Vacuum pump for semiconductor manufacturing

Abstract

The invention discloses a vacuum pump for semiconductor manufacturing, and relates to the technical field of semiconductor manufacturing, and the vacuum pump comprises a water tank, the top end of the water tank is provided with a driving motor, one end of the water tank close to the driving motor is provided with an exhaust pipe, the output end of the driving motor is in transmission connection with a pump body, the top end of the pump body is connected with a connecting pipe, and one end of the pump body is connected with an air inlet; according to the air pipe, external heating air is added along the air pipe body, so that the external heating air can circularly flow in the air circulating pipe, heating is achieved after electrification through the heating wire in the sleeving ring, drying and heating of the air inlet are achieved, and the air inlet is heated through the heating wire in the sleeving ring. According to the vacuum pump for semiconductor manufacturing, solid dust is prevented from entering the pump body to cause blockage and influence on normal use, dust accumulation in the pump body is prevented from occurring easily, and rapid treatment of the vacuum pump for semiconductor manufacturing on various vacuum process chamber gases in the whole process of wafer manufacturing, chip packaging testing and the like can be improved.

Description

A vacuum pump for semiconductor manufacturing Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, specifically a vacuum pump for semiconductor manufacturing. Background Technology

[0002] Vacuum pumps for semiconductor manufacturing are core vacuum equipment in semiconductor production lines. Their core function is to provide a precise, stable, and clean vacuum environment for various vacuum process chambers throughout the entire process of wafer manufacturing, chip packaging, and testing. At the same time, they enable vacuum pumping, pressure control, and extraction and treatment of harmful process waste gases and by-products in the process chambers. This is a prerequisite for achieving ultra-clean, high-precision, and high-consistency processes in semiconductor manufacturing.

[0003] After prolonged use, existing vacuum pumps used in semiconductor manufacturing may accumulate excessive dust inside the pump due to the chemical reaction of water mist contained in the pumped gas. This can lead to blockage of the vacuum pump and affect the accuracy of the equipment in semiconductor manufacturing, wafer testing, and wafer parameter measurement. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a vacuum pump for semiconductor manufacturing.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a vacuum pump for semiconductor manufacturing, comprising a water tank, a drive motor mounted on the top of the water tank, an exhaust pipe disposed near the end of the water tank close to the drive motor, a pump body drivenly connected to the output end of the drive motor, a connecting pipe connected to the top of the pump body, an air inlet connected to one end of the pump body, a heating and dehumidification mechanism extending to the outside disposed inside the air inlet, the heating and dehumidification mechanism comprising symmetrically distributed sleeve rings disposed on the surface of the air inlet, uniformly distributed heating wires disposed inside the sleeve rings, and symmetrically distributed air pipe bodies disposed at the top of the air inlet.

[0006] As described above, a first collar is provided on the surface of the trachea body, and a second collar is provided on the end of the trachea body surface near the first collar. A connecting rod extending into the interior of the second collar is connected to one end of the first collar, and the connecting rods are symmetrically distributed at one end of the first collar.

[0007] As described above, a trapezoidal block is provided inside the second collar, and triangular locking rods extending into the docking rod are provided on both sides of the trapezoidal block. One end of the two triangular locking rods is connected to a limiting plate, and a first spring is connected between the limiting plate and the second collar.

[0008] As described above, one end of the trapezoidal block is connected to a moving rod, the surface of the moving rod is provided with a spring baffle, a limiting rod is provided inside the second collar near the moving rod, and a second spring is connected between the limiting rod and the second collar.

[0009] As described above, the first and second rings are provided with adjusting rings on their surfaces. One end of the adjusting ring is provided with a guide rod extending into the interior of the first ring. A connecting frame is connected to the surface of the adjusting ring, and a push rod is provided at one end of the connecting frame.

[0010] As described above, one end of the push rod is connected to a push plate, a third spring is connected between the push plate and the connecting frame, and a gas circulation pipe connected to the air pipe body is provided inside the air inlet.

[0011] As described above, an auxiliary cleaning mechanism is provided inside the air inlet. The auxiliary cleaning mechanism includes a fixed frame disposed inside the air inlet. A drive motor is installed at one end of the air inlet. The output end of the drive motor is connected to a rotating rod extending into the fixed frame via a coupling. A rotating rod is disposed inside the fixed frame on the side near the rotating rod. A bevel gear set is connected between the rotating rod and the rotating rod.

[0012] As described above, the rotating rod surface is provided with uniformly distributed cleaning brushes, the rotating rod surface near the cleaning brush side is provided with a connecting block, the connecting block surface is connected with uniformly distributed connecting plates, a fixing plate is provided on one side of the connecting plate, the fixing plate is provided with a fixing rod connected to the fixing frame inside, one end of the fixing rod is fixedly connected with an arc plate, one end of the arc plate is fixedly connected with symmetrically distributed vertical rods, and one end of the vertical rods is connected with a cleaning plate.

[0013] As described above, an anti-adhesion mechanism is provided inside the air inlet on the side near the air pipe body. The anti-adhesion mechanism includes a crossbar provided on one side of the air pipe body, a connecting rod connected to the bottom end of the crossbar, and a movable block provided on the surface of the connecting rod.

[0014] As described above, a horizontal plate is connected to one side of the moving block, a triangular block is connected to the top of the horizontal plate, a striking seat is provided at the top of the triangular block, a fourth spring is connected between the striking seat and the connecting rod, and a rotating pressing rod is provided on the surface of the rotating rod near the rotating rod.

[0015] Compared with the prior art, the present invention has the following beneficial effects: First, the present invention connects two sleeve rings on the surface of the air inlet, and introduces external heated gas along the gas pipe body, so that it can circulate inside the gas circulation pipe, thereby drying the gas drawn from the air inlet. Moreover, the heating wire inside the sleeve ring is heated after being energized, which quickly dries the water mist in the gas entering the pump body, avoiding solid dust blockage after entering the pump body, which would affect normal use. This not only avoids dust accumulation inside, but also improves the rapid processing of various vacuum process chamber gases in the entire process of wafer manufacturing, chip packaging and testing by the vacuum pump for semiconductor manufacturing. This helps the equipment to test wafers and further improves the packaging effect and testing accuracy of the device.

[0016] Second, the present invention drives the cleaning brush and cleaning plate to rotate through the output end of the drive motor, so that the cleaning plate can clean the gas circulation pipe when rotating. As the connecting block rotates continuously, it can separate from the fixed plate during the rotation process, so that it can drive the cleaning plate to reset again, thereby completing the reciprocating cleaning. This avoids impurities in the gas drawn from the air inlet from adhering to the surface of the gas circulation pipe and affecting the heating treatment effect.

[0017] Third, this invention uses a drive motor to push the striking base, and the striking base can squeeze the fourth spring when it moves. Then, through the reset effect of the fourth spring, the striking base can be reset, thereby striking one side of the gas circulation tube to avoid surface adhesion. With the operation of the auxiliary cleaning mechanism, multiple cleaning can be achieved, which can effectively avoid the reduction of drying function due to adhesion, improve the overall efficiency of vacuum pumps used in wafer testing in semiconductor manufacturing, and further help to achieve ultra-clean, high-precision and high-consistency processes in semiconductor manufacturing.

[0018] Other advantages, objectives and features of the invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination or study, or may be learned from the practice of the invention. Attached Figure Description

[0019] Figure 1 is a three-dimensional structural schematic diagram of the water tank of the present invention; Figure 2 is a three-dimensional structural schematic diagram of the air inlet of the present invention; Figure 3 is a three-dimensional structural schematic diagram of the heating wire of the present invention; Figure 4 is a three-dimensional cross-sectional structural schematic diagram of the second ring of the present invention; Figure 5 is a three-dimensional cross-sectional structural schematic diagram of the air inlet of the present invention; Figure 6 is a three-dimensional structural schematic diagram of the gas circulation pipe of the present invention; Figure 7 is a three-dimensional structural schematic diagram of the connecting block of the present invention; Figure 8 is a three-dimensional structural schematic diagram of the striking seat of the present invention; Figure 9 is a partially enlarged structural schematic diagram of point A in Figure 5 of the present invention.

[0020] In the diagram: 1. Water tank; 2. Drive motor; 3. Exhaust pipe; 4. Pump body; 5. Connecting pipe; 6. Air inlet; 7. Heating and dehumidifying mechanism; 701. Sleeve ring; 702. Heating wire; 703. Air pipe body; 704. First sleeve ring; 705. Second sleeve ring; 706. Connecting rod; 707. Trapezoidal block; 708. Triangular locking rod; 709. Limiting plate; 710. First spring; 711. Moving rod; 712. Spring baffle; 713. Limiting rod; 714. Second spring; 715. Adjusting ring; 716. Guide rod; 717. Connecting frame; 718. Push rod; 719. Push plate; 720. Third spring; 721. Gas circulation pipe; 8. Auxiliary cleaning mechanism; 801. Fixed frame; 802. Drive motor; 803. Rotating rod; 804. Rotating rod; 805. Bevel gear set; 806. Cleaning brush; 807. Connecting block; 808. Connecting plate; 809. Fixed plate; 810. Fixed rod; 811. Arc plate; 812. Vertical rod; 813. Cleaning plate; 9. Anti-adhesion mechanism; 901. Horizontal rod; 902. Connecting rod; 903. Moving block; 904. Horizontal plate; 905. Triangular block; 906. Striking seat; 907. Fourth spring; 908. Rotating extrusion rod. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] As shown in Figures 1-5, the present invention provides a vacuum pump technical solution for semiconductor manufacturing: a vacuum pump for semiconductor manufacturing includes a water tank 1, a drive motor 2 installed at the top of the water tank 1, an exhaust pipe 3 provided at the end of the water tank 1 near the drive motor 2, a pump body 4 connected to the output end of the drive motor 2, a connecting pipe 5 connected to the top of the pump body 4, an air inlet 6 connected to one end of the pump body 4, a heating and dehumidification mechanism 7 extending to the outside provided inside the air inlet 6, the heating and dehumidification mechanism 7 includes a sleeve ring 701 symmetrically distributed on the surface of the air inlet 6, a uniformly distributed heating wire 702 provided inside the sleeve ring 701, and a symmetrically distributed air pipe body 703 provided at the top of the air inlet 6.

[0023] As shown in Figure 4, a first collar 704 is provided on the surface of the trachea body 703, and a second collar 705 is provided on the end of the trachea body 703 near the first collar 704. A connecting rod 706 extending into the interior of the second collar 705 is connected to one end of the first collar 704. The connecting rods 706 are symmetrically distributed at one end of the first collar 704. A trapezoidal block 707 is provided inside the second collar 705. Triangular locking rods 708 extending into the interior of the connecting rods 706 are provided on both sides of the trapezoidal block 707. A limiting plate 709 is connected to one end of the two triangular locking rods 708. A first spring 710 is connected between the limiting plate 709 and the second collar 705.

[0024] The triangular locking rod 708 is used to lock it to the docking rod 706.

[0025] As shown in Figure 4, a moving rod 711 is connected to one end of the trapezoidal block 707. A spring baffle 712 is provided on the surface of the moving rod 711. A limiting rod 713 is provided inside the second collar 705 near the moving rod 711. A second spring 714 is connected between the limiting rod 713 and the second collar 705. An adjusting ring 715 is provided on the surface of the first collar 704 and the second collar 705. A guide rod 716 extending into the first collar 704 is provided at one end of the adjusting ring 715. A connecting frame 717 is connected to the surface of the adjusting ring 715. A push rod 718 is provided at one end of the connecting frame 717. A push plate 719 is connected at one end of the push rod 718. A third spring 720 is connected between the push plate 719 and the connecting frame 717. A gas circulation pipe 721 connected to the air pipe body 703 is provided inside the air inlet 6.

[0026] By pushing the push rod 718, it can drive the push plate 719 to push the limiting rod 713, thereby adjusting the adjusting ring 715.

[0027] As shown in Figures 1-5, two connecting rings 701 are mated on the surface of the air inlet 6, allowing the connecting rings 701 to be fixed to the surface of the air inlet 6. Then, the first connecting ring 704 and the second connecting ring 705 are fitted onto the surface of the air pipe body 703, allowing the connecting rod 706 to be inserted into the second connecting ring 705, thereby limiting the first connecting ring 704 and the second connecting ring 705. By pulling the adjusting ring 715, the guide rod 716 can slide inside the first connecting ring 704, making the movement of the adjusting ring 715 more stable. When adjustment ring 715 moves to the bottom of the second ring 705, it pushes the moving rod 711 and the limiting rod 713, causing the moving rod 711 to move the trapezoidal block 707. Simultaneously, the trapezoidal block 707 pushes the triangular locking rods 708 on both sides, causing the triangular locking rods 708 to move and press the limiting plate 709 against the first spring 710. The triangular locking rods 708 also lock with the docking rod 706. Furthermore, after adjustment ring 715 moves to a certain position, the limiting rod 713 can be reset by the second spring 714. This allows the limiting rod 713 to engage with the adjusting ring 715, fixing the first ring 704 and the second ring 705 together. Conversely, pushing the push rod 718 pushes the limiting rod 713, and the moving limiting rod 713 compresses the second spring 714. Then, pulling the adjusting ring 715 rotates it to one end of the first ring 704, allowing external heated gas to be introduced along the gas pipe body 703, causing it to circulate inside the gas circulation pipe 721. Simultaneously, the inside of the gas circulation pipe 721... Heating the gas increases the internal temperature of the inlet 6, allowing for the drying of the gas drawn in through the inlet 6 and preventing excessive water mist from forming inside. Furthermore, the heating wire 702 inside the sleeve ring 701 is energized to further enhance the drying and heating of the inlet 6, rapidly drying the water mist in the incoming gas and preventing solid dust from clogging the pump body 4 and affecting normal operation. This not only prevents dust accumulation inside the pump but also improves the rapid processing of various vacuum process chamber gases throughout the entire process of wafer manufacturing, chip packaging and testing by the vacuum pump used in semiconductor manufacturing.

[0028] As shown in Figure 9, an auxiliary cleaning mechanism 8 is provided inside the air inlet 6. The auxiliary cleaning mechanism 8 includes a fixed frame 801 disposed inside the air inlet 6. A drive motor 802 is installed at one end of the air inlet 6. The output end of the drive motor 802 is connected to a rotating rod 803 extending into the fixed frame 801 via a coupling. A rotating rod 804 is disposed inside the fixed frame 801 near the rotating rod 803. A bevel gear set 805 is connected between the rotating rod 804 and the rotating rod 803. The surface of the rotating rod 804 is uniformly coated with... The cleaning brushes 806 are distributed. A connecting block 807 is provided on the surface of the rotating rod 804 near the cleaning brush 806. A connecting plate 808 is evenly distributed on the surface of the connecting block 807. A fixing plate 809 is provided on one side of the connecting plate 808. A fixing rod 810 connected to the fixing frame 801 is provided inside the fixing plate 809. An arc plate 811 is fixedly connected to one end of the fixing rod 810. A symmetrically distributed vertical rod 812 is fixedly connected to one end of the arc plate 811. A cleaning plate 813 is connected to one end of the vertical rod 812.

[0029] The drive motor 802 enables the cleaning brush 806 to clean the inside of the gas circulation pipe 721, and at the same time enables the cleaning plate 813 to clean the outside of the gas circulation pipe 721.

[0030] As shown in Figures 1, 6-7, and 9, by starting the drive motor 802, the output end of the drive motor 802 drives the rotating rod 803 to rotate. The rotating rod 803, in turn, drives the bevel gear set 805 to rotate. Simultaneously, the bevel gear set 805 drives the rotating rod 804 to rotate, which in turn drives the surface cleaning brush 806 to rotate. The cleaning brush 806 then cleans the inside of the gas circulation pipe 721. Simultaneously, the rotating rod 804 also drives the connecting block 807 to rotate, which in turn drives the surface connecting plate 808 to rotate. When the connecting plate 808 rotates, it can push the fixing plate 809. At the same time, the fixing plate 809 can slide on the surface of the fixing rod 810, so that when the fixing plate 809 rotates, it can drive the arc plate 811, the vertical rod 812 and the cleaning plate 813 to rotate. When the cleaning plate 813 rotates, it can clean the outside of the gas circulation pipe 721. As the connecting block 807 rotates continuously, it can separate from the fixing plate 809 during the rotation process, so that it can drive the cleaning plate 813 to reset. Then, the reciprocating cleaning is completed, which prevents impurities in the gas drawn from the air inlet 6 from adhering to the surface of the gas circulation pipe 721 and affecting the heating treatment effect.

[0031] As shown in Figure 8, an anti-adhesion mechanism 9 is provided inside the air inlet 6 on the side near the air pipe body 703. The anti-adhesion mechanism 9 includes a crossbar 901 on one side of the air pipe body 703. A connecting rod 902 is connected to the bottom end of the crossbar 901. A moving block 903 is provided on the surface of the connecting rod 902. A cross plate 904 is connected to one side of the moving block 903. A triangular block 905 is connected to the top of the cross plate 904. A striking seat 906 is provided at the top of the triangular block 905. A fourth spring 907 is connected between the striking seat 906 and the connecting rod 902. A rotating squeezing rod 908 is provided on the surface of the rotating rod 804 on the side near the rotating rod 803.

[0032] The rotating extrusion rod 908 can drive the triangular block 905 to push the striking seat 906 back and forth, so that the striking seat 906 can strike one side of the gas circulation pipe 721.

[0033] As shown in Figures 1 and 8, the starting of the drive motor 802 drives the rotating extrusion rod 908 on the surface of the rotating rod 804 to rotate. When the rotating extrusion rod 908 rotates, it pushes the horizontal plate 904. When the horizontal plate 904 moves, it drives the moving block 903 to move on the surface of the connecting rod 902. At the same time, when the horizontal plate 904 moves, it drives the triangular block 905 to move. When the triangular block 905 moves, it pushes the striking seat 906. When the striking seat 906 moves, it squeezes the fourth spring 907. When the rotating extrusion rod 908 rotates and separates from the horizontal plate 904, the fourth spring 907 resets the striking seat 906, thus striking one side of the gas circulation pipe 721 to prevent surface adhesion. With the operation of the auxiliary cleaning mechanism 8, multiple cleaning is achieved, which can effectively prevent the drying function from being reduced due to adhesion.

[0034] Working principle: Two connecting rings 701 are mated on the surface of the air inlet 6. Then, the first connecting ring 704 and the second connecting ring 705 are fitted onto the surface of the gas pipe body 703. External heated gas is introduced along the gas pipe body 703, allowing it to circulate inside the gas circulation pipe 721. This dries the gas drawn from the air inlet 6, preventing excessive water mist inside. The heating wire 702 inside the connecting ring 701 is energized to further enhance the drying and heating of the air inlet 6. This improves the rapid processing of various vacuum process chamber gases in the entire process of wafer manufacturing, chip packaging and testing by the vacuum pump used in semiconductor manufacturing. The output of the drive motor 802 drives the cleaning brush 806 and the cleaning plate 813 to rotate, allowing them to clean the gas circulation pipe 721 and prevent impurities in the gas drawn from the air inlet 6 from adhering to the surface of the gas circulation pipe 721. This ensures the accuracy of the equipment for semiconductor manufacturing, wafer testing, and wafer parameters.

[0035] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vacuum pump for semiconductor manufacturing, comprising a water tank (1), characterized in that, A drive motor (2) is installed at the top of the water tank (1). An exhaust pipe (3) is provided at the end of the water tank (1) near the drive motor (2). A pump body (4) is connected to the output end of the drive motor (2). A connecting pipe (5) is connected to the top of the pump body (4). An air inlet (6) is connected to one end of the pump body (4). A heating and dehumidifying mechanism (7) extending to the outside is provided inside the air inlet (6). The heating and dehumidifying mechanism (7) includes a sleeve ring (701) symmetrically distributed on the surface of the air inlet (6). A heating wire (702) is uniformly distributed inside the sleeve ring (701). A gas circulation pipe (721) connected to the air pipe body (703) is provided inside the air inlet (6).

2. The vacuum pump for semiconductor manufacturing according to claim 1, characterized in that: The tracheal body (703) is provided with a first collar (704) on its surface, and a second collar (705) is provided on the end of the tracheal body (703) near the first collar (704). A connecting rod (706) extending into the second collar (705) is connected to one end of the first collar (704), and the connecting rod (706) is symmetrically distributed at one end of the first collar (704).

3. A vacuum pump for semiconductor manufacturing according to claim 2, characterized in that: The second collar (705) is provided with a trapezoidal block (707) inside. Both sides of the trapezoidal block (707) are provided with triangular locking rods (708) extending into the docking rod (706). One end of the two triangular locking rods (708) is connected to a limiting plate (709). A first spring (710) is connected between the limiting plate (709) and the second collar (705).

4. A vacuum pump for semiconductor manufacturing according to claim 3, characterized in that: One end of the trapezoidal block (707) is connected to a moving rod (711), and a spring baffle (712) is provided on the surface of the moving rod (711). A limiting rod (713) is provided inside the second collar (705) on the side near the moving rod (711), and a second spring (714) is connected between the limiting rod (713) and the second collar (705).

5. A vacuum pump for semiconductor manufacturing according to claim 2, characterized in that: The first collar (704) and the second collar (705) are provided with adjusting rings (715). One end of the adjusting ring (715) is provided with a guide rod (716) extending into the interior of the first collar (704). A connecting frame (717) is connected to the surface of the adjusting ring (715). One end of the connecting frame (717) is provided with a push rod (718).

6. A vacuum pump for semiconductor manufacturing according to claim 5, characterized in that: One end of the push rod (718) is connected to a push plate (719), and a third spring (720) is connected between the push plate (719) and the connecting frame (717). The air inlet (6) is provided with a gas circulation pipe (721) connected to the air pipe body (703).

7. A vacuum pump for semiconductor manufacturing according to claim 1, characterized in that: An auxiliary cleaning mechanism (8) is provided inside the air inlet (6). The auxiliary cleaning mechanism (8) includes a fixed frame (801) provided inside the air inlet (6). A drive motor (802) is installed at one end of the air inlet (6). The output end of the drive motor (802) is connected to a rotating rod (803) extending into the fixed frame (801) via a coupling. A rotating rod (804) is provided inside the fixed frame (801) on the side near the rotating rod (803). A bevel gear set (805) is connected between the rotating rod (804) and the rotating rod (803).

8. A vacuum pump for semiconductor manufacturing according to claim 7, characterized in that: The rotating rod (804) is provided with a uniformly distributed cleaning brush (806) on its surface. A connecting block (807) is provided on the side of the rotating rod (804) near the cleaning brush (806). A uniformly distributed connecting plate (808) is connected to the surface of the connecting block (807). A fixing plate (809) is provided on one side of the connecting plate (808). A fixing rod (810) connected to the fixing frame (801) is provided inside the fixing plate (809). An arc plate (811) is fixedly connected to one end of the fixing rod (810). A symmetrically distributed vertical rod (812) is fixedly connected to one end of the arc plate (811). A cleaning plate (813) is connected to one end of the vertical rod (812).

9. A vacuum pump for semiconductor manufacturing according to claim 7, characterized in that: An anti-adhesion mechanism (9) is provided inside the air inlet (6) on the side near the air pipe body (703). The anti-adhesion mechanism (9) includes a crossbar (901) provided on one side of the air pipe body (703). A connecting rod (902) is connected to the bottom end of the crossbar (901). A moving block (903) is provided on the surface of the connecting rod (902).

10. A vacuum pump for semiconductor manufacturing according to claim 9, characterized in that: A horizontal plate (904) is connected to one side of the moving block (903), a triangular block (905) is connected to the top of the horizontal plate (904), a striking seat (906) is provided at the top of the triangular block (905), a fourth spring (907) is connected between the striking seat (906) and the connecting rod (902), and a rotating pressing rod (908) is provided on the surface of the rotating rod (804) near the rotating rod (803).

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