Screen assembly and electronic equipment

Abstract

The invention discloses a screen assembly and electronic equipment, and belongs to the technical field of electronic equipment. The screen assembly comprises a display screen, a screen supporting piece is arranged on one side of the display screen, and the screen supporting piece is of a metal structure and used for supporting the display screen; the screen assembly further comprises a heat conduction plate, the heat conduction plate and the screen supporting piece define a sealed cavity, a supporting column and a capillary layer are arranged in the sealed cavity, one of the supporting column and the capillary layer is arranged on the inner wall of the screen supporting piece, and the other one of the supporting column and the capillary layer is attached to the inner wall of the heat conduction plate.

Description

Technical Field

[0001] This application belongs to the field of electronic device technology, specifically relating to a screen assembly and an electronic device. Background Technology

[0002] In related technologies, electronic devices include a frame, a battery cover, and a circuit board. The frame and cover are an integrated structure, and the circuit board is fixed to the battery cover. The circuit board houses components, which generate heat during operation. To accelerate heat dissipation, a heat spreader is also provided, positioned on the side of the circuit board near the screen assembly. Heat generated by the components on the circuit board is transferred to the heat spreader and then from there to the outside of the electronic device. However, since the heat spreader occupies space in the thickness direction of the electronic device, it increases the device's thickness, hindering the pursuit of a thinner and lighter design. Summary of the Invention

[0003] This application aims to provide a screen assembly and an electronic device that at least solves one of the problems of the heat spreader occupying space in the thickness direction of the electronic device, thereby increasing the thickness of the electronic device and hindering its thinness and lightness.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of this application propose a screen assembly, which includes a display screen and a screen support member on one side of the display screen. The screen support member is a metal structure used to support the display screen. The screen assembly also includes a heat-conducting plate, which, together with the screen support member, forms a sealed cavity. A support column and a capillary layer are disposed within the sealed cavity. One of the support column and the capillary layer is disposed on the inner wall of the screen support member, and the other is attached to the inner wall of the heat-conducting plate.

[0006] Secondly, embodiments of this application propose an electronic device including a screen assembly as described in any of the above technical solutions.

[0007] In the embodiments of this application, the screen assembly includes a display screen, and a screen support member is disposed on one side of the display screen. The screen support member is a metal structure and is used to support and protect the screen, thereby improving the stability of the screen during the use of the electronic device. The screen assembly also includes a heat-conducting plate, which, together with the screen support member, forms a sealed cavity. A support column and a capillary layer are disposed within the sealed cavity. One of the support column and the capillary layer is disposed on the inner wall of the screen support member, and the other is attached to the inner wall of the heat-conducting plate. The heat-conducting plate is used to absorb heat. The heat generated by the heat-generating components of the electronic device can be transferred to the capillary layer through the heat-conducting plate and diffused to the periphery of the screen support member. The heat is then transferred to the outside of the electronic device through the screen support member, thereby achieving heat dissipation of the electronic device. Since the heat dissipation process of the electronic device reuses the screen support member supporting the screen as a non-heat source surface for heat dissipation, the heat dissipation structure no longer needs to be provided with a non-heat source surface for heat dissipation, thereby reducing the space occupied by the heat dissipation structure in the thickness direction of the electronic device, reducing the thickness of the electronic device, and facilitating the miniaturization of the electronic device.

[0008] The capillary layer contacts the screen support component, and the heat-conducting plate is located on the side of the capillary layer away from the screen support component. The heat-conducting plate absorbs heat generated by the heat-generating components, allowing the display screen and the heat-spreading structure to be integrated. This results in a tighter contact between the display screen and the heat-spreading structure, eliminating the need for assembly gaps between them. This further reduces the space occupied by the heat-spreading structure in the thickness direction of the electronic device, reducing its thickness and facilitating miniaturization. Furthermore, the tighter contact between the display screen and the heat-spreading structure accelerates the transfer of heat from the heat-spreading structure to the display screen, thereby improving the heat dissipation efficiency of the electronic device. This leads to more stable operation and improved overall quality of the electronic device.

[0009] Because the capillary layer is in contact with the screen support and is located on the side of the screen support away from the screen, the capillary layer in contact with the side of the screen support away from the screen will not cause localized development on the screen, thereby reducing the impact of the heat dissipation structure on the display and improving the display effect. Even if the display is subjected to external pressure, because the side of the screen support away from the screen is in contact with the capillary layer, the capillary layer makes the pressure distribution on the display more uniform and also acts as a buffer, thus reducing the probability of top-marking on the display and further improving the display effect.

[0010] The electronic device includes a screen assembly as described in any of the above technical solutions, and therefore the electronic device possesses all the beneficial effects of the screen assembly as described in any of the above technical solutions.

[0011] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0012] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0013] Figure 1 This is one of the schematic cross-sectional views of a screen assembly according to an embodiment of this application;

[0014] Figure 2 This is a second schematic diagram of the cross-sectional structure of the screen assembly according to an embodiment of this application;

[0015] Figure 3 This is one of the structural schematic diagrams of a screen assembly according to an embodiment of this application;

[0016] Figure 4 This is a second schematic diagram of the structure of a screen assembly according to an embodiment of this application;

[0017] Figure 5 This is the third schematic diagram of the structure of the screen assembly according to an embodiment of this application;

[0018] Figure 6 This is the fourth schematic diagram of the structure of the screen assembly according to an embodiment of this application;

[0019] Figure 7 This is the third schematic diagram of the cross-sectional structure of the screen assembly according to an embodiment of this application;

[0020] Figure 8 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0021] Figure label:

[0022] 10 Screen assembly, 100 Display screen, 110 Screen, 120 Screen support, 122 Sealed cavity, 200 Heat dissipation structure, 210 Capillary layer, 212 Main body, 214 Protrusion, 216 Channel, 220 Heat conduction plate, 222 First area, 224 Second area, 300 Support column, 20 Heating element, 30 Housing, 32 Frame, 34 Cover, 40 Circuit board. Detailed Implementation

[0023] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0024] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0025] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0026] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0027] The following is combined Figures 1 to 8 This application describes a screen assembly 10 and an electronic device according to embodiments thereof.

[0028] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, according to some embodiments of this application, the screen assembly 10 includes a display screen 100, and a screen support member 120 is provided on one side of the display screen 100. The screen support member 120 is a metal structure used to support the display screen 100. The screen assembly 10 also includes a heat-conducting plate 220. The heat-conducting plate 220 and the screen support member 120 enclose a sealed cavity 122. A support column 300 and a capillary layer 210 are provided in the sealed cavity 122. One of the support column 300 and the capillary layer 210 is disposed on the inner wall of the screen support member 120, and the other is attached to the inner wall of the heat-conducting plate 220.

[0029] In the embodiments of this application, the screen assembly 10 is used in an electronic device, and when the electronic device is working, the screen assembly 10 is used to realize human-computer interaction. The electronic device includes a heat-generating component 20, which generates a certain amount of heat when the electronic device is working. The screen assembly 10 includes a display screen 100, and a screen support member 120 is provided on one side of the display screen 100. The screen support member 120 is a metal structure used to support the display screen 100, thereby improving the stability of the screen 110 during the use of the electronic device. The screen assembly 10 also includes a heat-conducting plate 220, which, together with the screen support member 120, forms a sealed cavity 122. A support column 300 and a capillary layer 210 are disposed within the sealed cavity 122. One of the support column 300 and the capillary layer 210 is disposed on the inner wall of the screen support member 120, and the other is attached to the inner wall of the heat-conducting plate 220. The heat-conducting plate 220 absorbs the heat generated by the heat-generating component 20. The heat generated by the heat-generating component 20 can be transferred through the heat-conducting plate 220 to the capillary layer 210 and diffused around the heat-spreading structure 200. The heat is then transferred to the outside of the electronic device through the screen support member 120, thereby achieving heat dissipation for the electronic device. Since the heat dissipation process of the electronic device reuses the screen support member 120 supporting the screen 110 as a non-heat source surface for heat dissipation, the heat-spreading structure 200 no longer needs to have a non-heat source surface for heat dissipation. This reduces the space occupied by the heat-spreading structure 200 in the thickness direction of the electronic device, reduces the thickness of the electronic device, and is beneficial for miniaturization.

[0030] The capillary layer 210 contacts the screen support 120. A heat-conducting plate 220 is located on the side of the capillary layer 210 away from the screen support 120. The heat-conducting plate 220 absorbs the heat generated by the heat-generating component 20, making the display screen 100 and the heat-spreading structure 200 integrated. This results in a tighter contact between the display screen 100 and the heat-spreading structure 200, eliminating the need for assembly gaps between them. This further reduces the space occupied by the heat-spreading structure 200 in the thickness direction of the electronic device, reducing its thickness and facilitating miniaturization. Furthermore, the tighter contact between the display screen 100 and the heat-spreading structure 200 accelerates the heat transfer from the heat-spreading structure 200 to the display screen 100, thereby increasing the heat dissipation efficiency of the electronic device, making its operation more stable, and improving its overall quality.

[0031] Since the capillary layer 210 is in contact with the screen support 120 and is located on the side of the screen support 120 away from the screen 110, the capillary layer 210 in contact with the side of the screen support 120 away from the screen 110 will not produce localized development on the screen 110, thereby reducing the impact of the heat dissipation structure 200 on the display screen 100 and improving the display effect of the display screen 100. Even if the display screen 100 is subjected to external pressure, since the side of the screen support 120 away from the screen 110 is in contact with the capillary layer 210, the capillary layer 210 makes the pressure distribution on the display screen 100 more uniform on the one hand, and plays a buffering role on the other hand. Therefore, it reduces the probability of top-marking phenomenon on the display screen 100 and further improves the display effect of the display screen 100.

[0032] The heat dissipation structure 200 works in conjunction with the display screen 100 to dissipate heat from the electronic device, allowing the display screen 100 to support the heat dissipation structure 200. The electronic device no longer needs to have a support structure to support the heat dissipation structure 200. The application of the heat dissipation structure 200 is not limited by the main upper aluminum alloy middle plate, which also liberates the application freedom of the middle plate. It can be installed upright or upside down, which improves the diversity of mobile phone structural design, further reduces the thickness of the electronic device, and makes the internal layout of the electronic device more flexible and convenient.

[0033] Optionally, the heat spreader structure 200 is a heat spreader plate (VC, Vapor Chamber).

[0034] Specifically, the screen assembly 10 is an integrated structure that combines the display screen 100 with the heat dissipation structure 200.

[0035] Optionally, the capillary layer 210 is a capillary web.

[0036] Optionally, the screen support 120 is connected to the heat-conducting plate 220, and the screen support 120 and the heat-conducting plate 220 enclose a sealed cavity 122. The sealed cavity 122 is a closed environment and is filled with a certain amount of liquid (water). A capillary layer 210 is disposed inside the sealed cavity 122. The capillary layer 210 stores liquid.

[0037] When the electronic device is operating, the heat generated by the heat-generating component 20 is transferred to the heat-conducting plate 220 of the heat-spreading structure 200. After passing through the heat-conducting plate 220, the heat is transferred to the capillary layer 210. Since the capillary layer 210 is located inside the sealed cavity 122, the liquid inside the capillary layer 210 has a low boiling point. After the heat is transferred to the capillary layer 210, the temperature of the liquid inside the capillary layer 210 rises and boils. After the liquid vaporizes, the steam carries heat and spreads to various areas of the sealed cavity 122, thereby achieving heat spread. The steam spreading to various areas of the sealed cavity 122 releases heat after contacting the screen support 120, thereby allowing the heat to be transferred to the outside of the electronic device through the screen support 120, achieving heat dissipation for the electronic device. The steam after releasing heat liquefies again and is absorbed by the capillary layer 210, and then transferred to the surface of the heat-conducting plate 220 through the capillary layer 210, forming a circulation of liquid inside the sealed cavity 122.

[0038] Part of the space in the sealed cavity 122 is occupied by the capillary layer 210 and the support column 300, and the remaining space is the channel 216.

[0039] According to some embodiments of this application, such as Figure 1 and Figure 2 As shown, the capillary layer 210 is attached to the inner wall of the screen support 120, and the support column 300 is disposed on the heat-conducting plate 220.

[0040] In this embodiment, the capillary layer 210 is attached to the inner wall of the screen support 120, and the support column 300 is disposed on the heat-conducting plate 220. That is, the capillary layer 210 is located on the side of the screen support 120 away from the screen 110. The capillary layer 210 will not cause local development on the screen 110, thereby reducing the impact of the heat dissipation structure 200 on the display screen 100 and improving the display effect of the display screen 100. Even if the display screen 100 is subjected to external pressure, since the side of the screen support 120 away from the screen 110 is in contact with the capillary layer 210, the setting of the capillary layer 210 makes the pressure distribution on the display screen 100 more uniform on the one hand, and on the other hand, it can play a buffering role. Therefore, it reduces the probability of the display screen 100 exhibiting top-marking phenomenon and further improves the display effect of the display screen 100.

[0041] According to some embodiments of this application, such as Figure 1 and Figure 2 As shown, the capillary layer 210 includes a main body 212 and a protrusion 214. The protrusion 214 protrudes from the main body 212 and contacts the inner wall of the heat-conducting plate 220.

[0042] In this embodiment, the capillary layer 210 includes a main body 212 and a protrusion 214. The protrusion 214 protrudes from the main body 212 and contacts the inner wall of the heat-conducting plate 220. The liquid in the main body 212 can be transferred to the heat-conducting plate 220 through the protrusion 214, thereby improving the heat dissipation efficiency of the heat-spreading structure 200.

[0043] According to some embodiments of this application, such as Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, the heat-conducting plate 220 has a first region 222 for absorbing heat, and a protrusion 214 is disposed in the first region 222.

[0044] In this embodiment, the heat-conducting plate 220 has a first region 222, which is used to absorb the heat generated by the heating element 20, thereby enabling the heat generated by the heating element 20 to be transferred to the heat-spreading structure 200. A protrusion 214 is disposed in the first region 222, allowing the liquid within the main body 212 to move through the protrusion 214 to the first region 222 of the heat-conducting plate 220. This allows the heat transferred to the first region 222 to more fully contact the liquid in the capillary layer 210, improving the liquefaction efficiency of the liquid by the heat transferred to the first region 222. This enables the liquid in the capillary layer 210 to liquefy and diffuse more quickly, thereby improving the heat dissipation efficiency of the heat-spreading structure 200.

[0045] Optionally, a portion of the heat-conducting plate 220 is designated as a first region 222.

[0046] According to some embodiments of this application, such as Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, the heat-conducting plate 220 also has a second region 224, which is arranged side by side with the first region 222. A channel 216 is provided between the second region 224 of the heat-conducting plate 220 and the main body 212, and the channel 216 is connected to the protrusion 214.

[0047] In this embodiment, the heat-conducting plate 220 also has a second region 224, which is arranged side by side with the first region 222. That is, a portion of the heat-conducting plate 220 is the first region 222, and at least a portion of the heat-conducting plate 220 other than the first region 222 is the second region 224. A channel 216 is provided between the second region 224 of the heat-conducting plate 220 and the main body 212. The channel 216 communicates with the protrusion 214. After the liquid in the protrusion 214 is heated and vaporized, the steam will enter the channel 216 and diffuse to the periphery of the heat-spreading structure 200, thereby allowing heat to diffuse to the periphery of the heat-spreading structure 200 with the steam, improving the heat dissipation effect of the heat-spreading structure 200.

[0048] Optionally, the channel 216 is arranged around the protrusion 214 and extends from the protrusion 214 to the periphery of the heat dissipation structure 200.

[0049] Specifically, such as Figure 1 As shown, the heat generated by the heating element 20 is transferred to the heat-conducting plate 220, and then the heat-conducting plate 220 transfers the heat to the protrusion 214. The liquid in the protrusion 214 is vaporized by the heat transferred to the protrusion 214, forming steam, which then flows along... Figure 1 In the direction indicated by the hollow arrow, steam is transferred from the channel 216 to the periphery of the heat spreader 200. During the transfer process, the steam gradually enters the main body 212, where it comes into contact with the screen support 120. Since the screen support 120 has a lower temperature, the steam liquefies, and the liquefied steam then transforms back into a liquid, flowing along... Figure 1 In the direction indicated by the solid arrow, the liquid flows from the main body 212 to the protrusion 214, thereby forming a circulation.

[0050] Specifically, such as Figure 1 As shown, from the first region 222 to the second region 224, the temperature of the heat spreader 200 gradually decreases in the directions indicated by arrows A and B.

[0051] like Figure 6 As shown, from the first region 222 to the second region 224, the temperature of the heat spreader 200 gradually decreases in the directions indicated by arrows C and D.

[0052] According to some embodiments of this application, such as Figure 1 and Figure 2 As shown, the support column 300 is disposed in the channel 216. One end of the support column 300 is connected to the heat conduction plate 220, and the other end of the support column 300 abuts against the side of the main body 212 away from the display screen 100.

[0053] In this embodiment, the heat dissipation structure 200 also includes a support column 300, which is disposed in the channel 216. One end of the support column 300 is connected to the heat conduction plate 220, and the other end of the support column 300 abuts against the side of the main body 212 away from the display screen 100. Thus, the support column 300 supports the heat conduction plate 220 and the main body 212, so that the channel 216 between the heat conduction plate 220 and the main body 212 can maintain a certain height, thereby increasing the speed of vapor diffusion in the heat dissipation structure 200 and improving the heat dissipation efficiency and stability of the heat dissipation process. The other end of the support column 300 abuts against the side of the main body 212 away from the display screen 100. That is, there is a main body 212 between the support column 300 and the display screen 100. The main body 212 can prevent the support column 300 from directly contacting the display screen 100, reducing the probability of the support column 300 showing a localized image on the screen 110, thereby reducing the impact of the heat dissipation structure 200 on the display screen 100 and improving the display effect of the display screen 100. Even if the display screen 100 is subjected to external pressure, due to the presence of the main body 212 between the support column 300 and the display screen 100, the pressure distribution between the main body 212 and the display screen 100 is more uniform. At the same time, the main body 212 can act as a buffer pad, thereby reducing the probability of the display screen 100 showing an overprint phenomenon and further improving the display effect of the display screen 100.

[0054] Optionally, the support column 300 is columnar and is disposed on the heat-conducting plate 220.

[0055] The support column 300 and the heat-conducting plate 220 are an integral structure, or the support column 300 is installed on the heat-conducting plate 220.

[0056] Optionally, such as Figure 7 As shown, the support column 300 can also be disposed between the capillary layer 210 and the screen support member 120.

[0057] According to some embodiments of this application, such as Figure 1 and Figure 6 As shown, there are multiple support columns 300; along the length of the display screen 100 ( Figure 6 In the direction indicated by the middle arrow D, multiple support columns 300 are arranged in at least one row; and / or in the width direction of the display screen 100 (… Figure 6 In the direction indicated by the middle arrow C, multiple support columns 300 are arranged in at least one column.

[0058] In this embodiment, multiple support columns 300 are arranged in at least one row along the length of the display screen 100, and / or in at least one column along the width of the display screen 100. This makes the supporting force of the multiple support columns 300 on the heat-conducting plate 220 more evenly distributed on the heat-conducting plate 220, and the supporting force of the multiple support columns 300 on the main body 212 more evenly distributed on the main body 212. This makes the height of the channel 216 between the main body 212 and the heat-conducting plate 220 more evenly distributed at various locations, further improving the stability of the heat dissipation structure 200 during the heat dissipation process.

[0059] According to some embodiments of this application, such as Figure 1 and Figure 2 As shown, the channel 216 is configured to extend from one end away from the first region 222 to the end closer to the first region 222.

[0060] In this embodiment, the channel 216 is configured to extend from one end away from the first region 222 to the other end close to the first region 222, which makes the steam diffuse more smoothly in the channel 216 and allows the steam to diffuse to various regions of the heat distribution structure 200, thereby improving the uniformity of heat distribution on the heat distribution structure 200 and further improving the heat dissipation speed of the heat distribution structure 200.

[0061] According to some embodiments of this application, such as Figure 1 and Figure 2 As shown, the main body 212 and the protrusion 214 are an integral structure.

[0062] In this embodiment, the main body 212 and the protrusion 214 are an integral structure. The integral structure is more conducive to the transfer of liquid in the main body 212 and the protrusion 214, thereby accelerating the circulation speed of liquid and steam in the heat exchanger structure 200.

[0063] According to some embodiments of this application, the display screen 100 further includes a screen 110 and a cover plate, wherein the screen 110 is disposed on the side of the screen support 120 away from the heat dissipation structure 200; and the cover plate is disposed on the side of the screen 110 away from the screen support 120.

[0064] In this embodiment, the display screen 100 further includes a screen 110, which is disposed on the side of the screen support 120 away from the heat dissipation structure 200, thereby enabling the operator of the electronic device to interact with the electronic device through the screen 110. The display screen 100 also includes a cover plate, which is disposed on the side of the screen 110 away from the screen support 120, thereby protecting the screen 110, reducing the probability of damage to the screen 110, and improving the stability of the display screen 100 during the use of the electronic device.

[0065] An electronic device according to some embodiments of this application includes a screen assembly 10 as described in any of the above embodiments.

[0066] The electronic device includes a screen assembly 10 as described in any of the above embodiments, and therefore the electronic device has all the beneficial effects of the screen assembly 10 as described in any of the above embodiments.

[0067] Alternatively, the electronic device includes a mobile phone, tablet, smart wearable device, e-reader, or laptop.

[0068] According to some embodiments of this application, such as Figure 8 As shown, the electronic device also includes a housing 30 and a circuit board 40. The circuit board 40 is disposed inside the housing 30, and the heating element 20 is disposed on the circuit board 40 and is in contact with the heat-conducting plate 220.

[0069] In this embodiment, the electronic device also includes a housing 30 and a circuit board 40. The circuit board 40 is disposed inside the housing 30, and the heating component 20 is disposed on the circuit board 40. The heating component 20 on the circuit board 40 generates heat when the electronic device is working. Since the heating component 20 is in contact with the heat-conducting plate 220, the heat generated by the heating component 20 will be transferred to the heat-conducting plate 220 more quickly. In turn, the heat dissipation of the heating component 20 is achieved through the heat dissipation structure 200, thereby improving the stability of the electronic device during operation.

[0070] Optionally, the heating element 20 is opposite to the first region 222 of the heat-conducting plate 220.

[0071] Since the heat-generating component 20 is opposite to the first region 222 of the heat-conducting plate 220, the heat generated by the heat-generating component 20 will be transferred to the first region 222, and then the heat dissipation of the heat-generating component 20 will be achieved through the heat dissipation structure 200, thereby improving the stability of the electronic device during operation.

[0072] According to some embodiments of this application, the housing 30 includes a frame 32 and a cover 34; the frame 32 is arranged around the screen assembly 10; the cover 34 is disposed on the side of the frame 32 away from the screen assembly 10, and the circuit board 40 is fixed to the cover 34.

[0073] In this embodiment, the housing 30 includes a frame 32 and a cover 34. The frame 32 is arranged around the screen assembly 10, and the cover 34 is disposed on the side of the frame 32 away from the screen assembly 10. The cooperation between the frame 32 and the cover 34 protects the internal components of the electronic device and further improves the stability of the electronic device during operation. The circuit board 40 is fixed to the cover 34, thereby enabling the installation and fixation of the circuit board 40.

[0074] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0075] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A screen assembly, characterized in that, Includes a display screen, and a screen support is provided on one side of the display screen. The screen support is a metal structure used to support the display screen. The screen assembly further includes a heat-conducting plate, which, together with the screen support, forms a sealed cavity. A support column and a capillary layer are disposed within the sealed cavity. One of the support column and the capillary layer is disposed on the inner wall of the screen support, and the other is attached to the inner wall of the heat-conducting plate.

2. The screen assembly according to claim 1, characterized in that, The capillary layer is attached to the inner wall of the screen support, and the support column is disposed on the heat-conducting plate.

3. The screen assembly according to claim 2, characterized in that, The capillary layer includes a main body and a protrusion, the protrusion protruding from the main body and contacting the inner wall of the heat-conducting plate.

4. The screen assembly according to claim 3, characterized in that, The heat-conducting plate has a first region for absorbing heat, and the protrusion is disposed in the first region.

5. The screen assembly according to claim 4, characterized in that, The heat-conducting plate also has a second region, which is arranged side by side with the first region. A channel is provided between the second region of the heat-conducting plate and the main body, and the channel communicates with the protrusion.

6. The screen assembly according to claim 1, characterized in that, There are multiple support columns; Along the length of the display screen, a plurality of the support columns are arranged in at least one row; and / or In the width direction of the display screen, the plurality of support columns are arranged in at least one column.

7. The screen assembly according to claim 5, characterized in that, The channel is configured to extend from one end away from the first region to the end closer to the first region.

8. The screen assembly according to claim 3, characterized in that, The main body and the protrusion are an integral structure.

9. An electronic device, characterized in that, Includes the screen component as described in any one of claims 1 to 8.

10. The electronic device according to claim 9, characterized in that, Also includes: case; A circuit board, wherein the circuit board is disposed within the housing; A heating element is disposed on the circuit board and is in contact with the heat-conducting plate.

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