Thermocompression welding method and thermocompression welding system

Abstract

The invention discloses a thermocompression welding method and a thermocompression welding system. The thermocompression welding system comprises a thermocompression welding head used for simultaneously pressing and welding the welding ends of a plurality of wires to a plurality of bonding pads of a circuit board respectively; the distance detection device is used for detecting the distance from each bonding pad on the circuit board to a preset horizontal plane; the fitting line generator is used for generating a fitting line according to the distance of each bonding pad detected by the distance detection device and the position of each bonding pad in the horizontal direction; the distance calculation device is used for calculating the actual moving distance of the thermocompression welding head according to the generated fitting line and the preset moving distance of the thermocompression welding head; and the welding head moving device is used for driving the hot-pressure welding head to move towards the circuit board by an actual moving distance. The moving distance of the thermocompression welding head is adjusted according to the manufacturing error of the circuit board, so that the thermocompression welding head can reliably press and weld a plurality of wires onto a plurality of bonding pads of the circuit board at the same time, the problem of insufficient welding can be effectively avoided, and the product quality is improved.

Description

Technical Field

[0001] This invention relates to a hot-press welding method and a hot-press welding system. Background Technology

[0002] In existing technologies, when simultaneously soldering multiple wires to multiple pads on a circuit board using a thermoforming head, the distance the thermoforming head moves from its initial position toward the circuit board is usually fixed and pre-calculated based on the circuit board's preset dimensions and shape. However, due to manufacturing errors, this can lead to discrepancies between the actual dimensions and shape of the circuit board; for example, the circuit board thickness may be smaller than its preset dimensions, the circuit board surface may be curved, or the circuit board thickness may be uneven. If the thermoforming head uses a constant preset moving distance, some wires may not be reliably pressed against the pads, resulting in incomplete soldering and reduced product quality. Summary of the Invention

[0003] The purpose of this invention is to solve at least one aspect of the aforementioned problems and defects existing in the prior art.

[0004] According to one aspect of the present invention, a hot-press welding method is provided. The hot-press welding method includes the following steps:

[0005] S10: Provide a circuit board and position the circuit board on a horizontal reference plane;

[0006] S20: Detect the distance from each pad on the circuit board to a predetermined horizontal plane, the predetermined horizontal plane being located above the circuit board and at a first distance d1 from the horizontal reference plane;

[0007] S30: Generate a fitting line based on the detected distance of each pad to the predetermined horizontal plane and the position of each pad in the horizontal direction;

[0008] S40: Provide multiple wires and position the solder ends of the multiple wires on multiple pads of the circuit board respectively;

[0009] S50: Provide a thermoforming head and position the thermoforming head at a predetermined height position above the circuit board, the predetermined height position being a second distance d2 from the horizontal reference plane;

[0010] S60: Calculate the actual movement distance d4 of the hot-press welding head based on the generated fitting line and the preset movement distance d3 of the hot-press welding head along the height direction; and

[0011] S70: Drive the hot press welding head to move the actual moving distance d4 along the height direction toward the circuit board, so that the welding end of each wire is reliably pressed and welded to the corresponding pad by the hot press welding head.

[0012] According to an exemplary embodiment of the present invention, the actual travel distance d4 is calculated according to the following formula:

[0013] d4 = d3 + Δd; where

[0014] △d is the difference between the maximum distance d5 from the fitted line to the predetermined horizontal plane and the preset distance d6 from the pads of the circuit board to the predetermined horizontal plane.

[0015] According to another exemplary embodiment of the present invention, step S20 includes: providing a plurality of sensors corresponding to a plurality of pads on the circuit board and simultaneously detecting the distance from the plurality of pads on the circuit board to the predetermined horizontal plane using the plurality of sensors.

[0016] According to another exemplary embodiment of the present invention, step S20 includes: providing a single sensor and using the single sensor to detect, one by one, the distances of a plurality of pads on the circuit board to the predetermined horizontal plane.

[0017] According to another exemplary embodiment of the present invention, the sensor is a laser distance sensor.

[0018] According to another exemplary embodiment of the present invention, the hot-press welding head is capable of elastic deformation when pressed, so as to ensure that the welding ends of multiple wires positioned at different heights can be reliably pressed against multiple pads on the circuit board simultaneously.

[0019] According to another aspect of the present invention, a hot-press welding system is provided. The hot-press welding system includes: a hot-press welding head for simultaneously pressing and welding the welding ends of a plurality of wires to a plurality of pads on a circuit board; a distance detection device for detecting the distance of each pad on the circuit board to a predetermined horizontal plane; a fitting line generator for generating a fitting line based on the distances of each pad detected by the distance detection device and the horizontal positions of each pad; a distance calculation device for calculating the actual movement distance d4 of the hot-press welding head based on the generated fitting line and a preset movement distance d3 of the hot-press welding head in the height direction; and a welding head moving device for driving the hot-press welding head to move the actual movement distance d4 towards the circuit board along the height direction.

[0020] According to an exemplary embodiment of the present invention, the actual travel distance d4 is calculated according to the following formula:

[0021] d4 = d3 + Δd; where

[0022] △d is the difference between the maximum distance d5 from the fitted line to the predetermined horizontal plane and the preset distance d6 from the pads of the circuit board to the predetermined horizontal plane.

[0023] According to another exemplary embodiment of the present invention, the distance detection device includes a plurality of sensors, each corresponding to a plurality of pads on the circuit board, for simultaneously detecting the distances from the plurality of pads on the circuit board to the predetermined horizontal plane.

[0024] According to another exemplary embodiment of the present invention, the distance detection device includes a single sensor, and the hot press welding system further includes a sensor moving device for moving the single sensor in a horizontal direction to detect the distance of a plurality of pads on the circuit board to the predetermined horizontal plane one by one through the single sensor.

[0025] According to another exemplary embodiment of the present invention, the sensor is a laser distance sensor.

[0026] According to another exemplary embodiment of the present invention, the hot-press welding head is capable of elastic deformation when pressed, so as to ensure that the welding ends of multiple wires positioned at different heights can be reliably pressed against multiple pads on the circuit board simultaneously.

[0027] According to another exemplary embodiment of the present invention, the hot press welding system further includes: a circuit board fixing clamp for fixing and positioning the circuit board; and a wire fixing clamp for fixing and positioning a plurality of wires, such that the welding ends of the plurality of wires are respectively positioned on a plurality of pads on the circuit board.

[0028] In the foregoing exemplary embodiments of the present invention, the moving distance of the hot press welding head is adjusted according to the manufacturing error of the circuit board, so that the hot press welding head can simultaneously and reliably press and weld multiple wires to multiple pads on the circuit board, which can effectively avoid the problem of cold solder joints and improve the quality of the product.

[0029] Other objects and advantages of the invention will become apparent from the following description of the invention with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the invention. Attached Figure Description

[0030] Figure 1 A schematic diagram of a circuit board according to an exemplary embodiment of the present invention is shown;

[0031] Figure 2 This diagram illustrates how sensors detect the distances from each pad on a circuit board to a predetermined horizontal plane.

[0032] Figure 3This is an example diagram showing a fitted line generated based on the detected distances of each pad on the circuit board to a predetermined horizontal plane and the horizontal position of each pad.

[0033] Figure 4 This is an example diagram showing another fitted line generated based on the detected distances of each pad on the circuit board to a predetermined horizontal plane and the horizontal position of each pad.

[0034] Figure 5 This is an example diagram showing another fitted line generated based on the detected distances of each pad on the circuit board to a predetermined horizontal plane and the horizontal position of each pad.

[0035] Figure 6 This is an example diagram showing another fitted line generated based on the detected distances of each pad on the circuit board to a predetermined horizontal plane and the horizontal position of each pad.

[0036] Figure 7 This diagram shows how the solder ends of multiple wires are positioned onto multiple pads on a circuit board.

[0037] Figure 8 A schematic diagram showing the movement of the thermoforming head toward the circuit board;

[0038] Figure 9 This diagram illustrates how multiple wires are pressed and soldered onto multiple pads on a circuit board using a hot press soldering head.

[0039] Figure 10 A perspective view showing a circuit board, wires, and thermoforming head according to an exemplary embodiment of the present invention. Detailed Implementation

[0040] The technical solution of the present invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. In this specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention and should not be construed as a limitation thereof.

[0041] Furthermore, in the following detailed description, numerous specific details are set forth for ease of explanation to provide a thorough understanding of the embodiments disclosed herein. However, it will be apparent that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and apparatuses are illustrated to simplify the figures.

[0042] According to a general technical concept of the present invention, a hot-press welding system is provided. The hot-press welding system includes: a hot-press welding head for simultaneously pressing and welding the welding ends of multiple wires to multiple pads on a circuit board; a distance detection device for detecting the distance of each pad on the circuit board to a predetermined horizontal plane; a fitting line generator for generating a fitting line based on the distances of each pad detected by the distance detection device and the horizontal positions of each pad; a distance calculation device for calculating the actual movement distance d4 of the hot-press welding head based on the generated fitting line and a preset movement distance d3 of the hot-press welding head in the height direction; and a welding head moving device for driving the hot-press welding head to move the actual movement distance d4 towards the circuit board along the height direction.

[0043] According to another general technical concept of the present invention, a hot-press welding method is provided. The hot-press welding method includes the following steps: providing a circuit board and positioning the circuit board on a horizontal reference plane; detecting the distance from each pad on the circuit board to a predetermined horizontal plane, the predetermined horizontal plane being above the circuit board and at a first distance d1 from the horizontal reference plane; generating a fitting line based on the detected distances from each pad to the predetermined horizontal plane and the horizontal positions of each pad; providing a plurality of wires and positioning the welding ends of the plurality of wires on the plurality of pads respectively; providing a hot-press welding head and positioning the hot-press welding head at a predetermined height position above the circuit board, the predetermined height position being at a second distance d2 from the horizontal reference plane; calculating the actual movement distance d4 of the hot-press welding head based on the generated fitting line and a predetermined movement distance d3 of the hot-press welding head along the height direction; and driving the hot-press welding head to move the actual movement distance d4 along the height direction toward the circuit board, such that the welding end of each wire is reliably pressed and welded to the corresponding pad by the hot-press welding head.

[0044] Figure 1 A schematic diagram of a circuit board 1 according to an exemplary embodiment of the present invention is shown; Figure 2 This diagram illustrates how sensor 4 detects the distance from each pad 10 on circuit board 1 to a predetermined horizontal plane P. Figure 3 This is an example diagram showing a fitted line S generated based on the detected distances of each pad 10 on the circuit board 1 to a predetermined horizontal plane P and the horizontal position of each pad 10. Figure 4 This is an example diagram showing another fitted line S generated based on the detected distances of each pad 10 on the circuit board 1 to the predetermined horizontal plane P and the horizontal position of each pad 10. Figure 5 This is an example diagram showing another fitted line S generated based on the detected distances of each pad 10 on the circuit board 1 to the predetermined horizontal plane P and the horizontal position of each pad 10. Figure 6This is an example diagram showing another fitted line S generated based on the detected distances of each pad 10 on the circuit board 1 to the predetermined horizontal plane P and the horizontal position of each pad. Figure 7 This diagram shows the soldering ends of multiple wires 2 respectively positioned on multiple pads 10 of circuit board 1; Figure 8 A schematic diagram showing the hot press welding head 3 moving toward the circuit board 1;

[0045] Figure 9 This diagram shows how multiple wires 2 are pressed and soldered onto multiple pads 10 of a circuit board 1 using a hot press welding head 3. Figure 10 A perspective view of a circuit board 1, wires 2, and hot-press welding head 3 according to an exemplary embodiment of the present invention is shown.

[0046] like Figures 1 to 10 As shown, in an exemplary embodiment of the present invention, a hot-press welding method is disclosed. The hot-press welding method includes the following steps:

[0047] S10: As Figure 1 As shown, a circuit board 1 is provided and the circuit board 1 is positioned on a horizontal reference plane P;

[0048] S20: As Figure 2 As shown, the distance from each pad 10 on the circuit board 1 to the predetermined horizontal plane P1 is detected. The predetermined horizontal plane P1 is located above the circuit board 1 and is a first distance d1 away from the horizontal reference plane P.

[0049] S30: As Figures 3 to 6 As shown, a fitting line S is generated based on the detected distance of each pad 10 to the predetermined horizontal plane P1 and the position of each pad 10 in the horizontal direction.

[0050] S40: As Figure 7 As shown, multiple wires 2 are provided and the soldering ends of the multiple wires 2 are respectively positioned on multiple solder pads 10 of the circuit board 1;

[0051] S50: such as Figure 8 As shown, a hot press welding head 3 is provided and positioned at a predetermined height above the circuit board 1, the predetermined height being a second distance d2 from the horizontal reference plane P;

[0052] S60: As Figure 8 As shown, the actual moving distance d4 of the hot-press welding head 3 is calculated based on the generated fitting line S and the preset moving distance d3 along the height direction of the hot-press welding head 3; and

[0053] S70: As Figure 9As shown, the hot press welding head 3 moves an actual distance d4 along the height direction toward the circuit board 1, so that the welding end of each wire 2 is reliably pressed and welded to the corresponding pad 10 by the hot press welding head 3.

[0054] exist Figure 3 In the illustrated embodiment, the thickness of circuit board 1 is less than its preset thickness, but the surface of circuit board 1 remains horizontal. Therefore, the fitting line S is a horizontal straight line parallel to the predetermined horizontal plane P1. At this time, there is a difference Δd between the maximum distance d5 from the fitting line S to the predetermined horizontal plane P1 and the preset distance d6 from the pad 10 of circuit board 1 to the predetermined horizontal plane P1. Theoretically, if circuit board 1 has no errors, the maximum distance d5 from the fitting line S to the predetermined horizontal plane P1 should be equal to the preset distance d6 from the pad 10 of circuit board 1 to the predetermined horizontal plane P1. That is, theoretically, the fitting line S should coincide with the horizontal straight line represented by the dashed line in the figure.

[0055] exist Figure 4 In the illustrated embodiment, the surface of circuit board 1 is not horizontal but concave. Therefore, the fitting line S is a downward-concave arc. At this time, there is a difference Δd between the maximum distance d5 from the fitting line S to the predetermined horizontal plane P1 and the preset distance d6 from the pad 10 of circuit board 1 to the predetermined horizontal plane P1.

[0056] exist Figure 5 In the illustrated embodiment, the surface of circuit board 1 is not horizontal but convex. Therefore, the fitting line S is an upwardly convex arc. At this time, there is a difference Δd between the maximum distance d5 from the fitting line S to the predetermined horizontal plane P1 and the preset distance d6 from the pad 10 of circuit board 1 to the predetermined horizontal plane P1.

[0057] exist Figure 6 In the illustrated embodiment, the surface of circuit board 1 is not horizontal but inclined. Therefore, the fitting line S is an inclined line. At this time, there is a difference Δd between the maximum distance d5 from the fitting line S to the predetermined horizontal plane P1 and the preset distance d6 from the pad 10 of circuit board 1 to the predetermined horizontal plane P1.

[0058] like Figures 1 to 6 As shown in the illustrated embodiment, the horizontal axis of the coordinate system containing the fitting line S represents the horizontal position of each pad 10, and the vertical axis represents the detected distance of each pad 10 to the predetermined horizontal plane P1. Thus, the fitting line S can be generated based on the horizontal position of each pad 10 and the distance of each pad 10 to the predetermined horizontal plane P1.

[0059] like Figures 1 to 10 As shown in the illustrated embodiment, the actual moving distance d4 of the hot-press welding head 3 can be calculated according to the following formula:

[0060] d4 = d3 + Δd; where

[0061] △d is the difference between the maximum distance d5 from the fitted line S to the predetermined horizontal plane P1 and the preset distance d6 from the pad 10 of the circuit board 1 to the predetermined horizontal plane P1.

[0062] like Figures 1 to 10 As shown in the illustrated embodiment, step S20 includes: providing multiple sensors 4 corresponding to multiple pads 10 on the circuit board 1, and simultaneously detecting the distance from the multiple pads 10 on the circuit board 1 to a predetermined horizontal plane P1 using the multiple sensors 4. This can improve detection efficiency, but it will increase costs.

[0063] However, the present invention is not limited to the illustrated embodiments. For example, in another exemplary embodiment of the present invention, step S20 may include: providing a single sensor 4 and using the single sensor 4 to detect the distance from a plurality of pads 10 on the circuit board 1 to a predetermined horizontal plane P1 one by one. This can reduce costs, but it will also reduce detection efficiency.

[0064] like Figures 1 to 10 As shown, in the illustrated embodiment, sensor 4 can be a laser distance sensor.

[0065] like Figures 1 to 10 As shown in the illustrated embodiment, the hot-press welding head 3 can undergo elastic deformation when pressed, so as to ensure that the welding ends of multiple wires 2 positioned at different heights can be reliably pressed against multiple pads 10 on the circuit board 1 at the same time.

[0066] like Figures 1 to 10 As shown, in another exemplary embodiment of the present invention, a hot-press welding system is also disclosed. This hot-press welding system includes: a hot-press welding head 3, a distance detection device, a fitting line generator (not shown), a distance calculation device (not shown), and a welding head moving device (not shown). The hot-press welding head 3 is used to simultaneously press and weld the welding ends of multiple wires 2 to multiple pads 10 on a circuit board 1. The distance detection device is used to detect the distance of each pad 10 on the circuit board 1 to a predetermined horizontal plane P1. The fitting line generator generates a fitting line S based on the distances of each pad 10 detected by the distance detection device and the horizontal positions of each pad 10. The distance calculation device calculates the actual moving distance d4 of the hot-press welding head 3 based on the generated fitting line S and a preset moving distance d3 of the hot-press welding head 3 in the height direction. The welding head moving device is used to drive the hot-press welding head 3 to move the actual moving distance d4 towards the circuit board 1 along the height direction.

[0067] In the foregoing embodiments, the fitting line generator and the distance calculation device can be a combination of hardware and software functional devices, such as an industrial control computer running fitting software or calculation software.

[0068] like Figures 1 to 10 As shown in the illustrated embodiment, the actual distance traveled, d4, is calculated according to the following formula:

[0069] d4 = d3 + Δd; where

[0070] △d is the difference between the maximum distance d5 from the fitted line S to the predetermined horizontal plane P1 and the preset distance d6 from the pad 10 of the circuit board 1 to the predetermined horizontal plane P1.

[0071] like Figures 1 to 10 As shown in the illustrated embodiment, the distance detection device includes multiple sensors 4, which correspond to multiple pads 10 on the circuit board 1, and are used to simultaneously detect the distance from the multiple pads 10 on the circuit board 1 to a predetermined horizontal plane P1.

[0072] like Figures 1 to 10 As shown in the illustrated embodiment, the distance detection device includes a single sensor 4, and the hot press welding system also includes a sensor moving device for moving the single sensor 4 in a horizontal direction to detect the distance of the plurality of pads 10 on the circuit board 1 to a predetermined horizontal plane P1 one by one through the single sensor 4.

[0073] like Figures 1 to 10 As shown in the illustrated embodiment, sensor 4 is a laser distance sensor.

[0074] like Figures 1 to 10 As shown in the illustrated embodiment, the hot-press welding head 3 can undergo elastic deformation when pressed, so as to ensure that the welding ends of multiple wires 2 positioned at different heights can be reliably pressed against multiple pads 10 on the circuit board 1 at the same time.

[0075] like Figures 1 to 10 As shown in the illustrated embodiment, the hot press welding system further includes: a circuit board fixing clamp (not shown) and a wire fixing clamp (not shown). The circuit board fixing clamp is used to fix and position the circuit board 1. The wire fixing clamp is used to fix and position a plurality of wires 2, such that the welding ends of the plurality of wires 2 are respectively positioned on a plurality of pads 10 of the circuit board 1.

[0076] Those skilled in the art will understand that the embodiments described above are exemplary and can be improved upon. The structures described in the various embodiments can be freely combined without causing structural or principle conflicts, and these changes should fall within the protection scope of this invention.

[0077] Although the invention has been described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to illustrate preferred embodiments of the invention and should not be construed as limiting the invention.

[0078] While some embodiments of the general concept of the invention have been shown and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the general concept of the invention, the scope of which is defined by the claims and their equivalents.

[0079] It should be noted that the word "comprising" does not exclude other elements or steps, and the words "a" or "an" do not exclude multiple elements. Furthermore, any reference numerals in the claims should not be construed as limiting the scope of the invention.

Claims

1. A hot-press welding method, characterized in that, Includes the following steps: S10: Provide a circuit board (1) and position the circuit board (1) on a horizontal reference plane (P); S20: Detect the distance from each pad (10) on the circuit board (1) to a predetermined horizontal plane (P1), the predetermined horizontal plane (P1) being located above the circuit board (1) and at a first distance d1 from the horizontal reference plane (P); S30: Generate a fitting line (S) based on the detected distance of each pad (10) to the predetermined horizontal plane (P1) and the position of each pad in the horizontal direction; S40: Provide multiple wires (2) and position the solder ends of the multiple wires (2) on multiple pads (10) of the circuit board (1); S50: Provide a hot press welding head (3) and position the hot press welding head (3) at a predetermined height position above the circuit board (1), the predetermined height position being a second distance d2 from the horizontal reference plane (P); S60: Calculate the actual moving distance d4 of the hot press welding head (3) based on the generated fitting line (S) and the preset moving distance d3 of the hot press welding head along the height direction; and S70: Drive the hot press welding head (3) to move the actual moving distance d4 along the height direction toward the circuit board (1), so that the welding end of each wire (2) is reliably pressed and welded to the corresponding pad (10) by the hot press welding head (3).

2. The hot-press welding method according to claim 1, characterized in that: The actual distance traveled, d4, is calculated according to the following formula: d4 = d3 + Δd; in △d is the difference between the maximum distance d5 from the fitted line (S) to the predetermined horizontal plane (P1) and the preset distance d6 from the pad (10) of the circuit board (1) to the predetermined horizontal plane (P1).

3. The hot-press welding method according to claim 1, characterized in that, Step S20 includes: Provide multiple sensors (4) corresponding to multiple pads (10) on the circuit board (1) and use the multiple sensors (4) to simultaneously detect the distance from the multiple pads (10) on the circuit board (1) to the predetermined horizontal plane (P1).

4. The hot-press welding method according to claim 1, characterized in that, Step S20 includes: A single sensor (4) is provided and the distance from multiple pads (10) on the circuit board (1) to the predetermined horizontal plane (P1) is detected one by one using the single sensor (4).

5. The hot-press welding method according to claim 3 or 4, characterized in that: The sensor (4) is a laser distance sensor.

6. The hot-press welding method according to claim 1, characterized in that: The hot-press welding head (3) can undergo elastic deformation when pressed, so as to ensure that the welding ends of multiple wires (2) positioned at different heights can be reliably pressed against multiple pads (10) on the circuit board (1) at the same time.

7. A hot-press welding system, characterized in that, include: The hot press welding head (3) is used to simultaneously press and weld the welding ends of multiple wires (2) onto multiple pads (10) of the circuit board (1); A distance detection device is used to detect the distance from each pad (10) on the circuit board (1) to a predetermined horizontal plane (P1); The fitting line generator generates a fitting line (S) based on the distance of each pad (10) detected by the distance detection device and the position of each pad (10) in the horizontal direction. The distance calculation device calculates the actual moving distance d4 of the hot press welding head (3) based on the generated fitting line (S) and the preset moving distance d3 of the hot press welding head (3) in the height direction; and A welding head moving device is used to drive the hot-press welding head (3) to move the actual moving distance d4 along the height direction toward the circuit board (1).

8. The hot-press welding system according to claim 7, characterized in that: The actual distance traveled, d4, is calculated according to the following formula: d4 = d3 + Δd; in △d is the difference between the maximum distance d5 from the fitted line (S) to the predetermined horizontal plane (P1) and the preset distance d6 from the pad (10) of the circuit board (1) to the predetermined horizontal plane (P1).

9. The hot-press welding system according to claim 7, characterized in that: The distance detection device includes multiple sensors (4), which correspond to multiple pads (10) on the circuit board (1) and are used to simultaneously detect the distance from the multiple pads (10) on the circuit board (1) to the predetermined horizontal plane (P1).

10. The hot-press welding system according to claim 7, characterized in that: The distance detection device includes a single sensor (4), and the hot press welding system further includes a sensor moving device for moving the single sensor (4) in a horizontal direction to detect the distance from a plurality of pads (10) on the circuit board (1) to the predetermined horizontal plane (P1) one by one through the single sensor (4).

11. The hot-press welding system according to claim 9 or 10, characterized in that: The sensor (4) is a laser distance sensor.

12. The hot-press welding system according to claim 7, characterized in that: The hot-press welding head (3) can undergo elastic deformation when pressed, so as to ensure that the welding ends of multiple wires (2) positioned at different heights can be reliably pressed against multiple pads (10) on the circuit board (1) at the same time.

13. The hot-press welding system according to claim 7, characterized in that, Also includes: A circuit board fixing clamp is used to fix and position the circuit board (1); and A wire fixing clamp is used to fix and position multiple wires (2) such that the solder ends of the multiple wires (2) are respectively positioned on multiple pads (10) of the circuit board (1).

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