Packaging structure and corresponding preparation method

Abstract

The invention relates to the field of semiconductor packaging, and provides a packaging structure and a corresponding preparation method. The stacking structure is positioned on the surface of the substrate; the plastic package body is positioned on the surface of the substrate and covers the stacking structure; wherein the stacked structure comprises stacked photosensitive chips and corresponding light-transmitting sheets, and at least one side surface of each light-transmitting sheet is exposed out of the plastic package body, so that the corresponding photosensitive chips sense external light rays through the light rays of the side surfaces of the light-transmitting sheets. Therefore, the problem of light transmission can be solved only by pasting one light-transmitting sheet, the process is simple, and the cost of the product is not increased.

Description

A packaging structure and a corresponding fabrication method Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and discloses a packaging structure and a corresponding preparation method. Background Technology

[0002] Currently, the packaging process for photosensitive chips generally requires the photosensitive chip to sense light from the front of the filter. However, this type of packaging process requires a variety of special materials and equipment, has many process limitations, is relatively thick, and is costly. Summary of the Invention

[0003] The purpose of this invention is to address the current limitations of packaging photosensitive chips for sensing external light, which requires various specialized materials and equipment, resulting in numerous process constraints, thick layers, and high costs. This invention provides a packaging structure and a corresponding fabrication method. To achieve the above objective, this invention provides a packaging structure comprising: a substrate; a stacked structure located on the surface of the substrate; and a molding compound located on the surface of the substrate and covering the stacked structure. The stacked structure includes stacked photosensitive chips and corresponding light-transmitting sheets, with at least one side of the light-transmitting sheet exposed to the molding compound, allowing the corresponding photosensitive chip to sense external light through the side of the light-transmitting sheet.

[0004] As one possible implementation, the light-transmitting sheet is a glass sheet.

[0005] As one possible implementation, the stacked structure is at least one, and each stacked structure includes at least one light-transmitting sheet and at least one corresponding photosensitive chip.

[0006] As one possible implementation, when the stacked structure includes at least two photosensitive chips, the at least two photosensitive chips are arranged side by side.

[0007] In one possible implementation, the photosensitive chip is fixed to the corresponding light-transmitting film via a transparent adhesive film.

[0008] As one possible implementation, the adhesive film is a die-bonding adhesive film.

[0009] In one possible implementation, the photosensitive chip is fixed to the light-transmitting sheet by a baffle wall, wherein the baffle wall is arranged around the surface of the light-transmitting sheet facing the photosensitive chip, so that there is a cavity between the photosensitive chip and the corresponding light-transmitting sheet.

[0010] As one possible implementation, the retaining wall is made of an adhesive.

[0011] As one possible implementation, the adhesive is glue.

[0012] In one possible implementation, the photosensitive chip has a pad area and a photosensitive area, the light-transmitting sheet is located on the surface of the substrate, and at least the photosensitive area of ​​the photosensitive chip is located on the corresponding surface of the light-transmitting sheet.

[0013] In one possible implementation, the photosensitive chip has a pad area and a photosensitive area, the photosensitive chip is located on the surface of the substrate, and the light-transmitting film is located at least on the surface of the photosensitive area of ​​the photosensitive chip. In another possible implementation, the photosensitive chip is further electrically connected to the substrate via metal leads or conductive bumps.

[0014] Accordingly, the present invention also provides a method for preparing a packaging structure, comprising: providing a substrate; disposing a first stacked structure on the surface of the substrate, wherein the first stacked structure includes stacked photosensitive chips and corresponding light-transmitting sheets; molding the first stacked structure on the surface of the substrate using a molding compound to obtain a molding compound, thereby obtaining a package containing the substrate, the first stacked structure and the molding compound; cutting the package to obtain a single package structure comprising the substrate, a second stacked structure located on the surface of the substrate and a molding compound covering the second stacked structure, wherein the second stacked structure includes stacked photosensitive chips and corresponding light-transmitting sheets, and at least one side of the light-transmitting sheet is exposed to the molding compound, such that the corresponding photosensitive chip senses external light through the side of the light-transmitting sheet.

[0015] As one possible implementation, the light-transmitting sheet is a glass sheet.

[0016] As one possible implementation, a first stacked structure is disposed on the surface of the substrate, wherein the first stacked structure includes a photosensitive chip and a corresponding light-transmitting sheet stacked on the surface of the substrate. The step includes: disposing the light-transmitting sheet on the surface of the substrate, wherein the photosensitive chip has a photosensitive area, and disposing the photosensitive area of ​​the photosensitive chip on the surface of the corresponding light-transmitting sheet.

[0017] As one possible implementation, a first stacked structure is disposed on the surface of the substrate, wherein the first stacked structure includes a photosensitive chip and a corresponding light-transmitting sheet stacked on the surface of the substrate. The steps include: disposing the photosensitive chip on the surface of the substrate, the photosensitive chip having a photosensitive area, and disposing the light-transmitting sheet on the photosensitive area of ​​the corresponding photosensitive chip.

[0018] In one possible implementation, the photosensitive chip is electrically connected to the substrate via metal leads or conductive bumps.

[0019] As one possible implementation, there is at least one first stacked structure, and each first stacked structure includes at least one light-transmitting plate and at least one corresponding photosensitive chip.

[0020] As one possible implementation, when each light-transmitting sheet in the first stacked structure corresponds to at least two photosensitive chips, the at least two photosensitive chips are arranged side by side.

[0021] As one possible implementation, cutting the package includes cutting the light-transmitting sheet of the first stacked structure such that at least one side of the light-transmitting sheet is exposed to the plastic encapsulation of a single package structure.

[0022] In one possible implementation, the photosensitive chip is fixed to the corresponding light-transmitting film via a transparent adhesive film.

[0023] As one possible implementation, the adhesive film is a die-bonding adhesive film.

[0024] In one possible implementation, the photosensitive chip is fixed to the corresponding light-transmitting sheet by a baffle wall, wherein the baffle wall is arranged around the surface of the light-transmitting sheet facing the photosensitive chip, so that there is a cavity between the photosensitive chip and the light-transmitting sheet.

[0025] As one possible implementation, the retaining wall is made of an adhesive.

[0026] As one possible implementation, the adhesive is glue.

[0027] As one possible implementation, there is at least one second stacked structure, and each second stacked structure includes a light-transmitting sheet and at least one corresponding photosensitive chip.

[0028] As one possible implementation, when the second stacked structure includes at least two photosensitive chips, the at least two photosensitive chips are arranged side by side.

[0029] The beneficial effects of this invention are as follows: This invention provides a packaging structure and a corresponding manufacturing method, comprising: a substrate; a stacked structure located on the surface of the substrate; and a molding compound located on the surface of the substrate and covering the stacked structure; wherein the stacked structure includes stacked photosensitive chips and corresponding light-transmitting sheets, and at least one side of the light-transmitting sheet is exposed to the molding compound, allowing the corresponding photosensitive chip to sense external light through the side light of the light-transmitting sheet. This solves the light transmission problem of the photosensitive chip by requiring only one light-transmitting sheet, maintaining a small product thickness and not increasing product cost. Attached Figure Description

[0030] Figure 1 is a schematic diagram of a packaging structure provided in some embodiments of the present invention with one light-transmitting plate and the photosensitive chip above the light-transmitting plate; Figure 2 is a schematic diagram of a packaging structure provided in some embodiments of the present invention with two light-transmitting plates; Figure 3 is a schematic diagram of a packaging structure provided in some embodiments of the present invention with one light-transmitting plate and the photosensitive chip above the photosensitive chip; Figure 4 is a schematic diagram of a packaging structure provided in some embodiments of the present invention with the photosensitive chip and the light-transmitting plate fixed by a baffle phase; Figure 5 is a schematic diagram of a packaging structure provided in some embodiments of the present invention with the photosensitive chip and the light-transmitting plate fixed by an adhesive film phase; Figures 6-10 are schematic diagrams of the fabrication process of the packaging structure provided in some embodiments of the present invention; Figure 11 is a schematic diagram of the fabrication process of the packaging structure provided in some embodiments of the present invention. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] It should be understood that terms such as “first” and “second” used herein to describe various elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. For example, the use of terms such as “first” and “second” herein does not imply order or sequence unless the context clearly indicates otherwise. For ease of description, spatially relative terms such as “upper” and “lower” may be used herein to describe the relationship of one element or feature to other elements or features as shown in the accompanying drawings. It should be understood that spatially relative terms are intended to include not only the orientations shown in the accompanying drawings but also different orientations of the device in use or operation.

[0033] In this application, unless otherwise expressly specified and limited, the terms "connected" and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples. It should be noted that the terms "comprising" and "having," and their variations, used in this application are intended to cover non-exclusive inclusion.

[0035] Referring to Figure 1, some embodiments of the present invention provide a packaging structure, including: a substrate 10; a stacked structure located on the surface of the substrate 10; and a molding compound 40 located on the surface of the substrate 10 and covering the stacked structure; wherein the stacked structure includes stacked photosensitive chips 30 and corresponding light-transmitting sheets 20, and at least one side of the light-transmitting sheet 20 is exposed to the molding compound, such that the corresponding photosensitive chip 30 senses external light through the side of the light-transmitting sheet 20.

[0036] As shown in Figure 1, external light can reach the photosensitive chip 30 through the propagation path indicated by the arrow.

[0037] In some embodiments, the substrate 10 may be specifically selected as a silicon substrate, which is widely used due to its mature manufacturing process and good electrical properties; or a silicon carbide substrate, which exhibits unique advantages in certain applications due to its high heat resistance, high conductivity and excellent chemical stability; or a sapphire substrate, whose excellent hardness and light transmittance make it an ideal choice for applications requiring high transparency and wear resistance.

[0038] Of course, any other suitable substrate material can be selected according to actual needs to meet the specific requirements of different application scenarios, such as ceramic substrates, copper-clad laminates, redistribution layers, etc.

[0039] In other embodiments, the substrate may also be a semiconductor packaging structure substrate having one or more chip packaging structures.

[0040] In some embodiments, the photosensitive chip 30 can be a charge-coupled device (CCD), an integrated circuit that converts light into electrical charge and outputs these charges as electrical signals in an orderly manner through a series of complex transfer processes. Due to its high sensitivity and low noise characteristics, it plays an important role in high-end imaging equipment. Another type can be a complementary metal-oxide-semiconductor (CMOS) sensor, which integrates photodiodes, amplifiers, and analog-to-digital converters on the same chip, directly realizing the conversion of light signals to digital signals. Due to its low power consumption, high integration, and cost-effectiveness, it is widely used in various digital imaging devices, such as digital cameras and camcorders. Its main function is to convert light into electrical charge, and then generate digital signals for use in digital imaging devices such as digital cameras and camcorders. These chips capture light using highly sensitive semiconductor materials, convert the light signals into electrical signals, and then convert the electrical signals into digital signals through an analog-to-digital converter for easy storage and processing. The digital signals can then be transmitted to a computer for further image processing and analysis.

[0041] In some embodiments, the light-transmitting sheet 20 can be a glass sheet, chosen for its good light transmittance, weather resistance, and ease of processing. Alternatively, it can be any other light-transmitting sheet that allows the photosensitive chip 30 to sense external light, ensuring that the imaging device can function properly and capture clear and accurate image information.

[0042] In some embodiments, referring to FIG1, the photosensitive chip 30 has a photosensitive area and a pad area. The photosensitive area of ​​the photosensitive chip 30 is located on the lower surface of the photosensitive chip 30, that is, the light-transmitting sheet 20 is located on the surface of the substrate 10, and the corresponding photosensitive area on the lower surface of the photosensitive chip 30 is located on the surface of the light-transmitting sheet 20. The photosensitive area of ​​the photosensitive chip 30 senses external light through the side of the light-transmitting sheet 20. External light enters the light-transmitting sheet from the side of the light-transmitting sheet 20 and, through reflection, enters the photosensitive area of ​​the photosensitive chip.

[0043] In some embodiments, the pad area and photosensitive area of ​​the photosensitive chip 30 are located on the upper and lower surfaces, respectively. When the light-transmitting sheet 20 is located on the surface of the substrate 10, the photosensitive area on the lower surface of the photosensitive chip 30 is located on the corresponding surface of the light-transmitting sheet 20. The packaging structure further includes: metal leads connecting the pad area on the upper surface of the photosensitive chip 30 and the surface of the substrate 10, and the photosensitive chip 30 is electrically connected to the substrate 10 through the metal leads. In some embodiments, the metal leads can be aluminum wires, gold wires, silver wires, copper wires, etc.

[0044] In other embodiments, the pad area and photosensitive area of ​​the photosensitive chip 30 are located on the upper and lower surfaces, respectively. When the light-transmitting sheet 20 is located on the surface of the substrate 10, the entire lower surface of the photosensitive chip 30 is located on the corresponding surface of the light-transmitting sheet 20.

[0045] In some embodiments, the photosensitive area and the pad area of ​​the photosensitive chip 30 are on the same surface, the light-transmitting sheet 20 is located on the surface of the substrate 10, the photosensitive area of ​​the photosensitive chip 30 is located on the corresponding surface of the light-transmitting sheet 20, and the pad area of ​​the photosensitive chip 30 is not covered by the light-transmitting sheet 20 and is electrically connected to the substrate 10 through conductive bumps.

[0046] In some embodiments, referring to FIG3, the photosensitive area of ​​the photosensitive chip 30 is located on the upper surface of the photosensitive chip 30, that is, the photosensitive chip 30 is located on the surface of the substrate 10, and the corresponding light-transmitting sheet 20 at least covers the photosensitive area on the upper surface of the photosensitive chip 30. The photosensitive area on the upper surface of the photosensitive chip 30 senses external light through the side of the light-transmitting sheet 20.

[0047] In some embodiments, referring to FIG3, the photosensitive area of ​​the photosensitive chip 30 is located on the upper surface of the photosensitive chip 30. When the pad area of ​​the photosensitive chip 30 is located on the upper surface of the photosensitive chip 30, the corresponding light-transmitting film 20 covers the photosensitive area on the upper surface of the photosensitive chip 30. The pad area on the upper surface of the photosensitive chip 30 is electrically connected to the substrate 10 through metal leads.

[0048] In some embodiments, referring to FIG3, the photosensitive area of ​​the photosensitive chip 30 is located on the upper surface of the photosensitive chip 30. When the pad area of ​​the photosensitive chip 30 is located on the lower surface of the photosensitive chip 30, the corresponding light-transmitting film 20 can cover the upper surface of the photosensitive chip 30. The conductive bump is located on the pad area of ​​the lower surface of the photosensitive chip 30, and the photosensitive chip 30 is electrically connected to the substrate 10 through the conductive bump. In some embodiments, the material of the pad is metal, which can be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver. In some embodiments, the material of the conductive bump is metal, which can be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver.

[0049] In some embodiments, the stacked structure is at least one, and each stacked structure includes a light-transmitting sheet 20 and a corresponding at least one photosensitive chip 30. That is, each light-transmitting sheet 20 is connected to the corresponding at least one photosensitive chip 30, or each photosensitive chip 30 is connected to the corresponding at least one light-transmitting sheet 20.

[0050] In some embodiments, a photosensitive chip 30 is connected to multiple light-transmitting sheets 20 in different directions to simultaneously acquire external light from different directions.

[0051] In some embodiments, a photosensitive chip, a light-transmitting film, and a photosensitive chip are stacked in three layers, and different photosensitive chips simultaneously acquire external light.

[0052] In some embodiments, several photosensitive chips are stacked with the same light-transmitting sheet, and different photosensitive chips simultaneously acquire external light.

[0053] In some embodiments, when the stacked structure includes at least two photosensitive chips 30, the at least two photosensitive chips 30 are arranged side by side.

[0054] For example, referring to Figure 1, the stacked structure is one, the number of photosensitive chip 30 and the number of light-transmitting sheet 20 are both one, and one light-transmitting sheet 20 corresponds to one photosensitive chip 30.

[0055] For example, referring to Figure 2, there are two stacked structures, that is, there are two photosensitive chips 30 and two light-transmitting sheets 20, and each light-transmitting sheet 20 corresponds to one photosensitive chip 30. Each photosensitive chip 30 uses the corresponding light-transmitting sheet 20 to obtain external light in the corresponding direction, thereby obtaining external light in different directions at the same time.

[0056] In some embodiments, both the photosensitive chip 30 and the light-transmitting sheet 20 are elongated cubic shapes, with the first side 21 of the elongated cubic light-transmitting sheet exposed on one side of the encapsulation body 40.

[0057] In other embodiments, the light-transmitting sheet may also have multiple sides exposed to the encapsulation 40, thereby allowing the photosensitive chip to receive more external light.

[0058] In other embodiments, the light-transmitting sheet may also have two, three, or four sides exposed to the encapsulation 40.

[0059] In some embodiments, the first side 21 of the light-transmitting sheet is exposed to the side of the molding compound 40, and the second side 22 of the light-transmitting sheet 20 opposite to the first side 21 is flush with one side of the photosensitive chip.

[0060] In some embodiments, referring to FIG4, the photosensitive chip 30 is fixed to the light-transmitting sheet 20 by a baffle 50, wherein the baffle 50 is disposed around the side surface of the light-transmitting sheet 20 facing the photosensitive chip 30, and the baffle 50 is disposed at least around the photosensitive area of ​​the photosensitive chip 30, so that a cavity 60 is formed between the photosensitive area of ​​the photosensitive chip 30 and the corresponding light-transmitting sheet 20. The baffle 50 prevents the molding compound from overflowing into the gap between the photosensitive chip 30 and the corresponding light-transmitting sheet 20 during the subsequent molding process, thus ensuring the photosensitive effect of the photosensitive chip.

[0061] In some specific embodiments, the retaining wall 50 is designed to have a certain height, which is determined according to the actual application scenario to ensure that it can effectively perform functions such as blocking, supporting, or separating. Regarding the material of the retaining wall 50, an adhesive is used in this embodiment. This choice is based on the excellent bonding performance and plasticity of the adhesive, which allows the retaining wall 50 to adhere firmly to the required location while maintaining the stability and durability of the structure.

[0062] Furthermore, the adhesive is not limited to a specific type, but can be flexibly selected according to actual usage conditions and performance requirements. In some embodiments, the adhesive is a common glue, which is easy to use, cures quickly, and has high bonding strength, making it suitable for bonding various materials. In other embodiments, other types of adhesives can be selected, such as adhesives with special weather resistance, high temperature resistance, or chemical corrosion resistance, to meet the usage requirements in specific environments. In summary, the material selection of the retaining wall 50 fully considers various factors in practical applications to ensure that its performance reaches its optimal state.

[0063] In some embodiments, referring to Figure 5, the photosensitive chip 30 is fixed to the light-transmitting sheet 20 by a transparent adhesive film 70. The adhesive film 70 at least covers the photosensitive area of ​​the photosensitive chip 30. In some embodiments, the adhesive film 70 is a die-attach film, also known as DAF (Die Attach Film), a chip bonding film widely used in semiconductor packaging. Die-attach films, with their excellent adhesion performance, good thermal and chemical stability, and adaptability to bonding various materials, have become the preferred material for bonding chips to substrates and between chips. Of course, in practical applications, other types of adhesive films can be selected according to specific packaging requirements, process conditions, and cost considerations. These adhesive films may have different adhesion, thickness, temperature range, or special functions to meet the requirements of different packaging designs and application scenarios. In short, the selection of adhesive films requires comprehensive consideration of multiple factors to ensure the reliability and performance of the packaged products.

[0064] In some embodiments, the material of the molding compound 40 may be epoxy resin, polyimide resin, benzocyclobutene resin or polybenzoxazole resin, and the forming process may be injection molding or transfer molding.

[0065] In some embodiments, a method for preparing a packaging structure is also provided, as shown in FIG11, comprising: step S10, providing a substrate; step S20, disposing a first stacked structure on the surface of the substrate, wherein the first stacked structure includes stacked photosensitive chips and corresponding light-transmitting sheets; step S30, using molding compound to encapsulate the first stacked structure on the surface of the substrate to obtain a molded body, thereby obtaining a package containing the substrate, the first stacked structure and the molded body; step S40, cutting the package to obtain a single package structure containing a substrate, a second stacked structure located on the surface of the substrate and a molded body covering the second stacked structure, wherein the second stacked structure includes stacked photosensitive chips and corresponding light-transmitting sheets, and at least one side of the light-transmitting sheet is exposed to the molded body, such that the corresponding photosensitive chip senses external light through the side of the light-transmitting sheet.

[0066] Specifically, see Figure 6, where a substrate 10 is provided.

[0067] In some embodiments, the substrate 10 may be specifically selected as a silicon substrate, which is widely used due to its mature manufacturing process and good electrical properties; or a silicon carbide substrate, which exhibits unique advantages in certain applications due to its high heat resistance, high conductivity and excellent chemical stability; or a sapphire substrate, whose excellent hardness and light transmittance make it an ideal choice for applications requiring high transparency and wear resistance.

[0068] Of course, any other suitable substrate material can be selected according to actual needs to meet the specific requirements of different application scenarios, such as ceramic substrates, copper-clad laminates, redistribution layers, etc.

[0069] In other embodiments, the substrate may also be a semiconductor packaging structure substrate having one or more chip packaging structures.

[0070] Referring to Figures 7 and 8, a first stacked structure is disposed on the surface of the substrate 10, wherein the first stacked structure includes stacked photosensitive chips 30 and corresponding light-transmitting sheets 20.

[0071] In some embodiments, the photosensitive chip 30 can be a charge-coupled device (CCD), an integrated circuit that converts light into electrical charge and outputs these charges as electrical signals in an orderly manner through a series of complex transfer processes. Due to its high sensitivity and low noise characteristics, it plays an important role in high-end imaging equipment. Another type can be a complementary metal-oxide-semiconductor (CMOS) sensor, which integrates photodiodes, amplifiers, and analog-to-digital converters on the same chip, directly realizing the conversion of light signals to digital signals. Due to its low power consumption, high integration, and cost-effectiveness, it is widely used in various digital imaging devices, such as digital cameras and camcorders. Its main function is to convert light into electrical charge, and then generate digital signals for use in digital imaging devices such as digital cameras and camcorders. These chips capture light using highly sensitive semiconductor materials, convert the light signals into electrical signals, and then convert the electrical signals into digital signals through an analog-to-digital converter for easy storage and processing. The digital signals can then be transmitted to a computer for further image processing and analysis.

[0072] In some embodiments, the light-transmitting sheet 20 can be a glass sheet, chosen for its good light transmittance, weather resistance, and ease of processing. Alternatively, it can be any other light-transmitting sheet that allows the photosensitive chip 30 to sense external light, ensuring that the imaging device can function properly and capture clear and accurate image information.

[0073] In some embodiments, the step of disposing a first stacked structure on the surface of the substrate 10, wherein the first stacked structure includes stacked photosensitive chips 30 and corresponding light-transmitting sheets 20, includes: referring to FIG7, disposing the light-transmitting sheet 20 on the surface of the substrate 10; referring to FIG8, disposing the photosensitive chip 30 on the surface of the corresponding light-transmitting sheet 20.

[0074] The photosensitive area of ​​the photosensitive chip 30 is located on the lower surface of the photosensitive chip 30. Referring to Figure 1, the light-transmitting sheet 20 is located on the surface of the substrate 10, and the corresponding photosensitive area of ​​the photosensitive chip 30 is located on the surface of the light-transmitting sheet 20. The photosensitive area of ​​the photosensitive chip 30 senses external light through the side of the light-transmitting sheet 20.

[0075] In some embodiments, after the light-transmitting sheet 20 is disposed on the surface of the substrate 10 and the photosensitive area of ​​the photosensitive chip 30 is disposed on the corresponding surface of the light-transmitting sheet 20, the method further includes: the photosensitive chip 30 is electrically connected to the substrate 10 through metal leads or conductive bumps.

[0076] In some embodiments, the step of disposing a first stacked structure on the surface of the substrate 10, wherein the first stacked structure includes stacked photosensitive chips 30 and corresponding light-transmitting sheets 20, includes: disposing the photosensitive chips 30 on the surface of the substrate 10; and disposing the light-transmitting sheets 20 in the photosensitive area of ​​the corresponding photosensitive chips 30.

[0077] The photosensitive area of ​​the photosensitive chip 30 is located on the upper surface of the photosensitive chip 30. Referring to Figure 3, the photosensitive chip 30 is located on the surface of the substrate 10, and the corresponding light-transmitting sheet 20 is located in the photosensitive area of ​​the photosensitive chip 30. The photosensitive area of ​​the photosensitive chip 30 senses external light through the side of the light-transmitting sheet 20.

[0078] In some embodiments, when the photosensitive chip 30 is located on the surface of the substrate 10, the corresponding light-transmitting sheet 20 is located in the photosensitive area of ​​the photosensitive chip 30, and the photosensitive chip 30 is electrically connected to the substrate 10 through metal leads or conductive bumps.

[0079] In some embodiments, after the light-transmitting sheet 20 is disposed on the surface of the substrate 10 and the photosensitive chip 30 is disposed on the corresponding surface of the light-transmitting sheet 20, the method further includes: the photosensitive chip 30 is fixed to the light-transmitting sheet 20 by a baffle 50, wherein the baffle 50 is disposed around the side surface of the light-transmitting sheet 20 facing the photosensitive chip 30, so that a cavity 60 is formed between the photosensitive chip 30 and the corresponding light-transmitting sheet 20. In some embodiments, after the light-transmitting sheet 20 is disposed on the surface of the substrate 10, the baffle 50 can be formed on the surface of the light-transmitting sheet 20, and then the photosensitive chip 30 is fixed to the baffle 50, so that a cavity 60 is formed between the photosensitive chip 30 and the corresponding light-transmitting sheet 20. The baffle 50 prevents the molding compound in the subsequent molding process from overflowing between the photosensitive chip 30 and the corresponding light-transmitting sheet 20, thus ensuring the photosensitivity of the photosensitive chip.

[0080] In some specific embodiments, the retaining wall 50 is designed to have a certain height, which is determined according to the actual application scenario to ensure that it can effectively perform functions such as blocking, supporting, or separating. Regarding the material of the retaining wall 50, an adhesive is used in this embodiment. This choice is based on the excellent bonding performance and plasticity of the adhesive, which allows the retaining wall 50 to adhere firmly to the required location while maintaining the stability and durability of the structure.

[0081] Furthermore, the adhesive is not limited to a specific type, but can be flexibly selected according to actual usage conditions and performance requirements. In some embodiments, the adhesive is a common glue, which is easy to use, cures quickly, and has high bonding strength, making it suitable for bonding various materials. In other embodiments, other types of adhesives can be selected, such as adhesives with special weather resistance, high temperature resistance, or chemical corrosion resistance, to meet the usage requirements in specific environments. In summary, the material selection of the retaining wall 50 fully considers various factors in practical applications to ensure that its performance reaches its optimal state.

[0082] In some embodiments, referring to Figure 5, the photosensitive chip 30 is fixed to the light-transmitting sheet 20 by a transparent adhesive film 70. In some embodiments, the adhesive film 70 is a die-attach film, also known as DAF (Die Attach Film), a chip bonding film widely used in semiconductor packaging. Die-attach films, with their excellent adhesion performance, good thermal and chemical stability, and adaptability to bonding various materials, have become the preferred material for bonding chips to substrates and between chips. Of course, in practical applications, other types of adhesive films can be selected according to specific packaging requirements, process conditions, and cost considerations. These adhesive films may have different adhesion, thickness, temperature range, or special functions to meet the requirements of different packaging designs and application scenarios. In short, the selection of adhesive films requires comprehensive consideration of multiple factors to ensure the reliability and performance of the packaged products.

[0083] Referring to Figure 8, a plurality of packages are to be formed on the surface of the substrate. Each package includes a photosensitive chip 30 and a corresponding light-transmitting sheet 20, and a light-transmitting sheet is connected to two photosensitive chips corresponding to adjacent packages.

[0084] Referring to Figure 9, the stacked structure on the surface of the substrate 10 is encapsulated using molding compound to obtain a molded body 40, thereby obtaining a package containing the substrate 10, the first stacked structure and the molded body 40.

[0085] In some embodiments, the material of the molding compound 40 may be epoxy resin, polyimide resin, benzocyclobutene resin or polybenzoxazole resin, and the forming process may be injection molding or transfer molding.

[0086] Referring to Figure 10, the package is cut to obtain a single package structure comprising a substrate 10, a second stacked structure located on the surface of the substrate 10, and a molding compound 40 located on the surface of the substrate 10 and covering the second stacked structure. The second stacked structure includes stacked photosensitive chips 30 and corresponding light-transmitting sheets 20, and at least one side of the light-transmitting sheet 20 is exposed to the molding compound 40, so that the corresponding photosensitive chip 30 senses external light through the side light of the light-transmitting sheet 20.

[0087] In some embodiments, the second stacked structure is obtained by cutting the first stacked structure.

[0088] In some embodiments, the process of cutting the package includes cutting the light-transmitting plate 20 of the first stacked structure so that at least one side of the cut light-transmitting plate is exposed to the plastic encapsulation of a single package structure.

[0089] Furthermore, when the first stacked structure includes two photosensitive chips 30, cutting the package includes: cutting the light-transmitting plate 20 between the two photosensitive chips 30 in the first stacked structure to form two individual packaged encapsulations, and at least one side of the cut light-transmitting sheet is exposed to the encapsulation of the individual packaged structure. Specifically, when the first stacked structure is disposed on the surface of the substrate 10, for example referring to FIG8, each light-transmitting sheet 20 corresponds to two photosensitive chips 30, and the two photosensitive chips 30 are located at the edge portions on opposite sides of the surface of the corresponding light-transmitting sheet 20, then the cutting line can be a symmetrical line between the two photosensitive chips 30 corresponding to each light-transmitting sheet 20.

[0090] In some embodiments, the stacked structure is at least one, and each stacked structure includes a light-transmitting sheet 20 and a corresponding at least one photosensitive chip 30. That is, each light-transmitting sheet 20 is connected to the corresponding at least one photosensitive chip 30, or each photosensitive chip 30 is connected to the corresponding at least one light-transmitting sheet 20.

[0091] In some embodiments, a photosensitive chip 30 is connected to multiple light-transmitting sheets 20 in different directions to simultaneously acquire external light from different directions.

[0092] In some embodiments, a photosensitive chip, a light-transmitting film, and a photosensitive chip are stacked in three layers, and different photosensitive chips simultaneously acquire external light.

[0093] In some embodiments, several photosensitive chips are stacked with the same light-transmitting sheet, and different photosensitive chips simultaneously acquire external light.

[0094] In some embodiments, when the stacked structure includes at least two photosensitive chips 30, the at least two photosensitive chips 30 are arranged side by side.

[0095] For example, referring to Figure 1, the stacked structure is one, the number of photosensitive chip 30 and the number of light-transmitting sheet 20 are both one, and one light-transmitting sheet 20 corresponds to one photosensitive chip 30.

[0096] For example, referring to Figure 2, there are two stacked structures, that is, there are two photosensitive chips 30 and two light-transmitting sheets 20, and each light-transmitting sheet 20 corresponds to one photosensitive chip 30. Each photosensitive chip 30 uses the corresponding light-transmitting sheet 20 to obtain external light in the corresponding direction, thereby obtaining external light in different directions at the same time.

[0097] In some embodiments, both the photosensitive chip 30 and the light-transmitting sheet 20 are cubic in shape. In some embodiments, a first side 21 of the light-transmitting sheet is exposed to the side of the encapsulation 40, and a second side 22 on the light-transmitting sheet 20 opposite to the first side 21 is flush with a corresponding side 22 of the photosensitive chip. In other embodiments, the light-transmitting sheet may have multiple sides exposed to the encapsulation 40, thereby allowing the photosensitive chip 30 to receive more external light.

[0098] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

Claims

1. A packaging structure, characterized in that, include: substrate; A stacked structure located on the surface of the substrate; A molding compound located on the surface of the substrate and covering the stacked structure; wherein the stacked structure includes stacked photosensitive chips and corresponding light-transmitting sheets, and at least one side of the light-transmitting sheet is exposed to the molding compound, such that the corresponding photosensitive chip senses external light through the side of the light-transmitting sheet.

2. The packaging structure according to claim 1, characterized in that, The light-transmitting sheet is a glass sheet.

3. The packaging structure according to claim 1, characterized in that, The stacked structure is at least one, and each stacked structure includes at least one light-transmitting sheet and at least one corresponding photosensitive chip.

4. The packaging structure according to claim 1, characterized in that, When the stacked structure includes at least two photosensitive chips, the at least two photosensitive chips are arranged side by side.

5. The packaging structure according to claim 1, characterized in that, The photosensitive chip is fixed to the corresponding light-transmitting film by a transparent adhesive film.

6. The packaging structure according to claim 5, characterized in that, The adhesive film is a die-bonding adhesive film.

7. The packaging structure according to claim 1, characterized in that, The photosensitive chip is fixed to the light-transmitting sheet by a baffle wall, wherein the baffle wall is arranged around the surface of the light-transmitting sheet facing the photosensitive chip, so that there is a cavity between the photosensitive chip and the corresponding light-transmitting sheet.

8. The packaging structure according to claim 7, characterized in that, The retaining wall is made of adhesive.

9. The packaging structure according to claim 8, characterized in that, The adhesive is glue.

10. The packaging structure according to claim 1, characterized in that, The photosensitive chip has a pad area and a photosensitive area, the light-transmitting sheet is located on the surface of the substrate, and at least the photosensitive area of ​​the photosensitive chip is located on the corresponding surface of the light-transmitting sheet.

11. The packaging structure according to claim 1, characterized in that, The photosensitive chip has a pad area and a photosensitive area, the photosensitive chip is located on the surface of the substrate, and the light-transmitting sheet is located at least on the surface of the photosensitive area of ​​the photosensitive chip.

12. The packaging structure according to claim 10 or 11, characterized in that, Metal leads or conductive bumps connect the photosensitive chip pad area and the substrate surface, and the photosensitive chip is electrically connected to the substrate through the metal leads or conductive bumps.

13. A method for preparing a packaging structure, characterized in that, include: Provide substrate; A first stacked structure is disposed on the surface of the substrate, wherein the first stacked structure includes stacked photosensitive chips and corresponding light-transmitting sheets; the first stacked structure on the surface of the substrate is encapsulated using a molding compound to obtain a molded body, thereby obtaining a package containing the substrate, the first stacked structure, and the molded body; the package is cut to obtain a single package structure containing the substrate, a second stacked structure located on the surface of the substrate, and a molded body covering the second stacked structure, wherein the second stacked structure includes stacked photosensitive chips and corresponding light-transmitting sheets, and at least one side of the light-transmitting sheet is exposed to the molded body, so that the corresponding photosensitive chip senses external light through the side of the light-transmitting sheet.

14. The method for preparing the packaging structure according to claim 13, characterized in that, The step of placing a first stacked structure on the surface of the substrate, wherein the first stacked structure includes stacked photosensitive chips and corresponding light-transmitting sheets, includes: placing the light-transmitting sheet on the surface of the substrate, wherein the photosensitive area has a photosensitive area, and placing the photosensitive area of ​​the photosensitive chip on the surface of the corresponding light-transmitting sheet.

15. The method for preparing the packaging structure according to claim 14, characterized in that, After the step of placing a light-transmitting sheet on the surface of the substrate, and the photosensitive area having a photosensitive region, and placing the photosensitive region of the photosensitive chip on the corresponding light-transmitting sheet surface, the method further includes: the photosensitive chip being electrically connected to the substrate through metal leads or conductive bumps.

16. The method for preparing the packaging structure according to claim 13, characterized in that, The step of placing a first stacked structure on the surface of the substrate, wherein the first stacked structure includes stacked photosensitive chips and corresponding light-transmitting sheets, includes: placing the photosensitive chips on the surface of the substrate, the photosensitive area having a photosensitive region, and placing the light-transmitting sheet on the photosensitive region of the corresponding photosensitive chip.

17. The method for preparing the packaging structure according to claim 16, characterized in that, The photosensitive chip is electrically connected to the substrate via metal leads or conductive bumps.

18. The method for preparing the packaging structure according to claim 14 or 16, characterized in that, The first stacked structure is at least one, and each first stacked structure includes at least one light-transmitting plate and at least one corresponding photosensitive chip.

19. The packaging structure according to claim 18, characterized in that, When each light-transmitting sheet in the first stacked structure corresponds to at least two photosensitive chips, the at least two photosensitive chips are arranged side by side.

20. The method for preparing the packaging structure according to claim 13, characterized in that, Cutting the package includes cutting the light-transmitting sheet of the first stacked structure such that at least one side of the light-transmitting sheet is exposed to the plastic encapsulation of a single package structure.

21. The method for preparing the packaging structure according to claim 13, characterized in that, The photosensitive chip is fixed to the corresponding light-transmitting film by a transparent adhesive film.

22. The method for preparing the packaging structure according to claim 21, characterized in that, The adhesive film is a die-bonding adhesive film.

23. The method for preparing the packaging structure according to claim 13, characterized in that, The photosensitive chip is fixed by a baffle and a corresponding light-transmitting sheet, wherein the baffle is arranged around the surface of the light-transmitting sheet facing the photosensitive chip, so that there is a cavity between the photosensitive chip and the light-transmitting sheet.

24. The method for preparing the packaging structure according to claim 23, characterized in that, The retaining wall is made of adhesive.

25. The method for preparing the packaging structure according to claim 13, characterized in that, The second stacked structure is at least one, and each second stacked structure includes a light-transmitting sheet and at least one corresponding photosensitive chip.

26. The method for preparing the packaging structure according to claim 25, characterized in that, When the second stacked structure includes at least two photosensitive chips, the at least two photosensitive chips are arranged side by side.

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