Thermal-mechanical coupling multi-parameter intelligent testing device for 5G chip packaging material

Abstract

The invention discloses a 5G chip packaging material thermal-mechanical coupling multi-parameter intelligent testing device, and relates to the technical field of intelligent test.The 5G chip packaging material thermal-mechanical coupling multi-parameter intelligent testing device comprises a box body, a machine door, a heating assembly, a hydraulic pressure testing head and an automatic temperature control module, the machine door is installed on the outer wall of the box body, and the hydraulic pressure testing head is located on the inner wall of the box body; the automatic temperature control module comprises a temperature sensor and a processing control module, the processing control module is installed on the outer wall of the box body, and the temperature sensor is located on the inner wall of the box body. When the processing control module detects a high temperature state, the processing control module controls the fan and the heating wire to reduce the power, and after the fan and the heating wire reduce the power, the temperature sensor continuously detects real-time temperature data in the box body until the processing control module detects a low temperature state or a proper temperature state; and the functions of stabilizing the heating temperature of the packaging material and improving the detection accuracy during the thermal coupling test of the 5G chip packaging material are realized.

Description

Technical Field

[0001] This invention relates to the field of intelligent testing technology, specifically to an intelligent testing device for multiple parameters of 5G chip packaging materials via thermo-mechanical coupling. Background Technology

[0002] As 5G communication technology develops towards high frequency, high speed, and high density, chip packaging materials need to maintain stable performance under complex thermo-mechanical coupling environments. However, existing testing technologies mostly focus on single parameter detection, making it difficult to simulate the synergistic effect of temperature and stress in actual working conditions. This leads to deviations between test results and actual application scenarios, failing to provide comprehensive data support for the selection and optimization of packaging materials. Furthermore, existing intelligent testing devices cannot stably reduce the heating temperature of packaging materials during thermo-mechanical coupling testing of 5G chip packaging materials, thus lowering the accuracy of the detection.

[0003] The shortcomings of existing intelligent testing devices are: 1. Patent document CN106501109A discloses an in-situ nanoindentation testing platform for energy storage materials under an electrochemical-thermal atmosphere, "including a packaging box, an inert gas circulation device, a base, a movable sample stage, a battery voltage and current controller, a constant temperature chamber, a nanoindenter, and an in-situ energy storage material mechanism; the in-situ energy storage material mechanism includes a battery shell with two spaced cavities at the top, a substrate installed in each of the two cavities of the battery shell, and energy storage material, a gasket, and a pressure plate installed on each substrate. The in-situ nanoindentation testing platform of this invention realizes in-situ testing of the mechanical properties of micro-nano level energy storage materials under different electrochemical and temperature fields. It solves the problem of in-situ testing of material properties under the multi-field coupling of micro-nano electrochemical and thermodynamic fields, provides more accurate and realistic test data, and designs the microstructure of energy storage materials from a mechanical perspective, thereby improving the foundation of material performance." However, existing intelligent testing devices cannot stably reduce the detection accuracy when heating the packaging material during the thermodynamic coupling test of 5G chip packaging materials. Summary of the Invention

[0004] The purpose of this invention is to provide a multi-parameter intelligent testing device for thermo-mechanical coupling of 5G chip packaging materials, so as to solve the technical problem mentioned in the background art that the heating temperature of the packaging material cannot be stably reduced during the thermo-mechanical coupling test of 5G chip packaging materials, thus reducing the accuracy of the test.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a 5G chip packaging material thermo-mechanical coupling multi-parameter intelligent testing device, comprising a housing, a door, a heating component, a hydraulic pressure testing head, and an automatic temperature control module. The door is installed on the outer wall of the housing, and the hydraulic pressure testing head is located on the inner wall of the housing. The automatic temperature control module includes a temperature sensor and a processing control module. The processing control module is installed on the outer wall of the housing, and the temperature sensor and the heating component are located on the inner wall of the housing. The processing control module is electrically connected to the temperature sensor and the heating component. The temperature sensor is used to detect the real-time temperature inside the housing. The processing control module is set with standard operating temperature data inside the housing. The standard operating temperature is adjusted by the processing control module. The suitable temperature and the real-time temperature are compared by the processing control module. The standard operating temperature is 80~150℃.

[0006] Preferably, the heating assembly includes a fan, a heating wire, and a first box. The first box is located on the inner wall of the housing, the fan is located on the inner wall of the first box, the heating wire is located on the inner wall of the first box, a filter screen is installed through the top of the housing and the first box, and an air outlet is provided at the bottom of the first box.

[0007] Preferably, the processing control module is electrically connected to the fan and heating wire. The real-time temperature data inside the chamber is transmitted to the processing control module. The processing control module compares the real-time temperature data inside the chamber with the standard operating temperature data inside the chamber. When the real-time temperature data inside the chamber is lower than the standard operating temperature data inside the chamber, it is set to a suitable temperature state. When the real-time temperature data inside the chamber is higher than the standard operating temperature data inside the chamber, it is set to a high temperature state. When the real-time temperature data inside the chamber is lower than the standard operating temperature data inside the chamber, it is set to a low temperature state.

[0008] Preferably, a baffle is installed on the inner wall of the housing, and a uniform heating component is installed through the inner wall of the baffle. The uniform heating component is electrically connected to the processing control module. A pressure sensor is installed at one end of the hydraulic pressure test head. The pressure sensor is electrically connected to the processing control module and displays the thermal coupling value on the display screen of the processing control module.

[0009] Preferably, the uniform heating assembly includes a first motor, a threaded rod, a threaded sleeve, an I-shaped rod, a connector, and a first support rod. The first motor is located on the inner wall of the housing, the threaded rod is located at the output end of the first motor, the threaded sleeve engages with the outer wall of the threaded rod, a second opening is installed through the top of the baffle, the I-shaped rod penetrates the inner wall of the second opening, a sealing ring is installed on the outer wall of the second opening, the connector is located at one end of the I-shaped rod, the first support rod is located at the bottom of the baffle, a sliding cylinder is installed on the outer wall of the first support rod, and the outer wall of the I-shaped rod is connected to the outer wall of the sliding cylinder.

[0010] Preferably, the slide cylinder moves with the support of the first support rod, the I-shaped rod moves through the second port, and the sealing ring is made of rubber, which seals the second port and the I-shaped rod.

[0011] Preferably, the outer wall of the connector is fitted with a placement box, the outer wall of the placement box has several through openings, and the bottom of the placement box has a placement groove.

[0012] Preferably, an auxiliary heating module is installed through the outer wall of the box. The auxiliary heating module is electrically connected to the processing control module. The auxiliary heating module includes a No. 5 box, a No. 3 motor, a No. 5 spring, a top rod, and a guide plate. The No. 5 box is located on the outer wall of the box, the No. 3 motor is located on the inner wall of the No. 5 box, the No. 5 spring is located on the inner wall of the No. 5 box, the top rod penetrates through the outer wall of the No. 5 box and the box, and the outer wall of the No. 5 spring is connected to the outer wall of the top rod. A guide plate is installed at the bottom of the No. 1 box through a rotating ring, and one end of the top rod is connected to the outer wall of the guide plate through the rotating ring. A winding wheel is installed at the output end of the No. 3 motor, and a pull rope is installed on the outer wall of the winding wheel, with one end of the pull rope connected to the outer wall of the top rod.

[0013] Preferably, the top rod is moved by the support of the No. 5 box and the box body.

[0014] Preferably, the method of using the testing device includes the following steps: Step S1: When the processing control module detects a high temperature, it controls the fan and heating wire to reduce power. After the fan and heating wire reduce power, the temperature sensor continues to monitor the real-time temperature data inside the chamber until the processing control module detects a low temperature or a suitable temperature. When the processing control module detects a low temperature, it controls the fan and heating wire to increase power. After the fan and heating wire increase power, the temperature sensor continues to monitor the real-time temperature data inside the chamber until the processing control module detects a high temperature or a suitable temperature. When the processing control module detects a suitable temperature, it controls the fan and heating wire to maintain the current power. After the fan and heating wire maintain the current power, the temperature sensor continues to monitor the real-time temperature data inside the chamber until the processing control module detects a high temperature or a low temperature. This achieves the function of stabilizing the heating temperature of the packaging material and improving the detection accuracy during the thermal coupling test of 5G chip packaging materials. Step S2: After the processing control module detects a suitable temperature, it controls the rotation of the No. 1 motor. The rotation of the No. 1 motor drives the threaded rod to rotate, the rotation of the threaded rod drives the threaded sleeve to move, the movement of the threaded sleeve drives the I-shaped rod to move, the movement of the I-shaped rod drives the slide cylinder to move, the movement of the slide cylinder makes the I-shaped rod stably drive the connector to move, and the movement of the connector makes the placement box move up and down in the box through the forward and reverse rotation of the No. 1 motor, which realizes the function of more uniform heating of chip packaging material, further improving heating efficiency and measurement accuracy. Step S3: During the movement of the placement box, hot air is blown through the through-hole onto the encapsulation material to heat it quickly and evenly, further improving heating efficiency; Step S4: When the processing control module detects a low temperature and wants to quickly heat the material, it controls the No. 3 motor to rotate. The rotation of the No. 3 motor drives the winding wheel to rotate, which in turn moves the pull rope. The movement of the pull rope moves the top rod, which in turn moves the No. 5 spring. The No. 5 spring causes the top rod to move through the rotating ring, which in turn moves the air guide plate. The air guide plate moves the top rod to both sides of the placement box, concentrating the hot air on the surface of the placement box to quickly heat the encapsulation material. This achieves the function of quickly heating the encapsulation material in a low temperature state, further improving the efficiency of the device for heating the encapsulation material in thermal coupling testing.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention, through a processing control module, detects a high temperature state and controls the fan and heating wire to reduce power. After the fan and heating wire reduce power, the temperature sensor continuously monitors the real-time temperature data inside the chamber until the processing control module detects a low temperature state or a suitable temperature state. When the processing control module detects a low temperature state, it controls the fan and heating wire to increase power. After the fan and heating wire increase power, the temperature sensor continues to monitor the real-time temperature data inside the chamber until the processing control module detects a high temperature state or a suitable temperature state. When the processing control module detects a suitable temperature state, it controls the fan and heating wire to maintain the current power. After the fan and heating wire maintain the current power, the temperature sensor continues to monitor the real-time temperature data inside the chamber until the processing control module detects a high temperature state or a low temperature state. This invention achieves the function of stabilizing the heating temperature of the packaging material and improving the detection accuracy during the thermal coupling test of 5G chip packaging materials. 2. This invention controls the rotation of a first motor after the processing control module detects a suitable temperature. The rotation of the first motor drives the threaded rod to rotate, which in turn drives the threaded sleeve to move. The movement of the threaded sleeve drives the I-shaped rod to move, which in turn drives the slide cylinder to move. The movement of the slide cylinder causes the I-shaped rod to stably drive the connector to move. The movement of the connector causes the placement box to move up and down inside the box through the forward and reverse rotation of the first motor. This achieves more uniform heating of the chip packaging material, further improving heating efficiency and measurement accuracy. 3. This invention improves heating efficiency by blowing hot air through the through-hole onto the packaging material during the movement of the placement box, thereby rapidly and evenly heating it. 4. This invention, through a processing control module, detects a low temperature condition in the material and aims to rapidly heat it. In this case, the processing control module controls the rotation of motor number three, which in turn rotates the winding wheel. The winding wheel then moves the pull rope, which in turn moves the top rod. The top rod then moves spring number five, which in turn causes the top rod to move via a rotating ring, thus moving the air guide plate. This air guide plate then moves the top rod to both sides of the placement box, concentrating hot air on the surface of the placement box to rapidly heat the encapsulation material. This achieves the function of rapidly heating the encapsulation material in a low-temperature state, further improving the efficiency of the device's thermal coupling test for heating the encapsulation material. Attached Figure Description

[0016] Figure 1 This is a front view structural diagram of the present invention; Figure 2 This is a schematic diagram of the cross-sectional structure of the column box of the present invention; Figure 3 This is a schematic diagram of the fan structure of the present invention; Figure 4 For the present invention Figure 2 A schematic diagram of structure A; Figure 5 This is a schematic diagram of the temperature control process of the present invention; Figure 6 This is a schematic diagram of the I-shaped rod structure of the present invention; Figure 7 For the present invention Figure 2 A schematic diagram of the B structure; Figure 8 This is a schematic diagram of the air guide plate structure of the present invention; Figure 9 This is a schematic diagram of the top rod structure of the present invention.

[0017] In the diagram: 1. Housing; 2. Door; 3. Processing control module; 4. Filter screen; 5. Box No. 1; 6. Fan; 7. Heating wire; 8. Temperature sensor; 9. Baffle; 10. Port No. 2; 11. Sealing ring; 12. I-shaped rod; 13. Connector; 14. Motor No. 1; 15. Threaded sleeve; 16. Threaded rod; 17. Support rod No. 1; 18. Slide cylinder; 19. Placement box; 20. Through-hole; 21. Placement slot; 22. Air outlet; 23. Air guide plate; 24. Top rod; 25. Box No. 5; 26. Spring No. 5; 27. Motor No. 3; 29. ​​Rewinding reel; 30. Pull rope; 35. Hydraulic pressure test head. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand this according to the specific circumstances.

[0021] Example 1: Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5A multi-parameter intelligent testing device for thermal-mechanical coupling of 5G chip packaging materials is disclosed. The device includes a housing 1, a door 2, a heating assembly, a hydraulic pressure testing head 35, and an automatic temperature control module. The door 2 is installed on the outer wall of the housing 1, and the hydraulic pressure testing head 35 is located on the inner wall of the housing 1. The automatic temperature control module includes a temperature sensor 8 and a processing control module 3. The processing control module 3 is installed on the outer wall of the housing 1, and the temperature sensor 8 is located on the inner wall of the housing 1. The heating assembly is located on the inner wall of the housing 1. The processing control module 3 is electrically connected to both the temperature sensor 8 and the heating assembly. The temperature sensor 8 is used to detect the real-time temperature inside the housing 1, and the processing control module 3 is equipped with… The standard operating temperature inside chamber 1 is adjusted by the processing control module 3. The suitable temperature and the real-time temperature are compared by the processing control module 3. The standard operating temperature is 80~150℃. The heating components include a fan 6, a heating wire 7, and a first box 5. The first box 5 is located on the inner wall of chamber 1. The fan 6 and the heating wire 7 are located on the inner wall of the first box 5. A filter screen 4 is installed through the top of chamber 1 and the first box 5. An air outlet 22 is opened at the bottom of the first box 5. A baffle 9 is installed on the inner wall of chamber 1. A uniform heating component is installed through the inner wall of the baffle 9. The uniform heating component is electrically connected to the processing control module 3. A pressure sensor is installed at one end of the hydraulic pressure test head 35. The pressure sensor is connected to the processing control module 3. Electrical connection and processing display of thermal coupling value are shown on the display screen of processing control module 3. The machine door 2 is opened, and the chip packaging material is placed into the placement box 19. At this time, the fan 6 and heating wire 7 are started, blowing hot air through the air outlet 22 onto the chip packaging material to heat it. Simultaneously, the hydraulic pressure test head 35 is activated to perform a thermal coupling test on the heated chip packaging material. The test results are output and viewed by processing control module 3. Processing control module 3 is electrically connected to fan 6 and heating wire 7. Real-time temperature data inside chamber 1 is transmitted to processing control module 3. Processing control module 3 compares the real-time temperature data inside chamber 1 with the standard operating temperature data inside chamber 1. When the real-time temperature data inside chamber 1 is within the standard operating temperature data inside chamber 1, it is set as acceptable. Under suitable temperature conditions, a high temperature state is defined as when the real-time temperature data inside chamber 1 is greater than the standard operating temperature data inside chamber 1, and a low temperature state is defined as when the real-time temperature data inside chamber 1 is less than the standard operating temperature data inside chamber 1. When the processing control module 3 detects a high temperature state, it controls the fan 6 and heating wire 7 to reduce their power. After the fan 6 and heating wire 7 reduce their power, the temperature sensor 8 continues to monitor the real-time temperature data inside chamber 1 until the processing control module 3 detects a low temperature state or a suitable temperature state. When the processing control module 3 detects a low temperature state, it controls the fan 6 and heating wire 7 to increase their power. After the fan 6 and heating wire 7 increase their power, the temperature sensor 8 continues to monitor the real-time temperature data inside chamber 1.Until the processing control module 3 detects a high temperature or a suitable temperature, and when the processing control module 3 detects a suitable temperature, it controls the fan 6 and heating wire 7 to maintain the current power. After the fan 6 and heating wire 7 maintain the current power, the temperature sensor 8 continuously monitors the real-time temperature data inside the chamber 1 until the processing control module 3 detects a high temperature or a low temperature. This achieves the function of stabilizing the heating temperature of the packaging material and improving the detection accuracy during the thermal coupling test of 5G chip packaging materials.

[0022] Example 2: Please refer to Figure 1 , Figure 2 and Figure 6 A multi-parameter intelligent testing device for thermal-mechanical coupling of 5G chip packaging materials includes a uniformly heated component comprising a primary motor 14, a threaded rod 16, a threaded sleeve 15, an I-shaped rod 12, a connector 13, and a primary support rod 17. The primary motor 14 is located on the inner wall of the housing 1. The threaded rod 16 is located at the output end of the primary motor 14. The threaded sleeve 15 engages with the outer wall of the threaded rod 16. A secondary port 10 is installed through the top of a baffle 9. The I-shaped rod 12 penetrates the inner wall of the secondary port 10. A sealing ring 11 is installed on the outer wall of the secondary port 10. The connector 13 is located at one end of the I-shaped rod 12. The primary support rod 17 is located at the bottom of the baffle 9. A sliding cylinder 18 is installed on the outer wall of the primary support rod 17, and the outer wall of the I-shaped rod 12 is connected to the outer wall of the sliding cylinder 18. The sliding cylinder 18 is connected to the primary support rod 17. The support of rod 17 moves, and I-shaped rod 12 moves through port 10. The sealing ring 11 is made of rubber and seals port 10 and I-shaped rod 12. After the processing control module 3 detects a suitable temperature, it controls motor 14 to rotate. The rotation of motor 14 drives threaded rod 16 to rotate, which in turn drives threaded sleeve 15 to move. The movement of threaded sleeve 15 drives I-shaped rod 12 to move, which in turn drives slide cylinder 18 to move. The movement of slide cylinder 18 makes I-shaped rod 12 stably drive connector 13 to move. The movement of connector 13 makes placement box 19 move up and down inside box 1 by the forward and reverse rotation of motor 14, which realizes the function of more uniform heating of chip packaging material, further improving heating efficiency and measurement accuracy.

[0023] Example 3: Please refer to Figure 1 , Figure 2 and Figure 7 A multi-parameter intelligent testing device for thermal-mechanical coupling of 5G chip packaging materials is disclosed. A placement box 19 is installed on the outer wall of the connector 13. Several through holes 20 are opened on the outer wall of the placement box 19. A placement groove 21 is opened at the bottom of the placement box 19. An auxiliary heating module is installed through the outer wall of the box body 1. The auxiliary heating module is electrically connected to the processing control module 3. During the movement of the placement box 19, hot air is blown through the through holes 20 to heat the packaging material quickly and evenly, thereby improving the heating efficiency.

[0024] Example 4: Please refer to Figure 2 , Figure 8 and Figure 9 A multi-parameter intelligent testing device for thermo-mechanical coupling of 5G chip packaging materials is disclosed. The auxiliary heating module includes a fifth box 25, a third motor 27, a fifth spring 26, a top rod 24, and a guide plate 23. The fifth box 25 is located on the outer wall of the housing 1. The third motor 27 is located on the inner wall of the fifth box 25. The fifth spring 26 is located on the inner wall of the fifth box 25. The top rod 24 passes through the fifth box 25 and the outer wall of the housing 1, and the outer wall of the fifth spring 26 is connected to the outer wall of the top rod 24. The bottom of the first box 5 is equipped with a guide plate 23 via a rotating ring, and one end of the top rod 24 is connected to the outer wall of the guide plate 23 via the rotating ring. A winding wheel 29 is installed at the output end of the third motor 27, and a pull rope 30 is installed on the outer wall of the winding wheel 29, with one end of the pull rope 30 connected to the outer wall of the top rod 24. The wall connection allows the top rod 24 to move via the support of the fifth box 25 and the box body 1. When the processing control module 3 detects a low temperature and wants to quickly heat the material, it controls the third motor 27 to rotate. The rotation of the third motor 27 drives the winding wheel 29 to rotate, which in turn moves the pull rope 30. The movement of the pull rope 30 moves the top rod 24, which in turn moves the fifth spring 26. The fifth spring 26 causes the top rod 24 to move via the rotating ring, which in turn moves the air guide plate 23. The air guide plate 23 moves the top rod 24 to both sides of the placement box 19, concentrating hot air on the surface of the placement box 19 to quickly heat the encapsulation material. This achieves the function of rapidly heating the encapsulation material in a low temperature state, further improving the efficiency of the device's thermal coupling test for heating the encapsulation material.

[0025] The method of using this testing device includes the following steps: Step S1: When the processing control module 3 detects a high temperature, it controls the fan 6 and heating wire 7 to reduce their power. After the fan 6 and heating wire 7 reduce their power, the temperature sensor 8 continues to monitor the real-time temperature data inside the chamber 1 until the processing control module 3 detects a low temperature or a suitable temperature. When the processing control module 3 detects a low temperature, it controls the fan 6 and heating wire 7 to increase their power. After the fan 6 and heating wire 7 increase their power, the temperature sensor 8 continues to monitor the real-time temperature data inside the chamber 1 until the processing control module 3 detects a high temperature or a suitable temperature. When the processing control module 3 detects a suitable temperature, it controls the fan 6 and heating wire 7 to maintain their current power. After the fan 6 and heating wire 7 maintain their current power, the temperature sensor 8 continues to monitor the real-time temperature data inside the chamber 1 until the processing control module 3 detects a high temperature or a low temperature. This achieves the function of stabilizing the heating temperature of the packaging material and improving the detection accuracy during the thermal coupling test of 5G chip packaging materials. Step S2: After the processing control module 3 detects a suitable temperature, it controls the first motor 14 to rotate. The rotation of the first motor 14 drives the threaded rod 16 to rotate, which in turn drives the threaded sleeve 15 to move. The movement of the threaded sleeve 15 drives the I-shaped rod 12 to move, which in turn drives the slide cylinder 18 to move. The movement of the slide cylinder 18 makes the I-shaped rod 12 stably drive the connector 13 to move. The movement of the connector 13 makes the placement box 19 move up and down inside the box 1 by the forward and reverse rotation of the first motor 14, which realizes the function of more uniform heating of the chip packaging material, further improving heating efficiency and measurement accuracy. Step S3: During the movement of the placement box 19, hot air is blown through the through-hole 20 over the encapsulation material to heat it quickly and evenly, further improving the heating efficiency. Step S4: When the processing control module 3 detects a low temperature and wants to quickly heat the material, it controls the third motor 27 to rotate. The rotation of the third motor 27 drives the winding wheel 29 to rotate, which in turn moves the pull rope 30. The movement of the pull rope 30 moves the top rod 24, which in turn moves the fifth spring 26. The fifth spring 26 causes the top rod 24 to move through the rotating ring, which in turn moves the air guide plate 23. The air guide plate 23 moves to both sides of the placement box 19, concentrating hot air on the surface of the placement box 19 to quickly heat the encapsulation material. This achieves the function of quickly heating the encapsulation material in a low temperature state, further improving the efficiency of the device for heating the encapsulation material in thermal coupling testing.

[0026] Working principle: When the processing control module 3 detects a high temperature, it controls the fan 6 and heating wire 7 to reduce their power. After the fan 6 and heating wire 7 reduce their power, the temperature sensor 8 continuously monitors the real-time temperature data inside the chamber 1 until the processing control module 3 detects a low temperature or a suitable temperature. When the processing control module 3 detects a low temperature, it controls the fan 6 and heating wire 7 to increase their power. After the fan 6 and heating wire 7 increase their power, the temperature sensor 8 continues to monitor the real-time temperature data inside the chamber 1 until the processing control module 3 detects a high temperature or a suitable temperature. When the processing control module 3 detects a suitable temperature, it controls the fan 6 and heating wire 7 to maintain their current power. After the fan 6 and heating wire 7 maintain their current power, the temperature sensor 8 continuously monitors the real-time temperature data inside the chamber 1 until the processing control module 3 detects a high or low temperature. This achieves the function of stabilizing the heating temperature of the packaging material and improving detection accuracy during the thermal coupling test of 5G chip packaging materials. After detecting a suitable temperature, the processing control module 3 controls the first motor 14 to rotate. The rotation of the first motor 14 drives the threaded rod 16 to rotate, which in turn drives the screw... The threaded sleeve 15 moves, which in turn moves the I-shaped rod 12. The I-shaped rod 12 then moves the slide cylinder 18. The slide cylinder 18 moves, causing the I-shaped rod 12 to stably move the connector 13. The connector 13 moves, causing the placement box 19 to move up and down within the housing 1 via the forward and reverse rotation of the No. 1 motor 14. This achieves more uniform heating of the chip packaging material, further improving heating efficiency and measurement accuracy. During the movement of the placement box 19, hot air is blown through the through-hole 20 onto the packaging material, rapidly and uniformly heating it and further improving heating efficiency. When the processing control module 3 detects a low temperature, it also accelerates the process. The material is rapidly heated. At this time, the processing control module 3 controls the rotation of motor 27, which drives the winding wheel 29 to rotate. The rotation of the winding wheel 29 drives the pull rope 30 to move. The movement of the pull rope 30 drives the top rod 24 to move. The movement of the top rod 24 drives the fifth spring 26 to move. The fifth spring 26 causes the top rod 24 to drive the air guide plate 23 to move through the rotating ring. The movement of the air guide plate 23 moves it to both sides of the placement box 19, concentrating hot air on the surface of the placement box 19 to rapidly heat up the encapsulation material. This realizes the function of rapidly heating the encapsulation material in a low temperature state, further improving the efficiency of the device for heating the encapsulation material thermal coupling test.

[0027] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A multi-parameter intelligent testing device for thermo-mechanical coupling of 5G chip packaging materials, comprising a housing (1), a door (2), a heating component, a hydraulic pressure testing head (35), and an automatic temperature control module, characterized in that: The outer wall of the enclosure (1) is equipped with an organic door (2), and the hydraulic pressure test head (35) is located on the inner wall of the enclosure (1). The automatic temperature control module includes a temperature sensor (8) and a processing control module (3). The outer wall of the enclosure (1) is equipped with a processing control module (3), the temperature sensor (8) is located on the inner wall of the enclosure (1), the heating component is located on the inner wall of the enclosure (1), the processing control module (3) is electrically connected to the temperature sensor (8), and the processing control module (3) is electrically connected to the heating component. The temperature sensor (8) is used to detect the real-time temperature inside the enclosure (1). The processing control module (3) is set with standard working temperature data inside the enclosure (1). The standard working temperature is adjusted by the processing control module (3). The standard working temperature and the real-time temperature are compared by the processing control module (3). The standard working temperature is 80~150℃.

2. The intelligent testing device for multiple parameters of 5G chip packaging materials based on thermo-mechanical coupling according to claim 1, characterized in that: The heating assembly includes a fan (6), a heating wire (7), and a first box (5). The first box (5) is located on the inner wall of the box (1), the fan (6) is located on the inner wall of the first box (5), the heating wire (7) is located on the inner wall of the first box (5), a filter screen (4) is installed through the top of the box (1) and the first box (5), and an air outlet (22) is opened at the bottom of the first box (5).

3. The intelligent testing device for multiple parameters of thermo-mechanical coupling of 5G chip packaging materials according to claim 2, characterized in that: The processing control module (3) is electrically connected to the fan (6) and the heating wire (7). The real-time temperature data inside the box (1) is transmitted to the processing control module (3). The processing control module (3) compares the real-time temperature data inside the box (1) with the standard working temperature data inside the box (1). When the real-time temperature data inside the box (1) is at the same level as the standard working temperature data inside the box (1), it is set to a suitable temperature state. When the real-time temperature data inside the box (1) is greater than the standard working temperature data inside the box (1), it is set to a high temperature state. When the real-time temperature data inside the box (1) is less than the standard working temperature data inside the box (1), it is set to a low temperature state.

4. The intelligent testing device for multi-parameter thermo-mechanical coupling of 5G chip packaging materials according to claim 1, characterized in that: The inner wall of the box (1) is equipped with a baffle (9), and a uniform heating component is installed through the inner wall of the baffle (9). The uniform heating component is electrically connected to the processing control module (3). A pressure sensor is installed at one end of the hydraulic pressure test head (35). The pressure sensor is electrically connected to the processing control module (3) and displays the thermal coupling value on the display screen of the processing control module (3).

5. The intelligent testing device for thermo-mechanical coupling of multiple parameters of 5G chip packaging materials according to claim 4, characterized in that: The uniform heating assembly includes a first motor (14), a threaded rod (16), a threaded sleeve (15), an I-shaped rod (12), a connector (13), and a first support rod (17). The first motor (14) is located on the inner wall of the housing (1), the threaded rod (16) is located at the output end of the first motor (14), the threaded sleeve (15) engages with the outer wall of the threaded rod (16), a second port (10) is installed through the top of the baffle (9), the I-shaped rod (12) is installed through the inner wall of the second port (10), a sealing ring (11) is installed on the outer wall of the second port (10), the connector (13) is located at one end of the I-shaped rod (12), the first support rod (17) is located at the bottom of the baffle (9), a slide cylinder (18) is installed on the outer wall of the first support rod (17), and the outer wall of the I-shaped rod (12) is connected to the outer wall of the slide cylinder (18).

6. The intelligent testing device for thermo-mechanical coupling of multiple parameters of 5G chip packaging materials according to claim 5, characterized in that: The slide cylinder (18) moves under the support of the first support rod (17), the I-shaped rod (12) moves through the second port (10), and the sealing ring (11) is made of rubber. The sealing ring (11) seals the second port (10) and the I-shaped rod (12).

7. The intelligent testing device for multiple parameters of thermo-mechanical coupling of 5G chip packaging materials according to claim 5, characterized in that: The outer wall of the connector (13) is fitted with a placement box (19), the outer wall of the placement box (19) has several through holes (20), and the bottom of the placement box (19) has a placement groove (21).

8. The intelligent testing device for thermo-mechanical coupling of multiple parameters of 5G chip packaging materials according to claim 2, characterized in that: An auxiliary heating module is installed through the outer wall of the box (1). The auxiliary heating module is electrically connected to the processing control module (3). The auxiliary heating module includes a fifth box (25), a third motor (27), a fifth spring (26), a top rod (24), and a guide plate (23). The fifth box (25) is located on the outer wall of the box (1), the third motor (27) is located on the inner wall of the fifth box (25), the fifth spring (26) is located on the inner wall of the fifth box (25), and the top rod (24) is installed through the outer wall. The outer walls of the No. 5 box (25) and the box body (1) are connected, and the outer wall of the No. 5 spring (26) is connected to the outer wall of the top rod (24). The bottom of the No. 1 box (5) is equipped with a guide plate (23) through a swivel ring, and one end of the top rod (24) is connected to the outer wall of the guide plate (23) through a swivel ring. The output end of the No. 3 motor (27) is equipped with a winding wheel (29), and the outer wall of the winding wheel (29) is equipped with a pull rope (30), and one end of the pull rope (30) is connected to the outer wall of the top rod (24).

9. The intelligent testing device for multiple parameters of 5G chip packaging materials based on thermo-mechanical coupling according to claim 8, characterized in that: The top rod (24) moves by means of the support of the No. 5 box (25) and the box body (1).

10. A method of using a 5G chip packaging material thermo-mechanical coupling multi-parameter intelligent testing device, applicable to the 5G chip packaging material thermo-mechanical coupling multi-parameter intelligent testing device as described in any one of claims 1-9, characterized in that, The method of using this testing device includes the following steps: Step S1: When the processing control module (3) detects a high temperature, it controls the fan (6) and heating wire (7) to reduce their power. After the fan (6) and heating wire (7) reduce their power, the temperature sensor (8) continues to monitor the real-time temperature data inside the chamber (1) until the processing control module (3) detects a low temperature or a suitable temperature. When the processing control module (3) detects a low temperature, it controls the fan (6) and heating wire (7) to increase their power. After the fan (6) and heating wire (7) increase their power, the temperature sensor (8) continues to monitor the real-time temperature data inside the chamber (1). The real-time temperature data inside the body (1) is collected until the processing control module (3) detects a high temperature or a suitable temperature. When the processing control module (3) detects a suitable temperature, the processing control module (3) controls the fan (6) and heating wire (7) to maintain the current power. After the fan (6) and heating wire (7) maintain the current power, the temperature sensor (8) continues to detect the real-time temperature data inside the box (1) until the processing control module (3) detects a high temperature or a low temperature. This realizes the function of stabilizing the heating temperature of the packaging material and improving the detection accuracy during the thermal coupling test of 5G chip packaging material. Step S2: After the processing control module (3) detects a suitable temperature, it controls the first motor (14) to rotate. The rotation of the first motor (14) drives the threaded rod (16) to rotate. The rotation of the threaded rod (16) drives the threaded sleeve (15) to move. The movement of the threaded sleeve (15) drives the I-shaped rod (12) to move. The movement of the I-shaped rod (12) drives the slide cylinder (18) to move. The movement of the slide cylinder (18) makes the I-shaped rod (12) stably drive the connector (13) to move. The movement of the connector (13) makes the placement box (19) move up and down in the box (1) by the forward and reverse rotation of the first motor (14), which realizes the function of more uniform heating of chip packaging material, further improving heating efficiency and measurement accuracy. Step S3: During the movement of the placement box (19), hot air is blown through the through-hole (20) over the encapsulation material to heat it quickly and evenly, further improving the heating efficiency; Step S4: When the processing control module (3) detects a low temperature state and wants to quickly heat the material, the processing control module (3) controls the third motor (27) to rotate. The rotation of the third motor (27) drives the winding wheel (29) to rotate. The rotation of the winding wheel (29) drives the pull rope (30) to move. The movement of the pull rope (30) drives the top rod (24) to move. The movement of the top rod (24) drives the fifth spring (26) to move. The fifth spring (26) causes the top rod (24) to drive the air guide plate (23) to move through the rotating ring. The movement of the air guide plate (23) moves it to both sides of the placement box (19) to concentrate hot air on the surface of the placement box (19) so that the encapsulation material can be heated quickly. This realizes the function of rapidly heating the encapsulation material in a low temperature state and further improving the efficiency of the device for heating the encapsulation material thermal coupling test.

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