Badge heat transfer printing mold and mold assembly

Abstract

The invention belongs to the technical field of vacuum heat transfer printing equipment, and particularly relates to a badge heat transfer printing mold and a mold assembly.According to the badge heat transfer printing mold, an assembling groove is formed in the near end of a mold table, and a positioning protrusion and an air guide groove are formed in the lower side of the far end, so that the positioning protrusion is matched with a positioning hole, and meanwhile the sealing effect is achieved; an integrated gas path is formed between the mounting base part and the mold table and used for allowing gas to flow, so that the transfer film is adsorbed to the surface of the badge through the integrated gas path during gas exhaust, the mold table can be mounted and positioned through the arrangement mode, the positioning hole serves as the gas path communicating with the lower side of the base plate, one hole has two purposes, the hiding performance is good, and the practicability is high. And the badge heat transfer printing mold assembly is more attractive. Compared with an existing badge surface layer pattern processing mode, the mold and the mold assembly are applied to the vacuum heat transfer printing machine, the transfer printing film is attached to the surface of the badge through vacuumizing, heat transfer printing of elements is achieved, and the existing badge surface layer pattern processing mode is changed.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese application CN 2025109509890, filed on July 9, 2025, entitled "Badge Heat Transfer Mold Assembly, Mold, Heat Transfer Machine and Method", and to Chinese application CN2025105397311, filed on April 25, 2025, entitled "Vacuum Heat Transfer Machine, Mold and Assembly Thereof, Wiring Mechanism, Masking Component and Method", the contents of which are considered part of the disclosure of this application and are incorporated herein by reference in their entirety. Technical Field

[0003] This application belongs to the technical field of vacuum heat transfer equipment, specifically relating to badge heat transfer molds and mold assemblies. Background Technology

[0004] This section provides background information relevant to this application and is not necessarily prior art.

[0005] The current method of creating patterns on badges typically involves placing the badge body on the lower mold of a laminating machine, then covering the front of the badge body with a printed pattern. Pressure from the upper mold then folds the edge of the pattern towards the back of the badge body, securing it in place to create different patterns. However, badges made using this traditional molding method rely solely on the edge of the pattern to adhere to the badge body, resulting in poor adhesion and easy lifting of the edge, rendering the badge unusable. Therefore, it is essential to develop a badge heat transfer mold suitable for vacuum heat transfer printing to change the current processing method of badge surface patterns and improve the adhesion between the badge body and its pattern. Summary of the Invention

[0006] One objective of this application is to address the defect of poor adhesion between the surface pattern and the badge manufactured using existing molding processes. This application provides a badge heat transfer mold that can support the badge and enable it to be used for vacuum heat transfer printing. By drawing a vacuum, the transfer film is adhered to the front of the badge, and by heating, the elements of the transfer film are transferred to the surface of the badge, making the elements on the badge surface tightly bonded to the badge and less prone to edge lifting.

[0007] To solve the above-mentioned technical problems, this application adopts the following technical solution:

[0008] A badge heat transfer mold, the badge including a printing portion and a fixing component, the badge heat transfer mold including a mold platform, a support portion, a loading groove and a venting groove, the mold platform for mounting on a mounting base, having a proximal end and a distal end disposed opposite to each other, the lower side of the distal end having one or more positioning protrusions, the mounting base having positioning holes corresponding to the positioning protrusions, the one or more positioning protrusions detachably engaging with the corresponding positioning holes, the loading groove being constructed on the support portion for receiving the fixing component, the venting groove being constructed on the lower side of the distal end and communicating with the loading groove, in response to the engagement of the positioning protrusions with the positioning holes, the loading groove communicating with at least the positioning holes through the venting groove.

[0009] The badge heat transfer mold of this application constructs an assembly groove at the near end of the mold table and a positioning protrusion and air guide groove on the lower side of the far end. This achieves an integrated air passage between the mounting base and the mold table, where the positioning protrusion engages with the positioning hole, allowing gas flow. During vacuuming, the transfer film is adsorbed onto the badge surface through this integrated air passage. This design not only positions the mold table but also uses the positioning hole as an air passage connecting the lower side of the substrate, serving a dual purpose and offering good concealment, thus improving the aesthetics of the badge heat transfer mold assembly. Compared to existing badge surface pattern processing methods, the mold provided in this application is used on a vacuum heat transfer machine. By creating a vacuum, the transfer film adheres to the front of the badge, and heating transfers the elements of the heat transfer film onto the badge surface. This enhances the connection strength between the badge surface elements and the badge surface, changing the existing badge surface pattern processing method, avoiding edge lifting defects, extending the badge's lifespan, and making the badge surface pattern more tightly connected to the badge, resulting in a more aesthetically pleasing and reliable finish.

[0010] Furthermore, the outer ring of the support portion is provided with a downwardly inclined or downwardly curved inclined portion, which can provide clearance around the outer edge of the badge bottom surface, so that the film material can enter the inclined portion under negative pressure to cover the outer edge surface of the badge bottom surface.

[0011] Furthermore, two sets of positioning protrusions and positioning holes are configured, and the loading groove is disposed between the two sets of positioning holes. The above configuration can control the orientation of the mold relative to the mounting base.

[0012] Furthermore, a gap is provided between the positioning protrusion and the positioning hole. The gap ensures that the air guide groove is connected to the outside through the positioning hole, ensuring the flow of gas. This method of forming an air passage using a gap is simple in structure and easy to implement.

[0013] Furthermore, the mold platform is made of a thermally conductive material. For example, it can be made of aluminum or its alloys, copper or its alloys, or other materials with good thermal conductivity. This feature can improve heat transfer during vacuum heat transfer and increase the efficiency of badge heat transfer.

[0014] Furthermore, the loading slot is recessed downwards, and a first airflow channel is constructed on the lower distal side of the mold platform. The loading slot connects to the air guide slot through the first airflow channel. This type of positioning slot is a non-through mold platform, which can provide support for the badge's fixing components. Alternatively, the loading slot penetrates both the upper and lower surfaces of the mold platform and connects to the air guide slot. This type of loading slot forms a direct airflow path, improving the efficiency of gas flow.

[0015] Furthermore, the loading groove is recessed to the lower side, and a second airflow channel is provided on the side of the mold platform. The loading groove is connected to the side surface of the mold platform through the second airflow channel. One end of the second airflow channel is connected to the loading groove, and the other end extends to the side of the side surface of the mold platform near its lower surface and penetrates the lower surface of the mold platform to form an air extraction port. The positioning groove with this configuration is a non-penetrating mold platform, which can provide support for the fixing components of the badge, and at the same time allow the transfer mold to better adhere to the corner joint position between the side and bottom of the badge.

[0016] Furthermore, the air guide groove is connected to the side of the mold table. This arrangement allows the transfer film to be adsorbed from the side, improving the adhesion between the transfer film and the badge.

[0017] Furthermore, to increase gas flow and enhance the adhesion between the transfer film and the badge, two or more air guide channels are provided, with at least one end of each air guide channel connected to the loading slot and the other end extending to the side of the mold table. As a specific configuration, two or more air guide channels are provided, with at least a portion of the positioning protrusion having an annular channel around its periphery. At least one end of each air guide channel is connected to the loading slot, and the other end is connected to the annular channel before extending to the side of the mold table.

[0018] Another aspect of this application provides a badge heat transfer mold assembly, including one or more badge heat transfer molds of this application and a substrate. The substrate is configured with one or more positioning holes, and the mounting base is formed around the positioning holes. The positioning holes communicate with the lower side of the substrate. The distal ends of one or more badge heat transfer molds are detachably supported on the mounting base through the engagement of the positioning protrusions with the positioning holes, so that the air guide groove communicates with the lower side of the substrate and the loading groove through the gap between the positioning protrusions and the corresponding positioning holes.

[0019] The badge heat transfer mold assembly of this application achieves integrated air passage between the mounting base and the mold table by constructing an assembly groove at the near end of the mold table and a positioning protrusion and air guide groove on the lower side of the far end. This allows for gas flow, enabling the transfer film to be adsorbed onto the badge surface during vacuuming. This arrangement not only positions the mold table but also uses the positioning hole as an air passage connecting the lower side of the substrate, serving a dual purpose and providing good concealment, thus improving the aesthetics of the badge heat transfer mold assembly. Compared to existing badge surface pattern processing methods, the mold assembly provided in this application, used in a vacuum heat transfer machine, adheres the transfer film to the front of the badge through vacuuming and transfers the elements of the heat transfer film to the badge surface through heating. This enhances the connection strength between the badge surface elements and the badge surface, changing the existing badge surface pattern processing method, avoiding edge lifting defects, extending the badge's lifespan, and making the badge surface pattern more tightly connected to the badge, resulting in a more aesthetically pleasing and reliable finish. Meanwhile, the mold assembly can be configured with multiple molds to process multiple badges in a single vacuum heat transfer, improving the efficiency of badge surface pattern production. Attached Figure Description

[0020] Figure 1 A three-dimensional view of a badge heat transfer mold;

[0021] Figure 2 A three-dimensional view of the badge heat transfer mold assembly;

[0022] Figure 3 A schematic diagram of the structure for mounting the badge on the badge heat transfer mold assembly;

[0023] Figure 4 A schematic diagram showing the separation of the badge heat transfer mold from the substrate;

[0024] Figure 5 This is a schematic diagram of the air guide groove, positioning protrusion, and positioning hole on the substrate of the badge heat transfer mold.

[0025] Figure 6 This is a schematic diagram showing the fit between the badge heat transfer mold and the substrate;

[0026] Figure 7 This is a schematic diagram of the air guide groove of a badge heat transfer mold. The dotted line in the diagram represents the substrate in a transparent state.

[0027] Figure 8 A schematic diagram of a vacuum heat transfer printing machine and a badge heat transfer printing mold assembly for using badge heat transfer molds;

[0028] Figure 9 A schematic diagram of the badge heat transfer mold assembly assembled in the transfer cavity;

[0029] Figure 10 and Figure 11 A schematic diagram of the air guide groove and the first airflow channel of the badge heat transfer mold;

[0030] Figure 12 and Figure 13 A schematic diagram of the second airflow channel in a badge heat transfer mold;

[0031] Figure 14 A schematic diagram of a mold for this application fitted with a small badge;

[0032] Figure 15 This is a schematic diagram of a mold for this application with a large badge mounted on it. Detailed Implementation

[0033] The specific embodiments of this application are described below with reference to the accompanying drawings.

[0034] See Figure 1 , Figure 2 , Figure 3 This application generally relates to a badge heat transfer mold 9 and a mold assembly using the badge heat transfer mold, such as Figure 3 As shown, the badge b includes a printing portion b1 for attaching patterns, colors, and other elements, and a fixing component b2 disposed at the bottom of the printing portion b1. The fixing component b2 is used to fix the badge b onto the surface of clothing, bags, or other objects. A common fixing component b2 is a pin. Of course, the badge heat transfer mold and mold assembly of this application are not limited to the heat transfer process of badges. They can also be other workpieces with similar structures, such as brooches, hair clips, and other ornaments with fixing components. Heat transfer molds and mold assemblies for such uses are also within the scope of protection of this application.

[0035] See Figure 8 and Figure 9The badge heat transfer mold 9 of this application is used in a vacuum heat transfer machine. The vacuum heat transfer machine includes a body 1, a cover 2, a vacuum system (not shown), and a heating element (not shown). The body 1 is constructed with a transfer cavity 100, which is open on the upper side. The cover 2 can cover the transfer cavity 100. For example, the cover 2 is rotatably connected to the body 1. The user can open or close the transfer cavity 100 by flipping the cover 2. The heating element provides heat to the transfer chamber 100. A vacuum system is configured within the machine body 1. For example, the bottom wall of the transfer chamber 100 has a vacuum channel 106 communicating with the vacuum system. During operation, the badge heat transfer mold is placed in the transfer chamber 100, and the workpiece, such as a badge, is loaded onto the badge heat transfer mold 9. The transfer mold is then placed over the upper side of the transfer chamber 100. Commonly used transfer films for heat transfer include film. The cover 2 is then closed, pressing the transfer film downwards onto the transfer chamber 100. The vacuum system is activated to evacuate the transfer chamber 100, causing the transfer film to wrap around the workpiece. The elements of the transfer film are transferred to the workpiece by the heat provided by the heating element. The vacuum system includes a pump and pipes communicating with the pump and the transfer chamber 100. The heating element can be a heating tube or other heating elements suitable in the prior art.

[0036] See Figure 1 , Figure 4 , Figure 5 , Figure 6 , Figure 10 The badge heat transfer mold of this application includes a mold base 9', a support portion 90, a loading groove 900, and an air guide groove 10. The mold base 9' is used for mounting and supporting on a mounting base 81, and has a proximal end 91 and a distal end 92 disposed opposite to each other. The lower side of the distal end 92 is constructed with one or more positioning protrusions 9.81. The mounting base 81 is constructed with positioning holes 9.80 corresponding to the one or more positioning protrusions 9.81. The mold base 9' is supported on the mounting base 8' in response to the one or more positioning protrusions 9.81 being installed in the corresponding positioning holes 9.80. This application does not limit the shape of the mounting base 8', which can be a planar structure or a non-planar structure, as long as it can realize the function of supporting the mold base 9', it is within the protection scope of this application. Figure 6 As shown, in one specific implementation, when the positioning protrusion 9.81 is installed in the positioning hole 9.80 corresponding to the mounting base 8', the distal end 92 of the mold table 9' is supported on the mounting base 8'.

[0037] See Figure 1 , Figure 3 and Figure 10The support portion 90 is constructed at the proximal end 91 of the mold table 9' for supporting the printing portion b1 of the badge. The loading groove 900 is constructed on the support portion 90 for receiving the fixing component b2 of the badge. The air guide groove 10 is constructed on the lower side of the distal end 92 and communicates with the loading groove 900. In response to the engagement of the positioning protrusion 9.81 with the positioning hole 9.80, the loading groove 900 communicates with at least the positioning hole 9.80 through the air guide groove 10.

[0038] See Figure 2 and Figure 6 In one specific embodiment, the mounting base 8' is formed by the upper side of a substrate 8. The substrate 8 is constructed with the positioning hole 9.80, which connects to the lower side of the substrate 8. By installing the positioning protrusion 9.81 of the mold stage 9' into the corresponding positioning hole 9.80, the distal end 92 of the mold stage 9' is supported on the mounting base 8', thereby fixing the badge heat transfer mold onto the substrate 8. Then, the substrate 8 with the badge heat transfer mold is installed on the bottom wall of the transfer cavity 100. During operation, the loading groove 900, the air guide groove 10, and the positioning hole 9.80 form a vacuum path. The vacuum system evacuates the transfer mold through the vacuum path, causing the transfer film to adhere to the badge surface installed on the badge heat transfer mold. Then, the heat provided by the heating element is used to achieve the transfer of elements.

[0039] See Figures 4-6 In one embodiment, two sets of positioning protrusions 9.81 and positioning holes 9.80 are provided, with the positioning protrusions 9.81 positioned opposite each other on both sides of the loading groove 900, such as... Figures 4 to 8 The diagram shows a positioning protrusion 9.81(a) and a positioning hole 9.80(a), as well as a positioning protrusion 9.81(b) and a positioning hole 9.80(b). Since there are two sets of positioning protrusions 9.81 and positioning holes 9.80, the orientation of the mold 9 relative to the substrate 8 can be controlled by controlling the unique assembly relationship of each set of positioning protrusions 9.81 and positioning holes 9.80. One positioning scheme of this application is as follows: the positioning protrusions 9.81(b) and positioning holes 9.80(b) are respectively constructed to be slightly larger than the positioning protrusions 9.81(a) and positioning holes 9.80(a). In this way, the positioning hole 9.81(b) can only be assembled to the positioning hole 9.80(b), and the positioning hole 9.81(a) can only be assembled to the positioning hole 9.80(a), thus realizing the positioning of the mold 9 relative to the substrate 8. In other embodiments, the positioning protrusion 9.81(b) and the positioning hole 9.80(b) may also be constructed to be smaller than both the positioning protrusion 9.81(a) and the positioning hole 9.80(a). Of course, in other embodiments, the positioning protrusion 9.81 and the positioning hole 9.80 can be configured with different shapes to position the mold 9.

[0040] See Figure 11 and Figure 12 In some embodiments, the loading slot 900 is recessed downwards, meaning it does not penetrate the mold base 9'. A first airflow channel 901 is formed on the lower side of the distal end 92 of the mold base 9', and the loading slot 900 connects to the lower surface of the mold base 9' through the first airflow channel 901. In this embodiment, the first airflow channel 901 extends upwards from the lower surface of the mold base 9' to connect to the loading slot 900. This type of loading slot 900, which does not penetrate the mold base 9', can provide support for the badge's fixing components.

[0041] See Figure 6 In other embodiments, the loading groove 900 penetrates the upper and lower surfaces of the mold table 9' and communicates with the air guide groove 10. This configuration of the loading groove 900 can form a direct airflow path, thereby increasing the volume of gas flow in the loading groove 900 per unit time, improving vacuuming efficiency and the adhesion effect of the transfer film.

[0042] See Figure 12 and Figure 13 In some embodiments, the loading groove 900 is recessed to the lower side, and the side of the mold platform 9' is provided with a second airflow channel 904. The loading groove 900 is connected to the side surface of the mold platform 9' through the second airflow channel 904. One end of the second airflow channel 904 is connected to the loading groove 900, and the other end extends to the side of the side surface of the mold platform 9' near its lower surface, and penetrates the lower surface of the mold platform 9' to form an air extraction port 901'. The loading groove 900 configured in this way does not penetrate the mold platform 9', and can provide support for the fixing components of the badge. In addition, the second airflow channel 904 is provided so that the transfer mold can be better attached to the corner joint position between the side and bottom of the badge.

[0043] See Figure 5 , Figure 7 , Figure 10 In some embodiments, the air guide groove 10 is connected to the side of the mold stage 9'. This arrangement allows air to be drawn from the side of the transfer mold, enabling the bottom of the badge to fit more closely to the transfer film.

[0044] See Figure 5 , Figure 7 , Figure 10 In some embodiments, the air guide groove 10 is provided with two or more, and at least one end of the air guide groove 10 is connected to the loading groove 900, and the other end extends to the side of the mold table 9'. At least a portion of the air guide groove 10 connects the loading groove 900, the side of the mold table 9', and the side of the connecting positioning protrusion 9.81.

[0045] like Figure 5 , Figure 7 and Figure 10In the illustrated embodiment, at least a portion of the positioning protrusion 9.80 has an annular channel 101 formed on its outer periphery. The air guide groove 10 includes one or more first air guide grooves 10(a) connecting the loading groove 900 and the side of the mold 9', and a second air guide groove 10(b) connecting the loading groove 900, the side of the mold 9', and the annular channel 101. During vacuuming, some air is drawn from the loading groove 900 to the side of the mold 9' through the first air guide groove 10(a). Since the positioning protrusion 9.81 is used to load into the corresponding positioning hole 9.80, and the positioning hole 9.80 is connected to the lower side of the substrate 8, some air is drawn from the loading groove 900 to the positioning hole 9.80 to the lower side of the substrate 8 and the side of the mold 9 through the second air guide groove 10(b).

[0046] The air guide groove 10 may simultaneously include one or more first air guide grooves 10(a) and one or more second air guide grooves 10(b), such as Figure 5 In the illustrated embodiment, the air guide groove 10 includes four first air guide grooves 10(a) and two second air guide grooves 10(b). One end of the first air guide groove 10(a) is connected to the loading groove 900, and the other end extends directly to the side of the mold table 9'. One end of the second air guide groove 10(b) is connected to the loading groove 900, and the other end is connected to the annular channel 101 before extending to the side of the mold table 9'.

[0047] See Figure 14 and Figure 15 The outer edge of the support portion 90 of the mold 9 is provided with a downwardly inclined portion 9a. The inclined portion 9a can provide clearance around the outer edge of the bottom surface of the badge 89, so that the film material can enter the inclined portion 9a under negative pressure to cover the outer edge surface of the bottom surface of the badge. Figure 14 A schematic diagram shows mold 9 loading a badge 89 with a smaller diameter. Figure 15 A schematic diagram is shown of mold 9 loading a badge 89 with a larger diameter. For larger badges, the inclined part 9a is used to press against the inside of the bottom surface of the badge to prevent the badge from shifting; while for smaller badges, the inclined part 9a will avoid the edge of the lower surface of the badge.

[0048] See Figures 2-9Another aspect of this application provides a heat transfer mold assembly, including the badge heat transfer mold 9 of this application and a substrate 8. The substrate 8 is constructed with one or more positioning holes 9.80, and the mounting base 81 is formed around the positioning holes 9.80. Specifically, the mounting base 81 is defined by the upper side of the substrate 8, and the positioning holes 9.80 communicate with the lower side of the substrate 8. The distal ends 92 of one or more badge heat transfer molds 9 are detachably supported on the mounting base 81 through the engagement of positioning protrusions 9.81 with the positioning holes 9.80, so that the air guide groove 10 communicates with the lower side of the substrate 8 and the loading groove 900 through the gap between the positioning protrusions 9.81 and the corresponding positioning holes 9.80. The gap refers to the gap between the inner wall of the positioning hole 9.80 and the outer wall of the positioning protrusion 9.81. By setting the gap, it is ensured that the air guide groove 10 communicates with the lower side of the substrate 8 through the positioning holes 9.80. The method of forming an air passage by setting the gap is simple in structure and easy to implement.

[0049] When using the badge heat transfer mold assembly of this application, such as Figure 8 and Figure 9 As shown, the substrate 8 is loaded onto the bottom wall of the transfer cavity 100 with the badge heat transfer mold 9 facing upwards, and then as... Figure 3 As shown, the badge is loaded into the loading slot 900 (or the badge can be loaded first, and then the heat transfer mold assembly is loaded into the transfer cavity 100). At this time, the badge fixing component b2 is located in the loading slot 900, and the lower side of the badge abuts against the support part 90. The heat transfer material (such as transfer film) is covered with the transfer mold assembly and the relevant elements on the transfer film are ensured to correspond to each badge. The cover 2 is closed and the equipment is started to perform vacuuming. Under vacuum and heating conditions, the heat transfer elements of the heat transfer material are transferred to the surface of the badge.

[0050] In order to prevent the substrate 8 from shifting and to improve the space utilization of the transfer cavity 100, and to ensure the positioning stability of the badge heat transfer mold assembly in the transfer cavity 100, the shape of the transfer cavity 100 is adapted to the substrate 8. Preferably, the shape of the transfer cavity 100 and the substrate 8 is configured as rectangular.

[0051] See Figures 7-9 The substrate 8 has a removal recess 8' on its side. The removal recess 8' on the side of the substrate 8 facilitates the operator to quickly remove the mold, improving operational convenience and assembly speed.

[0052] Figure 8 A schematic diagram showing the separation of the heat transfer mold assembly from the transfer cavity 100 is shown. Figure 9 This is a schematic diagram of the heat transfer mold assembly after it has been loaded into the transfer cavity 100. Because it is equipped with a take-out recess 8', the user can easily take the heat transfer mold assembly out of the transfer cavity 100. For example, the user can use a pry pin to pry up the heat transfer mold assembly from the take-out recess 8' and then easily take it out of the transfer cavity 100.

[0053] Of course, in other embodiments, high-temperature resistant adhesive tape can also be adhered to the substrate 8, with a free portion retained on the tape, through which the heat transfer mold assembly can be extracted. It is preferable that the free portion of the high-temperature resistant adhesive tape is adjacent to the side of the substrate 8, especially the shorter side, for easier removal.

[0054] In some embodiments, the substrate 8 is provided with a plurality of positioning holes 9.80. By providing a plurality of positioning holes 9.80, a plurality of molds 9' can be assembled, thereby performing heat transfer on a plurality of badges in a single heat transfer process, thereby improving the efficiency of badge surface pattern production.

[0055] See Figure 6 In some improvements, the positioning hole 9.80 is a countersunk hole, with its bottom connected to the lower side of the substrate 8 via an air hole 801. This air hole 801 at the bottom of the positioning hole 9.80 serves as an air passage connecting the lower side of the substrate 8, providing a dual-purpose design with good concealment and improved aesthetics of the badge heat transfer mold assembly. Setting the positioning hole 9.80 as a countersunk hole allows it to support the positioning protrusion 9.81, thus supporting the mold 9. In one embodiment, when the positioning protrusion 9.81 is installed in 9.80, its bottom abuts against the bottom wall of the positioning hole 9.80, and an air extraction gap is formed between the lower distal end of the mold platform 9' and the mounting base 81. Alternatively, in another embodiment, when the positioning protrusion 9.81 is installed in 9.80, its bottom abuts against the bottom wall of the positioning hole 9.80, and the lower distal end of the mold platform 9' is supported on the mounting base 81.

[0056] In some embodiments, the substrate 8 and the mold 9' are made of thermally conductive materials.

[0057] The difference between the thermally conductive and non-thermally conductive materials referred to in the substrate 8 and mold stage 9' of this application lies in the strength of their thermal conductivity, which can be quantified by the thermal conductivity coefficient (λ).

[0058] Thermally conductive materials: such as the following metal or non-metal materials with thermal conductivity ≥1W / (m·K), such as metals (e.g., copper λ≈401, aluminum λ≈237), high thermal conductivity non-metals (e.g., graphene λ≈1000–5000, aluminum nitride ceramics λ≈170–280, silicon carbide λ≈120–200), etc.

[0059] Non-thermal conductive materials: such as non-metallic materials with thermal conductivity <0.12W / (m·K), such as rock wool board (λ<0.04), polyurethane foam (λ≈0.02–0.03), vacuum insulation board (λ≈0.004), etc.

[0060] That is, thermally conductive materials (λ≥1) accelerate heat transfer to dissipate heat, while non-thermally conductive materials (λ<0.12) impede heat transfer to provide insulation.

[0061] The thermally conductive material of this application can be aluminum or its alloys, copper or its alloys, or other materials with good thermal conductivity, such as stainless steel or its alloys, cast iron, or other known materials with good thermal conductivity, such as metals or non-metals.

[0062] The contents of the various embodiments of this application can be combined and referenced with each other, and all fall within the protection scope of this application.

[0063] The badge heat transfer mold of this application constructs an assembly groove 900 at the near end of the mold base 9' and a positioning protrusion 9.81 and an air guide groove 10 on the lower side of the far end 92. This achieves the formation of an integrated air passage between the mounting base 81 and the mold base 9' while the positioning protrusion 9.81 and the positioning hole 9.80 are engaged. This air passage is used to supply gas flow so that the transfer film can be adsorbed onto the surface of the badge during evacuation. The arrangement of this application can not only install and position the mold base 9', but also make the positioning hole 9.81 serve as an air passage connecting the lower side of the substrate 8. It has two uses in one hole, good concealment, and makes the badge heat transfer mold assembly more aesthetically pleasing. Compared to existing methods of processing badge surface patterns, the mold and mold assembly provided in this application are used in a vacuum heat transfer machine. By creating a vacuum, the transfer film is adhered to the front of the badge, and heating is used to transfer the elements of the heat transfer film onto the badge surface. This enhances the connection between the badge surface elements and the badge surface, changing the existing processing method for badge surface patterns. It avoids edge defects, extends the badge's lifespan, and makes the connection between the badge surface pattern and the badge more tight, aesthetically pleasing, and reliable. Furthermore, the mold and mold assembly of this application can process multiple badges in a single vacuum heat transfer, improving the efficiency of badge surface pattern production.

[0064] Based on the disclosure and teachings of the foregoing specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, this application is not limited to the specific embodiments disclosed and described above, and some modifications and changes to this application should also fall within the protection scope of the claims of this application. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on this application.

Claims

1. A badge heat transfer mold, the badge comprising a printing substrate (b1) and a fixing component (b2), characterized in that, Badge heat transfer molds include: A mold base (9') is mounted on a mounting base (81). The mold base (9') has a proximal end (91) and a distal end (92) disposed opposite to each other. One or more positioning protrusions (9.81) are constructed on the underside of the distal end (92). The mounting base (81) is constructed with positioning holes (9.80) corresponding to the positioning protrusions (9.81). The one or more positioning protrusions (9.81) and the corresponding positioning holes (9.80) are detachably engaged. A support portion (90) is constructed at the proximal end (91) of the mold base (9') to support the printing portion (b1). A loading slot (900) is constructed in the support portion (90) to accommodate the fixing component; An air guide groove (10) is constructed on the lower side of the distal end (92) and communicates with the loading groove (900). In response to the engagement of the positioning protrusion (9.81) with the positioning hole (9.80), the loading groove (900) communicates with at least the positioning hole (9.80) through the air guide groove (10).

2. The badge heat transfer mold according to claim 1, characterized in that, The outer edge of the support portion (90) is provided with a downwardly inclined portion (9a) or a downwardly bent portion.

3. The badge heat transfer mold according to claim 1, characterized in that, The positioning protrusion (9.81) and the positioning hole (9.80) are configured in two sets, and the loading groove (900) is disposed between the two sets of the positioning holes (9.80); And / or, the mold platform (9') is made of a thermally conductive material.

4. The badge heat transfer mold according to claim 1, characterized in that, The loading groove (900) is recessed to the lower side, and a first airflow channel (901) is constructed on the lower side of the far end (92) of the mold platform (9'), and the loading groove (900) is connected to the air guide groove (10) through the first airflow channel (901).

5. The badge heat transfer mold according to claim 1, characterized in that, The loading groove (900) penetrates the upper and lower surfaces of the mold platform (9') and communicates with the air guide groove (10).

6. The badge heat transfer mold according to claim 1, characterized in that, The loading groove (900) is recessed to the lower side, and the side of the mold platform (9') is provided with a second airflow channel (904). The loading groove (900) is connected to the side surface of the mold platform (9') through the second airflow channel (904). One end of the second airflow channel (904) is connected to the loading groove (900), and the other end extends to the side of the side surface of the mold platform (9') near its lower surface, and penetrates the lower surface of the mold platform (9') to form an air extraction port (901').

7. The badge heat transfer mold according to any one of claims 1 to 6, characterized in that, The air guide groove (10) is connected to the side of the mold platform (9').

8. The badge heat transfer mold according to claim 7, characterized in that, The air guide groove (10) is provided with two or more, and at least one end of the air guide groove (10) is connected to the loading groove (900), and the other end extends to the side of the mold table (9').

9. The badge heat transfer mold according to claim 7, characterized in that, The air guide groove (10) is configured with two or more, and at least part of the positioning protrusion (9.80) has an annular channel (101) around its periphery. At least part of the air guide channel (10) is connected to the loading groove (900) at one end and to the annular channel (101) at the other end, and then extends to the side of the mold table (9').

10. A badge heat transfer mold assembly, characterized in that, include: One or more badge heat transfer molds according to any one of claims 1 to 9; The substrate (8) is constructed with one or more positioning holes (9.80), and the mounting base (81) is formed around the positioning holes (9.80). The positioning holes (9.80) communicate with the lower side of the substrate (8). The distal end (92) of one or more badge heat transfer molds is detachably supported on the mounting base (81) through the engagement of the positioning protrusion (9.81) with the positioning hole (9.80). The air guide groove (10) communicates with the lower side of the substrate (8) and the loading groove (900) through the gap between the positioning protrusion (9.81) and the corresponding positioning hole (9.80).

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