Coil electronic component

Abstract

The present disclosure provides a coil electronic component including: a support member made of a glass material and including a first surface and a second surface; a coil pattern disposed on the support member; and a body including a magnetic material and surrounding the support member and the coil pattern, in which the coil pattern may include: a first coil pattern disposed on the first surface of the support member; and a second coil pattern disposed on the second surface of the support member and connected to the first coil pattern.

Description

Technical Field

[0001] This disclosure relates to a coil electronic assembly. Background Technology

[0002] In recent years, as power consumption has increased with the diversification of mobile device functions, coil electronics with low loss and high efficiency have been used around power management integrated circuits (PMICs) to extend battery life in mobile devices.

[0003] The demand for thinner power inductors is growing to enable product reduction and increased flexibility in component placement. Thin-film inductors are manufactured by forming coils on a support member using sputtering or plating processes. During the manufacturing process of thin-film inductors, the support member may deform due to heat or stress. When the support member deforms, the coil arrangement may become disordered, leading to exposed coils or short circuits, which can reduce the reliability of the thin-film inductor. Summary of the Invention

[0004] One aspect of this disclosure seeks to provide a coil electronics assembly with enhanced reliability.

[0005] However, the problems to be solved by this disclosure are not limited to those described above, but can be extended in various ways within the scope of the technical spirit included in this disclosure.

[0006] Embodiments of this disclosure provide a coil electronic assembly, the coil electronic assembly comprising: a support member made of glass material and including a first surface and a second surface; a coil pattern disposed on the support member; and a body comprising a magnetic material and surrounding the support member and the coil pattern, wherein the coil pattern may include: a first coil pattern disposed on the first surface of the support member; and a second coil pattern disposed on the second surface of the support member and connected to the first coil pattern.

[0007] The coil electronics also include a partition wall, which may be disposed between adjacent turns in the coil pattern.

[0008] The partition wall can be made of glass.

[0009] The supporting member and the partition wall may include the same glass material.

[0010] The supporting member and the partition wall may include photosensitive glass.

[0011] The coil electronics may also include an insulating film disposed between the coil pattern and the body.

[0012] The support member may include through holes, and the through holes may be filled with the magnetic material.

[0013] The coil electronics assembly also includes a through-hole passing through the support member, and the first coil pattern and the second coil pattern can be connected to each other through the through-hole.

[0014] The first coil pattern may include a first lead-out that is exposed from one surface of the body, and the second coil pattern may include a second lead-out that is exposed from another surface of the body opposite to the one surface.

[0015] The coil electronic assembly may further include: a first external electrode disposed on one surface of the body and connected to the first lead-out portion; and a second external electrode disposed on the other surface of the body and connected to the second lead-out portion.

[0016] The coil electronics may also include a surface insulating layer disposed on the outer surface of the body.

[0017] Another embodiment of this disclosure provides a coil electronic assembly, the coil electronic assembly comprising: a support member having a through hole and comprising a glass material; a core filling the through hole and comprising a magnetic material; a coil pattern disposed on the surface of the support member and comprising a plurality of turns surrounding the core; and a body comprising the magnetic material and surrounding the support member and the coil pattern.

[0018] According to an embodiment, a coil electronics assembly with enhanced reliability can be provided. Attached Figure Description

[0019] Figure 1 This is a schematic perspective view of a coil electronics assembly according to an embodiment.

[0020] Figure 2 It is along Figure 1 A schematic cross-sectional view taken from line I-I'.

[0021] Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line II-II'.

[0022] Figures 4 to 11 The diagram sequentially illustrates a method for manufacturing a coil electronic component according to an embodiment.

[0023] <Explanation of reference numerals in the attached figures> 1000: Coil Electronic Components 100: Main Body 200: Coil 210: First coil pattern 220: Second coil pattern 230: Via 213: First Introduction 223: Second Introduction 300: Supporting component 700: First external electrode 800: Second external electrode 900: Surface insulation layer. Detailed Implementation

[0024] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings to enable those skilled in the art to readily implement them. The drawings and description are intended to be illustrative rather than restrictive in nature. Throughout the specification, the same reference numerals denote the same elements. Furthermore, some components in the drawings may be exaggerated, omitted, or shown schematically, and the dimensions of each component do not perfectly reflect the actual dimensions.

[0025] It should be understood that the accompanying drawings are only for easy understanding of the embodiments disclosed in this specification, and the technical spirit disclosed in this specification is not limited by the drawings. This disclosure includes all variations, equivalents or alternatives within the scope of the technical spirit of this disclosure.

[0026] Terms including ordinal numbers (such as "first" and "second") are used to describe various components, but the components are not limited by the term. These terms are only used to distinguish one component from another.

[0027] Furthermore, it should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it may be directly on the other element, or there may be intermediate elements present. In contrast, when an element is referred to as being "directly on" another element, there are no intermediate elements present. Additionally, when an element is referred to as being "on" or "above" a reference portion, the element is located above or below the reference portion, and it does not specifically indicate that the element is located "above" or "on" the reference portion in a direction opposite to the direction of gravity.

[0028] Throughout this specification, it should be understood that the terms "comprising," "including," or "having" indicate the presence of the features, quantities, steps, operations, components, parts, or combinations thereof described in the specification, and do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, components, parts, or combinations thereof. Therefore, unless expressly stated to the contrary, the word "comprising" and variations such as "including" or "having" will be understood to imply the inclusion of the stated elements but not the exclusion of any other elements.

[0029] Furthermore, throughout the instruction manual, "plan view" refers to a diagram obtained by observing the target portion from the top, and "section view" refers to a diagram obtained by observing the cross-section obtained by vertically cutting the target portion from the side.

[0030] Furthermore, throughout the specification, the term "connection" can refer not only to a situation where two or more components are directly connected, but also to a situation where two or more components are indirectly connected through another component, and also to a situation where two or more components are electrically connected, or to a situation where two or more components are called by different names according to their location or function but are integrated with each other.

[0031] Figure 1 This is a schematic perspective view of a coil electronics assembly according to an embodiment. Figure 2 It is along Figure 1 A schematic cross-sectional view taken from line I-I', and Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line II-II'.

[0032] Reference Figure 1 , Figure 2 and Figure 3 The coil electronic assembly 1000 includes a main body 100, a coil 200, a support member 300, a first external electrode 700, a second external electrode 800, and a surface insulating layer 900.

[0033] The main body 100 may generally have a cuboid shape, but the embodiments are not limited to this. Due to the shrinkage of magnetic powder and the like during sintering, the main body 100 may not have a perfect cuboid shape, but may have a generally cuboid shape. For example, the main body 100 may generally have a cuboid shape, but the portions corresponding to the corners or vertices may have a rounded shape.

[0034] In this embodiment, for ease of description, the two surfaces of the body 100 that are opposite each other in the length direction (L-axis direction) will be defined as the first surface S1 and the second surface S2, the two surfaces of the body 100 that are opposite each other in the width direction (W-axis direction) will be defined as the third surface S3 and the fourth surface S4, and the two surfaces of the body 100 that are opposite each other in the thickness direction (T-axis direction) will be defined as the fifth surface S5 and the sixth surface S6.

[0035] Based on an optical microscope or scanning electron microscope (SEM) photograph of a cross-section taken at the center of the coil electronic component 1000 in the width direction (W-axis direction) along the length direction (L-axis direction) and thickness direction (T-axis direction), the length of the coil electronic component 1000 can be represented as the maximum value among the lengths of multiple line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the cross-sectional photograph, which are opposite each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction). Alternatively, the length of the coil electronic component 1000 can be represented as the minimum value among the lengths of multiple line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the cross-sectional photograph, which are opposite each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction). Optionally, the length of the coil electronic component 1000 may represent the arithmetic mean of the lengths of at least two line segments among the two outermost boundary lines that are opposite each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction) of the coil electronic component 1000 shown in the cross-sectional photograph above.

[0036] Based on an optical microscope or scanning electron microscope (SEM) photograph of a cross-section taken at the center of the coil electronic component 1000 in the width direction (W-axis direction) along the length direction (L-axis direction) and thickness direction (T-axis direction), the thickness of the coil electronic component 1000 can be represented as the maximum value among the lengths of multiple line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the cross-sectional photograph, which are opposite each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction). Alternatively, the thickness of the coil electronic component 1000 can be represented as the minimum value among the lengths of multiple line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the cross-sectional photograph, which are opposite each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction). Optionally, the thickness of the coil electronic component 1000 may represent the arithmetic mean of the lengths of at least two line segments among the two outermost boundary lines of the coil electronic component 1000 that are opposite each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction) in the above cross-sectional photograph.

[0037] Based on an optical microscope or scanning electron microscope (SEM) photograph of a cross-section taken at the center of the coil electronics component 1000 in the thickness direction (T-axis direction) along the length direction (L-axis direction) and width direction (W-axis direction), the width of the coil electronics component 1000 can represent the maximum value among the lengths of multiple line segments connecting the two outermost boundary lines of the coil electronics component 1000 shown in the cross-sectional photograph, which are opposite each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction). Alternatively, the width of the coil electronics component 1000 can represent the minimum value among the lengths of multiple line segments connecting the two outermost boundary lines of the coil electronics component 1000 shown in the cross-sectional photograph, which are opposite each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction). Optionally, the width of the coil electronic component 1000 may represent the arithmetic mean of the lengths of at least two line segments among the two outermost boundary lines that are opposite each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction) of the coil electronic component 1000 shown in the cross-sectional photograph above.

[0038] The length, width, and thickness of the coil electronics assembly 1000 can be measured using a micrometer measurement method. In this method, the zero point of the micrometer, which provides metrological repeatability and reproducibility (R&R), is set. The coil electronics assembly 1000, according to this embodiment, is inserted between the tips of the micrometer, and the measuring rod of the micrometer is rotated for measurement. When measuring the length of the coil electronics assembly 1000 using this method, the length can represent a single measurement or the arithmetic mean of multiple measurements. The same applies to measuring the width and thickness of the coil electronics assembly 1000.

[0039] The main body 100 forms the appearance of the coil electronics assembly 1000 and has a space that forms a magnetic circuit when current is applied to the coil 200 through the first external electrode 700 and the second external electrode 800. This magnetic circuit is the path through which the magnetic flux generated by the coil 200 passes.

[0040] The body 100 surrounds and encloses the coil 200 and the support member 300, and includes magnetic material. The body 100 may include magnetic particles and insulating material between the magnetic particles.

[0041] The magnetic particles may include a first metallic magnetic particle, a second metallic magnetic particle, and a third metallic magnetic particle. The second metallic magnetic particle has a smaller particle size than the first metallic magnetic particle, and the third metallic magnetic particle has a smaller particle size than the second metallic magnetic particle. The average particle size D of the first metallic magnetic particle is... 50 The average particle size D of the second metallic magnetic particles can range from about 5 μm to about 30 μm.50 It can be in the range of about 1 μm to about 5 μm, and the average particle size D of the third metallic magnetic particles 50 It can be in the range of about 0.05 μm to about 0.5 μm.

[0042] Magnetic particles can be ferrite particles or metallic magnetic particles that exhibit magnetism.

[0043] Ferrite particles may include, for example, at least one of spinel-type ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, Ni-Zn-based ferrites), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, Ba-Ni-Co-based ferrites), garnet-type ferrites (such as Y-based ferrites) and Li-based ferrites.

[0044] The metallic magnetic particles can be composed of two or more types of metallic magnetic particles with different compositions, and may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metallic magnetic particles may be at least one selected from pure iron, Fe-Si based alloys, Fe-Si-Al based alloys, Fe-Ni based alloys, Fe-Ni-Mo based alloys, Fe-Ni-Mo-Cu based alloys, Fe-Co based alloys, Fe-Ni-Co based alloys, Fe-Cr based alloys, Fe-Cr-Si based alloys, Fe-Si-Cu-Nb based alloys, Fe-Ni-Cr based alloys, and Fe-Cr-Al based alloys. Here, different compositions of metallic magnetic particles may refer to different amounts of the contained elements.

[0045] The metallic magnetic particles can be amorphous or crystalline. For example, the metallic magnetic particles can be Fe-Si-B-Cr based amorphous alloys, but the embodiments are not limited thereto. The average particle size of the metallic magnetic particles can range from about 0.1 μm to about 30 μm, but the embodiments are not limited thereto. In this specification, the average particle size may refer to a particle size composed of D... 90 D 50 Particle size distribution, expressed as such. Particle size distribution is well known to those skilled in the art; it serves as an indicator of the proportion of particles of a certain size (particle size) within a group of particles to be measured. D 50 (The particle size corresponding to a cumulative particle size distribution of 50%) refers to the median particle size.

[0046] Metallic magnetic particles can be two or more different types of metallic magnetic particles. Here, different types of metallic magnetic particles mean that the metallic magnetic particles are distinguished from each other in at least one aspect of average particle size, composition, component ratio, crystallinity, and shape.

[0047] The insulating material may include at least one of epoxy resin, polyimide, liquid crystal polymer, etc., but the embodiments are not limited thereto.

[0048] The support member 300 is disposed inside the main body 100 and supports the coil 200.

[0049] When viewed along the thickness direction (T-axis direction), the support member 300 may have the same shape as the shape formed by the edge of the coil 200, or it may have a rectangular shape that is wider than the coil 200. However, the embodiments are not limited to this.

[0050] The support member 300 may include glass.

[0051] For example, the glass included in the support member 300 can be SiO2-B2O3-based glass, SiO2-B2O3-K2O-based glass, SiO2-B2O3-Li2O-CaO-based glass, SiO2-B2O3-Li2O-CaO-ZnO-based glass, and Bi2O3-B2O3-SiO2-Al2O3-based glass. As another example, the support member 300 can be made of photosensitive glass including silicon dioxide, lithium (Li) oxide, aluminum (Al) oxide, and cerium (Ce) oxide.

[0052] In an embodiment, the glass included in the support member 300 may also include fillers. Fillers included in the glass may include, for example, quartz, alumina, magnesium oxide, silicon dioxide, forsterite (Mg2SiO4), talc (H2Mg3(SiO3)4), and zirconium oxide.

[0053] The support member 300 may include a first support surface 320 and a second support surface 330 that are opposite each other in the thickness direction (T-axis direction). A through hole 310 may be located at the center of the support member 300, and the through hole 310 may be filled with a magnetic material to form the core 110 of the body 100.

[0054] The coil 200 is embedded in the body 100 and exhibits the characteristics of the coil electronics 1000. For example, when the coil electronics 1000 according to the embodiment is used as a power inductor, when current is applied to the coil 200, the coil 200 can be used to stabilize the power of the electronic device by storing energy in the form of a magnetic field to maintain the output voltage.

[0055] When viewed along the thickness direction (T-axis direction), coil 200 may have a spiral shape.

[0056] The coil 200 may be disposed on a first support surface 320 and a second support surface 330 of the support member 300. The coil 200 may include a first coil pattern 210 and a second coil pattern 220 respectively disposed on the first support surface 320 and the second support surface 330 of the support member 300, and the first coil pattern 210 and the second coil pattern 220 may be connected to each other through a through-hole 230. The first coil pattern 210 and the second coil pattern 220 connected in this way may form a helical coil 200 having one or more turns. That is, the first coil pattern 210 and the second coil pattern 220 may include a plurality of turns surrounding the core 110, which will be described below.

[0057] The first coil pattern 210 is disposed on the first support surface 320 (i.e., the first surface of the support member 300) of the support member 300.

[0058] The first coil pattern 210 includes a first lead-out portion 213. The first lead-out portion 213 is exposed from the first surface S1 of the body 100 and is electrically connected to the first external electrode 700.

[0059] The second coil pattern 220 is disposed on the second support surface 330 (i.e., the second surface of the support member 300) of the support member 300.

[0060] The second coil pattern 220 includes a second lead-out 223. The second lead-out 223 is exposed from the second surface S2 of the body 100 and is electrically connected to the second external electrode 800.

[0061] Each of the coil 200 and the via 230 may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but the embodiments are not limited thereto.

[0062] The coil electronics assembly 1000 may further include a partition wall 400. The partition wall 400 is disposed between adjacent turns in the first coil pattern 210 and the second coil pattern 220. The partition wall 400 may also be disposed between the core 110 and the innermost coil C1 of the first coil pattern 210, and between the core 110 and the innermost coil C2 of the second coil pattern 220. The partition wall 400 separates adjacent turns in the first coil pattern 210, and the partition wall 400 separates adjacent turns in the second coil pattern 220.

[0063] The partition wall 400 may have a shape that extends from the surface of the support member 300 along the thickness direction (T-axis direction).

[0064] The partition wall 400 can be made of electrically insulating material. The partition wall 400 can also be made of glass.

[0065] The partition wall 400 may comprise the same glass as the glass included in the support member 300. In this case, glass is stronger than polymer, and therefore less likely to cause leakage current or short circuits in the coil. For example, the support member 300 and the partition wall 400 may comprise photosensitive glass.

[0066] An insulating film IF may be disposed between the coil 200 and the body 100. The insulating film IF may be formed along the surface of the coil 200. Since the partition wall 400 is disposed between adjacent turns in the coil patterns 210 and 220, the insulating film IF is not present in this area (i.e., the area between adjacent turns in the coil patterns 210 and 220), and the insulating film IF is not present at the locations where the support member 300 and the coil 200 are connected to the first external electrode 700 and the second external electrode 800.

[0067] The insulating film IF used to insulate the coil 200 from the body 100 may include known insulating materials such as parylene. Any insulating material can be used for the insulating film IF, and there are no particular limitations. For example, the insulating film IF may be a polyurethane resin, polyester resin, epoxy resin, or polyamide-imide resin. The insulating film IF may be formed by methods such as vapor deposition, but is not limited thereto. For example, the insulating film IF may be formed by stacking insulating films on both surfaces of the support member 300.

[0068] The first external electrode 700 and the second external electrode 800 are disposed on the outside of the main body 100 and connected to the coil 200.

[0069] The first external electrode 700 may be disposed on the first surface S1 of the main body 100 and connected to the first lead-out portion 213 of the coil 200. The first external electrode 700 covers a portion of the sixth surface S6 of the main body 100.

[0070] In another embodiment, the first external electrode 700 may cover the first surface S1 of the body 100, and may also cover a portion of at least one of the third surface S3, the fourth surface S4, the fifth surface S5 and the sixth surface S6.

[0071] The second external electrode 800 may be disposed on the second surface S2 of the main body 100 and connected to the second lead-out portion 223 of the coil 200. The second external electrode 800 covers a portion of the sixth surface S6 of the main body 100.

[0072] In another embodiment, the second external electrode 800 may cover the second surface S2 of the body 100, and may also cover a portion of at least one of the third surface S3, the fourth surface S4, the fifth surface S5 and the sixth surface S6.

[0073] The first external electrode 700 may include a first metal layer 701, a second metal layer 702, and a third metal layer 703.

[0074] The first metal layer 701 may be a plating layer that contacts the first lead-out portion 213 of the coil 200 and the outer surface of the body 100 (i.e., the first surface S1 and the sixth surface S6 of the body 100), and may include copper (Cu). The second metal layer 702 may be a plating layer covering the first metal layer 701, and may include nickel (Ni). The third metal layer 703 may be a plating layer covering the second metal layer 702, and may include tin (Sn). However, the embodiments are not limited to this three-layer structure, and a two-layer structure in which only one metal layer is provided on the first metal layer 701 is also feasible.

[0075] The second external electrode 800 may include a first metal layer 801, a second metal layer 802, and a third metal layer 803.

[0076] The first metal layer 801 may be a plating layer that contacts the second lead-out portion 223 of the coil 200 and the outer surface of the body 100 (i.e., the second surface S2 and the sixth surface S6 of the body 100), and may include copper (Cu). The second metal layer 802 may be a plating layer covering the first metal layer 801, and may include nickel (Ni). The third metal layer 803 may be a plating layer covering the second metal layer 802, and may include tin (Sn). However, the embodiments are not limited to this three-layer structure, and a two-layer structure in which only one metal layer is provided on the first metal layer 801 is also feasible.

[0077] As another example, the first external electrode 700 and the second external electrode 800 may comprise metal and glass. The metal may be, for example, a conductive metal, including at least one of copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The glass composition included in the first external electrode 700 and the second external electrode 800 may be a composition mixed with oxides. The glass composition may include, for example, silicon oxide, boron oxide, aluminum oxide, transition metal oxide, alkali metal oxide, alkaline earth metal oxide, or combinations thereof. Here, the transition metal may be selected from zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), or nickel (Ni); the alkali metal may be selected from lithium (Li), sodium (Na), or potassium (K); and the alkaline earth metal may be selected from magnesium (Mg), calcium (Ca), strontium (Sr), or barium (Ba). There are no particular limitations on the method used to form the first external electrode 700 and the second external electrode 800. For example, the first external electrode 700 and the second external electrode 800 can be formed by immersing the body 100 in a conductive paste containing metal and glass, or by printing the conductive paste onto the surface of the body 100 using, for example, screen printing or gravure printing. Furthermore, various methods can be used to form the first external electrode 700 and the second external electrode 800, such as coating the surface of the body 100 with conductive paste, or transferring a dry film formed by drying the conductive paste onto the body 100.

[0078] A surface insulating layer 900 may be disposed on the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the main body 100. However, the surface insulating layer 900 may partially cover the sixth surface S6 of the main body 100. That is, the first external electrode 700 and the second external electrode 800 may be disposed on the sixth surface S6 of the main body 100, and the surface insulating layer 900 may not cover the first external electrode 700 and the second external electrode 800.

[0079] As described above, the surface insulating layer 900 is disposed on at least a portion of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the body 100 to prevent electrical short circuits between other electronic components and the first external electrode 700 and the second external electrode 800.

[0080] When the first external electrode 700 and the second external electrode 800 are formed by electroplating, the surface insulating layer 900 can be used as an anti-plating layer, but is not limited thereto.

[0081] The surface insulating layer 900 may include polymer resins, pigments, fillers, etc. The polymer resin may include thermosetting polymer resins (such as epoxy resins) or thermoplastic polymer resins (such as acrylic resins). Pigments capable of producing color (such as black) may include carbon black, manganese (Mn)-based spinel powder, etc., and the surface insulating layer 900 may also include additives (such as SiO2 and talc) for controlling strength and / or coefficient of thermal expansion.

[0082] For example, the surface insulating layer 900 may include thermoplastic resins (such as polystyrene resins, vinyl acetate resins, polyester resins, polyethylene resins, polypropylene resins, polyamide resins, rubber resins, acrylic resins, etc.), thermosetting resins (such as phenolic resins, epoxy resins, polyurethane resins, melamine resins, alkyd resins), photosensitive resins, parylene, SiO2, etc. x or SiN x .

[0083] The surface insulating layer 900 can be formed by processes such as screen printing, pad printing, dipping, or spray printing. For example, the surface insulating layer 900 can be formed by coating a liquid insulating resin onto the surface of the body 100, or by stacking an insulating film such as a dry film on the surface of the body 100, or by a thin film process such as vapor deposition. When using an insulating film to form the surface insulating layer 900, an Ajinomoto stacked film (ABF) or a polyimide film can be used as the insulating film.

[0084] Figures 4 to 11 The diagram sequentially illustrates a method for manufacturing a coil electronic component according to an embodiment.

[0085] Reference Figure 4 A support part 300a made of glass material is provided.

[0086] Reference Figure 5 The trench 111 is formed by etching the support portion 300a. For example, the trench 111 can be formed by irradiating the support portion 300a with a laser beam or by performing a wet etching process on the support portion 300a.

[0087] The groove 111 can be formed with various patterns. For example, the groove 111 can be formed with a spiral pattern.

[0088] The portion of the support 300a located between the grooves 111 can form a partition wall 400.

[0089] Because the support portion 300a is made of glass, the groove 111 can be formed with a relatively high aspect ratio (e.g., the ratio of its dimension in the T-axis direction to its dimension in the L-axis direction). That is, when a laser beam is irradiated onto the glass support portion 300a, the straightness of the laser beam is excellent, thereby increasing the aspect ratio of the groove 111. For example, the aspect ratio of the groove 111 can be greater than or equal to 3:1 and less than or equal to 20:1. As a result, the grooves 111 can be arranged at a relatively high density and can be arranged close to each other with a fine pitch.

[0090] Unlike this embodiment, when the insulating film is placed on the support member and a groove is formed by irradiating the insulating film with a laser beam, it is difficult to increase the aspect ratio of the groove due to the scattering of the laser beam. In this case, the groove pitch may not be as fine as in this embodiment.

[0091] Reference Figure 6 The coil 200 is formed by filling the groove 111 with metal. The metal filling the groove 111 forms the coil 200. For example, the coil 200 can be formed by plating copper (Cu) on the groove 111. As a result, a first coil pattern 210, a second coil pattern 220, a first lead-out 213, a second lead-out 223, etc., can be formed.

[0092] Reference Figure 7 The through hole 310 is formed by etching the central portion of the support portion 300a. For example, the through hole 310 can be formed by irradiating the central portion of the support portion 300a with a laser beam or by performing a wet etching process on the support portion 300a. In addition, a region 303 opposite to the first lead-out portion 213 and a region 305 opposite to the second lead-out portion 223 can be etched on the support portion 300a to form the support member 300.

[0093] Reference Figure 8 An insulating film IF is formed on the coil 200. As a result, the surface of the coil 200, except for a portion of the first lead 213 and a portion of the second lead 223, can be covered with the insulating film IF and the partition wall 400. The insulating film IF may not be formed in regions 303 and 305.

[0094] Reference Figure 9 A body 100 is formed to surround the coil 200 and the support member 300. During this process, the through-hole 310 of the support member 300 is filled with magnetic material to form the core 110. Additionally, regions 303 and 305 (see...) Figure 8 It may be filled with magnetic material. For example, sheets made of magnetic material may be placed at the upper and lower parts of the coil 200, and then pressed and cured to form the body 100.

[0095] Reference Figure 10 A surface insulating layer 900 is formed on the outer surface of the main body 100, except for the portion where the first external electrode 700 and the second external electrode 800 will be formed.

[0096] Reference Figure 11 The coil electronic assembly 1000 is manufactured by forming a first external electrode 700 and a second external electrode 800 on the outer surface of the body 100. For example, conductive paste is applied to the first surface S1 and the sixth surface S6 of the body 100 and then cured to form the first external electrode 700, and conductive paste is applied to the second surface S2 and the sixth surface S6 of the body 100 and then cured to form the second external electrode 800. As another example, the first surface S1 and the sixth surface S6 of the body 100 are metal-plated to form the first external electrode 700, and the second surface S2 and the sixth surface S6 of the body 100 are metal-plated to form the second external electrode 800. Therefore, the first external electrode 700 is connected to the first lead-out portion 213, and the second external electrode 800 is connected to the second lead-out portion 223.

[0097] While embodiments of the present disclosure have been described above, the present disclosure is not limited thereto, and various modifications may be made within the scope of the claims, and such modifications also fall within the scope of the present disclosure.

Claims

1. A coil electronic assembly, comprising: The supporting member is made of glass material and includes a first surface and a second surface; A coil pattern is provided on the supporting member; as well as The main body comprises magnetic material and surrounds the support member and the coil pattern. The coil pattern includes: A first coil pattern is disposed on the first surface of the support member; and A second coil pattern is disposed on the second surface of the support member and connected to the first coil pattern.

2. The coil electronic assembly according to claim 1, wherein, The coil electronics assembly also includes a partition wall, and The partition wall is disposed between adjacent turns in the coil pattern.

3. The coil electronic assembly according to claim 2, wherein, The partition wall is made of glass.

4. The coil electronic assembly according to claim 3, wherein, The supporting member and the partition wall are made of the same glass material.

5. The coil electronic assembly according to claim 3, wherein, The supporting member and the partition wall include photosensitive glass.

6. The coil electronic assembly according to claim 2, further comprising: An insulating film is disposed between the coil pattern and the body.

7. The coil electronic assembly according to claim 1, wherein, The support member includes a through hole, and The through-hole is filled with the magnetic material.

8. The coil electronic assembly according to claim 1, wherein, The coil electronics assembly also includes a through-hole passing through the support member, and The first coil pattern and the second coil pattern are connected to each other through the via.

9. The coil electronic assembly according to claim 1, wherein, The first coil pattern includes a first lead-out that is exposed from one surface of the body, and The second coil pattern includes a second lead-out that is exposed from another surface of the body opposite to the first surface.

10. The coil electronic assembly according to claim 9, further comprising: A first external electrode is disposed on one surface of the body and connected to the first lead-out portion; as well as The second external electrode is disposed on the other surface of the main body and connected to the second lead-out portion.

11. The coil electronic assembly according to claim 1, further comprising: A surface insulating layer is disposed on the outer surface of the main body.

12. A coil electronic assembly, comprising: Supporting components, having through holes, including glass material; The core, filling the through-hole, comprises a magnetic material; A coil pattern is provided on the surface of the support member and includes a plurality of turns surrounding the core; as well as The main body includes the magnetic material and surrounds the support member and the coil pattern.

13. The coil electronic assembly of claim 12, further comprising an insulating film disposed between the coil pattern and the body.

14. The coil electronics assembly of claim 12, further comprising a partition wall separating adjacent turns in the coil pattern, the partition wall comprising the glass material.

15. The coil electronics assembly according to claim 14, wherein, The glass material included in the support member and the partition wall includes photosensitive glass.

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