Parameter configuration method and related equipment

Abstract

The embodiment of the invention provides a parameter configuration method and related equipment, is applied to communication equipment comprising a serializer / deserializer SerDes, and comprises the following steps: when the communication equipment is in a warm standby state, acquiring a current environment temperature; according to the current environment temperature and a first corresponding relation, a target SerDes parameter corresponding to the current environment temperature is determined, and the first corresponding relation comprises the first SerDes parameter corresponding to each temperature range in the multiple temperature ranges. And configuring a target SerDes parameter for the SerDes.

Description

Technical Field

[0001] This application relates to the field of communications, and more particularly to a parameter configuration method and related equipment. Background Technology

[0002] In communication systems, to ensure the continuity and reliability of data transmission, two or more communication devices are typically configured (one as the primary device and the rest as backup devices) to achieve redundancy. The primary device handles normal communication tasks, while the backup devices are in standby mode, ready to take over the work of the primary device at any time. When the primary device fails or its performance degrades, the system detects this change and triggers a switching mechanism to transfer the communication tasks to the backup devices.

[0003] Warm standby is an energy-efficient backup state where the standby device consumes less power while maintaining the ability to quickly resume operation when needed, ensuring rapid takeover. The serializer / deserializer (SerDes) parameters determine the performance and characteristics of SerDes, which are crucial for ensuring accurate and efficient reception and decoding of transmitted data. Once in warm standby mode, the standby device will not adaptively change the SerDes parameters.

[0004] However, the suitable SerDes parameters vary greatly depending on the ambient temperature. If the ambient temperature during the primary / standby switchover is significantly different from the ambient temperature when the standby device enters the warm standby state, the standby device needs to adaptively adjust the SerDes parameters, which takes a lot of time and thus affects the link signal quality. Summary of the Invention

[0005] This application provides a parameter configuration method and related equipment to avoid the situation where the standby equipment takes too long to adaptively adjust the SerDes parameters during primary / standby switchover, thus affecting the link signal quality.

[0006] The first aspect of this application provides a parameter configuration method applicable to communication devices including SerDes:

[0007] When the communication device is in temperature standby mode, the current ambient temperature is obtained. After obtaining the current ambient temperature, the target SerDes parameter corresponding to the current ambient temperature is determined according to the current ambient temperature and the first correspondence relationship, where the first correspondence relationship includes the first SerDes parameter corresponding to each of multiple temperature ranges. Finally, the target SerDes parameter is configured for SerDes.

[0008] In this application, after the backup board enters the temperature standby state, the current ambient temperature is obtained in real time, and the SerDes parameter suitable for the current ambient temperature is determined according to the correspondence between the current ambient temperature and the temperature range and the SerDes parameter. The SerDes parameter is then configured, so that when the backup board exits the temperature standby state, its SerDes parameter is matched with the current ambient temperature, and no adaptive adjustment is required, thus avoiding affecting the link quality.

[0009] In one possible implementation, the communication device also includes a logic chip and a network processor (NP) chip.

[0010] The logic chip acquires the switching information, which instructs the communication device to switch to the master device. The logic chip sends the switching information to the NP chip via the inter-integrated circuit (I2C) bus, and the NP chip activates the SerDes based on the switching information.

[0011] In this application, when a primary / standby switchover is required, the logic chip can directly instruct the NP chip to open the SerDes via the I2C bus, without needing to instruct it via the CPU, thereby improving the speed of opening the SerDes and reducing the impact on services.

[0012] In one possible implementation, the method also includes:

[0013] Obtain a second correspondence, which includes the second SerDes parameter corresponding to each of the multiple temperature ranges. Adjust the initial correspondence to obtain a first correspondence. The adjustment process includes adjusting the second SerDes parameter whose eye diagram quality data does not meet the preset conditions, so that the eye diagram quality data corresponding to the adjusted second SerDes parameter meets the preset conditions.

[0014] In this application, the correspondence between the temperature range and the SerDes parameter of the initial version is first obtained. Then, based on the eye diagram quality data, the SerDes parameter in the correspondence of the initial version is adjusted to obtain the required first correspondence, thereby improving the quality of the SerDes parameter and thus improving the link quality.

[0015] In one possible implementation, a reference SerDes parameter is determined based on at least one of the SerDes type, the SerDes trace length, and the type of communication device, and then a second correspondence is determined based on the reference SerDes parameter.

[0016] In this application, a baseline SerDes parameter is determined based on the inherent properties of the SerDes link. Then, the baseline SerDes parameter is adjusted for different temperature ranges to obtain the SerDes parameter corresponding to each temperature range. This ensures that the initial SerDes parameter is applicable to the SerDes link and reduces the overhead of adjustment processing.

[0017] In one possible implementation, the SerDes parameter includes at least one of the pre-emphasis coefficient and the pre-equilibrium coefficient.

[0018] In one possible implementation, the communication device is a single-board unit.

[0019] A second aspect of this application provides a communication device including a SerDes, comprising an acquisition unit and a processing unit;

[0020] The acquisition unit is used to acquire the current ambient temperature when the communication device is in temperature standby mode;

[0021] The processing unit is used to determine the target SerDes parameter corresponding to the current ambient temperature based on the current ambient temperature and the first correspondence relationship. The first correspondence relationship includes the first SerDes parameter corresponding to each of the multiple temperature ranges.

[0022] The processing unit is also used to configure target SerDes parameters for SerDes.

[0023] In one possible implementation,

[0024] The acquisition unit is also used to acquire a second correspondence, which includes a second SerDes parameter corresponding to each of the multiple temperature ranges;

[0025] The processing unit is also used to adjust the initial correspondence to obtain the first correspondence. The adjustment process includes adjusting the second SerDes parameter that does not conform to the preset condition, so that the eye diagram quality data corresponding to the adjusted second SerDes parameter conforms to the preset condition.

[0026] In one possible implementation,

[0027] The acquisition unit is specifically used to determine the reference SerDes parameters based on at least one of the following: the type of SerDes, the trace length of SerDes, and the type of communication device.

[0028] The acquisition unit is specifically used to determine the second correspondence based on the baseline SerDes parameters.

[0029] In one possible implementation, the SerDes parameter includes at least one of the pre-emphasis coefficient and the pre-equilibrium coefficient.

[0030] In one possible implementation, the communication device is a single-board unit.

[0031] A third aspect of this application provides a communication device including a processor and a memory, the processor being configured to execute instructions stored in the memory to cause the communication device to perform the method described in the first aspect above.

[0032] The fourth aspect of this application provides a communication device, including a SerDes, a logic chip, and an NP chip. The logic chip is used to send switching information to the NP chip via an I2C bus. The switching information is used to instruct the communication device to switch to a master device. The NP chip is used to turn on the SerDes according to the switching information.

[0033] The fifth aspect of this application provides a computer-readable storage medium including computer program instructions that, when executed, perform the method described in the first aspect above.

[0034] The sixth aspect of this application also provides a computer program product containing instructions that, when executed by a computer, cause the computer to perform the method described in the first aspect above. Attached Figure Description

[0035] Figure 1 This is a schematic diagram illustrating the application scenario in this application;

[0036] Figure 2 A schematic diagram of a SerDes link;

[0037] Figure 3 This is a flowchart illustrating the parameter configuration method in this application;

[0038] Figure 4 This is a schematic diagram of an NP chip;

[0039] Figure 5 This is a schematic diagram of the parameter configuration method in this application;

[0040] Figure 6 This is a schematic diagram of the parameter configuration method in this application;

[0041] Figure 7 A schematic diagram illustrating the primary / standby switchover process for a standby single board;

[0042] Figure 8 Another diagram illustrating the primary / backup switchover for a standby board;

[0043] Figure 9 This is a schematic diagram of the parameter configuration method in this application;

[0044] Figure 10 This is a schematic diagram of the communication device in this application;

[0045] Figure 11 This is another structural schematic diagram of the communication device in this application. Detailed Implementation

[0046] The embodiments of this application are described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. As those skilled in the art will understand, with the development of technology and the emergence of new scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0047] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0048] In this article, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0049] Furthermore, in the description of the embodiments of this application, unless otherwise stated, "multiple" refers to two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0050] This application can be applied to communication devices equipped with SerDes, located in a communication system with a master-slave failover mechanism, and used as a backup device. The master-slave failover mechanism is a high-availability system design designed to ensure network continuity and reliability. The master and backup devices are redundantly designed to ensure network stability and reliability. The master device handles normal network traffic and control tasks, while the backup device remains in standby mode, ready to take over the functions of the master device in case of failure. This design guarantees uninterrupted network service and improves system stability and reliability.

[0051] The aforementioned communication equipment can be a switch or a router, or, please refer to [link to relevant documentation]. Figure 1 If the aforementioned communication system is a distributed communication device, including a main board and a backup board, then the aforementioned communication device is a backup board. Physically, the main and backup boards are typically mounted on a backplane, which provides a platform for installing and connecting various boards and daughter cards. The backplane design considers factors such as thermal management, signal integrity, power distribution, and mechanical stability to ensure that all connected boards and daughter cards operate reliably.

[0052] Network daughter cards connect to the primary and backup boards via multiplexers (muxes) and demultiplexers (demuxers) to provide additional network functionality, such as connection to Ethernet ports. Specifically, communication between the backup board and the network daughter cards is via a SerDes link; please refer to [link to relevant documentation]. Figure 2 A SerDes link includes a SerDes transmitter and a SerDes receiver. Both the transmitter and receiver need to process the signal according to SerDes parameters. Specifically, the SerDes transmitter uses a pre-emphasis coefficient to preprocess the serial signal to be transmitted, and the SerDes receiver uses a pre-equalization coefficient to compensate for the received serial signal to obtain more accurate data. It can be understood that the backup board includes the aforementioned SerDes transmitter and receiver. The SerDes transmitter includes a serializer and a transmitter; its task is to convert the parallel data stream into a high-speed serial data stream for transmission through a medium (such as cable or optical fiber). The SerDes receiver includes a deserializer and a receiver; its task is to convert the received high-speed serial data stream back into a parallel data stream so that the receiving device can process the data.

[0053] The backup board is typically in warm standby mode, an energy-saving backup mode where the backup board disables SerDes to reduce power consumption. When the primary board fails, the backup board exits warm standby mode and becomes the primary board.

[0054] Please see Figure 3The following is a flowchart of the parameter configuration method in this application:

[0055] 301. When the communication equipment is in thermal standby mode, obtain the current ambient temperature;

[0056] by Figure 1 Taking the communication system shown as an example, the backup board can be configured to use SerDes parameters for SerDes links with other devices, such as the SerDes parameters used for two SerDes links with the network sub-card.

[0057] To facilitate the subsequent introduction, the relevant modules on the standby board will be introduced first:

[0058] The backup board includes an ambient temperature detection module, a physical port control module, a chip development kit (CDK), microcode, and a network processor (NP) chip. The ambient temperature detection module, for example, is a temperature sensor used to detect the current ambient temperature of the backup board. The physical port control module is a functional module of the central processing unit (CPU) on the backup board, used to control the connection and disconnection of the SerDes link connected to the backup board, including controlling the switching of the serializers and deserializers at both ends of the SerDes link. Please refer to [link to relevant documentation]. Figure 4 An NP chip is an integrated circuit specifically designed for network communication and packet processing. It is commonly used in network devices such as routers, switches, firewalls, and load balancers to improve the speed and efficiency of network data processing. Microcode is the firmware or software within the NP chip, used to control its behavior and processing logic. It defines how the processor hardware performs various operations, including instruction decoding, data path control, and register operations. The NP chip also runs a background thread detection component, which monitors and manages the system's running status. The NP chip also includes a SerDes register, used to configure and control the behavior of SerDes and monitor its status; SerDes parameters are stored in the SerDes register. Data exchange between the microcode and the SerDes register occurs via CP read and CP write. CP read indicates reading data from the SerDes register, while CP write indicates writing data to the SerDes register. The SerDes register can only be accessed indirectly, i.e., it cannot be directly accessed by the microcode.

[0059] Before entering warm standby mode, the standby board will obtain the first correspondence for each SerDes link. The first correspondence is shown in Table 1 below:

[0060] Table 1

[0061] Temperature range Pre-weighting coefficient Pre-equilibrium coefficient 0 to 10 degrees xxx xxx 10 to 20 degrees Celsius xxx xxx 20 to 30 degrees Celsius xxx xxx

[0062] As shown in Table 1, the first correspondence includes the first SerDes parameter corresponding to each of the multiple temperature ranges. The first SerDes parameter includes the pre-emphasis coefficient for the SerDes transmitter and the pre-equalization coefficient for the SerDes receiver. The first SerDes parameters corresponding to different temperature ranges may be the same or different. Generally speaking, the greater the difference in temperature ranges, the greater the difference in the corresponding first SerDes parameters.

[0063] The backup board can obtain the first mapping relationship for the SerDes link in the following way; please refer to [link / reference]. Figure 5 First, the physical port control module on the backup board determines the board type, the type of SerDes on the backup board, and the trace length of the SerDes link. The board type includes, for example, interface boards, switching boards, and routing switching boards; the SerDes type includes, for example, 5Gps SerDes, 10Gps SerDes, and 25Gps SerDes. Then, the physical port control module determines the baseline SerDes parameters based on the above information. These baseline SerDes parameters also include pre-emphasis coefficients and pre-equalization coefficients. The physical port control module obtains the second SerDes parameters corresponding to each of the multiple temperature ranges based on the baseline SerDes parameters. This information is denoted as the second correspondence. The second SerDes parameter corresponding to any temperature range is obtained by adjusting the baseline SerDes parameters according to that temperature range. The physical port control module then sends the second correspondence to the CDK on the CPU of the backup board. The CDK sends the second SerDes parameter corresponding to each temperature range to the NP chip. For any temperature range, the NP chip generates corresponding eye diagram quality data based on the second SerDes parameter. The CDK reads the eye diagram quality data. If the eye diagram quality data does not meet the preset conditions, there is no need to adjust the second SerDes parameter corresponding to that temperature range. If the eye diagram quality data does not meet the preset conditions, the second SerDes parameter is adjusted until the eye diagram quality data corresponding to the adjusted second SerDes parameter meets the preset conditions. After completing the above adjustment, the CDK sends the adjusted second correspondence to the physical port control module. The adjusted second correspondence is the aforementioned first correspondence.

[0064] After obtaining the first mapping, the backup board enters warm standby mode and disables SerDes, for example, disabling the SerDes link with the network sub-card's demux. Please refer to [link / reference]. Figure 6 After entering the temperature standby state, the standby board periodically obtains the current ambient temperature of the standby board through the ambient temperature detection module and sends the current ambient temperature to the physical port control module.

[0065] 302. Based on the current ambient temperature and the first correspondence, determine the target SerDes parameter corresponding to the current ambient temperature. The first correspondence includes the first SerDes parameter corresponding to each of the multiple temperature ranges.

[0066] After obtaining the current ambient temperature, the physical port control module determines the target SerDes parameter for the SerDes link based on the current ambient temperature and the first correspondence relationship between the SerDes link and the current ambient temperature. Specifically, the physical port control module determines the first SerDes parameter corresponding to the temperature range in the first correspondence relationship of the current ambient temperature as the target SerDes parameter. For example, if the current ambient temperature is 18 degrees Celsius, then the first SerDes parameter corresponding to the temperature range of "10 to 20 degrees Celsius" is determined as the target SerDes parameter.

[0067] 303. Configure the target SerDes parameters for serdes.

[0068] After determining the target SerDes parameters, the physical port control module sends the target SerDes parameters to the microcode, which then configures the target SerDes parameters into the registers of the NP chip. Taking the SerDes link between the backup board and the network daughter card's demux as an example, after determining the target SerDes parameters corresponding to this SerDes link, since the backup board is the receiver of this SerDes link, the pre-equalization coefficient of the SerDes receiver will be configured in the NP chip's register to be the pre-equalization coefficient in the aforementioned target SerDes parameters. In addition, the backup board can also configure the pre-emphasis coefficient of the SerDes transmitter on the demux to be the pre-emphasis coefficient in the aforementioned target SerDes parameters through the physical port control module. Similarly, taking the SerDes link between the backup board and the network daughter card's mux as an example, after determining the target SerDes parameters corresponding to this SerDes link, since the backup board is the transmitter of this SerDes link, the pre-equalization coefficient of the SerDes transmitter will be configured in the NP chip's register to be the pre-emphasis coefficient in the aforementioned target SerDes parameters. In addition, the backup board can also configure the pre-equalization coefficient of the SerDes receiver on the mux to be the pre-equalization coefficient in the aforementioned target SerDes parameters through the physical port control module.

[0069] In this way, after the backup board enters the warm standby state, it can continuously adjust the SerDes parameters according to the current ambient temperature. Therefore, when it needs to switch to the primary board and exit the warm standby state, even if the current ambient temperature has changed significantly from the ambient temperature when entering the warm standby state, it is not necessary to readjust the SerDes parameters again, thereby avoiding affecting the link quality.

[0070] This application also provides a method for quickly opening SerDes when switching from a backup board to a primary board. For comparison, the existing primary / backup switchover process is described below:

[0071] Please see Figure 7 The existing backup board has a logic chip, a CPU, and an NP chip. The CPU runs the board driver module, board service module, daughter card software, hardware abstraction layer (HAL), and CDK. The logic chip runs logic code, acquiring the presence and normal operation signals of each board, and performs primary / backup detection through internal judgment logic. When the primary board fails, the logic chip sends a backup-to-primary interrupt signal to the CPU. Upon receiving the backup-to-primary interrupt signal, the CPU's operating system detects the interrupt information and notifies the board driver module via interrupt subscription. The board driver detects the change in primary / backup role and notifies the board service module. The board service module further notifies each specific service unit of the primary / backup role change, including daughter card software and HAL, etc., which need to be aware of the primary / backup role change. In addition, the physical port control module on the CPU enables SerDes on the network daughter card. After the business unit detects the change in the primary and backup roles, it publishes a message to the NP chip through the peripheral component interconnect express (PCIE) bus. After the NP chip detects the message, it performs the corresponding business processing and enables the SerDes on the backup board.

[0072] Please refer to section 8. The following section describes the primary / backup switchover method of this application. Figure 8As shown, the logic chip of the backup board in this application also includes an I2C controller, which is used to manage and control the I2C bus between the logic chip and the NP chip. Similarly, the logic chip runs logic code, obtains the presence signal and normal operation signal of each board, and performs primary / backup detection through internal judgment logic. When the primary board fails, the logic chip sends a backup-to-primary interrupt signal to the CPU. After receiving the backup-to-primary interrupt signal, the CPU's operating system detects the interrupt information and then notifies the board driver module through interrupt subscription. The board driver detects the change in primary / backup role and then notifies the board service module. The board service module further notifies each specific service unit of the change in primary / backup role, including daughter card software and HAL, etc., which need to be aware of the change in primary / backup role. In addition, the physical port control module on the CPU will enable SerDes on the network daughter card. After the service unit detects the change in primary / backup role, it will publish a message to the NP chip through the PCIe bus. The logic chip also sends switching information to the NP chip via the I2C bus. This switching information instructs the backup board to switch to the primary board. The NP chip then opens the SerDes on the backup board based on the switching information. It's clear that in the above process, when the primary board fails, the logic chip sends a backup-to-primary interrupt signal to the CPU and simultaneously sends switching information to the NP chip. Therefore, the NP chip can directly open the SerDes on the backup board based on the switching information, without waiting for the CPU to issue a message via the PCIe bus, thus improving the speed of opening the SerDes.

[0073] In this application, by pre-obtaining the correspondence between temperature range and SerDes parameters, after the backup board enters temperature standby mode, it can determine and configure suitable SerDes parameters in real time based on the current ambient temperature and the aforementioned correspondence. Therefore, when the backup board exits temperature standby mode, its SerDes parameters are matched with the current ambient temperature, eliminating the need for adaptive adjustments and avoiding impact on link quality. Furthermore, the logic chip can directly instruct the NP chip to activate SerDes via the I2C bus in the event of a primary board failure, improving the speed of SerDes activation and reducing the impact on services.

[0074] The following describes another process for the parameter configuration method in this application:

[0075] 401. When the communication equipment is in thermal standby mode, obtain the current ambient temperature;

[0076] In this embodiment, for SerDes links with other devices, the backup board only adjusts the pre-emphasis coefficient of the SerDes transmitter on the SerDes link after entering warm standby mode. The following description takes the SerDes link between the backup board and the mux of the network sub-card as an example.

[0077] Similarly, before entering warm standby mode, the standby board will obtain the first correspondence for each SerDes link, as shown in Table 2 below:

[0078] Table 2

[0079] Temperature range Pre-weighting coefficient 0 to 10 degrees xxx 10 to 20 degrees Celsius xxx 20 to 30 degrees Celsius xxx

[0080] As shown in Table 2, the first correspondence includes the first SerDes parameter corresponding to each of the multiple temperature ranges. The first SerDes parameter includes the pre-emphasis coefficient used for the SerDes transmitter. The first SerDes parameters corresponding to different temperature ranges may be the same or different. Generally speaking, the greater the difference between the temperature ranges, the greater the difference between the corresponding first SerDes parameters.

[0081] Similarly, the backup board can obtain the first correspondence for the SerDes link as follows: First, the physical port control module on the backup board determines the board type, the type of SerDes on the backup board, and the trace length of the SerDes link. The board type includes, for example, interface boards, switching boards, and routing switching boards; the SerDes type includes, for example, 5Gps SerDes, 10Gps SerDes, and 25Gps SerDes. Then, the physical port control module determines the baseline SerDes parameters based on the above information. These baseline SerDes parameters also include a pre-emphasis factor. The physical port control module obtains the second SerDes parameters corresponding to each of the multiple temperature ranges based on the baseline SerDes parameters. This information is denoted as the second correspondence. The second SerDes parameter corresponding to any temperature range is obtained by adjusting the baseline SerDes parameters according to that temperature range. The physical port control module then sends the second correspondence to the CDK on the CPU of the backup board. The CDK sends the second SerDes parameter corresponding to each temperature range to the NP chip. For any temperature range, the NP chip generates corresponding eye diagram quality data based on the second SerDes parameter. The CDK reads the eye diagram quality data. If the eye diagram quality data does not meet the preset conditions, there is no need to adjust the second SerDes parameter corresponding to that temperature range. If the eye diagram quality data does not meet the preset conditions, the second SerDes parameter is adjusted until the eye diagram quality data corresponding to the adjusted second SerDes parameter meets the preset conditions. After completing the above adjustment, the CDK sends the adjusted second correspondence to the physical port control module. The adjusted second correspondence is the aforementioned first correspondence.

[0082] After obtaining the first mapping relationship, the backup board enters a warm standby state and disables SerDes, for example, disabling the SerDes link with the mux of the network sub-card. After entering the warm standby state, the backup board periodically obtains the current ambient temperature of the backup board through the ambient temperature detection module and sends the current ambient temperature to the physical port control module.

[0083] 402. Based on the current ambient temperature and the first correspondence, determine the target SerDes parameter corresponding to the current ambient temperature. The first correspondence includes the first SerDes parameter corresponding to each of the multiple temperature ranges.

[0084] After obtaining the current ambient temperature, the physical port control module determines the target SerDes parameter for the SerDes link based on the current ambient temperature and the first correspondence relationship corresponding to the SerDes link. Specifically, the backup board determines the first SerDes parameter corresponding to the temperature range in the first correspondence relationship where the current ambient temperature falls as the target SerDes parameter. For example, if the current ambient temperature is 18 degrees Celsius, then the first SerDes parameter corresponding to the temperature range of "10 to 20 degrees Celsius" is determined as the target SerDes parameter.

[0085] 403. Configure the target SerDes parameters for serdes.

[0086] After determining the target SerDes parameter, the physical port control module sends the target SerDes parameter to the microcode, which then configures the target SerDes parameter into the register of the NP chip. This configures the pre-emphasis coefficient of the SerDes transmitter of the SerDes link between the network sub-card and the mux to the pre-emphasis coefficient in the target SerDes parameter.

[0087] In this way, after the backup board enters the warm standby state, it can continuously adjust the SerDes parameters according to the current ambient temperature. Therefore, when it needs to switch to the primary board and exit the warm standby state, even if the current ambient temperature has changed significantly from the ambient temperature when entering the warm standby state, it is not necessary to readjust the SerDes parameters again, thereby avoiding affecting the link quality.

[0088] The primary / standby switching method in this embodiment is the same as... Figure 3Similar to the illustrated embodiment, when the primary board fails, the logic chip sends a backup / primary board upgrade interrupt signal to the CPU. Upon receiving the upgrade interrupt signal, the CPU's operating system detects the interrupt information and notifies the board driver module via interrupt subscription. The board driver detects the change in primary / backup role and notifies the board service module. The board service module further notifies each specific service unit of the primary / backup role change, including daughter card software and HAL, etc., which need to be aware of the primary / backup role change. In addition, the physical port control module on the CPU enables the SerDes on the network daughter card. After the service unit detects the change in primary / backup role, it publishes a message to the NP chip via the PCIe bus. The logic chip also sends switching information to the NP chip via the I2C bus. This switching information instructs the backup board to switch to the primary board, and the NP chip enables the SerDes on the backup board according to the switching information. It is easy to see that in the above process, when the main board fails, the logic chip sends a backup master interrupt signal to the CPU and also sends switching information to the NP chip. Therefore, the NP chip can directly open the SerDes on the backup board according to the switching information without waiting for the CPU to issue a message through the PCIe bus, thereby improving the opening speed of SerDes.

[0089] In this application, by pre-obtaining the correspondence between temperature range and SerDes parameters, after the backup board enters temperature standby mode, it can determine and configure suitable SerDes parameters in real time based on the current ambient temperature and the aforementioned correspondence. Therefore, when the backup board exits temperature standby mode, its SerDes parameters are matched with the current ambient temperature, eliminating the need for adaptive adjustments and avoiding impact on link quality. Furthermore, the logic chip can directly instruct the NP chip to activate SerDes via the I2C bus in the event of a primary board failure, improving the speed of SerDes activation and reducing the impact on services.

[0090] In the aforementioned embodiments, the microcode of the NP chip does not sense the current ambient temperature; the target SerDes parameter is determined by the physical port control module based on the current ambient temperature. In another possible implementation, the current ambient temperature can also be determined by the microcode of the NP chip, as described below:

[0091] 501. When the communication equipment is in thermal standby mode, obtain the current ambient temperature;

[0092] This step is similar to that described in step 301 above, except that after obtaining the first correspondence, the physical port control module sends the first correspondence to the microcode. Please refer to [link / reference]. Figure 9 After entering the temperature standby state, the standby board periodically obtains the current ambient temperature of the standby board through the ambient temperature detection module and sends the current ambient temperature to the physical port control module, which then sends the current ambient temperature to the microcode.

[0093] 502. Based on the current ambient temperature and the first correspondence, determine the target SerDes parameter corresponding to the current ambient temperature. The first correspondence includes the first SerDes parameter corresponding to each of the multiple temperature ranges.

[0094] After obtaining the current ambient temperature, the microcode determines the target SerDes parameter for the SerDes link based on the current ambient temperature and the first correspondence between the SerDes link and the current ambient temperature. Specifically, the microcode determines the first SerDes parameter corresponding to the temperature range in the first correspondence of the current ambient temperature as the target SerDes parameter. For example, if the current ambient temperature is 18 degrees Celsius, then the first SerDes parameter corresponding to the temperature range of "10 to 20 degrees Celsius" is determined as the target SerDes parameter.

[0095] 503. Configure the target SerDes parameters for serdes.

[0096] After determining the target SerDes parameters, the microcode configures these parameters into the NP chip's registers. Taking the SerDes link between the backup board and the network daughter card's demux as an example, after determining the target SerDes parameters for this link, since the backup board is the receiver of this SerDes link, the NP chip's registers will configure the pre-equalization coefficient of the SerDes receiver to match the pre-equalization coefficient in the target SerDes parameters. In addition, the backup board can also configure the pre-emphasis coefficient of the SerDes transmitter on the demux to match the pre-emphasis coefficient in the target SerDes parameters via the physical port control module. Similarly, taking the SerDes link between the backup board and the network daughter card's mux as an example, after determining the target SerDes parameters for this link, since the backup board is the transmitter of this SerDes link, the NP chip's registers will configure the pre-equalization coefficient of the SerDes transmitter to match the pre-emphasis coefficient in the target SerDes parameters. In addition, the backup board can also configure the pre-equalization coefficient of the SerDes receiver on the mux to the pre-equalization coefficient in the target SerDes parameters mentioned above through the physical port control module.

[0097] The subsequent steps are similar to those described in step 303 above, and will not be repeated here.

[0098] In this application, by pre-obtaining the correspondence between temperature range and SerDes parameters, after the backup board enters temperature standby mode, it can determine and configure suitable SerDes parameters in real time based on the current ambient temperature and the aforementioned correspondence. Therefore, when the backup board exits temperature standby mode, its SerDes parameters are matched with the current ambient temperature, eliminating the need for adaptive adjustments and avoiding impact on link quality. Furthermore, the logic chip can directly instruct the NP chip to activate SerDes via the I2C bus in the event of a primary board failure, improving the speed of SerDes activation and reducing the impact on services.

[0099] 601. Obtain the current ambient temperature of the communication equipment;

[0100] This step is similar to that described in step 401 above, except that after obtaining the first correspondence, the physical port control module sends the first correspondence to the microcode. After entering the temperature standby state, the standby board periodically obtains the current ambient temperature of the standby board through the ambient temperature detection module and sends the current ambient temperature to the physical port control module, which then sends the current ambient temperature to the microcode.

[0101] 602. Based on the current ambient temperature and the first correspondence, determine the target SerDes parameter corresponding to the current ambient temperature. The first correspondence includes the first SerDes parameter corresponding to each of the multiple temperature ranges.

[0102] After obtaining the current ambient temperature, the microcode determines the target SerDes parameter for the SerDes link based on the current ambient temperature and the first correspondence between the SerDes link and the current ambient temperature. Specifically, the microcode determines the first SerDes parameter corresponding to the temperature range in the first correspondence of the current ambient temperature as the target SerDes parameter. For example, if the current ambient temperature is 18 degrees Celsius, then the first SerDes parameter corresponding to the temperature range of "10 to 20 degrees Celsius" is determined as the target SerDes parameter.

[0103] 603. Configure the target SerDes parameters.

[0104] After the target SerDes parameters are determined, the microcode configures the target SerDes parameters into the register of the NP chip, thereby configuring the pre-emphasis coefficient of the SerDes transmitter of the SerDes link between the network sub-card and the mux as the pre-emphasis coefficient in the target SerDes parameters.

[0105] In this way, after the backup board enters the warm standby state, it can continuously adjust the SerDes parameters according to the current ambient temperature. Therefore, when it needs to switch to the primary board and exit the warm standby state, even if the current ambient temperature has changed significantly from the ambient temperature when entering the warm standby state, it is not necessary to readjust the SerDes parameters again, thereby avoiding affecting the link quality.

[0106] The primary / standby switching method in this embodiment is the same as... Figure 3 Similar to the illustrated embodiment, when the primary board fails, the logic chip sends a backup / primary board upgrade interrupt signal to the CPU. Upon receiving the upgrade interrupt signal, the CPU's operating system detects the interrupt information and notifies the board driver module via interrupt subscription. The board driver detects the change in primary / backup role and notifies the board service module. The board service module further notifies each specific service unit of the primary / backup role change, including daughter card software and HAL, etc., which need to be aware of the primary / backup role change. In addition, the physical port control module on the CPU enables the SerDes on the network daughter card. After the service unit detects the change in primary / backup role, it publishes a message to the NP chip via the PCIe bus. The logic chip also sends switching information to the NP chip via the I2C bus. This switching information instructs the backup board to switch to the primary board, and the NP chip enables the SerDes on the backup board according to the switching information. It is easy to see that in the above process, when the main board fails, the logic chip sends a backup master interrupt signal to the CPU and also sends switching information to the NP chip. Therefore, the NP chip can directly open the SerDes on the backup board according to the switching information without waiting for the CPU to issue a message through the PCIe bus, thereby improving the opening speed of SerDes.

[0107] In this application, by pre-obtaining the correspondence between temperature range and SerDes parameters, after the backup board enters temperature standby mode, it can determine and configure suitable SerDes parameters in real time based on the current ambient temperature and the aforementioned correspondence. Therefore, when the backup board exits temperature standby mode, its SerDes parameters are matched with the current ambient temperature, eliminating the need for adaptive adjustments and avoiding impact on link quality. Furthermore, the logic chip can directly instruct the NP chip to activate SerDes via the I2C bus in the event of a primary board failure, improving the speed of SerDes activation and reducing the impact on services.

[0108] The method in this application has been described above; the device in this application is described below:

[0109] Please see Figure 10This application provides a communication device 1000 including SERDES. The communication device 1000 includes an acquisition unit 1001 and a processing unit 1002. The communication device 1000 is used to perform the operations performed by the backup board in the aforementioned embodiments.

[0110] The acquisition unit 1001 is used to acquire the current ambient temperature when the communication device is in temperature standby mode;

[0111] Processing unit 1002 is used to determine the target SerDes parameter corresponding to the current ambient temperature based on the current ambient temperature and the first correspondence relationship, wherein the first correspondence relationship includes the first SerDes parameter corresponding to each of the multiple temperature ranges.

[0112] The processing unit 1002 is also used to configure target SerDes parameters for SerDes.

[0113] In one possible implementation,

[0114] The acquisition unit 1001 is also used to acquire a second correspondence relationship, which includes a second SerDes parameter corresponding to each of the multiple temperature ranges.

[0115] The processing unit 1002 is further configured to adjust the initial correspondence to obtain the first correspondence. The adjustment process includes adjusting the second SerDes parameter that does not conform to the preset condition, so that the eye diagram quality data corresponding to the adjusted second SerDes parameter conforms to the preset condition.

[0116] In one possible implementation,

[0117] The acquisition unit 1001 is specifically used to determine the reference SerDes parameters based on at least one of the following: the type of SerDes, the trace length of SerDes, and the type of communication device.

[0118] The acquisition unit 1001 is specifically used to determine the second correspondence based on the reference SerDes parameters.

[0119] In one possible implementation, the SerDes parameter includes at least one of the pre-emphasis coefficient and the pre-equilibrium coefficient.

[0120] In one possible implementation, the communication device is a single-board unit.

[0121] This application also provides a computer program product containing instructions. The computer program product may be a software or program product containing instructions, capable of running on a computing device or stored on any usable medium. When the computer program product is run on at least one computer, it causes the at least one computer to perform the methods described in the foregoing embodiments.

[0122] This application also provides a computer-readable storage medium. The computer-readable storage medium can be any usable medium that a computing device can store, or a data storage device such as a data center containing one or more usable media. The usable medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state drive). The computer-readable storage medium includes instructions that instruct a computer to perform the aforementioned operations. Figure 3 The method.

[0123] Figure 11 This is a schematic diagram of the structure of a device provided in an embodiment of this application. The device 1100 may include one or more central processing units (CPUs) 1201 and a memory 1105, in which one or more applications or data are stored.

[0124] The memory 1105 can be volatile or persistent storage. The program stored in the memory 1105 can include one or more modules, each module including a series of instruction operations. Furthermore, the central processing unit 1101 can be configured to communicate with the memory 1105 and execute the series of instruction operations stored in the memory 1105 on the device 1100.

[0125] Device 1100 may also include one or more power supplies 1102, one or more wired or wireless network interfaces 1103, one or more input / output interfaces 1104, and / or one or more operating systems. The central processing unit 1101 can execute the operations shown in the embodiments of the standby board in the foregoing embodiments, the specifics of which will not be elaborated here.

[0126] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0127] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between apparatuses or units through some interfaces, and may be electrical, mechanical, or other forms.

[0128] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0129] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0130] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A parameter configuration method, applied to a communication device including a serializer / deserializer (SerDes), characterized in that, include: When the communication device is in temperature standby mode, the current ambient temperature is obtained; Based on the current ambient temperature and the first correspondence, the target SerDes parameter corresponding to the current ambient temperature is determined. The first correspondence includes the first SerDes parameter corresponding to each of the multiple temperature ranges. Configure the target SerDes parameters for the SerDes.

2. The method according to claim 1, characterized in that, The communication device also includes a logic chip and a network processor (NP) chip; The method further includes: The logic chip acquires switching information, which is used to instruct the communication device to switch to the master device. The logic chip sends the switching information to the NP chip via the integrated circuit bus I2C. The NP chip activates the SerDes based on the switching information.

3. The method according to claim 1 or 2, characterized in that, The method further includes: Obtain a second correspondence, which includes the second SerDes parameter corresponding to each of the plurality of temperature ranges; The initial correspondence is adjusted to obtain the first correspondence. The adjustment process includes adjusting the second SerDes parameter whose eye diagram quality data does not conform to the preset condition, so that the eye diagram quality data corresponding to the adjusted second SerDes parameter conforms to the preset condition.

4. The method according to claim 3, characterized in that, The process of obtaining the second correspondence includes: The baseline SerDes parameters are determined based on at least one of the following: the type of the SerDes, the trace length of the SerDes, and the type of the communication device. The second correspondence is determined based on the baseline SerDes parameter.

5. The method according to any one of claims 1 to 4, characterized in that, The SerDes parameter includes at least one of the pre-weighting coefficient and the pre-equilibrium coefficient.

6. The method according to claim 5, characterized in that, The communication device is a single-board unit.

7. A communication device including a serializer / deserializer (SerDes), characterized in that, Includes an acquisition unit and a processing unit; The acquisition unit is used to acquire the current ambient temperature when the communication device is in a temperature standby state; The processing unit is configured to determine the target SerDes parameter corresponding to the current ambient temperature based on the current ambient temperature and the first correspondence relationship, wherein the first correspondence relationship includes the first SerDes parameter corresponding to each of the multiple temperature ranges. The processing unit is also configured to configure the target SerDes parameters for the SerDes.

8. The communication device according to claim 7, characterized in that, The acquisition unit is further configured to acquire a second correspondence relationship, the second correspondence relationship including a second SerDes parameter corresponding to each of the plurality of temperature ranges; The processing unit is further configured to adjust the initial correspondence to obtain the first correspondence. The adjustment process includes adjusting the second SerDes parameter whose eye diagram quality data does not conform to a preset condition, so that the eye diagram quality data corresponding to the adjusted second SerDes parameter conforms to the preset condition.

9. The communication device according to claim 8, characterized in that, The acquisition unit is specifically used to determine the baseline SerDes parameters based on at least one of the SerDes type, the SerDes trace length, and the communication device type. The acquisition unit is specifically used to determine the second correspondence based on the benchmark SerDes parameter.

10. The communication device according to any one of claims 7 to 9, characterized in that, The SerDes parameter includes at least one of the pre-weighting coefficient and the pre-equilibrium coefficient.

11. The communication device according to claim 10, characterized in that, The communication device is a single-board unit.

12. A communication device, characterized in that, It includes a processor and a memory, the processor being configured to execute instructions stored in the memory to cause the communication device to perform the method as described in any one of claims 1 to 6.

13. A communication device, characterized in that, It includes a serializer / deserializer (SerDes), a logic chip, and a network processor (NP) chip. The logic chip is used to send switching information to the NP chip via the integrated circuit bus (I2C). The switching information is used to instruct the communication device to switch to the master device. The NP chip is used to open the SerDes according to the switching information.

14. A computer-readable storage medium comprising computer program instructions, wherein when the computer program instructions are executed, the method of any one of claims 1 to 6 is performed.

Images