PCB film pasting method and film pasting equipment

Abstract

The invention relates to the technical field of circuit board film pasting, and particularly discloses a PCB film pasting method and film pasting equipment. The method comprises the following steps: assembling a pressing assisting layer and a dry film layer on PCB film pasting equipment; the pressing assisting layer and the dry film layer are conveyed through PCB film pasting equipment, a hot pressing roller on the PCB film pasting equipment is matched with the hard layer in a rotating mode, the pressing assisting layer abuts against the dry film layer, and the soft layer is attached to the polyethylene protective film; the production state of the PCB film pasting equipment is debugged, and debugging of the PCB film pasting equipment is stopped until wrinkles or bubbles do not appear between the auxiliary pressing layer passing through the hot pressing roller and the dry film layer within the preset distance; the PCB film pasting equipment is used for conveying the board to be pasted with the film, the board face of the board to be pasted with the film is attached to the dry film photosensitive layer, and the hot pressing roller is controlled to conduct hot pressing on the dry film layer to the board to be pasted with the film; and taking down the pressing assisting layer passing through the hot-pressing roller to obtain a processed finished product. According to the method, accurate lamination of the dry film layer on the to-be-laminated plate is realized by means of the pressure-assisting layer, and the product yield of film lamination operation is improved.

Description

Technical Field

[0001] This invention relates to the field of PCB film application technology, and more particularly to PCB film application methods and equipment. Background Technology

[0002] In the manufacturing process of PCB (Printed Circuit Board), the fabrication of outer layer circuitry is one of the key steps determining the accuracy and reliability of the product's electrical connections. This step typically employs a lamination process, where a dry film material with photosensitive properties is tightly adhered to the PCB surface to serve as a mask for subsequent pattern transfer. With the development of electronic information technology, PCB products are evolving towards higher integration and multifunctionality, giving rise to various new structures such as high aspect ratio boards and rigid-flex boards.

[0003] The physical structure of these complex PCBs exhibits significant non-uniformity. For example, high aspect ratio boards suffer from reduced surface flatness due to dense local metallization holes or variations in substrate thickness; rigid-flex boards, on the other hand, are made by laminating materials with different properties, easily creating noticeable height differences or depressions at the interface between the rigid and flexible components. These structural characteristics mean that the surface of the board to be laminated is no longer an ideal plane, but rather contains areas with local depressions, steps, or warping.

[0004] In existing standardized lamination processes, the conventional lamination method involves applying linear pressure to the dry film using a hot press roller to adhere it to the board surface. However, when there are significant height differences or recessed areas on the PCB board surface, the dry film often fails to effectively fill these low-lying areas under the rigid rolling action of the hot press roller. Due to the inherent rigidity and resilience of the dry film, bridging can easily occur at the edges of recessed areas, trapping air between the dry film and the board surface, forming air bubbles. Simultaneously, uneven pressure across the board surface can cause stress concentration in the transition areas, leading to wrinkling. These lamination defects not only affect the initial adhesion between the dry film and the board surface but also cause serious quality problems such as open circuits, short circuits, or precision deviations in subsequent exposure, development, and etching processes, directly resulting in product scrap and severely impacting production efficiency and delivery cycles. Summary of the Invention

[0005] The purpose of this invention is to provide a PCB film application method and film application equipment to ensure accurate adhesion of the dry film layer on the board to be filmed, thereby improving the product yield of the film application operation.

[0006] To achieve this objective, the present invention adopts the following technical solution: A PCB film application method is used to adhere a dry film layer to a board to be filmed. The dry film layer includes a stacked dry film photosensitive layer and a polyethylene protective film. The dry film photosensitive layer is used to adhere to the surface of the board to be filmed. The PCB film application method includes the following steps: S10: Assemble the pressure-boosting layer and the dry film layer on a PCB laminating device. The pressure-boosting layer includes a soft layer and a hard layer stacked together. The hardness of the hard layer is greater than that of the soft layer, and the soft layer does not chemically react with the polyethylene protective film. S20: The PCB laminating equipment delivers the pressure-boosting layer and the dry film layer respectively. The hot press roller on the PCB laminating equipment rotates and engages with the rigid layer, pressing the pressure-boosting layer against the dry film layer, so that the soft layer adheres to the polyethylene protective film. S30: Adjust the production status of the PCB laminating equipment until no wrinkles or bubbles appear between the pressure layer and the dry film layer of the hot press roller within a predetermined distance. Then, stop adjusting the PCB laminating equipment and determine that the PCB laminating equipment is qualified. S40: The PCB film-applying equipment is used to transport the board to be filmed, so that the dry film photosensitive layer is attached to the surface of the board to be filmed, and the hot press roller is controlled to hot press the dry film layer onto the board to be filmed. S50: Remove the pressure-boosting layer after passing through the hot press roller to obtain the finished product.

[0007] As an optional technical solution for PCB lamination, the fluidity of the soft layer is lower than that of the dry film layer.

[0008] As an optional technical solution for PCB film application, the thickness of the flexible layer is greater than 150 μm.

[0009] As an optional technical solution for PCB film application, the thickness of the rigid layer is 30-50 μm.

[0010] As an optional technical solution for PCB film application, the hardness of the rigid layer is 5-10 times that of the soft layer.

[0011] As an optional technical solution for PCB film application, the soft layer is made of silicone; and / or, the hard layer is made of silicone.

[0012] A PCB laminating device, applied to the above-mentioned PCB laminating method, the PCB laminating device includes a laminating module for pasting a dry film layer on one side of the board to be laminated, the laminating module including a first feeding roller, a second feeding roller and a hot press roller, the dry film layer roll being mounted on the first feeding roller for unwinding the dry film layer; the pressure-enhancing layer roll being mounted on the second feeding roller for unwinding the pressure-enhancing layer.

[0013] As an optional technical solution for PCB film application equipment, the film application module is provided in two parts. The two film application modules are respectively used to apply the dry film layer to both sides of the same board to be applied. The two hot press rollers are symmetrically arranged about the conveying direction of the board to be applied.

[0014] As an optional technical solution for PCB film application equipment, the conveying direction of the board to be filmed is perpendicular to the axial direction of the rotating shaft of the hot press roller.

[0015] As an optional technical solution for PCB film application equipment, the conveying direction of the board to be filmed is perpendicular to the vertical direction, and the axis of rotation of the hot press roller is perpendicular to the vertical direction.

[0016] The beneficial effects of this invention are: This PCB lamination method solves the problems of wrinkling and air bubbles caused by uneven board thickness or local depressions by introducing a pressure-boosting layer. As a buffer medium, the pressure-boosting layer, under the pressure of the hot press rollers, allows its soft layer to flow adaptively, tightly filling the recessed areas of the board to be laminated. This transforms the dry film layer from traditional "hard rolling" to "flexible extrusion filling," effectively expelling air from the depressions and ensuring seamless adhesion between the dry film photosensitive layer and the board surface. This improves the lamination yield of complex PCBs and guarantees higher lamination quality. By explicitly preventing the soft layer from chemically reacting with the polyethylene protective film, the pressure-boosting layer can easily and completely detach from the dry film surface after hot pressing, without damaging or adhering to the polyethylene protective film. This avoids secondary defects caused by peeling off the pressure-boosting layer, ensuring the integrity of the dry film layer and achieving damage-free lamination. Before formal production, the combination of the pressure-boosting layer and the dry film layer is pneumatically tested to ensure there are no air bubbles or wrinkles between the layers. This is equivalent to adding a quality pre-inspection before the board bonding process, eliminating the quality risks caused by improper debugging of PCB film bonding equipment or poor bonding between material layers, and ensuring the process stability and consistency of mass production.

[0017] This PCB lamination equipment, by setting independent first and second feeding rollers, can simultaneously and in the same direction transport the dry film layer and the pressure-adding layer, and complete the lamination and hot pressing with the board surface at the hot press roller. This structural design is a clever modification of existing lamination equipment, providing the hardware foundation for "pressure-adding assisted lamination" and realizing a leap from single-material lamination to dual-material collaborative lamination. Furthermore, the PCB lamination equipment integrates the unwinding, lamination, and hot pressing functions of the dry film and pressure-adding layer into one unit, achieving continuous production without the need for additional processes or lamination equipment to apply the pressure-adding layer, ensuring production efficiency and contributing to improved automation of the lamination operation. Attached Figure Description

[0018] Figure 1 This is a flowchart of the PCB film application method provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the pressure-boosting layer, dry film layer, and film plate to be applied provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the PCB film application equipment provided in an embodiment of the present invention.

[0019] In the picture: 100. Plates to be coated; 200. Dry film layer; 210. Dry film photosensitive layer; 220. Polyethylene protective film; 300, pressure-supporting layer; 310, soft layer; 320, hard layer; 400. Hot press roller; 500. The first feeding roller; 600. Second feed roller. Detailed Implementation

[0020] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Furthermore, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0024] like Figures 1 to 3 As shown, the present invention provides a PCB film application method for attaching a dry film layer 200 to a board 100 to be filmed. The dry film layer 200 includes a dry film photosensitive layer 210 and a polyethylene protective film 220 stacked together. The dry film photosensitive layer 210 is used to adhere to the board surface of the board 100 to be filmed. The PCB film application method includes the following steps: Step 1: Assemble the pressure-boosting layer 300 and the dry film layer 200 on the PCB film application equipment. The pressure-boosting layer 300 includes a soft layer 310 and a hard layer 320 stacked together. The hardness of the hard layer 320 is greater than that of the soft layer 310, and the soft layer 310 does not chemically react with the polyethylene protective film 220. Step 2: Using PCB laminating equipment, the pressure-boosting layer 300 and the dry film layer 200 are conveyed respectively. The hot press roller 400 on the PCB laminating equipment rotates and engages with the rigid layer 320, and presses the pressure-boosting layer 300 against the dry film layer 200, so that the soft layer 310 is bonded to the polyethylene protective film 220. Step 3: Adjust the production status of the PCB laminating equipment until no wrinkles or bubbles appear between the pressure layer 300 and the dry film layer 200 of the hot press roller 400 within the predetermined distance. Then stop adjusting the PCB laminating equipment and determine that the PCB laminating equipment has been successfully adjusted. Step 4: Use PCB film application equipment to transport the board to be filmed 100, so that the dry film photosensitive layer 210 is attached to the surface of the board to be filmed 100, and control the hot press roller 400 to hot press the dry film layer 200 onto the board to be filmed 100. Step 5: Remove the pressure-boosting layer 300 after passing through the hot press roller 400 to obtain the finished product.

[0025] This PCB lamination method, by introducing a pressure-boosting layer 300, solves the problems of wrinkling and air bubbles caused by uneven board thickness or local depressions. As a buffer medium, the pressure-boosting layer 300, under the pressure of the hot press roller 400, allows its soft layer 310 to adapt and flow, tightly filling the recessed areas of the board 100 to be laminated. This transforms the dry film layer 200 from traditional "hard rolling" to "flexible extrusion filling," effectively expelling air from the depressions and ensuring seamless adhesion between the dry film photosensitive layer 210 and the board surface. This improves the lamination yield of complex PCBs and enhances the quality of the lamination. By explicitly preventing the soft layer 310 from chemically reacting with the polyethylene protective film 220, the pressure-boosting layer 300 can easily and completely detach from the surface of the dry film layer 200 after hot pressing, without damaging or adhering to the polyethylene protective film 220. This avoids secondary defects caused by peeling off the pressure-boosting layer 300, ensuring the integrity of the dry film layer 200 and achieving damage-free auxiliary lamination. By performing air pressure testing on the combination of the pressure-boosting layer 300 and the dry film layer 200 before formal production, it is ensured that there are no air bubbles or wrinkles between the two layers. This is equivalent to adding a quality pre-inspection before the board bonding process, eliminating quality risks caused by improper PCB film bonding equipment debugging or poor bonding between material layers, and ensuring the process stability and consistency of mass production.

[0026] In this embodiment, the debugging process of the PCB film lamination equipment in production status is a conventional technical method in the art, which is well mastered by those skilled in the art, and is not the focus of this embodiment, so it will not be described in detail here. At the same time, the predetermined distance is determined by those skilled in the art based on the actual engineering situation, and the method of determination is common knowledge in the art, and is not the focus of this embodiment, so it will not be described in detail here.

[0027] In this embodiment, the fluidity of the soft layer 310 is lower than that of the dry film layer 200.

[0028] By limiting the fluidity, the lamination mechanism can be further optimized. During the hot pressing process, the dry film layer 200 needs to flow to fill the tiny gaps in the circuitry on the board surface, while the pressure-boosting layer 300 applies and transmits pressure. If the pressure-boosting layer 300 has too high fluidity, it will deform before the dry film layer 200, thus dispersing and absorbing the pressure, preventing the dry film layer 200 from obtaining sufficient extrusion force to enter the recessed area. By controlling the fluidity of the soft layer 310 to be lower than that of the dry film layer 200, it is ensured that the pressure from the hot press roller 400 can be effectively transmitted through the pressure-boosting layer 300 and concentrated on the dry film layer 200, forcing the relatively fluid dry film photosensitive layer 210 to fill the recess, thereby optimizing the recess filling effect.

[0029] For example, the thickness of the soft layer 310 is greater than 150 μm.

[0030] By limiting the minimum thickness of the soft layer 310, sufficient deformation allowance is provided for it. When encountering a deep depression, the soft layer 310, with a thickness greater than 150 μm, can fully embed itself into the depression, playing a filling role and transforming the local depression into a uniform pressure surface. If the soft layer 310 is too thin, it will be quickly compacted under pressure and will not be able to reach the bottom of the depression, resulting in a gap in the depression area and ineffective film adhesion.

[0031] In this embodiment, the thickness of the hard layer 320 is 30-50 μm.

[0032] By limiting the thickness range of the rigid layer 320, an optimal balance is found between pressure transmission and structural strength. The rigid layer 320 acts as a load-bearing layer, uniformly transmitting the linear pressure of the hot press roller 400 to the soft layer 310. If the rigid layer 320 is too thin, its rigidity is insufficient, and it is prone to non-uniform deformation under high temperature and pressure, resulting in uneven pressure distribution. If the rigid layer 320 is too thick, it will absorb and disperse some pressure due to its large cross-sectional inertia, reducing the effective pressure transmitted to the soft layer 310 and thus weakening the squeezing effect on the recessed area. The above-defined thickness range ensures that the rigid layer 320 can maintain morphological stability while efficiently transmitting pressure.

[0033] For example, the hardness of the hard layer 320 is 5 to 10 times that of the soft layer 310.

[0034] By defining the hardness ratio of the hard layer 320 and the soft layer 310, the optimal combination of mechanical properties of the pressure-boosting layer 300 is determined. The hard layer 320, acting as a support layer, possesses high hardness, making it less prone to deformation under pressure, and thus able to concentrate and conduct the pressure from the hot press roller 400 downwards. The soft layer 310, acting as a filler layer, has relatively low hardness, giving it good flexibility and allowing it to conform to uneven surfaces. This hardness difference constructs a hard-top-soft pressure amplification and homogenization mechanism, ensuring both sufficient downward pressure and uniform pressure distribution.

[0035] In one embodiment of this example, the soft layer 310 is made of silicone; the hard layer 320 is made of silicone.

[0036] The flexible layer 310 and the rigid layer 320 are both made of silicone, utilizing the inherent high-temperature resistance and anti-aging properties of silicone. PCB lamination is typically performed under heating conditions; ordinary materials are prone to softening, deformation, or aging at high temperatures, leading to performance degradation of the pressure-boosting layer 300. Using silicone ensures that the pressure-boosting layer 300 maintains stable physical and chemical properties during repeated hot pressing, extending its service life and guaranteeing long-term process reliability. Furthermore, silicone itself has low surface energy, which at the material level ensures that the flexible layer 310 will not chemically react or physically adhere to the polyethylene protective film 220, ensuring that the pressure-boosting layer 300 can be removed without damaging the dry film layer 200, thus achieving removability of the auxiliary materials.

[0037] In another embodiment of this invention, only the material of the soft layer 310 is specified. In yet another embodiment of this invention, only the material of the hard layer 320 is specified.

[0038] The present invention also provides a PCB laminating device applied to the above-mentioned PCB laminating method. The PCB laminating device includes a laminating module for laminating a dry film layer 200 on one side of a board 100 to be laminating. The laminating module includes a first feeding roller 500, a second feeding roller 600, and a hot press roller 400. A roll of dry film layer 200 is mounted on the first feeding roller 500 for unwinding the dry film layer 200. A roll of pressure-boosting layer 300 is mounted on the second feeding roller 600 for unwinding the pressure-boosting layer 300.

[0039] This PCB lamination equipment, by setting up independent first feed rollers 500 and second feed rollers 600, can simultaneously and in the same direction transport the dry film layer 200 and the pressure-adding layer 300, and complete the lamination and hot pressing of the two onto the board surface at the hot pressing roller 400. This structural design is a clever modification of existing lamination equipment, providing the hardware foundation for completing the "pressure-adding layer 300-assisted lamination," realizing a leap from single-material lamination to dual-material collaborative lamination. Furthermore, the PCB lamination equipment integrates the unwinding, lamination, and hot pressing functions of the dry film and pressure-adding layer 300 into one unit, achieving continuous production without the need for additional processes or lamination equipment to apply the pressure-adding layer 300, ensuring production efficiency and contributing to improving the automation level of the lamination operation.

[0040] In this embodiment, there are two film-applying modules. The two film-applying modules are used to apply dry film layers 200 to both sides of the same film-to-be-applied plate 100. The two hot press rollers 400 are symmetrically arranged about the conveying direction of the film-to-be-applied plate 100.

[0041] By symmetrically arranging two film-applying modules, the PCB film-applying equipment can simultaneously apply the pressure-enhancing layer 300 to both sides of the same board 100 to be film-applied. This not only doubles the production efficiency but also ensures balanced stress on both sides of the board 100. Especially for thinner or softer boards 100, it avoids warping and deformation of the board 100 caused by uneven stress during single-sided film application, achieving high-quality film application on both sides simultaneously.

[0042] For example, the conveying direction of the film plate 100 to be applied is perpendicular to the axis of rotation of the hot press roller 400.

[0043] By ensuring that the axis of the hot press roller 400 is perpendicular to the traveling direction of the film board 100, it is ensured that the hot press roller 400 can evenly roll over the surface of the film board 100 across the entire width of the roller surface, thus guaranteeing the uniformity of pressure and the continuity of film application. This achieves a standard and efficient layout for horizontal PCB film application and improves the traveling stability of the PCB film application equipment.

[0044] In this embodiment, the conveying direction of the film plate 100 to be applied is perpendicular to the vertical direction, and the axis of rotation of the hot press roller 400 is perpendicular to the vertical direction.

[0045] By limiting the horizontal conveying of the substrate 100 and the horizontal placement of the hot press roller 400, a film-applying method under gravity is achieved. In this layout, the substrate 100 is placed horizontally, the dry film layer 200 and the pressure-adding layer 300 are applied horizontally from top or bottom, and the hot press roller 400 applies vertical pressure from above or below the substrate 100. This design makes the material bonding process natural and smooth, facilitates the operation and maintenance of the PCB film-applying equipment, and ensures a mature and reliable mechanical structure, allowing for upgrades and modifications without significant alterations to existing film-applying equipment.

[0046] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A PCB film application method for applying a dry film layer (200) to a board (100) to be filmed, the dry film layer (200) comprising a dry film photosensitive layer (210) and a polyethylene protective film (220) stacked together, the dry film photosensitive layer (210) being used to adhere to the surface of the board (100) to be filmed, characterized in that, The PCB film application method includes the following steps: S10: Assemble the pressure-boosting layer (300) and the dry film layer (200) on a PCB laminating device. The pressure-boosting layer (300) includes a soft layer (310) and a hard layer (320) stacked together. The hardness of the hard layer (320) is greater than that of the soft layer (310), and the soft layer (310) does not chemically react with the polyethylene protective film (220). S20: The PCB laminating equipment is used to deliver the pressure-boosting layer (300) and the dry film layer (200) respectively. The hot press roller (400) on the PCB laminating equipment rotates and engages with the rigid layer (320), and presses the pressure-boosting layer (300) against the dry film layer (200), so that the soft layer (310) adheres to the polyethylene protective film (220). S30: Adjust the production status of the PCB film application equipment until no wrinkles or bubbles appear between the pressure layer (300) and the dry film layer (200) of the hot press roller (400) within a predetermined distance. Then stop adjusting the PCB film application equipment and determine that the PCB film application equipment is qualified. S40: The PCB film application equipment is used to transport the board to be applied (100), so that the dry film photosensitive layer (210) is attached to the surface of the board to be applied (100), and the hot press roller (400) is controlled to hot press the dry film layer (200) onto the board to be applied (100). S50: Remove the pressure-boosting layer (300) after passing through the hot press roller (400) to obtain the finished product.

2. The PCB film application method according to claim 1, characterized in that, The fluidity of the soft layer (310) is lower than that of the dry film layer (200).

3. The PCB film application method according to claim 1, characterized in that, The thickness of the soft layer (310) is greater than 150 μm.

4. The PCB film application method according to claim 1, characterized in that, The thickness of the hard layer (320) is 30-50 μm.

5. The PCB film application method according to claim 1, characterized in that, The hardness of the hard layer (320) is 5-10 times that of the soft layer (310).

6. The PCB film application method according to any one of claims 1-5, characterized in that, The soft layer (310) is made of silicone; and / or the hard layer (320) is made of silicone.

7. A PCB film lamination equipment, characterized in that, The PCB film application method according to any one of claims 1-6, the PCB film application equipment includes a film application module for applying a dry film layer (200) to one side of a board (100) to be filmed, the film application module including a first feeding roller (500), a second feeding roller (600) and a hot press roller (400), the roll of the dry film layer (200) is mounted on the first feeding roller (500) for unwinding the dry film layer (200); the roll of the pressure-boosting layer (300) is mounted on the second feeding roller (600) for unwinding the pressure-boosting layer (300).

8. The PCB lamination equipment according to claim 7, characterized in that, The film application module is provided in two parts, and the two film application modules are respectively used to apply the dry film layer (200) to both sides of the same film plate (100) to be applied. The two hot press rollers (400) are symmetrically arranged with respect to the conveying direction of the film plate (100).

9. The PCB lamination equipment according to claim 7, characterized in that, The conveying direction of the film plate (100) to be applied is perpendicular to the axial direction of the rotating shaft of the hot press roller (400).

10. The PCB film bonding equipment according to claim 7, characterized in that, The conveying direction of the film plate (100) to be applied is perpendicular to the vertical direction, and the axis of rotation of the hot press roller (400) is perpendicular to the vertical direction.

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