Heat dissipation assembly, driving module and robot
The heat dissipation component, which combines end caps and flow guides, enables coordinated heat dissipation of the end face and side face of the heat source carrier inside the high power density robot drive module. This solves the problem of low heat dissipation efficiency in existing technologies and improves overall heat dissipation efficiency and equipment stability.
Patent Information
- Application Number
- CN202610224114.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-25
- Publication Date
- 2026-05-01
AI Technical Summary
In the existing technology, the internal heat dissipation scheme of the drive module of high power density robots is simple and cannot be targeted to organize and distribute airflow according to the distribution of heat sources, resulting in low heat dissipation efficiency and difficulty in meeting the requirements for stable operation.
The heat dissipation component adopts a combination of end caps and air guide shrouds. Through the design of air guide channels and air outlets, it achieves coordinated heat dissipation on the end face and side of the heat source carrier. It utilizes Bernoulli's principle to enhance the contact effect between airflow and heat source, and combines centrifugal fan to provide power support.
It improves the overall heat dissipation efficiency of the drive module, ensures effective heat dissipation of the heat source carrier end face and side heat source, meets the requirements of stable robot operation, and facilitates the miniaturization design and maintenance of the equipment.
Smart Images

Figure CN121968537A_ABST
Abstract
Description
A heat dissipation component, a drive module, and a robot Technical Field
[0001] This invention relates to the field of robot component technology, and in particular to a heat dissipation component, a drive module, and a robot. Background Technology
[0002] In related technologies, the internal space of the drive module of high-power-density robots is compact, and its main heat sources are the drive chip and the motor coil. The drive chip has a low upper temperature limit and is quite sensitive to temperature changes; while the motor coil has a relatively high upper temperature limit. Most air-cooling solutions are simple in design and have a single cooling target. They cannot organize and distribute airflow according to the different distributions of heat sources to achieve targeted and efficient coordinated heat dissipation, making it difficult to meet the requirements for stable operation of the drive module. Summary of the Invention
[0003] This invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of this invention is to provide a heat dissipation assembly. According to the heat dissipation assembly of this invention, by cooperating with the end cap and the air guide, targeted and efficient synergistic heat dissipation can be achieved on the end face and side heat source of the heat source carrier, thereby improving the overall heat dissipation efficiency.
[0004] The present invention also proposes a drive module having the above-mentioned heat dissipation components.
[0005] The present invention also proposes a robot having the above-mentioned drive module.
[0006] The heat dissipation assembly according to the present invention includes: an end cap for mounting on the end face of a heat source carrier; and a flow guide shroud disposed on the end cap, the flow guide shroud extending to the outer periphery of the end cap and defining an airflow channel for airflow with the end cap, at least a portion of the flow guide shroud protruding from the outer periphery of the end cap, and forming an air outlet communicating with the airflow channel in the protruding at least portion of the flow guide shroud, the air outlet being adapted to discharge air to the side of the heat source carrier, and an air inlet communicating with the airflow channel being provided on the top of the end cap or the flow guide shroud.
[0007] The heat source carrier has heat sources only on its sides (i.e., heat-generating components, such as motors in joint modules) or both its end faces (e.g., drive circuit boards, control circuit boards) and sides. The heat dissipation assembly, including end caps and air guides, can form air inlets, air channels, and air outlets on the end faces and sides of the heat source carrier, effectively covering the heat sources on each side of the heat source carrier, thus enabling heat dissipation from the end faces and / or sides of the heat source carrier. Specifically, when airflow enters from the air inlet and passes through the air channel, it carries away the heat from the end faces of the heat source carrier, thereby achieving heat dissipation from the end faces of the heat source carrier. When airflow exits from the air outlet, it can directly blow towards the sides of the heat source carrier, or, based on Bernoulli's principle (increasing the airflow speed increases the effect of Bernoulli's principle), bring in cooler air (relative to the outflowing airflow) from both sides of the air outlet to contact the sides of the heat source carrier, thereby achieving heat dissipation from the sides of the heat source carrier. It should be noted that the airflow blowing out of the vent, due to Bernoulli's principle, carries in cool air from both sides of the vent, increasing the airflow volume. This increases the contact area and contact time between the airflow and the sides of the heat source carrier, thereby improving the heat dissipation effect. Even when there are heat sources on both the end face and sides of the heat source carrier, the hot air flowing out of the vent, although having already exchanged heat with the heat source on the end face and absorbed some heat, still meets the condition for secondary heat exchange with the heat source on the sides. This is because, typically, the heat from the circuit board is lower than that from the motor, thus allowing for continued effective heat dissipation from the heat source on the sides of the heat source carrier. For example, when the heat dissipation component is used in a joint module, the end face drive circuit board / control circuit board of the joint module has heat sources such as chips and other electronic components with low temperature resistance limits. The heat sources distributed on the end face can be efficiently dissipated through the air guide channel. Meanwhile, the sides of the joint module generate heat due to the operation of internal motors, etc., with higher temperature resistance limits. Air outlets facing the sides can directly dissipate heat from the sides, forming a synergistic heat dissipation for the end face and sides of the joint module, improving overall heat dissipation efficiency. In summary, according to the heat dissipation component of the present invention, through the cooperation of the end cover and the air guide shroud, not only is heat dissipation of the end face heat source of the heat source carrier achieved, but also the air outlet formed by the air guide shroud protruding from the outer periphery of the end cover guides the airflow to the side of the heat source carrier, thereby effectively dissipating the heat from the side heat source. It can rationally organize and distribute the airflow according to the distribution characteristics and temperature resistance requirements of different heat sources, achieving targeted and efficient synergistic heat dissipation.
[0008] According to some embodiments of the present invention, the flow guide is disposed on the inner or outer surface of the end cap.
[0009] When the air guide shroud is located on the inner surface of the end cover, its overall structure is more compact, effectively utilizing the space inside the end cover. This results in a smaller overall volume of the heat source carrier after the heat dissipation components are installed, occupying less space and facilitating miniaturization of the equipment. In this case, the air guide channel is formed between the inner surface of the end cover and the air guide shroud. Airflow can enter from the air inlet on the end cover, pass through the air guide channel, and exit from the air outlet protruding from the outer periphery of the end cover. When the air guide shroud is located on the outer surface of the end cover, it facilitates the processing, installation, and maintenance of the air guide shroud and air guide channel. When the air guide shroud needs to be adjusted or replaced, there is no need to remove the end cover from the heat source carrier, making operation more convenient. In this case, the air guide shroud is directly fixed to the outside of the end cover, and the air guide channel is formed between the outer surface of the end cover and the air guide shroud. Airflow can enter from the air inlet on the air guide shroud, pass through the air guide channel, and exit from the air outlet protruding from the outer periphery of the end cover.
[0010] According to some embodiments of the present invention, the air guide shroud is disposed on the inner surface of the end cap, and the end cap is provided with the air inlet; the air guide shroud includes: an air guide protrusion, the air guide protrusion protruding from the inner surface of the end cap, the air guide protrusion being configured as a plurality of protrusions spaced apart in the circumferential direction, and a first air guide section being formed between two adjacent air guide protrusions; an outer air guide portion, the outer air guide portion protruding from the outer periphery of the end cap and having a second air guide section formed inside, communicating with the first air guide section, the first air guide section and the second air guide section jointly defining the air guide channel, the second air guide section bending toward the air inlet, and the outer end of the second air guide section forming the air outlet.
[0011] The guide protrusions guide and distribute airflow during its flow, causing the cold air entering from the air inlet to disperse circumferentially and form multiple radially flowing airflows. A first guide section is formed between two adjacent guide protrusions. The airflow flows radially within the first guide section and then flows towards the outer guide section.
[0012] When the airflow flows radially from the first guide section to the outer periphery of the end cap, it flows from the first guide section into the second guide section. The first and second guide sections together define the airflow channel, ensuring that the airflow can form a complete flow path inside the end cap.
[0013] The second guide section changes the airflow direction, directing the airflow from radial flow to the side of the heat source carrier. An outlet is formed at the outer end of the second guide section. When the airflow reaches the outer end of the second guide section, it exits the airflow channel through the outlet and flows along the side of the heat source carrier, achieving heat dissipation from the side of the heat source carrier.
[0014] According to some embodiments of the present invention, the air guide shroud is disposed on the outer surface of the end cap; the air guide shroud includes: a center plate having an air inlet extending through in the thickness direction; an extension plate disposed on the outer periphery of the center plate and extending towards the outer periphery of the air guide shroud, the extension plates being configured as a plurality and spaced apart in the circumferential direction of the center plate; an airflow guide wall being configured as a plurality corresponding one-to-one with the extension plates, the airflow guide wall being disposed at the radially outer end of the extension plate and bending towards the air inlet; and side plates disposed on both sides of each extension plate in the circumferential direction and extending to the airflow guide wall to define the airflow channel.
[0015] The central plate is located at the intersection of multiple extension plates, and its air inlets simultaneously introduce external cold air into multiple airflow channels defined by the extension plates. It should be noted that the central plate can be positioned at the center of the airflow shroud or, depending on the actual design requirements, off-center. When the central plate is in the center, it ensures that the airflow entering from the air inlets is evenly distributed to the airflow channels between the extension plates, resulting in relatively consistent airflow rate and velocity within each channel, thus providing more uniform heat dissipation to different areas on the side of the heat source carrier. When the central plate is off-center, it can selectively guide more airflow to areas with relatively concentrated heat sources or higher heat generation, based on the different heat density and heat generation on the side of the heat source carrier, achieving more targeted heat dissipation and further optimizing heat dissipation efficiency.
[0016] Extension plates extend radially outward from the outer periphery of the center plate to guide airflow radially. By constructing multiple extension plates spaced apart circumferentially on the center plate, the cold air entering from the air inlet is dispersed circumferentially, forming multiple radially flowing airflows. Each extension plate has an airflow guide wall at its radially outer end. The airflow guide wall bends towards the air inlet to guide the airflow and change its direction, so that the originally radially flowing airflow can be redirected by the airflow guide wall upon reaching the radially outer end, thereby blowing towards the side of the drive module.
[0017] The side plates are used to restrict airflow in the circumferential direction, forcing the airflow to flow along the extension direction of the extension plate and the airflow guide wall. By restricting the airflow in the circumferential direction through the side plates, the shroud can guide and distribute the airflow, improving the airflow velocity, utilization rate, and heat dissipation efficiency.
[0018] According to some embodiments of the present invention, the heat dissipation assembly further includes a centrifugal fan rotatably disposed on the end cover, the pivot axis of the centrifugal fan being perpendicular to the end cover and located at the air inlet, and a plurality of the air guide channels being located on the radial outer periphery of the centrifugal fan.
[0019] Centrifugal fans can rotate around their own pivot axis. Through rotation, centrifugal fans can generate airflow, providing power for the entire cooling process.
[0020] Centrifugal fans, when rotating, can directly act on the cold air entering from the inlet, more effectively drawing in cold air and accelerating and propelling it towards other areas inside the end cover. Specifically, centrifugal fans are axially inlet fans with radially outlet fans.
[0021] When a centrifugal fan rotates, the airflow it generates is dispersed around its circumference. Through multiple air guide channels on the radial outer periphery of the centrifugal fan, the airflow is further organized and distributed, allowing the airflow to be distributed within each air guide channel and flow radially along the extension direction of the air guide channel.
[0022] According to some embodiments of the present invention, the heat dissipation assembly further includes a heat dissipation component disposed within the air guide channel, and a heat dissipation fin is formed on the heat dissipation component.
[0023] The heat dissipation component absorbs heat from the heat source at the end face of the heat source carrier and carries it away through airflow in the airflow channel, thereby further enhancing the heat dissipation capacity of the heat dissipation assembly. In some specific embodiments, the heat dissipation component can be in direct contact with the heat source (such as the driver circuit board / control circuit board) at the end face of the heat source carrier or indirect contact through a thermally conductive medium to ensure that heat can be efficiently transferred to the heat dissipation component and then dissipated through airflow. For example, one end of the heat dissipation component is attached to the surface of the driver chip, and the other end extends into the airflow channel, so that the heat generated by the driver chip can be quickly conducted to the heat dissipation component in the airflow channel and carried away by the flowing airflow, thereby effectively reducing the operating temperature of the driver chip and ensuring its stable operation.
[0024] According to some embodiments of the present invention, the air guide channel is constructed in multiple ways, and each air guide channel is provided with at least one heat dissipation component. The multiple heat dissipation components are adapted to correspond one-to-one with multiple heat sources on the end face of the heat source carrier.
[0025] When multiple heat sources are distributed on the end face of the heat source carrier, heat dissipation components corresponding to the positions and numbers of the multiple heat sources can be installed in each air guide channel. Each heat dissipation component is in close contact with its corresponding heat source and is equipped with a heat sink, so that the heat generated by each heat source can be quickly conducted to the air guide channel through its corresponding heat dissipation component and carried away by the flowing airflow, thereby achieving efficient heat dissipation of multiple dispersed heat sources on the end face of the heat source carrier. Moreover, when combined with the aforementioned implementation where the air guide shroud is installed on the inner surface of the end cover, the heat dissipation component is located in the "thermal space" formed by the heat generated by the heat sources on the end face of the end cover, thus absorbing heat more easily and facilitating heat dissipation.
[0026] According to some embodiments of the present invention, the flow guide is disposed on the inner surface of the end cap, and the heat dissipation component is at least partially adapted to contact the heat source at the end face of the heat source carrier.
[0027] The heat dissipation component and the air guide are both located inside the end cover, and the heat dissipation component can be set on the inner surface of the end cover. They are in contact with or partially in contact with the heat source, ensuring that heat is quickly transferred from the heat source to the heat dissipation component and forming a more direct heat transfer path with the heat source. For example, when the heat source is a drive circuit board, the heat sink can be directly attached to the surface of the drive circuit board. The heat generated by the chip on the drive circuit board when it is working can be quickly conducted to the heat sink and then quickly carried away by the airflow in the air guide channel, improving the heat conversion efficiency and effectively reducing the temperature of the chip.
[0028] The drive module according to the present invention is briefly described below.
[0029] The drive module according to the present invention includes a drive module body and a heat dissipation component, wherein the heat dissipation component is configured as described in any of the above embodiments, and the end cap of the heat dissipation component is mounted on the end face of the drive module body.
[0030] The end face of the drive module body has heat sources with low upper temperature limits, such as drive circuit boards or control circuit boards. After the end cover of the heat dissipation component is installed on the end face, the airflow channel can directly act on these heat sources on the end face, quickly removing heat through airflow and preventing the chip from being affected or damaged due to excessive temperature. At the same time, during the operation of the drive module body, its sides will generate a lot of heat due to the continuous operation of internal electric and / or mechanical components (such as motors, reducers, etc.), and the upper temperature limit of the side structure is relatively high. The air outlet of the heat dissipation component protrudes from the outer periphery of the end cover and blows air out towards the side, which can directly blow the airflow accelerated and guided by the airflow channel to the side, dissipating the heat on the side. Therefore, the heat dissipation component can simultaneously take into account the different heat dissipation needs of the heat source carrier end face and the side, forming a synergistic heat dissipation effect and improving the overall heat dissipation efficiency of the drive module body.
[0031] Since the drive module according to the present invention includes the heat dissipation component described in any of the above embodiments, the drive module according to the present invention can effectively dissipate heat from the side of the heat source carrier by means of the heat dissipation component, thereby meeting the requirements for stable operation.
[0032] According to some embodiments of the present invention, the drive module body is a motor, the end cover is disposed at the end of the motor, and the air outlet is adapted to discharge air to the side of the motor.
[0033] When the motor is running, the side of its casing will continuously generate heat due to the electromagnetic induction of the internal windings. The air outlet faces the side of the motor and blows the cold air that has been guided and accelerated through the air guide channel directly onto the outer wall of the motor side. As the airflow flows along the side of the motor, it exchanges heat with the motor casing, carrying away the heat from the casing and thus reducing the overall temperature of the motor.
[0034] According to some embodiments of the present invention, the motor end is provided with a circuit board, and the air guide channel corresponds to the circuit board.
[0035] The circuit board integrates multiple heat-generating components such as driver chips and capacitors, and the airflow channel corresponds to the circuit board. Cool air entering the airflow channel from the inlet absorbs heat from the circuit board. Subsequently, the airflow exits from the outlet and blows towards the side of the motor, efficiently cooling both the circuit board and the side of the motor. This achieves coordinated heat dissipation between the circuit board at the motor end and the side of the motor, ensuring that all components on the motor and circuit board are within a suitable operating temperature range. Furthermore, when the airflow blows from the outlet towards the side of the motor (e.g., parallel to the side), based on Bernoulli's principle (increasing the airflow speed amplifies the Bernoulli effect), it draws in cool air from both sides of the outlet (relative to the outflowing airflow) to contact the side of the motor, thus achieving heat dissipation for the side of the motor.
[0036] According to some embodiments of the present invention, the drive module body is a joint module, the end cap is disposed at the end of the joint module, and the air outlet is adapted to discharge air to the side of the joint module.
[0037] During operation, the joint module generates heat on its sides due to the operation of the motor and reducer. The air outlet faces the side of the joint module, directly blowing the airflow from the air guide channel onto the side of the joint module. As the airflow flows along the side of the joint module, it carries away the heat, thus reducing the temperature of the side of the joint module. Furthermore, when the airflow blows from the air outlet onto the side of the joint module (e.g., parallel to the side), based on Bernoulli's principle (increasing the airflow speed amplifies the Bernoulli effect), it brings in cooler air from both sides of the air outlet (relative to the outflowing airflow) to come into contact with the side of the joint module, thereby achieving heat dissipation from the side of the joint module.
[0038] According to some embodiments of the present invention, the end of the joint module is provided with a circuit board, and the air guide channel corresponds to the circuit board.
[0039] The ends of the joint module may be equipped with control circuit boards or drive circuit boards. These circuit boards contain various heat-generating electronic components, and the air ducts are correspondingly set to these electronic components (mainly chips / processors) on the circuit boards. Cool air enters from the air inlet and is guided into the air duct by the air guide shroud, absorbing heat and achieving targeted heat dissipation for the circuit boards.
[0040] The robot according to the present invention is briefly described below.
[0041] The robot according to the present invention includes the drive module described in any of the above embodiments. Because the robot according to the present invention includes the drive module described in any of the above embodiments, the robot according to the present invention can ensure stable joint operation, thereby improving the overall stability and reliability of operation.
[0042] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0043] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0044] Figure 1 is a schematic diagram of a heat dissipation assembly according to an embodiment of the present invention; Figure 2 is a cross-sectional view of a heat dissipation assembly according to an embodiment of the present invention; Figure 3 is a perspective view of a heat dissipation assembly according to an embodiment of the present invention; Figure 4 is a perspective view of a heat dissipation assembly according to another embodiment of the present invention; Figure 5 is an exploded view of a heat dissipation assembly according to another embodiment of the present invention.
[0045] Reference numerals: 1. Heat dissipation component; 11. End cap; 111. Air duct; 112. Air inlet; 113. Air outlet; 115. Air guide shroud; 1151. Center plate; 1152. Extension plate; 1153. Airflow guide wall; 1154. Side plate; 1161. Airflow protrusion; 117. Outer airflow guide; 12. Heat dissipation component; 13. Centrifugal fan; 21. Housing; 22. Circuit board. Detailed Implementation
[0046] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0047] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.
[0048] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0049] In related technologies, the internal space of the drive module of high-power-density robots is compact, and its main heat sources are the drive chip and the motor coil. The drive chip has a low upper temperature limit and is quite sensitive to temperature changes; while the motor coil has a relatively high upper temperature limit. Most air-cooling solutions are simple in design and have a single cooling target. They cannot organize and distribute airflow according to the different distributions of heat sources to achieve targeted and efficient coordinated heat dissipation, making it difficult to meet the requirements for stable operation of the drive module.
[0050] The heat dissipation assembly 1 according to an embodiment of the present invention will now be described with reference to Figures 1-5.
[0051] As shown in Figures 1-5, the heat dissipation assembly 1 according to the present invention includes an end cap 11 and a flow guide 115. The end cap 11 is used to install on the end face of the heat source carrier. The heat source carrier is a device that can internally accommodate components that generate heat, such as a drive module, specifically a motor or a joint module. Both the motor and the joint module can be equipped with a circuit board 22 (such as a drive circuit board, a control circuit board, etc.), and the joint module can also contain a motor, a reducer, etc. The heat dissipation assembly 1 is installed on the end face of the heat source carrier through the end cap 11, which can effectively cover the heat source on the end face and / or sides of the heat source carrier, so that heat dissipation treatment can be performed on the end face and / or sides of the heat source carrier based on the heat dissipation assembly 1 during application.
[0052] The air guide shroud 115 extends to the outer periphery of the end cap 11, defining an air guide channel 111 for airflow. An air inlet 112 communicating with the air guide channel 111 is provided on the top of the end cap 11 or the air guide shroud 115. When airflow enters from the air inlet 112 and passes through the air guide channel 111, it can carry away heat from the heat source end face of the heat source carrier, thereby achieving heat dissipation from the heat source end face. At least a portion of the air guide shroud 115 protrudes from the outer periphery of the end cap 11, forming an air outlet 113 communicating with the air guide channel 111 in the protruding portion of the air guide shroud 115. The air outlet 113 is adapted to discharge air to the side of the heat source carrier. When airflow exits from outlet 113, it can directly blow towards the side of the heat source carrier, or, based on Bernoulli's principle (increasing the airflow speed amplifies the Bernoulli effect), bring in cool air from both sides of outlet 113 (relative to the outflowing airflow) to contact the side of the heat source carrier, thereby achieving heat dissipation from the side of the heat source carrier. It should be noted that the airflow exiting outlet 113, due to Bernoulli's principle, brings in cool air from both sides of outlet 113, increasing the airflow rate. This increases the contact area and contact time between the airflow and the side of the heat source carrier, thus improving the heat dissipation effect.
[0053] In cases where both the end face and side face of the heat source carrier have heat sources, although the hot air flowing out of the air outlet 113 has already exchanged heat with the heat source on the end face of the heat source carrier within the air guide channel 111 and absorbed some heat, it still meets the conditions for secondary heat exchange with the heat source on the side face of the heat source carrier. This is because, generally, the heat of the circuit board is lower than that of the motor, thus it can continue to effectively dissipate heat from the heat source on the side face of the heat source carrier. For example, when the heat dissipation component 1 is used in a joint module, the end face of the joint module's drive circuit board / control circuit board has heat sources such as chips and other electronic components with low temperature resistance limits. The air guide channel 111 can efficiently dissipate the heat sources distributed on the end face. Meanwhile, the side face of the joint module will generate heat with higher temperature resistance limits due to the operation of the internal motor, etc. The air outlet 113 facing the side can directly dissipate heat from the side, forming a synergistic heat dissipation of the end face and side face of the joint module, improving the overall heat dissipation efficiency.
[0054] According to the heat dissipation assembly 1 of the present invention, the cooperation between the end cap 11 and the air guide shroud 115 not only realizes the heat dissipation of the end face heat source of the heat source carrier, but also utilizes the air outlet 113 formed by the air guide shroud 115 protruding from the outer periphery of the end cap 11 to guide the airflow to the side of the heat source carrier, thereby effectively dissipating the heat of the side heat source. It can rationally organize and distribute the airflow according to the distribution characteristics and temperature resistance requirements of different heat sources, and realize targeted and efficient synergistic heat dissipation.
[0055] Therefore, according to the heat dissipation assembly 1 of the present invention, by cooperating with the end cap 11 and the flow guide shroud 115, targeted and efficient synergistic heat dissipation can be achieved on the end face and side heat source of the heat source carrier, thereby improving the overall heat dissipation efficiency.
[0056] According to some embodiments of the present invention, as shown in Figures 1-5, the flow guide 115 is disposed on the inner or outer surface of the end cap 11.
[0057] When the air guide shroud 115 is located on the inner surface of the end cover 11, its overall structure is more compact, effectively utilizing the space inside the end cover 11. This results in a smaller overall volume of the heat source carrier after the heat dissipation component 1 is installed on it, occupying less space and facilitating the miniaturization of the equipment. In this case, the air guide channel 111 is formed between the inner surface of the end cover 11 and the air guide shroud 115. Airflow can enter from the air inlet 112 on the end cover 11, pass through the air guide channel 111, and exit from the air outlet 113 protruding from the outer periphery of the end cover 11. When the air guide shroud 115 is located on the outer surface of the end cover 11, it facilitates the processing, installation, and maintenance of the air guide shroud 115 and the air guide channel 111. When the air guide shroud 115 needs adjustment or replacement, it is not necessary to remove the end cover 11 from the heat source carrier, making operation more convenient. At this time, the air guide 115 is directly fixed to the outside of the end cover 11, and the air guide channel 111 is formed between the outer surface of the end cover 11 and the air guide 115. The airflow can enter from the air inlet 112 provided in the air guide 115, and exit from the air outlet 113 protruding from the outer periphery of the end cover 11 through the air guide channel 111.
[0058] According to some embodiments of the present invention, as shown in Figures 3-5, the air guide channel 111 extends radially along the end cap 11, such that the air guide channel 111 can constrain the flow direction of the airflow, causing it to flow radially.
[0059] An air outlet 113 is provided at the radial outer end of the air guide channel 111. Outside air can directly enter the air guide channel 111 through the air inlet 112, flow radially towards the outer periphery of the end cover 11, and finally be discharged from the air outlet 113. The radially extending air guide channel 111 can make full use of the radial space of the end cover 11, making the airflow path shorter and the resistance lower during the flow process, which helps to increase the airflow rate and velocity, and enhance the heat dissipation effect. In some specific embodiments, the air guide shroud 115 is provided on the inner surface of the end cover 11, and the air inlet 112 can be located at the center of the end cover 11, so that the airflow flows radially from the center to the surrounding air guide channel 111, which can be evenly distributed to each air outlet 113, ensuring the heat dissipation uniformity of each area of the heat source carrier side heat source.
[0060] It should be noted that the air guide channel 111 can extend in a straight line along the radial direction of the end cover 11, or it can extend in a curve or a broken line, as long as it can guide the airflow from the air inlet 112 to the air outlet 113.
[0061] According to some embodiments of the present invention, as shown in Figures 1-3, a flow guide shroud 115 is disposed on the inner surface of an end cap 11, and the end cap 11 is provided with an air inlet 112. The flow guide shroud 115 includes flow guide protrusions 1161 and an outer flow guide portion 117. The flow guide protrusions 1161 protrude from the inner surface of the end cap 11, and are configured as a plurality of protrusions spaced apart in the circumferential direction. The flow guide protrusions 1161 can guide and distribute the airflow during the airflow process, so that the cold air entering from the air inlet 112 is dispersed in the circumferential direction and forms a plurality of radially flowing airflows. A first flow guide section is formed between two adjacent flow guide protrusions 1161. The airflow flows radially within the first flow guide section and flows toward the outer flow guide portion 117.
[0062] The outer guide section 117 protrudes from the outer periphery of the end cover 11 and has a second guide section inside that communicates with the first guide section. When the airflow flows radially from the first guide section to the outer periphery of the end cover 11, it flows from the first guide section into the second guide section. The first guide section and the second guide section together define the airflow channel 111, ensuring that the airflow can form a complete flow path inside the end cover 11.
[0063] The second guide section bends towards the air inlet 112, thereby changing the airflow direction and guiding the airflow from radial flow to the side of the heat source carrier. The outer end of the second guide section forms an air outlet 113. When the airflow reaches the outer end of the second guide section, it exits the air guide channel 111 through the air outlet 113 and flows along the side of the heat source carrier, achieving heat dissipation from the side of the heat source carrier.
[0064] It should be noted that Figure 3 shows the airflow direction from the outlet 113 on the second guide section. When the airflow enters the second guide section from the first guide section, the curved inner wall of the second guide section guides the airflow, causing the airflow that was originally flowing radially outward along the end cap 11 to gradually change direction, eventually flowing out of the outlet 113 in a direction parallel to the side of the heat source carrier. Based on Bernoulli's principle, the high-speed airflow from the outlet 113 creates a low-pressure area around it, thereby continuously drawing in and carrying the ambient cold air (which is cooler than the exhaust air that has absorbed heat) to the side of the heat source carrier. The brought-in ambient cold air acts on the side of the heat source carrier, exchanging heat through contact with the side heat source.
[0065] According to some embodiments of the present invention, as shown in Figures 4 and 5, a flow deflector 115 is disposed on the outer surface of the end cap 11. The flow deflector 115 includes a center plate 1151, extension plates 1152, airflow guide walls 1153, and side plates 1154. An air inlet 112 extending in the thickness direction is formed on the center plate 1151. The center plate 1151 is located at the intersection of multiple extension plates 1152, and the air inlet 112 thereon can simultaneously introduce external cold air into multiple air guide channels 111 defined by the multiple extension plates 1152.
[0066] It should be noted that the center plate 1151 can be located at the center of the air guide shroud 115, or it can be located off-center from the air guide shroud 115 according to actual design requirements. When the center plate 1151 is in the center position, it can ensure that the airflow entering from the air inlet 112 is evenly distributed to the air guide channels 111 between each extension plate 1152, so that the airflow rate and velocity in each air guide channel 111 are relatively consistent, thereby making the heat dissipation of different areas on the side of the heat source carrier more uniform. When the center plate 1151 is in the off-center position, it can guide more airflow to areas where the heat source is relatively concentrated or where the heat generation is large, according to the different heat source distribution density and heat generation on the side of the heat source carrier, to achieve more targeted heat dissipation distribution and further optimize heat dissipation efficiency.
[0067] Extension plates 1152 are disposed on the outer periphery of the center plate 1151 and extend along the outer periphery of the shroud 115. Multiple extension plates 1152 are configured and spaced apart circumferentially from the center plate 1151. The extension plates 1152 extend from the outer periphery of the center plate 1151 to the outer periphery of the shroud 115, guiding airflow. By configuring multiple extension plates 1152 and spaced apart circumferentially from the center plate 1151, the cold air entering from the air inlet 112 is dispersed circumferentially, forming multiple airflows that guide the airflow along the outer periphery of the shroud 115.
[0068] The airflow guide wall 1153 is constructed in multiple ways, corresponding one-to-one with the extension plate 1152, and is disposed at the radial outer end of the extension plate 1152. Therefore, each extension plate 1152 has an airflow guide wall 1153 at its radial outer end. The airflow guide wall 1153 is bent towards the air outlet 1 to guide the airflow and change its direction. This allows the airflow, which originally flows radially, to turn under the guidance of the airflow guide wall 1153 when it reaches the radial outer end, and blow from the air outlet towards the outer wall surface of the drive module. By utilizing Bernoulli's principle, the cold air on both sides of the air outlet is brought into the flow through the outer wall surface of the drive module, which can increase the airflow rate. Therefore, it can increase the contact area and contact time between the airflow and the side of the heat source carrier, thereby improving the heat dissipation effect.
[0069] Side plates 1154 are disposed on both sides of each extension plate 1152 in the circumferential direction and extend to the airflow guide wall 1153 to define the airflow channel 111. The side plates 1154 are used to restrict the flow of air in the circumferential direction, forcing the airflow to flow along the extension direction of the extension plate 1152 and the airflow guide wall 1153. By restricting the airflow in the circumferential direction by the side plates 1154, the air hood 115 can guide and distribute the airflow, improving the airflow velocity, utilization rate and heat dissipation efficiency.
[0070] According to some embodiments of the present invention, as shown in Figures 1-5, the heat dissipation assembly 1 further includes a centrifugal fan 13, which is rotatably disposed on the end cover 11, allowing the centrifugal fan 13 to rotate about its own pivot axis. Through rotation, the centrifugal fan 13 generates airflow, providing power support for the entire heat dissipation process.
[0071] The pivot axis of the centrifugal fan 13 is perpendicular to the end cover 11 and located at the air inlet 112, so that when the centrifugal fan 13 rotates, it can directly act on the cold air entering from the air inlet 112, and can more effectively draw in the cold air and accelerate and push it to other areas inside the end cover 11. Specifically, the centrifugal fan 13 is an axially intake and radially exhaust fan.
[0072] Multiple air guide channels 111 are located on the radial outer periphery of the centrifugal fan 13. When the centrifugal fan 13 rotates, the airflow it generates is dispersed in its circumference. Through the multiple air guide channels 111 on the radial outer periphery of the centrifugal fan 13, the airflow is further organized and distributed, so that the airflow can be distributed in each air guide channel 111 and flow radially along the extension direction of the air guide channel 111.
[0073] According to some embodiments of the present invention, as shown in Figures 2-5, the heat dissipation assembly 1 further includes a heat dissipation component 12, which is disposed within the airflow channel 111. The heat dissipation component 12 absorbs heat from the heat source end face of the heat source carrier and carries the heat away through the airflow within the airflow channel 111, thereby further enhancing the heat dissipation capacity of the heat dissipation assembly 1. In some specific embodiments, the heat dissipation component 12 can be in direct contact with the heat source (such as a drive circuit board / control circuit board) at the end face of the heat source carrier or indirect contact through a thermally conductive medium to ensure that heat can be efficiently transferred to the heat dissipation component 12 and then dissipated through the airflow. For example, one end of the heat dissipation component 12 is attached to the surface of the drive chip, and the other end extends into the airflow channel 111, so that the heat generated by the drive chip can be quickly conducted to the heat dissipation component 12 within the airflow channel 111 and carried away by the flowing airflow, thereby effectively reducing the operating temperature of the drive chip and ensuring its stable operation.
[0074] The heat dissipation component 12 has heat dissipation fins formed on it. The heat dissipation fins are constructed in multiple ways. By contacting the air with the heat dissipation fins, the heat dissipation area is increased, which can more effectively transfer heat from the heat dissipation component 12 to the air.
[0075] Each heat sink extends along the direction of the airflow channel 111, ensuring that air makes full contact with the heat sink as it flows through the channel. The air carries away heat from the heat sink during its flow. The heat sink's extension along the airflow direction allows air to flow along it, guaranteeing a longer contact time and a larger contact area between the air and the heat sink, thereby improving heat exchange efficiency.
[0076] Multiple heat sinks are spaced apart from each other in a direction perpendicular to the extension of the air guide channel 111, providing flow gaps for airflow. This allows air to flow smoothly between the heat sinks, ensuring stable heat dissipation. For example, when the air guide channel 111 extends radially, the heat sinks also extend radially, forming gaps between adjacent heat sinks that allow airflow. After entering from the air inlet 112, the cool air flows radially within the air guide channel 111, passing through the gaps between the heat sinks in sequence, fully absorbing the heat from the heat sinks, and then is discharged from the air outlet 113 and blown toward the side of the heat source carrier.
[0077] According to some embodiments of the present invention, the air guide channel 111 is constructed in multiple ways, and each air guide channel 111 is provided with at least one heat dissipation component 12. The multiple heat dissipation components 12 are adapted to correspond one-to-one with multiple heat sources on the end face of the heat source carrier.
[0078] When multiple heat sources are distributed on the end face of the heat source carrier, heat dissipation components 12 corresponding to the positions and numbers of the multiple heat sources can be installed in each air guide channel 111. Each heat dissipation component 12 is in close contact with the corresponding heat source and is equipped with heat dissipation fins, so that the heat generated by each heat source can be quickly conducted into the air guide channel 111 through the corresponding heat dissipation component 12 and carried away by the flowing airflow in time, thereby achieving efficient heat dissipation of multiple dispersed heat sources on the end face of the heat source carrier. Moreover, when combined with the aforementioned implementation where the air guide shroud 115 is installed on the inner surface of the end cover 11, the heat dissipation component 12 is located in the "thermal space" formed by the heat generated by the heat source on the end face of the end cover 11, thus absorbing heat more easily and dissipating heat more conveniently.
[0079] According to some embodiments of the present invention, the flow guide 115 is disposed on the inner surface of the end cover 11, and the heat dissipation component 12 is also located on the inner side of the end cover 11. The heat dissipation component 12 can be disposed on the inner surface of the end cover 11 and is in contact with or partially in contact with the heat source to ensure that heat is quickly transferred from the heat source to the heat sink.
[0080] At least a portion of the heat dissipation component 12 is adapted to contact the heat source at the end face of the heat source carrier, enabling a more direct heat transfer path to be formed between the heat dissipation component 12 and the heat source. For example, when the heat source is a drive circuit board, the heat sink can be directly attached to the surface of the drive circuit board. The heat generated when the chip on the drive circuit board is working can be quickly conducted to the heat sink and then quickly carried away by the airflow flowing in the air duct 111, thereby improving the heat conversion efficiency and effectively reducing the temperature of the chip.
[0081] According to some embodiments of the present invention, as shown in Figures 3-5, the air guide channels 111 are configured as a plurality and are arranged circumferentially around the center point of the end cover 11. The heat dissipation components 12 are configured as a plurality corresponding one-to-one with the air guide channels 111, such that each air guide channel 111 is provided with a heat dissipation component 12.
[0082] By constructing multiple air ducts 111, the heat dissipation components 12 within each air duct 111 can be used to target and dissipate heat from more heat-generating components, further improving the comprehensiveness and efficiency of heat dissipation. For example, when multiple heat-generating components on the heat source carrier are circumferentially distributed on the end face, the heat dissipation components 12 corresponding to each air duct 111 can contact these heat-generating components respectively, so that the heat generated by each heat-generating component can be quickly transferred to the air duct 111 through the corresponding heat dissipation component 12 and carried away by the flowing airflow, improving the heat dissipation efficiency of the entire heat dissipation assembly 1 for the driver. At the same time, when external cold air enters each air duct 111 from the air inlet 112 at the top of the end cover 11, it will flow radially under the guidance of the air duct 111 and finally be blown out from the air outlet 113 at the radial outer end. Since the air ducts 111 are circumferentially spaced, the blown airflow will form multiple circumferentially distributed airflows around the outer wall of the drive module, which can more comprehensively cover the outer wall of the drive module, increase the heat dissipation area, and ensure that the outer wall of the drive module can be cooled more evenly and effectively.
[0083] The drive module according to the present invention will now be briefly described with reference to Figures 1-5.
[0084] As shown in Figures 1-5, the drive module according to the present invention includes a drive module body and a heat dissipation component 1. The heat dissipation component 1 is constructed as the heat dissipation component 1 in any of the above embodiments, and the end cap 11 of the heat dissipation component 1 is installed on the end face of the drive module body.
[0085] The end face of the drive module body has heat sources with low temperature resistance, such as drive circuit boards or control circuit boards. After the end cover 11 of the heat dissipation component 1 is installed on the end face, the air guide channel 111 can directly act on these end face heat sources, and quickly remove heat through airflow, preventing the chip from being affected or damaged due to excessive temperature. At the same time, during the operation of the drive module body, its side will generate a lot of heat due to the continuous operation of internal electric and / or mechanical components (such as motors, reducers, etc.), and the temperature resistance of the side structure is relatively high. The air outlet 113 of the heat dissipation component 1 protrudes from the outer periphery of the end cover 11 and blows air towards the side, which can directly blow the airflow accelerated and guided by the air guide channel 111 to the side, dissipating the heat on the side. Therefore, the heat dissipation component 1 can simultaneously take into account the different heat dissipation needs of the heat source carrier end face and the side, forming a synergistic heat dissipation effect and improving the overall heat dissipation efficiency of the drive module body.
[0086] Since the drive module according to the present invention includes the heat dissipation component 1 in any of the above embodiments, the drive module according to the present invention can effectively dissipate heat from the side of the heat source carrier by means of the heat dissipation component 1, thereby meeting the requirements for stable operation.
[0087] According to some embodiments of the present invention, the drive module body is a motor, the end cover 11 is disposed at the end of the motor, and the air outlet 113 is adapted to discharge air to the side of the motor.
[0088] When the motor is running, the side of its casing will continuously generate heat due to the electromagnetic induction of the internal winding. The air outlet 113 is vented towards the side of the motor, which can directly blow the cold air guided and accelerated by the air guide channel 111 onto the outer wall of the side of the motor. As the airflow flows along the side of the motor, it exchanges heat with the motor casing, carrying away the heat on the casing, thereby reducing the overall temperature of the motor.
[0089] According to some embodiments of the present invention, a circuit board is provided at the end of the motor, and the air guide channel 111 corresponds to the circuit board.
[0090] The circuit board integrates multiple heat-generating components such as a driver chip and capacitors, and the air duct 111 corresponds to the circuit board. Cool air entering the air duct 111 from the air inlet 112 absorbs heat from the circuit board. Subsequently, the airflow exits from the air outlet 113 and blows towards the side of the motor, efficiently cooling both the circuit board and the side of the motor. This achieves coordinated heat dissipation between the circuit board at the motor end and the side of the motor, ensuring that all components on the motor and circuit board are within a suitable operating temperature range. Furthermore, when the airflow blows from the air outlet 113 towards the side of the motor (e.g., parallel to the side), it can utilize Bernoulli's principle (increasing the airflow speed amplifies the Bernoulli effect) to bring in cool air from both sides of the air outlet (relative to the outflowing airflow) to contact the side of the motor, thereby achieving heat dissipation for the side of the motor.
[0091] According to some embodiments of the present invention, the drive module body is a joint module, the end cap 11 is disposed at the end of the joint module, and the air outlet 113 is adapted to discharge air to the side of the joint module.
[0092] During operation, the joint module generates heat on its sides due to the operation of the motor and reducer. The air outlet 113 directs airflow towards the side of the joint module, directly blowing the airflow from the air guide channel 111 onto the side of the joint module. As the airflow flows along the side of the joint module, it carries away the heat, thereby reducing the temperature of the side of the joint module. Furthermore, when the airflow blows from the air outlet 113 towards the side of the joint module (e.g., parallel to the side), based on Bernoulli's principle (increasing the airflow speed amplifies the effect of Bernoulli's principle), it brings in cooler air from both sides of the air outlet (relative to the outflowing airflow) to contact the side of the joint module, thus achieving heat dissipation from the side of the joint module.
[0093] According to some embodiments of the present invention, the end of the joint module is provided with a circuit board, and the air guide channel 111 corresponds to the circuit board.
[0094] The ends of the joint module may be equipped with control circuit boards or drive circuit boards, on which various heat-generating electronic components are distributed. The air duct 111 is set in correspondence with these electronic components (mainly chips / processors) on the circuit boards. Cool air enters from the air inlet 112 and enters the air duct 111 under the guidance of the air guide shroud 115, absorbing heat and achieving targeted heat dissipation for the circuit boards.
[0095] The robot according to the present invention is briefly described below.
[0096] The robot according to the present invention includes the drive module of any of the above embodiments. Because the robot according to the present invention includes the drive module of any of the above embodiments, the robot according to the present invention can ensure stable joint operation, thereby improving the overall stability and reliability of operation.
[0097] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0098] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims
1. A heat dissipation component, characterized in that, include: An end cap (11) is used to be installed on the end face of a heat source carrier; a flow guide (115) is disposed on the end cap (11), the flow guide (115) extends to the outer periphery of the end cap (11) and defines an air guide channel (111) for airflow. At least a portion of the flow guide (115) protrudes from the outer periphery of the end cap (11), and an air outlet (113) communicating with the air guide channel (111) is formed in the protruding at least portion of the flow guide (115). The air outlet (113) is adapted to discharge air to the side of the heat source carrier. An air inlet (112) communicating with the air guide channel (111) is provided on the top of the end cap (11) or the flow guide (115).
2. The heat dissipation assembly according to claim 1, characterized in that, The flow guide (115) is disposed on the inner or outer surface of the end cap (11).
3. The heat dissipation assembly according to claim 2, characterized in that, The air guide shroud (115) is disposed on the inner surface of the end cap (11), and the end cap (11) is provided with the air inlet (112). The air guide shroud (115) includes: a guide protrusion (1161), which protrudes from the inner surface of the end cap (11) and is constructed as a plurality of protrusions spaced apart in the circumferential direction, with a first guide section formed between two adjacent guide protrusions (1161); an outer guide portion (117), which protrudes from the outer periphery of the end cap (11) and has a second guide section formed inside that communicates with the first guide section. The first guide section and the second guide section together define the air guide channel (111), and the second guide section bends toward the air inlet (112), with the outer end of the second guide section forming the air outlet (113).
4. The heat dissipation assembly according to claim 2, characterized in that, The air guide shroud (115) is disposed on the outer surface of the end cap (11); the air guide shroud (115) includes: a center plate (1151), on which the air inlet (112) is formed in the thickness direction; an extension plate (1152), the extension plate (1152) is disposed on the outer periphery of the center plate (1151) and extends along the outer periphery of the air guide shroud (115), the extension plate (1152) is configured as a plurality of extension plates and is spaced apart in the circumferential direction of the center plate (1151); airflow Guide wall (1153), the airflow guide wall (1153) is constructed as a plurality of corresponding one-to-one with the extension plate (1152), the airflow guide wall (1153) is disposed at the outer end of the extension plate (1152), the airflow guide wall (1153) is bent toward the air inlet (112); side plate (1154), the side plate (1154) is disposed on both sides of each extension plate (1152) in the circumferential direction and extends to the airflow guide wall (1153) to define the air guide channel (111).
5. The heat dissipation assembly according to claim 1, characterized in that, Also includes: Centrifugal fan (13) is disposed on end cover (11). The pivot axis of centrifugal fan (13) is perpendicular to end cover (11) and located at air inlet (112). Multiple air guide channels (111) are located on the outer periphery of centrifugal fan (13).
6. The heat dissipation assembly according to claim 1, characterized in that, Also includes: Heat dissipation component (12) is disposed in the air guide channel (111) and heat dissipation fins are formed on the heat dissipation component (12).
7. The heat dissipation assembly according to claim 6, characterized in that, The air guide channel (111) is constructed in multiple ways, and each air guide channel (111) is provided with at least one heat dissipation component (12). The multiple heat dissipation components (12) are adapted to correspond one-to-one with multiple heat sources on the end face of the heat source carrier.
8. The heat dissipation assembly according to claim 6, characterized in that, The flow guide (115) is disposed on the inner surface of the end cap (11), and the heat dissipation component is at least partially adapted to contact the heat source at the end face of the heat source carrier.
9. A drive module, characterized in that, include: Drive module body; A heat dissipation assembly, wherein the heat dissipation assembly is constructed as described in any one of claims 1 to 8, and the end cap (11) of the heat dissipation assembly is mounted on the end face of the drive module body.
10. The drive module according to claim 9, characterized in that, The drive module body is a motor, the end cover (11) is disposed at the end of the motor, and the air outlet (113) is adapted to discharge air to the side of the motor.
11. The drive module according to claim 10, characterized in that, The motor end is provided with a circuit board, and the air guide channel (111) corresponds to the circuit board.
12. The drive module according to claim 9, characterized in that, The drive module body is a joint module, the end cap (11) is disposed at the end of the joint module, and the air outlet (113) is adapted to discharge air to the side of the joint module.
13. The drive module according to claim 12, characterized in that, The joint module is equipped with a circuit board at its end, and the air guide channel (111) corresponds to the circuit board.
14. A robot, characterized in that, Includes the drive module described in any one of claims 9-13.