A treatment device for a metal surface
By designing an electroplating tank device with a sludge scraping and agitation mechanisms, the problem of scraping and recycling anode sludge was solved, improving anode performance and resource utilization efficiency, and reducing resource waste.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGXI HUINAN NEW MATERIAL TECH CO LTD
- Filing Date
- 2026-04-09
- Publication Date
- 2026-06-02
AI Technical Summary
The generation and residue of anode sludge in existing electroplating equipment leads to resource waste and is difficult to recycle effectively, affecting anode performance.
Design a processing device comprising a sludge scraping mechanism and an agitation mechanism. The sludge scraping mechanism removes anode sludge from the surface of the anode plate during the electroplating process, while the agitation mechanism keeps the anode sludge in a flowing state for easy recycling.
It effectively removes anode mud from the surface of the anode plate, ensuring anode performance, reducing resource waste, and improving electroplating quality and resource recycling efficiency.
Smart Images

Figure CN122128787A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of metal processing, and particularly relates to a treatment device for a metal surface. BACKGROUND
[0002] Metal surface treatment is to improve the surface performance of a material through physical, chemical or electrochemical methods, so as to improve the corrosion resistance, wear resistance and decoration of the surface of a metal device, wherein the electroplating equipment is one of the commonly used metal surface treatment equipment in the industry at present; The electroplating equipment on the market at present is usually a process of depositing a layer of metal on the surface of metal or other materials through electrolysis, and is usually used for corrosion prevention, decoration or enhancement of conductivity, and the equipment usually comprises a plating tank, a power supply, an anode, a cathode (a piece to be plated), an electrolyte circulating system, a temperature control system and the like, wherein the anode is usually a soluble metal, and the metal ions in the plating solution are supplemented after dissolution, and the cathode is a metal piece to be plated, which is connected with the negative pole of the power supply through a hanger or a roller; during electroplating, the metal anode is dissolved into ions under the action of current, migrates to the surface of the cathode, obtains electrons and is reduced into a metal plating layer; However, although the soluble anode (such as a nickel plate for nickel plating and a lead-tin alloy plate for chromium plating) can supplement the metal ions in the electrolyte, the anode mud (accounting for 5%-15% of the weight of the anode) is generated during the dissolution process, the anode mud remains on the surface of the anode plate, affects the performance of the anode plate, and the effective metals (such as nickel and copper) in the anode mud are not convenient to recycle, causing certain resource waste, and therefore, it is necessary to propose a treatment device for a metal surface to solve the above problems, so that the anode mud generated by the anode plate can be effectively recycled, and the resource waste is reduced. SUMMARY
[0003] The application aims to provide a treatment device for a metal surface, which can scrape off the anode mud generated by the anode plate in time, guarantee the performance of the anode plate, and use the flow guide mechanism and the stirring mechanism to stir and guide the anode mud generated in the electroplating tank, so as to facilitate the recycling of the effective metals in the anode mud and reduce the resource waste, so as to solve the problems in the above background.
[0004] To achieve the above-mentioned purpose, the application adopts the following technical scheme: A treatment device for a metal surface comprises an electroplating tank and mounting mechanisms located on both sides of the electroplating tank, anode plates are arranged on both sides of the inside of the electroplating tank, the anode plates are detachably mounted on the inner wall of the electroplating tank through the mounting mechanisms, and a mud scraping mechanism for scraping the surface of the anode plate is mounted on the mounting mechanism. The sludge scraping mechanism includes a sludge scraping component that is attached to the surface of the anode plate and a rotating rod that is rotatably installed at the opening of the electroplating tank. An automatic reset component is installed on the rotating rod. The automatic reset component is connected to the sludge scraping component via a connecting rope. The sludge scraping component is slidably connected to the installation mechanism. A baffle is inclinedly fixed to the bottom wall of the electroplating tank located at the lower end of the anode plate. A flow guiding mechanism is provided between the baffle and the side wall of the electroplating tank. The liquid collection end of the flow guiding mechanism is connected to a discharge mechanism. The bottom of the electroplating tank is equipped with an agitation mechanism for stirring the liquid in the electroplating tank. The agitation mechanism stirs the liquid in the electroplating tank by blowing gas. At the same time, the gas blown by the agitation mechanism also blows the flow guiding mechanism and the baffle to keep the scraped anode mud in a flowing state.
[0005] Preferably, the installation mechanism includes a movable plate and a limiting plate fixed to the upper and lower ends of the anode plate. The movable plate is slidably connected to the inner wall of the electroplating tank, and a position adjustment mechanism is installed on the movable plate. The position adjustment mechanism is fixed to the upper end of the electroplating tank by the installation plate, and the upper and lower ends of the anode plate abut against the limiting plate and the movable plate, respectively.
[0006] Preferably, the sludge scraping component includes a fixed seat located on one side of the anode plate. One end of the fixed seat is fixed with a scraper for scraping the surface of the anode plate. The two fixed seats are connected by multiple connecting rods. Each connecting rod has an automatic reset component at both ends, and one end of the automatic reset component is fixed to the side walls of both ends of the connecting rod by a connecting rope.
[0007] Preferably, a plurality of positioning rods are fixed on the upper surface of the fixing base, and the upper end of the positioning rod passes through the mounting plate and is fixed with an anti-detachment block. The positioning rod is slidably connected to the mounting plate.
[0008] Preferably, the automatic reset component includes a coil spring wound around the outside of the rotating rod and a connecting strap wound around the outside of the coil spring. One end of the coil spring is fixed to the outer wall of the rotating rod, and the other end of the coil spring is fixed to one end of the connecting strap. The other end of the connecting strap is fixed to the connecting rod by a connecting rope.
[0009] Preferably, the rotating rod has a mounting hole for fixing one end of the coil spring, and baffles are fixed on the outer wall of the rotating rod at both ends of the mounting hole, with the coil spring located between the two baffles.
[0010] Preferably, the flow guiding mechanism includes a flow guiding channel located between the baffle and the side wall of the electroplating tank, the bottom of the flow guiding channel is provided with an inclined surface, the liquid gathering end of the flow guiding channel is provided with a liquid discharge port, and the liquid discharge port is connected to the discharge mechanism.
[0011] Preferably, the discharge mechanism includes a discharge pipe connected to the discharge port, one end of the discharge pipe is connected to a filter device for recovering and filtering anode mud, the outlet end of the filter device is connected to a three-way pipe, one end of the three-way pipe is connected to the inside of the electroplating tank through a pump, and the other end of the three-way pipe is connected to a waste liquid treatment device, and a solenoid valve is installed on the pipeline to the waste liquid treatment device.
[0012] Preferably, the agitation mechanism includes a main pipe located on one side of the baffle, with both ends of the main pipe fixed to the side wall of the electroplating tank. The installation direction of the main pipe is consistent with the installation direction of the baffle. One end of the main pipe on both sides of the electroplating tank is connected through a connecting pipe. An air inlet pipe is connected to the connecting pipe, and one end of the air inlet pipe is connected to an air supply mechanism. Multiple serpentine pipes and bends are equidistantly connected to the main pipe. Multiple air outlets are opened on the serpentine pipes, and the air outlet end of the bend is located above the baffle.
[0013] Preferably, a waterproof and breathable membrane is bonded to the outside of the serpentine tube, the waterproof and breathable membrane covers the air outlet, and the air outlet end of the bend is also wrapped with a waterproof and breathable membrane.
[0014] The present invention provides a treatment device for metal surfaces, which has the following advantages compared with the prior art: 1. This invention, through the cooperation of a scraping mechanism and an installation mechanism, allows the scraping component to be placed into the electroplating tank during metal plating. The electroplating rack or electroplating cylinder containing the metal parts first contacts the scraping component. The weight of the rack or cylinder and the metal parts drives the scraping component downwards, scraping the anode plate surface during this downward movement to reduce residual anode mud and ensure anode performance. After electroplating is completed, when the rack or cylinder is removed from the electroplating tank, an automatic reset mechanism returns the scraping component to its initial position, scraping the anode plate surface again during the return process to improve the scraping effect.
[0015] 2. This invention utilizes the cooperation of an agitation mechanism and a flow guiding mechanism to agitate the liquid in the electroplating tank with purging gas. Simultaneously, the purging gas from the agitation mechanism also purifies the flow guiding mechanism and baffles, keeping the scraped anode mud in a flowing state, reducing the sedimentation of anode mud on the baffles, and facilitating the recovery of anode mud from the electroplating solution using a discharge mechanism, thereby reducing resource waste. Attached Figure Description
[0016] Figure 1 A schematic diagram of an electroplating tank structure according to an embodiment of the present invention is shown; Figure 2 A schematic diagram of the internal structure of an electroplating tank according to an embodiment of the present invention is shown; Figure 3 An embodiment of the present invention is shown. Figure 2Enlarged structural diagram at point A in the middle; Figure 4 A schematic diagram of the sludge scraping mechanism according to an embodiment of the present invention is shown; Figure 5 A schematic diagram of the scraping mechanism according to an embodiment of the present invention during electroplating is shown; Figure 6 A schematic diagram of the automatic reset component structure according to an embodiment of the present invention is shown; Figure 7 A schematic diagram of the stirring mechanism according to an embodiment of the present invention is shown.
[0017] In the diagram: 1. Electroplating tank; 2. Sludge scraping mechanism; 21. Rotating rod; 22. Automatic reset component; 221. Coil spring; 222. Connecting belt; 223. Mounting hole; 224. Baffle plate; 23. Sludge scraping component; 231. Connecting rod; 232. Fixed base; 233. Positioning rod; 234. Scraper strip; 24. Connecting rope; 3. Agitation mechanism; 31. Main pipe; 32. Air inlet pipe; 33. Connecting pipe; 34. Serpentine pipe; 35. Bend pipe; 4. Drain pipe; 5. Installation mechanism; 51. Mounting plate; 52. Moving plate; 53. Sliding block; 54. Hand-tightening bolt; 55. Slide groove; 6. Anode plate; 7. Notch; 8. Baffle; 9. Drain port; 10. Limiting plate. Detailed Implementation
[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The specific embodiments described herein are merely used to explain the present invention and are not intended to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0019] This invention provides, for example Figures 1-7The apparatus shown is for treating metal surfaces, including an electroplating tank 1 and mounting mechanisms 5 located on both sides of the electroplating tank 1. Anode plates 6 are arranged on both sides inside the electroplating tank 1. The anode plates 6 are detachably mounted to the inner wall of the electroplating tank 1 via the mounting mechanisms 5. A scraping mechanism 2 for scraping sludge from the surface of the anode plates 6 is mounted on the mounting mechanism 5. The scraping mechanism 2 includes a scraping component 23 that adheres to the surface of the anode plates 6 and a rotating rod 21 rotatably mounted at the opening of the electroplating tank 1. An automatic reset component 22 is mounted on the rotating rod 21. The automatic reset component 22 is connected to the scraping component 23 via a connecting rope 24, and the scraping component 23 is connected to the mounting mechanism. 5. Sliding connection: When electroplating metal parts, the electroplating rack or electroplating cylinder containing the metal parts is placed into the electroplating tank 1 and first contacts the scraping component 23. The weight of the electroplating rack or electroplating cylinder and the metal parts drives the scraping component 23 to move downward. During the downward movement of the scraping component 23, the surface of the anode plate 6 is scraped to reduce the residual anode mud on the surface of the anode plate 6 and ensure the performance of the anode. When the electroplating is completed and the electroplating rack or electroplating cylinder is removed from the electroplating tank 1, the automatic reset component 22 drives the scraping component 23 to return to the initial position. During the return process, the surface of the anode plate 6 is scraped again to improve the scraping effect on the surface of the anode plate 6.
[0020] The installation mechanism 5 includes a movable plate 52 and a limiting plate 10 fixed at the upper and lower ends of the anode plate 6. The movable plate 52 is slidably connected to the inner wall of the electroplating tank 1, and a position adjustment mechanism is installed on the movable plate 52. The position adjustment mechanism is fixed to the upper end of the electroplating tank 1 by the mounting plate 51. The upper and lower ends of the anode plate 6 abut against the limiting plate 10 and the movable plate 52 respectively. The distance between the movable plate 52 and the limiting plate 10 is adjusted by the position adjustment mechanism. The clamping force between the limiting plate 10 and the movable plate 52 is used to fix the anode plate 6 inside the electroplating tank 1.
[0021] The position adjustment mechanism includes multiple hand-tightening bolts 54, which are equidistantly threaded onto the mounting plate 51. The adjustment end of each hand-tightening bolt 54 is located above the mounting plate 51, and the other end of each hand-tightening bolt 54 passes through the mounting plate 51 and is rotatably connected to the moving plate 52. By rotating the hand-tightening bolt 54 through the adjustment end, the thread engagement between the hand-tightening bolt 54 and the mounting plate 51 is utilized to adjust the length of the screw of the hand-tightening bolt 54 between the mounting plate 51 and the moving plate 52, thereby driving the moving plate 52 to move in position and adjust the distance between the moving plate 52 and the limiting plate 10 so that it can be adapted to the installation of the anode plate 6.
[0022] Multiple sliders 53 are fixed on the side of the movable plate 52 near the side wall of the electroplating tank 1. A groove 55 is provided on the side wall of the electroplating tank 1 for the multiple sliders 53 to slide. By utilizing the sliding cooperation between the sliders 53 and the groove 55, the movable plate 52 can move linearly along the direction of the groove 55.
[0023] like Figure 4 and Figure 5 As shown, the scraping component 23 includes a fixed seat 232 located on one side of the anode plate 6. One end of the fixed seat 232 is fixed with a scraper 234 for scraping the surface of the anode plate 6. The two fixed seats 232 are connected by multiple connecting rods 231. Each end of the connecting rod 231 corresponds to an automatic reset component 22, and one end of the automatic reset component 22 is fixed to the side walls of the two ends of the connecting rod 231 by a connecting rope 24. The fixed seat 232 is a rectangular strip and is perpendicular to the connecting rod 231. The multiple connecting rods 231 are equidistant from each other. When the electroplating tank 1 is electroplating metal parts, the electroplating rack or electroplating cylinder is placed on the multiple connecting rods 231 so that the weight of the electroplating rack or electroplating cylinder drives the connecting rods 231 to move towards the bottom of the electroplating tank 1. At the same time, the downward movement of the connecting rods 231 drives the fixed seat 232 and the scraper 234 to move. While moving, the scraper 234 scrapes the surface of the anode plate 6. The upper surface of the fixed base 232 is fixed with a plurality of positioning rods 233. The upper end of the positioning rod 233 passes through the mounting plate 51 and is fixed with an anti-detachment block. The positioning rod 233 is slidably connected to the mounting plate 51. The sliding connection between the positioning rod 233 and the mounting plate 51 limits the movement direction of the fixed base 232, so that the fixed base 232 can drive the scraper 234 to move in a straight line, thereby ensuring the smooth movement of the mud scraping component 23.
[0024] like Figure 6 As shown, the automatic reset component 22 includes a coil spring 221 wrapped around the outside of the rotating rod 21 and a connecting strap 222 wrapped around the outside of the coil spring 221. One end of the coil spring 221 is fixed to the outer wall of the rotating rod 21, and the other end of the coil spring 221 is fixed to one end of the connecting strap 222. The other end of the connecting strap 222 is fixed to the connecting rod 231 through a connecting rope 24. When the connecting rod 231 moves downward under force, the connecting rope 24 pulls the connecting strap 222 and the coil spring 221 to extend. At the same time, the torque of the coil spring 221 drives the rotating rod 21 to rotate. When the connecting rod 231 loses external force, the rebound force of the coil spring 221 drives the rotating rod 21 to rotate in the opposite direction, thereby driving the connecting strap 222 and the connecting rope 24 to reset and wrap around the outside of the coil spring 221, thereby achieving the purpose of automatically resetting the position of the connecting rod 231. The rotating rod 21 has a mounting hole 223 for fixing one end of the coil spring 221. The outer wall of the rotating rod 21 located at both ends of the mounting hole 223 is fixed with baffles 224. The coil spring 221 is located between the two baffles 224. By limiting the two baffles 224, the connecting strip 222 can be wound around the designated position of the rotating rod 21 when the coil spring 221 drives the connecting strip 222 to automatically reset and wind, preventing the connecting strip 222 from slipping and detaching during winding, which would affect the performance.
[0025] A baffle 8 is fixedly inclined on the bottom wall of the electroplating tank 1 located at the lower end of the anode plate 6. A flow guiding mechanism is provided between the baffle 8 and the side wall of the electroplating tank 1. The liquid gathering end of the flow guiding mechanism is connected to a discharge mechanism. An agitation mechanism 3 for stirring the liquid in the electroplating tank 1 is installed at the bottom of the electroplating tank 1. The agitation mechanism 3 agitates the liquid in the electroplating tank 1 by blowing gas. At the same time, the gas blown by the agitation mechanism 3 also blows the flow guiding mechanism and the baffle 8, so that the scraped anode mud is in a flowing state, reducing the sedimentation of anode mud on the baffle 8. The discharge mechanism facilitates the recovery of anode mud in the electroplating solution, reducing the waste of resources.
[0026] The flow guiding mechanism includes a flow guiding channel located between the baffle 8 and the side wall of the electroplating tank 1. The bottom of the flow guiding channel is provided with an inclined surface, and the liquid gathering end of the flow guiding channel is provided with a liquid discharge port 9. The liquid discharge port 9 is connected to the discharge mechanism. The inclined surface of the flow guiding channel is used to guide the liquid containing anode mud, so that the liquid containing anode mud can be discharged and recycled through the discharge mechanism. The discharge mechanism includes a discharge pipe 4 connected to the discharge port 9. One end of the discharge pipe 4 is connected to a filter device for recovering and filtering anode mud. The outlet end of the filter device is connected to a three-way pipe. One end of the three-way pipe is connected to the inside of the electroplating tank 1 via a pump. The other end of the three-way pipe is connected to a waste liquid treatment device, and a solenoid valve is installed on the pipeline to the waste liquid treatment device. The filter device is used to perform solid-liquid separation on the liquid flowing out of the electroplating tank 1. The separated liquid is transferred according to actual production needs. That is, during electroplating, the pump is started to transfer the filtered liquid back to the electroplating tank 1 for recycling. If the electroplating liquid needs to be replaced, the pump is turned off and the solenoid valve connected to the waste liquid treatment device is opened to transfer the electroplating liquid to the waste liquid treatment device for waste liquid treatment. The waste liquid treatment device is used to purify the waste liquid. The filter device only needs to achieve preliminary solid-liquid separation and can be purchased commercially.
[0027] like Figure 7As shown, the agitation mechanism 3 includes a main pipe 31 located on one side of the baffle 8. Both ends of the main pipe 31 are fixed to the sidewalls of the electroplating tank 1. The installation direction of the main pipe 31 is consistent with the installation direction of the baffle 8. One end of the main pipe 31 on both sides of the electroplating tank 1 is connected via a connecting pipe 33. An air inlet pipe 32 is connected to the connecting pipe 33, and one end of the air inlet pipe 32 is connected to an air supply mechanism. Multiple serpentine pipes 34 and bends 35 are equidistantly connected to the main pipe 31. Multiple air outlets are provided on the serpentine pipes 34, and the air outlet of the bend 35 is located above the baffle 8. An air supply mechanism provides the air source, allowing the gas to pass through… Connecting pipe 33 and main pipe 31 are discharged from the air outlets of bend pipe 35 and serpentine pipe 34. The airflow is used to agitate the liquid in electroplating tank 1 to improve the electroplating quality of metal parts in electroplating tank 1. The serpentine pipe 34 is designed so that the air outlet direction of the serpentine pipe 34 can flow from the bottom to the top of electroplating tank 1 in a spiral path, which improves the contact effect between the metal parts in electroplating tank 1 and the electroplating solution, thereby improving the electroplating quality of the electroplated metal layer. The air outlet of bend pipe 35 is placed above baffle 8 to purge the baffle 8 and keep the liquid at the baffle 8 in a flowing state, reducing the probability of anode mud depositing on the baffle 8. The air supply mechanism includes an air compressor, the air outlet of which is connected to the air inlet pipe 32. The air compressor provides an air source to the air inlet pipe 32, which facilitates the supply of air to the agitation mechanism 3.
[0028] The bend 35 is located on one side of the serpentine tube 34, and below the two adjacent connecting rods 231 of the serpentine tube 34, directly below the main tube 31 and the rotating rod 21, so that the main tube 31 is located on both sides of the electroplating tank 1, and the electroplating rack or electroplating cylinder is placed between the two main tubes 31, so as not to affect the agitation of the liquid, and not to interfere with the placement of the electroplating rack or electroplating cylinder.
[0029] The serpentine tube 34 is externally fitted with a waterproof and breathable membrane that covers the air outlet. The air outlet end of the bend 35 is also wrapped with a waterproof and breathable membrane. The waterproof and breathable membrane can prevent liquid from entering the interior of the serpentine tube 34 and the bend 35 without affecting the gas outlet. The waterproof and breathable membrane is made of polytetrafluoroethylene (PTFE). PTFE has the properties of being resistant to acids, alkalis, and organic solvents, which improves the service life of the waterproof and breathable membrane. The electroplating tank 1 has multiple recesses 7 at the openings on opposite sides, and the recesses on both sides are aligned. The recesses 7 facilitate the positioning of the electroplating racks placed in the electroplating tank 1, so that multiple electroplating racks can be placed in the electroplating tank 1 at the same time.
[0030] In use, the metal parts to be electroplated are installed on the electroplating rack or inside the electroplating drum. A conveyor system that moves the rack or drum is then used to move it above the electroplating tank 1. A lifting mechanism on the conveyor system then positions the rack or drum inside the electroplating tank 1. The rack or drum moves the connecting rod 231 towards the bottom of the tank. Simultaneously, the connecting rod 231 moves, causing the scraper 234 to scrape the surface of the anode plate 6. At this point, the process is initiated. The gas supply mechanism agitates the electroplating solution in the electroplating tank 1 with gas to improve the electroplating quality of the metal parts. After electroplating is completed, the lifting mechanism on the conveying equipment moves the electroplating rack or electroplating cylinder out of the electroplating tank 1. At this time, the connecting rod 231 loses its downward pressure and the rebound force of the coil spring 221 drives the connecting rod 231 to rise. While the connecting rod 231 rises, it scrapes the surface of the anode plate 6 again to reduce the anode plate 6 from being covered by the reacted anode mud and ensure the performance of the anode plate 6.
[0031] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A treatment apparatus for metal surfaces, characterized in that: It includes an electroplating tank (1) and an installation mechanism (5) located on both sides of the electroplating tank (1). An anode plate (6) is provided on both sides inside the electroplating tank (1). The anode plate (6) is detachably installed to the inner wall of the electroplating tank (1) through the installation mechanism (5). A scraping mechanism (2) for scraping mud from the surface of the anode plate (6) is installed on the installation mechanism (5). The scraping mechanism (2) includes a scraping component (23) that is attached to the surface of the anode plate (6) and a rotating rod (21) that is rotatably installed at the opening of the electroplating tank (1). An automatic reset component (22) is installed on the rotating rod (21). The automatic reset component (22) is connected to the scraping component (23) through a connecting rope (24). The scraping component (23) is slidably connected to the installation mechanism (5). A baffle (8) is fixedly inclined on the bottom wall of the electroplating tank (1) located at the lower end of the anode plate (6). A flow guiding mechanism is provided between the baffle (8) and the side wall of the electroplating tank (1). The liquid collection end of the flow guiding mechanism is connected to a discharge mechanism. The bottom of the electroplating tank (1) is equipped with an agitation mechanism (3) for agitating the liquid in the electroplating tank (1). The agitation mechanism (3) agitates the liquid in the electroplating tank (1) by blowing gas. At the same time, the gas blown by the agitation mechanism (3) also blows the flow guiding mechanism and the baffle (8) so that the scraped anode mud is in a flowing state.
2. The device for treating metal surfaces according to claim 1, characterized in that: The installation mechanism (5) includes a movable plate (52) and a limiting plate (10) fixed at the upper and lower ends of the anode plate (6). The movable plate (52) is slidably connected to the inner wall of the electroplating tank (1), and a position adjustment mechanism is installed on the movable plate (52). The position adjustment mechanism is fixed to the upper end of the electroplating tank (1) by the mounting plate (51). The upper and lower ends of the anode plate (6) abut against the limiting plate (10) and the movable plate (52) respectively.
3. The apparatus for treating metal surfaces according to claim 2, characterized in that: The scraping component (23) includes a fixed seat (232) located on one side of the anode plate (6). One end of the fixed seat (232) is fixed with a scraper (234) for scraping the surface of the anode plate (6). The two fixed seats (232) are connected by multiple connecting rods (231). Each connecting rod (231) has an automatic reset component (22) at both ends. One end of the automatic reset component (22) is fixed to the side walls of both ends of the connecting rod (231) by a connecting rope (24).
4. The apparatus for treating metal surfaces according to claim 3, characterized in that: The upper surface of the fixed base (232) is fixed with a plurality of positioning rods (233). The upper end of the positioning rod (233) passes through the mounting plate (51) and is fixed with an anti-detachment block. The positioning rod (233) is slidably connected to the mounting plate (51).
5. The apparatus for treating metal surfaces according to claim 4, characterized in that: The automatic reset component (22) includes a coil spring (221) wrapped around the outside of the rotating rod (21) and a connecting strap (222) wrapped around the outside of the coil spring (221). One end of the coil spring (221) is fixed to the outer wall of the rotating rod (21), and the other end of the coil spring (221) is fixed to one end of the connecting strap (222). The other end of the connecting strap (222) is fixed to the connecting rod (231) by a connecting rope (24).
6. The apparatus for treating metal surfaces according to claim 5, characterized in that: The rotating rod (21) has a mounting hole (223) for fixing one end of the coil spring (221). The outer wall of the rotating rod (21) located at both ends of the mounting hole (223) is fixed with baffles (224), and the coil spring (221) is located between the two baffles (224).
7. The apparatus for treating metal surfaces according to claim 6, characterized in that: The flow guiding mechanism includes a flow guiding channel located between the baffle (8) and the side wall of the electroplating tank (1). The bottom of the flow guiding channel is provided with an inclined surface, and the liquid gathering end of the flow guiding channel is provided with a liquid discharge port (9). The liquid discharge port (9) is connected to the discharge mechanism.
8. The apparatus for treating metal surfaces according to claim 7, characterized in that: The discharge mechanism includes a discharge pipe (4) connected to the discharge port (9). One end of the discharge pipe (4) is connected to a filter device for recycling and filtering anode mud. The outlet end of the filter device is connected to a three-way pipe. One end of the three-way pipe is connected to the inside of the electroplating tank (1) via a pump. The other end of the three-way pipe is connected to a waste liquid treatment device, and a solenoid valve is installed on the pipeline to the waste liquid treatment device.
9. The apparatus for treating metal surfaces according to claim 8, characterized in that: The stirring mechanism (3) includes a main pipe (31) located on one side of the baffle (8). Both ends of the main pipe (31) are fixed to the side wall of the electroplating tank (1). The installation direction of the main pipe (31) is consistent with the installation direction of the baffle (8). One end of the main pipe (31) on both sides of the electroplating tank (1) is connected through a connecting pipe (33). An air inlet pipe (32) is connected to the connecting pipe (33). One end of the air inlet pipe (32) is connected to an air supply mechanism. Multiple serpentine pipes (34) and bends (35) are equidistantly connected to the main pipe (31). Multiple air outlets are opened on the serpentine pipes (34). The air outlet of the bend (35) is located above the baffle (8).
10. The apparatus for treating metal surfaces according to claim 9, characterized in that: The outer sleeve of the serpentine tube (34) is bonded with a waterproof and breathable membrane, which covers the air outlet. The air outlet end of the bend (35) is also wrapped with a waterproof and breathable membrane.