Server cabinet
By introducing a closed-loop cooling system into the server rack, and using heat exchangers and partitions to guide airflow to transfer server heat into the liquid cooling system, the high cost and thermal pollution problems of traditional cooling methods are solved, achieving efficient and environmentally friendly cooling effects.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GIGA COMPUTING TECHNOLOGY CO LTD
- Filing Date
- 2024-10-21
- Publication Date
- 2026-04-21
AI Technical Summary
Existing server racks require large spaces for heat dissipation and are prone to thermal pollution. This is especially true for small server racks, which are costly, and traditional fan cooling methods are inefficient and not environmentally friendly.
It adopts a closed heat dissipation system, which combines heat exchangers, partitions and fan assemblies. It uses airflow to introduce the server heat into the heat exchanger and cools it through the liquid cooling system. The airflow does not escape to the outside, reducing heat pollution.
It achieves efficient and environmentally friendly server heat dissipation, reduces thermal pollution, lowers costs, and is suitable for the heat dissipation needs of a small number of server racks.
Smart Images

Figure CN121908502A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a server rack, and more particularly to a server rack with a sealed heat dissipation system. Background Technology
[0002] Currently, large electronic devices often require multiple servers to operate. These servers generate heat during operation, necessitating timely cooling to prevent them from malfunctioning due to overheating. Typically, multiple servers are housed in server racks arranged sequentially within server cabinets, each equipped with a large cooling unit to dissipate heat from the servers. However, such server cabinets require significant space, making them costly for smaller numbers of server racks. Furthermore, cooling servers often relies on fans to directly expel the heat generated during operation, potentially causing thermal pollution to the environment. Summary of the Invention
[0003] The purpose of this invention is to provide a server rack with a sealed heat dissipation system that can dissipate heat from the server.
[0004] A server rack according to the present invention is suitable for connecting a liquid cooling system. The server rack includes a cabinet, a heat exchanger, at least two server racks, two partitions, a first fan assembly, and a second fan assembly. The cabinet has an internal space, which is a sealed space. The heat exchanger is disposed in the internal space and has a first end and a second end opposite to each other. The at least two server racks are respectively disposed on opposite sides of the heat exchanger and have a plurality of heat sources. The two partitions are respectively disposed between one of the at least two server racks and the heat exchanger. The first fan assembly is disposed at the first end, wherein the first fan assembly generates an airflow, and the airflow flows from the first fan assembly toward the at least two server racks. The second fan assembly is disposed at the second end, wherein the airflow flows into the heat exchanger through the second fan assembly.
[0005] Based on the above, the present invention provides a server rack that uses a heat exchanger and a partition to directly remove the heat generated by multiple heat sources on both sides of the server rack by the airflow generated by the first fan assembly, and the second fan assembly brings the airflow back into the heat exchanger for heat dissipation. The airflow will not escape from the internal space to the outside of the server rack, thereby reducing the heat pollution generated during server operation.
[0006] To make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description
[0007] Figure 1This is a schematic diagram of a server rack according to the present invention.
[0008] Figure 2 This is a top view of a server rack according to the present invention.
[0009] Figure 3 This is a schematic diagram of the baffle guiding airflow according to the present invention.
[0010] The attached figures are labeled as follows:
[0011] 100: Server rack
[0012] 110: Cabinet
[0013] 111: Interior Space
[0014] 120: Heat exchanger
[0015] 120a: First end
[0016] 120b: Second end
[0017] 121: Heat exchange tube
[0018] 122: Cooling pipe assembly
[0019] 130: Server rack
[0020] 131: Server
[0021] 140: partition
[0022] 150: First fan assembly
[0023] 160: Second fan assembly
[0024] 200: Liquid cooling system
[0025] F: Airflow
[0026] F1: First airflow
[0027] F2: Second airflow Detailed Implementation
[0028] Figure 1 This is a schematic diagram of a server rack according to the present invention. Figure 2 This is a top view of a server rack according to the present invention. Please also refer to... Figure 1 and Figure 2In this embodiment, the server rack 100 is adapted to connect to a liquid cooling system 200. The server rack 100 includes a cabinet 110, a heat exchanger 120, at least two server racks 130, two partitions 140, a first fan assembly 150, and a second fan assembly 160. The cabinet 110 has an internal space 111, which is a sealed space. The heat exchanger 120 is disposed in the internal space 111 and has a first end 120a and a second end 120b opposite to each other. The two server racks 130 are respectively disposed on opposite sides of the heat exchanger 120 and have a plurality of heat sources. The two partitions 140 are respectively disposed between one of the two server racks 130 and the heat exchanger 120. The first fan assembly 150 is disposed at the first end 120a, and the second fan assembly 160 is disposed at the second end 120b.
[0029] Figure 3 This is a schematic diagram of the baffle guiding airflow according to the present invention. Please also refer to... Figure 2 and Figure 3The first fan assembly 150 generates an airflow F, which flows from the first fan assembly 150 toward the two server racks 130 and flows into the heat exchanger 120 through the second fan assembly 160. Specifically, a partition 140 extends from the bottom to the top of the internal space 111 and separates the server racks 130 from the heat exchanger 120. That is, the orthographic projection of the server racks 130 onto the surfaces of adjacent partitions 140 does not exceed the partition 140, and the orthographic projection of the heat exchanger 120 onto the surfaces of partitions 140 also does not exceed the partition 140. Furthermore, after flowing through the two partitions 140, the airflow F forms a first airflow F1 and a second airflow F2, respectively, where the first airflow F1 flows toward one of the two server racks 130, and the second airflow F2 flows toward the other of the two server racks 130. Because the two partitions 140 completely block the heat exchanger 120 from the two server racks 130, the first airflow F1 and the second airflow F2 will not escape into the heat exchanger 120 when flowing towards one of the two server racks 130 respectively. That is, the airflow F forms the first airflow F1 and the second airflow F2 through the two partitions 140, and flows towards one of the two server racks 130 respectively. The first airflow F1 and the second airflow F2 will not intersect and affect each other because of the partitions 140. In this embodiment, there are two server racks 130. In other embodiments, there may be four server racks 130, with two located on one side of the heat exchanger 120 and the other two on the other side. Adjacent server racks 130 are also separated by partitions 140 to prevent the airflow F from affecting each other when flowing through these server racks 130. This invention is not limited to these embodiments. In addition, in this embodiment, the two partitions 140 are made of thermal insulating material, such as plastic. In other embodiments, the two partitions 140 may also be made of other non-metallic materials, as long as the partitions 140 can withstand high temperatures and have poor thermal conductivity. This invention is not limited to this.
[0030] Please refer to Figure 1 and Figure 3 Each server rack 130 has multiple servers 131, and these servers 131 are considered the heat source of the server rack 130. A first airflow F1 and a second airflow F2 flow through these servers 131, carrying away the heat generated by these servers 131 from the server rack 130 and into the heat exchanger 120 via the second fan assembly 160. In other words, when the first airflow F1 and the second airflow F2 flow through these servers 131 respectively, they carry away a portion of the heat generated by these servers 131 and transfer it to the heat exchanger 120 via the second fan assembly 160.
[0031] As described above, the heat exchanger 120 also includes two heat exchange tubes 121, which are disposed at the first end 120a and extend from the internal space 111 of the cabinet 110 to the outside of the cabinet 110 to connect to the liquid cooling system 200. The two heat exchange tubes 121 contain a working fluid for transferring heat from the heat exchanger 120 to the liquid cooling system 200. Specifically, when the first airflow F1 and the second airflow F2 flow through the two server racks 130 and enter the heat exchanger 120 through the second fan assembly 160, they transfer heat into the heat exchanger 120. The heat is then transferred to the liquid cooling system 200 via one of the two heat exchange tubes 121, cooled in the liquid cooling system 200, and then re-enters the heat exchanger 120 via the other of the two heat exchange tubes 121. In other words, the two heat exchange tubes 121 will transfer the heat in the heat exchanger 120 to the liquid cooling system 200 for cooling through the working fluid. The liquid cooling system 200 can be a direct-to-chip liquid cooling system.
[0032] As described above, the heat exchanger 120 also includes a cooling pipe assembly 122 disposed within the heat exchanger 120. The cooling pipe assembly 122 extends out of the heat exchanger 120 from its first end 120a, and also contains working fluid. In this embodiment, the cooling pipe assembly 122 comprises two pipes that extend from the heat exchanger 120 through two adjacent partitions 140 toward two server racks 130, and into these servers 131 to cool them. That is, the cooling pipe assembly 122 transports the cooled working fluid from the first end 120a of the heat exchanger 120 to the multiple servers 131 on the server racks 130, carrying away heat from the servers 131, thus raising the temperature of the working fluid. The fluid is then transported back into the heat exchanger 120 via the second end 120b, where it cools the working fluid within the cooling pipe assembly 122.
[0033] In detail, two partitions 140 connect the top and bottom of the internal space 111 respectively, and the two partitions 140 respectively block the two server racks 130 and the heat exchanger 120. Therefore, the first airflow F1 and the second airflow F2 will not meet each other, and the partitions 140 can effectively guide the direction of the first airflow F1 and the second airflow F2. Since the two partitions 140 block the heat exchanger 120 and the adjacent server rack 130 respectively, the first airflow F1 and the second airflow F2 will not flow to the heat exchanger 120 when flowing through the server rack 130, which can more effectively dissipate heat from the multiple servers 131.
[0034] As described above, when the first airflow F1 flows through the server rack 130, it is guided by the partition 140 to the second fan assembly 160. Similarly, when the second airflow F2 flows through the server rack 130, it is also guided by the partition 140 to the second fan assembly 160. The first airflow F1 and the second airflow F2 converge into airflow F through the second fan assembly 160 and enter the heat exchanger 120. When the airflow F carrying heat enters the heat exchanger 120, it transfers heat to the heat exchanger 120. In this embodiment, the heat exchanger 120 has multiple fin groups and multiple heat pipes. The airflow F transfers heat to the fin groups and heat pipes, and then to the liquid cooling system 200 through the heat exchange pipe 121. In other words, the hot airflow F enters the heat exchanger 120 through the second fan assembly 160 and transfers heat to the heat exchanger 120. This ensures that the airflow F exits the heat exchanger 120 without heat when passing through the first fan assembly 150, effectively dissipating heat from the two server racks 130. Additionally, the cooling pipe assembly 122, directly connected to these servers 131, also carries away another portion of the heat and transfers it back to the heat exchanger 120 for cooling. This ensures that the cooling pipe assembly 122 exits the heat exchanger 120 without heat when flowing out from the first end 120a, effectively dissipating heat from these servers 131.
[0035] In summary, the server rack of the present invention utilizes a heat exchanger and a partition to directly remove the heat generated by multiple heat sources on both sides of the server rack by the airflow generated by the first fan assembly, and the second fan assembly brings the airflow back into the heat exchanger for heat dissipation. Moreover, the airflow will not escape from the internal space to the outside of the server rack, thereby reducing the heat pollution generated during server operation.
[0036] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.
Claims
1. A server rack suitable for connecting a liquid cooling system, characterized in that, The server rack includes: A cabinet having an internal space, wherein the internal space is a closed space; A heat exchanger is disposed in the internal space and has a first end and a second end opposite to each other; At least two server racks are respectively arranged on opposite sides of the heat exchanger, wherein each of the at least two server racks has multiple heat sources; Two partitions are respectively disposed between one of the at least two server racks and the heat exchanger; A first fan assembly is disposed at the first end, wherein the first fan assembly generates an airflow, and the airflow flows from the first fan assembly toward the at least two server racks; and A second fan assembly is disposed at the second end, through which the airflow flows into the heat exchanger.
2. The server rack as described in claim 1, characterized in that, The heat exchanger also includes two heat exchange tubes, which are located at the first end and extend to the outside of the cabinet to connect to the liquid cooling system.
3. The server rack as described in claim 1, characterized in that, Each of the two partitions extends from the bottom to the top of the interior space and blocks one of the at least two server racks from contacting the heat exchanger.
4. The server rack as described in claim 3, characterized in that, The orthographic projection of each of the two partitions onto the surfaces of the plurality of partitions does not exceed the plurality of partitions.
5. The server rack as described in claim 1, characterized in that, After passing through the two partitions, the airflow splits into a first airflow and a second airflow. The first airflow flows to one of the at least two server racks, and the second airflow flows to the other of the at least two server racks.
6. The server rack as described in claim 5, characterized in that, The first airflow and the second airflow flow into the heat exchanger via the second fan assembly.
7. The server rack as described in claim 5, characterized in that, The first airflow and the second airflow are separated from each other by the two partitions.
8. The server rack as described in claim 1, characterized in that, The heat exchanger also has a cooling tube assembly disposed within the heat exchanger, extending out of the heat exchanger from the first end and through the two partitions to the plurality of heat sources, and connected to the heat exchanger from the second end.
9. The server rack as described in claim 1, characterized in that, The two partitions are made of thermally insulating material.