Terminal and battery wiring module

Abstract

The present application provides a terminal and a battery wiring module capable of improving the connection reliability of a conductive member and an electronic component. The terminal (14) includes a resin molding portion (23), a plate-shaped conductive member (21, 22) partially embedded in the resin molding portion (23), and an electronic component (24) connected to the conductive member (21, 22). An upper surface of the conductive member (21, 22) includes a first surface (43) in contact with the resin molding portion (23), a stepped surface (44) downwardly inclined from the first surface (43), and a second surface (45) connected to the first surface (43) via the stepped surface (44) and located downwardly of the first surface (43). The entire second surface (45) is located outside the resin molding portion (23). The electronic component (24) is connected to the second surface (45).

Description

Technical Field

[0001] This invention relates to terminals and battery wiring modules. Background Technology

[0002] Conventional terminals exist that house electronic components such as chip fuses and diodes. These terminals include: a resin-molded portion; a plate-shaped conductive member, partly embedded in the resin-molded portion; and electronic components connected to the conductive member. The conductive member has an embedded portion embedded in the resin-molded portion and a protrusion extending from the resin-molded portion. Electronic components are connected to the protrusion of the conductive member. Existing technical documents Patent documents

[0003] Patent Document 1: Japanese Patent Application Publication No. 2002-42979 Summary of the Invention The problem that the invention aims to solve

[0004] In terminals like those described above, if burrs are formed on the surface of the protrusion of the conductive member, poor connection between the conductive member and the electronic component may occur due to these burrs.

[0005] The purpose of this invention is to provide terminals and battery wiring modules that can improve the connection reliability of conductive components and electronic components. Solution for solving the problem

[0006] The terminal of the present invention comprises: a resin molding portion; a plate-shaped conductive member, a portion of which is embedded in the resin molding portion; and an electronic component connected to the conductive member, wherein the upper surface of the conductive member includes: a first surface that contacts the resin molding portion; a stepped surface extending downward from the first surface; and a second surface that is connected to the first surface via the stepped surface and is located below the first surface, the entire second surface being located outside the resin molding portion, and the electronic component being connected to the second surface. Invention Effects

[0007] The terminal and battery wiring module according to the present invention can improve the connection reliability of conductive components and electronic components. Attached Figure Description

[0008] Figure 1 This is a schematic structural diagram illustrating a battery wiring module according to one embodiment. Figure 2 This is a perspective view of the terminals in this embodiment. Figure 3 This is a cross-sectional view of the terminal in this embodiment. Figure 4This is a partial cross-sectional view showing the peripheral structure of the resin molding portion in the terminal of this embodiment. Figure 5 This is a cross-sectional view showing the molding method of the resin molding portion in the terminal of this embodiment. Figure 6 This is a partial cross-sectional view showing the peripheral structure of the resin molding portion in the modified terminal. Detailed Implementation

[0009] [Description of embodiments of the present invention] First, embodiments of the present invention will be described. [1] The terminal of the present invention comprises: a resin molding portion; a plate-shaped conductive member partially embedded in the resin molding portion; and an electronic component connected to the conductive member, wherein the upper surface of the conductive member includes: a first surface in contact with the resin molding portion; a stepped surface extending downward from the first surface; and a second surface connected to the first surface via the stepped surface and located below the first surface, the entire second surface being located outside the resin molding portion, and the electronic component being connected to the second surface.

[0010] According to this structure, the entire second surface of the conductive member, which connects to the electronic component, is located outside the resin molding portion. Furthermore, a stepped surface is provided on the upper surface of the conductive member between the second surface and the first surface that contacts the resin molding portion. As a result, burrs from the resin molding portion at the point of contact with the first surface are less likely to reach the second surface due to the stepped surface, thus reducing the likelihood of burrs forming on the second surface. Therefore, the connection reliability between the conductive member and the electronic component can be improved.

[0011] [2] In the above [1], the resin molding part may also have a positioning surface, the positioning surface being configured to position the electronic component, and the conductive member having: an embedded part having the first surface on its upper surface and embedded in the resin molding part; and a first protrusion having the second surface on its upper surface and protruding from the positioning surface to the outside of the resin molding part.

[0012] According to this structure, when connecting electronic components to conductive members, by positioning the electronic components with the positioning surface of the resin molding part, misalignment of the electronic components can be suppressed.

[0013] [3] In the above [2], the positioning surface may also be formed above the step surface. According to this structure, burrs extending from the positioning surface are less likely to reach the second surface due to the stepped surface, thus reducing the likelihood of burrs forming on the second surface. Therefore, the connection reliability between the conductive components and electronic parts can be improved.

[0014] [4] In [2] or [3] above, the conductive member may also have a second protrusion protruding outward from the resin molding portion, the second protrusion having a crimping portion for crimping wires and a bending portion disposed between the root of the second protrusion and the crimping portion.

[0015] According to this structure, the stress applied to the crimping portion when crimping the wire is absorbed by the bending portion, thus minimizing the crimping stress transmitted to the first protrusion connected to the electronic component.

[0016] [5] In any of the above [1] to [4], the terminal may also have two of the conductive members, which are electrically connected to each other via the electronic components.

[0017] According to this structure, in a structure in which two conductive components are electrically connected to each other via electronic components, the connection reliability between each conductive component and the electronic component can be improved by the stepped surface of each conductive component.

[0018] [6] In the above [5], the resin molding part may also have a bottom wall and a peripheral wall, the bottom wall covering the lower side of the two conductive members, the peripheral wall extending upward from the bottom wall and surrounding the electronic component, the bottom wall having a recessed portion recessed downward between the second surface of each of the two conductive members, and the electronic component being connected to the second surface by soldering.

[0019] According to this structure, solder exposed between the electronic component and the second surface of the conductive member can flow to the recess provided on the bottom wall of the resin molding part. Therefore, the formation of solder bridges between the second surfaces of the two conductive members can be suppressed.

[0020] [7] The battery wiring module of the present invention has any one of the terminals described in [1] to [6] above. According to this structure, in the conductive member of the terminal, the entire second surface, which connects to the electronic component, is located outside the resin molding portion. Furthermore, a stepped surface is provided on the upper surface of the conductive member between the second surface and the first surface that contacts the resin molding portion. As a result, burrs from the resin molding portion at the point of contact with the first surface are less likely to reach the second surface due to the stepped surface, thus preventing burrs from forming on the second surface. Therefore, the connection reliability between the conductive member and the electronic component can be improved.

[0021] [Detailed Description of Embodiments of the Invention] Specific examples of the terminal and battery wiring module of the present invention will be described below with reference to the accompanying drawings. In the drawings, for ease of description, some components are sometimes exaggerated or simplified. Furthermore, the dimensional ratios of the various parts may differ in different drawings. The term "orthogonal" in this specification includes not only strictly orthogonal cases but also cases where they are approximately orthogonal to the extent that they serve the function and effect of this embodiment. Additionally, terms such as "first," "second," etc., in this specification are used only to distinguish objects and do not order them. The present invention is not limited to these examples, but is shown through the claims and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0022] (Structure of battery wiring module 10) like Figure 1 As shown, the battery wiring module 10 of this embodiment is used for a battery, which is mounted in an electric vehicle, hybrid vehicle, etc. The battery wiring module 10 is respectively provided on both sides of the battery stack 12 in the width direction, and the battery stack 12 is constructed by arranging a plurality of individual cells 11. Each battery wiring module 10 includes: a plurality of busbars 13 connecting adjacent individual cells 11; a plurality of terminals 14 respectively connected to the plurality of busbars 13; and wires 15 respectively connected to the plurality of terminals 14. The wires 15 are, for example, voltage sensing wires for detecting the voltage of the individual cells 11. Each wire 15 is connected to a connector 16, and the connector 16 is connected to a voltage sensing device (not shown).

[0023] (Structure of terminal 14) like Figure 2 and Figure 3 As shown, the terminal 14 of this embodiment includes a first conductive member 21, a second conductive member 22, a resin molding part 23 made of resin, and an electronic component 24.

[0024] The first conductive member 21 and the second conductive member 22 are each plate-shaped. The first conductive member 21 and the second conductive member 22 are formed, for example, from metal plates by stamping. The first conductive member 21 and the second conductive member 22 are electrically connected to each other via an electronic component 24. The electronic component 24 may be, for example, a chip fuse or a diode. The resin molding portion 23 is configured to cover a portion of the first conductive member 21, a portion of the second conductive member 22, and the electronic component 24. The resin molding portion 23 is formed by molding the first conductive member 21 and the second conductive member 22 as inserts.

[0025] Furthermore, the accompanying drawings show three mutually orthogonal directions: the length direction X, the width direction Y, and the height direction Z. In the following description, the area above and below the height direction Z will sometimes be simply referred to as "above" and "below". Also, terminal 14 is not necessarily positioned with the upper part of the height direction Z facing the zenith.

[0026] (Structure of resin molding part 23) The resin molding section 23 has a bottom wall 31 covering the lower side of each conductive member 21, 22 and a peripheral wall 32 extending upward from the bottom wall 31. The electronic component 24 is disposed on the inner peripheral side of the peripheral wall 32. That is, the peripheral wall 32 is configured to surround the electronic component 24. Furthermore, when the electronic component 24 is connected to each conductive member 21, 22, casting material (not shown) is filled into the inner peripheral side of the peripheral wall 32.

[0027] like Figure 4 As shown, the inner circumferential surface of the peripheral wall 32 has a conical surface 33 and a pair of positioning surfaces 34. The conical surface 33 is inclined inward to the circumferential side so as to guide the electronic component 24 during assembly. The pair of positioning surfaces 34 are provided at the lower end of the conical surface 33. The pair of positioning surfaces 34 are respectively provided on both sides of the electronic component 24 in the length direction X, such that they clamp the electronic component 24 in the length direction X. Each positioning surface 34 is a surface orthogonal to or intersecting the length direction X. The electronic component 24 is positioned in the length direction X by the pair of positioning surfaces 34.

[0028] like Figure 2 As shown, a positioning recess 35 extending along the height direction Z is formed on the outer peripheral surface of the resin molding portion 23. The positioning recess 35 is provided on both sides of the resin molding portion 23 in the width direction Y, for example. For example, when connecting the electronic component 24 and each conductive member 21, 22, the resin molding portion 23 is positioned by fitting positioning pins (not shown) into the positioning recess 35.

[0029] (Structure of the first conductive component 21) like Figure 4 As shown, the first conductive member 21 includes an embedded portion 40 embedded in the resin molding portion 23 and a first protrusion 41 and a second protrusion 42 protruding from the resin molding portion 23, respectively.

[0030] The embedded portion 40 penetrates the interior of the peripheral wall 32 of the resin molding portion 23. The embedded portion 40 has a through hole 40a that penetrates the embedded portion 40 in the thickness direction (height direction Z). The resin constituting the resin molding portion 23 enters the through hole 40a. As a result, the first conductive member 21 can be prevented from falling off the resin molding portion 23.

[0031] The first protrusion 41 is connected to the embedded part 40 and protrudes from the positioning surface 34 toward the inner peripheral side of the peripheral wall 32. The first protrusion 41 is formed, for example, by a semi-punch-cutting process, so that it is located below the embedded part 40.

[0032] The upper surface of the first conductive member 21 includes: a first surface 43, which contacts the resin molding portion 23; a stepped surface 44 extending downward from the first surface 43; and a second surface 45, which is connected to the first surface 43 via the stepped surface 44 and is located below the first surface 43. The first surface 43 is the upper surface of the embedded portion 40. The first protrusion 41 is deformed by the aforementioned semi-punch-cutting process to form the stepped surface 44. The second surface 45 is the upper surface of the first protrusion 41. The second surface 45 is entirely located outside the resin molding portion 23, specifically, on the inner circumferential side of the peripheral wall 32. The electronic component 24 is connected to the second surface 45.

[0033] The positioning surface 34 of the resin molding part 23 is formed above the stepped surface 44. In this embodiment, the positioning surface 34 and the stepped surface 44 are formed in a vertically continuous manner and are coplanar with each other.

[0034] The second protrusion 42 of the first conductive member 21 is connected to the embedded part 40 and protrudes from the resin molding part 23 toward the outer periphery of the peripheral wall 32. The second protrusion 42 is connected to the busbar 13. The second protrusion 42 and the busbar 13 are connected to each other, for example, by laser welding.

[0035] (Structure of the second conductive component 22) The second conductive member 22 will be described below. In the following description, for structures in the second conductive member 22 that are the same as those in the first conductive member 21, the same reference numerals as those in the first conductive member 21 will be used, and detailed descriptions will be omitted.

[0036] like Figure 2 and Figure 3 As shown, the second conductive member 22 includes an embedded portion 40 embedded in the resin molding portion 23 and a first protrusion 41 and a second protrusion 51 protruding from the resin molding portion 23, respectively. Additionally, as... Figure 4 As shown, the second conductive member 22 has the same first surface 43, stepped surface 44, and second surface 45 as the first conductive member 21. The electronic component 24 is connected to the second surface 45 of the first protrusion 41 in each conductive member 21 and 22 by solder S, so that the first conductive member 21 and the second conductive member 22 are electrically connected to each other via the electronic component 24.

[0037] (The structure of the recess 36 in the resin molding part 23) The bottom wall 31 of the resin molding portion 23 has a recess 36 that is recessed downward between the second surfaces 45 of each conductive member 21, 22. The recess 36 is, for example, a recess that does not penetrate the bottom wall 31 and has a bottom surface 36a. The bottom surface 36a is located below the lower surface of the first protrusion 41 of each conductive member 21, 22. When the solder S connecting the electronic component 24 and the second surface 45 of the first protrusion 41 is exposed between the electronic component 24 and the second surface 45, the exposed solder S flows into the recess 36.

[0038] (The structure of the second protrusion 51 of the second conductive member 22) like Figure 3 As shown, the second protrusion 51 of the second conductive member 22 is connected to the embedded portion 40 and protrudes from the resin molding portion 23 toward the outer periphery of the peripheral wall 32. The second protrusion 51 has a crimping portion 52 for crimping the wire 15 and a bending portion 53 disposed between the root portion 51a of the second protrusion 51 and the crimping portion 52. The root portion 51a of the second protrusion 51 is the base end of the second protrusion 51 protruding from the resin molding portion 23, and is a portion near the resin molding portion 23 in the second protrusion 51. The bending portion 53 bends from the root portion 51a to the crimping portion 52 in the thickness direction of the plate. In this embodiment, the bending portion 53 bends, for example, obliquely downward from the root portion 51a to the crimping portion 52.

[0039] (The function of this implementation method) The function of this embodiment will be explained below. like Figure 5 As shown, the resin molding portion 23 is injection molded using a first mold 61 and a second mold 62. First, the guiding members 21 and 22 are arranged in the first mold 61. Then, the second mold 62 is joined to the first mold 61 from above, thereby forming a cavity between the first mold 61 and the second mold 62. Finally, the resin molding portion 23 is formed by filling the cavity between the first mold 61 and the second mold 62 with resin.

[0040] The second mold 62 has a pair of forming surfaces 63, which respectively form a pair of positioning surfaces 34 in the resin molding section 23. Each forming surface 63 is a surface orthogonal to or intersecting the longitudinal direction X. During the molding of the resin molding section 23, each forming surface 63 and the stepped surface 44 of each conductive member 21, 22 abut against each other in the longitudinal direction X. Thus, the positioning surface 34 and the stepped surface 44 are formed in a manner that is continuously arranged vertically along the forming surface 63. In this way, since the stepped surface 44 is a structure between the positioning surface 34 and the second surface 45, the formation of burrs that may form on the positioning surface 34 to the second surface 45 connecting the electronic component 24 can be suppressed. In addition, since the stepped surface 44 is a structure between the positioning surface 34 and the second surface 45, the gas generated during resin molding can be suppressed from reaching the second surface 45. As a result, the formation of an insulating film on the second surface 45 due to this gas can be suppressed.

[0041] After the resin molding section 23 is formed, the electronic component 24 is connected to the second surface 45 of each conductive member 21, 22 by soldering. As described above, the step surface 44 can suppress the generation of burrs and insulating film on the second surface 45, thereby suppressing the occurrence of poor connection between the electronic component 24 and the second surface 45.

[0042] (Effects of this implementation method) The effects of this embodiment will be explained below. (1) Terminal 14 includes: a resin molding portion 23; plate-shaped conductive members 21 and 22, a portion of which are embedded in the resin molding portion 23; and an electronic component 24 connected to the conductive members 21 and 22. The upper surface of the conductive members 21 and 22 includes: a first surface 43 in contact with the resin molding portion 23; a stepped surface 44 extending downward from the first surface 43; and a second surface 45 connected to the first surface 43 via the stepped surface 44 and located below the first surface 43. The entire second surface 45 is located outside the resin molding portion 23. The electronic component 24 is connected to the second surface 45. According to this structure, the entire second surface 45 of the conductive members 21 and 22 connected to the electronic component 24 is located outside the resin molding portion 23. Furthermore, a stepped surface 44 is provided between the second surface 45 and the first surface 43 in contact with the resin molding portion 23 on the upper surface of the conductive members 21 and 22. Therefore, burrs on the resin molding portion 23 in contact with the first surface 43 are less likely to reach the second surface 45 due to the stepped surface 44, thus preventing burrs from forming on the second surface 45. As a result, the connection reliability of the conductive members 21 and 22 and the electronic component 24 can be improved.

[0043] (2) The resin molding portion 23 includes a positioning surface 34 configured to position the electronic component 24. The conductive members 21 and 22 include: an embedded portion 40 having a first surface 43 on its upper surface, embedded in the resin molding portion 23; and a first protruding portion 41 having a second surface 45 on its upper surface, protruding from the positioning surface 34 outwards from the resin molding portion 23. According to this structure, when the electronic component 24 is connected to the conductive members 21 and 22, by positioning the electronic component 24 using the positioning surface 34 of the resin molding portion 23, misalignment of the electronic component 24 can be suppressed. Furthermore, the placement position of the electronic component 24 becomes clear through each positioning surface 34, improving the assembly workability of the electronic component 24.

[0044] (3) The positioning surface 34 is formed above the stepped surface 44. According to this structure, burrs extending from the positioning surface 34 are less likely to reach the second surface 45 due to the stepped surface 44, and therefore burrs are less likely to form on the second surface 45. Therefore, the connection reliability of the conductive members 21, 22 and the electronic component 24 can be improved.

[0045] (4) The second conductive member 22 has a second protrusion 51 protruding outward from the resin molding portion 23. The second protrusion 51 has a crimping portion 52 for crimping the wire 15 and a bending portion 53 provided between the root portion 51a of the second protrusion 51 and the crimping portion 52. According to this structure, when crimping the wire 15, the stress applied to the crimping portion 52 is absorbed by the bending portion 53, so the crimping stress transmitted to the first protrusion 41 connected to the electronic component 24 can be suppressed to a smaller extent.

[0046] (5) Terminal 14 has two conductive members (first conductive member 21 and second conductive member 22). The first conductive member 21 and the second conductive member 22 are electrically connected to each other via electronic component 24. According to this structure, in the structure in which the first conductive member 21 and the second conductive member 22 are electrically connected to each other via electronic component 24, the connection reliability of each conductive member 21, 22 and electronic component 24 can be improved by the stepped surface 44 of each conductive member 21, 22.

[0047] (6) The resin molding portion 23 has a bottom wall 31 and a peripheral wall 32. The bottom wall 31 covers the lower side of the first conductive member 21 and the second conductive member 22, and the peripheral wall 32 extends upward from the bottom wall 31 and surrounds the electronic component 24. The bottom wall 31 has a recess 36 that is recessed downward between the second surfaces 45 of each conductive member 21, 22. The electronic component 24 is connected to the second surfaces 45 by soldering. According to this structure, the solder S exposed between the electronic component 24 and the second surfaces 45 of the conductive members 21, 22 can flow to the recess 36 provided in the bottom wall 31 of the resin molding portion 23. Therefore, it is possible to suppress the formation of solder bridges between the second surfaces 45 of the two conductive members 21, 22, thereby preventing the conductive members 21, 22 from being electrically connected through the solder bridges.

[0048] (Other implementation methods) The above embodiments can be implemented with the following modifications. The above embodiments and the following variations can be combined with each other within a technically compatible scope.

[0049] like Figure 6 As shown, in the resin molding portion 23, the recess 36 can also be a hole that penetrates the bottom wall 31 along the height direction Z. With this structure, it is possible to check from the lower side of the resin molding portion 23 whether a weld bridge is formed between the conductive members 21 and 22 through the recess 36, which serves as a through hole. Furthermore, when the resin molding portion 23 is designed to be waterproof, it is necessary to seal the recess 36, which serves as a through hole, for example, with a casting material. In this respect, as in the above embodiment, by providing a recess 36 that does not penetrate the bottom wall 31, the waterproofness of the recess 36 can be ensured even without using a casting material.

[0050] In the resin molding part 23 of the above embodiment, the recess 36 may also be omitted. In the above embodiment, the positioning surface 34 of the resin molding portion 23 is formed above the stepped surface 44 of each of the conductive members 21 and 22, but it is not particularly limited to this. The positioning surface 34 may also be formed above the first surface 43 of each of the conductive members 21 and 22. In this case, the structure in which the stepped surface 44 and the first surface 43 are included as part of the first protrusion 41, that is, the structure in which the stepped surface 44 and the first surface 43 are located on the inner peripheral side of the peripheral wall 32 of the resin molding portion 23. According to such a structure, burrs of the resin molding portion 23 at the part in contact with the first surface 43 are less likely to reach the second surface 45 due to the stepped surface 44, and therefore burrs are less likely to form on the second surface 45.

[0051] In the resin molding part 23 of the above embodiment, the positioning surface 34 may also be omitted. In each of the conductive components 21 and 22 described above, a stepped surface 44 is formed by a semi-punch cutting process, but it is not particularly limited to this.

[0052] In each of the conductive members 21 and 22 described above, the lower surface of the portion corresponding to the stepped surface 44 may also be planar. That is, the stepped surface 44 may be formed simply by shifting the upper surface of the conductive members 21 and 22.

[0053] The thickness and other structures of each conductive component 21, 22 are not limited to the above-described embodiment and can be appropriately modified. The shape of the bend 53 in the second protrusion 51 is not limited to the above embodiment and can be appropriately changed according to the structure. In addition, the bend 53 may be omitted in the second conductive member 22 of the above embodiment.

[0054] In the second conductive member 22 of the above embodiment, the crimping part 52 may be omitted, and the second conductive member 22 may be connected to the wire 15 by welding or the like. In the terminal 14 of the above embodiment, the first conductive member 21 may also be a structure that is connected to a member other than the busbar 13.

[0055] In the terminal 14 of the above embodiment, the second conductive member 22 may also be a structure that is connected to a member other than the wire 15. The terminal 14 in the above embodiment has two conductive members 21 and 22, but it is not limited to this and may also have a structure with only one conductive member.

[0056] In the above embodiment, the terminal 14 used in the battery wiring module 10 is applicable, but it is not limited thereto and can also be applied to the terminal used in devices other than the battery wiring module 10. The embodiments disclosed herein are illustrative in all respects, and the invention is not limited to these illustrative examples. That is, the scope of the invention is defined by the claims and is intended to include all modifications within the meaning and scope equivalent to the claims. Explanation of reference numerals in the attached figures

[0057] 10 Battery wiring module 11 Single Cell 12 Battery Stacks 13. Busbar 14 terminals 15. Electrical wires 16 connectors 21. First Conducting Component (Conducting Component) 22. Second Conducting Component (Conducting Component) 23 Resin Molding Department 24 Electronic Components 31 bottom wall 32 Zhou Bi 33 Conical surface 34 Positioning Surfaces 35 Positioning recess 36 recess 36a Bottom surface 40. Installation Department 40a Through Hole 41 First protrusion 42 Second protrusion 43 Page 1 44 Stepped surface 45 Page 2 51 Second protrusion 51a Root 52 Crimping section 53. Bending section 61 Mold No. 1 62 Mold No. 2 63 Forming Surface S solder X length direction Y-axis width direction Z-axis height direction

Claims

1. A terminal comprising: Resin molding section; A plate-shaped conductive member, partly embedded in the resin molding portion; and Electronic components, connected to the conductive member, in, The upper surface of the conductive member includes: a first surface, in contact with the resin molding portion; a stepped surface extending downward from the first surface; and a second surface, connected to the first surface via the stepped surface, located below the first surface. The second surface is entirely located outside the resin molding portion. The electronic component is connected to the second surface.

2. The terminal according to claim 1, wherein, The resin molding portion has a positioning surface configured to position the electronic component. The conductive component includes: The embedded part, having the first surface on its upper surface, is embedded in the resin molding part; and The first protrusion has the second surface on its upper surface and protrudes outward from the positioning surface of the resin molding portion.

3. The terminal according to claim 2, wherein, The positioning surface is formed above the step surface.

4. The terminal according to claim 2, wherein, The conductive member also has a second protrusion that protrudes outward from the resin molding portion. The second protrusion has a crimping portion for crimping wires and a bent portion disposed between the root of the second protrusion and the crimping portion.

5. The terminal according to claim 1, wherein, The terminal has two of the aforementioned conductive members. The two conductive components are electrically connected to each other via the electronic components.

6. The terminal according to claim 5, wherein, The resin molding portion has a bottom wall and a peripheral wall. The bottom wall covers the lower side of the two conductive members, and the peripheral wall extends upward from the bottom wall and surrounds the electronic component. The bottom wall has a downwardly recessed portion located between the second surfaces of each of the two conductive members. The electronic component is connected to the second surface via soldering.

7. A battery wiring module, It has the terminal as described in any one of claims 1 to 6.

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