Uniform-temperature heating device

Abstract

The invention discloses a uniform-temperature heating device, and aims to overcome the defect that the heat treatment effect of a wafer is affected due to non-uniform temperature caused by heat loss of the edge of a wafer heating disc. The vapor chamber comprises a bottom supporting table and a vapor chamber body, the vapor chamber body is installed on the bottom supporting table, a plurality of circles of liquid flow channels distributed at intervals in the radial direction are arranged in the vapor chamber body from the center to the edge, liquid media are loaded in the liquid flow channels, heaters are installed in the liquid flow channels, and the heaters heat the liquid media. According to the uniform-temperature heating device, the temperature distribution of all positions on the uniform-temperature plate is uniform, and the influence of edge heat loss is reduced through zoned temperature control, so that the heat treatment effect of the uniform-temperature heating device on wafers is ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more specifically, to a uniform heating device. Background Technology

[0002] During wafer heat treatment, wafers are typically mounted on a heating plate. Traditional heating plates use resistance wire heating, which suffers from high thermal inertia and uneven temperature due to edge heat loss, thus affecting the heat treatment effect. Chinese patent application number 201910767823X discloses a heating plate and a method for controlling the surface temperature of a wafer, featuring at least two heating sub-plates, each heating a wafer placed on a sub-plate, thus avoiding temperature gradient problems. Furthermore, because each heating sub-plate can extend and retract in a direction perpendicular to the wafer surface, warped areas of the wafer can be made to conform as closely as possible to the temperature-regulating heating sub-plate, resulting in uniform heating and improved uniformity of critical wafer dimensions. However, the resistance wire heating method still suffers from high thermal inertia, and edge heat loss leads to uneven temperature, thus affecting the heat treatment effect. Summary of the Invention

[0003] To overcome the above shortcomings, the present invention provides a uniform temperature heating device with uniform temperature distribution at each location, and reduces the impact of edge heat loss by controlling the temperature in zones.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a uniform temperature heating device, including a bottom support platform and a heat spreader plate, the heat spreader plate is installed on the bottom support platform, and several radially spaced liquid flow channels are arranged in the heat spreader plate from the center to the edge, the liquid flow channels are loaded with liquid medium, and heaters are installed in the liquid flow channels to heat the liquid medium.

[0005] The bottom support platform provides stability to the entire device. Several concentric liquid channels, spaced from the center to the edge, are arranged within the heat spreader. Heaters heat the liquid medium in these channels, raising its temperature. The increased temperature of the liquid medium creates a temperature difference with the heat spreader, causing heat to transfer upwards and further increasing its temperature. The radially spaced liquid channels create distinct zones within the heat spreader, allowing for separate heating control of each area. Since edge effects can lead to higher internal temperatures and lower edge temperatures, this zoned arrangement allows for individual temperature control of each area, ensuring temperature uniformity across the heat spreader and guaranteeing effective heat treatment of the wafers.

[0006] Preferably, the heat spreader is embedded with several temperature detectors corresponding to the liquid flow channel area.

[0007] Temperature detectors monitor the temperature of various areas of the heat spreader in real time and send the results back to the temperature controller. When a preset value is reached, the power of the heater is controlled to maintain a constant temperature on the heat spreader for heating the wafer. Due to edge effects, the internal temperature tends to be higher than the edge temperature, so the heating power of the heater gradually increases from the inside out to control temperature uniformity.

[0008] Preferably, several raised columns are installed between the bottom support platform and the heat spreader, with the raised columns separating the bottom support platform and the heat spreader.

[0009] Elevating columns are used to elevate and separate the bottom support platform and the heat spreader, preventing the two structures from directly contacting each other, reducing the transfer of heat generated by the heat spreader to the lower part, and reducing heat loss.

[0010] Preferably, a heat insulation pad is installed on the bottom support platform, and the heat insulation pad surrounds the heat spreader.

[0011] The heat insulation pad has a heat preservation effect, reducing heat loss from heat radiation.

[0012] Preferably, the heat spreader includes a heating plate and a metal heat-conducting plate. A liquid flow channel is disposed on the heating plate, and the metal heat-conducting plate is disposed above the heating plate. The heating plate and the metal heat-conducting plate are connected to form an integral structure.

[0013] The heating plate and the metal heat-conducting plate are connected to form a heat spreader, which facilitates the processing of the liquid flow channel.

[0014] Preferably, a mounting groove is provided on the bottom support platform, and the heat spreader is placed in the mounting groove.

[0015] The heat spreader is placed in the mounting groove, which not only facilitates the installation of the heat spreader, but also provides thermal insulation for the heat spreader, which helps to reduce heat loss.

[0016] The second approach involves circumferentially spaced interfering blades on the inner wall of the liquid flow channel, with the rotation of the heat exchange plate driving the disturbance of the liquid medium in the liquid flow channel.

[0017] During the rotation of the heat spreader, the turbulence blades can cause the liquid medium to turbulent. The turbulent liquid medium has good temperature uniformity at all positions, which is beneficial to improving the temperature uniformity performance of the heat spreader at all positions.

[0018] The third option involves setting an eccentric heat exchange plate below the heat spreader, with the heat spreader supported on the eccentric heat exchange plate. The eccentric heat exchange plate is eccentrically positioned relative to the heat spreader and rotates.

[0019] During the rotation of the eccentric heat exchange plate, it comes into contact with different sections of the heat exchange plate to achieve heat exchange, which helps to improve the temperature uniformity of each section.

[0020] The fourth option involves embedding several heat exchange columns on the upper part of the heat exchange plate, with the heat exchange columns extending into the liquid flow channel.

[0021] The heat exchange column has good thermal conductivity, and its extension into the liquid flow channel can accelerate the absorption of heat, allowing heat to be quickly transferred to the heat spreader.

[0022] The fifth option involves installing turbulence columns inside the liquid flow channel and installing several rings of electromagnetic blocks corresponding to the liquid flow channel below the heat exchange plate. The electromagnetic blocks, which are spaced circumferentially, are energized in sequence to attract the turbulence columns, which move within the liquid flow channel to disturb the liquid medium.

[0023] The electromagnetic blocks arranged at circumferential intervals are energized in sequence to attract the turbulence columns, causing the turbulence columns to move within the liquid flow channel. This causes the liquid medium within the liquid flow channel to be disturbed, resulting in good temperature uniformity at various locations of the disturbed liquid medium, which is beneficial for improving the temperature uniformity performance of the heat spreader at various locations.

[0024] Compared with the prior art, the beneficial effects of the present invention are: (1) The temperature distribution of each position on the heat exchange plate of the heat exchange heating device of this patent application is uniform. By controlling the temperature in zones, the influence of edge heat loss is reduced, thereby ensuring the heat treatment effect of the heat exchange heating device on the wafer; (2) The temperature detector detects the temperature of each area of ​​the heat exchange plate, monitors the temperature of each position of the heat exchange plate in real time, and feeds it back to the temperature controller. When the preset value is reached, the power of the heater is controlled so that the temperature of the heat exchange plate is constant and the wafer is heated; (3) The raised column separates the bottom support platform and the heat exchange plate, avoids direct contact between the two structures, reduces the heat generated by the heat exchange plate from being transferred to the lower part, and reduces heat loss; (4) The liquid medium in the liquid flow channel is disturbed. The temperature uniformity of each position of the disturbed liquid medium is good, which is conducive to improving the temperature uniformity of each position of the heat exchange plate; (5) The eccentric heat exchange plate contacts different positions of the heat exchange plate during the rotation process, realizes heat exchange, which is conducive to improving the temperature uniformity of each position of the zone. Attached Figure Description

[0025] Figure 1 This is a cross-sectional view of Embodiment 1 of the present invention.

[0026] Figure 2 This is an exploded view of Embodiment 1 of the present invention.

[0027] Figure 3 This is a cross-sectional view of Embodiment 2 of the present invention.

[0028] Figure 4 This is a cross-sectional view of Embodiment 3 of the present invention.

[0029] Figure 5 This is a cross-sectional view of Embodiment 4 of the present invention.

[0030] Figure 6 This is a cross-sectional view of Embodiment 5 of the present invention.

[0031] In the diagram: 1. Bottom support platform, 2. Heat spreader plate, 3. Support foot, 4. Mounting groove, 5. Liquid flow channel, 6. Insulation groove, 7. Liquid medium, 8. Elevating column, 9. Insulation pad, 10. Heating plate body, 11. Metal heat-conducting plate body, 12. Baffle blade, 13. Rotating sleeve, 14. Mounting sleeve, 15. Drive gear, 16. Gear ring, 17. Eccentric heat exchange plate, 18. Rotating column, 19. Deflection motor, 20. Drive bevel gear, 21. Driven bevel gear, 22. Positioning ring groove, 23. Positioning pin, 24. Heat exchange column, 25. Baffle column, 26. Electromagnetic block. Detailed Implementation

[0032] The technical solution of the present invention will be further described in detail below through specific embodiments and in conjunction with the accompanying drawings: Example 1: A uniform temperature heating device (see Figure 1 , Figure 2 The device includes a bottom support platform 1 and a heat spreader plate 2. The heat spreader plate 2 is mounted on the bottom support platform 1, which is connected to four support legs 3, which provide support for the bottom support platform 1. A mounting groove 4 is provided on the bottom support platform 1, and the heat spreader plate 2 is placed in the mounting groove 4. Placing the heat spreader plate 2 in the mounting groove 4 not only facilitates the installation of the heat spreader plate 2, but the mounting groove 4 also provides thermal insulation for the heat spreader plate 2, helping to reduce heat loss.

[0033] The heat spreader 2 has several radially spaced liquid channels 5 arranged from the center to the edge. The central liquid channel 5 has a circular structure, while the other liquid channels 5 have an annular structure. Several heat insulation grooves 6 are arranged on the lower surface of the heat spreader 2, and a heat insulation groove 6 is arranged between each pair of adjacent liquid channels 5. Liquid medium 7 is loaded in the liquid channels 5, and heaters are installed in the liquid channels 5 to heat the liquid medium 7.

[0034] The heat spreader 2 is embedded with several temperature detectors corresponding to the areas of the liquid flow channels 5. Each liquid flow channel 5 has several temperature detectors evenly distributed circumferentially. The temperature detectors detect the temperature of each area of ​​the heat spreader 2 in real time, monitor the temperature at each position of the heat spreader 2, and feed the data back to the temperature controller. When a preset value is reached, the power of the heater is controlled to keep the temperature of the heat spreader 2 constant for heating the wafer. Due to the edge effect, the internal temperature is higher and the edge temperature is lower, so the heating power of the heater gradually increases from the inside to the outside to control temperature uniformity.

[0035] Several raised posts 8 are installed between the bottom support platform 1 and the heat spreader 2, separating the bottom support platform 1 and the heat spreader 2. The raised posts 8 are placed at the bottom of the mounting groove 4. The raised posts 8 are used to elevate and separate the bottom support platform 1 and the heat spreader 2, avoiding direct contact between the two structures, reducing the heat generated by the heat spreader 2 from being transferred downwards, and reducing heat loss.

[0036] A heat insulation pad 9 is installed on the bottom support platform 1, surrounding the heat spreader 2. The heat insulation pad 9 is positioned on the side wall of the mounting groove 4. The heat insulation pad 9 provides insulation, reducing heat loss due to thermal radiation.

[0037] The heat spreader 2 includes a heating plate body 10 and a metal heat-conducting plate body 11. A liquid flow channel 5 is disposed on the heating plate body 10, and the metal heat-conducting plate body 11 is disposed above the heating plate body 10. The heating plate body 10 and the metal heat-conducting plate body 11 are connected to form an integral structure. The connection between the heating plate body 10 and the metal heat-conducting plate body 11 to form the heat spreader 2 facilitates the processing of the liquid flow channel 5. The bottom support platform 1 and the heat spreader 2 are fastened together with screws.

[0038] The bottom support platform 1 provides support for the entire device, ensuring its stability. The heat spreader 2 contains several concentric liquid channels 5 spaced from the center to the edge. The heater heats the liquid medium 7 within these channels 5, raising its temperature. This increased temperature creates a temperature difference between the liquid medium 7 and the heat spreader 2, causing heat to transfer upwards and further increasing the temperature of the heat spreader 2. The radially spaced liquid channels 5 create zones within the heat spreader 2, allowing for separate heating control within each zone. Since edge effects can lead to higher internal temperatures and lower edge temperatures, this zoned design allows for individual temperature control of each area, ensuring temperature uniformity across the heat spreader 2 and guaranteeing effective heat treatment of the wafers.

[0039] Example 2: A uniform temperature heating device (see Figure 3 The device includes a bottom support platform 1 and a heat spreader plate 2. The heat spreader plate 2 is mounted on the bottom support platform 1, which is connected to four support legs 3, which provide support for the bottom support platform 1. A mounting groove 4 is provided on the bottom support platform 1, and the heat spreader plate 2 is placed in the mounting groove 4. Placing the heat spreader plate 2 in the mounting groove 4 not only facilitates the installation of the heat spreader plate 2, but the mounting groove 4 also provides thermal insulation for the heat spreader plate 2, helping to reduce heat loss.

[0040] The heat spreader 2 has several radially spaced liquid channels 5 arranged from the center to the edge. The central liquid channel 5 has a circular structure, while the other liquid channels 5 have an annular structure. Several heat insulation grooves 6 are arranged on the lower surface of the heat spreader 2, and a heat insulation groove 6 is arranged between each pair of adjacent liquid channels 5. Liquid medium 7 is loaded in the liquid channels 5, and heaters are installed in the liquid channels 5 to heat the liquid medium 7.

[0041] The heat spreader 2 is embedded with several temperature detectors corresponding to the areas of the liquid flow channels 5. Each liquid flow channel 5 has several temperature detectors evenly distributed circumferentially. The temperature detectors detect the temperature of each area of ​​the heat spreader 2 in real time, monitor the temperature at each position of the heat spreader 2, and feed the data back to the temperature controller. When a preset value is reached, the power of the heater is controlled to keep the temperature of the heat spreader 2 constant for heating the wafer. Due to the edge effect, the internal temperature is higher and the edge temperature is lower, so the heating power of the heater gradually increases from the inside to the outside to control temperature uniformity.

[0042] Several raised posts 8 are installed between the bottom support platform 1 and the heat spreader 2, separating the bottom support platform 1 and the heat spreader 2. The raised posts 8 are placed at the bottom of the mounting groove 4. The raised posts 8 are used to elevate and separate the bottom support platform 1 and the heat spreader 2, avoiding direct contact between the two structures, reducing the heat generated by the heat spreader 2 from being transferred downwards, and reducing heat loss.

[0043] A heat insulation pad 9 is installed on the bottom support platform 1, surrounding the heat spreader 2. The heat insulation pad 9 is positioned on the side wall of the mounting groove 4. The heat insulation pad 9 provides insulation, reducing heat loss due to thermal radiation.

[0044] The heat spreader 2 includes a heating plate body 10 and a metal heat-conducting plate body 11. A liquid flow channel 5 is disposed on the heating plate body 10, and the metal heat-conducting plate body 11 is disposed above the heating plate body 10. The heating plate body 10 and the metal heat-conducting plate body 11 are connected to form an integral structure. The connection between the heating plate body 10 and the metal heat-conducting plate body 11 to form the heat spreader 2 facilitates the processing of the liquid flow channel 5.

[0045] A few turbulence-disrupting blades 12 are circumferentially spaced on the inner wall of the liquid flow channel 5. The rotation of the heat spreader 2 drives the liquid medium 7 in the liquid flow channel 5 to agitate. The turbulence-disrupting blades 12 are located near one side wall of the liquid flow channel 5. The heat spreader 2 is rotatably mounted on the bottom support platform 1 in the middle. A rotating sleeve 13 is located at the middle position of the lower surface of the heat spreader 2. An mounting sleeve 14 is located on the bottom support platform 1, and the rotating sleeve 13 is rotated and mounted on the mounting sleeve 14. A drive gear 15 driven by a motor is installed on the edge of the bottom support platform 1. A gear ring 16 is located on the side wall of the heat spreader 2, and the drive gear 15 meshes with the gear ring 16 for transmission. The drive motor drives the drive gear 15 to rotate, thereby driving the heat spreader 2 to rotate, causing the liquid medium 7 in the liquid flow channel 5 to agitate. The agitated liquid medium 7 has good temperature uniformity at all positions, which is beneficial to improving the temperature uniformity performance of the heat spreader 2 at all positions.

[0046] The bottom support platform 1 provides support for the entire device, ensuring its stability. The heat spreader 2 contains several concentric liquid channels 5 spaced from the center to the edge. The heater heats the liquid medium 7 within these channels 5, raising its temperature. This increased temperature creates a temperature difference between the liquid medium 7 and the heat spreader 2, causing heat to transfer upwards and further increasing the temperature of the heat spreader 2. The radially spaced liquid channels 5 create zones within the heat spreader 2, allowing for separate heating control within each zone. Since edge effects can lead to higher internal temperatures and lower edge temperatures, this zoned design allows for individual temperature control of each area, ensuring temperature uniformity across the heat spreader 2 and guaranteeing effective heat treatment of the wafers.

[0047] Example 3: A uniform temperature heating device (see Figure 4 The device includes a bottom support platform 1 and a heat spreader plate 2. The heat spreader plate 2 is mounted on the bottom support platform 1, which is connected to four support legs 3, which provide support for the bottom support platform 1. A mounting groove 4 is provided on the bottom support platform 1, and the heat spreader plate 2 is placed in the mounting groove 4. Placing the heat spreader plate 2 in the mounting groove 4 not only facilitates the installation of the heat spreader plate 2, but the mounting groove 4 also provides thermal insulation for the heat spreader plate 2, helping to reduce heat loss.

[0048] The heat spreader 2 has several radially spaced liquid channels 5 arranged from the center to the edge. The central liquid channel 5 has a circular structure, while the other liquid channels 5 have an annular structure. Several heat insulation grooves 6 are arranged on the lower surface of the heat spreader 2, and a heat insulation groove 6 is arranged between each pair of adjacent liquid channels 5. Liquid medium 7 is loaded in the liquid channels 5, and heaters are installed in the liquid channels 5 to heat the liquid medium 7.

[0049] The heat spreader 2 is embedded with several temperature detectors corresponding to the areas of the liquid flow channels 5. Each liquid flow channel 5 has several temperature detectors evenly distributed circumferentially. The temperature detectors detect the temperature of each area of ​​the heat spreader 2 in real time, monitor the temperature at each position of the heat spreader 2, and feed the data back to the temperature controller. When a preset value is reached, the power of the heater is controlled to keep the temperature of the heat spreader 2 constant for heating the wafer. Due to the edge effect, the internal temperature is higher and the edge temperature is lower, so the heating power of the heater gradually increases from the inside to the outside to control temperature uniformity.

[0050] Several raised posts 8 are installed between the bottom support platform 1 and the heat spreader 2, separating the bottom support platform 1 and the heat spreader 2. The raised posts 8 are placed at the bottom of the mounting groove 4. The raised posts 8 are used to elevate and separate the bottom support platform 1 and the heat spreader 2, avoiding direct contact between the two structures, reducing the heat generated by the heat spreader 2 from being transferred downwards, and reducing heat loss.

[0051] A heat insulation pad 9 is installed on the bottom support platform 1, surrounding the heat spreader 2. The heat insulation pad 9 is positioned on the side wall of the mounting groove 4. The heat insulation pad 9 provides insulation, reducing heat loss due to thermal radiation.

[0052] The heat spreader 2 includes a heating plate body 10 and a metal heat-conducting plate body 11. A liquid flow channel 5 is disposed on the heating plate body 10, and the metal heat-conducting plate body 11 is disposed above the heating plate body 10. The heating plate body 10 and the metal heat-conducting plate body 11 are connected to form an integral structure. The connection between the heating plate body 10 and the metal heat-conducting plate body 11 to form the heat spreader 2 facilitates the processing of the liquid flow channel 5.

[0053] An eccentric heat exchange plate 17 is positioned below the heat exchange plate 2, and the heat exchange plate 2 is supported on the eccentric heat exchange plate 17. The eccentric heat exchange plate 17 is eccentrically positioned to the heat exchange plate 2 and can rotate. A rotating column 18 is eccentrically positioned on the eccentric heat exchange plate 17, extending to the bottom support platform 1. A deflection motor 19 is mounted on the lower surface of the bottom support platform 1. A driving bevel gear 20 is mounted on the output shaft of the deflection motor 19, and a driven bevel gear 21 is mounted on the rotating column 18. The driving bevel gear 20 and the driven bevel gear 21 mesh and drive each other. A driving gear 15 driven by a motor is mounted on the edge of the bottom support platform 1. A gear ring 16 is positioned on the side wall of the heat exchange plate 2, and the driving gear 15 meshes and drives the gear ring 16. The drive motor drives the driving gear 15 to rotate, thereby driving the heat exchange plate 2 to rotate. A positioning ring groove 22 is provided on the outer wall of the heat spreader 2, and several circumferentially distributed positioning pins 23 are connected to the bottom support platform 1. The ends of the positioning pins 23 are inserted into the positioning ring groove 22 to achieve positioning of the heat spreader 2, so that the heat spreader 2 can only rotate and cannot move radially or axially.

[0054] The eccentric heat exchange plate 17 rotates and the heat spreader 2 also rotates. During the rotation, the eccentric heat exchange plate 17 comes into contact with different partition positions of the heat spreader 2 to achieve heat exchange, which is beneficial to improve the temperature uniformity of each partition position.

[0055] The bottom support platform 1 provides support for the entire device, ensuring its stability. The heat spreader 2 contains several concentric liquid channels 5 spaced from the center to the edge. The heater heats the liquid medium 7 within these channels 5, raising its temperature. This increased temperature creates a temperature difference between the liquid medium 7 and the heat spreader 2, causing heat to transfer upwards and further increasing the temperature of the heat spreader 2. The radially spaced liquid channels 5 create zones within the heat spreader 2, allowing for separate heating control within each zone. Since edge effects can lead to higher internal temperatures and lower edge temperatures, this zoned design allows for individual temperature control of each area, ensuring temperature uniformity across the heat spreader 2 and guaranteeing effective heat treatment of the wafers.

[0056] Example 4: A uniform temperature heating device (see Figure 5 The device includes a bottom support platform 1 and a heat spreader plate 2. The heat spreader plate 2 is mounted on the bottom support platform 1, which is connected to four support legs 3, which provide support for the bottom support platform 1. A mounting groove 4 is provided on the bottom support platform 1, and the heat spreader plate 2 is placed in the mounting groove 4. Placing the heat spreader plate 2 in the mounting groove 4 not only facilitates the installation of the heat spreader plate 2, but the mounting groove 4 also provides thermal insulation for the heat spreader plate 2, helping to reduce heat loss.

[0057] The heat spreader 2 has several radially spaced liquid channels 5 arranged from the center to the edge. The central liquid channel 5 has a circular structure, while the other liquid channels 5 have an annular structure. Several heat insulation grooves 6 are arranged on the lower surface of the heat spreader 2, and a heat insulation groove 6 is arranged between each pair of adjacent liquid channels 5. Liquid medium 7 is loaded in the liquid channels 5, and heaters are installed in the liquid channels 5 to heat the liquid medium 7.

[0058] The heat spreader 2 is embedded with several temperature detectors corresponding to the areas of the liquid flow channels 5. Each liquid flow channel 5 has several temperature detectors evenly distributed circumferentially. The temperature detectors detect the temperature of each area of ​​the heat spreader 2 in real time, monitor the temperature at each position of the heat spreader 2, and feed the data back to the temperature controller. When a preset value is reached, the power of the heater is controlled to keep the temperature of the heat spreader 2 constant for heating the wafer. Due to the edge effect, the internal temperature is higher and the edge temperature is lower, so the heating power of the heater gradually increases from the inside to the outside to control temperature uniformity.

[0059] Several raised posts 8 are installed between the bottom support platform 1 and the heat spreader 2, separating the bottom support platform 1 and the heat spreader 2. The raised posts 8 are placed at the bottom of the mounting groove 4. The raised posts 8 are used to elevate and separate the bottom support platform 1 and the heat spreader 2, avoiding direct contact between the two structures, reducing the heat generated by the heat spreader 2 from being transferred downwards, and reducing heat loss.

[0060] A heat insulation pad 9 is installed on the bottom support platform 1, surrounding the heat spreader 2. The heat insulation pad 9 is positioned on the side wall of the mounting groove 4. The heat insulation pad 9 provides insulation, reducing heat loss due to thermal radiation.

[0061] The heat spreader 2 includes a heating plate body 10 and a metal heat-conducting plate body 11. A liquid flow channel 5 is disposed on the heating plate body 10, and the metal heat-conducting plate body 11 is disposed above the heating plate body 10. The heating plate body 10 and the metal heat-conducting plate body 11 are connected to form an integral structure. The connection between the heating plate body 10 and the metal heat-conducting plate body 11 to form the heat spreader 2 facilitates the processing of the liquid flow channel 5.

[0062] Several heat exchange columns 24 are embedded in the upper part of the heat spreader 2, extending into the liquid flow channel 5. Each liquid flow channel 5 contains several circumferentially spaced heat exchange columns 24. The heat spreader 2 is made of aluminum, and the heat exchange columns 24 are made of copper. Copper heat exchange columns 24 have good thermal conductivity, and their extension into the liquid flow channel 5 accelerates heat absorption, allowing heat to be quickly transferred to the heat spreader 2.

[0063] The heat spreader 2 is rotatably mounted on the bottom support platform 1 in the middle. A rotating sleeve 13 is set at the middle position of the lower surface of the heat spreader 2, and an mounting sleeve 14 is set on the bottom support platform 1. The rotating sleeve 13 and the mounting sleeve 14 are fitted together. A drive gear 15 driven by a motor is installed on the edge of the bottom support platform 1. A gear ring 16 is set on the side wall of the heat spreader 2, and the drive gear 15 meshes with the gear ring 16 for transmission. The drive motor drives the drive gear 15 to rotate, thereby driving the heat spreader 2 to rotate, which disturbs the liquid medium 7 in the liquid flow channel 5. The disturbed liquid medium 7 has good temperature uniformity at all positions, which is beneficial to improving the temperature uniformity performance of the heat spreader 2 at all positions.

[0064] The bottom support platform 1 provides support for the entire device, ensuring its stability. The heat spreader 2 contains several concentric liquid channels 5 spaced from the center to the edge. The heater heats the liquid medium 7 within these channels 5, raising its temperature. This increased temperature creates a temperature difference between the liquid medium 7 and the heat spreader 2, causing heat to transfer upwards and further increasing the temperature of the heat spreader 2. The radially spaced liquid channels 5 create zones within the heat spreader 2, allowing for separate heating control within each zone. Since edge effects can lead to higher internal temperatures and lower edge temperatures, this zoned design allows for individual temperature control of each area, ensuring temperature uniformity across the heat spreader 2 and guaranteeing effective heat treatment of the wafers.

[0065] Example 5: A uniform temperature heating device (see Figure 6 The device includes a bottom support platform 1 and a heat spreader plate 2. The heat spreader plate 2 is mounted on the bottom support platform 1, which is connected to four support legs 3, which provide support for the bottom support platform 1. A mounting groove 4 is provided on the bottom support platform 1, and the heat spreader plate 2 is placed in the mounting groove 4. Placing the heat spreader plate 2 in the mounting groove 4 not only facilitates the installation of the heat spreader plate 2, but the mounting groove 4 also provides thermal insulation for the heat spreader plate 2, helping to reduce heat loss.

[0066] The heat spreader 2 has several radially spaced liquid channels 5 arranged from the center to the edge. The central liquid channel 5 has a circular structure, while the other liquid channels 5 have an annular structure. Several heat insulation grooves 6 are arranged on the lower surface of the heat spreader 2, and a heat insulation groove 6 is arranged between each pair of adjacent liquid channels 5. Liquid medium 7 is loaded in the liquid channels 5, and heaters are installed in the liquid channels 5 to heat the liquid medium 7.

[0067] The heat spreader 2 is embedded with several temperature detectors corresponding to the areas of the liquid flow channels 5. Each liquid flow channel 5 has several temperature detectors evenly distributed circumferentially. The temperature detectors detect the temperature of each area of ​​the heat spreader 2 in real time, monitor the temperature at each position of the heat spreader 2, and feed the data back to the temperature controller. When a preset value is reached, the power of the heater is controlled to keep the temperature of the heat spreader 2 constant for heating the wafer. Due to the edge effect, the internal temperature is higher and the edge temperature is lower, so the heating power of the heater gradually increases from the inside to the outside to control temperature uniformity.

[0068] Several raised posts 8 are installed between the bottom support platform 1 and the heat spreader 2, separating the bottom support platform 1 and the heat spreader 2. The raised posts 8 are placed at the bottom of the mounting groove 4. The raised posts 8 are used to elevate and separate the bottom support platform 1 and the heat spreader 2, avoiding direct contact between the two structures, reducing the heat generated by the heat spreader 2 from being transferred downwards, and reducing heat loss.

[0069] A heat insulation pad 9 is installed on the bottom support platform 1, surrounding the heat spreader 2. The heat insulation pad 9 is positioned on the side wall of the mounting groove 4. The heat insulation pad 9 provides insulation, reducing heat loss due to thermal radiation.

[0070] The heat spreader 2 includes a heating plate body 10 and a metal heat-conducting plate body 11. A liquid flow channel 5 is disposed on the heating plate body 10, and the metal heat-conducting plate body 11 is disposed above the heating plate body 10. The heating plate body 10 and the metal heat-conducting plate body 11 are connected to form an integral structure. The connection between the heating plate body 10 and the metal heat-conducting plate body 11 to form the heat spreader 2 facilitates the processing of the liquid flow channel 5. The bottom support platform 1 and the heat spreader 2 are fastened together with screws.

[0071] A flow-dispersing column 25 is installed inside the liquid flow channel 5. The flow-dispersing column 25 has a cylindrical structure. Several electromagnetic blocks 26 corresponding to the liquid flow channel 5 are installed below the heat spreader 2. The electromagnetic blocks 26, which are spaced apart circumferentially, are energized in sequence to attract the flow-dispersing column 25. The flow-dispersing column 25 moves within the liquid flow channel 5, causing disturbance to the liquid medium 7 within the liquid flow channel 5. The bottom support platform 1 and the heat spreader 2 are both made of aluminum, while the flow-dispersing column 25 is made of iron. When the electromagnetic blocks 26 are energized, they can attract the flow-dispersing column 25, but will not attract the bottom support platform 1 and the heat spreader 2.

[0072] The circumferentially spaced electromagnetic blocks 26 are sequentially energized to attract the turbulence columns 25, causing them to move within the liquid flow channel 5. This agitates the liquid medium 7 within the channel, resulting in good temperature uniformity across all positions of the agitated liquid medium 7, which is beneficial for improving the temperature uniformity of the heat spreader 2. The movement of the turbulence columns 25 within the liquid flow channel 5 can be achieved by controlling the energizing sequence of the electromagnets, ensuring stability and reliability.

[0073] The bottom support platform 1 provides support for the entire device, ensuring its stability. The heat spreader 2 contains several concentric liquid channels 5 spaced from the center to the edge. The heater heats the liquid medium 7 within these channels 5, raising its temperature. This increased temperature creates a temperature difference between the liquid medium 7 and the heat spreader 2, causing heat to transfer upwards and further increasing the temperature of the heat spreader 2. The radially spaced liquid channels 5 create zones within the heat spreader 2, allowing for separate heating control within each zone. Since edge effects can lead to higher internal temperatures and lower edge temperatures, this zoned design allows for individual temperature control of each area, ensuring temperature uniformity across the heat spreader 2 and guaranteeing effective heat treatment of the wafers.

[0074] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any way. Other variations and modifications may be made without departing from the technical solutions described in the claims.

Claims

1. A uniform temperature heating device, characterized in that, It includes a bottom support platform and a heat spreader plate. The heat spreader plate is installed on the bottom support platform. Several radially spaced liquid channels are arranged inside the heat spreader plate from the center to the edge. Liquid medium is loaded in the liquid channels. Heaters are installed in the liquid channels to heat the liquid medium.

2. The uniform temperature heating device according to claim 1, characterized in that, The heat spreader is equipped with several temperature detectors corresponding to the liquid flow channel areas.

3. The uniform temperature heating device according to claim 1, characterized in that, Several raised columns are installed between the bottom support platform and the heat spreader, separating the bottom support platform and the heat spreader.

4. The uniform temperature heating device according to claim 1, characterized in that, A heat insulation pad is installed on the bottom support platform, and the heat insulation pad surrounds the heat spreader.

5. The uniform temperature heating device according to claim 1, characterized in that, The heat spreader includes a heating plate and a metal heat-conducting plate. The liquid flow channel is located on the heating plate, and the metal heat-conducting plate is located above the heating plate. The heating plate and the metal heat-conducting plate are connected to form an integral structure.

6. The uniform temperature heating device according to claim 1, characterized in that, An installation slot is provided on the bottom support platform, and the heat spreader is placed in the installation slot.

7. A uniform temperature heating device according to any one of claims 1 to 6, characterized in that, The inner wall of the liquid flow channel is circumferentially spaced with turbulent flow blades, and the rotation of the heat exchange plate drives the liquid medium in the liquid flow channel to be disturbed.

8. A uniform temperature heating device according to any one of claims 1 to 6, characterized in that, An eccentric heat exchange plate is installed below the heat exchange plate, and the heat exchange plate is supported on the eccentric heat exchange plate. The eccentric heat exchange plate and the heat exchange plate are eccentrically set, and the eccentric heat exchange plate is rotated.

9. A uniform temperature heating device according to any one of claims 1 to 6, characterized in that, Several heat exchange columns are embedded in the upper part of the heat exchange plate, and the heat exchange columns extend into the liquid flow channel.

10. A uniform temperature heating device according to any one of claims 1 to 6, characterized in that, A flow-dispersing column is installed inside the liquid flow channel. Several electromagnetic blocks corresponding to the liquid flow channel are installed below the heat exchange plate. The electromagnetic blocks, which are circumferentially spaced, are energized in sequence to attract the flow-dispersing column. The flow-dispersing column moves inside the liquid flow channel, causing the liquid medium inside the liquid flow channel to be disturbed.

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