Smt production line incoming deviation printing compensation calibration method, device and measuring equipment

Abstract

The application discloses a kind of SMT production line deviation printing compensation calibration method, device and measuring equipment.The method comprises: obtaining the actual coordinate data of reference point in incoming material circuit board and pad actual coordinate data, and the reference point coordinate data and pad reference coordinate data of printing machine steel mesh;According to the actual coordinate data of reference point and the reference point coordinate data of steel mesh, reference point is aligned, and reference point offset compensation data is obtained;According to the actual coordinate data of pad and pad reference coordinate data, pad is aligned, and pad offset compensation data is obtained;According to reference point offset compensation data and pad offset compensation data, determine incoming material deviation compensation data, so that printing machine is compensated and calibrated according to incoming material deviation compensation data.This provides accurate incoming material deviation pre-compensation basis for printing machine, and can accurately adapt to individual differences of incoming material, solves the problem of low printing alignment accuracy and poor quality caused by incoming material difference from the root, improves the overall yield and production efficiency of SMT production line.

Description

Technical Field

[0001] This invention relates to the field of surface mount technology, and in particular to a method, apparatus, and measuring equipment for calibrating and compensating for material deviations in SMT production lines. Background Technology

[0002] In current SMT production lines, printers generally use a large-board mark alignment mode for printing positioning, assuming that incoming PCBs / FPCBs conform to design standards. However, in actual production, incoming materials often exhibit individual differences such as pad misalignment, sub-board deformation, board expansion and contraction, and positioning hole misalignment. Large-board mark alignment alone cannot accommodate these material differences, leading to significant misalignment between pads and stencils, directly reducing printing accuracy. Furthermore, printing misalignment caused by material deviations can further propagate to subsequent processes, causing a chain reaction of problems such as SPI detection data distortion, AOI false alarms and false negatives, and placement defects in pick-and-place machines. The printing defect rate is particularly high for easily deformable products such as multi-panel boards and FPC flexible boards, severely impacting the overall yield and production efficiency of the SMT production line. Summary of the Invention

[0003] This invention provides a method, apparatus, and measuring device for compensating for incoming material deviations in SMT production lines, in order to adapt to individual differences in incoming materials and accurately offset the impact of incoming material deviations on printing accuracy.

[0004] In a first aspect, embodiments of the present invention provide a method for compensating and calibrating incoming material deviations in an SMT production line, applied to a measuring device, the method comprising: Obtain the actual coordinate data of the reference points and the actual coordinate data of the pads in the incoming circuit board, as well as the reference point coordinate data and the pad reference coordinate data of the stencil of the printing press; Based on the actual coordinate data of the reference point and the coordinate data of the steel mesh reference point, the reference point is aligned to obtain the reference point offset compensation data. The pads are aligned based on the actual coordinate data of the pads and the reference coordinate data of the pads to obtain pad offset compensation data. The incoming material deviation compensation data is determined based on the reference point offset compensation data and the pad offset compensation data, so that the printing press can perform compensation calibration based on the incoming material deviation compensation data.

[0005] Optionally, the step of aligning the pads according to the actual coordinate data of the pads and the reference coordinate data of the pads to obtain pad offset compensation data includes: Calculate the centroid of the pad in the actual coordinate data of the pad and the reference coordinate data of the pad, respectively; Based on the centroid of the pad, calculate the centered coordinates of each pad in the actual coordinate data of the pad and the reference coordinate data of the pad, and calculate the covariance term between the two types of centered coordinates. The target rotation angle is calculated based on the covariance term, and the target translation amount is calculated based on the target rotation angle and the pad centroid. The pad offset compensation data includes the target rotation angle and the target translation amount.

[0006] Optionally, determining the incoming material deviation compensation data based on the reference point offset compensation data and the pad offset compensation data includes: The incoming material deviation compensation data is obtained by performing a differential operation between the pad offset compensation data and the reference point offset compensation data.

[0007] Optionally, after determining the incoming material deviation compensation data based on the reference point offset compensation data and the pad offset compensation data, the method further includes: The incoming material deviation compensation data is associated with and stored with the identification of the incoming circuit board.

[0008] Secondly, embodiments of the present invention also provide a method for compensating and calibrating incoming material deviations in an SMT production line, applied to a printing press, the method comprising: Acquire the actual reference point coordinate data in the incoming circuit board, the reference point coordinate data of the stencil, and the incoming material deviation compensation data generated by the measuring equipment; The actual reference point coordinate data and the steel mesh reference point coordinate data are aligned to obtain the foundation alignment data. The actual deviation compensation data is determined based on the basic alignment data and the incoming material deviation compensation data, so as to adjust the printing alignment mechanism according to the actual deviation compensation data.

[0009] Optionally, determining the actual deviation compensation data based on the basic alignment data and the incoming material deviation compensation data includes: The basic alignment data and the incoming material deviation compensation data are superimposed to obtain the actual deviation compensation data.

[0010] Thirdly, embodiments of the present invention also provide an incoming material deviation printing compensation calibration device for SMT production lines, applied to measuring equipment, the device comprising: The coordinate data acquisition module is used to acquire the actual coordinate data of the reference points and the actual coordinate data of the pads in the incoming circuit board, as well as the coordinate data of the stencil reference points and the reference coordinate data of the pads in the printing press. The reference point alignment module is used to align the reference points according to the actual coordinate data of the reference points and the coordinate data of the steel mesh reference points, and to obtain the reference point offset compensation data. The pad alignment module is used to align the pads according to the actual coordinate data of the pads and the reference coordinate data of the pads, and to obtain pad offset compensation data. The deviation compensation determination module is used to determine the incoming material deviation compensation data based on the reference point offset compensation data and the pad offset compensation data, so that the printing press can perform compensation calibration based on the incoming material deviation compensation data.

[0011] Fourthly, embodiments of the present invention also provide a measuring device, the measuring device comprising: One or more processors; Memory, used to store one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the SMT production line incoming material deviation printing compensation calibration method provided in any embodiment of the present invention.

[0012] Fifthly, embodiments of the present invention also provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the SMT production line incoming material deviation printing compensation calibration method provided in any embodiment of the present invention.

[0013] Sixthly, embodiments of the present invention also provide a computer program product, which includes a computer program that, when executed by a processor, implements the SMT production line incoming material deviation printing compensation calibration method provided in any embodiment of the present invention.

[0014] This invention provides a method for compensating and calibrating incoming material deviations in an SMT production line. First, the actual coordinate data of the reference points and pads in the incoming circuit board are acquired, along with the reference point coordinate data of the stencil and pads from the printer. Then, on one hand, the reference points are aligned based on the actual coordinate data and the stencil reference point coordinate data to obtain reference point offset compensation data. On the other hand, the pads are aligned based on the actual coordinate data and the pad reference coordinate data to obtain pad offset compensation data. Finally, the incoming material deviation compensation data is determined based on the reference point offset compensation data and the pad offset compensation data, thereby enabling the printer to perform compensation and calibration based on the obtained incoming material deviation compensation data. The SMT production line incoming material deviation printing compensation calibration method provided in this embodiment of the invention generates compensation data by combining reference point alignment and whole board pad alignment for printer compensation calibration. This provides the printer with a highly accurate basis for pre-compensation of incoming material deviation and can accurately adapt to individual differences in incoming materials. It fundamentally solves the problems of low printing alignment accuracy and poor printing quality caused by differences in incoming materials, avoids the chain of defects in subsequent processes, and thus improves the overall yield and production efficiency of the SMT production line. Attached Figure Description

[0015] Figure 1 This is a flowchart of the SMT production line incoming material deviation printing compensation calibration method provided in Embodiment 1 of the present invention; Figure 2 This is a flowchart of the SMT production line incoming material deviation printing compensation calibration method provided in Embodiment 2 of the present invention; Figure 3 This is a schematic diagram of the SMT production line incoming material deviation printing compensation calibration device provided in Embodiment 3 of the present invention; Figure 4 This is a schematic diagram of the measuring device provided in Embodiment 4 of the present invention. Detailed Implementation

[0016] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0017] Before discussing the exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts describe the steps as sequential processes, many of these steps can be performed in parallel, concurrently, or simultaneously. Furthermore, the order of the steps can be rearranged. The process can be terminated when its operation is complete, but may also have additional steps not included in the figures. The process can correspond to a method, function, procedure, subroutine, subroutine, etc.

[0018] Example 1 Figure 1 This is a flowchart of the SMT production line incoming material deviation printing compensation calibration method provided in Embodiment 1 of the present invention. This embodiment is applicable to printing calibration in various SMT production lines, especially suitable for scenarios with high-precision printing requirements such as FPC flexible boards, multi-panel boards, and MiniLED packaging boards. This method can be executed by the SMT production line incoming material deviation printing compensation calibration device provided in this embodiment of the present invention. This device can be implemented in hardware and / or software, and is generally integrated into a measuring device. Specifically, a high-precision measuring machine with an absolute error ≤ ±10μm and a repeatability accuracy ≤ 1μm can be selected. Figure 1 As shown, the method specifically includes the following steps: S11. Obtain the actual coordinate data of the reference points and the actual coordinate data of the pads in the incoming circuit board, as well as the reference point coordinate data of the stencil and the reference coordinate data of the pads in the printing press.

[0019] S12. Align the reference points according to the actual coordinate data of the reference points and the coordinate data of the steel mesh reference points to obtain the reference point offset compensation data.

[0020] S13. Align the pads according to the actual coordinate data of the pads and the reference coordinate data of the pads to obtain pad offset compensation data.

[0021] S14. Determine the incoming material deviation compensation data based on the reference point offset compensation data and the pad offset compensation data, so that the printing machine can perform compensation calibration based on the incoming material deviation compensation data.

[0022] Specifically, the aforementioned metrology machine can accurately capture and scan the incoming circuit boards (such as PCBs / FPCBs) delivered by the board loading machine to collect and generate full-dimensional geometric data of the incoming circuit boards. This data can be bound to the unique identifier (such as an identification code) of the incoming circuit boards for subsequent calculations and problem traceability. The collected geometric data includes at least the actual coordinates of reference points and pads on the incoming circuit boards. The reference point coordinates can specifically include the actual coordinates of the large board Mark and / or the actual coordinates of the single panel PcsMark. The pad coordinates can include the actual coordinates of all pads on the entire board. The metrology machine can include a vision positioning module that can capture images of the incoming circuit boards using a camera and then calculate the required geometric data using relevant algorithms. Alternatively, the stencil can be photographed using a camera on the printing press to obtain the stencil reference point coordinate data, which is then provided to the metrology machine. Simultaneously, the metrology machine can retrieve the preset Gerber data of the incoming circuit board to obtain the corresponding pad reference coordinate data.

[0023] Based on the aforementioned actual coordinate data of the reference points and the coordinate data of the steel mesh reference points, reference point alignment calculations can be performed to obtain reference point offset compensation data. Specifically, two reference points can be selected; for example, if a large plate Mark alignment method is used, two large plate Marks can be selected. Then, the corresponding steel mesh reference point coordinate data of these two reference points are matched and aligned with the actual reference point coordinate data. Specifically, one of the reference points can be used as the origin for alignment, yielding the initial X-axis offset Xm and initial Y-axis offset Ym of the steel mesh reference point coordinate data relative to the actual reference point coordinate data. Then, the line connecting the two reference points is used as the direction for alignment, yielding the initial rotation angle Rm of the steel mesh reference point coordinate data relative to the actual reference point coordinate data. Xm, Ym, and Rm provide a basic reference for calculating incoming material deviation compensation data.

[0024] Based on the aforementioned actual pad coordinate data and pad reference coordinate data, full-board pad alignment calculations can be performed to obtain pad offset compensation data. Due to potential issues such as board expansion and contraction, local deformation, and distortion in the incoming circuit board, the global error between the actual pad coordinate data and the pad reference coordinate data may still be significant after reference point alignment. In other words, the deviation between each pad in the actual pad coordinate data and its corresponding pad in the pad reference coordinate data may be substantial. Therefore, a full-board pad alignment mode can be used to determine pad offset compensation data to characterize the overall pad offset. Specifically, the pad reference coordinate data can be matched and aligned with all pad coordinates in the actual pad coordinate data. With the goal of minimizing the global error of all pads, an optimal alignment algorithm is used to optimize the alignment results of all pads on the entire board, obtaining pad offset compensation data. This ensures that the global error between the adjusted pad reference coordinate data and the actual pad coordinate data is minimized. The pad offset compensation data may include the X-axis offset Xp of the entire board pads, the Y-axis offset Yp of the entire board pads, and the rotation angle Rp of the entire board pads.

[0025] In an optional implementation, the step of aligning the pads according to the actual coordinate data and the reference coordinate data to obtain pad offset compensation data includes: calculating the pad centroid in the actual coordinate data and the reference coordinate data respectively; calculating the centered coordinates of each pad in the actual coordinate data and the reference coordinate data based on the pad centroid, and calculating the covariance term between the two types of centered coordinates; calculating the target rotation angle based on the covariance term, and calculating the target translation amount based on the target rotation angle and the pad centroid, wherein the pad offset compensation data includes the target rotation angle and the target translation amount.

[0026] Specifically, the least squares rigid registration method can be used to obtain the pad offset compensation data, so that the global alignment error between the pad reference coordinate data and the actual pad coordinate data after adjustment based on the pad offset compensation data reaches a unique global minimum. Let the actual pad coordinate data include actual pad coordinates Pi=(Xi,Yi), i=1,2,…,N, and the pad reference coordinate data include pad reference coordinates Si=(xi,yi), i=1,2,…,N. Then the pad centroid coordinates in the actual pad coordinate data are: ; The centroid coordinates of the pads in the pad reference coordinate data are: ; Furthermore, the centered coordinates of each pad in the actual coordinate data and the reference coordinate data of the pads can be calculated as follows: ; Constructing the covariance term includes: ; Therefore, the target rotation angle can be calculated based on the above covariance term as follows: ; The target translation is then calculated as follows: ; After obtaining the reference point offset compensation data and pad offset compensation data, the incoming material deviation compensation data can be calculated. This data only addresses the inherent deviation of the incoming material and is unrelated to equipment factors such as the printer's squeegee speed, pressure, and angle. The obtained incoming material deviation compensation data can then be provided to the printer so that it can perform pre-printing compensation calibration based on this data before printing, thereby specifically offsetting the impact of inherent material deviations on printing accuracy.

[0027] In an optional implementation, determining the incoming material deviation compensation data based on the reference point offset compensation data and the pad offset compensation data includes: performing a difference operation between the pad offset compensation data and the reference point offset compensation data to obtain the incoming material deviation compensation data.

[0028] Specifically, the difference between the obtained pad offset compensation data and the reference point offset compensation data can be used to remove the influence of board offset, resulting in incoming material deviation compensation data that truly reflects the pad position deviation. This data is a customized parameter for individual differences in incoming materials. Specifically, the difference between the overall board pad X-axis offset Xp and the initial X-axis offset Xm can be used as the incoming material X-axis compensation offset dx, i.e., dx = Xp - Xm; the difference between the overall board pad Y-axis offset Yp and the initial Y-axis offset Ym can be used as the incoming material Y-axis compensation offset dy, i.e., dy = Yp - Ym; and the difference between the overall board pad rotation angle Rp and the initial rotation angle Rm can be used as the incoming material rotation compensation angle dR, i.e., dR = Rp - Rm.

[0029] Based on the above technical solution, optionally, after determining the incoming material deviation compensation data according to the reference point offset compensation data and the pad offset compensation data, the method further includes: associating and storing the incoming material deviation compensation data with the identification of the incoming circuit board.

[0030] Specifically, the aforementioned incoming material X-axis compensation offset dx, incoming material Y-axis compensation offset dy, and incoming material rotation compensation angle dR can be associated and stored with the identification of the incoming circuit board. This can be stored locally on the measuring machine or uploaded to a unified data center. This allows for adaptation to production line rhythm; when the printing press processes a specific incoming circuit board, the corresponding identification data for material deviation compensation can be retrieved for calibration, thus better adapting to individual differences in incoming materials.

[0031] The technical solution provided by this invention first obtains the actual coordinate data of the reference points and pads in the incoming circuit board, as well as the reference point coordinate data of the stencil and pad reference coordinate data of the printing press. Then, on the one hand, the reference points are aligned based on the actual coordinate data and the stencil reference point coordinate data to obtain reference point offset compensation data; on the other hand, the pads are aligned based on the actual coordinate data and the pad reference coordinate data to obtain pad offset compensation data. Finally, the incoming material deviation compensation data is determined based on the reference point offset compensation data and the pad offset compensation data, thereby enabling the printing press to perform compensation calibration based on the obtained incoming material deviation compensation data. By combining the reference point alignment and the whole board pad alignment to generate compensation data for printing press compensation calibration, a highly accurate pre-compensation basis for incoming material deviation is provided for the printing press. It can accurately adapt to individual differences in incoming materials, fundamentally solving the problem of low printing alignment accuracy and poor printing quality caused by differences in incoming materials, avoiding the chain of defects in subsequent processes, and thus improving the overall yield and production efficiency of the SMT production line.

[0032] Example 2 Figure 2 This is a flowchart of the SMT production line incoming material deviation printing compensation calibration method provided in Embodiment 2 of the present invention. This embodiment is applicable to printing calibration in various SMT production lines, especially suitable for scenarios with high-precision printing requirements such as FPC flexible boards, multi-panel boards, and MiniLED packaging boards. This method is applied in printing machines, such as... Figure 2 As shown, the method specifically includes the following steps: S21. Obtain the actual reference point coordinate data, stencil reference point coordinate data, and incoming material deviation compensation data generated by the measuring equipment from the incoming circuit board.

[0033] S22. Align the actual reference point coordinate data and the steel mesh reference point coordinate data to obtain the foundation alignment data.

[0034] S23. Determine the actual deviation compensation data based on the basic alignment data and the incoming material deviation compensation data, and adjust the printing alignment mechanism according to the actual deviation compensation data.

[0035] Specifically, when the incoming circuit boards arrive at the printing press for processing, the printing press can collect the actual reference point coordinate data of the incoming circuit boards through its vision recognition module. The actual reference point coordinate data can include the actual coordinates of the large board Mark and / or the actual coordinates of the individual board PcsMark. In addition, the stencil reference point coordinate data can be collected in advance through its vision recognition module, and the corresponding incoming deviation compensation data of the incoming circuit boards can be received. This incoming deviation compensation data is generated by the measuring equipment, as detailed in the above description.

[0036] Then, printing alignment operations can be performed on the incoming circuit boards. First, reference point alignment is performed to obtain basic alignment data. Specifically, two reference points can be selected, such as two large board marks if a large board mark alignment method is used. Then, the corresponding stencil reference point coordinate data of these two reference points are matched and aligned with the actual reference point coordinate data. Specifically, one of the reference points can be used as the origin for alignment, which yields the basic X-axis offset Xb and basic Y-axis offset Yb of the stencil reference point coordinate data relative to the actual reference point coordinate data. Then, the line connecting the two reference points is used as the direction for alignment, which yields the basic rotation angle Rb of the stencil reference point coordinate data relative to the actual reference point coordinate data. Xb, Yb, and Rb are the basic alignment data of the printing press. Then, the actual deviation compensation data is generated by combining the incoming material deviation compensation data to complete the incoming material difference offset rotation compensation, thereby ensuring high-precision positioning of the stencil openings and the incoming material pads, eliminating the impact of incoming material deviation on subsequent printing quality from the source.

[0037] In an optional implementation, determining the actual deviation compensation data based on the basic alignment data and the incoming material deviation compensation data includes: performing a superposition operation on the basic alignment data and the incoming material deviation compensation data to obtain the actual deviation compensation data.

[0038] Specifically, the basic alignment data and the incoming material deviation compensation data can be summed to obtain the actual deviation compensation data for aligning the circuit board and eliminating material discrepancies for the incoming circuit board. Specifically, the sum of the basic X-axis offset Xb and the incoming material X-axis compensation offset dx can be used as the actual X-axis compensation offset Xa, i.e., Xa = Xb + dx; the sum of the basic Y-axis offset Yb and the incoming material Y-axis compensation offset dy can be used as the actual Y-axis compensation offset Ya, i.e., Ya = Yb + dy; and the sum of the basic rotation angle Rb and the incoming material rotation compensation angle dR can be used as the actual rotation compensation angle Ra, i.e., Ra = Rb + dR. The printing press can then automatically adjust its printing alignment mechanism based on the calculated Xa, Ya, and Ra to complete the pre-precision compensation for incoming material discrepancies.

[0039] The technical solution provided by this invention, through precise superposition compensation, accurately offsets inherent deviations in incoming materials, overcomes the limitations of traditional large-board mark alignment, and significantly improves the accuracy of printing compensation calibration. This solves the problem of low printing alignment accuracy and poor printing quality caused by differences in incoming materials at its source, avoids cascading defects in subsequent processes, and improves the overall yield and production efficiency of the SMT production line.

[0040] Example 3 Figure 3 This is a schematic diagram of the SMT production line incoming material deviation printing compensation calibration device provided in Embodiment 3 of the present invention. This device can be implemented in hardware and / or software, and is generally integrated into a measuring device to execute the SMT production line incoming material deviation printing compensation calibration method provided in Embodiment 1 of the present invention. Figure 3 As shown, the device includes: The coordinate data acquisition module 21 is used to acquire the actual coordinate data of the reference points and the actual coordinate data of the pads in the incoming circuit board, as well as the coordinate data of the stencil reference points and the reference coordinate data of the pads in the printing press. The reference point alignment module 22 is used to align the reference points according to the actual coordinate data of the reference points and the coordinate data of the steel mesh reference points, and to obtain the reference point offset compensation data. The pad alignment module 23 is used to align the pads according to the actual coordinate data of the pads and the reference coordinate data of the pads, and to obtain pad offset compensation data. Deviation compensation determination module 24 is used to determine incoming material deviation compensation data based on the reference point offset compensation data and the pad offset compensation data, so that the printing press can perform compensation calibration based on the incoming material deviation compensation data.

[0041] The technical solution provided by this invention first obtains the actual coordinate data of the reference points and pads in the incoming circuit board, as well as the reference point coordinate data of the stencil and pad reference coordinate data of the printing press. Then, on the one hand, the reference points are aligned based on the actual coordinate data and the stencil reference point coordinate data to obtain reference point offset compensation data; on the other hand, the pads are aligned based on the actual coordinate data and the pad reference coordinate data to obtain pad offset compensation data. Finally, the incoming material deviation compensation data is determined based on the reference point offset compensation data and the pad offset compensation data, thereby enabling the printing press to perform compensation calibration based on the obtained incoming material deviation compensation data. By combining the reference point alignment and the whole board pad alignment to generate compensation data for printing press compensation calibration, a highly accurate pre-compensation basis for incoming material deviation is provided for the printing press. It can accurately adapt to individual differences in incoming materials, fundamentally solving the problem of low printing alignment accuracy and poor printing quality caused by differences in incoming materials, avoiding the chain of defects in subsequent processes, and thus improving the overall yield and production efficiency of the SMT production line.

[0042] Based on the above technical solution, optionally, the pad alignment module 23 is specifically used for: Calculate the centroid of the pad in the actual coordinate data of the pad and the reference coordinate data of the pad, respectively; Based on the centroid of the pad, calculate the centered coordinates of each pad in the actual coordinate data of the pad and the reference coordinate data of the pad, and calculate the covariance term between the two types of centered coordinates. The target rotation angle is calculated based on the covariance term, and the target translation amount is calculated based on the target rotation angle and the pad centroid. The pad offset compensation data includes the target rotation angle and the target translation amount.

[0043] Based on the above technical solution, optionally, the deviation compensation determination module 24 is specifically used for: The incoming material deviation compensation data is obtained by performing a differential operation between the pad offset compensation data and the reference point offset compensation data.

[0044] Based on the above technical solution, optionally, the device further includes: The data storage module is used to associate and store the incoming material deviation compensation data with the identification of the incoming circuit board after determining the incoming material deviation compensation data based on the reference point offset compensation data and the pad offset compensation data.

[0045] The SMT production line incoming material deviation printing compensation and calibration device provided in this embodiment of the invention can execute the SMT production line incoming material deviation printing compensation and calibration method provided in any embodiment of the invention, and has the corresponding functional modules and beneficial effects of executing the method.

[0046] It is worth noting that in the above embodiment of the SMT production line incoming material deviation printing compensation calibration device, the various units and modules included are only divided according to functional logic, but are not limited to the above division, as long as the corresponding functions can be achieved; in addition, the specific names of each functional unit are only for easy differentiation and are not used to limit the scope of protection of the present invention.

[0047] Example 4 Figure 4 This is a schematic diagram of the structure of a measuring device provided in Embodiment 4 of the present invention, showing a block diagram of an exemplary measuring device suitable for implementing the embodiments of the present invention. Figure 4 The measuring device shown is merely an example and should not be construed as limiting the functionality or scope of the embodiments of the present invention. Figure 4As shown, the measuring device includes a processor 31, a memory 32, an input device 33, and an output device 34; the number of processors 31 in the measuring device can be one or more. Figure 4 Taking a processor 31 as an example, the processor 31, memory 32, input device 33, and output device 34 in the measuring device can be connected via a bus or other means. Figure 4 Taking the example of a connection between China and Israel via a bus.

[0048] The memory 32, as a computer-readable storage medium, can be used to store software programs, computer-executable programs, and modules, such as the program instructions / modules corresponding to the SMT production line incoming material deviation printing compensation calibration method in this embodiment of the invention (e.g., the coordinate data acquisition module 21, the reference point alignment module 22, the pad alignment module 23, and the deviation compensation determination module 24 in the SMT production line incoming material deviation printing compensation calibration device). The processor 31 executes various functional applications and data processing of the measuring equipment by running the software programs, instructions, and modules stored in the memory 32, thereby realizing the above-mentioned SMT production line incoming material deviation printing compensation calibration method.

[0049] The memory 32 may primarily include a program storage area and a data storage area. The program storage area may store the operating system and at least one application program required for a given function; the data storage area may store data created based on the use of the measuring device. Furthermore, the memory 32 may include high-speed random access memory and non-volatile memory, such as at least one disk storage device, flash memory, or other non-volatile solid-state storage device. In some instances, the memory 32 may further include memory remotely located relative to the processor 31, which can be connected to the measuring device via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0050] Input device 33 can be used to acquire coordinate data from incoming circuit boards, and to generate key signal inputs related to user settings and function control of the measuring equipment. Output device 34 can be used to output the generated incoming material deviation compensation data, etc.

[0051] Example 5 Embodiment 5 of the present invention also provides a storage medium containing computer-executable instructions, which, when executed by a computer processor, are used to perform a method for compensating for printing deviations in incoming materials on an SMT production line. The method includes: Obtain the actual coordinate data of the reference points and the actual coordinate data of the pads in the incoming circuit board, as well as the reference point coordinate data and the pad reference coordinate data of the stencil of the printing press; Based on the actual coordinate data of the reference point and the coordinate data of the steel mesh reference point, the reference point is aligned to obtain the reference point offset compensation data. The pads are aligned based on the actual coordinate data of the pads and the reference coordinate data of the pads to obtain pad offset compensation data. The incoming material deviation compensation data is determined based on the reference point offset compensation data and the pad offset compensation data, so that the printing press can perform compensation calibration based on the incoming material deviation compensation data.

[0052] Storage media can be any type of memory device or storage device. The term "storage media" is intended to include: mounting media, such as CD-ROMs, floppy disks, or magnetic tape devices; computer system memory or random access memory, such as DRAM, DDR RAM, SRAM, EDO RAM, Rambus RAM, etc.; non-volatile memory, such as flash memory, magnetic media (e.g., hard disks or optical storage); registers or other similar types of memory elements. Storage media may also include other types of memory or combinations thereof. Furthermore, storage media may reside in a computer system in which the program is executed, or may reside in a different second computer system connected to the computer system via a network (such as the Internet). The second computer system can provide program instructions to the computer for execution. The term "storage media" can include two or more storage media that may reside in different locations (e.g., in different computer systems connected via a network). Storage media may store program instructions (e.g., specifically implemented as a computer program) that can be executed by one or more processors.

[0053] Of course, the computer-executable instructions provided in the embodiments of the present invention are not limited to the method operations described above, but can also perform related operations in the SMT production line incoming material deviation printing compensation calibration method provided in any embodiment of the present invention.

[0054] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, capable of sending, propagating, or transmitting programs for use by or in connection with an instruction execution system, apparatus, or device.

[0055] Program code contained on a computer-readable medium may be transmitted using any suitable medium, including but not limited to wireless, wire, optical fiber, RF, etc., or any suitable combination thereof.

[0056] Based on the above description of the implementation methods, those skilled in the art can clearly understand that the present invention can be implemented using software and necessary general-purpose hardware, and of course, it can also be implemented using hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as a computer floppy disk, read-only memory (ROM), random access memory (RAM), flash memory, hard disk, or optical disk, etc., including several instructions to cause a measuring device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0057] Example 6 Embodiment 6 of the present invention also provides a computer program product, which includes a computer program (also referred to as code or instructions). The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, it is used to execute the SMT production line incoming material deviation printing compensation calibration method provided in any of the above embodiments, and has the corresponding beneficial effects of executing the method.

[0058] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for compensating and calibrating incoming material deviations in an SMT production line, characterized in that, Applied to measuring equipment, including: Obtain the actual coordinate data of the reference points and the actual coordinate data of the pads in the incoming circuit board, as well as the reference point coordinate data and the pad reference coordinate data of the stencil of the printing press; Based on the actual coordinate data of the reference point and the coordinate data of the steel mesh reference point, the reference point is aligned to obtain the reference point offset compensation data. The pads are aligned based on the actual coordinate data of the pads and the reference coordinate data of the pads to obtain pad offset compensation data. The incoming material deviation compensation data is determined based on the reference point offset compensation data and the pad offset compensation data, so that the printing press can perform compensation calibration based on the incoming material deviation compensation data.

2. The SMT production line incoming material deviation printing compensation calibration method according to claim 1, characterized in that, The step of aligning the pads based on their actual coordinate data and reference coordinate data to obtain pad offset compensation data includes: Calculate the centroid of the pad in the actual coordinate data of the pad and the reference coordinate data of the pad, respectively; Based on the centroid of the pad, calculate the centered coordinates of each pad in the actual coordinate data of the pad and the reference coordinate data of the pad, and calculate the covariance term between the two types of centered coordinates. The target rotation angle is calculated based on the covariance term, and the target translation amount is calculated based on the target rotation angle and the pad centroid. The pad offset compensation data includes the target rotation angle and the target translation amount.

3. The SMT production line incoming material deviation printing compensation calibration method according to claim 1, characterized in that, The step of determining the incoming material deviation compensation data based on the reference point offset compensation data and the pad offset compensation data includes: The incoming material deviation compensation data is obtained by performing a differential operation between the pad offset compensation data and the reference point offset compensation data.

4. The SMT production line incoming material deviation printing compensation calibration method according to claim 1, characterized in that, After determining the incoming material deviation compensation data based on the reference point offset compensation data and the pad offset compensation data, the method further includes: The incoming material deviation compensation data is associated with and stored with the identification of the incoming circuit board.

5. A method for compensating and calibrating incoming material deviations in an SMT production line, characterized in that, Applied to printing presses, including: Acquire the actual reference point coordinate data in the incoming circuit board, the reference point coordinate data of the stencil, and the incoming material deviation compensation data generated by the measuring equipment; The actual reference point coordinate data and the steel mesh reference point coordinate data are aligned to obtain the foundation alignment data. The actual deviation compensation data is determined based on the basic alignment data and the incoming material deviation compensation data, so as to adjust the printing alignment mechanism according to the actual deviation compensation data.

6. The SMT production line incoming material deviation printing compensation calibration method according to claim 5, characterized in that, The step of determining the actual deviation compensation data based on the basic alignment data and the incoming material deviation compensation data includes: The basic alignment data and the incoming material deviation compensation data are superimposed to obtain the actual deviation compensation data.

7. A device for compensating and calibrating incoming material deviations in an SMT production line, characterized in that, Applied to measuring equipment, including: The coordinate data acquisition module is used to acquire the actual coordinate data of the reference points and the actual coordinate data of the pads in the incoming circuit board, as well as the coordinate data of the stencil reference points and the reference coordinate data of the pads in the printing press. The reference point alignment module is used to align the reference points according to the actual coordinate data of the reference points and the coordinate data of the steel mesh reference points, and to obtain the reference point offset compensation data. The pad alignment module is used to align the pads according to the actual coordinate data of the pads and the reference coordinate data of the pads, and to obtain pad offset compensation data. The deviation compensation determination module is used to determine the incoming material deviation compensation data based on the reference point offset compensation data and the pad offset compensation data, so that the printing press can perform compensation calibration based on the incoming material deviation compensation data.

8. A measuring device, characterized in that, include: One or more processors; Memory, used to store one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the SMT production line incoming material deviation printing compensation calibration method as described in any one of claims 1-4.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When executed by the processor, the program implements the SMT production line incoming material deviation printing compensation calibration method as described in any of claims 1-4.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the SMT production line incoming material deviation printing compensation calibration method as described in any one of claims 1-4.

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