Module structure for listening sound
With its three-section layout (left and right speakers) and multiple shielding design, the system solves the problems of circuit interference and heat dissipation in high electromagnetic interference environments for network audio devices. It achieves high electromagnetic compatibility and low-distortion analog audio output, and its compact structure makes it easy to install.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- THE 715TH RES INST OF CHINA SHIPBUILDING IND CORP
- Filing Date
- 2026-02-02
- Publication Date
- 2026-05-08
AI Technical Summary
Existing network audio receiving devices, in environments with high electromagnetic interference, have open internal circuit board layouts, which leads to mutual interference between high-sensitivity audio circuits and high-power circuits, resulting in output signal distortion. Furthermore, the heat dissipation design compromises the shielding integrity, affecting the clarity and fidelity of the sound.
It adopts a three-section integrated layout with left and right speakers. The electronic enclosure is a fully enclosed metal shell with independent internal circuit partitions. Multiple shielding is formed by metal partitions and conductive rubber strips. Combined with the sealed shell with no openings and air duct heat dissipation, electromagnetic compatibility and efficient heat dissipation are ensured.
It achieves low-distortion, high-fidelity analog audio signal output in high electromagnetic interference environments. The module has a compact structure, high shielding effectiveness, and is easy to manufacture and maintain.
Smart Images

Figure CN122002168A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of audio playback and electromagnetic compatibility technology, specifically relating to a module structure for listening. Background Technology
[0002] In traditional acoustic detection, broadcast monitoring, and professional audio processing fields, the input signals of listening devices are mostly locally generated analog audio signals. However, with the rapid development of digital and network technologies, the acquisition, transmission, and distribution of audio data are increasingly being conducted in digital form and via networks. Especially in complex systems such as shipboard sonar and command and control systems, multiple audio data streams are aggregated to the control console via the network. This necessitates a dedicated listening terminal device capable of remotely receiving these network digital audio streams and reliably converting them back into analog signals that can be directly listened to by operators.
[0003] Existing network audio receiving devices or general-purpose audio interface modules are often not specifically designed for environments with high electromagnetic interference. Their internal circuit board layouts are typically quite open, lacking effective spatial isolation and shielding. When a module needs to integrate high-sensitivity audio decoding circuits, high-power amplifier circuits, and switching power supplies, high-frequency noise generated by digital circuits, power supply ripple, and electromagnetic radiation from power amplification can easily crosstalk within the module, leading to distortion and increased noise floor in the final output analog audio signal, severely affecting the clarity and fidelity of the sound. Furthermore, these devices also face the challenge of ensuring shielding integrity through heat dissipation design; common ventilation methods can disrupt the continuity of the shielding.
[0004] Therefore, there is an urgent need for a dedicated listening module structure that is compact, has high shielding effectiveness, reasonable heat dissipation, and is suitable for harsh electromagnetic environments, in order to solve the technical problem of reliable conversion of network digital audio to high-quality analog listening signals. Summary of the Invention
[0005] The technical problem to be solved by this invention is to provide a modular structure for listening, which achieves extremely high electromagnetic shielding efficiency in an extremely limited space through innovative mechanical and electrical structural design, ensuring that the internal high-sensitivity audio circuit and high-power circuit can coexist without interfering with each other, thereby outputting low-distortion, high-fidelity analog audio signals; at the same time, while ensuring the integrity of shielding, it solves the heat dissipation problem of the module and realizes modular design to facilitate production, installation and maintenance.
[0006] The technical solution of this invention is to provide a modular structure for listening, adopting a three-section integrated layout of a left speaker, an electronic speaker, and a right speaker. Acoustic reproduction, core circuit processing, and power management are integrated into separate sections.
[0007] The electronic enclosure, as the core, is a fully enclosed metal shell that forms the basic electromagnetic shielding layer. Internally, it integrates three core circuit units essential for the listening function: a receiver circuit for receiving and converting network digital audio signals, a power amplifier circuit for amplifying audio power, and a power supply circuit for providing electrical energy.
[0008] The left and right speakers are symmetrically distributed, each containing speaker and headphone jack circuitry. The right speaker also integrates a power control circuit. External interfaces are arranged in zones: the power interface is located on the right speaker, and the network interface is located on the left speaker.
[0009] To achieve superior electromagnetic compatibility, the present invention features a revolutionary design for the electronic enclosure: the listening circuit, power amplifier circuit, and power supply circuit are not mixed together, but are implemented using their respective dedicated circuit boards. The interior of the electronic enclosure is divided into multiple independent shielded compartments by metal partitions, with each core circuit board housed and physically isolated within its own compartment, thus spatially eliminating the main paths of interference coupling.
[0010] The module is equipped with a power input interface for connecting to an external power source, a network interface for connecting to a console to receive network audio data, and a headphone jack for outputting analog audio signals. The listening circuit is configured to receive network digital audio data through the network interface and convert it into analog audio signals, which are then amplified by the power amplifier circuit to drive the speaker or output through the headphone jack.
[0011] This invention can receive network audio data and control commands from a console, and convert the network audio data into analog signals according to the data format and data sampling rate agreed upon in the interface protocol, so as to realize the listening function.
[0012] Furthermore, at the rear of each shielded compartment, a large printed circuit board is installed. This board is entirely copper-clad, serving both as a mounting backplane and electrical interconnection hub for each individual circuit board, and as a tightly connected component to the surrounding metal partitions via conductive rubber strips and other conductive connectors. This allows the front (front cover of the enclosure), rear (copper-clad board), and sides (metal partitions) of each compartment to collectively form a six-sided, fully enclosed independent shielded cavity, creating a crucial second level of shielding.
[0013] Preferably, a single metal back cover is installed behind the printed circuit board. This back cover is secured to the main body of the electronic module with screws and makes good contact with the copper-clad layer of the printed circuit board through conductive rubber strips. This forms a third level of shielding, further sealing off any electromagnetic leakage that may originate from the rear. All contact surfaces are connected using conductive rubber strips, ensuring reliable contact and stable shielding performance during long-term use.
[0014] Preferably, in terms of heat dissipation, this invention abandons the traditional method of opening holes in the shielding shell. The shell of the electronic module is designed as a continuously sealed structure. Each circuit board is fixed by a metal locking strip, and the heat generated is directly conducted to the electronic module shell through the locking strip. The shell itself is designed with internal and external air ducts, and the airflow is driven by the fan assembly at the rear of the module to flow across the shell surface, forcibly convection carrying away the heat, achieving a coexistence of efficient heat dissipation and perfect shielding.
[0015] Preferably, the power and audio signal connections between the left and right speakers are laid through a dedicated rectangular channel outside the electronic enclosure, close to its air duct side. This channel is completely isolated from the internal circuitry of the electronic enclosure, avoiding interference that may be introduced by cables passing through the shielding.
[0016] Preferably, the module's external interfaces are arranged according to functional zones: the 220V power input and output sockets are located at the bottom of the right speaker; the network data socket and fan power socket are located at the bottom of the left speaker; and the headphone jacks are located on the front panels of the left and right speakers respectively. Power consumption is no more than 120W. The module has a compact overall structure, with dimensions no greater than 642×300×154 mm (width×depth×height), with an error of ±1 mm, and a weight no greater than 20 kg, making it lightweight and easy to integrate and install.
[0017] Preferably, the module receives sonar network audio data in real time and converts it to output corresponding analog listening signals. It can simultaneously receive no fewer than 16 channels of network digital audio, allowing real-time listening to one or two of these channels. Left and right channels can be cloned, superimposed, or switched; software-controlled selection of output audio sources and volume adjustment are supported. It can drive common stereo headphones for listening.
[0018] Compared with the prior art, the present invention has the following advantages:
[0019] I. A module for listening was designed, which can receive network audio data and control commands from the console, and convert the network audio data into analog signals according to the data format and data sampling rate agreed upon by the interface protocol to realize the listening function;
[0020] Second, the module design incorporates an electronic enclosure that forms a closed, multi-layered shielded shell. Internally, it is divided into four small compartments, each housing four 3U high printed circuit boards (PCBs) and one copper-clad laminate (CCL) motherboard. This electronic enclosure provides physical spatial isolation from other components, significantly improving the module's shielding performance and reliability. Attached Figure Description
[0021] Figure 1 This is an exploded view of the present invention.
[0022] Figure 2This is a schematic diagram of the structure of the present invention.
[0023] Figure 3 A schematic diagram of the structure of the present invention from another perspective.
[0024] Figure 4 This is a schematic diagram of the internal electronic housing of the present invention.
[0025] Figure 5 This is a schematic diagram of the internal electronic housing from another perspective of the present invention.
[0026] Figure 6 This is a cross-sectional schematic diagram of the internal electronic module of the present invention.
[0027] Figure 7 This is a cross-sectional schematic diagram of the internal electronic module from another perspective of the present invention.
[0028] In the diagram: 1. Front cover of left speaker; 2. Front cover of right speaker; 3. Front cover of electronic speaker; 4. Module body; 5. Electronic speaker; 6. PCB of listening module; 7. PCB of left channel power amplifier module; 8. PCB of right channel power amplifier module; 9. PCB of power supply module; 11. Headphone recording socket board; 12. Power control board; 13. Signal isolation coupling board; 14. Printed motherboard; 15. Rear cover of left speaker; 16. Fan assembly; 17. Rear cover of right speaker. Detailed Implementation
[0029] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:
[0030] like Figure 1-7 The diagram illustrates a modular structure for audio listening. The audio module is a single, box-shaped device. Its main body 4 is composed of a left speaker, an electronic speaker enclosure 5, and a right speaker, assembled from left to right to form a unified whole. The front of the left and right speakers is covered by a left speaker front cover 1 and a right speaker front cover 2, which have speaker grilles and headphone jacks. The electronic speaker enclosure front cover 3 is black and forms the functional area on the front of the device. The back of the device is enclosed by a left speaker rear cover 15 and a right speaker rear cover 17, which houses auxiliary components and interfaces such as a fan assembly 16, fuses, a main power switch, and ground and signal ground terminals. Together with their respective front covers, these components form the complete acoustic cavities and electrical installation space for the left and right speakers. In this embodiment, the left speaker front cover 1, the right speaker front cover 2, and the central electronic speaker enclosure front cover 3 are integrally formed.
[0031] The core electronic module 5, such as Figure 1 , 7As shown, the listening circuit is implemented by a listening module printed circuit board 6. This board is responsible for receiving digital audio streams through the network interface, performing protocol parsing, data routing, and digital-to-analog conversion (DAC). The power supply circuit is implemented by two independent printed circuit boards: the left channel power amplifier module printed circuit board 7 and the right channel power amplifier module printed circuit board 8, which amplify the left and right channel analog signals respectively. The power supply circuit is implemented by a power module printed circuit board 9, which converts the input 220V AC power into various DC voltages required by the device. All four printed circuit boards are standard 3U high circuit boards.
[0032] Inside the right speaker, there is a power control board 12 and a headphone recording jack board 11. The power control board 12 is used to manage the switching, filtering, and distribution of the 220V main power supply. The headphone recording jack board 11 integrates the headphone jack on the right channel front panel and possible line output / recording interfaces. The second headphone interface circuit is specifically implemented by the headphone recording jack board 11.
[0033] Inside the left speaker, there is a signal isolation coupling board 13 and another headphone recording jack board 11. The signal isolation coupling board 13 receives the amplified audio signal from the left channel power amplifier module printed circuit board 7, and typically includes an output transformer or isolation operational amplifier circuit to achieve ground isolation, impedance matching, and anti-interference enhancement of the audio signal. The headphone recording jack board 11 integrates the headphone jack on the left channel front panel, and the first headphone interface circuit is specifically implemented by the headphone recording jack board 11 and the signal isolation coupling board 13.
[0034] This invention receives network audio data and control commands from a console, and converts the network audio data into analog signals according to the data format and sampling rate agreed upon in the interface protocol, thereby enabling the listening function.
[0035] like Figure 4 , Figure 5 As shown, the electronic insertion box 5 (with a removable rear cover) and the electronic insertion box front cover 3 together form a closed shielded housing.
[0036] like Figure 6 and Figure 7 As shown in the cross-sectional view, the interior of the electronic housing 5 is precisely divided into four independent shielded compartments by metal partitions, which are used to accommodate and physically isolate the listening module printed circuit board 6, the left channel power amplifier module printed circuit board 7, the right channel power amplifier module printed circuit board 8, and the power module printed circuit board 9, respectively.
[0037] Behind all the circuit boards, a large printed circuit board 14 is installed. This board connects to four functional circuit boards via connectors to provide power and signal transmission. The substrate surface of the printed circuit board 14 is entirely copper-clad. Strips of conductive rubber are attached to the four edges of the printed circuit board 14 to ensure good electrical connection with the metal partitions and frames of the electronic module 5 after compression. Thus, each compartment containing a circuit board, with the electronic module front cover 3 in front, the copper-clad printed circuit board 14 behind, and grounded metal partitions on all sides, together form an independent shielded cavity.
[0038] Behind the printed circuit board 14, a complete aluminum alloy rear cover is fastened with screws. This cover is pressed against the copper-clad layer of the printed circuit board 14 with conductive rubber to form the outermost shielding layer, and together with the housing of the electronic insertion box 5 and the printed circuit board 14, it constitutes a multi-layer electromagnetic shielding structure.
[0039] Each circuit board is secured within the compartment by upper and lower locking metal strips. These locking strips also serve as heat conduction paths. Heat generated during circuit board operation is transferred through the locking strips to the metal casing of the electronic module 5. In one embodiment, the casing of the electronic module 5 is a continuously sealed structure without any heat dissipation openings. Air ducts are designed inside its top cover and bottom plate. When the fan assembly 16, installed at the rear of the module, operates, it drives cooling airflow through these ducts, forcibly carrying away heat from the casing surface via convection, thereby achieving efficient sealed heat dissipation.
[0040] In one implementation, the power and audio signal cables between the left and right speakers are connected through a dedicated rectangular metal channel on the outer side of the back of the electronic enclosure 5, which is completely isolated from the internal circuit cavity of the electronic enclosure.
[0041] In one implementation, the power input socket is located at the bottom of the right speaker, while the network socket and the 220V power output socket for the fan are located at the bottom of the left speaker.
[0042] In this embodiment, the overall dimensions of the module are 642mm×300mm×154mm, the weight is <20kg, the operating voltage is 220V, and the power consumption is <120W.
[0043] Furthermore, the listening module printed circuit board 6 can simultaneously receive and process no less than 16 channels of network audio, supports the selection of 1 or 2 channels for monitoring, and has multiple output modes.
[0044] The above description only illustrates preferred embodiments of the present invention and should not be construed as limiting the scope of the claims. Any equivalent procedural modifications made using this specification are included within the patent protection scope of this invention.
Claims
1. A module structure for listening, characterized in that: Includes a left speaker, a right speaker, and an electronic speaker located between them; wherein: The electronic box constitutes a closed electromagnetic shielding shell, which contains a listening circuit for receiving and converting network digital audio signals, a power amplifier circuit for amplifying audio power, and a power supply circuit for providing electrical energy. The left speaker is equipped with a left channel speaker and a first headphone jack circuit connected to the output of the power amplifier circuit. The right speaker is equipped with a power control circuit, a right channel speaker, and a second headphone jack circuit connected to the power circuit. The module structure includes a power input interface for connecting to an external power source, a network interface for connecting to a console to receive network audio data, and a headphone jack for outputting analog audio signals. The listening circuit is configured to receive network digital audio data through the network interface and convert it into an analog audio signal, which is then amplified by the power amplifier circuit to drive the speaker or output through the headphone jack.
2. The module structure for listening according to claim 1, characterized in that: The listening circuit, power amplifier circuit, and power supply circuit are each implemented by an independent circuit board; the interior of the electronic enclosure is divided into multiple independent shielded compartments by partitions, which are used to accommodate and physically isolate the circuit boards corresponding to the listening circuit, left channel power amplifier circuit, right channel power amplifier circuit, and power supply circuit.
3. The module structure for listening according to claim 2, characterized in that: It also includes a printed circuit board, which is disposed in the electronic insertion box and located at the rear of each shielded compartment, for mounting and electrically connecting each of the circuit boards; the surface of the printed circuit board is copper-plated and electrically connected to the partition of the electronic insertion box through conductive connectors, so that each shielded compartment forms an independent shielded cavity.
4. The module structure for listening according to claim 3, characterized in that: A metal rear cover is also installed behind the printed circuit board. The metal rear cover, together with the housing of the electronic plug box and the printed circuit board, constitutes a multi-layer electromagnetic shielding structure.
5. The module structure for listening according to claim 2, characterized in that: The circuit board is fixedly connected to the shielding partition wall of the electronic insertion box by a locking strip.
6. The module structure for listening according to claim 5, characterized in that: The housing of the electronic module is a continuously sealed structure; the heat generated by each circuit board during operation is conducted to the housing of the electronic module through the locking strip, and is dissipated by airflow driven by the fan assembly on the module through the air duct outside the housing.
7. The module structure for listening according to claim 1, characterized in that: The electrical connection cable between the left and right speakers is connected via an external channel that is isolated from the internal circuit cavity of the electronic enclosure.
8. The module structure for listening according to claim 1, characterized in that: The power input interface and power control board are installed at the bottom of the right speaker; the network interface is installed at the bottom of the left speaker.
9. The module structure for listening according to claim 1, characterized in that: The overall dimensions of the module are no greater than 642mm×300mm×154mm, the weight is no greater than 20kg, the rated operating voltage is 220V, and the power consumption is no greater than 120W.
10. The module structure for listening according to claim 1, characterized in that: The listening circuit is configured to receive no less than 16 channels of network digital audio data in real time, and select one or two channels for conversion and output in real time according to control commands, and supports left and right channel cloning, superposition and switching output modes.