A method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module

Abstract

This invention discloses a method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module, comprising the following steps: S1, substrate pretreatment: cleaning and drying the substrate to be coated for the backlight module to remove surface oil, dust, and impurities; S2, underlayer preparation: for plastic substrates, a SiO2 underlayer is deposited using a vacuum evaporation process; S3, AR anti-reflection and anti-reflection layer preparation: selecting a multi-layer alternating high and low refractive index coating structure or a biomimetic subwavelength microcone array structure according to the component type and application scenario; S4, surface treatment: depositing an AF hydrophobic coating on the surface of the AR anti-reflection and anti-reflection layer; S5, finished product assembly and testing: assembling the components into a complete backlight module, performing optical performance and reliability testing, and shipping after passing the test. This invention achieves adaptable fabrication of different AR structures and different substrates through a low-temperature process, which helps improve process stability and mass production yield, and reduces industrialization costs.

Description

Technical Field

[0001] This invention relates to the field of backlight module manufacturing technology, and specifically to a method for manufacturing an AR anti-reflection and anti-reflection structure for a backlight module. Background Technology

[0002] Existing fabrication processes for AR antireflective structures suffer from several drawbacks: excessively high coating temperatures on plastic substrates lead to substrate deformation; low precision in film thickness control affects optical performance; nanoimprinting processes present difficulties in demolding and easily damage microstructures; and the lack of adaptability among fabrication processes for different AR structures fails to meet the needs of various substrates and application scenarios, resulting in low mass production yields and high costs. Therefore, developing a reasonable, adaptable, and mass-producible fabrication method is crucial for the industrialization of AR antireflective and anti-reflective structures. Summary of the Invention

[0003] This invention aims to overcome the shortcomings of existing AR antireflection structure fabrication processes, such as unreasonableness, poor adaptability, and low mass production yield. It provides a method for fabricating AR antireflection and antireflection structures for backlight modules, enabling the adaptable fabrication of different AR structures and different substrates, improving process stability and mass production yield, and reducing costs.

[0004] The technical solution of the present invention is as follows: A method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module includes the following steps: S1, Substrate Pretreatment The substrate components to be plated for use in backlight modules are cleaned and dried to remove surface oil, dust and impurities; S2, Underlayer Preparation For the substrate material, a vacuum evaporation process is used to deposit SiO2 as the bottom layer; S3, AR anti-reflection and anti-reflection layer preparation Choose a multi-layer high and low refractive index alternating coating structure or a biomimetic subwavelength microcone array structure based on the component type and application scenario. S4, Surface Treatment Deposit an AF hydrophobic coating on the surface of the AR antireflection and anti-reflection layer; S5. Finished Product Assembly and Inspection The components are assembled into a complete backlight module, and its optical performance and reliability are tested. Once qualified, it is shipped out of the factory.

[0005] In step S1, after the plastic substrate is pretreated, it also needs to be dried at a low temperature of ≤80℃.

[0006] In step S2, the deposition temperature is ≤80℃, the deposition rate is 0.1-0.3nm / s, the thickness of the underlayer is controlled at 10-20nm, and after deposition, low-temperature curing is performed at ≤70℃ for 10-15min.

[0007] Optionally, in step S3, a multi-layer high and low refractive index alternating coating structure is selected. The plastic substrate adopts a vacuum electron beam evaporation + ion source assisted process with a deposition temperature ≤80℃, film thickness accuracy ±5nm, deposition rate 0.2-0.5nm / s, and ion source power 80-120W. The glass substrate adopts a magnetron sputtering process with a deposition temperature ≤150℃, film thickness accuracy ±3nm, and deposition rate 0.1-0.2nm / s. Plasma bombardment is used to enhance the film density.

[0008] The deposition sequence of the multilayer alternating high and low refractive index coating structure is as follows: a low refractive index film layer, a high refractive index film layer, and a low refractive index film layer are deposited sequentially from the substrate surface, with the outermost layer being a low refractive index film layer.

[0009] Optionally, in step S3, a biomimetic subwavelength microcone array structure is selected, and a nanoimprinting process is used to attach the subwavelength microcone array template to the interface to be plated. The microstructure is transferred by UV curing at a wavelength of 365nm and a curing time of 30-60s. After demolding, the residual curing agent is cleaned to remove it.

[0010] The template used in the nanoimprinting process is made of quartz or silicon-based material, and a low surface energy release agent is used during the demolding process.

[0011] In step S4, the deposition temperature is ≤60℃, the deposition rate is 0.05-0.1nm / s, the thickness is 5-10nm, and after deposition, annealing is performed at a temperature ≤80℃ for 5-10min.

[0012] After surface treatment, structures or coatings with AR effects can be applied to the light-incident side of the light guide plate, the structured or non-structured surface of the brightness enhancement film, the cover plate, etc.

[0013] Compared with existing technologies, the beneficial effects of this invention are as follows: This invention includes five steps: substrate pretreatment, optional underlayer preparation, AR antireflection and anti-reflection layer preparation, optional surface treatment, and finished product assembly and testing. For two types of AR structures, namely multilayer coating and biomimetic nano AR, appropriate preparation processes are adopted respectively, process parameters are precisely controlled, and it is compatible with different substrates such as plastic and glass. The process is mature and has a high yield. It can be directly adapted to existing backlight module production lines to realize the mass production of AR antireflection and anti-reflection structures (multilayer high and low refractive index alternating AR coating structure and biomimetic nano AR antireflection structure), which helps to reduce industrialization costs. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0015] To illustrate the technical solution described in this invention, specific embodiments are described below.

[0016] Example This embodiment provides a method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module, including the following steps: S1, Substrate Pretreatment The substrates to be plated, such as light guide plates, brightness enhancement films, and cover plates used in backlight modules, are cleaned and dried to remove surface oil, dust, and impurities, ensuring a surface flatness of ≤0.1μm. After pretreatment, the plastic substrates are dried at a low temperature of ≤80℃ to avoid deformation of the substrates in subsequent processes. S2, Underlayer Preparation For substrate materials (such as plastic substrates), a vacuum evaporation process is used to deposit SiO2 as the underlayer. The deposition temperature is ≤80℃, the deposition rate is 0.1-0.3nm / s, and the thickness of the underlayer is controlled at 10-20nm. After deposition, a low-temperature curing process is performed at ≤70℃ for 10-15min to improve the adhesion of the subsequent AR layer. S3, AR anti-reflection and anti-reflection layer preparation Choose a multi-layer high and low refractive index alternating coating structure or a biomimetic subwavelength microcone array structure based on the component type and application scenario. ① If a multilayer high and low refractive index alternating coating structure is selected, the plastic substrate adopts a vacuum electron beam evaporation + ion source assisted process, with a deposition temperature ≤80℃, film thickness accuracy ±5nm, deposition rate 0.2-0.5nm / s, and ion source power 80-120W. The glass substrate adopts a magnetron sputtering process, with a deposition temperature ≤150℃, film thickness accuracy ±3nm, and deposition rate 0.1-0.2nm / s. Plasma bombardment is used to enhance the film density. The deposition sequence of the multilayer high and low refractive index alternating coating structure is as follows: a low refractive index film layer and a high refractive index film layer are deposited sequentially from the substrate surface, and the outermost layer is a low refractive index film layer. ② If a biomimetic subwavelength microcone array structure is selected, a nanoimprinting process is used to attach the subwavelength microcone array template to the interface to be plated. The microstructure is transferred by UV curing at a wavelength of 365nm and a curing time of 30-60s. After demolding, the residual curing agent is cleaned away. The template used in the nanoimprinting process is made of quartz or silicon-based material, and a low surface energy release agent is used during the demolding process. S4, Surface Treatment An AF hydrophobic coating was deposited on the surface of the AR antireflection and antireflection layer at a deposition temperature ≤60℃, a deposition rate of 0.05-0.1nm / s, and a thickness of 5-10nm. After deposition, the coating was annealed at a temperature ≤80℃ for 5-10min. After surface treatment, structures or coatings with AR effects can be applied to the light-incident side of the light guide plate, the structured or non-structured surface of the brightness enhancement film, the cover plate, etc. S5. Finished Product Assembly and Inspection The components are assembled into a complete backlight module, and its optical performance and reliability are tested. Once qualified, it is shipped out of the factory.

[0017] In summary, this preparation method includes five steps: substrate pretreatment, optional undercoat preparation, AR antireflection and anti-reflection layer preparation, optional surface treatment, and finished product assembly and testing. For both multilayer coating and biomimetic nano AR structures, appropriate preparation processes can be adopted respectively, process parameters can be precisely controlled, and it is compatible with different substrates such as plastic and glass. The process is mature and has a high yield. It can be directly adapted to existing backlight module production lines to realize the mass production of AR antireflection and anti-reflection structures (multilayer high and low refractive index alternating AR coating structure and biomimetic nano AR antireflection structure), which helps to reduce industrialization costs.

[0018] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module, characterized in that, Includes the following steps: S1, Substrate Pretreatment The substrate components to be plated for use in backlight modules are cleaned and dried to remove surface oil, dust and impurities; S2, Underlayer Preparation For the substrate material, a vacuum evaporation process is used to deposit SiO2 as the bottom layer; S3, AR anti-reflection and anti-reflection layer preparation Choose a multi-layer high and low refractive index alternating coating structure or a biomimetic subwavelength microcone array structure based on the component type and application scenario. S4, Surface Treatment Deposit an AF hydrophobic coating on the surface of the AR antireflection and anti-reflection layer; S5. Finished Product Assembly and Testing The components are assembled into a complete backlight module, and its optical performance and reliability are tested. Once qualified, it is shipped out of the factory.

2. The method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module according to claim 1, characterized in that, In step S1, after the plastic substrate is pretreated, it also needs to be dried at a low temperature of ≤80℃.

3. The method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module according to claim 1, characterized in that, In step S2, the deposition temperature is ≤80℃, the deposition rate is 0.1-0.3nm / s, the thickness of the underlayer is controlled at 10-20nm, and after deposition, low-temperature curing is performed at ≤70℃ for 10-15min.

4. The method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module according to claim 1, characterized in that, In step S3, a multi-layer high and low refractive index alternating coating structure is selected. The plastic substrate adopts a vacuum electron beam evaporation + ion source assisted process with a deposition temperature ≤80℃, film thickness accuracy ±5nm, deposition rate 0.2-0.5nm / s, and ion source power 80-120W. The glass substrate adopts a magnetron sputtering process with a deposition temperature ≤150℃, film thickness accuracy ±3nm, and deposition rate 0.1-0.2nm / s. Plasma bombardment is used to enhance the film density.

5. The method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module according to claim 4, characterized in that, The deposition sequence of the multilayer alternating high and low refractive index coating structure is as follows: a low refractive index film layer, a high refractive index film layer, and a low refractive index film layer are deposited sequentially from the substrate surface, with the outermost layer being a low refractive index film layer.

6. The method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module according to claim 1, characterized in that, In step S3, a biomimetic subwavelength microcone array structure is selected, and a nanoimprinting process is used to attach the subwavelength microcone array template to the interface to be plated. The microstructure is transferred by UV curing at a wavelength of 365nm and a curing time of 30-60s. After demolding, the residual curing agent is removed by cleaning.

7. The method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module according to claim 6, characterized in that, The template used in the nanoimprinting process is made of quartz or silicon-based material, and a low surface energy release agent is used during the demolding process.

8. The method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module according to claim 1, characterized in that, In step S4, the deposition temperature is ≤60℃, the deposition rate is 0.05-0.1nm / s, the thickness is 5-10nm, and after deposition, annealing is performed at a temperature ≤80℃ for 5-10min.

9. The method for fabricating an AR anti-reflection and anti-reflection structure for a backlight module according to claim 1, characterized in that, After surface treatment, structures or coatings with AR effects can be applied to the light-incident side of the light guide plate, the structured or non-structured surface of the brightness enhancement film, the cover plate, etc.