Anti-scratch manufacturing method for gold finger plate gold surface

Abstract

The invention relates to the technical field of metal plate manufacturing, in particular to an anti-scratch manufacturing method for a golden finger plate gold surface. The method comprises the following steps: cleaning and deburring a golden finger plate, and eliminating edge hidden dangers which are easy to generate scratches; the plate placing direction is reasonably set in the conveying and circulating process, so that the metal surface is located on the non-stress side; during forming and edge processing, the board feeding posture is controlled to avoid an equipment contact path, and gold surface appearance inspection and abnormal separation are implemented in the manufacturing process, so that the gold surface of the golden finger board is effectively prevented from being scratched and damaged. According to the invention, the stress direction, the placement direction and the board feeding posture of the golden finger board in the conveying, circulating and processing processes are systematically controlled, and the process detection and abnormal separation of the appearance state of the gold surface are combined, so that the abrasion damage caused by the contact between the gold surface and equipment or components is avoided from the source; therefore, the appearance quality and the process yield of the gold finger plate gold surface are stably improved.

Description

A method for manufacturing anti-scratch materials for gold-plated finger plates Technical Field

[0001] This invention relates to the field of sheet metal manufacturing technology, and in particular to a method for manufacturing anti-scratch materials for the gold surface of gold finger sheets. Background Technology

[0002] In the manufacturing process of electronic circuit boards, the gold finger board, because its gold surface directly bears the functions of insertion and removal conduction and signal transmission, has high requirements for surface integrity and appearance quality. However, in existing production processes, the gold finger board usually comes into contact with conveying components, load-bearing components, or transmission and guiding components of processing equipment during multiple processes such as cleaning, conveying, mounting, forming, chamfering, and edge processing. This makes it prone to defects such as scratches, wear, or localized dullness on the gold surface due to concentrated force, improper posture, or the presence of edge burrs. Existing technologies mostly rely on adding protective materials, slowing down processing, or post-processing screening to reduce the risk of scratches. These processes are complex and have limited stability, making it difficult to effectively prevent gold surface damage from the source of the manufacturing process, thus affecting product yield and reliability. Summary of the Invention

[0003] Therefore, it is necessary to provide a method for manufacturing anti-scratch materials for the gold surface of gold finger plates to solve at least one of the above-mentioned technical problems.

[0004] To achieve the above objectives, a method for manufacturing anti-scratch materials for the gold surface of a gold finger plate is provided. The method includes the following steps: Step S1: Cleaning the gold finger plate and deburring the edges and forming contours of the plate to prevent the formation of hard protrusions that could scratch the gold surface of the gold finger plate; Step S2: During the conveying, erecting, or transfer of the gold finger plate, the placement direction of the gold finger plate is set so that the gold surface of the gold finger plate is located on the non-stress side of the plate, and the load-bearing position of the plate is limited to the plate body part away from the gold finger area; Step S3: During the forming, chamfering, or edge treatment of the gold finger plate, the feeding posture of the gold finger plate is controlled so that the gold finger area avoids the contact path of the transmission or guide components in the processing equipment; Step S4: After at least one manufacturing process is completed, the appearance of the gold surface of the gold finger plate is inspected, and gold finger plates with abnormal appearance are separated from the corresponding manufacturing process.

[0005] The beneficial effects of this invention are as follows: First, by systematically constraining the force path, placement direction, and feeding posture of the gold finger plate throughout the entire manufacturing process, this method avoids the risk of direct or indirect contact between the gold surface and the conveying components, bearing components, and transmission or guiding components of the processing equipment from the source. Specifically, by always arranging the gold surface of the gold finger plate on the non-force-bearing side, concentrating and limiting the bearing force to non-functional plate parts far away from the gold finger area, and actively avoiding equipment contact paths during forming, chamfering, and edge treatment processes, the friction, extrusion, and sliding forces generated during the conveying, transfer, and processing of the plate will not act on the gold finger area, thereby effectively reducing scratches, wear, and indentations caused by mechanical contact, posture deviation, or path overlap. This method does not rely on additional protective films or complex protective structures, but achieves anti-scratch effects through the reasonable setting of the process flow and plate posture, and has the advantages of simple process, strong adaptability, and stable reliability.

[0006] II. By introducing a phased inspection and anomaly separation mechanism for the appearance of the gold-plated surface during the manufacturing process, this method achieves timely identification and process control of the gold-plated surface quality of the gold-plated finger board. Through comprehensive inspection of the gold-plated surface integrity, edge condition, and surface consistency, abnormal appearance features such as linear scratches, flaky wear, localized dullness, and discontinuous gold layers can be accurately identified. Abnormal boards are separated in a timely manner during the manufacturing process, preventing defective products from entering subsequent processes or flowing into the finished product stage. This not only improves the finished appearance quality and consistency of the gold-plated finger board but also reduces rework, scrap, and hidden quality risks, which is conducive to improving the overall process yield and product reliability. It is especially suitable for electronic board manufacturing scenarios with high requirements for gold-plated finger connection performance and appearance quality. Attached Figure Description

[0007] Figure 1 is a schematic flowchart of a method for manufacturing an anti-scratch material for a gold-plated metal surface; Figure 2 is a schematic flowchart of the detailed implementation steps of step S2 in Figure 1; Figure 3 is a schematic diagram of the cleaning operation of a method for manufacturing an anti-scratch material for a gold-plated metal surface according to this application; Figure 4 is a schematic diagram of a normal gold-plated metal surface according to a method for manufacturing an anti-scratch material for a gold-plated metal surface according to this application; Figure 5 is a schematic diagram of scratches on a gold-plated metal surface according to a method for manufacturing an anti-scratch material for a gold-plated metal surface according to this application. The realization of the purpose, functional characteristics and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0008] The technical method of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0009] Furthermore, the accompanying drawings are merely illustrative of the invention and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted. Some block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor methods and / or microcontroller methods.

[0010] It should be understood that although the terms "first," "second," etc., may be used herein to describe various units, these units should not be limited by these terms. These terms are used merely to distinguish one unit from another. For example, without departing from the scope of the exemplary embodiments, a first unit may be referred to as a second unit, and similarly, a second unit may be referred to as a first unit. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0011] To achieve the above objectives, please refer to Figures 1 to 5. A method for manufacturing anti-scratch materials for the gold surface of a gold finger board is described. The method includes the following steps: Step S1: Cleaning the gold finger board material and deburring the edges and forming contours of the material to prevent the formation of hard protrusions on the edges that could scratch the gold surface of the gold finger board. In one embodiment, the gold finger board material to be processed is first selected and transported to the pre-processing station. The material is preferably a semi-finished gold finger board that has completed substrate forming but has not yet undergone gold surface protection treatment.

[0012] During the cleaning process, the surface of the board is first pre-treated with dust removal methods, such as using adhesive rollers or negative pressure adsorption devices to roll or adsorb and remove floating dust and debris from both sides of the board, to prevent particles from scratching the gold surface during subsequent processing. Then, the board is sent to the cleaning station, where, as shown in Figure 3, the surface is cleaned using a neutral or weakly alkaline cleaning solution via spraying or immersion to remove residual oil, fingerprints, or tiny particles. After cleaning, the board is rinsed with pure water and then dried using air drying or low-temperature drying to keep the surface dry.

[0013] After cleaning, the edges and contours of the gold finger board are deburred. Specifically, the board is fixed in the deburring station, and the edges are trimmed using a flexible grinding wheel, fine sanding belt, or fine chamfering tool according to the shape of the gold finger board. During the deburring process, special attention is paid to any tiny burrs, sharp angles, or irregular protrusions that may exist on the cut edges, stamped edges, or forming corners of the board, so that the edges of the board form a continuous and smooth transition structure.

[0014] In some implementations, the deburring operation can employ a multi-step, lightweight process to avoid removing too much material at once and affecting the dimensional accuracy of the sheet metal. By trimming in sections, the edges of the sheet metal are no longer rigid and sharp, thus preventing scratches between the sheet metal edges and the gold surface of the gold finger plate during subsequent handling, stacking, or contact with other tooling.

[0015] After deburring, visually or tactilely inspect the edges of the sheet to confirm that there are no obvious hard protrusions, sharp angles or burr residues on the edges and forming contours of the sheet, ensuring that the sheet has good edge smoothness and a good foundation for gold surface protection before entering the subsequent processes.

[0016] Step S2: When conveying, setting up or transferring the gold finger board, the placement direction of the gold finger board is set so that the gold surface of the gold finger board is located on the non-stress side of the board, and the load-bearing position of the board is limited to the part of the board body away from the gold finger area. In one embodiment, when conveying, setting up or transferring the gold finger board after completing step S1, the placement direction of the gold finger board in each station is uniformly set in advance to avoid the gold surface being squeezed or rubbed during the transfer process.

[0017] In practice, a pallet, turnover frame, or conveying fixture for supporting the gold finger plate is set up at the conveying or erection station, and the placement posture of the plate is preset on the supporting structure. During placement, the gold surface of the gold finger plate is arranged facing the non-stress direction, so that the gold surface is away from the contact surface of the pallet, the conveying roller, or the supporting component, avoiding direct contact between the gold surface and the rigid structure.

[0018] At the same time, the stress-bearing position of the gold finger plate is limited, and the load-bearing area of ​​the plate is set in the plate body part away from the gold finger area. For example, support surfaces or limiting blocks corresponding to the non-gold finger area of ​​the plate are set on the pallet or turnover frame, so that after the plate is placed, its weight and external forces are mainly borne by the plate body area, while the gold finger area is in a suspended or low contact state.

[0019] In some implementations, directional markers or structural guides can be installed on the supporting structure to ensure that operators can only place the gold finger plate in a preset direction, thereby guaranteeing that the gold surface is always on the non-load-bearing side. For automated conveyor lines, the height difference of the guide rails or the partitioned structure of the support surface can be used to allow the plate to naturally form a gold-side-up posture during the conveying process.

[0020] When gold finger boards are stacked and transferred, isolation gaps or flexible pads are set between adjacent boards to make the board parts contact each other, while the gold finger areas remain misaligned or do not contact each other, further reducing the risk of the gold surface being compressed or rubbed.

[0021] Step S3: When performing forming, chamfering, or edge treatment processes on the gold finger plate, control the feeding posture of the gold finger plate so that the gold finger area avoids the contact path of the transmission components or guide components in the processing equipment; in one embodiment, before performing forming, chamfering, or edge treatment processes on the gold finger plate, the feeding posture of the gold finger plate entering the processing equipment is first preset to avoid the gold finger area from contacting the transmission components or guide components in the equipment during processing.

[0022] In practice, a feeding guide structure is installed at the feeding end of the forming machine, chamfering machine, or edge processing equipment. The entry direction of the gold finger plate is constrained by guide grooves, limiting edges, or posture correction components, so that the gold finger plate enters the processing area in a preset posture. The preset posture positions the gold finger area on the side away from the transmission direction of the equipment, or towards the non-contact space of the equipment, thereby avoiding the movement path of transmission components such as rollers, pressure rollers, chains, or guide rails.

[0023] In some embodiments, the vertical or horizontal orientation of the gold finger plate is controlled differently depending on the arrangement of the transmission components inside the processing equipment. For example, when the transmission components are located below, the gold finger area is positioned upwards; when the transmission components are located to the side, the gold finger area is positioned towards the opposite side, structurally preventing the gold finger area from entering the transmission contact area.

[0024] During the feeding process, adjustable guide blocks can be set to limit the lateral deviation of the gold finger plate, so that the plate maintains stable linear movement during the conveying process and prevents the gold finger area from accidentally contacting the edge of the guide component due to plate shaking or deviation.

[0025] In continuous processing scenarios, by designing the posture inheritance of the handover area between the previous station and the current processing station, the gold finger board maintains the same board feeding posture throughout the process, avoiding flipping or posture changes when switching stations, thereby further reducing the risk of contact between the gold finger area and processing equipment components.

[0026] Step S4: After at least one manufacturing process is completed, the appearance of the gold surface of the gold finger board is inspected, and the gold finger boards with abnormal appearance are separated from the corresponding manufacturing process.

[0027] In one embodiment, after at least one manufacturing process is completed, the gold surface appearance condition of the gold finger plate that has completed the manufacturing process is inspected in a timely manner to identify abnormal appearance conditions such as scratches, indentations or contamination that occur during processing, transportation or transfer, and the gold finger plate with abnormalities is separated from the corresponding manufacturing process.

[0028] In practice, after the forming, chamfering, edge treatment, or other manufacturing processes with a high risk of contact with the gold finger plate are completed, a visual inspection station is set up at the material output end of that process. The finished gold finger plate is transported to the visual inspection station, exposing the gold finger area to the inspection side, so that the gold surface can be directly observed or inspected.

[0029] In some embodiments, the appearance inspection is carried out manually by visual inspection. Under standard lighting conditions, the operator inspects each gold-plated plate individually, focusing on whether there are any abnormal appearance conditions such as scratches, abrasions, local discoloration, oil residue, or plating defects in the gold-plated area. The operator may use a magnifying glass or a local supplemental lighting device to improve the ability to identify subtle defects.

[0030] In other embodiments, the appearance inspection can also employ an automated detection method. A visual inspection device scans and captures images of the gold surface of the gold finger plate, and the detected images are compared and analyzed based on preset appearance judgment criteria to identify abnormal appearance conditions. When the inspection results determine that the gold finger plate has an abnormal appearance condition, corresponding abnormality identification information is generated.

[0031] After completing the appearance inspection, the gold finger boards are sorted according to the inspection results. Gold finger boards that are found to be in normal appearance are continued to the next manufacturing process or enter the finished product buffer area; gold finger boards that are found to be in abnormal appearance are removed manually, separated from the normal flow path of the current manufacturing process by diversion baffles or automatic sorting mechanisms, and placed in the abnormal product temporary storage area.

[0032] In some embodiments, to facilitate subsequent traceability and analysis, when the abnormal gold finger plate is set separately, additional identification information can be added to it, including manufacturing process number, inspection time and abnormality type identification, for subsequent rework, re-inspection or scrapping.

[0033] In another embodiment, referring to Figures 4 and 5, the present invention also provides a schematic diagram of a normal gold finger plate surface (Figure 4) and a schematic diagram of a scratched gold finger plate surface (Figure 5). After completing at least one gold finger plate manufacturing process, the gold finger plate is output along the conveyor roller or the support table, and its surface is inspected under natural light or auxiliary detection light source conditions. During the inspection, the focus is on identifying whether there are abnormal appearance conditions such as linear scratches, drag marks, local indentations, and irregular scratches caused by contact between the roller conveyor, the holding components, or the tooling. When scratches, strip-shaped friction marks, or concentrated abnormal scratch areas that are obviously inconsistent with the normal processing texture are detected on the gold surface, the corresponding gold finger plate is separated from the qualified product flow path of the current manufacturing process and set separately in the abnormal product temporary storage or rework channel to avoid defective gold finger plates entering subsequent processes and causing further surface damage.

[0034] As an example of the present invention, referring to Figure 2, step S2 in this example includes: Step S21: Before the gold finger plate enters the conveying, erecting or transfer process, determine the main force direction and force contact surface of the plate in the current process, and define the plate surface corresponding to the main force direction as the force side; Step S22: According to the determination result of the force side, adjust the placement direction of the gold finger plate so that the gold surface of the gold finger plate faces the non-force side opposite to the force side; Step S23: Select a non-functional area away from the gold finger area on the plate body as the bearing force area, and make the bearing force area contact the conveying component, support component or bearing component during the conveying, erecting or transfer process; Step S24: When the gold finger plate moves along the conveying path or is erected or picked up, keep the bearing force area continuously under stress so that the friction force generated by the weight of the plate, pushing or contact is always transmitted through the bearing force area and does not act on the plate body part of the gold finger area.

[0035] In one embodiment, firstly, before the gold finger plate enters the conveying, erecting, or transfer process, the structural form of the current process is analyzed. For example, in the conveying process, the conveying components are typically rollers, belts, or slide rails; in the erecting or temporary storage process, the plate is typically supported by a support frame or supporting block. Based on the above process structure, the direction in which the gold finger plate mainly bears the plate's own weight, pushing force, or contact pressure in this process is determined, and the plate surface that is in direct contact with the conveying components and supporting components is further identified, and this plate surface is defined as the force-bearing side.

[0036] After identifying the force-bearing side, the placement direction of the gold finger plate is adjusted. In practice, the gold surface of the gold finger plate is arranged facing the side opposite to the force-bearing side through manual placement or an automatic flipping mechanism, thus preventing the gold surface from directly contacting the conveying or supporting components, even if the gold surface is on the non-force-bearing side.

[0037] Subsequently, a portion of the board body furthest from the gold finger area is selected as the load-bearing area. This load-bearing area is typically located in the middle or edge non-functional area of ​​the board body, maintaining a preset safe distance from the gold finger area. During transportation, erection, or transfer, this load-bearing area comes into direct contact with the transportation components, support components, or load-bearing components, thereby bearing the weight of the board body and the frictional forces generated by movement.

[0038] As the gold finger plate moves along the conveyor path, or undergoes loading, unloading, and pick-up operations, the load-bearing area is continuously kept under stress. For example, during roller conveying, the rollers are always in contact with the load-bearing area; during the erection process, the support points act only on the load-bearing area. This ensures that the plate's weight, pushing force, and friction are always transmitted through the load-bearing area, and not to the corresponding plate body portion in the gold finger area.

[0039] Preferably, step S22 includes: determining the placement reference surface of the gold finger plate based on the contact relationship between the plate and the load-bearing component in the current conveying, erecting, or transfer process, and setting the plate surface corresponding to the force-bearing side as the placement reference surface; using the placement reference surface as a reference, flipping or adjusting the direction of the gold finger plate so that the gold surface of the gold finger plate is arranged in a direction away from the placement reference surface, thereby placing the gold surface of the gold finger plate in a non-force-bearing state; after the direction adjustment of the gold finger plate is completed, confirming that the gold surface of the gold finger plate does not form a contact relationship with the load-bearing component, conveying component, or supporting component, to ensure that the gold surface of the gold finger plate is located on the non-force-bearing side opposite to the force-bearing side; when the gold finger plate enters the conveying, erecting, or transfer process, keeping the placement direction unchanged, so that the gold surface of the gold finger plate remains on the non-force-bearing side throughout the entire force-bearing process.

[0040] In one embodiment, the placement reference surface of the gold finger plate is determined based on the contact relationship between the gold finger plate and the supporting component during the current conveying, erecting, or transfer process. For example, in a process using roller conveying, the plate surface in direct contact with the roller is determined as the primary contact surface; in a transfer process using a pallet or support frame, the plate surface in contact with the pallet or support surface is determined as the primary contact surface. The plate surface corresponding to this primary contact surface is set as the placement reference surface and is simultaneously determined as the force-bearing side of the gold finger plate.

[0041] After determining the placement reference surface, the gold finger plate is flipped or its orientation adjusted using this reference surface as the benchmark for orientation adjustment. In practice, this can be achieved through manual flipping, a flipping mechanism, or an automatic flipping device on the conveyor line, ensuring that the gold surface of the gold finger plate faces away from the placement reference surface. This orientation adjustment prevents the plate surface containing the gold finger area from directly contacting the load-bearing component, thus placing the gold surface of the gold finger plate in a non-stressed state.

[0042] After the orientation of the gold finger plate is adjusted, its placement is confirmed. Specifically, check whether the gold surface of the gold finger plate is in direct contact with the load-bearing, conveying, or supporting components, and confirm that there is a gap between the gold surface and these components, or that there is only air isolation without physical contact. Only after confirming that the gold surface of the gold finger plate is completely on the non-load-bearing side opposite to the load-bearing side is the gold finger plate allowed to enter the subsequent conveying, erection, or transfer processes.

[0043] Once the gold finger plate officially enters the conveying, erection, or transfer process, its placement orientation remains unchanged. For example, during continuous conveying, the reactivation of the flipping mechanism is restricted; during erection or pick-up / drop operations, positioning blocks or limiting structures prevent the plate from flipping. This ensures that the gold surface of the gold finger plate remains on the non-load-bearing side throughout the entire stress and movement process, and does not come into contact with the load-bearing components due to changes in orientation.

[0044] Preferably, confirming that the gold surface of the gold finger plate does not form a contact relationship with the load-bearing component, conveying component, or supporting component specifically involves: after the gold finger plate has completed its orientation adjustment, determining the contact interface between the gold finger plate and the load-bearing component, conveying component, or supporting component to determine the actual contact area of ​​the plate in its current state; comparing the actual contact area with the spatial position of the gold surface of the gold finger plate to determine whether the gold surface of the gold finger plate is outside the stress range corresponding to the actual contact area; when it is determined that the gold surface of the gold finger plate is not within the stress range corresponding to the actual contact area, confirming that the gold surface of the gold finger plate does not form direct or indirect contact with the load-bearing component, conveying component, or supporting component.

[0045] In one embodiment, after the gold finger plate has been flipped or oriented and placed on a conveyor line, pallet, or support frame, the contact interface of the current placement state of the gold finger plate is determined. Specifically, the actual contact position between the gold finger plate and the load-bearing, conveying, or supporting components can be determined through visual inspection, contact detection structures, or simple gap detection methods. For example, in a roller conveying process, it is confirmed that the gold finger plate only contacts the roller on its back or edge; in a flat pallet carrying process, it is confirmed that only the back area of ​​the plate contacts the pallet surface. This determines the actual contact area of ​​the plate in its current state.

[0046] After determining the actual contact area, the position of this actual contact area on the gold finger board is compared with the spatial position of the gold finger area on the board surface. In some embodiments, the board surface where the gold finger area is located can be regarded as the spatial marker surface of the gold finger board, and it is determined whether the spatial marker surface is located within the stress range corresponding to the actual contact area. For example, when the actual contact area is concentrated on the back of the gold finger board or on the board body part far away from the gold finger area, it can be determined that the gold finger board is outside the stress range.

[0047] Furthermore, during the comparison process, slight deformation or vibration that may occur during the transport or installation of the sheet material can be considered, and the actual contact area can be appropriately expanded for assessment. For example, a safe distance can be reserved around the actual contact area to determine whether the gold surface of the gold finger plate is still outside the expanded stress range, thereby avoiding potential contact risks caused by slight offset.

[0048] When it is determined that the gold surface of the gold finger plate is not within the stress range corresponding to the actual contact area, and does not come into contact with the load-bearing component, conveying component, or supporting component under both static placement and simulated conveying conditions, it is confirmed that the gold surface of the gold finger plate does not form direct or indirect contact with the aforementioned components. After confirmation, the gold finger plate is allowed to proceed to subsequent conveying, erection, or manufacturing processes.

[0049] Preferably, comparing the actual contact area with the spatial position of the gold surface on the gold finger plate to determine whether the gold surface is outside the stress range corresponding to the contact area includes: determining the projection range of the actual contact area on the plate surface based on the contact state between the gold finger plate and the load-bearing component, conveying component, or supporting component to form a corresponding contact area outline; obtaining the distribution position of the gold surface on the gold finger plate on the plate surface and mapping the distribution position of the gold surface to a reference plane that is the same as the actual contact area outline; comparing the relative positional relationship between the actual contact area outline and the mapped position of the gold surface to determine whether the gold surface overlaps, intersects, or enters the stress influence range of the contact area outline.

[0050] In one embodiment, after the gold finger plate has been oriented and placed on the conveying member or the supporting member, the spatial position of the gold surface of the gold finger plate and the actual contact area is compared to determine whether the gold surface of the gold finger plate is outside the range of force influence, based on the contact state between the gold finger plate and the supporting member, the conveying member or the supporting member.

[0051] First, based on the current placement of the gold finger plate, the contact between it and the load-bearing, conveying, or supporting components is identified. Specifically, this can be achieved by observing contact marks, detecting contact points, or confirming the support position of the load-bearing component and the plate to determine the actual contact area on the plate surface. For example, in a belt conveyor process, the actual contact area is a strip-shaped area formed by the belt and the back of the gold finger plate; in a roller conveyor process, the actual contact area appears as several linear or point-like contact areas distributed along the conveying direction. These actual contact areas are then projected onto the surface of the gold finger plate to form corresponding contact area outlines for subsequent comparison.

[0052] Subsequently, the distribution position of the gold surface of the gold finger area on the board is obtained. In some embodiments, the distribution range of the gold finger area on the edge of the board or a specific functional area can be determined according to the design drawings or standard structural information of the gold finger board, and this distribution range is identified as the spatial position of the gold surface of the gold finger board. For ease of comparison, the distribution position of the gold surface of the gold finger board is mapped to a reference plane with the same outline as the aforementioned contact area, so that the two are under a unified spatial reference relationship.

[0053] After completing the unified representation of the contact area contour and the mapping position of the gold finger plate's gold surface, the relative positional relationship between the two is compared and judged. In specific implementation, it can be checked whether the mapped area of ​​the gold finger plate's gold surface overlaps or intersects with the contact area contour, or whether it enters the force-affected range around the contact area contour that may be subject to compression, friction, or transmitted forces. For example, when the gold finger plate's gold surface is completely outside the contact area contour and there is a clear gap between it and the contact area, it is determined that the gold finger plate's gold surface is outside the force-affected range; when the edge of the gold finger plate's gold surface is close to or partially enters the extension range of the contact area contour, it is determined that there is a potential force risk.

[0054] In some embodiments, the contour of the contact area can be appropriately extended along the direction of movement of the gold finger plate during the conveying or erection process to simulate the changes in the force range that may occur during actual operation, and to determine again whether the gold surface of the gold finger plate is still outside the range of force influence.

[0055] When the above comparison confirms that the gold surface of the gold finger plate does not overlap or intersect with the outline of the actual contact area, and does not enter its stress influence range, it can be confirmed that the gold surface of the gold finger plate is in a non-stressed state, thereby meeting the process requirements to prevent scratches in the gold finger area during manufacturing or transfer.

[0056] Preferably, in step S3, controlling the feeding posture of the gold finger plate to ensure that the gold finger area avoids the contact path of the transmission components or guide components in the processing equipment specifically involves: before the gold finger plate enters the forming, chamfering, or edge processing process, identifying the transmission components and guide components used for plate conveying or positioning in the processing equipment, and identifying the plate contact path of the transmission components or guide components during the processing; obtaining the spatial positional relationship of the gold finger area on the gold finger plate within the plate outline, and mapping the position of the gold finger area to the contact path; setting the feeding posture of the gold finger plate according to the mapping relationship between the gold finger area and the contact path, so that the gold finger area deviates from the contact path of the transmission components or guide components during feeding and processing; and maintaining the feeding posture unchanged during the forming, chamfering, or edge processing of the gold finger plate, so that the gold finger area continuously avoids the contact path of the transmission components or guide components in the processing equipment throughout the entire processing process.

[0057] In one embodiment, before the gold finger plate enters the forming, chamfering, or edge treatment processes, the processing equipment is first analyzed to identify the transmission and guiding components that may contact the plate, and to determine their contact paths during processing. For example, in a roller conveyor, the transmission rollers form a rolling contact path along the conveying direction; in a mechanical guide or positioning groove, the guiding components form a guiding contact path along a fixed trajectory. These contact paths are represented in the processing space by a planar projection of the plate to form the outline of the contact area of ​​the processing equipment.

[0058] Subsequently, the spatial distribution of the gold finger area on the gold finger board within the board outline is obtained. This can be achieved by acquiring the boundary coordinates of the gold finger area through design drawings or board scanning. The position of the gold finger area is then mapped to a spatial reference system that is identical to the contact path of the processing equipment, in order to determine whether the gold finger area intersects or overlaps with the contact path.

[0059] After mapping is completed, the feeding posture of the gold finger board is determined based on the relative position of the gold finger area and the contact path. In practice, the gold finger area can be deviated from the contact path of all transmission and guide components during the overall movement of the board by flipping, rotating, or offsetting the board. For example, the gold finger area can be arranged towards the non-stressed side of the board or away from the rollers and guide rails, while adjusting the board angle to maintain a safe distance between the gold finger edges during processing.

[0060] After the gold finger board enters the processing station, the board's orientation is fixed by clamps, locating pins, or suction devices to ensure that the gold finger board does not shift during forming, chamfering, or edge treatment. In this way, the gold finger area always avoids the contact path of transmission or guide components in the processing equipment throughout the entire processing, reducing the risk of scratches, abrasions, or deformation of the gold finger surface.

[0061] In some embodiments, photoelectric or mechanical sensing devices can be used to detect the position of the gold finger board in real time during the processing. If the board posture is found to be deviated, the preset board feeding posture can be restored through automatic adjustment or manual intervention to ensure that the gold finger area continuously avoids the contact path.

[0062] Preferably, setting the feeding posture of the gold finger board according to the correspondence between the gold finger area and the contact path includes: determining the relative orientation of the gold finger area with respect to the contact path based on the correspondence between the gold finger area and the contact path; determining the flipping direction or tilting direction of the gold finger board when feeding, so that the gold finger area deviates from the space side where the contact path is located when the board enters the processing equipment; and setting the feeding posture of the gold finger board by the flipping direction or tilting direction when feeding.

[0063] In one embodiment, the orientation of the gold finger area relative to the contact path within the sheet metal plane is determined based on the correspondence between the gold finger area and the contact path of the processing equipment. For example, if the gold finger area is located at the upper right corner of the sheet metal, and the contact path of the roller or guide rail covers the right side of the sheet metal, then the gold finger area is located outside the contact path relative to the contact path.

[0064] Subsequently, based on the relative orientation, the flipping or tilting direction of the gold finger plate is determined. In specific operation, this can be achieved in the following ways: Flipping direction setting: If the gold finger area is located on one side of the board, the board can be flipped 180° or 90° along the longitudinal or transverse axis to deviate the gold finger area from the contact path. For example, flip the gold finger area to the non-load-bearing side of the board, away from the rollers or guide rails. Tilting direction setting: When flipping the board cannot completely avoid the contact path, the board can be slightly tilted to raise or deviate the gold finger area from the spatial position of the contact path during board feeding. For example, raise the gold finger area by 2–5 mm or rotate it 3°–10° along the board plane to ensure it does not contact the processing equipment.

[0065] By setting the flipping or tilting direction as described above, a predetermined feeding posture can be formed when the gold finger plate enters the processing equipment, so that the gold finger area is always deviated from the contact path of the transmission component or guide component throughout the processing, thereby effectively protecting the gold finger surface from mechanical scratches or damage.

[0066] In some embodiments, a clamp or positioning device can be used to fix the plate in a set feeding posture to ensure that the posture is stable and does not deviate during the feeding process.

[0067] Preferably, the feeding posture of the gold finger board is set by the flipping direction or tilting direction during feeding. Specifically, during the feeding process, the gold finger board is flipped along its normal direction according to the spatial position relationship between the gold finger area and the contact path of the transmission component or guide component in the processing equipment, wherein the flipping angle is 90° to 180°; or, while keeping the flipping state of the gold finger board unchanged, the gold finger board is tilted so that the surface of the gold finger board forms a tilting angle of 3 to 15° relative to the horizontal plane.

[0068] In one embodiment, the feeding posture of the gold finger plate is set by a flipping direction or a tilting direction to ensure that the gold finger area avoids the contact path of the transmission components or guide components in the processing equipment. Specific operations include: when the gold finger plate is fed into the plate, the gold finger plate is flipped along the normal direction of the plate surface according to the relative positional relationship between the gold finger area and the contact path of the processing equipment; the flipping angle is set within the range of 90° to 180°, for example, flipping the gold finger area from the upper side of the plate to the lower side or right side of the plate to ensure that it does not contact the transmission components or guide components; after flipping, a feeding clamp or positioning device can be used to fix the plate to ensure the stability of the flipping posture throughout the feeding process.

[0069] After the flipping operation is completed or when the flipping cannot completely avoid the contact path, the gold finger plate is tilted; the surface of the gold finger plate forms a tilt angle of 3° to 15° relative to the horizontal plane, so that the gold finger area is spatially deviated from the contact path of the transmission component or guide component; the tilting can be achieved by a support device or adjustable fixture, and the angle remains unchanged during the feeding and processing.

[0070] Preferably, determining the relative orientation of the gold finger area relative to the contact path based on the correspondence between the gold finger area and the contact path includes: determining the contact path direction of the transmission component or guide component in the feeding direction of the processing equipment based on the correspondence between the gold finger area and the contact path, defining the direction of the contact path as the reference direction, and determining the position of the gold finger area on the gold finger plate in the outline of the plate, and mapping the position of the gold finger area to a reference plane corresponding to the reference direction of the contact path; determining the relative orientation relationship of the gold finger area relative to the contact path based on the reference plane, wherein the relative orientation relationship includes being located on the same side, opposite side, or offset side of the contact path; and determining the relative orientation of the gold finger area relative to the contact path according to the relative orientation relationship.

[0071] In one embodiment, the motion trajectory of the transmission component or guide component in the feeding direction is obtained based on the matching relationship between the gold finger plate and the processing equipment. Specifically, the contact path of the transmission component and guide component in the feeding direction of the plate can be identified through equipment design parameters or sensor monitoring, and this path is defined as the reference direction of the contact path. In some embodiments, the reference direction can be used as a reference for the feeding direction of the plate, and the extension range of the contact area and the possible interference area can be determined along this direction.

[0072] Subsequently, the specific location of the gold finger area on the gold finger board within the board's outline is obtained. For example, using the gold finger board design drawing or CAD model, the position, width, and length of the gold finger area along the board's edge are identified, and the distribution of the gold finger area on the board is mapped to a reference plane corresponding to the contact path's reference direction. On this reference plane, the spatial relationship between the gold finger area and the contact path can be clearly represented, including the minimum distance between the gold finger area and the contact path and their relative angle.

[0073] Next, the relative orientation of the gold finger area with respect to the contact path is determined on the reference plane. The specific method includes: when the gold finger area is located on the same side of the contact path extension direction, it is determined to be "same side"; when the gold finger area is located on the opposite side of the contact path extension direction, it is determined to be "opposite side"; when the gold finger area has a certain horizontal or vertical offset relative to the contact path but is not on the same side or opposite side, it is determined to be "offset side".

[0074] Finally, based on the above judgment results, a relative orientation relationship is established between the position of the gold finger area on the sheet and the spatial direction of the contact path, thereby clarifying the safe position of the gold finger area throughout the entire processing or conveying process, ensuring that the gold finger area will not come into contact with the transmission components or guide components during subsequent forming, chamfering or edge treatment processes, thereby avoiding scratches or damage to the gold surface.

[0075] Preferably, the appearance inspection of the gold surface of the gold finger plate in step S4 includes: performing a surface integrity test on the gold surface of the gold finger plate, scanning the gold surface to identify any abnormal appearance features such as linear scratches, flaky wear, localized dullness, or surface discontinuities; inspecting the edge area of ​​the gold surface of the gold finger plate to detect whether there are scratches or localized deformations caused by molding, chamfering, or conveying contact at the edge of the gold finger area; performing a consistency test on the surface condition of the gold surface of the gold finger plate, wherein the consistency test includes detecting the uniformity of the gold surface gloss, the continuity of the gold layer, and the matching between the gold surface area and the design specifications; and judging and screening the gold finger plate according to the appearance inspection results to obtain a gold finger plate with a normal appearance condition or a gold finger plate with an abnormal appearance condition.

[0076] In one embodiment, the gold finger plate is placed horizontally on the visual inspection station and fixed with a special fixture to ensure a flat gold surface and uniform illumination. In some embodiments, a high-brightness uniform light source or a diffuse reflection light source can be used to eliminate the influence of the illumination angle on surface inspection. Subsequently, an integrity scan is performed on the gold surface of the gold finger plate. The scan can be performed using a visual inspection system or a high-definition camera to acquire an image of the gold surface. During image analysis, the following abnormal features are identified on the gold surface: linear scratches: stripe-like scratches extending along the surface of the plate; flaky wear: areas of localized gold layer wear or detachment; localized dullness: areas of uneven reflection or localized reduced gloss; surface discontinuity: areas of defects, holes, or incomplete coverage on the gold surface.

[0077] Simultaneously, the edge areas of the gold finger plate are given special attention, particularly the edges of the gold finger area, to check for scratches, localized bending, or deformation caused by contact during molding, chamfering, or transportation. Inspection can be performed using high-definition image magnification, edge recognition algorithms, or manual assistance.

[0078] Furthermore, the gold surface is subjected to consistency testing, including: gloss uniformity: testing whether the gloss of the gold surface is consistent by measuring the distribution of reflected light intensity; gold layer continuity: determining whether the gold layer coverage is complete by measuring color, brightness, or thickness; and matching with design specifications: comparing the actual gold surface area of ​​the gold finger plate with the design size or shape to determine whether it meets the design requirements.

[0079] Finally, based on the above test results, the condition of the gold finger board is determined. Gold finger boards that pass the inspection are classified as having a normal appearance condition, while gold finger boards that are found to have scratches, wear, or discontinuities are classified as having an abnormal appearance condition and are separated and stored from the corresponding manufacturing process to prevent them from entering subsequent processes.

[0080] Most importantly, the feeding posture of the gold finger board is set by the flipping or tilting direction during feeding, including: flipping control of the feeding direction of the gold finger board, setting the flipping angle of the gold finger board along its normal direction according to the spatial position relationship of the gold finger area relative to the contact path of the transmission or guide components in the processing equipment, so that the gold finger area is located on the non-contact side of the contact path; tilting control of the feeding direction of the gold finger board, setting the tilting angle of the gold finger board relative to the horizontal plane while keeping the overall flipping state of the gold finger board unchanged, so that the gold finger area forms a spatial offset relative to the contact path; and keeping the flipping or tilting angle unchanged during the process of the gold finger board entering the forming, chamfering or edge treatment process, so that the gold finger area continuously avoids the contact path throughout the feeding and processing process.

[0081] In one embodiment, to prevent the gold surface of the gold finger plate from contacting the transmission or guide components in the processing equipment during the plate feeding and processing, the feeding posture of the gold finger plate is preset before entering the forming, chamfering or edge processing process.

[0082] First, based on the spatial positional relationship of the gold finger area relative to the contact path of the transmission or guide components in the processing equipment, as determined in the previous steps, the feeding direction of the gold finger plate is controlled by flipping. Specifically, through a flipping mechanism or adjustable guide device, the gold finger plate is flipped at a predetermined angle along its normal direction, so that the gold finger area is located on the non-contact side of the contact path, thereby preventing the gold finger area from directly facing the transmission or guide components during the feeding process. The flipping angle can be set according to the distribution position of the gold finger area in the material, for example, set to a 180° flip or a partial angle flip.

[0083] Subsequently, while maintaining the aforementioned flipping state, the feeding direction of the gold finger plate is tilted. An adjustable tilting mechanism allows the gold finger plate to form a preset tilt angle relative to the horizontal plane, causing the gold finger area to shift spatially relative to the contact path, either vertically or laterally, thereby further increasing the safe distance between the gold finger area and the contact path. The tilt angle can be adjusted according to the processing equipment structure and the plate size to achieve avoidance without affecting the stability of the feeding process.

[0084] After the gold finger plate enters the forming, chamfering, or edge treatment process, the aforementioned flipping angle and / or tilting angle remain unchanged throughout the entire feeding and processing process. By locking the posture of the flipping mechanism and tilting mechanism, the gold finger area is kept away from the contact path throughout the entire conveying, positioning, and processing process, thereby continuously preventing the gold finger area from forming direct or indirect contact with the transmission components or guide components.

[0085] In some embodiments, the flip angle and tilt angle can be written into the equipment control system as feeding parameters and automatically called according to different gold finger plate specifications to improve processing consistency and anti-scratch effect on the gold surface.

[0086] Most importantly, based on the spatial positional relationship between the gold finger area and the contact path of the transmission or guide components in the processing equipment, setting the flip angle of the gold finger plate along its normal direction includes: spatially locating the contact path of the transmission or guide components in the feeding direction of the processing equipment, and determining the positional distribution of the contact path in the feeding plane of the plate; calibrating the position of the gold finger area on the gold finger plate in the plate outline, and establishing a spatial correspondence between the gold finger area and the contact path; based on the spatial correspondence, calculating the relative orientation of the gold finger area with the contact path in the current feeding posture, and determining the direction in which the gold finger plate needs to be flipped along its normal direction; and setting the flip angle of the gold finger plate along its normal direction according to the determined flip direction, so that the gold finger area is flipped from the contact path side to the non-contact side corresponding to the contact path.

[0087] In one embodiment, to prevent the gold finger area from contacting the transmission or guide components in the processing equipment during the board feeding stage, the contact path of the transmission or guide components in the processing equipment in the board feeding direction is first spatially positioned before the gold finger plate enters the forming, chamfering, or edge processing process. Specifically, the movement trajectory of the transmission roller, guide rail, or clamping component in the board feeding direction is determined by the equipment structural parameters or by on-site calibration, and this movement trajectory is projected onto the board feeding plane to obtain the positional distribution range of the contact path in the board feeding plane.

[0088] Subsequently, the position of the gold finger area on the gold finger board within the board's outline is calibrated. Specifically, based on the design drawings of the gold finger board or through visual recognition, the positional relationship of the gold finger area relative to the board's edge is determined, and a spatial position model of the gold finger area in the board's coordinate system is established. By overlaying the position model of the gold finger area with the positional distribution of the contact path, a spatial correspondence between the gold finger area and the contact path is established.

[0089] Based on this, and using the established spatial correspondence, the relative orientation of the gold finger area with respect to the contact path under the current board-feeding posture is calculated. Specifically, it is determined whether the gold finger area is located on the same side, opposite side, or intersecting side of the contact path in the board-feeding direction. When it is determined that the gold finger area is located on the same side of the contact path or may enter the coverage area of ​​the contact path, it is determined that the gold finger board needs to be flipped along its normal direction, and the flipping direction is further determined to be the side that moves the gold finger area away from the contact path.

[0090] According to the determined flipping direction, the flipping device in the feeding mechanism sets the flipping angle of the gold finger plate along its normal direction. For example, in one specific embodiment, when the gold finger area is located on the left side of the contact path, the flipping device is controlled to flip the gold finger plate 180° around its normal direction, so that the gold finger area is flipped from the contact path side to the non-contact side corresponding to the contact path; in another embodiment, the flipping angle can also be set to less than 180° according to the limitations of the equipment structure, as long as it can ensure that the gold finger area completely avoids the contact path.

[0091] After setting the flip angle, the feeding posture after flipping is kept unchanged, so that the gold finger area is always on the non-contact side of the contact path during the subsequent feeding, conveying and processing, thereby effectively reducing the risk of scratches on the gold finger plate during processing.

[0092] Therefore, the embodiments should be considered as exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of the equivalents of the application are intended to be included within the invention.

[0093] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features of the invention herein.

Claims

1. A method for manufacturing anti-scratch materials for the gold surface of a gold finger plate, characterized in that, The process for using a gold finger board includes the following steps: Step S1: Cleaning the gold finger board and deburring the edges and forming contours to prevent hard protrusions from forming on the edges that could scratch the gold surface of the gold finger board; Step S2: During the conveying, erecting, or transfer of the gold finger board, setting the placement direction of the gold finger board so that the gold surface is located on the non-load-bearing side of the board and limiting the load-bearing position of the board to the part of the board body away from the gold finger area; Step S3: During the forming, chamfering, or edge treatment of the gold finger board, controlling the feeding posture of the gold finger board so that the gold finger area avoids the contact path of the transmission or guide components in the processing equipment; Step S4: After at least one manufacturing process is completed, inspecting the appearance of the gold surface of the gold finger board and separating gold finger boards with abnormal appearance from the corresponding manufacturing process.

2. The method for manufacturing anti-scratch coating for gold-plated plates according to claim 1, characterized in that, Step S2 includes the following steps: Step S21: Before the gold finger plate enters the conveying, erecting, or transfer process, determine the main force direction and force contact surface of the plate in the current process, and define the plate surface corresponding to the main force direction as the force side; Step S22: Based on the determination of the force side, adjust the placement direction of the gold finger plate so that the gold surface of the gold finger plate faces the non-force side opposite to the force side; Step S23: Select a non-functional area on the plate body that is far away from the gold finger area as the load-bearing force area, and make the load-bearing force area contact the conveying component, support component, or load-bearing component during the conveying, erecting, or transfer process; Step S24: When the gold finger plate moves along the conveying path or is erected or picked up, keep the load-bearing force area continuously under stress so that the friction force generated by the weight of the plate, pushing, or contact is always transmitted through the load-bearing force area and does not act on the plate body part of the gold finger area.

3. The method for manufacturing anti-scratch materials for the gold surface of a gold finger plate according to claim 2, characterized in that, Step S22 includes: determining the placement reference surface of the gold finger plate based on the contact relationship between the plate and the load-bearing component in the current conveying, erecting, or transfer process, and setting the plate surface corresponding to the force-bearing side as the placement reference surface; using the placement reference surface as a reference, flipping or adjusting the orientation of the gold finger plate so that the gold surface of the gold finger plate faces away from the placement reference surface, thereby placing the gold surface of the gold finger plate in a non-force-bearing state; after the orientation adjustment of the gold finger plate is completed, confirming that the gold surface of the gold finger plate does not form a contact relationship with the load-bearing component, conveying component, or supporting component, to ensure that the gold surface of the gold finger plate is located on the non-force-bearing side opposite to the force-bearing side; when the gold finger plate enters the conveying, erecting, or transfer process, maintaining the placement orientation without change, so that the gold surface of the gold finger plate remains on the non-force-bearing side throughout the entire force-bearing process.

4. The method for manufacturing anti-scratch coating for gold-plated finger plates according to claim 3, characterized in that, Confirming that the gold-plated surface of the gold finger plate does not form a contact relationship with the load-bearing component, conveying component, or supporting component involves: after the gold finger plate has been oriented, determining the contact interface between the gold finger plate and the load-bearing component, conveying component, or supporting component to determine the actual contact area of ​​the plate in its current state; comparing the actual contact area with the spatial position of the gold-plated surface of the gold finger plate to determine whether the gold-plated surface of the gold finger plate is outside the stress range corresponding to the actual contact area; When it is determined that the gold surface of the gold finger plate is not within the stress range corresponding to the actual contact area, it is confirmed that the gold surface of the gold finger plate is not in direct or indirect contact with the load-bearing component, conveying component or supporting component.

5. The method for manufacturing anti-scratch coating for gold-plated finger plates according to claim 4, characterized in that, The process of comparing the actual contact area with the spatial position of the gold surface on the gold finger board to determine whether the gold surface is outside the stress range corresponding to the contact area includes: determining the projection range of the actual contact area on the board surface based on the contact state between the gold finger board and the load-bearing component, conveying component, or supporting component to form the corresponding contact area outline; obtaining the distribution position of the gold surface on the board surface and mapping the distribution position of the gold surface to the same reference plane as the actual contact area outline; and comparing the relative positional relationship between the actual contact area outline and the mapped position of the gold surface to determine whether the gold surface overlaps, intersects, or enters the stress influence range of the contact area outline.

6. The method for manufacturing anti-scratch coating for gold-plated finger plates according to claim 1, characterized in that, Step S3, controlling the feeding posture of the gold finger plate to ensure the gold finger area avoids the contact path of the transmission or guide components in the processing equipment, specifically involves: before the gold finger plate enters the forming, chamfering, or edge processing process, identifying the transmission and guide components used for plate conveying or positioning in the processing equipment, and recognizing the plate contact path of the transmission or guide components during processing; obtaining the spatial positional relationship of the gold finger area on the gold finger plate within the plate outline, and mapping the position of the gold finger area to the contact path; setting the feeding posture of the gold finger plate according to the mapping relationship between the gold finger area and the contact path, so that the gold finger area deviates from the contact path of the transmission or guide components during feeding and processing; maintaining the feeding posture unchanged during the forming, chamfering, or edge processing of the gold finger plate, ensuring that the gold finger area continuously avoids the contact path of the transmission or guide components in the processing equipment throughout the entire processing process.

7. The method for manufacturing anti-scratch coating for gold-plated finger plates according to claim 6, characterized in that, Based on the correspondence between the gold finger area and the contact path, the feeding posture of the gold finger board is set, including: determining the relative orientation of the gold finger area with respect to the contact path based on the correspondence between the gold finger area and the contact path; determining the flipping direction or tilting direction of the gold finger board when feeding, so that the gold finger area deviates from the space side where the contact path is located when the board enters the processing equipment; and setting the feeding posture of the gold finger board by the flipping direction or tilting direction when feeding.

8. The method for manufacturing anti-scratch coating for gold-plated finger plates according to claim 7, characterized in that, The feeding posture of the gold finger board is set by the flipping or tilting direction during feeding. Specifically, during the feeding process, the gold finger board is flipped along its normal direction according to the spatial position relationship between the gold finger area and the contact path of the transmission or guide components in the processing equipment, wherein the flipping angle is 90° to 180°; or, while keeping the flipping state of the gold finger board unchanged, a tilting posture is applied to the gold finger board so that the surface of the gold finger board forms a tilting angle of 3° to 15° relative to the horizontal plane.

9. The method for manufacturing anti-scratch coating for gold-plated finger plates according to claim 7, characterized in that, Determining the relative orientation of the gold finger area relative to the contact path based on the correspondence between the gold finger area and the contact path includes: determining the contact path direction of the transmission component or guide component in the feeding direction of the processing equipment based on the correspondence between the gold finger area and the contact path, defining the direction of the contact path as the reference direction, and determining the position of the gold finger area on the gold finger plate in the outline of the plate, and mapping the position of the gold finger area to a reference plane corresponding to the reference direction of the contact path; determining the relative orientation relationship of the gold finger area relative to the contact path based on the reference plane, wherein the relative orientation relationship includes being on the same side, opposite side, or offset side of the contact path; and determining the relative orientation of the gold finger area relative to the contact path based on the relative orientation relationship.

10. The method for manufacturing anti-scratch coating for gold-plated finger plates according to claim 1, characterized in that, Step S4 involves inspecting the appearance of the gold surface of the gold finger board, including: performing a surface integrity test on the gold surface of the gold finger board by scanning the surface to identify any abnormal appearance features such as linear scratches, flaky wear, localized dullness, or surface discontinuities; inspecting the edge areas of the gold surface of the gold finger board to check for scratches or localized deformation caused by molding, chamfering, or conveyor contact; performing a consistency test on the surface condition of the gold surface of the gold finger board, which includes checking the uniformity of the gold surface gloss, the continuity of the gold layer, and the matching between the gold surface area and the design specifications; and based on the appearance inspection results, classifying and screening the gold finger boards to obtain either those with normal appearance or those with abnormal appearance.

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