Radiating device of ultrathin micro-channel substrate

Abstract

The invention provides an ultrathin heat dissipation device, and belongs to the technical field of heat dissipation of electronic equipment. The device comprises an upper substrate, a middle substrate and a lower substrate which are stacked. The lower substrate is provided with a heat absorption pool with a heat conduction turbulent flow column and a one-way flow channel with the characteristic of a Tesla valve, and is used for absorbing heat of equipment and guiding cooling liquid to flow in a one-way mode. The middle substrate is provided with a piezoelectric ceramic pump, a well-shaped heat dissipation channel and a nano-porous power generation assembly which are communicated in sequence to form a self-energy-supply circulation flow path; the nano-porous power generation assembly generates power through rotation of fluid kinetic energy, drives a piezoelectric ceramic pump to deform periodically, and provides power for circulation of cooling liquid. The well-shaped heat dissipation channel is a net-shaped micro-channel and is used for efficient heat dissipation. The upper substrate is provided with a corresponding heat dissipation area. Efficient self-circulation heat dissipation without external power is achieved, the overall thickness can be controlled within 3 mm, and the heat dissipation device has the advantages of being ultrathin, compact in structure and good in heat dissipation performance and is particularly suitable for portable electronic equipment with limited space.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and specifically to a heat dissipation device for an ultrathin microchannel substrate. Background Technology

[0002] As electronic devices evolve towards miniaturization and higher performance, their internal power density increases significantly, making heat dissipation a growing concern. This is especially true for smartphones, tablets, wearable devices, and various precision portable devices, where internal space is extremely limited. Traditional active / passive cooling solutions based on fans or heat pipes are often difficult to implement due to size, thickness, or noise constraints. Overheating inside the device can lead to decreased chip performance, system crashes, and prolonged high temperatures can even cause reliability issues such as solder joint detachment and chip solder joint defects.

[0003] While some existing microfluidic cooling technologies can achieve a certain degree of thinness, they typically rely on external pumps to drive coolant circulation. This not only increases the overall system size, complexity, and power consumption but also limits their application in completely enclosed, miniaturized devices. Therefore, achieving efficient self-circulating coolant cooling within a microfluidic system without relying on an external power source is a pressing technical challenge in this field. Summary of the Invention

[0004] To address the aforementioned technical problems, this application provides an ultra-thin heat dissipation device that can achieve self-circulation of coolant without relying on an external power source. It features an ultra-thin structure, high heat dissipation efficiency, good reliability, and suitability for limited spaces.

[0005] This application provides a heat dissipation device for an ultrathin microchannel substrate, the method comprising: An ultra-thin heat dissipation device includes an upper substrate, a middle substrate, and a lower substrate that are stacked and pressed together from top to bottom into one piece.

[0006] The lower substrate is provided with a heat absorption pool, a first unidirectional flow channel, and a second unidirectional flow channel. Both the first and second unidirectional flow channels have Tesla valve characteristics, utilizing their low forward resistance and high reverse resistance to achieve unidirectional flow. The heat absorption pool contains an array of thermally conductive turbulent flow columns to increase the heat exchange area and agitate the fluid to enhance heat absorption. The inlet of the heat absorption pool is connected to the inlet of the lower substrate via the first unidirectional flow channel, and the outlet of the heat absorption pool is connected to the outlet of the lower substrate via the second unidirectional flow channel. Specifically, the first unidirectional flow channel includes a return flow reverse damping channel and a return flow confluence channel. The lower substrate inlet is connected to the return flow confluence channel via the return flow reverse damping channel, and then connected to the heat absorption pool inlet. The second unidirectional flow channel includes an outflow branch port and an outflow convergence port. The outlet of the heat absorption pool is connected to the outflow convergence port via the outflow branch port, and then connected to the lower substrate outlet.

[0007] The intermediate substrate is provided with an inlet section, a piezoelectric ceramic pump, a Well-shaped heat dissipation channel, and a nanoporous power generation component connected in sequence. The inlet section is connected to the outlet of the lower substrate, the nanoporous power generation component is connected to the outlet of the intermediate substrate, and the outlet of the intermediate substrate is connected to the inlet of the lower substrate, thus forming a complete closed-loop flow path. The nanoporous power generation component is electrically connected to the piezoelectric ceramic pump to form a self-powered drive system.

[0008] The piezoelectric ceramic pump includes a pump slot and two symmetrically embedded piezoelectric ceramic arc-shaped springs, a left piezoelectric ceramic spring and a right piezoelectric ceramic arc-shaped spring. The nanoporous power generation component includes a rotating shaft, a rotating disk fixed on the rotating shaft, and multiple arc-shaped adsorption impellers arranged circumferentially on the rotating disk. The arc-shaped adsorption impellers are composed of a PZT backbone and a nanoporous silicon layer attached to its surface, and the rotating disk is also made of PZT.

[0009] The well-shaped heat dissipation channel is a mesh structure composed of multiple interconnected horizontal and vertical microchannels. The cross-sectional area of ​​the channel is designed to be 1 / 2 or 1 / 3 of the cross-sectional area of ​​the main channel in order to increase the heat dissipation surface area.

[0010] The upper substrate is provided with a heat dissipation area, which corresponds to the position of the heat dissipation channel of the middle substrate in the stacking direction, and is used to dissipate heat to the external environment.

[0011] Preferably, the overall thickness of the ultra-thin heat dissipation device is less than or equal to 3 mm.

[0012] The beneficial effects of this invention are as follows: High-efficiency self-circulation and self-powered: The fluid kinetic energy flowing through the nanoporous power generation component is used to drive its rotation to generate electricity. The generated electricity directly drives the piezoelectric ceramic pump to work, providing power for the liquid circulation of the entire microfluidic system. No external power source or mechanical pump is required, realizing true self-circulation and self-driven heat dissipation.

[0013] Ultra-thin and compact: By integrating all functional components through multi-layer substrate stacking and micro-machining technology, the overall thickness can be controlled within 3mm. Its extremely thin shape allows it to be easily embedded in various portable and handheld micro-devices with strict thickness requirements.

[0014] Excellent heat dissipation performance: It combines a unidirectional flow channel with Tesla valve characteristics to ensure circulation direction, turbulent columns in the heat absorption pool to enhance heat absorption, and a well-shaped mesh microchannel to greatly increase the heat dissipation area, forming an efficient "heat absorption-transportation-heat dissipation" thermal management path.

[0015] Sturdy structure and flexible application: The three substrates are pressed into one piece, resulting in a robust and reliable structure. Its flat design also gives it a degree of flexibility, allowing it to be attached and installed on curved or curved surfaces, making it suitable for a wide range of applications. Attached Figure Description

[0016] Figure 1 An exploded view of a heat dissipation method for an ultrathin microchannel substrate according to the present invention; Figure 2 This is a cross-sectional view of a heat dissipation method for an ultrathin microchannel substrate according to the present invention; Figure 3 This invention provides a heat dissipation method for an ultrathin microchannel substrate using nanoporous power generation. Figure 4 The diagram shows a piezoelectric ceramic pump used in a heat dissipation method for an ultrathin microchannel substrate according to the present invention.

[0017] The attached diagram is labeled as follows: 1. Lower substrate; 2. Middle substrate; 3. Upper substrate; 1-1. Lower substrate inlet; 1-2. Return flow reverse damping channel; 1-3. Return flow confluence channel; 1-4. Absorber pool inlet; 1-5. Absorber pool; 1-6. Thermally conductive turbulent flow column; 1-7. Absorber pool outlet; 1-8. Outflow branch port; 1-9. Outflow convergence port; 1-10. Lower substrate outlet; 2-1. Middle substrate inlet; 2-2. Piezoelectric ceramic pump; 2-3. Well-shaped heat dissipation channel; 2-4. Nanoporous power generation component; 2-5. Middle substrate outlet; 3-1. Upper substrate heat dissipation area; 2-100. Arc-shaped adsorption impeller; 2-101. Rotating disk; 2-102. Rotating shaft; 2-201. Left piezoelectric ceramic arc-shaped spring; 2-202. Piezoelectric ceramic pump slot; 2-203. Right piezoelectric ceramic arc-shaped spring. Detailed Implementation Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0018] like Figure 1 and Figure 2 As shown, the ultra-thin heat dissipation device provided by the present invention is mainly composed of a lower substrate (1), a middle substrate (2) and an upper substrate (3) forming an integral structure through bonding or pressing processes.

[0019] The lower substrate (1) is the heat-absorbing part of the device. Its lower substrate inlet (1-1) is connected to the heat-absorbing pool (1-5) through the first unidirectional flow channel. The first unidirectional flow channel has Tesla valve characteristics and is composed of a return flow reverse damping channel (1-2) and a return flow confluence channel (1-3), ensuring that the coolant can only flow from the inlet (1-1) to the heat-absorbing pool (1-5), and the reverse flow will be greatly damped. The heat-absorbing pool (1-5) is densely packed with thermally conductive turbulent columns (1-6). When the device is attached to a heat-generating device (such as a chip), heat is transferred to the heat-absorbing pool (1-5) through the substrate of the lower substrate (1). The coolant in the pool absorbs the heat, and the thermally conductive turbulent columns (1-6) effectively increase the contact area and disturb the liquid flow, thereby improving the heat absorption efficiency. The coolant after heat absorption flows out from the heat-absorbing pool outlet through the second unidirectional flow channel. The second unidirectional flow channel also has Tesla valve characteristics, including an outflow branch port (1-8) and an outflow convergence port (1-9), which guides the liquid to flow unidirectionally to the substrate outlet (1-10).

[0020] The middle substrate (2) is the core part of the device for driving and heat dissipation. The heated coolant from the lower substrate outlet (1-10) enters the piezoelectric ceramic pump (2-2) through the inlet section. For example... Figure 4 As shown, the piezoelectric ceramic pump (2-2) consists of a pump trough (2-202) and left and right piezoelectric ceramic arc-shaped springs (2-201, 2-203) within it. The liquid then flows into the Well-Tempered Cooling Channel (2-3), which is composed of densely interwoven transverse and longitudinal microchannels (e.g., ...). Figure 1 (Illustrative diagram) This greatly expands the contact area for heat dissipation with the upper substrate (3). The liquid flowing out from the well-shaped heat dissipation channel (2-3) drives the nanoporous power generation component (2-4) to rotate.

[0021] like Figure 3 As shown, the surface of the arc-shaped adsorption impeller (2-100) of the nanoporous power generation component (2-4) is covered with a nanoporous silicon layer. When liquid flows through, it is adsorbed into the nanoporous structure, causing charge separation and transfer. As the impeller rotates, the adsorption and desorption processes occur periodically, thereby generating a sinusoidal alternating voltage in the PZT trunk and rotating disk (2-101) (both are PZT materials). This voltage is fed to the left and right piezoelectric ceramic arc-shaped springs (2-201, 2-203) of the piezoelectric ceramic pump (2-2), driving them to periodically coordinate deformation (contraction and relaxation). This deformation, like a "miniature heart," exerts a squeezing and propulsive effect on the liquid in the pump tank (2-202). Due to the reverse flow resistance characteristics of the upstream and downstream unidirectional flow channels, the liquid is pumped directionally, forming a continuous circulation. The coolant that has completed its work and further dissipated heat flows out from the middle substrate outlet (2-5) and returns to the lower substrate inlet (1-1) to start a new cycle.

[0022] The heat dissipation area (3-1) of the upper substrate (3) is directly opposite the Well heat dissipation channel (2-3), which can effectively dissipate the heat conducted from the liquid to the surrounding air or the equipment casing.

[0023] The entire operation requires no external energy input, being entirely driven by electrical energy converted from the thermal energy of the fluid within the system, achieving efficient, quiet, and ultra-thin adaptive heat dissipation. The overall thickness of the device can be controlled to less than 3mm, making it ideal for integration into modern electronic devices with limited space.

[0024] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A heat dissipation device for an ultrathin microchannel substrate, characterized in that, It includes an upper substrate (3), a middle substrate (2) and a lower substrate (1) stacked from top to bottom; The lower substrate (1) is provided with a heat absorption pool (1-5), a first unidirectional flow channel and a second unidirectional flow channel. Both the first unidirectional flow channel and the second unidirectional flow channel have Tesla valve characteristics. The heat absorption pool (1-5) is provided with a thermally conductive turbulent flow column (1-6). The inlet end of the heat absorption pool (1-5) is connected to the lower substrate inlet (1-1) through the first unidirectional flow channel, and the outlet end of the heat absorption pool (1-5) is connected to the lower substrate outlet (1-10) through the second unidirectional flow channel. The middle substrate (2) is provided with an inlet section, a piezoelectric ceramic pump (2-2), a well-shaped heat dissipation channel (2-3), and a nanoporous power generation component (2-4) connected in sequence; the inlet section is connected to the outlet (1-10) of the lower substrate, the nanoporous power generation component (2-4) is connected to the outlet (2-5) of the middle substrate (2), and the outlet (2-5) of the middle substrate is connected to the inlet (1-1) of the lower substrate to form a circulation path; The nanoporous power generation component (2-4) is electrically connected to the piezoelectric ceramic pump (2-2) and is used to generate electricity under the drive of the flowing fluid and to supply power to the piezoelectric ceramic pump (2-2); The upper substrate (3) is provided with a heat dissipation area (3-1), which corresponds to the heat dissipation channel (2-3) in the stacking direction.

2. The heat dissipation device for the ultrathin microchannel substrate according to claim 1, characterized in that, The first unidirectional flow channel includes a return flow reverse damping channel (1-2) and a return flow confluence channel (1-3). The lower substrate inlet (1-1) is connected to the return flow confluence channel (1-3) through the return flow reverse damping channel (1-2). The return flow confluence channel (1-3) is connected to the heat absorption pool (1-5) through the heat absorption pool inlet (1-4).

3. The heat dissipation device for the ultrathin microchannel substrate according to claim 1, characterized in that, The second unidirectional flow channel includes an outflow branch port (1-8) and an outflow convergence port (1-9). The outlet of the heat absorption pool (1-5) is connected to the outflow convergence port (1-9) through the outflow branch port (1-8). The outflow convergence port (1-9) is connected to the outlet of the lower substrate (1-10).

4. The heat dissipation device for the ultrathin microchannel substrate according to claim 1, characterized in that, The piezoelectric ceramic pump (2-2) includes a pump slot (2-202) and a left piezoelectric ceramic arc-shaped spring (2-201) and a right piezoelectric ceramic arc-shaped spring (2-203) symmetrically arranged in the pump slot (2-202).

5. The heat dissipation device for the ultrathin microchannel substrate according to claim 1, characterized in that, The nanoporous power generation component (2-4) includes a rotating shaft (2-102), a rotating disk (2-101) fixed on the rotating shaft (2-102), and at least one arc-shaped adsorption impeller (2-100) disposed on the rotating disk (2-101); the arc-shaped adsorption impeller (2-100) includes a PZT backbone and a nanoporous silicon layer attached to the surface of the PZT backbone.

6. The heat dissipation device for the ultrathin microchannel substrate according to claim 5, characterized in that, The rotating disk (2-101) is made of PZT.

7. The heat dissipation device for the ultrathin microchannel substrate according to claim 1, characterized in that, The well-shaped heat dissipation channel (2-3) is composed of multiple interconnected horizontal and vertical microchannels.

8. The heat dissipation device for the ultrathin microchannel substrate according to claim 7, characterized in that, The cross-sectional area of ​​the horizontal microchannel and the vertical microchannel is 1 / 2 or 1 / 3 of the cross-sectional area of ​​the main channel.

9. The heat dissipation device for the ultrathin microchannel substrate according to any one of claims 1 to 8, characterized in that, The upper substrate (3), middle substrate (2) and lower substrate (1) are pressed into an integral structure.

10. The heat dissipation device for the ultrathin microchannel substrate according to claim 9, characterized in that, The overall thickness of the heat dissipation device of the ultrathin microchannel substrate is less than or equal to 3 mm.

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