Dry-method preparation device and process for high-purity nano copper oxide

Abstract

The invention relates to the technical field of copper oxide dry methods, in particular to a high-purity nanometer copper oxide dry method preparation device and process. The invention provides a high-purity nano copper oxide dry-method preparation device which comprises a base, a reaction furnace is arranged at the upper end of the base, a cover body is arranged at the upper end of the reaction furnace, and an oxygen through opening automatic adjusting mechanism is arranged in the reaction furnace. Through the spraying and circulating system of the sodium hydroxide solution, sulfur dioxide harmful gas generated in the reaction process can be efficiently adsorbed, gas purification treatment is achieved, the adsorption effect is greatly improved through efficient recycling of the sodium hydroxide solution, solution waste is avoided, gas purification continuity and stability are guaranteed, and the product quality is improved. And the risk of environmental pollution is reduced, and the method is environment-friendly and meets the modern environmental protection requirements.

Description

Technical Field

[0001] This invention relates to the field of dry copper oxide technology, specifically to a high-purity nano-copper oxide dry preparation apparatus and process. Background Technology

[0002] High-purity nano-copper oxide (CuO) is an important nanomaterial with wide applications in catalysis, sensors, electronic devices, and energy storage. Various methods exist for preparing high-purity nano-copper oxide, among which the dry preparation method is widely studied due to its low energy consumption, simple operation, and high product purity. The dry preparation apparatus for high-purity nano-copper oxide, through the coordinated operation of components such as a reactor, atmosphere control, and gas purification system, can efficiently convert copper raw materials into high-purity nano-copper oxide. Temperature has a significant impact on the particle size and morphology of nano-copper oxide; typically, the reaction temperature is between 300℃ and 600℃.

[0003] In the dry synthesis process, changes in oxygen concentration affect the growth rate of the oxide layer on the surface of copper powder, which in turn determines the size and distribution of nanoparticles. Excessive oxygen may lead to an overly rapid reaction, forming larger copper oxide particles or aggregates, affecting the particle size and morphology control of the product. Insufficient oxygen may slow down the reaction rate, resulting in smaller copper oxide particles, which may have more surface defects or incompletely oxidized areas. Existing dry preparation devices for high-purity nano-copper oxide are not convenient for controlling the oxygen supply. On the other hand, harmful gases (such as sulfur dioxide) generated during the dry preparation of high-purity nano-copper oxide are detrimental to environmental safety. Summary of the Invention

[0004] To address the aforementioned shortcomings of existing technologies, this invention provides a dry preparation apparatus and process for high-purity nano-copper oxide, which effectively solves the problems of inconvenient control of oxygen flow and the generation of harmful gases during the dry preparation of high-purity nano-copper oxide.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] This invention provides a dry preparation device for high-purity nano-copper oxide, including a base, a reaction furnace at the upper end of the base, a cover at the upper end of the reaction furnace, an automatic oxygen inlet adjustment mechanism inside the reaction furnace, a gas purification mechanism fixedly connected to the outside of the reaction furnace, and multiple heating ring tubes installed on the inner sidewall of the reaction furnace.

[0007] The automatic oxygen inlet adjustment mechanism includes a sliding cavity opened at the bottom of the reactor, a sliding plate slidably connected to the sliding cavity, a plurality of weighing springs fixedly connected between the sliding plate and the sliding cavity, copper raw material placed in the sliding plate, a first oxygen inlet opened on the furnace wall of the reactor, and a second oxygen inlet opened on the wall of the sliding plate corresponding to the vertical position of the first oxygen inlet.

[0008] The gas purification mechanism includes a mounting box fixedly connected to the outside of the reactor. The reactor and the mounting box share a pressure relief port. The end of the mounting box away from the reactor has a discharge port. The mounting box is equipped with a filter screen at the discharge port. The interior of the mounting box has a liquid storage area containing sodium hydroxide solution. The upper end of the mounting box has a liquid inlet for replenishing sodium hydroxide solution. The mounting box is equipped with a circulation component.

[0009] According to the above-mentioned dry preparation device for high-purity nano-copper oxide, the upper end of the reactor is provided with a connecting ring groove, and the lower end of the cover is fixedly connected with a connecting ring block, and the connecting ring block is threadedly engaged with the connecting ring groove.

[0010] According to the above-mentioned dry preparation device for high-purity nano-copper oxide, when no copper raw material is placed in the sliding disk, the second oxygen inlet is located above the first oxygen inlet, and the second oxygen inlet has the same shape and size as the first oxygen inlet.

[0011] According to the above-mentioned dry preparation device for high-purity nano-copper oxide, the circulation component includes a liquid outlet opened in the bottom wall of the mounting box, a circulation pump fixedly installed at the lower end of the mounting box, a connecting pipe connected to the upper end of the circulation pump and the liquid outlet, a connecting hose connected to the lower end of the circulation pump and the upper end of the mounting box, a liquid inlet opened at the upper end of the mounting box, and a strip-shaped spray head connected to the liquid inlet on the inner top wall of the mounting box.

[0012] According to the above-mentioned dry preparation device for high-purity nano-copper oxide, an L-shaped mounting plate is fixedly connected to the side wall of the mounting box, a rotary motor is fixedly mounted on the L-shaped mounting plate, a threaded rod is fixedly connected to the output end of the rotary motor, a threaded sleeve block is threadedly sleeved on the body of the threaded rod, a connecting block is fixedly connected to one end of the threaded sleeve block near the liquid inlet, and the connecting block is fixedly connected to the connecting hose.

[0013] According to the above-mentioned dry preparation device for high-purity nano-copper oxide, the threaded sleeve is rectangular in shape, and the lower end of the threaded sleeve is slidably connected to the upper end of the mounting box.

[0014] According to the above-mentioned dry preparation device for high-purity nano-copper oxide, a positioning plate is fixedly connected to the upper end of the mounting box, and when the threaded sleeve abuts against the positioning plate, the position of the connecting hose corresponds to that of the liquid inlet.

[0015] According to the aforementioned dry preparation apparatus for high-purity nano-copper oxide, a double-layer vacuum check valve is installed at both the first oxygen inlet and the pressure relief outlet on the reactor.

[0016] A dry preparation process for high-purity nano-copper oxide, characterized by comprising the following steps:

[0017] S1, Raw Material Preparation

[0018] S1.1 Select high-purity copper raw materials (such as copper powder or copper wire) to ensure that there are no other impurities in the raw materials and that they meet the required particle size range;

[0019] S1.2 Prepare a sodium hydroxide solution as needed for the gas purification section, ensuring that the solution concentration is appropriate and can effectively adsorb impurity gases generated during the reaction process;

[0020] S2, Preheating and Loading

[0021] S2.1 Start the heating ring to preheat the reactor. Adjust the power of the heating ring according to the temperature requirements of the oxidation reaction to ensure that the internal temperature of the reactor is between 300℃ and 600℃.

[0022] S2.2 Add copper raw material to the sliding pan;

[0023] S3, Reaction Atmosphere Control

[0024] S3.1 If the sliding plate is empty, the second oxygen port is misaligned with the first oxygen port, but their vertical positions correspond.

[0025] S3.2 As copper raw material is added to the sliding plate, the more copper raw material is added, the greater the pressure exerted by the sliding plate on the multiple weighing springs. The deformation of the weighing springs under pressure increases, the sliding plate slides downward, and the second oxygen port slides downward and gradually overlaps with the first oxygen port. The greater the weight of the sliding plate, the greater the overlap range between the second oxygen port and the first oxygen port. The amount of oxygen input and the oxidation rate during the reaction process can be automatically controlled to ensure uniform oxidation of the copper raw material.

[0026] S4, Gas Purification

[0027] While copper oxide is being produced from copper raw materials in the S4.1 reactor, harmful gases such as sulfur dioxide are released. The gases enter the gas purification mechanism through the pressure relief port.

[0028] S4.2 The sodium hydroxide solution is transported from the liquid storage area to the strip spray head through the connecting hose via the circulation pump, which improves the fluidity of the liquid and enhances the adsorption capacity of the solution. The sodium hydroxide solution adsorbs the harmful gases generated during the reaction, and the sodium hydroxide solution is continuously circulated, resulting in high utilization.

[0029] S4.3 After the sodium hydroxide solution has circulated for a certain period of time, it is replaced. The rotary motor drives the threaded rod to rotate, which moves the threaded sleeve block away from the L-shaped mounting plate. The connecting block moves the connecting hose to a position that is misaligned with the mounting box. A collection box is placed at the lower end of the connecting hose to collect and centrally process the used sodium hydroxide solution. Then, sodium hydroxide solution is added to the liquid storage area in the mounting box through the injection port to ensure the purification effect of the gas.

[0030] The technical solution provided by this invention has the following advantages compared with the known prior art:

[0031] 1. This invention, through the design of a sliding disc and multiple weighing springs, can automatically adjust the degree of overlap between the second oxygen inlet and the first oxygen inlet according to the amount of copper raw material added, thereby controlling the amount of oxygen input in the reactor. This automatic adjustment function can effectively control the rate of oxidation reaction, avoid the influence of excessively high or low oxygen concentration, ensure uniform oxidation of copper raw material, and improve the stability and efficiency of the reaction.

[0032] 2. This invention utilizes a sodium hydroxide solution spraying and circulation system to efficiently adsorb harmful sulfur dioxide gas generated during the reaction process, achieving gas purification. The efficient recycling of sodium hydroxide solution greatly improves the adsorption effect, avoids solution waste, ensures the continuity and stability of gas purification, reduces the risk of environmental pollution, is environmentally friendly, and meets modern environmental protection requirements. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0034] Figure 1 This is a structural schematic diagram from a first perspective of the present invention;

[0035] Figure 2 for Figure 1 Schematic diagram of the internal structure of the intermediate reactor;

[0036] Figure 3This is a structural schematic diagram from a second perspective of the present invention;

[0037] Figure 4 for Figure 1 Enlarged structural diagram of section A;

[0038] Figure 5 for Figure 1 A schematic diagram of the gas purification mechanism.

[0039] Reference numerals: 1. Base; 2. Reactor; 3. Sliding chamber; 4. Sliding disc; 5. Weighing spring; 6. First oxygen inlet; 61. Double-layer vacuum check valve; 7. Second oxygen inlet; 8. Cover; 9. Connecting ring groove; 10. Connecting ring block; 11. Mounting box; 12. Liquid storage area; 13. Circulating pump; 14. Connecting hose; 15. Strip spray head; 16. Filter screen; 17. Liquid inlet; 18. L-shaped mounting plate; 19. Rotary motor; 20. Threaded rod; 21. Threaded sleeve block; 22. Connecting block; 23. Positioning plate; 24. Heating ring tube. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0041] The present invention will be further described below with reference to embodiments.

[0042] Example: Refer to Figures 1 to 5 A dry preparation device for high-purity nano-copper oxide includes a base 1, a reactor 2 is provided at the upper end of the base 1, a cover 8 is provided at the upper end of the reactor 2, a connecting ring groove 9 is provided at the upper end of the reactor 2, and a connecting ring block 10 is fixedly connected to the lower end of the cover 8. The connecting ring block 10 is threadedly engaged with the connecting ring groove 9 to ensure the airtightness of the reactor 2 during operation.

[0043] The reactor 2 is equipped with an automatic oxygen inlet adjustment mechanism. Specifically, the automatic oxygen inlet adjustment mechanism includes a sliding cavity 3 opened at the bottom of the reactor 2, a sliding plate 4 slidably connected to the sliding cavity 3, and multiple weighing springs 5 ​​fixedly connected between the sliding plate 4 and the sliding cavity 3. Copper raw material is placed in the sliding plate 4. The furnace wall of the reactor 2 has a first oxygen inlet 6, and the wall of the sliding plate 4 has a second oxygen inlet 7 corresponding to the vertical position of the first oxygen inlet 6. When no copper raw material is placed in the sliding plate 4, the second oxygen inlet 7 is located above the first oxygen inlet 6, and the second oxygen inlet 7 and the first oxygen inlet 6 have the same shape and size. The overlap range between the second oxygen inlet 7 and the first oxygen inlet 6 is adjusted according to the weight of the added copper raw material to achieve the purpose of automatic adjustment of the oxygen inlet.

[0044] A gas purification mechanism is fixedly connected to the outside of the reactor 2. Specifically, the gas purification mechanism includes a mounting box 11 fixedly connected to the outside of the reactor 2. The reactor 2 and the mounting box 11 share a pressure relief port. Double-layer vacuum check valves 61 are installed on the reactor 2 at both the first oxygen inlet 6 and the pressure relief port. A discharge port is provided at the end of the mounting box 11 away from the reactor 2. A filter screen 16 is provided at the discharge port of the mounting box 11. A liquid storage area 12 is provided inside the mounting box 11, which contains sodium hydroxide solution. A liquid inlet 17 for replenishing sodium hydroxide solution is provided at the upper end of the mounting box 11. The mounting box 11 is equipped with... The system includes a circulation assembly. Specifically, the circulation assembly includes a liquid outlet on the bottom wall of the mounting box 11, a circulation pump 13 fixedly installed at the lower end of the mounting box 11, a connecting pipe connecting the upper end of the circulation pump 13 to the liquid outlet, a connecting hose 14 connecting the lower end of the circulation pump 13 to the upper end of the mounting box 11, a liquid inlet at the upper end of the mounting box 11, and a strip spray head 15 connected to the liquid inlet on the inner top wall of the mounting box 11. The sodium hydroxide solution forms a water curtain through the strip spray head 15. When gases such as sulfur dioxide in the reactor 2 are discharged through the pressure relief port, they are purified by the flowing sodium hydroxide water curtain, thus avoiding precipitation and uneven adsorption of the solution.

[0045] An L-shaped mounting plate 18 is fixedly connected to the side wall of the mounting box 11. A rotary motor 19 is fixedly mounted on the L-shaped mounting plate 18. A threaded rod 20 is fixedly connected to the output end of the rotary motor 19. A threaded sleeve block 21 is threadedly sleeved on the body of the threaded rod 20. The threaded sleeve block 21 is rectangular in shape, and the lower end of the threaded sleeve block 21 is in close contact with the upper end of the mounting box 11.

[0046] A connecting block 22 is fixedly connected to one end of the threaded sleeve 21 near the liquid inlet. The connecting block 22 is fixedly connected to the connecting hose 14. A positioning plate 23 is fixedly connected to the upper end of the mounting box 11. When the threaded sleeve 21 abuts against the positioning plate 23, the position of the connecting hose 14 corresponds to that of the liquid inlet. The threaded rod 20 is driven to rotate by the rotary motor 19, and the connecting hose 14 is moved by the connecting block 22 to adjust the positional relationship between the connecting hose 14 and the liquid inlet.

[0047] Multiple heating rings 24 are installed on the inner wall of the reactor 2 to ensure that the internal temperature of the reactor 2 is between 300°C and 600°C.

[0048] The specific working steps of this invention are as follows:

[0049] S1, Raw Material Preparation

[0050] 1.1 Select high-purity copper raw materials (such as copper powder or copper wire) to ensure that there are no other impurities in the raw materials and that they meet the required particle size range;

[0051] 1.2 Prepare a sodium hydroxide solution as needed for the gas purification section, ensuring that the solution concentration is appropriate and can effectively adsorb impurity gases generated during the reaction process;

[0052] S2, Preheating and Loading

[0053] 2.1 Start the heating ring tube 24 to preheat the reactor 2. Adjust the power of the heating ring according to the temperature requirements of the oxidation reaction to ensure that the internal temperature of the reactor is between 300℃ and 600℃.

[0054] 2.2 Add the copper raw material to the sliding pan 4;

[0055] S3, Reaction Atmosphere Control

[0056] 3.1 If the sliding disk 4 is empty, the second oxygen port 7 and the first oxygen port 6 are misaligned, but their vertical positions correspond;

[0057] 3.2 As copper raw material is added to the sliding disk 4, the more copper raw material is added, the greater the pressure exerted by the sliding disk 4 on the multiple weighing springs 5. The deformation of the weighing springs 5 ​​under pressure increases, the sliding disk 4 slides downward, and the second oxygen port 7 slides downward and gradually overlaps with the first oxygen port 6. The greater the weight of the sliding disk 4, the greater the overlap range between the second oxygen port 7 and the first oxygen port 6. This can automatically control the amount of oxygen input and the oxidation rate during the reaction process, ensuring uniform oxidation of the copper raw material.

[0058] S4, Gas Purification

[0059] 4.1 In the reactor 2, while copper oxide is generated from copper raw materials, harmful gases such as sulfur dioxide are released. The gases enter the gas purification mechanism through the pressure relief port.

[0060] 4.2 The sodium hydroxide solution is transported from the liquid storage area 12 to the strip spray head 15 through the connecting hose 14 via the circulation pump 13, which improves the fluidity of the liquid and enhances the adsorption capacity of the solution. The sodium hydroxide solution adsorbs the harmful gases generated during the reaction process, and the sodium hydroxide solution is continuously circulated, resulting in high utilization rate.

[0061] 4.3 After the sodium hydroxide solution has circulated for a certain period of time, it is replaced. The rotary motor 19 drives the threaded rod 20 to rotate, which in turn moves the threaded sleeve block 21 away from the L-shaped mounting plate 18. The connecting block 22 drives the connecting hose 14 to move to a position that is misaligned with the mounting box 11. A collection box is placed at the lower end of the connecting hose 14 to collect and centrally process the used sodium hydroxide solution. Then, sodium hydroxide solution is added to the liquid storage area 12 in the mounting box 11 through the liquid inlet 17 to ensure the purification effect of the gas.

[0062] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A dry preparation apparatus for high-purity nano-copper oxide, characterized in that, Includes a base (1), a reactor (2) is provided at the upper end of the base (1), a cover (8) is provided at the upper end of the reactor (2), an automatic oxygen inlet adjustment mechanism is provided inside the reactor (2), a gas purification mechanism is fixedly connected to the outside of the reactor (2), and multiple heating ring tubes (24) are installed on the inner side wall of the reactor (2). The automatic oxygen inlet adjustment mechanism includes a sliding cavity (3) opened at the bottom of the reactor (2), a sliding disk (4) is slidably connected in the sliding cavity (3), a plurality of weighing springs (5) are fixedly connected between the sliding disk (4) and the sliding cavity (3), copper raw material is placed in the sliding disk (4), a first oxygen inlet (6) is opened in the furnace wall of the reactor (2), and a second oxygen inlet (7) is opened in the disk wall of the sliding disk (4) corresponding to the vertical position of the first oxygen inlet (6); The gas purification mechanism includes an installation box (11) fixedly connected to the outside of the reactor (2). The reactor (2) and the installation box (11) are provided with a pressure relief port. The end of the installation box (11) away from the reactor (2) is provided with a discharge port. The installation box (11) is provided with a filter screen (16) at the discharge port. The interior of the installation box (11) is provided with a liquid storage area (12) containing sodium hydroxide solution. The upper end of the installation box (11) is provided with a liquid inlet (17) for replenishing sodium hydroxide solution. The installation box (11) is provided with a circulation component.

2. The apparatus for dry preparation of high-purity nano-copper oxide according to claim 1, characterized in that, The upper end of the reactor (2) is provided with a connecting ring groove (9), and the lower end of the cover (8) is fixedly connected with a connecting ring block (10), and the connecting ring block (10) is threadedly engaged with the connecting ring groove (9).

3. The apparatus for dry preparation of high-purity nano-copper oxide according to claim 1, characterized in that, When no copper raw material is placed in the sliding disk (4), the second oxygen inlet (7) is located above the first oxygen inlet (6), and the second oxygen inlet (7) has the same shape and size as the first oxygen inlet (6).

4. The apparatus for dry preparation of high-purity nano-copper oxide according to claim 1, characterized in that, The circulation assembly includes an outlet on the bottom wall of the mounting box (11), a circulation pump (13) is fixedly installed at the lower end of the mounting box (11), the upper end of the circulation pump (13) is connected to the outlet by a connecting pipe, the lower end of the circulation pump (13) is connected to the upper end of the mounting box (11) by a connecting hose (14), the upper end of the mounting box (11) is provided with an inlet, and the inner top wall of the mounting box (11) is provided with a strip spray head (15) connected to the inlet.

5. The apparatus for dry preparation of high-purity nano-copper oxide according to claim 4, characterized in that, An L-shaped mounting plate (18) is fixedly connected to the side wall of the mounting box (11). A rotary motor (19) is fixedly mounted on the L-shaped mounting plate (18). A threaded rod (20) is fixedly connected to the output end of the rotary motor (19). A threaded sleeve block (21) is threaded onto the rod body of the threaded rod (20). A connecting block (22) is fixedly connected to one end of the threaded sleeve block (21) near the liquid inlet. The connecting block (22) is fixedly connected to the connecting hose (14).

6. The apparatus for dry preparation of high-purity nano-copper oxide according to claim 5, characterized in that, The threaded sleeve (21) is rectangular in shape, and the lower end of the threaded sleeve (21) is in close contact with the upper end of the mounting box (11).

7. The apparatus for dry preparation of high-purity nano-copper oxide according to claim 5, characterized in that, The upper end of the mounting box (11) is fixedly connected to a positioning plate (23), and when the threaded sleeve (21) abuts against the positioning plate (23), the position of the connecting hose (14) corresponds to that of the liquid inlet.

8. The apparatus for dry preparation of high-purity nano-copper oxide according to claim 1, characterized in that, The reactor (2) is equipped with a double-layer vacuum check valve (61) at both the first oxygen inlet (6) and the pressure relief port.

9. A preparation process for the dry preparation apparatus for high-purity nano-copper oxide according to claim 5, characterized in that, Includes the following steps: S1, Raw material preparation: S1.1 Select high-purity copper raw materials to ensure that there are no other impurities in the raw materials and that they meet the required particle size range; S1.2 Prepare a sodium hydroxide solution as needed for the gas purification section, ensuring that the solution concentration is appropriate and can effectively adsorb impurity gases generated during the reaction process; S2, Preheating and Loading: S2.1, start the heating ring tube (24) to preheat the reactor (2). Adjust the power of the heating ring according to the temperature requirements of the oxidation reaction to ensure that the internal temperature of the reactor (2) is between 300°C and 600°C. S2.2, add copper raw material to sliding disk (4); S3, Reaction Atmosphere Control: S3.1 If the sliding disk (4) is empty, the second oxygen port (7) and the first oxygen port (6) are misaligned, but their vertical positions correspond. S3.2 As copper raw material is added to the sliding disk (4), the more copper raw material is added, the greater the pressure exerted by the sliding disk (4) on the multiple weighing springs (5). The deformation of the weighing springs (5) under pressure increases, the sliding disk (4) slides downward, and the second oxygen port (7) slides downward and gradually overlaps with the first oxygen port (6). The greater the weight of the sliding disk (4), the greater the overlap range between the second oxygen port (7) and the first oxygen port (6), so as to automatically control the amount of oxygen input and the oxidation rate during the reaction process. S4, Gas Purification: S4.1, While copper oxide is generated from copper raw materials in the reactor (2), sulfur dioxide is released. The sulfur dioxide enters the gas purification mechanism through the pressure relief port. S4.2, the sodium hydroxide solution is transported from the liquid storage area (12) through the connecting hose (14) to the strip spray head (15) for spraying by the circulating pump (13); S4.3 After the sodium hydroxide solution has been used for a preset time, it is replaced. The rotary motor (19) drives the threaded rod (20) to rotate, which drives the threaded sleeve block (21) to move away from the L-shaped mounting plate (18). The connecting block (22) drives the connecting hose (14) to move. The connecting hose (14) is moved to a position that is misaligned with the mounting box (11). A collection box is placed at the lower end of the connecting hose (14) to collect and centrally process the used sodium hydroxide solution. Then, sodium hydroxide solution is added to the liquid storage area (12) in the mounting box (11) through the injection port (17) to ensure the purification effect of the gas.

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