on one side of the limiting plate 600, and a protective pad 602 is movably installed inside the installation groove 601.

[0058] By setting up the protective pad 602, when the worker places the protective pad 602 inside the mounting slot 601, the protective pad 602 can limit the crystal 102 before installation.

[0059] As a further embodiment of the present invention, a positioning frame 700 is fixedly connected to the bottom surface of the cover plate 105, and a positioning groove 701 is provided on the top surface of the base 100. The positioning frame 700 and the positioning groove 701 are movably fitted together. A sealing gasket 702 is fixedly connected to the bottom surface of the cover plate 105, and a low thermal conductivity insulation layer 703 is provided on the top surface inside the cover plate 105. The sealing gasket 702 can seal between the cover plate 105 and the base 100 to prevent gas inside the base 100 from flowing out through the gap between the base 100 and the cover plate 105 after the cover plate 105 is sealed. The low thermal conductivity insulation layer 703 can reduce the absorption of heat radiation inside the base 100 by the cover plate 105.

[0060] By setting the positioning frame 700, when the staff places the cover plate 105 on the top surface of the base 100, the positioning frame 700 can be movably fitted together with the positioning groove 701, thereby limiting the cover plate 105 before packaging and preventing the cover plate 105 from shifting randomly during packaging.

[0061] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A constant temperature crystal oscillator based on thermal coupling of copper plates, characterized in that, The utility model relates to a crystal oscillator, including: The inside of base (100) is equipped with PCB board (101); The bottom surface of crystal (102) is pasted with adhesive (103) in four corner positions, and the top surface of PCB board (101) is equipped with copper plate (104); Cover plate (105) is arranged on the top surface of base (100); Heating component is arranged in the inside of base (100) and is used for heating copper plate (104); Adjusting component is arranged in the inside of base (100) and is used for adjusting the position of copper plate (104).

2. The constant temperature crystal oscillator based on copper plate thermal coupling according to claim 1, characterized in that, The heating component includes two heaters (200) fixed to the bottom of copper plate (104), the heater (200) is electrically connected with the PCB board (101), the top surface of copper plate (104) is provided with a placing groove (201), the inside of placing groove (201) is fixedly connected with a temperature guide block (202), one side of temperature guide block (202) is fixedly connected with a copper pipe (203), the inside of copper pipe (203) is provided with a first temperature sensor (204), and the first temperature sensor (204) is electrically connected with the PCB board (101).

3. The constant temperature crystal oscillator based on copper plate thermal coupling according to claim 2, characterized in that, The inside of copper pipe (203) is provided with a temperature guide pad (205), and one side of temperature guide pad (205) is attached with the first temperature sensor (204).

4. The constant temperature crystal oscillator based on copper plate thermal coupling according to claim 1, characterized in that, The adjusting component includes two adjusting plates (300) arranged in the inside of base (100), the bottom surface of PCB board (101) is fixedly connected with the top surface of adjusting plate (300), the front and rear sides of adjusting plate (300) are fixedly connected with adjusting blocks (301), the front and rear sides of base (100) are provided with two adjusting grooves (302), the adjusting blocks (301) and adjusting grooves (302) are slidably installed, the inside of adjusting groove (302) is rotatably installed with adjusting rod (303), the top surface of adjusting block (301) is provided with adjusting hole (304), and adjusting rod (303) is screwedly connected with adjusting hole (304).

5. The constant temperature crystal oscillator based on copper plate thermal coupling according to claim 4, characterized in that, The top surface of adjusting rod (303) is provided with control groove (400), the inside of control groove (400) is provided with control rod (401), the top surface of control rod (401) is fixedly connected with control plate (402), the bottom surface of base (100) is provided with a plurality of limiting grooves (403), the bottom surface of control plate (402) is fixedly connected with limiting frame (404), the limiting frame (404) and limiting groove (403) are movably sleeved, the outer wall surface of control rod (401) is fixedly connected with two connecting blocks (405), the inner wall surface of control groove (400) is provided with two connecting grooves (406), and the connecting block (405) and connecting groove (406) are movably sleeved.

6. The constant temperature crystal oscillator based on copper plate thermal coupling according to claim 2, characterized in that, The base (100) is provided with a detection groove (500) on one side, and a second temperature sensor (501) is fixedly connected inside the detection groove (500), and the second temperature sensor (501) is electrically connected with the PCB (101).

7. The constant temperature crystal oscillator based on copper plate thermal coupling according to claim 1, characterized in that, The bottom surface of the base (100) is fixedly connected with two limiting plates (600), one side of the limiting plate (600) is provided with a mounting groove (601), and the protection pad (602) is movably mounted in the mounting groove (601).

8. The constant temperature crystal oscillator based on copper plate thermal coupling according to claim 1, characterized in that, The bottom surface of the cover plate (105) is fixedly connected with a positioning frame (700), the top surface of the base (100) is provided with a positioning groove (701), the positioning frame (700) and the positioning groove (701) are movably sleeved together, the bottom surface of the cover plate (105) is fixedly connected with a sealing gasket (702), and the top surface of the cover plate (105) is provided with a low-thermal-conductivity thermal insulation layer (703).

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