Jig and test equipment

Abstract

The present disclosure provides a jig and a test device, suitable for testing a chip, the jig comprising: a circuit board suitable for driving the chip to work, the circuit board comprising a first side and a second side opposite to each other; the heat dissipation jig comprises a first heat dissipation part and a second heat dissipation part, the first heat dissipation part and the second heat dissipation part are connected through a heat conduction part, the heat conduction part is suitable for conducting heat to the second heat dissipation part, the first heat dissipation part is located on the first side of the circuit board, the chip is suitable for being placed on the first heat dissipation part, and the second heat dissipation part is located on the second side of the circuit board. The second heat dissipation part is located on the second side of the circuit board. When the jig is applied to a chip test, a good heat dissipation effect is achieved, heat generated by the chip in the test process can be rapidly conducted out, and the situation that the test result is affected or the chip is damaged due to temperature rise caused by heat accumulation is prevented.

Description

Technical Field

[0001] This disclosure relates to the field of display chip testing, and more particularly to a fixture and testing equipment. Background Technology

[0002] Display chips need to undergo various performance tests before leaving the factory. During some tests, the display chip will generate heat when powered on. The heat needs to be dissipated in time to prevent the temperature from rising and affecting the test results or even damaging the display chip.

[0003] In particular, when the test power is high, a large amount of heat is generated that cannot be dissipated quickly, causing the display chip temperature to rise. The display chip is prone to damage when operating in an over-temperature environment.

[0004] Therefore, a new jig needs to be developed. Summary of the Invention

[0005] This disclosure provides a fixture suitable for testing a chip. The fixture includes: a circuit board suitable for driving the chip to work, the circuit board including a first side and a second side opposite to each other; and a heat dissipation fixture including: a first heat dissipation part and a second heat dissipation part, the first heat dissipation part and the second heat dissipation part being connected by a heat conduction part, the heat conduction part being suitable for conducting heat to the second heat dissipation part, the first heat dissipation part being located on a first side of the circuit board and being suitable for placing the chip thereon, and the second heat dissipation part being located on a second side of the circuit board.

[0006] In some embodiments, the first heat dissipation portion is provided with at least one groove, the groove being adapted to accommodate the chip.

[0007] In some embodiments, the bottom of the groove is higher than the surface of the circuit board, and the height difference between the bottom of the groove and the surface of the circuit board is 1.4 mm to 2.1 mm.

[0008] In some embodiments, the first heat sink is provided with a plurality of grooves to accommodate a plurality of chips respectively, and the circuit board includes a plurality of interfaces to be connected to the plurality of chips respectively.

[0009] In some embodiments, the chip is a display chip module, including a display chip, an electrical connector, and a flexible component connecting the display chip and the electrical connector; the circuit board includes an interface adapted to connect to the electrical connector; the gap between the groove and the interface of the circuit board is not greater than the length of the flexible component.

[0010] In some embodiments, the circuit board is provided with at least one through hole so that the heat conduction portion of the heat dissipation fixture can pass through.

[0011] In some embodiments, the heat conduction part includes one or more support pillars, and the number of through holes in the circuit board is one or more, with the support pillars passing through the through holes and connected to the first heat dissipation part.

[0012] In some embodiments, the second heat dissipation portion includes: a heat sink body, including two opposing sides; fins disposed on one side of the heat sink body; and the heat conduction portion located on the other side of the heat sink body.

[0013] In some embodiments, the first heat dissipation part and the heat conduction part are an integral boss.

[0014] In some embodiments, the first heat dissipation part, the heat conduction part, and the second heat dissipation part are an integral structure, wherein the first heat dissipation part and the heat conduction part protrude from the surface of the heat sink body on the other side.

[0015] In some embodiments, the first heat dissipation part, the heat conduction part, and the second heat dissipation part are made of metal or alloy.

[0016] In some embodiments, the first heat dissipation part, the heat conduction part, and the second heat dissipation part are made of one or more of aluminum, aluminum alloy, copper, and copper alloy.

[0017] In some embodiments, the first heat dissipation part is made of copper or a copper alloy, and the heat conduction part and the second heat dissipation part are made of aluminum or an aluminum alloy.

[0018] This disclosure also provides a fixture suitable for testing chips. The fixture includes: a circuit board suitable for driving the chip to work, the circuit board including a first side and a second side opposite to each other, and a through hole in the circuit board; and a heat dissipation fixture including: a first heat dissipation part and a second heat dissipation part, the first heat dissipation part being a boss protruding from one side of the second heat dissipation part, the boss being suitable for passing through the through hole, and the surface of the boss being suitable for placing a chip such that the chip is located on the first side of the circuit board, and the second heat dissipation part is located on the second side of the circuit board.

[0019] In some embodiments, the second heat dissipation portion includes: a heat sink body, including two opposing sides; fins disposed on one side of the heat sink body; and a boss protruding from the surface of the other side of the heat sink body.

[0020] In some embodiments, the first heat dissipation part and the second heat dissipation part are integrally formed structures.

[0021] In some embodiments, the height of the boss is 2mm to 4mm.

[0022] In some embodiments, the boss is provided with at least one groove, the groove being adapted to accommodate the chip.

[0023] In some embodiments, the boss is provided with a plurality of grooves to accommodate a plurality of chips respectively, and the circuit board includes a plurality of interfaces to be connected to the plurality of chips respectively.

[0024] In some embodiments, the chip is a display chip module, including a display chip, an electrical connector, and a flexible component connecting the display chip and the electrical connector; the circuit board includes an interface adapted to connect with the electrical connector; the gap between the groove and the interface of the circuit board is not greater than the length of the flexible component.

[0025] In some embodiments, the boss is made of one or more of copper, copper alloy, aluminum, and aluminum alloy.

[0026] This disclosure also provides a testing device for testing chips, the testing device comprising: at least one fixture according to any of the embodiments; and a chamber adapted to accommodate the fixture in order to provide a testing environment for the chip.

[0027] In some embodiments, the test equipment further includes a backplate connected to one or more of the fixtures and adapted to transmit signals to the one or more fixtures.

[0028] In some embodiments, the back plate is provided with multiple slots for engaging with the fixture; the other side of the back plate is provided with a signal interface for receiving signals and transmitting them to the multiple slots.

[0029] In some embodiments, there is a gap between adjacent slots to ensure that the distance between the chip of a fixture and the second heat dissipation part of the adjacent fixture in the direction perpendicular to the circuit board of the fixture is 70mm to 80mm.

[0030] In some embodiments, the test equipment further includes: a support structure having a plurality of arrayed mounting positions for mounting the backplate; the support structure having an opening to expose the signal interface.

[0031] Compared with the prior art, the technical solutions of the embodiments of this disclosure have the following beneficial effects:

[0032] According to embodiments of this disclosure, the heat dissipation fixture includes a first heat dissipation part and a second heat dissipation part, which are located on opposite sides of the circuit board during testing. The chip is located on the first heat dissipation part. The first heat dissipation part can quickly conduct heat to the second heat dissipation part. The second heat dissipation part has a larger area, which can quickly dissipate heat and has a good heat dissipation effect, preventing heat accumulation from causing the temperature to rise and affecting the test results or damaging the chip.

[0033] According to an embodiment of this disclosure, the first heat dissipation part and the heat conduction part are integrated into a boss, and the height of the boss is 2mm to 4mm. A boss of a certain height is beneficial for heat dissipation during the testing process, while ensuring the stability of the electrical connection between the chip and the circuit board.

[0034] Furthermore, the first heat dissipation part is provided with multiple grooves to accommodate multiple chips, and the circuit board includes multiple interfaces to be connected to the multiple chips respectively to drive the chips. Therefore, multiple chips can be tested at the same time, which improves the testing efficiency.

[0035] The test equipment of this disclosure includes the heat dissipation fixture as described above and a chamber that provides a test environment. During testing, the heat generated by the chip can be dissipated in a timely manner to prevent heat accumulation from causing the temperature to rise and affecting the test results or damaging the chip.

[0036] Furthermore, a heat dissipation fixture is mounted on a backplate, which has multiple slots that share a single signal interface to receive signals, thereby improving efficiency.

[0037] Furthermore, by fixing multiple backplanes with a support structure, the number of test chips can be increased, thus improving testing efficiency. Attached Figure Description

[0038] Other features and advantages of this disclosure will be better understood through the following detailed description of alternative embodiments in conjunction with the accompanying drawings, in which the same reference numerals denote the same or similar parts, wherein:

[0039] Figure 1 A three-dimensional structural schematic diagram of a fixture according to an embodiment of the present disclosure is shown;

[0040] Figure 2 A three-dimensional structural schematic diagram of a fixture according to an embodiment of the present disclosure is shown;

[0041] Figure 3 It shows Figure 2 A view of the fixture on the first side of the circuit board;

[0042] Figure 4 It shows Figure 2 A view of the fixture on the second side of the circuit board;

[0043] Figure 5 A three-dimensional structural schematic diagram of a heat dissipation fixture according to an embodiment of the present disclosure is shown;

[0044] Figure 6 A schematic diagram of the structure of a test device according to an embodiment of the present disclosure is shown;

[0045] Figure 7 A perspective view of the fixture and backplate according to an embodiment of the present disclosure is shown;

[0046] Figure 8 A schematic diagram of a support structure with a fixture fixed according to an embodiment of the present disclosure is shown;

[0047] Figure 9 A three-dimensional structural schematic diagram of the control board and adapter board according to an embodiment of the present disclosure is shown. Detailed Implementation

[0048] Embodiments of this disclosure are described in detail below, examples of which are illustrated in the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this disclosure, and should not be construed as limiting this disclosure.

[0049] Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. In the description of this disclosure, it should be understood that the terms “center,” “longitudinal,” “lateral,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this disclosure and for simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0050] To ensure that the chip is not damaged by overheating during testing, this disclosure provides a fixture suitable for testing the chip and with good heat dissipation effect. It can quickly dissipate the heat generated by the chip during the testing process, avoiding heat accumulation that could lead to temperature rise and damage to the chip.

[0051] Figure 1 A three-dimensional structural schematic diagram of a jig according to an embodiment of the present disclosure is shown. (See reference...) Figure 1 This disclosure provides a fixture 1, which includes a circuit board 11 and a heat dissipation fixture 12. The circuit board 11 is adapted to drive a chip to operate and includes a first side and a second side opposite to each other. The heat dissipation fixture 12 includes a first heat dissipation part 121 and a second heat dissipation part 122, which are connected by a heat conduction part (not shown) adapted to conduct heat to the second heat dissipation part 122. The first heat dissipation part 121 is located on the first side of the circuit board 11, and the chip is adapted to be placed on the first heat dissipation part 121; the second heat dissipation part 122 is located on the second side of the circuit board 11.

[0052] In some embodiments, the circuit board 11 provides drive signals and power to the chip under test by being directly or indirectly connected to a power source.

[0053] Figure 2 A three-dimensional structural schematic diagram of a fixture according to an embodiment of the present disclosure is shown; Figure 3 It shows Figure 2 A view of the fixture on the first side of the circuit board; Figure 4 It shows Figure 2 A view of the fixture on the second side of the circuit board. (Reference) Figures 2-4 The first heat dissipation part 121 is provided with at least one groove 1211, which is adapted to accommodate a chip.

[0054] In some embodiments, a first heat dissipation portion 121 located on a first side of the circuit board 11 protrudes from the surface of the circuit board 11. In some embodiments, the first heat dissipation portion 121 is a boss that protrudes from the surface of the circuit board 11.

[0055] To ensure that the chip fits snugly against the bottom surface of the recess 1211 to increase the contact area and to ensure the stability of the electrical connection between the chip and the circuit board 11, especially when the chip and the circuit board 11 are flexibly connected, the height of the bottom of the recess 1211 from the surface of the circuit board 11 needs to be set. In some embodiments, the bottom of the recess 1211 is higher than the surface of the circuit board 11, that is, the bottom of the recess 1211 is located on the first side of the circuit board 11, and the height difference between the bottom of the recess 1211 and the surface of the circuit board 11 is 1.4mm to 2.1mm, specifically, it can be 1.5mm or 2.0mm, etc.

[0056] In some embodiments, the first heat sink 121 is a solid structure, made of a material with good heat transfer properties, and its volume affects the heat dissipation rate. In some embodiments, the height of the first heat sink 121 protruding from the surface of the circuit board 11 is 0.4mm to 2.4mm, thereby ensuring that the first heat sink 121 has a sufficiently large volume to ensure the stability of the connection between the chip and the circuit board 11, especially when the chip and the circuit board 11 are flexibly connected, ensuring the stability of the electrical connection, while also ensuring the heat dissipation effect.

[0057] In some embodiments, the first heat sink 121 is provided with a plurality of grooves 1211 to accommodate a plurality of chips for testing, and the circuit board 11 includes a plurality of interfaces to be connected to the plurality of chips respectively to drive the chips, thus enabling simultaneous testing of multiple chips and improving testing efficiency. In some embodiments, the plurality of grooves 1211 on the first heat sink 121 are spaced apart on the first heat sink 121, and the circuit board 11 is provided with a plurality of corresponding interfaces to provide drive signals and power to the chips.

[0058] The fixtures of this disclosure, in some embodiments, refer to... Figure 3 The chip is a display chip module 2, which includes a display chip 21, an electrical connector 22, and a flexible component 23 connecting the display chip and the electrical connector. The groove 1211 of the first heat dissipation part 121 is adapted to accommodate the display chip 21. The circuit board 11 includes an interface (not marked in the figure) located near the groove 1211, adapted to connect with the electrical connector 22 of the display chip module 2.

[0059] In some embodiments, the gap between the groove 1211 of the first heat dissipation part 121 and the interface of the circuit board 11 is not greater than the length of the flexible component 23, so as to avoid the flexible component 23 from breaking or being damaged. In some embodiments, the flexible component 23 is a flexible circuit board, which is electrically connected to the display chip 21 and the electrical connector 22.

[0060] Continue to refer to Figure 3 In some embodiments, the display chip module 2 further includes a heat sink 24, on which the display chip 21 is disposed. When the display chip module 2 is installed on the fixture 1, the heat sink 24 contacts the first heat sink 121 to conduct the heat generated by the display chip 21 due to power-on to the first heat sink 121.

[0061] In some embodiments, the display chip 21 is placed on the surface of the heat sink 24, and the heat sink 24 is placed in the groove 1211 of the first heat dissipation part 121. In some embodiments, the area of ​​the heat sink 24 is not less than the area of ​​the display chip 21, so that the heat sink 24 and the display chip 21 can make more sufficient contact, thereby better conducting heat to the first heat dissipation part 121.

[0062] In some embodiments, the heat sink 24 is made of metal or alloy; in some embodiments, the heat sink 24 is made of stainless steel.

[0063] In some embodiments, circuit board 11 is a PCBA board.

[0064] In some embodiments of the fixture disclosed herein, the circuit board 11 is provided with at least one through hole 111 so that the heat conduction part of the heat dissipation fixture 12 can pass through. The through hole 111 can be provided in a non-wiring area of ​​the circuit board 11. The heat conduction part passing through the through hole 111 connects the first heat dissipation part 121 and the second heat dissipation part 122 located on both sides of the circuit board 11, thereby improving the space utilization rate. Furthermore, the second heat dissipation part 122 can be designed according to actual conditions, such as increasing its surface area or extending it to the other side of the space to improve the heat dissipation effect. In this way, the heat dissipation effect can be guaranteed while occupying as little area of ​​the circuit board 11 as possible.

[0065] In some embodiments, the heat conduction part includes one or more support pillars, and the number of through holes 111 in the circuit board 11 is one or more. The support pillars pass through the through holes 111 and connect to the first heat dissipation part 121. It is possible for one support pillar to pass through one through hole 111, or for multiple support pillars to pass through one through hole 111; this is not limited here. In some embodiments, refer to... Figures 2-4 The circuit board 11 has a through hole 111 and the heat conduction part is a support pillar structure, so that the heat conduction part and the first heat dissipation part 121 have a larger contact area and better heat transfer effect.

[0066] In some embodiments, the first heat dissipation part 121 and the heat conduction part are an integral boss. To ensure heat dissipation effect and the stability of electrical connection between the chip and the circuit board 11, in some embodiments, the height of the boss is 2mm to 4mm, specifically, for example, 2.5mm, 3.0mm, 3.5mm, etc.; in some embodiments, the boss is a cuboid structure with a height of 2mm to 4mm, a length of 2mm to 3mm, and a width of 2mm to 3mm.

[0067] In some embodiments, the heat dissipation fixture 12 includes a first heat dissipation part 121 and a second heat dissipation part 122 connected together. The first heat dissipation part 121 is a boss protruding from one side of the second heat dissipation part 122, and the boss is adapted to pass through a through hole 111. It should be noted that the boss passing through the through hole 111 means that the through hole 111 is located in the circumferential position of the boss. To ensure the heat dissipation effect of the boss and the stability of the electrical connection between the chip and the circuit board 11, in some embodiments, the height of the boss is 2mm to 4mm, specifically, for example, 2.5mm, 3.0mm, 3.5mm, etc.; in some embodiments, the boss is a cuboid structure with a height of 2mm to 4mm, a length of 2mm to 3mm, and a width of 2mm to 3mm.

[0068] In some embodiments, the boss and the second heat dissipation part 122 are integrally formed structures.

[0069] In some embodiments, the boss is made of copper, copper alloy, aluminum, or aluminum alloy.

[0070] In some embodiments, the boss and the second heat dissipation part 122 are integrally formed; in some embodiments, the boss and the second heat dissipation part 122 are bonded together, for example, by metal glue.

[0071] Figure 5 A three-dimensional structural schematic diagram of a heat dissipation fixture according to an embodiment of the present disclosure is shown. (See reference...) Figure 5The second heat dissipation part 122 of the fixture 1 in this embodiment includes: a heat sink body 1221, the heat sink body 1221 having two opposing sides; fins 1222 disposed on one side of the heat sink body 1221; and the heat conduction part located on the other side of the heat sink body 1221.

[0072] In some embodiments, there are multiple fins 1222, which are parallel to each other and protrude from the other side of the heat sink body 1221. The fins 1222 increase the contact area with air, transferring heat to the circulating air to carry away the heat, thereby improving the heat dissipation effect on the display chip 21. In some embodiments, the fins 1222 and the heat sink body 1221 are an integral structure.

[0073] In some embodiments, the first heat dissipation part 121 and the heat conduction part are an integral boss that protrudes from the other side of the heat sink body 1221. The first heat dissipation part 121 conducts the heat generated by the display chip during the test to the heat sink body 1221 through the heat conduction part, and the heat is further conducted to the fins 1222 and dissipated, thereby achieving rapid heat dissipation.

[0074] In some embodiments, the first heat dissipation part 121, the heat conduction part, and the second heat dissipation part 122 are an integral structure. The first heat dissipation part 121 and the heat conduction part form a boss, which is protruding on the other side of the heat sink body 1221. Correspondingly, the circuit board 11 is provided with a through hole 111, through which the first heat dissipation part 121 passes and protrudes from the surface of the circuit board 11.

[0075] The larger the volume of the second heat dissipation part 122, the better it is to quickly receive the heat of the first heat dissipation part 121 and dissipate it into the air. Since the second heat dissipation part 122 is located on the second side of the circuit board 11, there is more space to set the second heat dissipation part 122 compared to the first side. In some embodiments, the projected area of ​​the second heat dissipation part 122 on the circuit board 11 is larger than the area of ​​the through hole 111.

[0076] In some embodiments, the material of the second heat dissipation part 122 is one or more of copper, copper alloy, aluminum, and aluminum alloy.

[0077] In some embodiments, the first heat dissipation part 121, the heat conduction part, and the second heat dissipation part 122 may be made of the same or different materials. In some embodiments, the first heat dissipation part 121, the heat conduction part, and the second heat dissipation part 122 may be made of metal or alloy.

[0078] In some embodiments, the first heat dissipation part 121, the heat conduction part, and the second heat dissipation part 122 are made of one or more of aluminum, aluminum alloy, copper, and copper alloy.

[0079] In some embodiments, the first heat dissipation part 121, the heat conduction part, and the second heat dissipation part 122 are made of aluminum or aluminum alloy.

[0080] In some embodiments, the first heat dissipation part 121, the heat conduction part, and the second heat dissipation part 122 are made of copper or copper alloy.

[0081] In some embodiments, the first heat dissipation part 121 and the heat conduction part are made of copper or copper alloy, and the second heat dissipation part 122 is made of aluminum or aluminum alloy.

[0082] In some embodiments, to ensure heat dissipation while reducing costs, the first heat dissipation part 121 is made of copper or a copper alloy, and the second heat dissipation part 122 and the heat conduction part are made of aluminum or an aluminum alloy.

[0083] In some embodiments, the first heat dissipation part 121, the heat conduction part, and the second heat dissipation part 122 are integrally formed; in some embodiments, the first heat dissipation part 121, the heat conduction part, and the second heat dissipation part 122 are bonded together, for example, by metal glue.

[0084] The fixture of this disclosure allows for various methods of connecting and fixing the circuit board 11 and the heat dissipation fixture 12, such as threaded engagement, snap-fit ​​engagement, interference fit, etc. In some embodiments, the second heat dissipation part 122 of the heat dissipation fixture 12 is provided with a mounting groove 1223, and the circuit board 11 is provided with a corresponding mounting hole 112. A mounting component passes through the mounting hole 112 of the circuit board 11 and engages with the mounting groove 1223 to fix it, thereby connecting and fixing the heat dissipation fixture 12 and the circuit board 11. In some embodiments, the mounting groove 1223 is a threaded hole with a threaded inner surface, and the mounting component is a matching screw. The circuit board 11 and the second heat dissipation part 122 are connected and fixed by threaded engagement. In some embodiments, the mounting groove 1223 includes a snap-fit ​​structure, and the mounting component is a corresponding hook structure. The circuit board 11 and the second heat dissipation part 122 are connected and fixed by snap-fit ​​engagement. In some embodiments, the structure of the mounting groove 1223 and the mounting component is suitable for interference fit connection.

[0085] The fixture in this embodiment includes a heat dissipation fixture with good heat dissipation effect. The first heat dissipation part and the second heat dissipation part are respectively located on both sides of the circuit board. During the test, the heat generated by the display chip is quickly dissipated, avoiding damage to the display chip due to excessive temperature.

[0086] The fixture of this disclosure can be used for various tests of display chips. By changing the power supply and drive signals of the input circuit board, and adjusting the temperature and pressure of the test environment, the test conditions can be changed to perform corresponding tests. Accordingly, the materials of the first heat dissipation part, the heat conduction part, and the second heat dissipation part can be selected according to actual conditions, and it has good heat dissipation effect in various testing processes of display chips. In some embodiments, the fixture of this disclosure can be used to perform aging tests on display chips, as well as constant temperature and constant current tests, high temperature tests, low temperature tests, etc.

[0087] Accordingly, this disclosure also provides a testing device, including at least one fixture according to any of the above embodiments, the fixtures of which will not be described in detail here.

[0088] Figure 6 A schematic diagram of the structure of a test apparatus according to an embodiment of the present disclosure is shown. (See reference...) Figure 6 In some embodiments, the test apparatus further includes a chamber 7 adapted to house the fixture 1 in order to provide a test environment for the chip.

[0089] In some embodiments, the test environment inside the chamber can be adjusted according to different test conditions, such as adjusting the temperature and pressure inside the chamber 7, and the current magnitude and drive signal can also be adjusted to match the test conditions of the corresponding test, so as to realize multiple performance tests of the chip and tests of various types of chips.

[0090] In some embodiments, the test equipment further includes a backplane connected to one or more of the fixtures and electrically connected to the chip via a circuit board, the backplane being adapted to receive current and drive signals and transmit them to the chip via the circuit board.

[0091] Figure 7 A perspective view of the fixture and backplate according to an embodiment of this disclosure is shown. (See reference...) Figure 7 At least one fixture 1 is connected to a backplane 3, and the backplane 3 is electrically connected to the circuit board 11 of the fixture 1 to transmit current and drive signals to the chip. One backplane 3 can be connected to multiple fixtures 1 simultaneously. Through the circuit design on the backplane 3, it is ensured that current and drive signals are transmitted to the corresponding chip via each circuit board 11. In some embodiments, one backplane 3 is simultaneously connected to the circuit boards 11 of four fixtures 1. The power input interface 31 and drive signal input interface 32 of the backplane 3 receive current and drive signals and transmit them to the four circuit boards 11, and then to the corresponding chip. In some embodiments, one backplane 3 is simultaneously connected to the circuit boards 11 of two fixtures 1. The power input interface 31 and drive signal input interface 32 of the backplane 3 receive current and drive signals and transmit them to the two circuit boards 11, and then to the corresponding chip. The number of fixtures 1 connected to one backplane 3 is merely illustrative and is not intended to limit the technical solution of this disclosure.

[0092] In some embodiments, the back plate 3 is provided with multiple locking positions to engage with the fixture 1 respectively.

[0093] In some embodiments, a signal interface is provided on the other side of the backplane 3, the signal interface including: a power input interface 31 and a drive signal input interface 32; the power input interface 31 is adapted to receive current and transmit the current to the chip via the circuit board 11; the drive signal input interface 32 is adapted to receive drive signals and transmit the drive signals to the chip via the circuit board 11. In some embodiments, the signal interface of the backplane 3 receives signals and transmits them to a slot on one side of the backplane 3 and then to the circuit board, ultimately driving the chip to work.

[0094] Continue to refer to Figure 7 In some embodiments, the slots on the backplate 3 are spaced apart to allow the circuit boards 11 of the fixtures to be mounted at certain intervals. After installation, the circuit boards of each fixture are parallel. To further ensure that heat can be quickly dissipated when multiple fixtures are used for chip testing, and to avoid the heat dissipation affecting adjacent chips, the distance between the chip on the first heat dissipation part 121a of a fixture 1a and the second heat dissipation part 122b of the adjacent fixture 1b is more than 70mm in the direction perpendicular to the surface of the circuit board 11. More specifically, the distance is 70mm to 80mm, thereby enabling simultaneous testing of more chips and ensuring good heat dissipation.

[0095] In some embodiments, the testing equipment further includes a support structure 4, with a plurality of backplates 3 connected and fixed to the support structure 4. The support structure 4 is disposed within a chamber 7 to provide a testing environment for testing the chip within the chamber 7.

[0096] Figure 8 A schematic diagram of a support structure with a fixture fixed according to an embodiment of the present disclosure is shown. (See reference...) Figure 8 In some embodiments, the support structure 4 is provided with a plurality of arrayed mounting positions to accommodate the backplate 3, thereby fixing the fixture connected to the backplate 3 to the support structure 4. The support structure 4 can fix multiple backplates 3 at the same time, thereby fixing multiple fixtures 1 for testing, which improves the efficiency of testing.

[0097] In some embodiments, the back plate 3 and the support structure 4 are connected by fasteners, such as threaded connections. The connection method is only for illustrative purposes and is not limited herein.

[0098] In some embodiments, the support structure 4 has an opening to expose a signal interface on the backplate 3 for receiving signals.

[0099] In some embodiments, current and drive signals are transmitted to the backplane 3 via a control board and an adapter board. The control board can adjust and distribute the current and drive signals transmitted to the fixture, thereby controlling the test conditions.

[0100] Figure 9 A perspective view of the control board and adapter board according to an embodiment of this disclosure is shown. (See reference...) Figure 9 The control board 5 is adapted to be connected to a power source and electrically connected to the backplane 3; the adapter board 6 is electrically connected to the control board 5 and the backplane 3 respectively, and outputs current and drive signals to the signal interface of the backplane 3.

[0101] In some embodiments, the adapter board 6 includes a power output interface 61 and a drive signal output interface 62. The power output interface 61 is electrically connected to the power input interface 31 of the backplane 3, and the drive signal output interface 62 is electrically connected to the drive signal input interface 32 of the backplane 3, thereby transmitting current and drive signals to the backplane 3 and then to the chip 2 placed on the fixture 1.

[0102] In some embodiments, the control board 5 is directly connected to the adapter board 6, and the adapter board 6 is connected to the back plate 3 by wires, so that the adapter board 6 and the control board 5 are kept at a certain distance from the fixture 1, so as to avoid damage to the control board 5 by the heat dissipation of the fixture 1 during the test.

[0103] In some embodiments, the control board 5 and the adapter plate 6 are disposed outside the chamber 7.

[0104] In some embodiments, multiple fixtures 1 are fixed to the support structure 4 in an array. To ensure heat accumulation during the test, the distance between the chip on the first heat dissipation part 121 of one fixture and the second heat dissipation part 122 of the adjacent fixture is 70mm to 80mm in the direction perpendicular to the circuit board 11, for example, 72mm, 75mm, 78mm, etc.

[0105] The testing equipment of this embodiment can fix multiple fixtures for testing. During the testing process, the fixtures can dissipate the heat generated by the display chip, avoiding heat accumulation that could cause the display chip to overheat and be damaged. At the same time, it avoids other adverse effects of high temperature on the test, and can test multiple display chips at the same time, thus improving the testing efficiency.

[0106] In some embodiments, the support structure 4 of the test equipment fixes multiple fixtures 1, and the first heat dissipation part 121 on each fixture 1 holds multiple display chips, so that multiple display chips can be tested at the same time, which improves the test efficiency and has a good heat dissipation effect, avoiding heat accumulation that affects the test results or damages the display chips.

[0107] The testing equipment of this disclosure embodiment can be used to perform various tests on the chip. By changing the power supply and drive signal of the input circuit board, and adjusting the temperature and pressure of the test environment, the test conditions can be changed to perform corresponding tests. Accordingly, the materials of the first heat sink and the second heat sink can be selected according to actual conditions, and it has good heat dissipation effect in various testing processes of the display chip. In some embodiments, the testing equipment of this disclosure embodiment can be used to perform aging tests on the display chip, as well as constant temperature and constant current tests, high temperature tests, low temperature tests, etc.

[0108] The above description is merely an exemplary embodiment used to illustrate the principles of this disclosure and is not intended to limit the scope of protection of this disclosure. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and substance of this disclosure, and these modifications and improvements are also within the scope of protection of this disclosure.

Claims

1. A fixture suitable for testing chips, characterized in that, The fixtures include: A circuit board adapted to drive the chip to work, the circuit board including a first side and a second side opposite to each other; A heat dissipation fixture includes: a first heat dissipation part and a second heat dissipation part, the first heat dissipation part and the second heat dissipation part being connected by a heat conduction part, the heat conduction part being adapted to conduct heat to the second heat dissipation part, the first heat dissipation part being located on a first side of the circuit board and adapted to place the chip thereon, and the second heat dissipation part being located on a second side of the circuit board.

2. The fixture according to claim 1, characterized in that, The first heat dissipation part is provided with at least one groove, which is adapted to accommodate the chip.

3. The fixture according to claim 2, characterized in that, The bottom of the groove is higher than the surface of the circuit board, and the height difference between the bottom of the groove and the surface of the circuit board is 1.4mm to 2.1mm.

4. The fixture according to claim 2, characterized in that, The first heat sink has multiple grooves to accommodate multiple chips respectively, and the circuit board includes multiple interfaces to be connected to the multiple chips respectively.

5. The fixture according to claim 2, characterized in that, The chip is a display chip module, including a display chip, an electrical connector, and a flexible component connecting the display chip and the electrical connector; The circuit board includes an interface adapted to be connected to the electrical connector; The gap between the groove and the interface of the circuit board is no greater than the length of the flexible component.

6. The fixture according to claim 1, characterized in that, The circuit board has at least one through hole so that the heat conduction part of the heat dissipation fixture can pass through.

7. The fixture according to claim 6, characterized in that, The heat conduction part includes one or more support pillars, and the circuit board has one or more through holes. The support pillars pass through the through holes and are connected to the first heat dissipation part.

8. The jig according to any one of claims 1 to 7, characterized in that, The second heat dissipation part includes: a heat sink body, including two opposing sides; and fins disposed on one side of the heat sink body. The heat conduction section is located on the other side of the heat sink body.

9. The fixture according to claim 8, characterized in that, The first heat dissipation part and the heat conduction part are an integral boss.

10. The fixture according to claim 8, characterized in that, The first heat dissipation part, the heat conduction part, and the second heat dissipation part are an integral structure, wherein the first heat dissipation part and the heat conduction part protrude from the surface of the other side of the heat sink body.

11. The jig according to any one of claims 1 to 7, characterized in that, The first heat dissipation part, the heat conduction part, and the second heat dissipation part are made of metal or alloy.

12. The jig according to any one of claims 1 to 7, characterized in that, The first heat dissipation part, the heat conduction part, and the second heat dissipation part are made of one or more of aluminum, aluminum alloy, copper, and copper alloy.

13. The jig according to any one of claims 1 to 7, characterized in that, The first heat dissipation part is made of copper or copper alloy, and the heat conduction part and the second heat dissipation part are made of aluminum or aluminum alloy.

14. A fixture suitable for testing chips, characterized in that, The fixtures include: A circuit board adapted to drive the chip to work, the circuit board including a first side and a second side opposite to each other, and through holes provided in the circuit board; A heat dissipation fixture includes: a first heat dissipation part and a second heat dissipation part. The first heat dissipation part is a boss that protrudes from one side of the second heat dissipation part. The boss is adapted to pass through the through hole. The surface of the boss is adapted to place a chip such that the chip is located on the first side of the circuit board. The second heat dissipation part is located on the second side of the circuit board.

15. The fixture according to claim 14, characterized in that, The second heat dissipation part includes: a heat sink body, including two opposing sides; and fins disposed on one side of the heat sink body. The boss protrudes from the surface of the heat sink body on the other side.

16. The fixture according to claim 15, characterized in that, The first heat dissipation part and the second heat dissipation part are integrally formed structures.

17. The fixture according to claim 14, characterized in that, The height of the boss is 2mm to 4mm.

18. The fixture according to claim 14, characterized in that, The protrusion has at least one groove, which is adapted to accommodate the chip.

19. The fixture according to claim 18, characterized in that, The protrusion has multiple grooves to accommodate multiple chips, and the circuit board includes multiple interfaces to connect to the multiple chips respectively.

20. The fixture according to claim 18, characterized in that, The chip is a display chip module, including a display chip, an electrical connector, and a flexible component connecting the display chip and the electrical connector; The circuit board includes an interface adapted to be connected to the electrical connector; The gap between the groove and the interface of the circuit board is no greater than the length of the flexible component.

21. The jig according to any one of claims 14 to 20, characterized in that, The boss is made of one or more of the following materials: copper, copper alloy, aluminum, and aluminum alloy.

22. A testing device for testing chips, characterized in that, include: At least one jig as described in any one of claims 1 to 21; A chamber adapted to house the fixture in order to provide a testing environment for the chip.

23. The testing equipment according to claim 22, characterized in that, Also includes: A backplate, connected to one or more of the fixtures and adapted to transmit signals to the one or more fixtures.

24. The testing equipment according to claim 23, characterized in that, The back plate is provided with multiple locking slots for engaging with the fixture; the other side of the back plate is provided with a signal interface for receiving signals and transmitting them to the multiple locking slots.

25. The testing equipment according to claim 24, characterized in that, There is a gap between adjacent slots to ensure that the distance between the chip of one fixture and the second heat sink of the adjacent fixture in the direction perpendicular to the circuit board of the fixture is 70mm to 80mm.

26. The testing equipment according to claim 24, characterized in that, Also includes: A support structure having several arrayed mounting positions for mounting the back plate; The support structure has an opening to expose the signal interface.

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