Flow channel structure and liquid-cooling cold plate

Abstract

The invention provides a flow channel structure and a liquid-cooling cold plate, the flow channel structure comprises a fractal curve flow channel, the fractal curve flow channel is a Hilbert curve flow channel or a Petronol curve flow channel, and the fractal curve flow channel is used for increasing the heat dissipation area and strengthening the convection heat exchange efficiency in a limited plane space; wherein the Hilbert curve flow channel is constructed on the basis of a Hilbert curve, and the Peano curve flow channel is constructed on the basis of a Peano curve. According to the flow channel structure and the liquid-cooling cold plate provided by the embodiment of the invention, the heat dissipation performance is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to a flow channel structure and a liquid cooling plate. Background Technology

[0002] Liquid cooling plates are core heat dissipation components in electronic devices. They utilize coolant to absorb, conduct, and transfer heat from the parts through which it flows, thereby achieving heat dissipation and contributing to the stable operation of electronic devices.

[0003] Currently, liquid cooling plates are increasingly being used for chip heat dissipation. However, the relatively simple flow channel structure of liquid cooling plates limits their heat dissipation performance, making it difficult to meet the exponential growth in chip heat dissipation demands. The performance degradation of long, straight flow channels in liquid cooling plates is due to several factors: increased flow channel length leads to decreased heat dissipation efficiency, a significant increase in fluid pressure drop, and poor heat flow uniformity. Uneven distribution of parallel flow channels in liquid cooling plates results in uneven coolant distribution, easily creating heat dissipation hotspots on the chip. The temperature rise effect of series flow channels in liquid cooling plates is also a concern: when a single long flow channel covers the entire cooling plate in series, the coolant temperature rise and flow rate changes at the outlet cause the corresponding chip junction temperature to rise, reducing heat dissipation efficiency. Therefore, optimizing the flow channel structure of liquid cooling plates to improve their heat dissipation performance is a crucial issue that urgently needs to be addressed in this field. Summary of the Invention

[0004] To address the problems in the prior art, embodiments of the present invention provide a flow channel structure and a liquid-cooled cold plate, which can at least partially solve the problems existing in the prior art.

[0005] In a first aspect, the present invention proposes a flow channel structure, including a fractal curve flow channel, wherein the fractal curve flow channel is a Hilbert curve flow channel or a Peano curve flow channel, so as to increase the heat dissipation area and enhance the convective heat transfer efficiency within a limited planar space; wherein the Hilbert curve flow channel is constructed based on the Hilbert curve, and the Peano curve flow channel is constructed based on the Peano curve.

[0006] Furthermore, the Hilbert curve flow channel is a multi-order Hilbert curve flow channel.

[0007] Furthermore, the Peano curve channel is a multi-order Peano curve channel.

[0008] Furthermore, the corners of the fractal curve flow channel adopt an arc transition.

[0009] Furthermore, the fractal curve flow channel is an optimized Hilbert curve flow channel or a Peano curve flow channel. The optimized Hilbert curve flow channel is obtained by optimizing the thermal resistance and heat dissipation of the Hilbert curve flow channel based on the flow channel parameters, and the optimized Peano curve flow channel is obtained by optimizing the thermal resistance and heat dissipation of the Peano curve flow channel based on the flow channel parameters.

[0010] Secondly, the present invention proposes a liquid-cooled cold plate, including the fractal curve flow channel described in any of the above embodiments.

[0011] Furthermore, the liquid-cooled cold plate provided in the embodiments of the present invention includes multiple layers of flow channels, each layer of flow channels adopting the fractal curve flow channel described in any of the above embodiments.

[0012] Based on the above embodiments, further, at least two of the multi-layer flow channels have different flow channel structures.

[0013] Furthermore, the liquid-cooled cold plate provided in the embodiments of the present invention includes an array of flow channel units, each flow channel unit having a flow channel inlet and a flow channel outlet, and each flow channel unit adopts the fractal curve flow channel described in any of the above embodiments.

[0014] Furthermore, the liquid-cooled cold plate provided in the embodiments of the present invention includes multiple flow channel regions, each flow channel region adopts the fractal curve flow channel described in any of the above embodiments, and at least two flow channel regions adopt different flow channel structures.

[0015] The flow channel structure and liquid cooling plate provided in this embodiment of the invention include a fractal curve flow channel, which is a Hilbert curve flow channel or a Peano curve flow channel, in order to increase the heat dissipation area and enhance the convective heat transfer efficiency within a limited planar space, thereby improving the heat dissipation performance. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0017] Figure 1 This is a schematic diagram of the structure of a Hilbert curve flow channel provided in an embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of the structure of a Peano curve flow channel provided in an embodiment of the present invention.

[0019] Figure 3 This is a schematic diagram of the structure of a fractal curve flow channel provided in an embodiment of the present invention.

[0020] Figure 4 This is a schematic diagram of the optimized Hilbert curve flow channel provided in an embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram of the structure of a liquid-cooled cold plate provided in an embodiment of the present invention.

[0022] Figure 6 This is a schematic diagram of the structure of a liquid-cooled cold plate provided in another embodiment of the present invention.

[0023] Figure 7 This is a schematic diagram of the structure of a liquid-cooled cold plate provided in another embodiment of the present invention. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Here, the illustrative embodiments and their descriptions are used to explain the present invention, but are not intended to limit the present invention. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. The acquisition, storage, use, and processing of data in the technical solutions of this application all comply with relevant laws and regulations. The user information in the embodiments of this application is obtained through legal and compliant means, and the acquisition, storage, use, and processing of user information have been authorized and agreed upon by the customer.

[0025] To facilitate understanding of the technical solution provided in this application, the relevant content of the technical solution in this application will be explained below.

[0026] With the continuous increase in the integration and power density of high-performance computing chips, their heat flux density is growing exponentially, exceeding several hundred watts per square centimeter, and the heat distribution on the chip and system is uneven. If heat dissipation is not timely, the chip junction temperature will rise significantly, seriously affecting the reliability and performance of the chip and system. At the same time, the failure rate rises sharply with temperature, easily leading to chip failure. High temperatures exacerbate the threshold voltage drift and interconnect electromigration effects of field-effect transistors, leading to faults such as open circuits, short circuits, and signal errors, causing a decrease in operating speed or even complete chip failure. In high-density chip application scenarios such as data centers, heat dissipation problems may lead to server failures or even the paralysis of the entire data center, resulting in significant economic losses. Faced with the increasingly severe challenges of chip heat dissipation, the development of efficient integrated heat dissipation technologies for high-performance computing chips is imperative. Currently, there are few two-dimensional planar layout and optimization methods for the flow channel design in liquid cooling plates, which are insufficient to cope with the continuously increasing power density and increasingly severe challenges of uneven heat flux distribution in high-performance computing chips.

[0027] In summary, to address the severe challenges of heat dissipation in high-performance computing chips, it is urgent to develop liquid cooling plates with groundbreaking flow channel designs to significantly improve heat dissipation performance, optimize coolant distribution, increase heat dissipation area, enhance convective heat transfer efficiency, and ultimately achieve compactness and lightweighting of the liquid cooling plate and equipment structure.

[0028] This patent proposes a novel flow channel structure. This flow channel structure is constructed using a continuous fractal space-filling curve. The flow channel order and topology can be selected based on chip size, heat flux density, and system cooling requirements. This fractal curve flow channel facilitates fine and complex fabrication. These characteristics make it highly promising for scenarios requiring extreme heat dissipation performance, extremely limited space, and high thermal uniformity (such as direct cooling of high-performance chips).

[0029] The flow channel structure provided in this embodiment of the invention includes a fractal curve flow channel, which is a Hilbert curve flow channel or a Peano curve flow channel, in order to increase the heat dissipation area and enhance the convective heat transfer efficiency within a limited planar space; wherein, the Hilbert curve flow channel is constructed based on the Hilbert curve, and the Peano curve flow channel is constructed based on the Peano curve.

[0030] Specifically, such as Figure 1 As shown, the Hilbert curve flow channel 101 is constructed based on a continuous fractal space-filling curve—the Hilbert curve. It can be constructed using first-order, second-order, or third-order Hilbert curves. The Hilbert curve is generated through fractal iteration: a square is divided into four equal parts, the center points of the smaller squares are connected in a specific order, and this process is repeated for each smaller square. The Hilbert curve flow channel fully utilizes fractal geometry to construct an ultra-long heat transfer path within a limited space, increasing the heat dissipation area. Furthermore, the continuous bending significantly enhances the convective heat transfer process, thereby optimizing the coolant distribution and significantly improving heat dissipation performance.

[0031] like Figure 2 As shown, the Peano curve flow channel 201 can be constructed based on a continuous fractal space-filling Peano curve, which can be constructed using first-order, second-order, or third-order Peano curves. A Peano curve is a space-filling curve that fills an entire two-dimensional planar region with a one-dimensional curve through infinite recursion. The drawing of a Peano curve starts with a basic shape, such as a "U" shape or a similar shape. The basic pattern is continuously replaced and refined in subsequent steps. In each recursive step, each line segment of the previous step needs to be replaced with a reduced version of the basic pattern, which has been rotated or flipped. According to the specific rules of the Peano curve, the orientation of the reduced pattern is adjusted as needed to ensure that they can be correctly connected. Theoretically, the recursive process of the Peano curve is infinite. However, in practical applications, it will stop after reaching a certain recursion depth as needed; as the recursion depth increases, the Peano curve gradually fills the entire two-dimensional planar region. With a fixed liquid cooling plate area, the Piano curve flow channel 201 can increase the heat dissipation area and enhance the convective heat transfer efficiency, thereby improving heat dissipation performance.

[0032] The flow channel structure provided in this embodiment of the invention includes a fractal curve flow channel, which is a Hilbert curve flow channel or a Peano curve flow channel, in order to increase the heat dissipation area and enhance the convective heat transfer efficiency within a limited planar space, thereby improving the heat dissipation performance.

[0033] Based on the above embodiments, the Hilbert curve flow channel 101 is further configured as a multi-order Hilbert curve flow channel.

[0034] Specifically, multi-order Hilbert curve flow channels can be recursively generated from first-order Hilbert curve flow channels. For example, a second-order Hilbert curve flow channel is formed by rotating / flipping four first-order Hilbert curve flow channels and then splicing them together. An n-order Hilbert curve flow channel is formed by rotating / flipping four (n-1)-order Hilbert curve flow channels and then splicing them together, where n is a positive integer greater than or equal to 2.

[0035] Multi-stage Hilbert curve flow channels can densely cover the entire plane, with more complex flow paths that maintain continuity, which is more conducive to improving heat dissipation.

[0036] Based on the above embodiments, the Peano curve channel 201 is further configured as a multi-order Peano curve channel.

[0037] Specifically, multi-order Peano curve channels can be recursively generated from first-order Peano curve channels. For example, a second-order Peano curve channel is formed by rotating / flipping four first-order Peano curve channels and then splicing them together, and an n-order Peano curve channel is formed by rotating / flipping four (n-1)-order Peano curve channels and then splicing them together.

[0038] Multi-stage Peano curve flow channels can densely cover the entire plane, with more complex flow paths that maintain continuity, which is more conducive to improving heat dissipation.

[0039] Based on the above embodiments, the corners of the fractal curve flow channel are further provided with an arc transition.

[0040] Specifically, the fractal curve flow channel includes multiple right-angle bends, which can cause a large pressure drop and flow resistance. The flow channel structure at the right-angle bend transition can be further optimized by using an arc shape at the right-angle bend transition, so that the fluid in the flow channel is continuous and the fluid velocity does not change abruptly, thereby achieving better flow performance and heat dissipation performance.

[0041] For example, Hilbert curve flow channels typically include multiple closely connected right-angle bends, which can cause significant pressure drops and flow resistance. At the right-angle bend transitions in Hilbert curve flow channels, rounded arcs are used to optimize the flow channel structure. The optimized Hilbert curve flow channel at the right-angle bend transition is as follows: Figure 3 As shown.

[0042] Based on the above embodiments, the fractal curve flow channel is further described as an optimized Hilbert curve flow channel or a Peano curve flow channel. The optimized Hilbert curve flow channel or Peano curve flow channel is obtained by optimizing the thermal resistance and heat dissipation of the Hilbert curve flow channel or Peano curve flow channel based on the flow channel parameters.

[0043] Specifically, by controlling flow channel parameters such as minimum channel width and channel spacing, the flow resistance and heat dissipation capacity are optimized, and the analytical expression of the curve is iteratively derived to obtain the basic unit of the fractal curve flow channel. Then, based on the hotspot distribution, the fractal order and topology scheme are determined. Optimizing the thermal resistance and heat dissipation of the Hilbert curve flow channel based on the flow channel parameters yields the optimized Hilbert curve flow channel. Similarly, optimizing the thermal resistance and heat dissipation of the Peano curve flow channel based on the flow channel parameters yields the optimized Peano curve flow channel.

[0044] Taking fractal flow channel optimization in the form of Hilbert curves as an example, one possible approach is to optimize the flow resistance using the idea of ​​second-order curvature continuity, so that the main flow channel curve conforms to a cosine function curve:

[0045]

[0046] Assuming the minimum flow channel width and spacing that the processing capacity can satisfy are: and The side length of the smallest repeatable unit that allows the entire parting flow channel to satisfy the above physical constraints is You can get The constraint equations (inequality boundary conditions for linear optimization) are shown in the following example:

[0047]

[0048] Further enable The length of the flow channel within the area should be as long as possible to achieve higher heat dissipation efficiency under low flow resistance optimization (this can be obtained through simulation or flow path integration), thus targeting a given area. and Obtain a set of valid Value. The optimized Hilbert curve flow channel 401, as shown... Figure 4 As shown.

[0049] Fractal curve flow channels can be fabricated using micro-nano processing techniques such as photolithography and etching to create channels with fine linewidths and narrow pitches, enabling fabrication on semiconductor materials such as silicon wafers, as well as other non-metallic and metallic materials. Fractal curve flow channels are also suitable for additive manufacturing; additive manufacturing technologies such as 3D printing are ideally suited for manufacturing such complex internal structures.

[0050] Fractal curve flow channel structures have a high surface area-to-volume ratio and a long effective flow channel length. Within a given bottom area of ​​the liquid cooling plate, the effective heat transfer length through which the coolant flows can far exceed that of traditional straight or regularly curved channel designs. The longer flow channel length directly increases the contact time and contact area between the coolant and the heat source, thereby significantly improving the heat transfer per flow.

[0051] Fractal curve flow channels exhibit high spatial ergonomics, allowing the coolant to densely and repeatedly cover the heat dissipation area, resulting in excellent heat distribution uniformity. Simultaneously, it promotes secondary flow and enhanced mixing (microscale turbulence), improving convective heat transfer capabilities. It efficiently fills planar space, achieving a high degree of compactness and integration of the liquid-cooled plate.

[0052] Figure 5 This is a schematic diagram of the structure of a liquid-cooled cold plate provided in an embodiment of the present invention, as shown below. Figure 5 As shown, an embodiment of the present invention provides a liquid-cooled cold plate 500, which includes the fractal curve flow channel 501 described in any of the above embodiments.

[0053] Based on the above embodiments, the liquid-cooled cold plate provided in the embodiments of the present invention further includes multiple layers of flow channels, each layer of flow channel adopting the fractal curve flow channel described in any of the above embodiments.

[0054] Based on the above embodiments, at least two flow channels have different flow channel structures.

[0055] For example, in the multi-layer flow channel, one layer includes a Hilbert curve flow channel and another layer includes a Peano curve flow channel.

[0056] For example, in the multi-layer flow channel, one layer includes a second-order Hilbert curve flow channel, and another layer includes a third-order Hilbert curve flow channel.

[0057] For example, in the multi-layer flow channel, one layer includes a second-order Peano curve flow channel, and another layer includes a third-order Peano curve flow channel.

[0058] Figure 6 This is a schematic diagram of the structure of a liquid-cooled cold plate provided in another embodiment of the present invention, as shown below. Figure 6 As shown, based on the above embodiments, the liquid-cooled cold plate 600 provided in the embodiments of the present invention further includes an array of flow channel units 601, each flow channel unit 601 having a flow channel inlet 601-1 and a flow channel outlet 601-2, and each flow channel unit 601 adopts the fractal curve flow channel described in any of the above embodiments.

[0059] The order of high-order fractal curve flow channels can be reduced, and the reduced-order flow channels can be arranged in a plane to construct multiple fractal curve flow channels, thereby reducing the flow channel pressure drop and achieving better uniform distribution of coolant on the liquid cooling plate.

[0060] Figure 7 This is a schematic diagram of the structure of a liquid-cooled cold plate provided in another embodiment of the present invention, as shown below. Figure 7 As shown, based on the above embodiments, the liquid-cooled cold plate 700 provided in this embodiment of the invention further includes multiple flow channel regions 701, each flow channel region adopts the fractal curve flow channel described in any of the above embodiments, and at least two flow channel regions adopt different flow channel structures.

[0061] For example, such as Figure 7 As shown, among the multiple flow channel regions, one flow channel region includes Hilbert curve flow channel 701-1, and another flow channel region includes Peano curve flow channel 701-2.

[0062] For example, among the plurality of flow channel regions, one flow channel region includes a first-order Hilbert curve flow channel, and another flow channel region includes a second-order Hilbert curve flow channel.

[0063] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A flow channel structure, characterized in that, It includes fractal curve flow channels, which are Hilbert curve flow channels or Peano curve flow channels, to increase the heat dissipation area and enhance the convective heat transfer efficiency within a limited planar space; wherein, the Hilbert curve flow channel is constructed based on the Hilbert curve, and the Peano curve flow channel is constructed based on the Peano curve.

2. The flow channel structure according to claim 1, characterized in that, The Hilbert curve flow channel is a multi-order Hilbert curve flow channel.

3. The flow channel structure according to claim 1, characterized in that, The Peano curve flow channel is a multi-order Peano curve flow channel.

4. The flow channel structure according to claim 1, characterized in that, The corners of the fractal curve flow channel adopt an arc transition.

5. The flow channel structure according to any one of claims 1 to 3, characterized in that, The fractal curve flow channel is an optimized Hilbert curve flow channel or a Peano curve flow channel. The optimized Hilbert curve flow channel is obtained by optimizing the thermal resistance and heat dissipation of the Hilbert curve flow channel based on the flow channel parameters. The optimized Peano curve flow channel is obtained by optimizing the thermal resistance and heat dissipation of the Peano curve flow channel based on the flow channel parameters.

6. A liquid-cooled cold plate, characterized in that, Includes the fractal curve flow channel as described in any one of claims 1 to 5.

7. The liquid-cooled cold plate according to claim 6, characterized in that, It includes multiple flow channels, each of which employs the fractal curve flow channel as described in any one of claims 1 to 5.

8. The liquid-cooled cold plate according to claim 7, characterized in that, At least two of the multi-layered flow channels have different flow channel structures.

9. The liquid-cooled cold plate according to claim 6, characterized in that, It includes an array of flow channel units, each flow channel unit having a flow channel inlet and a flow channel outlet, and each flow channel unit employing a fractal curve flow channel as described in any one of claims 1 to 5.

10. The liquid-cooled cold plate according to claim 6, characterized in that, It includes multiple flow channel regions, each flow channel region adopts the fractal curve flow channel as described in any one of claims 1 to 5, and at least two flow channel regions adopt different flow channel structures.

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