Multi-layer sandwich aluminum-based printed board of high-power module

Abstract

The invention discloses a high-power module multilayer sandwich aluminum-based printed board, which comprises a printed board main body and a wire passing hole arranged on the printed board main body, and is characterized in that the printed board main body is formed by laminating a surface layer, an aluminum substrate and a bottom layer, and the surface layer and the bottom layer have the same structure and are symmetrically arranged; the surface layer or the bottom layer is sequentially composed of a first high-thermal-conductivity insulating medium layer, a copper circuit layer, a second high-thermal-conductivity insulating medium layer and a wiring layer from inside to outside, and the wire passing hole penetrates through the aluminum substrate or the bottom layer from the surface layer; uniform heat distribution can be achieved, heat can be rapidly diffused on the whole aluminum substrate, the phenomenon of local overheating is avoided, the working temperature is remarkably reduced, collaborative improvement of thermal-electric-mechanical properties is achieved, the stability of the PCB is improved, the service life of the PCB is prolonged, the double-face wiring function is achieved, the wiring density is easy to reasonably arrange, and the production cost is reduced. The problems that a traditional aluminum substrate can only achieve single-face wiring and is insufficient in wiring density are solved.

Description

Technical Field

[0001] This invention relates to the field of PCB board stack-up structure technology, specifically to a multi-layer sandwich aluminum-based printed circuit board for high-power modules. Background Technology

[0002] The current trend of avionics products towards high density and multi-functionality makes the development of power electronic products towards high efficiency and high power an inevitable trend. In particular, the heat dissipation problem of high-power electronic products, represented by power module products, is often the key and difficult point of PCB boards.

[0003] Traditional PCBs mostly use single-sided aluminum substrates, which have the problems of only being able to route on one side and insufficient routing density; to address this, a multi-layer sandwich aluminum substrate PCB for high-power modules is proposed. Summary of the Invention

[0004] The purpose of this invention is to provide a multi-layer sandwich aluminum-based printed circuit board for high-power modules to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a multilayer sandwich aluminum-based printed circuit board for high-power modules, comprising a printed circuit board body and through holes formed on the printed circuit board body. The printed circuit board body is formed by stacking a top layer, an aluminum substrate, and a bottom layer. The top layer and the bottom layer have the same structure and are arranged symmetrically. The top layer or the bottom layer is composed of a first high thermal conductivity insulating dielectric layer, a copper circuit layer, a second high thermal conductivity insulating dielectric layer, and a wiring layer from the inside to the outside. The through holes pass through the aluminum substrate or the bottom layer from the top layer, and the walls of the through holes are circumferentially coated with resin.

[0006] Furthermore, the insulating media of both the first and second high thermal conductivity insulating media layers are made of high-performance PP material, which is an electronic-grade glass fiber cloth reinforced hydrocarbon ceramic matrix.

[0007] Furthermore, an adhesive is provided between the first high thermal conductivity insulating dielectric layer and the copper circuit layer, between the copper circuit layer and the second high thermal conductivity insulating dielectric layer, or between the second high thermal conductivity insulating dielectric layer and the wiring layer. The adhesive is yellow glue, red glue, silicone glue, hot melt glue, or thermally conductive silicone.

[0008] The beneficial effects of this invention are as follows: This invention is made by laminating a trace layer, a copper circuit layer, a high thermal conductivity insulating dielectric layer, and an aluminum substrate, which can achieve uniform heat distribution. Heat can be rapidly diffused across the entire aluminum substrate, avoiding local overheating, significantly reducing the operating temperature, achieving synergistic improvement in thermal-electrical-mechanical performance, and improving the stability and lifespan of the PCB board. Furthermore, the top and bottom layers have the same structure and are arranged symmetrically. The copper circuit layer and trace layer are placed on the top and bottom of the aluminum substrate, providing double-sided wiring functionality. This facilitates reasonable layout of wiring density and solves the problems of traditional aluminum substrates only being able to provide single-sided wiring and insufficient wiring density. Attached Figure Description

[0009] Figure 1 This is a cross-sectional view of the structure of the multi-layer sandwich aluminum-based printed circuit board for the high-power module of the present invention.

[0010] In the figure: 1. Aluminum substrate; 2. First high thermal conductivity insulating dielectric layer; 3. Copper circuit layer; 4. Second high thermal conductivity insulating dielectric layer; 5. Wiring layer; 6. Through hole; 7. Resin. Detailed Implementation

[0011] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0012] Please see Figure 1 This invention provides a technical solution: a multi-layer sandwich aluminum-based printed circuit board for high-power modules, including a printed circuit board body and through holes 6 formed on the printed circuit board body. The printed circuit board body is formed by stacking a top layer, an aluminum substrate 1 and a bottom layer. The top layer and the bottom layer have the same structure and are arranged symmetrically. The top layer or the bottom layer is composed of a first high thermal conductivity insulating dielectric layer 2, a copper circuit layer 3, a second high thermal conductivity insulating dielectric layer 4 and a wiring layer 5 from the inside to the outside.

[0013] In this embodiment, the insulating media of both the first high thermal conductivity insulating dielectric layer 2 and the second high thermal conductivity insulating dielectric layer 4 are made of high-performance PP material. The high-performance PP material is, but is not limited to, electronic-grade glass fiber cloth reinforced hydrocarbon ceramic matrix. An adhesive is provided between the first high thermal conductivity insulating dielectric layer 2 and the copper circuit layer 3, between the copper circuit layer 3 and the second high thermal conductivity insulating dielectric layer 4, or between the second high thermal conductivity insulating dielectric layer 4 and the wiring layer 5. The adhesive is, but is not limited to, yellow glue, red glue, silicone glue, hot melt glue, or thermally conductive silicone.

[0014] Before fabricating the high-power module multilayer sandwich aluminum-based printed circuit board, the technical requirements of the printed circuit board, such as heat dissipation requirements, power size, and current size, are considered and technical references are determined. Then, the substrate material of the printed circuit board is selected, and the substrate material is chosen according to the characteristics of the substrate. The main body of the printed circuit board is then fabricated by lamination. The four-layer symmetrical structure of the main body of the printed circuit board can quickly transfer the heat generated by the device or copper circuit layer 3 to the heat sink of the aluminum substrate 1. Utilizing the high thermal conductivity of aluminum on the PCB, the sandwich structure of the aluminum substrate 1 can achieve uniform heat distribution. The heat can be quickly diffused throughout the entire aluminum substrate 1, avoiding local overheating, significantly reducing the operating temperature, and improving the stability and lifespan of the printed circuit board.

[0015] It should be noted that the first high thermal conductivity insulating dielectric layer 2 and the second high thermal conductivity insulating dielectric layer 4, made of high-performance PP material, have low dielectric constant and low loss characteristics, which help reduce signal interference and improve signal integrity. Among them, the through hole 6 passes through the aluminum substrate 1 or the bottom layer from the surface layer. The through hole 6 is surrounded by resin 7. Considering the electrical issues between the aluminum substrate 1 and the through hole 6, the aluminum substrate 1 is a metal material with conductive properties. When processing the aluminum substrate 1, the hole in the aluminum substrate 1 should be drilled 1-2 mm larger than the actual through hole 6. Then, the through hole 6 is filled with resin 7, and then the hole is re-drilled and electroplated according to the actual processing size. If there are many through holes 6 or the area that needs to be grooved is large, the area can be directly hollowed out, filled with the same resin 7, and then grooved and electroplated.

[0016] Among them, resin 7 is a polymer material specifically designed for PCB boards of electronic equipment circuits. It mainly undertakes mechanical support and electrical insulation functions, ensuring stable circuit operation and preventing current leakage. Resin 7 can be, but is not limited to, epoxy resin, phenolic resin or polytetrafluoroethylene resin. The trace layer 5 is the core component of the multilayer PCB board, and the copper circuit layer 3 is the core part that constitutes the conductive foundation of the PCB board. The structure and principle of trace layer 5 and copper circuit layer 3 are well-known technologies in the market, so they will not be described in detail here.

[0017] Application Example: This high-power module features a multi-layer sandwich aluminum-based printed circuit board. By optimizing the composite structure of the aluminum substrate 1 and the insulating dielectric layer, and combining high thermal conductivity materials with a layered layout strategy, it achieves a synergistic improvement in thermal, electrical, and mechanical performance, increases the mechanical strength of the printed circuit board, and can be applied to aerospace motor systems, thereby meeting the high power density and high reliability requirements of aerospace motor systems for power modules.

[0018] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0019] The above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be understood that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. In the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can refer to a mechanical connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components. Among these, there are various ways of detachable installation, such as by using a combination of plug-in and snap-fit, or by using bolt connections, etc.

[0020] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multilayer sandwich aluminum-based printed circuit board for high-power modules, comprising a printed circuit board body and through holes formed on the printed circuit board body, wherein the printed circuit board body is formed by stacking a top layer, an aluminum substrate, and a bottom layer, characterized in that: The top layer and the bottom layer have the same structure and are arranged symmetrically. The top layer or bottom layer consists of a first high thermal conductivity insulating dielectric layer, a copper circuit layer, a second high thermal conductivity insulating dielectric layer and a wiring layer from the inside to the outside. The through hole passes through the aluminum substrate or the bottom layer from the top layer, and the wall of the through hole is circumferentially covered with resin.

2. The high-power module multilayer sandwich aluminum-based printed circuit board according to claim 1, characterized in that: The insulating media of both the first and second high thermal conductivity insulating media layers are made of high-performance PP material, which is an electronic-grade glass fiber cloth reinforced hydrocarbon ceramic matrix.

3. The high-power module multilayer sandwich aluminum-based printed circuit board according to claim 1, characterized in that: An adhesive is provided between the first high thermal conductivity insulating dielectric layer and the copper circuit layer, between the copper circuit layer and the second high thermal conductivity insulating dielectric layer, or between the second high thermal conductivity insulating dielectric layer and the wiring layer. The adhesive is yellow glue, red glue, silicone glue, hot melt glue, or thermally conductive silicone.

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