Grinding wheel for parallel surface grinding machine and manufacturing method of grinding wheel

Abstract

The grinding wheel comprises a steel base body structure, and a transition structure layer bonding face is arranged on the upper end face of the steel base body structure. The lower end surface of the transition structure layer and the transition structure layer bonding surface of the steel matrix structure are bonded through a metal bonding agent; an abrasive material structure layer bonding surface is arranged on the upper end surface of the transition structure layer; the lower end surface of the abrasive structure layer and the abrasive structure layer bonding surface of the transition structure layer are bonded through a metal bonding agent; circumferential chip grooves are formed in the circumferential surfaces of the abrasive material structure layer, the transition structure layer and the steel matrix structure; a plurality of radial chip grooves, arc chip grooves and pore structures are arranged on the upper end face of the abrasive material structure layer. The invention also discloses a preparation method of the composition. By additionally arranging the transition structure layer, it is guaranteed that steel cannot make direct contact with a workpiece while abrasives are used up, the utilization rate of the abrasives is increased, the transition layer can make contact with the workpiece after the abrasives are used up, and the workpiece is prevented from being damaged.

Description

Technical Field

[0001] This invention relates to the field of grinding wheel manufacturing for double-end face grinders, and specifically to a grinding wheel for double-end face grinders and its manufacturing method. Background Technology

[0002] When existing double-end grinding wheels are used up, the steel substrate will directly contact the workpiece. On the one hand, the rough surface of the steel substrate will cause deep scratches, roughening and other mechanical damage to the workpiece; on the other hand, the local high temperature generated by direct friction between metals may cause changes in the metallographic structure of the workpiece surface (such as annealing softening or quenching cracks), and even cause irreversible dimensional deviations. Summary of the Invention

[0003] In order to overcome the above-mentioned defects of the prior art, the purpose of this invention is to provide a grinding wheel for a double-end face grinder and a method for manufacturing the same.

[0004] This invention improves the utilization rate of abrasive by adding a transition layer between the abrasive layer and the steel substrate. This ensures that the abrasive is used up without causing the steel to directly contact the workpiece, and also allows the transition layer to contact the workpiece after the abrasive is used up, preventing the steel substrate from directly contacting the workpiece and causing damage.

[0005] To achieve the objectives of this invention, the technical solution adopted is as follows: A grinding wheel for a double-end grinding machine, comprising: A steel substrate structure, wherein a transition structure layer bonding surface is provided at the upper end surface of the steel substrate structure; The lower end face of the transition structure layer is bonded to the bonding surface of the transition structure layer of the steel substrate structure using a metal adhesive. The upper surface of the transition structure layer is provided with an abrasive structure layer bonding surface. The lower end face of the abrasive structure layer and the bonding surface of the abrasive structure layer of the transition structure layer are bonded together using a metal adhesive. Circumferential chip removal grooves are provided on the circumferential surfaces of the abrasive structure layer, the transition structure layer, and the steel substrate structure. The upper surface of the abrasive structure layer is provided with several radial chip removal grooves, arc-shaped chip removal grooves, and a porous structure.

[0006] In a preferred embodiment of the present invention, the radial chip removal grooves are a plurality of radial chip removal grooves arranged radially along the center of the abrasive structure layer.

[0007] In a preferred embodiment of the present invention, the transition structure layer is made of resin.

[0008] In a preferred embodiment of the present invention, the resin material is any one or more of phenolic resin, epoxy resin, and polyimide resin.

[0009] A method for manufacturing a grinding wheel for a double-end face grinder includes the following steps: The lower end face of the transition structure layer is bonded to the bonding surface of the transition structure layer of the steel substrate structure using a metal adhesive. Then, the lower end face of the abrasive structure layer and the bonding surface of the abrasive structure layer of the transition structure layer are bonded together using a metal adhesive. Then, the corresponding chip removal channel is installed.

[0010] The beneficial effects of this invention are as follows: This invention improves the utilization rate of abrasive by adding a transition layer between the abrasive structure layer and the steel substrate structure. This ensures that the abrasive is used up without the steel material directly contacting the workpiece, and also allows the transition layer to contact the workpiece after the abrasive is used up, preventing the steel substrate from directly contacting the workpiece and causing damage. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0012] Figure 2 This is a partial structural diagram of the present invention. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. However, it should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the invention. Furthermore, in the following descriptions, well-known structures and technologies are omitted to avoid unnecessarily obscuring the concept of the invention.

[0014] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. Furthermore, terms such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0015] like Figure 1 or Figure 2 The grinding wheel for a double-end face grinder shown includes a steel substrate structure 100. A transition structure layer bonding surface 101 is provided on the upper end face of the steel substrate structure 100. The lower end face of the transition structure layer 200 and the transition structure layer bonding surface 101 of the steel substrate structure 100 are bonded together by a metal adhesive.

[0016] The steel matrix structure 100 serves as the skeleton of the grinding wheel and is made of high-rigidity steel. Its upper surface has a pre-set transition structure layer bonding surface, and its flatness and roughness are ensured by precision machining. This provides a stable mechanical bearing foundation for the upper structure and ensures that the grinding wheel is not easily deformed under high-speed rotation and grinding load.

[0017] The upper end face of the transition structure layer 200 is provided with an abrasive structure layer bonding surface 201, and the lower end face of the abrasive structure layer 300 and the abrasive structure layer bonding surface 201 of the transition structure layer 200 are bonded together with a metal adhesive.

[0018] The lower end face of the transition structure layer is bonded to the steel substrate through a metal adhesive, while the upper end face of the transition structure layer is provided with an abrasive structure layer bonding surface. Through the gradient transition of material properties, a strong connection is achieved with the steel substrate through the metal adhesive, and the stress change after the abrasive layer wears out is buffered by its own characteristics, thus avoiding the steel substrate being directly exposed to the grinding interface.

[0019] The transition structure layer 200 is made of resin. The resin material is phenolic resin, epoxy resin, or polyimide resin.

[0020] The hardness of resin material (usually HRC20-40) is between that of superhard abrasives (HV8000 and above) and steel substrates (HRC30-60). When the abrasive layer is completely worn, the resin transition layer can contact the workpiece first. Its moderate hardness can avoid rigid scratch damage to the steel substrate and can slowly release stress through its own slight wear.

[0021] Even if the transition layer eventually wears away completely, its wear rate is much slower than the workpiece damage caused by direct contact with the steel substrate. This can significantly reduce the risk of mass workpiece scrap.

[0022] Among them, the characteristics of different resins can be matched to specific working conditions. Phenolic resin has low cost and good overall performance, making it suitable for conventional grinding; epoxy resin has strong adhesion and good dimensional stability, making it suitable for precision parts processing; polyimide resin is resistant to high temperature and fatigue, making it suitable for high-speed and heavy-load scenarios.

[0023] Circumferential chip removal grooves 400 are provided on the circumferential surfaces of the abrasive structure layer 300, the transition structure layer 200, and the steel substrate structure 100. The circumferential chip removal grooves 400 quickly remove grinding chips and waste fluid from the periphery of the grinding zone, avoiding circumferential accumulation that could lead to imbalance of the grinding wheel.

[0024] The upper surface of the abrasive structure layer is provided with several radial chip removal grooves 500, arc-shaped chip removal grooves, and a porous structure 600. The radial chip removal grooves are several radial chip removal grooves 500 arranged radially along the center of the abrasive structure layer.

[0025] The radial chip removal grooves 500 rapidly divert wear debris from the central area to the surrounding areas. The radial chip removal grooves 500 also guide edge wear debris towards the circumferential grooves via an arc-shaped path. Together, they form a planar guiding system that integrates central radiation and edge convergence.

[0026] This invention improves the utilization rate of abrasive by adding a transition layer between the abrasive structure layer and the steel substrate structure. This ensures that the abrasive is used up without the steel material directly contacting the workpiece, and also allows the transition layer to contact the workpiece after the abrasive is used up, preventing the steel substrate from directly contacting the workpiece and causing damage.

[0027] The foregoing has shown and described the basic principles and main features of the invention and the advantages of the invention.

[0028] Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the present invention. Various changes and modifications can be made to the present invention without departing from its spirit and scope. All such changes and modifications fall within the scope of the present invention as claimed, which is defined by the appended claims and their equivalents.

Claims

1. A grinding wheel for a double-end face grinder, characterized in that, include: A steel substrate structure, wherein a transition structure layer bonding surface is provided at the upper end surface of the steel substrate structure; The lower end face of the transition structure layer is bonded to the bonding surface of the transition structure layer of the steel substrate structure using a metal adhesive. The upper surface of the transition structure layer is provided with an abrasive structure layer bonding surface. The lower end face of the abrasive structure layer and the bonding surface of the abrasive structure layer of the transition structure layer are bonded together using a metal adhesive. Circumferential chip removal grooves are provided on the circumferential surfaces of the abrasive structure layer, the transition structure layer, and the steel substrate structure. The upper surface of the abrasive structure layer is provided with several radial chip removal grooves, arc-shaped chip removal grooves, and a porous structure.

2. The grinding wheel for a double-end face grinder as described in claim 1, characterized in that, The radial chip removal grooves are a number of radial chip removal grooves arranged radially along the center of the abrasive structure layer.

3. A grinding wheel for a double-end face grinder as described in claim 1, characterized in that, The transition structure layer is made of resin.

4. A grinding wheel for a double-end face grinder as described in claim 1, characterized in that, The resin material is any one or more of phenolic resin, epoxy resin, and polyimide resin.

5. A method for manufacturing a grinding wheel for a double-end face grinder, characterized in that, Includes the following steps: The lower end face of the transition structure layer is bonded to the bonding surface of the transition structure layer of the steel substrate structure using a metal adhesive. Then, the lower end face of the abrasive structure layer and the bonding surface of the abrasive structure layer of the transition structure layer are bonded together using a metal adhesive. Then, the corresponding chip removal channel is installed.

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