Epoxy resin composition for sealing

Abstract

The present invention provides an epoxy resin composition for sealing, the epoxy resin composition comprising an epoxy resin, a polyfunctional epoxy compound having a polyalkylene glycol chain, and an inorganic filler. The epoxy resin composition has the properties of low viscosity, high glass transition temperature and low elastic modulus, and can inhibit warping under the condition of sealing a large-area substrate.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor packaging technology, and in particular relates to an epoxy resin composition for sealing. Background Technology

[0002] In recent years, with the trend towards miniaturization and lightweighting of electronic devices, semiconductor packaging has also been continuously developing, and wafer-level packaging (WLP) has received widespread attention. However, traditional epoxy resin compositions face many challenges in the sealing process of semiconductor packaging. Due to the large area of ​​the sealing layer, wafers are prone to warping, which not only affects subsequent processes such as grinding, cutting, and assembly, but may also lead to a decrease in the reliability of packaged devices. In addition, existing epoxy resin compositions are also unable to meet increasingly stringent requirements in terms of heat resistance, moisture resistance, and low thermal expansion.

[0003] To address these issues, researchers have attempted to use various sealing methods, such as compression molding. However, commonly used epoxy resins and phenolic curing agents, in sheet form, suffer from problems such as easy breakage and poor workability. Therefore, developing a sealing resin composition with low viscosity, high glass transition temperature, and low elastic modulus to suppress warping when sealing large-area substrates has become a current research focus.

[0004] Currently, commonly used epoxy diluents such as ethylene glycol diglycidyl ether and 1,4-butanediol diglycidyl ether, due to their low viscosity, can be used as reactive diluents to improve overall flowability. However, these diluents significantly lower the glass transition temperature after curing, affecting the resin's performance. Therefore, developing a sealing resin composition that maintains both low viscosity and a high glass transition temperature and low elastic modulus has become crucial to solving current technical problems. This requires not only innovation in formulation design but also optimization in material selection and preparation processes to meet the increasingly demanding performance requirements of sealing materials for electronic components. Summary of the Invention

[0005] In view of the shortcomings of the prior art described above, the object of the present invention is to provide an epoxy resin composition for sealing, which has the properties of low viscosity, high glass transition temperature and low elastic modulus, and can also suppress warping when sealing large-area substrates, thereby solving the problems in the prior art.

[0006] The technical solution of this invention is:

[0007] This invention provides an epoxy resin composition comprising an epoxy resin, a polyfunctional epoxy compound having a polyalkylene glycol chain, and an inorganic filler, wherein the polyfunctional epoxy compound having the polyalkylene glycol chain has the structure shown in Formula I:

[0008] Formula I;

[0009] In Formula I, R1 is selected from one or more of polyethylene glycol chains, polypropylene glycol chains, polytrimethylene glycol chains, and polytetramethylene glycol chains, with 2 to 10 repeating units; R2 is hydrogen or methyl; and n is 2 to 20.

[0010] The polyfunctional epoxy compound with polyalkylene glycol chains has a viscosity of 500~5000 cP at 25°C.

[0011] The present invention also provides a method for preparing an epoxy resin composition, the method comprising mixing epoxy resin, a polyfunctional epoxy compound having a polyalkylene glycol chain, and an inorganic filler uniformly to obtain an epoxy resin composition, which is then used after defoaming under reduced pressure.

[0012] The present invention also provides a structural component comprising electronic components and a resin layer formed by curing an epoxy resin composition as described in the present invention.

[0013] The present invention also provides a method for preparing a structural component, comprising the following steps: coating the epoxy resin composition onto the surface of the electronic component, curing it to form the resin layer, and then obtaining the structural component.

[0014] Compared with the prior art, the present invention provides an epoxy resin composition for sealing, which has the following beneficial effects:

[0015] 1. This invention effectively improves the fluidity of resin by introducing a polyfunctional epoxy compound with a polyalkylene glycol chain into the formulation, while maintaining a high glass transition temperature. This solves the problems of easy cracking and poor workability of traditional epoxy resins during compression molding, and improves the processing performance of sealing materials.

[0016] 2. The epoxy resin composition for sealing of the present invention has excellent elastic modulus, which can effectively suppress warping when sealing large-area substrates, significantly improve the encapsulation quality, meet the requirements of high-density installation, and overcome the defects of easy deformation of sealing materials in the prior art;

[0017] 3. This invention uses a special multifunctional epoxy diluent, which maintains low viscosity characteristics without significantly reducing the glass transition temperature after curing, thus achieving an optimized balance of resin performance and meeting the high-performance requirements of electronic components for sealing materials.

[0018] 4. This invention achieves a comprehensive upgrade of epoxy resin compositions for sealing by optimizing formulation design, material selection, and preparation process, which can better meet the performance requirements of different application scenarios and promote the further development of wafer-level packaging technology. Detailed Implementation

[0019] Hereinafter, embodiments of the epoxy resin composition for sealing provided by the present invention will be described in detail.

[0020] The "range" disclosed in this application is defined by a lower limit and an upper limit. A given range is defined by selecting a lower limit and an upper limit, which define the boundaries of a particular range. Ranges defined in this way can include or exclude endpoints and can be arbitrarily combined; that is, any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60~120 and 80~110 are listed for a specific parameter, it is also expected that ranges of 60~110 and 80~120 are also included. Furthermore, if minimum range values ​​of 1 and 2 are listed, and if maximum range values ​​of 3, 4, and 5 are listed, then the following ranges are all expected: 1~3, 1~4, 1~5, 2~3, 2~4, and 2~5. In this application, unless otherwise stated, the numerical range "a~b" represents a shortened representation of any combination of real numbers between a and b, where a and b are real numbers. For example, the numerical range "0~5" indicates that all real numbers between "0~5" have been listed in this article; "0~5" is simply a shortened representation of these numerical combinations. Furthermore, when a parameter is stated as an integer ≥2, it is equivalent to disclosing that the parameter is, for example, an integer such as 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc.

[0021] Traditional epoxy resin and phenolic curing agents in sheet form are prone to cracking and deformation during compression molding, resulting in poor operability and difficulty in meeting the miniaturization and lightweight requirements of electronic devices. Commonly used epoxy diluents, such as ethylene glycol diglycidyl ether and 1,4-butanediol diglycidyl ether, can improve overall flowability as active diluents due to their low viscosity, but they significantly reduce the glass transition temperature after curing, affecting the resin's performance. Existing epoxy resin compositions for sealing are difficult to suppress warping when sealing large-area substrates, affecting encapsulation quality and failing to meet the requirements of high-density mounting. Existing epoxy resin compositions for sealing still need further optimization in formulation design, material selection, and preparation processes to simultaneously achieve low viscosity, high glass transition temperature, and low elastic modulus to meet the needs of different application scenarios.

[0022] Therefore, through extensive research and exploration, the inventors of this invention provide an epoxy resin composition for sealing, which exhibits low viscosity, high glass transition temperature, and low elastic modulus, and can suppress warping even when sealing large-area substrates. To address the aforementioned issues, the epoxy resin composition for sealing electronic components provided by this invention comprises: (A) an epoxy resin, (B) a polyfunctional epoxy compound having a polyalkylene glycol chain, and (C) an inorganic filler. This results in low viscosity, high glass transition temperature, and low elastic modulus, and also provides warping suppression even when sealing large-area substrates. Based on this, this application was completed.

[0023] Epoxy Resin Composition

[0024] The present invention provides an epoxy resin composition comprising an epoxy resin, a multifunctional epoxy compound having a polyalkylene glycol chain, and an inorganic filler.

[0025] In the epoxy resin composition provided by the present invention, the multifunctional epoxy compound having a polyalkylene glycol chain has the structure shown in Formula I:

[0026] Formula I;

[0027] In formula I,

[0028] R1 is a polyalkylene glycol chain. Specifically, R1 is selected from one or more of polyethylene glycol chains, polypropylene glycol chains, polytrimethylene glycol chains, and polytetramethylene glycol chains. The repeating unit is 2 to 10, for example, the repeating unit can be 2 to 6, 6 to 10, 2 to 4, 4 to 6, or 6 to 10.

[0029] R2 is hydrogen or methyl.

[0030] n can be 2~20, and can be 2~10, 10~20, 2~5, 5~10, 10~15, or 15~20.

[0031] The viscosity of the polyalkylene glycol chain polyvinyl alcohol polyoxide compound at 25°C is 500~5000 cP and any value between them or any two values, which can be selected as 500~1000 cP, 1000~3000 cP, 3000~5000 cP, 1000~2000 cP, 2000~3000 cP, 3000~4000 cP, or 4000~5000 cP.

[0032] The epoxy equivalent of the polyalkylene glycol chain polyfunctional epoxy compound is 250~1000 g / eq, and can be selected as 250~400 g / eq or 400~1000 g / eq.

[0033] In some embodiments, the structure shown in Formula I can be, for example,

[0034] or ;

[0035] The choices of R1 and n are as defined in Equation I.

[0036] In the epoxy resin composition provided by this invention, the epoxy resin is an epoxy compound having one or more epoxy groups in one molecule, and there is no particular limitation. It is ideal for the epoxy resin to be liquid at room temperature, but even if it is solid at room temperature, it can be diluted with other liquid epoxy resins or diluents to make it liquid at room temperature for use. The epoxy resin is selected from one or more combinations of trimethylolpropane triglycidyl ether, glycidylamine type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin, and naphthalene type epoxy resin.

[0037] In the epoxy resin composition provided by the present invention, there are no particular limitations on the inorganic filler. For example, the inorganic filler is selected from one or more combinations of silicon dioxide, alumina, talc, calcium carbonate, titanium dioxide, iron oxide red, silicon carbide, boron nitride, aluminum nitride, and glass beads. The silicon dioxide is selected from one or more of fused silicon dioxide, crystalline silicon dioxide, etc.

[0038] From the perspective of reducing the linear thermal expansion coefficient of the cured product, the inorganic filler is selected from silica powder. The average particle size of the silica powder is 1~25μm and any value or any two values ​​therebetween, preferably 1~8μm or 8~25μm. The cutoff particle size is 5~75μm and any value or any two values ​​therebetween, preferably 5~25μm or 25~75μm. More preferably, it is fused silica powder.

[0039] In the epoxy resin composition provided by the present invention, the content of the epoxy resin in the epoxy resin composition is 0.5~15wt% and any value or any two values ​​therebetween, optionally 0.5~2wt%, 2~15wt%, 2~10wt%, or 10~15wt%. The content of the structure represented by Formula I in the epoxy resin composition is 1~20wt% and any value or any two values ​​therebetween, optionally 1~4wt%, 4~10wt%, or 10~20wt%. The content of the inorganic filler in the epoxy resin composition is 50~95wt% and any value or any two values ​​therebetween, optionally 50~87wt% or 87~95wt%.

[0040] In the epoxy resin composition provided by this invention, the curing agent is not particularly limited. For example, the epoxy resin composition further includes a curing agent selected from one or more combinations of amine curing agents, phenol curing agents, and acid anhydride curing agents. Examples of amine curing agents include tetramethyldiaminodiphenylmethane, tetraethyldiaminodiphenylmethane, diethyldimethyldiaminodiphenylmethane, dimethyldiaminotoluene, diaminodibutyltoluene, diaminodipropyltoluene, diaminodiphenyl sulfone, diaminoxylenyl sulfone, diethyldiaminotoluene, bis(4-amino-3-ethylphenyl)methane, and polybutoxide-di-p-aminobenzoic acid ester. These can be used alone or in combination of two or more. Phenolic curing agents, such as phenols or naphthols (e.g., phenol, cresol, naphthol, alkylphenol, bisphenol, terpene phenol, etc.), are obtained by polycondensation with formaldehyde. Examples include: phenolic varnish, o-cresol varnish, p-cresol varnish, α-naphthol varnish resin, β-naphthol varnish resin, tributylphenol varnish, dicyclopentadiene cresol, poly(p-vinylphenol), bisphenol A type phenolic varnish, styrene-modified phenolic varnish, decahydronaphthalene-modified phenolic varnish, poly(di-o-hydroxyphenyl)methane, poly(di-m-hydroxyphenyl)methane, and poly(di-p-hydroxyphenyl)methane. These can be used alone or in combination of two or more. Anhydride curing agents include phthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride and other alkyl hexahydrophthalic anhydrides, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, 3-methyltetrahydrophthalic anhydride and other alkyltetrahydrophthalic anhydrides, simulic anhydride, succinic anhydride, trimellitic anhydride, pyromellitic anhydride, etc. These can be used alone or in combination of two or more.

[0041] Further, the content of curing agent in the epoxy resin composition is 0.1~40wt% and any value between them or any two values, and can be selected as 0.1~5.5wt%, 5.5~40wt%, 5.5~20wt%, or 20~40wt%.

[0042] In the epoxy resin composition provided by the present invention, the epoxy resin composition further includes a curing accelerator, which is selected from one or more combinations of amine compounds, phosphorus compounds, basic compounds, and microencapsulated curing accelerators. A reaction accelerator capable of self-polymerizing the epoxy resin is preferred, and the amine compound is an imidazole compound. The curing accelerator may also be latent, but microencapsulated curing accelerators are more preferably preferred.

[0043] Furthermore, the alkaline compound is an organometallic compound.

[0044] Further, the content of the curing accelerator in the epoxy resin composition is 0.1~10wt% and any value between them or any two values, and can be selected as 0.1~0.5wt%, 0.5~10wt%, 0.5~5wt%, or 5~10wt%.

[0045] The epoxy resin composition provided by the present invention further includes additives, which are selected from one or more of silane coupling agents, carbon black, ion trapping agents, defoamers, leveling agents and dispersants.

[0046] The content of additives in the epoxy resin composition is 0.1~10wt% and any value or range between any two values, and can be selected as 0.1~0.5wt%, 0.5~10wt%, 0.5~5wt%, or 5~10wt%.

[0047] The silane coupling agent is selected from one or more of 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, vinyltrimethoxysilane, and vinyltriethoxysilane. Even when using silica with a surface pre-reacted with the silane coupling agent, the above-mentioned silane coupling agents can be blended as needed.

[0048] The content of the silane coupling agent in the epoxy resin composition is 0.1~10wt% and any value or range between any two values, optionally 0.1~5wt%, 5~10wt%, 0.1~3wt%, 3~5wt%, 5~8wt%, or 8~10wt%. Preferably, the content of the silane coupling agent in the epoxy resin composition is 1~5wt%.

[0049] The carbon black content in the epoxy resin composition is preferably 0.1~5 wt% and any value or range between any two values, and can be selected as 0.1~0.5 wt%, 0.5~2 wt%, or 2~5 wt%. Preferably, the carbon black content in the epoxy resin composition is 0.5~2 wt%.

[0050] The ion trapping agent is a reagent capable of trapping impurity ions in a resin composition and improving the reliability of sealed electronic components. The ion trapping agent is an inorganic ion exchanger. Specifically, the inorganic ion exchanger includes one or more compounds represented by Formulas 1 and 2.

[0051] Equation 1, where a is 0 < a ≤ 0.5, and u > 0;

[0052] Equation 2, where b is 0.9≤b≤1.1, c is 0.6≤c≤0.8, and d is 0.2≤d≤0.4;

[0053] The compound shown in Formula 1 can be, for example, commercially available DHT-4A (Kyowa Chemical Industry Co., Ltd.), and the compound shown in Formula 2 can be, for example, commercially available IXE500 (Toa Synthetic Co., Ltd.).

[0054] If an ion scavenger is included, its content is not particularly limited, but in the epoxy resin composition, it is preferred that the content of the ion scavenger in the epoxy resin composition is 0.05 wt% or more, more preferably 2 wt% or less. Even more preferably, the content of the ion scavenger in the epoxy resin composition is 0.05 to 2 wt%.

[0055] If a defoamer is present, its content is not particularly limited, but in the epoxy resin composition, the content of the defoamer in the epoxy resin composition is preferably 0.1% to 5% and any value between them or any two values, and can be selected as 0.1% to 3% or 3% to 5%. Further, the defoamer is selected from one or more of silicone-based defoamers, acrylic-based defoamers, fluorinated defoamers, and vinyl resin-based defoamers.

[0056] If a leveling agent is present, its content is not particularly limited, but in the epoxy resin composition, the content of the leveling agent in the epoxy resin composition is preferably 0.1% to 5% and any value between them or any two values, preferably 0.1% to 3% or 3% to 5%. Further, the leveling agent is selected from one or more of silicone-based leveling agents, acrylic-based leveling agents, fluorinated leveling agents, and vinyl resin-based leveling agents.

[0057] The content of the dispersant is not particularly limited, but in the epoxy resin composition, the content of the dispersant in the epoxy resin composition is preferably 0.1% to 5% and any value or range between any two values, preferably 0.1% to 3% or 3% to 5%. Further, the dispersant is selected from one or more of anionic dispersants, cationic dispersants, nonionic dispersants, amphoteric dispersants, and polymeric dispersants.

[0058] The epoxy resin composition is a sealing resin composition used for semiconductor packaging with a sealing area of ​​wafer-level or above, or board-level or above. Specifically, wafer-level (e.g., 12 inches (300 mm in diameter) or above) and board-level (>300*300 mm) are examples of such sealing resin compositions. 2 )above.

[0059] Preparation method of epoxy resin composition

[0060] There are no particular limitations on the preparation method of epoxy resin composition, as long as the method of uniformly dispersing and mixing the components is acceptable. It can be prepared by conventional mixing methods, and the components can be formulated in a predetermined ratio.

[0061] In some embodiments, the preparation method includes uniformly mixing epoxy resin, a polyfunctional epoxy compound having a polyalkylene glycol chain, and an inorganic filler to obtain an epoxy resin composition, which is then used after defoaming under reduced pressure.

[0062] When the epoxy resin contains curing agent, curing accelerator, and additives, the preparation method includes mixing epoxy resin, a polyfunctional epoxy compound having a polyalkylene glycol chain, an inorganic filler, a curing agent, a curing accelerator, and additives uniformly to obtain an epoxy resin composition, which is then used after defoaming under reduced pressure.

[0063] Optionally, the mixing time is from 30 minutes to 480 minutes, for example, from 30 minutes to 240 minutes or from 240 minutes to 480 minutes.

[0064] Optionally, the pressure under reduced pressure is ≤-0.098 MPa.

[0065] [Structural Components]

[0066] The present invention also provides a structural component comprising electronic components and a resin layer formed by curing an epoxy resin composition as described in the present invention.

[0067] [Preparation methods for structural components]

[0068] The present invention also provides a method for preparing a structural component, comprising the following steps: coating the epoxy resin composition onto the surface of the electronic component, curing it to form the resin layer, and then obtaining the structural component.

[0069] The beneficial effects of the present invention will be further illustrated below with reference to the embodiments.

[0070] To make the inventive objectives, technical solutions, and beneficial effects of this invention clearer, the invention is further described in detail below with reference to embodiments. However, it should be understood that the embodiments of this invention are merely for illustrative purposes and not for limiting the invention, and the embodiments are not limited to those given in the specification. Unless otherwise specified, specific experimental or operational conditions in the embodiments were prepared under conventional conditions or according to the conditions recommended by the material supplier.

[0071] Furthermore, it should be understood that the existence of other method steps before or after the combined steps, or the insertion of other method steps between these explicitly mentioned steps, does not preclude the existence of other method steps before or after the combined steps, or the insertion of other method steps between these explicitly mentioned steps, unless otherwise stated. It should also be understood that the combined connection relationship between one or more devices / apparatus mentioned in this invention does not preclude the existence of other devices / apparatus before or after the combined devices / apparatus, or the insertion of other devices / apparatus between these explicitly mentioned devices / apparatus, unless otherwise stated. Moreover, unless otherwise stated, the numbering of each method step is merely a convenient tool for identifying each method step, and not for limiting the order of the method steps or limiting the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

[0072] In the following embodiments, unless otherwise specified, all the raw materials of the present invention are commercially available or prepared according to conventional methods in the art.

[0073] Example 1

[0074] Two parts of bisphenol A type epoxy resin 1) 4 parts of phenolic epoxy compounds with polyalkylene glycol chains 2) 87 parts molten silica 4) 5.5 parts acid anhydride curing agent 5) 0.5 parts curing accelerator 6) 0.1 parts silane coupling agent 7) 0.25 parts carbon black 8) 0.65 parts dispersant 9) Stir for 120 minutes to obtain a homogeneous epoxy resin composition. Defoam after depressurization (pressure ≤ -0.098Mpa) before use.

[0075] Example 2 and Comparative Examples 1-5 are the same as in Example 1, but with the components and amounts listed in Table 1.

[0076] Table 1

[0077]

[0078] 1) Bisphenol A type epoxy resin, manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., trade name YDF-8125G, epoxy equivalent 172g / eq;

[0079] 2) Phenolic epoxy compounds with polyalkylene glycol chains, manufactured by Seinopco, Japan, with the following chemical formula: R1 = polypropylene glycol, epoxy equivalent 400 g / eq, viscosity 1200 cp.

[0080] ;

[0081] 3) Cresol phenolic epoxy compound with polyalkylene glycol chain, manufactured by Seinopco, Japan, with the following chemical formula: R1 = polypropylene glycol, epoxy equivalent 430 g / eq, viscosity 2300 cp.

[0082] ;

[0083] 4) Fused silica, manufactured by Yaduma Co., Ltd., trade name FEB25K-SED, average particle size 8μm, cutoff particle size 25μm, surface treated with 3-glycidoxypropyltrimethoxysilane.

[0084] 5) Anhydride curing agent, methyltetrahydrophthalic anhydride, manufactured by Risennoko Co., Ltd. of Japan, trade name HN-2200, anhydride equivalent 166g / eq, viscosity 60cp;

[0085] 6) Curing accelerator, manufactured by Ajinomoto Fine Chemicals Co., Ltd., trade name AJICURE™ PN-23;

[0086] 7) Silane coupling agent, 3-glycidyloxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Industry Co., Ltd., trade name KBM-403;

[0087] 8) Carbon black, manufactured by Cabot Corporation, trade name MOGUL-E;

[0088] 9) Dispersant, polyetheramine with polyethylene glycol as the main chain, manufactured by Huntsman Chemical Trading (Shanghai) Co., Ltd., trade name JEFFAMINE M-2070;

[0089] 10) Ethylene glycol diglycidyl ether, manufactured by Nagase Sangyo Co., Ltd., trade name EX-810P, chemical formula as follows, epoxy equivalent 95g / eq, viscosity 10cp;

[0090] ;

[0091] 11) 1,4-Butanediol diglycidyl ether, manufactured by Nagase Sangyo Co., Ltd., trade name EX-214L, chemical formula as follows, epoxy equivalent 115g / eq, viscosity 15cp;

[0092] ;

[0093] 12) 1,6-Hexanediol diglycidyl ether, manufactured by Nagase Sangyo Co., Ltd., trade name EX-212L, chemical formula as follows, epoxy equivalent 135g / eq, viscosity 15cp;

[0094] ;

[0095] 13) Sorbitol tetraglycidyl ether, manufactured by Nagase Sangyo Co., Ltd., trade name EX-614B, chemical formula as follows, epoxy equivalent 173g / eq, viscosity 5000cp;

[0096] ;

[0097] 14) Polypropylene glycol diglycidyl ether, manufactured by NOPTECHS ES 100, Japan, with the following chemical formula, epoxy equivalent 280 g / eq, and viscosity 32 cp.

[0098] ;

[0099] Feature Evaluation

[0100] a. Viscosity evaluation: The epoxy resin composition was tested at 25°C using a rheometer (TA Instruments HR-10) with a 25mm parallel plate and a shear rate of 1 / sec. The values ​​were obtained under the following conditions.

[0101] b. Thixotropic index (TI): The viscosity of the epoxy resin composition was determined at shear rates of 0.1 / sec and 1 / sec. The TI value was obtained by dividing the viscosity at 0.1 / sec by the viscosity at 1 / sec.

[0102] c. DMA Tg point and modulus: The epoxy resin composition was heated at 125°C for 10 minutes and then at 150°C for 1 hour to cure it, forming a cured product. The Tg point and modulus were tested using DMA (TA Instruments DMA850) in double cantilever mode, and the temperature corresponding to the peak value of Tanδ was taken as the Tg point.

[0103] d. Post-curing warpage: The post-curing warpage test of the epoxy resin composition was conducted using a 12-inch wafer (epoxy resin composition material thickness 400μm, wafer thickness 775μm) and a compression molding machine from Tongling Wenyi Sanjia Technology. The wafer was cured at 125℃ for 10 minutes, and the compressed epoxy resin composition was post-cured at 150℃ for 1 hour. The height difference between the center and the end of the silicon wafer was measured using a ruler to determine the warpage.

[0104] In summary, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0105] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any form or substance. It should be noted that those skilled in the art can make various improvements and additions without departing from the method of the present invention, and these improvements and additions should also be considered within the scope of protection of the present invention. Any modifications, alterations, and equivalent changes made by those skilled in the art based on the above-disclosed technical content without departing from the spirit and scope of the present invention are equivalent embodiments of the present invention. Furthermore, any modifications, alterations, and evolutions made to the above embodiments based on the essential technology of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. An epoxy resin composition, characterized in that, The epoxy resin composition comprises an epoxy resin, a multifunctional epoxy compound having a polyalkylene glycol chain, and an inorganic filler, wherein the multifunctional epoxy compound having a polyalkylene glycol chain has the structure shown in Formula I: Equation I; In formula I, R1 is selected from one or more of polyethylene glycol chains, polypropylene glycol chains, polytrimethylene glycol chains, and polytetramethylene glycol chains, with repeating units of 2 to 10; R2 is hydrogen or methyl; n is 2 to 20; The polyfunctional epoxy compound with polyalkylene glycol chains has a viscosity of 500~5000 cP at 25°C.

2. The epoxy resin composition according to claim 1, characterized in that, It also includes one or more of the following conditions: A1) The epoxy resin is selected from one or more combinations of trimethylolpropane triglycidyl ether, glycidylamine type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin and naphthalene type epoxy resin; A2) The inorganic filler is selected from one or more of the following: silica, alumina, talc, calcium carbonate, titanium dioxide, iron oxide red, silicon carbide, boron nitride, aluminum nitride, and glass beads, wherein the silica is selected from one or more of the following: fused silica and crystalline silica. A3) The epoxy equivalent of the polyfunctional epoxy compound having a polyalkylene glycol chain is 250~1000 g / eq; A4) The epoxy resin content in the epoxy resin composition is 0.5~15wt%; A5) The content of the structure represented by Formula I in the epoxy resin composition is 1~20 wt%; A6) The content of the inorganic filler in the epoxy resin composition is 50~95wt%.

3. The epoxy resin composition according to claim 2, characterized in that, In feature A2), the inorganic filler is selected from silica powder, preferably fused silica powder.

4. The epoxy resin composition according to claim 1, characterized in that, It also includes one or more of the following conditions: B1) The epoxy resin composition further includes a curing agent, wherein the curing agent is selected from one or more combinations of amine curing agents, phenol curing agents, and acid anhydride curing agents; B2) The epoxy resin composition further includes a curing accelerator, wherein the curing accelerator is selected from one or more combinations of amine compounds, phosphorus compounds, basic compounds, and microencapsulated curing accelerators; B3) The epoxy resin composition further includes additives selected from one or more of silane coupling agents, carbon black, ion trapping agents, defoamers, leveling agents, and dispersants.

5. The epoxy resin composition according to claim 4, characterized in that, It also includes one or more of the following conditions: B11) In feature B1), the content of the curing agent in the epoxy resin composition is 0.1~40 wt%; B21) In feature B2), the amine compound is an imidazole compound; B22) In feature B2), the basic compound is an organometallic compound; B23) In feature B2), the content of the curing accelerator in the epoxy resin composition is 0.1~10 wt%; B31) In feature B3), the content of additives in the epoxy resin composition is 0.1~10 wt%; B32) In feature B3), the silane coupling agent is selected from one or more of 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, vinyltrimethoxysilane, and vinyltriethoxysilane; B33) In feature B3), the content of the silane coupling agent in the epoxy resin composition is 0.1~10 wt%; B34) In feature B3), the carbon black content in the epoxy resin composition is 0.1~5 wt%; B35) In feature B3), the ion trapping agent is an inorganic ion exchanger; B36) In feature B3), the content of the ion scavenger in the epoxy resin composition is 0.05 wt% or more.

6. The epoxy resin composition according to claim 5, characterized in that, It also includes one or more of the following conditions: In feature B33), the content of the silane coupling agent in the epoxy resin composition is 1-5 wt%; In characteristic B34), the carbon black content in the epoxy resin composition is 0.5~2 wt%. In feature B36), the content of the ion scavenger in the epoxy resin composition is 0.05 to 2 wt%.

7. The epoxy resin composition according to any one of claims 1 to 6, wherein the epoxy resin composition is a sealing resin composition for use in semiconductor packaging with a sealing area of ​​wafer-level or above or board-level or above.

8. The method for preparing the epoxy resin composition according to any one of claims 1 to 7, characterized in that, The preparation method includes uniformly mixing epoxy resin, a polyfunctional epoxy compound with a polyalkylene glycol chain, and an inorganic filler to obtain an epoxy resin composition, which is then used after defoaming under reduced pressure.

9. A structural component, characterized in that, It includes electronic components and a resin layer cured from the epoxy resin composition as described in any one of claims 1 to 7.

10. A method for manufacturing a structural component as described in claim 9, characterized in that, Includes the following steps: The epoxy resin composition is coated onto the surface of the electronic component, and after curing to form the resin layer, the structural component is obtained.

Images